GB2439001B - Method of forming organic compound layer, method of manufacturing organic el element and organic el element - Google Patents
Method of forming organic compound layer, method of manufacturing organic el element and organic el elementInfo
- Publication number
- GB2439001B GB2439001B GB0718024A GB0718024A GB2439001B GB 2439001 B GB2439001 B GB 2439001B GB 0718024 A GB0718024 A GB 0718024A GB 0718024 A GB0718024 A GB 0718024A GB 2439001 B GB2439001 B GB 2439001B
- Authority
- GB
- United Kingdom
- Prior art keywords
- organic
- compound layer
- manufacturing
- forming
- organic compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 150000002894 organic compounds Chemical class 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
-
- H01L51/0002—
-
- H01L51/50—
-
- H01L51/56—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005079146 | 2005-03-18 | ||
PCT/JP2006/303225 WO2006100868A1 (en) | 2005-03-18 | 2006-02-23 | Method of forming organic compound layer, process for producing organic el device, and organic el device |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0718024D0 GB0718024D0 (en) | 2007-10-24 |
GB2439001A GB2439001A (en) | 2007-12-12 |
GB2439001B true GB2439001B (en) | 2011-03-09 |
Family
ID=37023546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0718024A Expired - Fee Related GB2439001B (en) | 2005-03-18 | 2006-02-23 | Method of forming organic compound layer, method of manufacturing organic el element and organic el element |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5157440B2 (en) |
GB (1) | GB2439001B (en) |
WO (1) | WO2006100868A1 (en) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100209614A1 (en) * | 2007-11-01 | 2010-08-19 | Kazuhiko Sakata | Coating method, and coating apparatus |
JP5294141B2 (en) * | 2008-03-25 | 2013-09-18 | 株式会社ニコン | Display element manufacturing equipment |
DE102008033017A1 (en) | 2008-07-14 | 2010-01-21 | Osram Opto Semiconductors Gmbh | Encapsulated optoelectronic component and method for its production |
US8102119B2 (en) * | 2008-12-17 | 2012-01-24 | General Electric Comapny | Encapsulated optoelectronic device and method for making the same |
KR101896209B1 (en) * | 2009-09-25 | 2018-09-07 | 가부시키가이샤 니콘 | Substrate cartridge and its applications |
US8801307B2 (en) | 2009-09-25 | 2014-08-12 | Nikon Corporation | Substrate cartridge, substrate processing apparatus, substrate processing system, control apparatus, and method of manufacturing display element |
TWI538861B (en) | 2009-11-05 | 2016-06-21 | 尼康股份有限公司 | A substrate processing system, and a circuit manufacturing method |
JP2011098808A (en) | 2009-11-05 | 2011-05-19 | Nikon Corp | Substrate cartridge, substrate processing device, substrate processing system, substrate processing method, control device and method of manufacturing display element |
KR101678717B1 (en) | 2009-11-19 | 2016-11-23 | 가부시키가이샤 니콘 | Sheet substrate, substrate cartridge, substrate process device, substrate process method, electric circuit manufacturing method, leader connection method |
JP5887935B2 (en) | 2009-11-26 | 2016-03-16 | 株式会社ニコン | Substrate processing apparatus, display element manufacturing method, and substrate processing method |
US20110135405A1 (en) | 2009-12-04 | 2011-06-09 | Akira Miyaji | Roller apparatus and transportation apparatus |
US10541160B2 (en) | 2009-12-29 | 2020-01-21 | Nikon Corporation | Substrate case and substrate accommodation apparatus |
KR101816327B1 (en) * | 2010-02-12 | 2018-01-08 | 가부시키가이샤 니콘 | Substrate processing device |
