JP4628656B2 - Light emitting device manufacturing apparatus and light emitting device manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an element (hereinafter referred to as a light emitting element) having a structure in which a thin film (hereinafter referred to as a light emitting layer) that emits light is sandwiched between an anode, a cathode, and a phenomenon called electroluminescence. In a technical field related to a display device (hereinafter referred to as a light emitting device) provided on a substrate and a technical field related to a manufacturing apparatus for manufacturing the light emitting device.
[0002]
[Prior art]
In recent years, development of a light emitting device called an organic EL panel or an organic light emitting diode (OLED) has been urgently developed as an image display. This is because a hole and an electron are recombined in a light emitting layer provided between an electrode for injecting holes (hereinafter referred to as an anode) and an electrode for injecting electrons (hereinafter referred to as a cathode). Thus, a light emission phenomenon called electroluminescence is generated, and image display is made possible by controlling on / off of the light emission.
[0003]
The light-emitting element that plays the most important role in these light-emitting devices is that the light-emitting layer (especially, a light-emitting layer made of an organic compound) is extremely sensitive to oxygen and moisture and easily deteriorates. Don't be. That is, after the anode (or cathode) is formed, the light emitting layer and the like are formed, the cathode (or anode) is formed, and further sealing (sealing the light emitting element) is not consistently released to the atmosphere. Technology to do is required. Therefore, the manufacturing apparatus for manufacturing the light emitting element inevitably increases in size, and the floor area (so-called footprint) of the apparatus has increased.
[0004]
A manufacturing apparatus having a large footprint is not only troublesome in the layout of a clean room, but also has a considerable weight, so that there is a problem that it is very expensive even in a clean room design. However, at present, the film forming apparatus and the sealing apparatus are merely connected in a multi-chamber, and there is still room for development in terms of downsizing and weight reduction as a manufacturing apparatus.
[0005]
In recent years, a technique for forming a light emitting layer used in the light emitting device by solution coating such as a spin coating method, an ink jet method, and a printing method has been actively developed. In particular, the formation of an organic thin film by an ink jet method has already approached a practical level, and the basic technique is disclosed in a gazette or the like (for example, see Patent Document 1).
[0006]
[Patent Document 1]
Japanese Patent Laid-Open No. 10-12377
[0007]
The ink-jet method is a technology that diverts the ink-jet method used in conventional printers to thin film formation, and instead of ink, the solute that is the material of the organic thin film is dissolved or dispersed in a solvent such as water or alcohol. This is a method of applying liquid droplets for each pixel. When this ink-jet method is used, it is considered that the apparatus can be reduced in size because the vacuum apparatus is not required. However, if the multi-chamber is used, the increase in size as a whole cannot be avoided.
[0008]
[Problems to be solved by the invention]
The present invention has been made in view of the above problems, and it is an object of the present invention to provide a manufacturing apparatus for a light emitting device with a small footprint and a method for manufacturing a light emitting device using the manufacturing apparatus.
[0009]
[Means for Solving the Problems]
The manufacturing apparatus of the present invention is a manufacturing apparatus of a light emitting device including a load chamber, a light emitter film forming chamber, a conductor film forming chamber, an insulator film forming chamber, and an unload chamber, wherein the light emitter film forming chamber is a light emitting device. A film forming chamber for forming a light emitter by a method of spraying a solution containing a body composition as drops (dots) or as a continuous fluid (hereinafter referred to as a liquid jet method), and the conductor film forming chamber is formed by sputtering. A film forming chamber for forming a conductor by a method, and the insulator film forming chamber is a film forming chamber for forming an insulator by a sputtering method. The load chamber, the light emitter forming chamber, the conductor forming chamber, and the like. In any of the film chamber, the insulator film formation chamber, and the unload chamber, the substrate to be processed is held so that the angle formed by the film formation surface of the substrate to be processed and the direction of gravity is within 0 to 30 °. Features. At this time, the loading chamber and the unloading chamber can be used in common. That is, there is no particular problem even if both chambers are integrated.
[0010]
The most important feature of the present invention is that the process from the formation of the light emitter to the sealing is performed without opening to the atmosphere. The angle formed between the film formation surface and the direction of gravity is such that the angle is kept within a range of 0 to 30 ° (preferably 0 to 10 °). By erecting the substrate to be processed, the floor area (footprint) occupied by the transport mechanism and each film forming chamber can be reduced, and the footprint of the entire manufacturing apparatus can be reduced. The substrate may be arranged with the long side up and down or the short side up and down. However, in order to more actively reduce the footprint of the manufacturing apparatus, the short side It is preferable to arrange so that is vertically.
[0011]
In the present invention, the light emitter is a carrier injection layer (a hole injection layer or an electron injection layer), a carrier transport layer (a hole transport layer or an electron transport layer), a carrier blocking layer (a hole blocking layer or an electron blocking layer). ), An organic compound or an inorganic compound that contributes to recombination of the light emitting layer and other carriers, or a laminate thereof. Moreover, a light-emitting body composition means the composition used as the material of these light-emitting bodies, and it is not ask | required that it is an inorganic compound if it is an organic compound. The luminous body composition is roughly classified into a luminous material and a carrier (hole or electron) transporting material.
[0012]
A light-emitting material is a material that generates a light-emitting phenomenon due to electroluminescence by injecting holes and electrons. Such a luminescent material can be found in both inorganic compounds and organic compounds, but in the method of applying a solution as in the present invention, it is preferable to use an organic compound. As the light-emitting material, a material that emits fluorescence by singlet excitation or a material that emits phosphorescence by triplet excitation may be used. In addition, the hole transporting material is a material that easily moves holes, and the electron transporting material is a material that easily moves electrons.
[0013]
Moreover, the manufacturing apparatus of the present invention can use a printing method, a spray method, and other solution coating methods in addition to using the liquid jet method for film formation of the light emitter. The printing method is a method of applying a solution containing a phosphor composition using a printing method such as a screen printing method or a relief printing method, and baking to form a phosphor. The spray method is a method in which a solution containing a phosphor composition is applied in the form of a mist and baked to form a phosphor. These three methods are all methods for forming a phosphor by applying and baking a solution containing a phosphor composition, and can also be collectively referred to as a solution coating method.
[0014]
These solution coating methods may be performed in an atmospheric pressure or a pressurized atmosphere. Since the phosphor composition easily deteriorates due to the presence of oxygen and moisture, it is desirable to have an atmosphere in which moisture is excluded as much as possible, and it is desirable to have an inert atmosphere such as nitrogen, a rare gas, or the like. Moreover, it is good also as an atmosphere containing the solvent component of the solution to apply | coat. When the atmosphere containing the solvent component is used, the probability that clogging or the like occurs due to drying of the solution at the injection port or the like when the coating process is interrupted can be reduced.
[0015]
Furthermore, it is also possible to apply the solution under reduced pressure by selecting a solvent. Under reduced pressure refers to a pressure lower than atmospheric pressure, and in an atmosphere filled with nitrogen, a rare gas, or other inert gas, 1 × 10 ² ~ 2x10 ^Four Pa (preferably 5 × 10 ² ~ 5x10 ^Three Pa) or 1-5 × 10 in higher vacuum ^Four Pa (1 × 10 ² ~ 1x10 ^Three Pa). By setting the pressure under reduced pressure, the solvent is volatilized from the droplets until the droplets injected into the atmosphere reach the pixel electrode, and the volume of the droplets decreases. Therefore, the firing process can be completed in a shorter time.
[0016]
In addition, when forming a light-emitting body by a solution coating method, an organic compound is mainly used as the light-emitting material, but it is preferable to use a polymer organic compound. Since the high molecular organic compound has excellent heat resistance, it can be said to be a suitable material for manufacturing a highly reliable light-emitting device with little deterioration as a material.
[0017]
Further, the manufacturing apparatus of the present invention is characterized by using a sputtering method for film formation of a conductor and an insulator because the elements such as a light emitter or a transistor are deteriorated by an electron beam, an X-ray or other radiation. This is to prevent this from happening. Conventionally, a vapor deposition method has been used when forming a conductor (especially a cathode material), but there is a possibility that a light emitter, a transistor, or the like may deteriorate due to radiation generated during the vapor deposition. In order to solve this problem, the manufacturing apparatus of the present invention uses a sputtering method that does not generate radiation. This configuration is particularly effective in manufacturing an active matrix light-emitting device.
[0018]
Note that as the conductor, a metal film serving as a cathode or an oxide conductive film serving as an anode is formed. As the metal film serving as the cathode, a metal film containing an element belonging to Group 1 or 2 of the periodic table can be used, and an aluminum film containing lithium is particularly preferable. As the oxide conductive film serving as an anode, indium oxide, tin oxide, zinc oxide, or a compound thereof can be used.
[0019]
As the insulator, a film with low permeability of oxygen or moisture is preferably used, and a silicon compound containing nitrogen such as a silicon nitride film or a silicon nitride oxide film is preferably used. In addition, an aluminum nitride film or a diamond-like carbon (DLC) film can be used. In particular, a silicon nitride film is preferable because it can be easily formed by a sputtering method and a dense film can be formed.
[0020]
Since the manufacturing apparatus described above can perform the process from the formation of the light emitter to the sealing to protect the light emitter from oxygen or the like without opening to the atmosphere, a highly reliable light emitting device can be manufactured. In addition, since the entire process is performed with the substrate upright, the footprint of the manufacturing apparatus can be reduced, and the degree of freedom in the design stage such as the layout of the clean room is greatly improved. Furthermore, the manufacturing cost of the light-emitting device can be reduced by using a simple solution coating method for forming the light-emitting body, and if a polymer organic compound is used as the light-emitting layer, the reliability of the light-emitting device can be improved. it can.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
[Embodiment 1]
In this embodiment mode, an in-line manufacturing apparatus that performs steps from formation of a light emitter to formation of a cathode will be described with reference to FIG. 1A is a top view and FIG. 1B is a side view. In addition, since each chamber is not necessarily described with the same scale, when actually manufacturing the said manufacturing apparatus, a volume is suitably determined with reference to the function of each chamber demonstrated in this Embodiment. There is a need.
[0022]
1A and 1B, 11 is a load chamber for carrying in a substrate, 12 is an unload chamber for carrying out the substrate, 13 is a film forming chamber for forming a hole injection layer, and 14 is a light emitting layer. 15 is a film forming chamber for forming an electron injection layer, 16 is a film forming chamber for forming a metal film to be a cathode, and 17 is a film forming a protective film having a passivation effect. It is a room. An arrow 100 in the figure is the direction in which the substrate 10 is conveyed, and a substrate that has already been processed is represented by a dotted line. At this time, the substrate 10 is transported in an upright state, that is, in a state where the angle formed by the film formation surface (surface to be processed) and the direction of gravity falls within 0 to 30 °.
[0023]
Each of the film formation chambers 13 to 15 is a film formation chamber for forming a light emitter, and in the present embodiment, a liquid jet method (in particular, a method of injecting a droplet-like solution is referred to as a dot jet method). This method is also called an ink jet method). Here, the characteristics of the deposition chamber of the dot jet method will be described with reference to FIG.
[0024]
FIG. 2A is an enlarged view of a portion (hereinafter referred to as a head portion) that functions as a head that performs dot jet in a solution coating apparatus of the dot jet method and its periphery. Specifically, the state immediately after the solution containing the luminescent material is ejected from the head portion is shown. Note that in this embodiment, an example in which light-emitting materials corresponding to three colors of red, green, and blue are separately applied in one deposition chamber will be described.
[0025]
In FIG. 2A, reference numeral 201 denotes a pixel electrode, which is an electrode that functions as an anode or a cathode of a light emitting element. 202 is an insulator that defines each pixel, and 203 is a carrier injection layer. The carrier injection layer 203 is a hole injection layer if the pixel electrode 201 is an anode, and an electron injection layer if the pixel electrode 201 is a cathode. The head unit 204 includes a plurality of ejection units 205a to 205c having a function of ejecting a solution containing a luminescent material, and piezoelectric elements (piezo elements) 206a to 206c are provided respectively. Moreover, each of the injection parts 205a-205c is filled with the solution 207a-207c containing a luminescent material.
[0026]
Here, the solution 207a containing a light emitting material contains a light emitting material that emits red light, the solution 207b containing a light emitting material contains a light emitting material that emits green light, and the solution 207c containing a light emitting material is blue. A luminescent material that emits light. These three kinds of luminescent materials constitute a pixel emitting red light, a pixel emitting green light, and a pixel emitting blue light, and these three pixels are regarded as one pixel unit (pixel unit).
[0027]
In FIG. 2 (A), only R (red), G (green), and B (blue) each corresponding to one injection unit is described, but a plurality of injection units (nozzles) are arranged in parallel. In consideration of throughput, it can be said that it is most desirable to arrange the pixels corresponding to the number of pixels (pixel number) corresponding to one row or one column of the pixel portion. In the present embodiment, a light emitting layer can be formed on all the pixels in one scan using a head portion (that is, a linear or rectangular head portion) provided with an ejection portion corresponding to one row of pixels. To do. Of course, it is also possible to perform overcoating by scanning a plurality of times.
[0028]
A space 208 between the head unit 204 and the pixel electrode 201 is an atmospheric atmosphere filled with nitrogen. In particular, it is desirable that the oxygen and water contents be sufficiently reduced during purification. Further, in addition to nitrogen or instead of nitrogen, a solvent component (same as the solvent of the solution containing the light emitting material) may be filled. This has the effect of preventing clogging due to drying of the tip portions of the ejection portions 205a to 205c.
[0029]
Then, the solutions 207 a to 207 c containing the luminescent material filled in the ejection units 205 a to 205 c are pressed and pushed out by the volume change of the piezoelectric elements 206 a to 206 c and ejected toward the pixel electrode 201. As a result, the luminescent material is deposited intermittently. Then, the ejected droplet 209 is deposited on the pixel electrode 201 and baked to form a light emitting layer. In addition, baking is performed by exposing in a vacuum, heating, or using these together.
[0030]
The manufacturing apparatus of the present embodiment uses a liquid jet method having the above characteristics when forming a light emitter. That is, in FIGS. 1A and 1B, head portions 13a to 15a are provided inside the film forming chambers 13 to 15, respectively. Each of these head portions has the configuration described with reference to FIG. 2, and solution coating containing an organic compound or an inorganic compound is performed. At this time, a mechanism for heating the substrate 10 at room temperature (typically 20 ° C.) to 300 ° C., more preferably 50 to 200 ° C., may be provided. By providing a heating mechanism, heating at the same time as solution application is possible, and the necessity of providing a separate baking step can be eliminated.
[0031]
In FIG. 1B, the side view of the film formation chamber (light emitting layer) 14 corresponds to a state in which the head portion moving along the substrate surface (film formation surface) is viewed from above. An arrow 101 indicates the moving direction of the head portion 14a. The head 101 moves from one end to the other end of the substrate 10 in parallel with the substrate surface, and solution application is performed. As shown in FIG. 1 (A), the distance (L) between the base 10 and the tip (jet port) of the head portion 14a is preferably 0.1 to 2 mm.
[0032]
Further, at this time, nitrogen, rare gas or other inert gas flows in the film forming chambers 13 to 15 from the top to the bottom in the direction perpendicular to the paper surface, and the base 10 and the head portions 13a to 15a. A laminar flow (laminar flow) is formed between them. At this time, the flowing inert gas can be heated instead of or in combination with the substrate.
[0033]
Here, the manner in which a solution containing a luminescent material is applied with the manufacturing apparatus of the present embodiment will be described with reference to FIGS. In FIG. 3, reference numeral 301 denotes an active matrix substrate on which thin film transistors and pixel electrodes are formed. Circuits corresponding to four panels are formed on a single glass substrate. Note that each panel includes a pixel portion 302a, a gate line driver circuit 302b, and a data line driver circuit 302c; however, the structure is not limited thereto.
[0034]
At this time, the head portion 303 is scanned from above the active matrix substrate 301 along the film formation surface downward (in the direction of the arrow), and as shown in an enlarged portion 304 surrounded by a dotted line, each head pixel 303 Sequentially emit light emitting materials. Note that 305a is a pixel coated with a luminescent material corresponding to red, 305b is a pixel coated with a luminescent material corresponding to green, and 305c is a pixel coated with a luminescent material corresponding to blue. Reference numeral 306 denotes an insulating film that defines each pixel.
[0035]
Further, in FIG. 3, the luminescent material is applied separately for each pixel, but as shown in FIG. 4, the luminescent material may be applied separately for each pixel column. In FIG. 4, reference numeral 401 denotes an active matrix substrate on which thin film transistors and pixel electrodes are formed, and is provided with a pixel portion 402a, a gate line driver circuit 402b, and a data line driver circuit 402c. The head unit 403 is scanned downward (in the direction of the arrow) along the film formation surface from above the active matrix substrate 401, and as shown in an enlarged portion 404 surrounded by a dotted line, is applied to each pixel column. The luminescent material is jetted continuously. In addition, 405a is a pixel column coated with a luminescent material corresponding to red, 405b is a pixel column coated with a luminescent material corresponding to green, and 405c is a pixel column coated with a luminescent material corresponding to blue. is there. Reference numeral 406 denotes an insulating film that defines each pixel column.
[0036]
The solution applied in each of the film forming chambers 13 to 15 is thinned by performing a baking process such as heating in a vacuum. Although not illustrated in the present embodiment, the solution application may be performed on all pixels at once, or the solution application and firing may be performed individually for each pixel corresponding to each color of red, green, and blue. A process may be performed.
[0037]
3 and 4 show an example in which the head portion is scanned from the upper end to the lower end of the base body, it is also possible to scan from the left end to the right end. In that case, it is also possible to adopt a method in which the substrate moves.
[0038]
The substrate 10 having completed the formation of the light emitter in the film forming chambers 13 to 15 having the above configuration is then transferred to the film forming chamber 16. The film formation chamber 16 is a chamber for forming a metal film to be a cathode by sputtering, and film formation is performed while the substrate 10 passes by the side of the rectangular target 16a. For example, a metal film containing an element belonging to Group 1 or Group 2 of the periodic table, such as an alloy film of aluminum and lithium, can be formed. The shape of the target 16a is not limited to this, but as a merit of placing the substrate 10 vertically, a high throughput can be ensured by using a linear, rectangular, oblong or other elongated target. The point that an apparatus area can be made small is mentioned.
[0039]
The film forming chamber 17 is a chamber for forming an insulating film having a passivation effect by a sputtering method (preferably a high frequency sputtering method). Like the film forming chamber 16, the base 10 is placed next to a rectangular target 17a. During the passage, film formation is performed. For example, a highly dense silicon compound film such as a silicon nitride film or a silicon nitride oxide film can be formed.
[0040]
The base body 10 thus finished up to the sealing step is transported to the unload chamber 12 and taken out. Through the series of steps described above, the formation of the light emitter, the formation of the cathode, and the formation (sealing) of the protective film are performed without opening to the atmosphere. Although the load chamber 11 and the unload chamber 12 are described as separate chambers here, the load chamber and the unload chamber may be integrated to share functions.
[0041]
[Embodiment 2]
In the first embodiment, the example in which the luminescent material corresponding to each color of red, green, and blue is separately applied in the film formation chamber 14 has been described. However, in this embodiment, the light emission corresponding to each color of red, green, and blue is described. An example in which a conductive material is formed in a separate film formation chamber will be described. In addition, since each chamber is not necessarily described with the same scale, when actually manufacturing the said manufacturing apparatus, a volume is suitably determined with reference to the function of each chamber demonstrated in this Embodiment. There is a need.
[0042]
The basic structure of the manufacturing apparatus shown in FIG. 5 is the same as that shown in FIG. 1 except that a plasma processing chamber is provided, the film forming chamber is divided into three chambers, and the film forming chamber. The difference is that a turning chamber is provided in connecting and folding. The substrate 500 carried in from the load chamber 501 is first transported to the plasma processing chamber 503, where the surface of the pixel electrode formed on the substrate 500 is subjected to plasma processing to achieve cleaning and adjustment of work function. If the pixel electrode is an anode, oxygen plasma or ozone plasma is preferable. Note that plasma may be generated by forming an electric field between the electrodes 503a.