JP5567407B2 (en) * | 2010-03-15 | 2014-08-06 | ユー・ディー・シー アイルランド リミテッド | Method for manufacturing organic electroluminescent device |
KR101788348B1 (en) | 2010-04-09 | 2017-10-19 | 가부시키가이샤 니콘 | Substrate cartridge, substrate storage device, and substrate processing system |
CN102835189B (en) * | 2010-04-09 | 2016-06-29 | 株式会社尼康 | Substrate board treatment |
WO2012026363A1 (en) * | 2010-08-26 | 2012-03-01 | コニカミノルタホールディングス株式会社 | Method for manufacturing organic electroluminescent element |
JP5852810B2 (en) * | 2010-08-26 | 2016-02-03 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
JP5401443B2 (en) * | 2010-12-28 | 2014-01-29 | 日東電工株式会社 | Method and apparatus for manufacturing organic EL element |
WO2012115143A1 (en) * | 2011-02-24 | 2012-08-30 | 株式会社ニコン | Substrate processing apparatus |
KR101652674B1 (en) * | 2011-02-24 | 2016-08-30 | 가부시키가이샤 니콘 | Device for transporting sheet substrate, and processing device |
KR101896220B1 (en) | 2011-04-25 | 2018-09-07 | 가부시키가이샤 니콘 | Substrate processing device |
WO2013025210A1 (en) * | 2011-08-17 | 2013-02-21 | Hewlett-Packard Development Company, L.P. | Printing system and method |
RU2607823C2 (en) * | 2011-11-03 | 2017-01-20 | Конинклейке Филипс Н.В. | Formation of structure of organic light-emitting devices |
WO2013065429A1 (en) | 2011-11-04 | 2013-05-10 | 株式会社ニコン | Substrate processing apparatus and substrate processing method |
WO2013065451A1 (en) * | 2011-11-04 | 2013-05-10 | 株式会社ニコン | Substrate processing unit and method for processing substrate |
CN104203779B (en) | 2012-04-03 | 2016-04-20 | 株式会社尼康 | The formation method of Handling device and electronics package |
TWI604550B (en) * | 2012-04-13 | 2017-11-01 | 尼康股份有限公司 | Cassette apparatus, substrate transferring apparatus, substrate processing apparatus and substrate processing method |
JP5743005B2 (en) * | 2014-05-12 | 2015-07-01 | 株式会社ニコン | Manufacturing method of display element |
JP5743004B2 (en) * | 2014-05-12 | 2015-07-01 | 株式会社ニコン | Electric circuit manufacturing method |
JP6405436B1 (en) | 2017-10-23 | 2018-10-17 | 住友化学株式会社 | Organic electronic device manufacturing method and organic electronic device |
CN113441377B (en) * | 2021-06-29 | 2022-10-28 | 辽宁分子流科技有限公司 | Preparation method of nano silver wire electrode film |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1077467A (en) * | 1996-09-04 | 1998-03-24 | Sumitomo Chem Co Ltd | Production of organic electroluminescence element |
EP0986112A2 (en) * | 1998-09-11 | 2000-03-15 | Hewlett-Packard Company | An efficient method for fabricating organic light emitting diodes |
JP2001006875A (en) * | 1999-06-24 | 2001-01-12 | Dainippon Printing Co Ltd | Manufacture of el element |
JP2003509817A (en) * | 1999-09-03 | 2003-03-11 | スリーエム イノベイティブ プロパティズ カンパニー | Large area organic electronic device having conductive polymer buffer layer and method of manufacturing the same |
JP2003077669A (en) * | 2001-09-03 | 2003-03-14 | Toppan Printing Co Ltd | High polymer electroluminescent element and manufacturing method therefor |
JP2004185951A (en) * | 2002-12-03 | 2004-07-02 | Dainippon Printing Co Ltd | Production line for flexible polymer organic el display |
JP2004247100A (en) * | 2003-02-12 | 2004-09-02 | Tokai Rubber Ind Ltd | Manufacturing method of organic electroluminescent element, and organic electroluminescent element obtained by the same |
JP2004311111A (en) * | 2003-04-03 | 2004-11-04 | Fuji Photo Film Co Ltd | Method for manufacturing organic electroluminescent element and organic electroluminescent element |