[0043]
Next, a solution containing an organic compound is applied from the head portion 504 a in the film formation chamber 504. And the baking process by heating is performed after application | coating, and a positive hole injection layer is formed. In the baking step by heating, the solution is applied while the substrate is heated, so that the baking can be performed sequentially at the same time as the application. Hereinafter, the solution coating method using the head portion has been described in the first embodiment, and thus the description thereof is omitted in the present embodiment.
[0044]
Next, a light emitting layer R (light emitting layer corresponding to red) and a light emitting layer G (light emitting layer corresponding to green) are formed in the film formation chambers 505 and 506, respectively. These become a light emitting layer through a coating process of a solution containing a light emitting material by the head portions 504a and 505a provided in each chamber and a baking process by heating. The substrate 500 is sequentially conveyed while forming a light emitting layer corresponding to a predetermined color in each chamber. Also in the formation of the light emitting layer, the baking step is performed simultaneously with the solution application.
[0045]
The base body 500 that has completed the formation of the light emitting layer R and the light emitting layer G is transferred to the turning chamber 507 as it is. A turntable 507a is installed in the turning chamber 507, and two rails 507b are provided thereon. The turntable 507a turns 180 ° with the substrate 500 placed on one of the rails 507b, and the substrate 500 moves to the next line such as the film formation chamber 508.
[0046]
Next, a light emitting layer B (a light emitting layer corresponding to blue) is formed in the film formation chamber 508. The light emitting layer B is formed through an application process of a solution containing a light emitting material by the head portion 508a and a baking process by heating performed at the same time.
[0047]
Next, the film is transferred to a film formation chamber 509 where a metal film to be a cathode is formed by sputtering, and a cathode is formed. The substrate 500 is formed while passing through the side of the rectangular target 509a as in the first embodiment. Of course, the shape of the target 509a is not limited to this, and a linear, rectangular, oblong or other elongated target can be used as in the first embodiment.
[0048]
Further, in the film formation chamber 510 for forming an insulating film serving as a protective film, an insulating film is formed on the cathode by a sputtering method (preferably a high-frequency sputtering method), and the light emitter formed on the substrate 500 is sealed. . As the insulating film, a silicon nitride film is preferable.
[0049]
The base body 500 that has completed the sealing process is transported to the unload chamber 502 and taken out. Through the series of steps described above, the formation of the light emitter, the formation of the cathode, and the formation (sealing) of the protective film are performed without opening to the atmosphere. Although the load chamber 501 and the unload chamber 502 are described as separate chambers here, the load chamber and the unload chamber may be integrated to share functions.
[0050]
[Embodiment 3]
In this embodiment, an example in which the configuration of the head portion in Embodiments 1 and 2 is different from that in FIG. 2 will be described with reference to FIG. That is, in this example, the solution is not applied by jetting droplets, but a gel-like solution having a certain degree of viscosity is applied. This method is called a line jet method because it is a method in which a solution is jetted in a linear form as a continuous fluid.
[0051]
FIG. 6A illustrates a state where a solution containing a luminescent material is being sprayed, and FIG. 6B illustrates a state where injection of the solution containing a luminescent material is stopped. Note that the description of the first embodiment may be referred to for the same reference numerals as those used in FIG.
[0052]
In this embodiment, as shown in FIG. 6A, the head portion 604 has a plurality of ejection portions 605a to 605c each having a function of ejecting a luminescent material, and each includes a piezoelectric element (piezoresistive element). ) 606a to 606c are provided. Moreover, each of the injection parts 605a-605c is filled with the solution 607a-607c containing a luminescent material. At this time, similarly to FIG. 2A, the solution 607a containing a light emitting material contains a light emitting material that emits red light, and the solution 607b containing a light emitting material contains a light emitting material that emits green light. The solution 607c containing a light emitting material contains a light emitting material that emits blue light.
[0053]
However, in this embodiment, the viscosity of the solutions 607a to 607c containing the luminescent material is adjusted to be higher than the viscosity of the solutions 207a to 207c containing the luminescent material of the first embodiment. This is so that the solution containing the luminescent material is continuously applied, and as a result, the luminescent material is continuously deposited. Further, as shown in FIG. 6A, when the solutions 607a to 607c containing the light emitting material are applied, the light emitting material is applied by an inert gas such as nitrogen while the piezoelectric elements 606a to 606c are pushed down. It applies so that the solution 607a-607c containing may be pressurized and extruded.
[0054]
At this time, it is preferable to keep the distance between the ejection units 605a to 605c and the pixel electrode 201 as close as possible. For example, about 0.1 to 0.5 mm is preferable. In the case of this embodiment, it is necessary to spray the solution perpendicularly to the substrate to apply the solution, but it is difficult to spray vigorously because the solutions 607a to 607c containing the light-emitting material have high viscosity. Therefore, it is possible to accurately apply onto the pixel electrode 201 when the distance is as close as possible.
[0055]
Further, as shown in FIG. 6B, when the application of the solutions 607a to 607c containing the luminescent material is stopped, pressurization with an inert gas is stopped and the piezoelectric elements 606a to 606c are moved upward (in the direction of the arrow). And pushed up. If it carries out like this, since the solution containing a luminescent material will enter from a jet nozzle a little back, the drying of a solution can be prevented. Further, by making the space 608 an atmosphere containing a solvent component at this time, drying of the solutions 607a to 607c containing the light-emitting material at the injection port can be prevented.
[0056]
In addition, after apply | coating each solution, you may heat and bake, and you may bake by exposing in a vacuum. Moreover, you may use these baking methods together. Thus, as shown in FIG. 6B, a light emitting layer 610a that emits red light, a light emitting layer 610b that emits green light, and a light emitting layer 610c that emits blue light are formed. Thereafter, a carrier transport layer, a carrier injection layer, and the like are formed as necessary, and then a counter electrode (a cathode for an anode and an anode for a cathode) is provided to complete a light emitting element.
[0057]
[Embodiment 4]
This embodiment is an example in which a film formation chamber by a printing method is provided in the manufacturing apparatus described in Embodiment 1 or Embodiment 2 in order to form a light emitter. Specifically, an example of forming by a relief printing method is shown, but it goes without saying that it may be replaced by a screen printing method. Here, as an example of improving the manufacturing apparatus shown in Embodiment Mode 2, an example in which light emitting layers of three colors of red, green, and blue are formed in separate chambers will be described. If only one color is sufficient, it may be combined with the manufacturing apparatus of the first embodiment.
[0058]
In addition, since each chamber is not necessarily described with the same scale, when actually manufacturing the said manufacturing apparatus, a volume is suitably determined with reference to the function of each chamber demonstrated in this Embodiment. There is a need.
[0059]
The manufacturing apparatus of this embodiment is shown in FIG. The manufacturing apparatus shown in FIG. 7 includes a load chamber 701 and an unload chamber 702. In the order of steps, a plasma processing chamber 703, a film formation chamber 704 for forming a hole injection layer, and a light emitting layer that emits red light are formed. A film forming chamber 705 for forming a film, a film forming chamber 706 for forming a light emitting layer that develops green color, a turning chamber 707, a film forming chamber 708 for forming a light emitting layer that develops blue color, and a film forming for forming a cathode. A chamber 709 and a film formation chamber 710 for forming a protective film are provided. The plasma treatment chamber 703 has an electrode 703a, the film formation chamber 704 has a roll portion 704a, the film formation chamber 705 has a roll portion 705a, the film formation chamber 706 has a roll portion 706a, the turning chamber 707 has a turntable 707a and The rail 707b, the film formation chamber 708 includes a roll portion 708a, the film formation chamber 709 includes a sputter target 709a, and the film formation chamber 710 includes a sputter target 710a.
[0060]
The function of each part in the above configuration is substantially the same as that of the manufacturing apparatus described in Embodiment 2 with reference to FIG. 5, and detailed description is omitted, but the configuration of each of the film formation chambers 704 to 706 and 708 is the same. Since it has been changed, the internal configuration of these film forming chambers will be described below with reference to FIG.
[0061]
The configuration shown in FIG. 8 is an enlarged view of the vicinity of a roll provided inside each of the film formation chambers 704 to 706 and 708, and FIG. 8A is a top view of the film formation chamber as viewed from the upper surface side. FIG. 8B is a side view of the film forming chamber as viewed from the side.
[0062]
In FIG. 8, 801 is an anilox roll, 802 is a holding part (hereinafter simply referred to as a solution holding part) for holding a solution 803 containing a luminescent composition, and the solution holding part 802 is a luminescent composition. While holding the solution 803 in contact with the anilox stall 801, the solution is supplied to the anilox roll 801. Although not shown, mesh-shaped grooves are provided on the surface of the anilox roll 801, and the solution 803 containing the phosphor composition is held in the mesh-shaped grooves by rotating in the direction of arrow A. In addition, the dotted line illustrated on the surface of the anilox roll 801 means that the solution 803 containing the phosphor composition is held.
[0063]
Reference numeral 804 denotes a printing roll, and reference numeral 805 denotes a letterpress (hereinafter simply referred to as letterpress) engraved with a pattern to be printed. While the anilox roll 801 rotates and keeps the solution 803 containing the phosphor composition in the mesh-shaped groove, the printing roll 804 rotates in the direction of arrow B, and the convex portion of the relief printing plate 805 becomes the anilox roll 801. By the contact, the solution 803 containing the phosphor composition is applied to the convex portions of the relief plate 805.
[0064]
Then, a solution 803 containing the phosphor composition is applied (printed) to a portion where the base 806 that moves horizontally (in the direction of arrow C) at the same speed as the printing roll 804 and the convex portion of the relief plate 805 are in contact with each other. Thereafter, the solvent is vaporized by heat treatment in vacuum to leave only the phosphor composition, thereby forming a hole injection layer and a light emitting layer. At this time, the film thickness of the phosphor to be finally formed is determined by the viscosity of the solution 803 containing the phosphor composition. The viscosity can be adjusted by selecting a solvent, and is preferably 10 to 50 cp, more preferably 20 to 30 cp.
[0065]
[Embodiment 5]
This embodiment is an example in which a film formation chamber by a spray method is provided in the manufacturing apparatus described in Embodiment 1 or 2 to form a light emitter. Here, as an example of improving the manufacturing apparatus described in Embodiment Mode 2, an example in which light emitting layers of three colors of red, green, and blue are formed in separate chambers will be described. If only one color is sufficient, it may be combined with the manufacturing apparatus of the first embodiment.
[0066]
In addition, since each chamber is not necessarily described to the same scale, when actually manufacturing the manufacturing apparatus, the volume is appropriately determined with reference to the function of each chamber described in the present embodiment. There is a need.
[0067]
The manufacturing apparatus of this embodiment is shown in FIG. The manufacturing apparatus shown in FIG. 9 includes a load chamber 901 and an unload chamber 902. In the order of steps, a plasma processing chamber 903, a deposition chamber 904 for depositing a hole injection layer, and a red light emitting layer are formed. A film formation chamber 905 for forming a film, a film formation chamber 906 for forming a light emitting layer that develops green color, a turning chamber 907, a film formation chamber 908 for forming a light emitting layer that develops blue color, and a film formation for forming a cathode A chamber 909 and a film formation chamber 910 for forming a protective film are provided.
[0068]
The plasma treatment chamber 903 has an electrode 903a, the film formation chamber 904 has a spray portion 904a for spraying a solution containing a phosphor composition, the film formation chamber 905 has a spray portion 905a and a mask 905b, and the film formation chamber 906 has Spray unit 906a and mask 906b, turntable 907 with turntable 907a and rail 907b, deposition chamber 908 with spray unit 908a and mask 908b, deposition chamber 909 with sputter target 909a and deposition chamber 910 with sputter target 910a.
[0069]
At this time, the mask 905b is a mask for blocking pixels other than the pixels on which the light emitting layer (light emitting layer R) that develops red color is to be formed, and the mask 906b is a light emitting layer (light emitting layer G) that develops green color. The mask 908b is a mask for blocking pixels other than the pixel for forming the light emitting layer (light emitting layer B) that develops blue color. These masks enable the light emitting layer to be applied separately.
[0070]
The function of each part in the above configuration is substantially the same as that of the manufacturing apparatus described in Embodiment 2 with reference to FIG. 5, and detailed description is omitted, but the configuration of each film formation chamber 904 to 906 and 908 is the same. Since it is changed, the internal configuration of these film forming chambers will be described below with reference to FIG.
[0071]
10 is an enlarged view of a spray unit provided in each of the film formation chambers 904 to 906 and 908, and FIG. 10A is a top view as seen from the upper surface side of the film formation chamber. (B) is the side view seen from the side of the film-forming chamber.
[0072]
In FIG. 10, reference numeral 1001 denotes a base, which includes a pixel electrode and an insulating film for defining each pixel, like the active matrix base shown in FIG. Here, at least a pixel (pixel R) 1002a corresponding to red display, a pixel (pixel G) 1002b corresponding to green display, and a pixel (pixel B) 1002c corresponding to blue display exist on the base body 1001, and these pixels are present. Are arranged in a matrix.
[0073]
A mask 1003 and a spray unit 1004 are disposed on the pixel R1002a, the pixel G1002b, and the pixel B1002c. Note that the mask 1003 is a so-called shadow mask, and functions as a shielding mask for preventing the light emitting composition from being formed on unnecessary pixels.
[0074]
The spray unit 1004 is provided with a plurality of injection ports 1005 (see FIGS. 10A and 10B), from which solution 1006 containing a luminescent material is injected radially. In this embodiment mode, since the atomized solution 1006 is ejected radially, it is called a spray method. Note that in the structure illustrated in FIG. 10A, a solution 1006 containing a light-emitting material is a solution containing a light-emitting material that develops red color, and a light-emitting layer that develops red color is formed over the pixel R1002a. Thereafter, the solvent is vaporized by heat treatment in vacuum to leave only the luminescent material, thereby forming a luminescent layer. At this time, it is necessary that the viscosity of the solution 1006 containing the luminescent material is within a range that can be sprayed in a mist form.
[0075]
In the above configuration, since the kinetic energy blown out is large in the vicinity of the injection port 1005, so-called turbulent flow is generated. However, when the distance between the ejection port 1005 and each pixel 1002 is sufficiently large, the flow rate of the solution 1006 containing the luminescent material ejected radially is sufficiently slow, resulting in a so-called laminar flow. Conceivable. Therefore, if the distance between the ejection port 1005 and each pixel 1002 is sufficiently separated to the extent that a laminar flow is generated, film formation with higher uniformity can be achieved.
[0076]
According to the above configuration, spraying on the entire surface of the substrate is possible at once, and a process with extremely high throughput can be realized. Of course, as illustrated in the head section of the dot jet method of FIG. 3, the spray section is made into a linear, rectangular, oblong, or other elongated shape, and spraying is performed while moving the substrate or spray section. It is also possible to do. In this case, the spray unit may scan from the upper end to the lower end of the substrate, or may scan from the left end to the right end.
[0077]
[Embodiment 6]
The present embodiment is an example in which the structure of the film formation chamber is changed in the manufacturing apparatus (FIG. 5) described in the second embodiment. Specifically, a solution application apparatus using a spray method is used for a film formation chamber for forming a hole injection layer, and a solution application apparatus using a liquid jet method is used for a film formation chamber for forming a light emitting layer. FIG. 11 is used for the description. Note that portions having the same configuration as in FIG. 5 are described using the same reference numerals.
[0078]
First, FIG. 11A shows a state in which a hole injection layer is formed on the substrate 500 by a spray method. The film formation chamber 1101 is provided with a spray portion 1101a for injecting a solution containing a phosphor composition (here, an organic compound or an inorganic compound to be a hole injection layer) by a spray method. The solution containing the material to be is ejected radially.
[0079]
FIG. 11B shows a state in which a light emitting layer that is colored green is formed on the substrate 500 on which the hole injection layer is formed by a liquid jet method (either a dot jet method or a line jet method). . The film formation chamber 506 is provided with a head portion 506a for ejecting a solution containing a phosphor composition (here, a light emitting layer) by a liquid jet method, and a solution containing a material to be a light emitting layer is jetted. .
[0080]
In this embodiment, the reason why the spray method is used for forming the hole injection layer and the liquid jet method is used for forming the light emitting layer is that the hole injection layer is a layer that functions in common for all pixels. This is because it is not necessary to paint each one separately. In other words, since there is no need for separate coating, a simple and high-throughput spray method is advantageous. On the other hand, since it is necessary to coat the light emitting layer for each pixel, a liquid jet method suitable for painting is used. Of course, not only the liquid jet method but also the printing method may be used.
[0081]
As described above, optimizing the means for forming a layer common to all pixels and the means for forming a layer that needs to be separately applied to each pixel contributes to an improvement in overall throughput. In carrying out this embodiment, the effect of the present invention is not impaired even when combined with any of the configurations shown in the first to fifth embodiments.
[0082]
[Embodiment 7]
In the first and second embodiments, the case where the substrate (substrate to be processed) is erected, that is, the case where the surface to be processed is conveyed in a state parallel to the direction of gravity has been described. An example of a different configuration will be described with reference to FIG.
[0083]
12A and 12B are diagrams illustrating a manufacturing process of a light emitter in the present embodiment, and the head portion 1201 of the solution coating apparatus is scanned along the surface of the base body 1200. FIG. A solution containing a phosphor composition is ejected from the head portion 1201 in the manner shown in the first to third embodiments, and a phosphor 1202 is formed through a firing process. At this time, the feature of the present embodiment is that the base body 1200 is installed with a certain inclination with respect to the direction of gravity. If this inclination is too large, the advantage of space saving of the manufacturing apparatus is lost. Therefore, if the angle formed by the film formation surface of the substrate to be processed and the direction of gravity is 0 to 30 ° (more preferably 0 to 10 °). good.
[0084]
Another feature of the present embodiment is that means are provided for preventing drying of the ejection openings of the head portion 1201 after the predetermined coating process is completed on the entire substrate. That is, a storage portion 1203 for storing the head portion 1201 is installed under the base 1200, and the inside thereof is filled with a gas obtained by volatilizing the solvent. A gas in which the solvent is volatilized (a gas containing a solvent component) is introduced from the introduction port 1204 and then filled into the storage portion 1203 through a plurality of openings 1205 provided in the lower portion of the storage portion 1203.
[0085]
The “gas in which the solvent is volatilized” is a solvent that can dissolve the phosphor to be formed, and is preferably the same as the solvent of the solution containing the phosphor composition ejected by the head unit 1201. Of course, it is not necessary to limit to the same thing, What is necessary is just to change suitably according to the kind of light-emitting body which should be formed.
[0086]
Next, FIGS. 12C and 12D show the state of the head portion 1201 at the time when the light-emitting body forming process is completed. As shown in FIGS. 12C and 12D, the head portion 1201 is housed so as to be completely hidden inside the housing portion 1203 and exposed to an atmosphere of solvent gas. At this time, it is effective to provide a lid portion in the storage unit 1203 and suppress the diffusion of the solvent component to the outside after the head unit 1201 has been stored. Of course, since the head portion is fixed and scanned by a support material (not shown) or the like, it is natural to cover the head portion while avoiding this.
[0087]
As described above, the present embodiment is characterized in that after the step of forming a light emitter, the head portion is exposed to an atmosphere filled with a solvent capable of dissolving the light emitter to be formed. In addition, since the phosphor composition is dissolved by the solvent at the ejection port of the head portion 1201, clogging does not occur due to drying or the like. That is, since there is an environment in which the phosphor composition does not dry even when the spraying of the phosphor composition is stopped, there is no need to always continuously spray the solution to prevent drying as in the conventional so-called ink jet method, and the ratio of wasteful jetting and discharging is reduced. And the utilization efficiency of the phosphor composition can be improved.