JP2004305912A (en) * | 2003-04-07 | 2004-11-04 | Seiko Epson Corp | Drying method of liquid material, drying apparatus, production method of device, manufacturing apparatus of device, device, and electric appliance |
JP2004534676A (en) * | 2001-07-13 | 2004-11-18 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Apparatus and method for continuously printing on a substrate-strip |
JP2005327667A (en) * | 2004-05-17 | 2005-11-24 | Seiko Epson Corp | Method for manufacturing organic el device, system for manufacturing organic el device, and electronic equipment |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4226159B2 (en) * | 1999-08-06 | 2009-02-18 | シャープ株式会社 | Manufacturing method of organic LED display |
JP2002361742A (en) * | 2001-06-12 | 2002-12-18 | Pioneer Electronic Corp | Laminating method and laminating device |
JP4628656B2 (en) * | 2002-07-09 | 2011-02-09 | 株式会社半導体エネルギー研究所 | Light emitting device manufacturing apparatus and light emitting device manufacturing method |
-
2006
- 2006-02-23 WO PCT/JP2006/303225 patent/WO2006100868A1/en active Application Filing
- 2006-02-23 GB GB0718024A patent/GB2439001B/en not_active Expired - Fee Related
- 2006-02-23 JP JP2007509168A patent/JP5157440B2/en active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1077467A (en) * | 1996-09-04 | 1998-03-24 | Sumitomo Chem Co Ltd | Production of organic electroluminescence element |
EP0986112A2 (en) * | 1998-09-11 | 2000-03-15 | Hewlett-Packard Company | An efficient method for fabricating organic light emitting diodes |
JP2001006875A (en) * | 1999-06-24 | 2001-01-12 | Dainippon Printing Co Ltd | Manufacture of el element |
JP2003509817A (en) * | 1999-09-03 | 2003-03-11 | スリーエム イノベイティブ プロパティズ カンパニー | Large area organic electronic device having conductive polymer buffer layer and method of manufacturing the same |
US6593690B1 (en) * | 1999-09-03 | 2003-07-15 | 3M Innovative Properties Company | Large area organic electronic devices having conducting polymer buffer layers and methods of making same |
JP2004534676A (en) * | 2001-07-13 | 2004-11-18 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Apparatus and method for continuously printing on a substrate-strip |
JP2003077669A (en) * | 2001-09-03 | 2003-03-14 | Toppan Printing Co Ltd | High polymer electroluminescent element and manufacturing method therefor |
JP2004185951A (en) * | 2002-12-03 | 2004-07-02 | Dainippon Printing Co Ltd | Production line for flexible polymer organic el display |
JP2004247100A (en) * | 2003-02-12 | 2004-09-02 | Tokai Rubber Ind Ltd | Manufacturing method of organic electroluminescent element, and organic electroluminescent element obtained by the same |
JP2004311111A (en) * | 2003-04-03 | 2004-11-04 | Fuji Photo Film Co Ltd | Method for manufacturing organic electroluminescent element and organic electroluminescent element |
JP2004305912A (en) * | 2003-04-07 | 2004-11-04 | Seiko Epson Corp | Drying method of liquid material, drying apparatus, production method of device, manufacturing apparatus of device, device, and electric appliance |
JP2005327667A (en) * | 2004-05-17 | 2005-11-24 | Seiko Epson Corp | Method for manufacturing organic el device, system for manufacturing organic el device, and electronic equipment |
Also Published As
Publication number | Publication date |
---|---|
WO2006100868A1 (en) | 2006-09-28 |
JPWO2006100868A1 (en) | 2008-08-28 |
GB0718024D0 (en) | 2007-10-24 |
JP5157440B2 (en) | 2013-03-06 |
GB2439001A (en) | 2007-12-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20190223 |