[0088]
The present embodiment can be combined with a manufacturing apparatus including any of the configurations of the first to third and sixth embodiments.
[0089]
[Embodiment 8]
In the present embodiment, the configuration of the head portion of the solution coating apparatus using the liquid jet method used in the manufacturing apparatus of the present invention will be described with reference to FIG. In FIG. 13A, a base body 1301 is supported by a susceptor 1302 made of a magnetic material, and is installed vertically (including an oblique case). Then, a head portion 1303 of the solution coating apparatus is provided in the vicinity of the surface side of the base body 1301. At this time, an enlarged portion of the tip portion of the nozzle (jet port) 1304 is indicated by a dotted line portion 1305. The inside of the nozzle has a hollow structure, and further, a core 1306 fixed inside the nozzle, and a cap made of a magnetic body connected to the core 1306 via an elastic body (a spring in this embodiment) 1307 (hereinafter referred to as magnetic 1308). The outside of the hollow structure is filled with a solution 1309 containing a phosphor composition.
[0090]
The magnetic cap 1308 is selected from a material that exerts a repulsive force between the magnetic cap 1308 and the susceptor 1302 made of a magnetic material. In the case of FIG. 13A, the distance (X1) between the base body 1301 and the magnetic body cap 1308 is a distance where the repulsive force does not work effectively between the susceptor 1302 and the magnetic body cap 1308, and the material of the magnetic body And a distance determined by the thickness of the substrate. When the repulsive force does not work effectively between the susceptor 1302 and the magnetic body cap 1308, the magnetic body cap 1308 is pushed by the elastic body 1307 and is packed at the tip of the nozzle 1304, and the solution 1309 containing the phosphor composition is added. It is designed not to be jetted.
[0091]
On the other hand, after the solution application is started, as shown in FIG. 13B, the distance between the base 1301 and the magnetic cap 1308 is reduced to X2. This distance X2 is a distance at which a repulsive force acts sufficiently between the susceptor 1302 and the magnetic cap 1308, and the magnetic cap 1308 compresses the elastic body 1307 and is pushed into the hollow structure by this repulsive force. As a result, a space is secured at the tip of the nozzle 1304, and the solution 1309 containing the phosphor composition is injected. In this manner, the solution 1309 containing the phosphor composition is applied to the surface of the substrate 1301, and the solvent is volatilized under reduced pressure, or the solvent is volatilized by heating the substrate 1301 to form the phosphor 1310.
[0092]
As described above, it is possible to apply the internal solution when approaching a certain distance by using a magnetic material having a repulsive force acting as a cap on both the susceptor and the nozzle tip. Thus, the uniformity of the distance between the base and the head portion (strictly, the nozzle) can be ensured. This technique is particularly effective when a solution is applied onto a substrate having irregularities.
[0093]
The present embodiment can be combined with a manufacturing apparatus including any of the configurations of the first to third, sixth, and seventh embodiments.
[0094]
[Embodiment 9]
In this embodiment, a technique for storing a solution containing a phosphor composition without exposing it to the atmosphere in the manufacturing apparatus shown in Embodiments 1 to 8 will be described.
[0095]
FIG. 14 is a cross-sectional view of a container (canister can) for storing (stocking) a solution containing a phosphor composition in a solution coating apparatus. The container 1401 is desirably formed of a material having sufficient confidentiality, particularly resistance to permeation of oxygen and moisture, and stainless steel, aluminum, or the like may be used. The inner surface is preferably mirror-finished. Furthermore, a silicon nitride film, a diamond-like carbon film, or other insulating film having a low oxygen permeability may be provided on the inner surface and / or the outer surface as necessary. This is to prevent deterioration of the solution 1402 containing the phosphor composition provided inside the container 1401.
[0096]
Reference numeral 1403 denotes an introduction port for introducing nitrogen, a rare gas, or other inert gas into the container 1401, and the inert gas is introduced from here to increase the internal pressure of the container. Reference numeral 1404 denotes a lead-out port for sending the solution 1402 containing the phosphor composition delivered by pressurization to the head portion of a solution coating apparatus (not shown). The inlet 1403 and outlet 1404 may be formed of a material different from that of the container 1401 or may be integrally formed.
[0097]
Reference numeral 1406 denotes an introduction pipe connected to the introduction port 1403. When an inert gas is actually introduced, the distal end of the introduction pipe 1406 is connected to the introduction port 1403 to introduce the inert gas. Similarly, the leading end of the outlet tube 1407 is connected to the outlet port 1404 to lead out the solution 1402 containing the phosphor composition. In the figure, it is indicated by a dotted line because it is removable.
[0098]
For example, each head portion shown in the first embodiment and the second embodiment is attached to the extended tip of the outlet tube 1407. In the case of the first embodiment, the solution 1402 containing the phosphor composition can be intermittently ejected by vibrating the piezoelectric elements 206a to 206c in a state where the inside of the container 1401 is pressurized with an inert gas. Become. In the case of Embodiment 2, it is possible to apply continuously while the inside of the container 1401 is pressurized with an inert gas, and when the pressurization is stopped, the solution 1402 containing the luminescent composition is also ejected. Stop.
[0099]
Furthermore, this embodiment is characterized in that the solution 1402 containing the phosphor composition is always transported in a state of being cut off from the atmosphere after being put into the container 1401 and being attached to the solution coating apparatus. That is, a manufacturer that manufactures the solution 1402 containing the phosphor composition puts the solution 1402 containing the phosphor composition into the container 1401 and transports it without opening to the atmosphere while maintaining airtightness, and directly into the solution coating apparatus. It can be attached. This is a device made in view of the fact that the phosphor composition is weak in resistance to oxygen and moisture and easily deteriorates, and after purifying the phosphor composition, it maintains the purity as it is purified until it is applied. Therefore, it contributes to suppression of deterioration of the phosphor composition, that is, improvement of the reliability of the light emitting device.
[0100]
Note that the container shown in FIG. 14 in this embodiment is an example suitable for transporting while maintaining the purity of the solution containing the phosphor composition, and limits the containers that can be used in the present invention. is not.
[0101]
[Embodiment 10]
This embodiment is characterized in that light in a long wavelength region is used as means for baking the light-emitting body formed by the various methods described in Embodiments 1 to 5. The structure of this embodiment will be described with reference to FIGS. 15A is a top view illustrating a heating method in this embodiment, FIG. 15B is a cross-sectional view taken along line AA ′, and FIG. 15C is a line taken along BB. FIG.
[0102]
In FIG. 15A, reference numeral 1501 denotes a substrate which transmits at least light having a wavelength longer than that of visible light (typically light having a wavelength longer than 300 nm), and a thin film transistor, a pixel electrode, and the like are provided thereover. It has been. The base 1501 is transported in the direction of the arrow 1502 by a transport mechanism (not shown).
[0103]
In addition, a head portion 1503 of a solution coating apparatus is installed above the surface of the base 1501, and the solution containing the phosphor composition is applied in the manner described in the first to third embodiments. The applied phosphor composition 1504 is heated by light (hereinafter, referred to as lamp light) emitted from a lamp 1505 provided below the back surface side of the substrate 1501, and the solvent is volatilized (baked). 1506. That is, the applied phosphor composition 1504 is coated and then fired with lamp light to form a thin film.
[0104]
That is, the head 1503 and the lamp 1505 are scanned in the direction opposite to the moving direction of the base 1501 by the movement of the base 1501. Needless to say, the base 1501 can be fixed and the head portion 1503 and the lamp 1505 can be scanned. At this time, the head 1503 is always scanned first. As a result, the solution application by the head portion 1503 and the subsequent firing process by lamp light are performed almost simultaneously, and an effect equivalent to substantially reducing the firing process can be obtained.
[0105]
Note that light that can be used as lamp light is light having a wavelength that enables heating only without destroying the composition of the light emitter 1506. Specifically, light having a wavelength longer than 400 nm, that is, infrared light. The above long wavelength light is good. For example, electromagnetic waves in a wavelength region from 1 μm to 10 cm from far infrared to microwave can be used. In particular, from the viewpoint of handling, it is preferable to use far infrared rays (typically a wavelength of 4 to 25 μm).
[0106]
In this example, the entire surface application is completed by one scan of the head unit 1503. However, the substrate 1501 is reciprocated several times to perform multiple coats, and then the lamp 1505 is scanned. You can go. At this time, the lamp 1505 may be turned off during the first several scans of the head unit 1503, and the lamp 1505 may be scanned and emitted in synchronization with the last scan of the head unit 1503.
[0107]
In the present embodiment, the embodiment corresponding to the solution application by the liquid jet method has been described. However, in the solution application by the spray method, the spray portion has a linear shape, a rectangular shape, an elliptical shape, or other elongated shapes. It can also be applied to cases.
[0108]
As described above, by using a light source such as a lamp as a heating means in the firing process and irradiating light having a wavelength longer than infrared light, the phosphor composition can be applied and fired almost simultaneously. In other words, a process in which the firing step is omitted can be obtained.
Thereby, the throughput of the manufacturing process of the light emitting device can be improved.
[0109]
[Embodiment 11]
In this embodiment, an example in which the manufacturing apparatus of the present invention is a cluster tool system (also referred to as a multi-chamber system) will be described with reference to FIG. Each chamber is connected to each other by a gate valve so as to maintain an airtight state.
[0110]
In FIG. 16, a carrier 1602 for conveying a substrate is installed in a stock chamber 1601. The stock chamber 1601 is connected to the transfer chamber 1603 via a gate valve, and the substrate mounted on the carrier 1602 is transferred by the transfer arm 1604 and installed on the substrate mounting base 1605. At this time, the base is first placed on the pusher pin 1606, and then the pusher pin 1606 is lowered and placed on the base mounting base 1605.
[0111]
After fixing the substrate, the substrate mounting base 1605 rises 90 °, moves to the inside of the load / unload chamber 1607, and delivers the substrate to the susceptor 1600. In FIG. 16, the portion of the susceptor 1600 represented by a dotted line is located at the time of substrate processing, but the substrate and the susceptor move together as the process proceeds, and now It means that there is not at that time.
[0112]
The substrate delivered in the load / unload chamber 1607 moves along the rail together with the susceptor 1600 and is transferred to the common chamber 1608 connected by the gate valve. A turntable 1609 is provided in the common chamber 1608. When the susceptor 1600 is placed on the turntable 1609, the turntable 1609 rotates, and a chamber to be subjected to the next process connected to the common chamber via a gate valve is provided. select.
[0113]
The manufacturing apparatus in this embodiment includes a film formation chamber (HIL film formation chamber) 1610 in which a hole injection layer (HIL) is formed as a chamber for processing, and a film formation chamber (light emission layer formation) in which a light emitting layer is formed. A film chamber 1611, a film formation chamber (sputter film formation chamber) 1612 for forming a cathode by a sputtering method, and a film formation chamber (sputter film formation chamber) 1616 for forming a protective film by a sputtering method are provided. Each of the film formation chambers 1610 and 1611 for forming the light emitter is provided with the solution coating apparatus by the spray method described in Embodiment 5, and a film containing the light emitter composition is sprayed radially to form a film. The chamber to be performed. Each chamber is provided with spray units 1610a and 1611a of a solution coating apparatus.
[0114]
The sputter deposition chamber 1612 is provided with electrodes 1613 and 1614 and a target 1615, and the sputter deposition chamber 1616 is provided with electrodes 1617 and 1618 and a target 1619, all of which are columnar or elliptical. It is the shape of. The substrate attached to the susceptor 1600 is conveyed in the direction of the arrow, and film formation is performed when it passes by the side of the target 1615 or 1619. At this time, the sputtering method may be either a DC (direct current) sputtering method or an RF (alternating current) sputtering method.
[0115]
The substrate (susceptor) that has been processed in each chamber returns to the load / unload chamber 1607, and is stored in the carrier 1602 through the substrate mounting base 1605 and the like. The process up to the formation of the cathode of the light emitting element is thus completed. Note that the structure of the light emitter is not limited to this embodiment mode, and the light emitter can have any structure as long as the number of chambers is changed, the processing content of the film formation chamber is changed, or other changes. In other words, as in the second embodiment, the red, green, and blue light emitting layers can be separately applied.
[0116]
In addition, the present embodiment may be equipped with the solution coating apparatus by the liquid jet method shown in the first to third embodiments and / or the solution coating apparatus by the printing method shown in the fourth embodiment, or the sixth embodiment. You may combine with any structure of -10.
[0117]
[Embodiment 12]
Examples of the light emitters shown in Embodiments 1 to 5 include a light emitting layer, a hole injection layer, a hole transport layer, a hole blocking layer, an electron injection layer, an electron transport layer or an electron blocking layer, or a laminate thereof. Although these are mentioned, these may be comprised only with an organic compound, and the composite_body | complex (composite) which laminated | stacked the organic compound and the inorganic compound may be sufficient as it.
[0118]
Therefore, in this embodiment, an example in which a composite in which an organic compound and an inorganic compound are combined is used as a light emitter of the light emitting device of the present invention will be described. In addition, as a patent characterized by a hybrid structure in which an organic compound and an inorganic compound are laminated, there is US Pat. No. 5,895,932, which describes ultraviolet light (wavelength 380 nm) emitted from a diode made of an inorganic compound. ) Is an organic compound Alq _Three (Tris-8-quinolinolato aluminum complex) is a technique for extracting light generated by a phenomenon called photoluminescence, which is fundamentally different from the light emitter described in this embodiment, that is, a composite. It is a technical idea.
[0119]
Among organic compounds, a high molecular weight organic compound (hereinafter referred to as an organic polymer) has high heat resistance and is easy to handle, so that it is used as a solute in a film forming method by solution coating. In this embodiment, an example in which a composite of an organic polymer and an inorganic compound is used as a light emitter will be described.
[0120]
As an example of laminating an organic polymer and an inorganic compound to form a light emitter, there are typically the following four patterns.
(A) A combination of a hole injection layer (or hole transport layer) made of an inorganic compound and a light emitting layer made of an organic polymer
(B) A combination of an electron injection layer (or electron transport layer) made of an inorganic compound and a light emitting layer made of an organic polymer.
(C) A combination of a light emitting layer made of an inorganic compound and a hole injection layer (or hole transport layer) made of an organic polymer
(D) A combination of a light-emitting layer made of an inorganic compound and an electron injection layer (or electron transport layer) made of an organic polymer
[0121]
Moreover, as an example of forming a light emitter by mixing an organic polymer and an inorganic compound, there are typically the following three patterns.
(E) A combination in which an organic polymer having carrier transporting properties is used as a light emitting layer, and an inorganic compound is mixed in the organic polymer.
(F) Combination in which an organic polymer having the same polarity (n-type or p-type) carrier transportability and an inorganic compound are mixed as a light emitting layer
(G) A combination of an organic polymer having carrier transportability mixed with an inorganic compound having carrier acceptability
[0122]
Examples of the configuration (g) include a combination of an organic polymer having a hole transporting property and an inorganic compound having an electron accepting property. In this case, the inorganic compound having an electron-accepting property has a configuration in which electrons are received from the organic polymer, and as a result, holes are generated in the organic polymer, and the holes are transported to obtain transportability.
[0123]
In the structures (a) to (g), a p-type semiconductor material such as NiO (nickel oxide) can be used as a hole injection layer or a hole transport layer made of an inorganic compound, and an electron made of an inorganic compound. As the injection layer or the electron transport layer, ZnO (zinc oxide), TiO ₂ An n-type semiconductor material such as (titanium dioxide) can be used, and ZnS (zinc sulfide), CdS (cadmium sulfide), or the like can be used as the light-emitting layer made of an inorganic compound.
[0124]
For example, as an example of the configuration of the above (b), an example in which PPV (polyparaphenylene vinylene) is used as an organic polymer, CdS is used as an inorganic compound, and these are prepared by solution coating. In this case, when forming CdS, it is possible to apply CdS nano-particles (fine particles of several nm to several tens of nm; the same applies hereinafter) dispersed in a solvent. What is necessary is just to implement a process. In addition, instead of CdS, ZnO, TiO ₂ An n-type semiconductor material such as NiO or a p-type semiconductor material such as NiO may be used.
[0125]
Moreover, as an example of the structure of said (e), the example which uses PVK (polyvinylcarbazole) as an organic polymer, uses CdS as an inorganic compound, and produces these by solution coating is mentioned. In this case, CdS emits light with the light emission center.
When CdS is formed, CdS fine particles can be dispersed and applied in a solvent, and the coating process of the present invention may be performed in this coating process. An inorganic compound such as ZnS can be used instead of CdS. Since these CdS and ZnS are inorganic compounds that can easily form nanoparticles, they are very suitable materials when solution coating is used as in the present invention.
[0126]
In addition, as an example of the configuration of (g), PC (polycarbonate) is used as an organic polymer, and TPD (triphenyldiamine), which is a hole-transporting inorganic compound, and Ti alkoxide are mixed with this PC. After applying, PC, TPD and TiO by hydrolysis and vacuum heating ₂ An example of forming a light emitter in which is mixed. In this case, when CdS is formed, the fine particles of CdS can be dispersed and applied in a solvent, and the coating process of the present invention may be performed in this coating process.
[0127]
As described above, a composite phosphor can be manufactured by using various organic compounds and inorganic compounds, and the manufacturing method of the present invention can be carried out during the formation. It is.
[0128]
Note that the structure of the light emitter (composite) described in this embodiment can be manufactured by any of the methods in Embodiments 1 to 8, and can be stored in the container described in Embodiment 9. Is possible.
[0129]
[Embodiment 13]
In this embodiment, an example of a light-emitting device that can be manufactured by implementing the present invention will be described with reference to FIGS. In the pixel structure shown in FIG. 17A, reference numeral 1701 denotes a data signal line, 1702 denotes a gate signal line, 1703 denotes a power supply line, 1704 denotes a switching thin film transistor (hereinafter referred to as switching TFT, the same applies hereinafter), and 1705 denotes a charge holding line. , A capacitor 1706 is a driving thin film transistor (referred to as a driving TFT, hereinafter the same) for supplying a current to the light emitting element, 1707 is a pixel electrode connected to the drain of the driving TFT, and the pixel electrode 1707 is a light emitting element. Functions as an anode. Reference numeral 1712 denotes a counter electrode, and the counter electrode 1712 functions as a cathode of the light emitting element.
[0130]
FIG. 17B shows a drawing corresponding to the cut surface at AA ′ at this time. In FIG. 17B, reference numeral 1710 denotes a substrate, and a glass substrate, a quartz substrate, a plastic substrate, or other light-transmitting substrate can be used. A driving TFT 1706 is formed on the substrate 1710 using a semiconductor process. In addition, an insulator 1708 patterned in a lattice shape is provided so as to cover the end portion of the pixel electrode 1707 formed so as to be connected to the driving TFT 1706 and at least the driving TFT and the switching TFT.
[0131]
On these pixel electrodes 1707, light emitters 1711a to 1711c, a counter electrode 1712 functioning as a cathode, and a passivation film 1713 are provided. The light emitters 1711a to 1711c refer to a carrier injection layer, a carrier transport layer, a carrier blocking layer, a light emitting layer, an organic compound or an inorganic compound that contributes to carrier recombination, or a stacked body thereof. Known structures and materials may be used for the laminated structures and materials of the light emitters 1711a to 1711c.
[0132]
For example, as described in JP-A-2000-268967, JP-A-2000-294375, etc., at least one of the light emitters has a high resistance (resistivity is 1 to 1 × 10 × 10). ¹¹ Ω · cm) of an inorganic hole injection layer (or an inorganic hole transport layer). This inorganic hole injecting layer comprises, as a first component, an alkali metal element selected from Li, Na, K, Rb, Cs and Fr, an alkaline earth metal element selected from Mg, Ca and Sr, or La and A lanthanoid element selected from Ce is included, and an element selected from Zn, Sn, V, Ru, Sm and In is included as the second component. Further, as at least one layer of the light emitters, high resistance (resistivity is 1 to 1 × 10 ¹¹ Ω · cm) of an inorganic electron transport layer may be included. This inorganic hole injection layer is made of a metal element selected from Au, Cu, Fe, Ni, Ru, Sn, Cr, Ir, Nb, Pt, W, Mo, Ta, Pd and Co, or an oxide or carbide thereof. , Nitrides, silicides or borides. The main component of the inorganic hole injection layer may be silicon, germanium, or silicon germanium oxide. Thus, reliability as a light-emitting element can be increased by using a stable inorganic insulating film as a material for part of the light-emitting body.
[0133]
As the counter electrode 1712, an aluminum film or a silver thin film containing an element belonging to Group 1 or Group 2 of the periodic table can be used. In this embodiment mode, light emitted from the light emitters 1711a to 1711c is used. Therefore, the film thickness is desirably 50 nm or less. As the passivation film 1713, a silicon nitride film, an aluminum nitride film, a diamond-like carbon film, or other insulating films having high blocking properties against moisture and oxygen can be used.
[0134]
By implementing the present invention in manufacturing the light-emitting device having the above structure, it becomes possible to produce a light-emitting device with high throughput by a low-cost and simple method, and further improve the reliability of the light-emitting device. Can do.
[0135]
[Embodiment 14]
In this embodiment, an example of a light-emitting device that can be manufactured by implementing the present invention will be described with reference to FIGS. In the pixel structure shown in FIG. 18A, 1801 is a data signal line, 1802 is a gate signal line, 1803 is a power supply line, 1804 is a switching TFT, 1805 is a capacitor for holding electric charge, 1806 is a driving TFT, and 1807 is a driving TFT. The drain electrode 1808 is a pixel electrode connected to the drain electrode of the driving TFT, and the pixel electrode 1808 functions as an anode of the light emitting element. The pixel electrode 1808 is preferably made of a conductive film that is transparent to visible light so that light emitted from the light emitter can pass through, such as ITO (compound of indium oxide and tin oxide) or indium oxide and zinc oxide. It is preferable to use an oxide conductive film such as the above compound. Reference numeral 1812 denotes a counter electrode, and the counter electrode 1812 functions as a cathode of the light emitting element.
[0136]
FIG. 18B shows a drawing corresponding to the cut surface at AA ′ at this time. In FIG. 18B, reference numeral 1810 denotes a substrate, and a glass substrate, a quartz substrate, a plastic substrate, or other light-transmitting substrate can be used. A driving TFT 1806 is formed on the base 1810 using a semiconductor process. In addition, an insulator 1809 patterned in a lattice shape is provided so as to cover the end portion of the pixel electrode 1808 formed to be connected to the driving TFT 1806 and at least the driving TFT and the switching TFT.
[0137]
On these pixel electrodes 1808, light emitters 1811a to 1811c, a counter electrode 1812 functioning as a cathode, and a passivation film 1813 are provided. The light emitters 1811a to 1811c refer to a carrier injection layer, a carrier transport layer, a carrier blocking layer, a light emitting layer, an organic compound or an inorganic compound that contributes to carrier recombination, or a laminate thereof. Known structures and materials may be used for the laminated structures and materials of the light emitters 1811a to 1811c.
[0138]
For example, as described in JP-A-2000-268967, JP-A-2000-294375, etc., at least one of the light emitters has a high resistance (resistivity is 1 to 1 × 10 × 10). ¹¹ Ω · cm) of an inorganic hole injection layer (or an inorganic hole transport layer). This inorganic hole injecting layer comprises, as a first component, an alkali metal element selected from Li, Na, K, Rb, Cs and Fr, an alkaline earth metal element selected from Mg, Ca and Sr, or La and A lanthanoid element selected from Ce is included, and an element selected from Zn, Sn, V, Ru, Sm and In is included as the second component. Further, as at least one layer of the light emitters, high resistance (resistivity is 1 to 1 × 10 ¹¹ Ω · cm) of an inorganic electron transport layer may be included. This inorganic hole injection layer is made of a metal element selected from Au, Cu, Fe, Ni, Ru, Sn, Cr, Ir, Nb, Pt, W, Mo, Ta, Pd and Co, or an oxide or carbide thereof. , Nitrides, silicides or borides. The main component of the inorganic hole injection layer may be silicon, germanium, or silicon germanium oxide. Thus, reliability as a light-emitting element can be increased by using a stable inorganic insulating film as a material for part of the light-emitting body.
[0139]
As the counter electrode 1812, an aluminum film or a silver thin film containing an element belonging to Group 1 or 2 of the periodic table can be used. As the passivation film 1813, a silicon nitride film, an aluminum nitride film, a diamond-like carbon film, or another insulating film having a high blocking property against moisture and oxygen can be used.
[0140]
By implementing the present invention in manufacturing a light-emitting device having the above structure, it becomes possible to produce a light-emitting device with high throughput by a low-cost and simple method, and further improve the reliability of the light-emitting device. Can do.
[0141]
[Embodiment 15]
In this embodiment, an example in which the structure of the light-emitting element in the structure of the light-emitting device described in Embodiment 13 is different will be described. FIG. 19 is used for the description. Note that FIG. 19A illustrates a method in which a light-emitting layer that emits white light is used as a light-emitting layer, and the white light is color-separated into three colors of red, green, and blue through a color filter. FIG. 19B shows a method in which a light emitting layer that emits blue light is used as a light emitting layer, and the blue light is color-converted into three colors of red, green, and blue by a color conversion layer (CCM).
[0142]
In FIG. 19A, reference numeral 1901 denotes a pixel electrode. Here, a titanium nitride film is used as an anode. An insulating film 1902 is provided so as to cover the end portion, and a hole injection layer 1903 is provided thereon. A light emitting layer 1904 that emits white light is provided over the hole injection layer 1903, and a cathode 1905 and a protective film 1906 are further provided thereover. Until the formation of the protective film 1906, the manufacturing apparatus of the present invention can be used in an integrated process.
[0143]
At this time, as the light-emitting layer 1904 that emits white light, a known light-emitting layer using a polymer organic compound can be used. As an example, Butyl-PBD (1, 1), which is an electron transport material, is added to PVK (polyvinylcarbazole). 3,4-oxadiazole derivative) was dispersed, and TPB (1,1,4,4-tetraphenyl-1,3-butadiene), coumarin 6, and DCM1 (a kind of styryl dye) were added as dopants. Things.
[0144]
The cathode 1905 has a laminated structure of an Al—Li (aluminum-added lithium alloy) electrode and an ITO (compound of indium oxide and tin oxide) electrode having a film thickness of about 20 to 50 nm. Transparent electrode.
[0145]
Further, a color filter that also serves as a sealing body is bonded onto the light emitting element using an adhesive resin (epoxy resin or the like) 1907. The color filter includes a support 1908, a black mask 1909, a resin layer 1910a that transmits red light, a resin layer 1910b that transmits green light, a resin layer 1910c that transmits blue light, and an overcoat layer (planarization layer) 1911. Is done.
[0146]
With the above structure, white light emitted from each pixel is converted into red light, green light, and blue light by the resin layer 1910a that transmits red light, the resin layer 1910b that transmits green light, and the resin layer 1910c that transmits blue light. Color separation is possible and colorization becomes possible.
[0147]
FIG. 19B is similar to the structure of FIG. 19A as a basic structure, but a light emitting layer 1921 emitting blue light is provided as a light emitting layer, and blue light is used instead of a color filter. A color conversion layer 1922a that converts color to red light, a color conversion layer 1922b that converts color to green light, and a color conversion layer 1922c that converts blue light for the purpose of improving purity (this color conversion layer 1922c can be omitted). Is provided.
[0148]
At this time, a known light-emitting layer using a polymer organic compound can be used as the light-emitting layer 1904 that emits blue light, and examples thereof include π-conjugated polymers such as polydialkylfluorene derivatives and polyparaphenylene derivatives. It is done.
As the color conversion layer, a known phosphor excited by blue light may be used.
[0149]
With the above structure, blue light emitted from each pixel is color-converted into red light, green light, and blue light by the color conversion layer 1922a, the color conversion layer 1922b, and the color conversion layer 1922c, respectively, and can be colored.
[0150]
The light-emitting device having the light-emitting element illustrated in FIGS. 19A and 19B can be manufactured using any of the manufacturing apparatuses including any of Embodiments 1 to 11.
[0151]
[Embodiment 16]
In this embodiment mode, an overall structure of a light-emitting device manufactured by implementing the present invention will be described with reference to FIGS. 20 is a top view of a light-emitting device formed by sealing an element substrate on which a thin film transistor is formed with a sealing material, and FIG. 20B is a cross-sectional view taken along line BB ′ of FIG. FIG. 20C is a cross-sectional view taken along the line AA ′ of FIG.
[0152]
On the base 81, a pixel portion (display portion) 82, a data line driving circuit 83, gate line driving circuits 84a and 84b, and a protection circuit 85 provided so as to surround the pixel portion 82 are arranged so as to surround them. A sealing material 86 is provided. The pixel portion 82 includes a light-emitting element manufactured by implementing the present invention. As the sealing material 86, an ultraviolet curable resin, an epoxy resin, or other resin can be used, but it is desirable to use a material having as low a hygroscopic property as possible. Note that the sealing material 86 may be provided so as to overlap with part of the data line driving circuit 83, the gate line driving circuits 84a and 84b, and the protection circuit 85, or may be provided avoiding these circuits.
[0153]
Then, the sealing material 87 is bonded using the sealing material 86, and the sealed space 88 is formed by the base body 81, the sealing material 86, and the sealing material 87. As the sealing material 87, a glass material, a metal material (typically a stainless steel material), a ceramic material, or a plastic material (including a plastic film) can be used. It is also possible to seal only with an insulating film as shown in Embodiment Mode 8.
[0154]
When a material different from that of the base body 81 is used as the sealing material 87, the adhesiveness of the sealing material 86 may be impaired due to a difference in thermal expansion coefficient. Therefore, it is desirable to use the same material as the base material 81 on which the transistor is formed as the sealing material 87. In other words, it is desirable to use a substrate having the same thermal expansion coefficient as that of the substrate 81. In this embodiment mode, glass is used as the material of the base 81 and the sealing material 87, and the sealing material 87 has the same thermal expansion coefficient by allowing the base 81 to pass the same thermal history as that in the thin film transistor manufacturing process.
[0155]
The sealing material 87 is previously provided with a moisture absorbent (barium oxide, calcium oxide or the like) 89 in the recess, and adsorbs moisture, oxygen, etc. inside the sealed space 28 to maintain a clean atmosphere. Plays a role in suppressing deterioration. This concave portion is covered with a fine mesh-shaped cover material 90, and the cover material 90 allows air and moisture to pass therethrough and does not allow the moisture absorbent 89 to pass therethrough. The sealed space 88 may be filled with a rare gas such as nitrogen or argon, and may be filled with a resin or liquid if inactive.
[0156]
Further, a terminal portion 91 for transmitting signals to the data line driving circuit 83 and the gate line driving circuits 84a and 84b is provided on the base 81, and an FPC (flexible printed circuit) 92 is connected to the terminal portion 91. Thus, a data signal such as a video signal is transmitted. The cross section of the terminal portion 91 is as shown in FIG. 14B. The terminal portion 91 is provided on the side of the FPC 92 and the wiring having a structure in which the oxide conductive film 34 is stacked on the wiring 93 formed simultaneously with the gate wiring or the data wiring. The wiring 95 is electrically connected using a resin 97 in which a conductor 96 is dispersed. The conductor 96 may be a spherical polymer compound that is plated with gold or silver.
[0157]
In this embodiment, the protection circuit 85 is provided between the terminal portion 91 and the data line driving circuit 83, and when static electricity such as a sudden pulse signal enters between the two, the pulse signal is transmitted to the outside. Play a role of escape. At that time, a high voltage signal that enters instantaneously can be blunted by a capacitor, and other high voltage can be released to the outside by a circuit configured using a thin film transistor or a thin film diode. Needless to say, the protection circuit may be provided at another location, for example, between the pixel portion 82 and the data line driving circuit 83 or between the pixel portion 82 and the gate line driving circuits 84a and 84b.
[0158]
[Embodiment 17]
The thin film transistors shown in Embodiments 13 and 14 each have a top gate structure (specifically, a planar structure), but in each embodiment, a bottom gate structure (specifically, an inverted staggered structure) is used. It is also possible.
[0159]
Needless to say, the present invention is not limited to a thin film transistor, and may be applied to a MOS transistor formed using a silicon well. Furthermore, the present invention may be applied to a case where a diode element (also referred to as a two-terminal element) typified by an MIM (Metal-Insulator-Metal) element or the like is used instead of a thin film transistor.
[0160]
In any case, even when the present invention is implemented in manufacturing an active matrix light emitting device, the original effect is not impaired by the structure of a switching element such as a transistor structure.
[0161]
[Embodiment 18]
An electronic device can be manufactured by incorporating a light-emitting device obtained by implementing the present invention into a display portion. Electronic devices include video cameras, digital cameras, goggle-type displays (head-mounted displays), navigation systems, sound playback devices (car audio, audio components, etc.), notebook-type personal computers, game devices, and portable information terminals (mobile computers, A mobile phone, a portable game machine, an electronic book, or the like), an image playback device including a recording medium (specifically, a display capable of playing back a recording medium such as a digital versatile disc (DVD) and displaying the image) apparatus), and the like. Specific examples of these electronic devices are shown in FIGS.
[0162]
FIG. 21A illustrates a television which includes a housing 2001, a support base 2002, a display portion 2003, a speaker portion 2004, a video input terminal 2005, and the like. The present invention can be applied to the display portion 2003. Note that all information display televisions such as a personal computer, a TV broadcast reception, and an advertisement display are included.
[0163]
FIG. 21B illustrates a digital camera, which includes a main body 2101, a display portion 2102, an image receiving portion 2103, operation keys 2104, an external connection port 2105, a shutter 2106, and the like. The present invention can be applied to the display portion 2102.
[0164]
FIG. 21C illustrates a laptop personal computer, which includes a main body 2201, a housing 2202, a display portion 2203, a keyboard 2204, an external connection port 2205, a pointing mouse 2206, and the like. The present invention can be applied to the display portion 2203.
[0165]
FIG. 21D illustrates a mobile computer, which includes a main body 2301, a display portion 2302, a switch 2303, operation keys 2304, an infrared port 2305, and the like. The present invention can be applied to the display portion 2302.
[0166]
FIG. 21E shows a portable image reproducing device (specifically, a DVD reproducing device) provided with a recording medium, which includes a main body 2401, a housing 2402, a display portion A2403, a display portion B2404, and a recording medium (DVD or the like). A reading unit 2405, operation keys 2406, a speaker unit 2407, and the like are included. Although the display portion A 2403 mainly displays image information and the display portion B 2404 mainly displays character information, the present invention can be applied to the display portions A, B 2403, and 2404. Note that an image reproducing device provided with a recording medium includes a home game machine and the like.
[0167]
FIG. 21F illustrates a goggle type display (head mounted display), which includes a main body 2501, a display portion 2502, and an arm portion 2503. The present invention can be applied to the display portion 2502.
[0168]
FIG. 21G shows a video camera, which includes a main body 2601, a display portion 2602, a housing 2603, an external connection port 2604, a remote control receiving portion 2605, an image receiving portion 2606, a battery 2607, an audio input portion 2608, operation keys 2609, and the like. . The present invention can be applied to the display portion 2602.
[0169]
FIG. 21H illustrates a mobile phone, which includes a main body 2701, a housing 2702, a display portion 2703, an audio input portion 2704, an audio output portion 2705, operation keys 2706, an external connection port 2707, an antenna 2708, and the like. The present invention can be applied to the display portion 2703. Note that the display portion 2703 can suppress current consumption of the mobile phone by displaying white characters on a black background.
[0170]
As described above, the display device obtained by implementing the present invention may be used as a display unit of any electronic device. Note that the light-emitting device having any structure of Embodiments 13 to 16 may be used for the electronic device of this embodiment.
[0171]
【The invention's effect】
According to the present invention, the area occupied by the means for transporting the substrate can be kept small, and as a result, a manufacturing apparatus having a small footprint can be provided. By providing a manufacturing apparatus with a small footprint, the layout of the clean room and the design of the clean room can be facilitated.
[Brief description of the drawings]
FIG. 1 is a top view and a side view of a manufacturing apparatus according to the present invention.
FIG. 2 is a diagram for explaining the principle of the dot jet method.
FIG. 3 is a diagram showing an example of film formation by a dot jet method.
FIG. 4 is a diagram showing an example of film formation by a dot jet method.
FIG. 5 is a top view of the manufacturing apparatus of the present invention.
FIG. 6 is a view for explaining the principle of the line jet method.
FIG. 7 is a top view of the manufacturing apparatus of the present invention.
FIG. 8 is a diagram for explaining the principle of a printing method.
FIG. 9 is a top view of the manufacturing apparatus of the present invention.
FIG. 10 is a view for explaining the principle of a spray method.
FIG. 11 is a top view of the manufacturing apparatus of the present invention.
FIG. 12 is a diagram showing an example of film formation by a line jet method.
FIG. 13 is a diagram showing an example of the structure of a nozzle used in the line jet method.
FIG. 14 is a cross-sectional view of a container for storing a solution containing a phosphor composition.
FIGS. 15A and 15B are diagrams illustrating an example of manufacturing a light-emitting device by a solution coating method. FIGS.
FIG. 16 is a top view of the manufacturing apparatus of the present invention.
FIG. 17 shows a structure of a light-emitting device obtained by the present invention.
FIG. 18 shows a structure of a light emitting device obtained by the present invention.
FIG. 19 shows a structure of a light-emitting device obtained by the present invention.
FIG. 20 is a diagram showing the appearance of a light emitting device obtained by the present invention.
FIG. 21 illustrates an example of an electronic device including a light-emitting device obtained by the present invention.

Claims (13)

An in-line type light emitting device manufacturing apparatus including a load chamber, a plasma processing chamber, a light emitter film forming chamber, a turning chamber, a conductor film forming chamber, an insulator film forming chamber, and an unload chamber,
The light emitter film forming chamber is a film forming chamber for forming a light emitter by a liquid jet method,
The conductor film forming chamber is a film forming chamber in which a conductor is formed by sputtering.
The insulator film forming chamber is a film forming chamber for forming an insulator by sputtering,
The turning chamber has a turntable;
In any of the load chamber, the plasma processing chamber, the phosphor film forming chamber, the turning chamber, the conductor film forming chamber, the insulator film forming chamber, and the unload chamber, the substrate to be processed is a component of the substrate to be processed. The angle formed between the film surface and the direction of gravity is held so as to be within 0 to 30 °, and is rotated 180 ° in the turning chamber and moved to the next deposition chamber,
Under the substrate to be treated, there is provided a storage portion that stores a head portion for solution application and is filled with a gas in which a solvent is volatilized .
The substrate to be processed is supported by a susceptor made of a magnetic material ,
The head portion has a nozzle,
The nozzle has a hollow structure, and has a magnetic cap made of a material that exerts a repulsive force between the nozzle and the susceptor at a tip portion thereof. pushed within apparatus for manufacturing a light emitting device according to claim Rukoto internal solution is injected. Oite to claim 1, wherein the light emitter and wherein the light emitting layer, a hole injection layer, a hole transport layer, a hole blocking layer, an electron injection layer, which is either an electron transporting layer or an electron blocking layer Manufacturing device for light emitting device. 3. The light-emitting device manufacturing apparatus according to claim 1 , wherein the conductor is a metal film containing an element belonging to Group 1 or Group 2 of the periodic table. The light-emitting device manufacturing apparatus according to claim 1 , wherein the conductor is an oxide conductive film. In any one of claims 1 to 4, wherein the insulator manufacturing apparatus of the light-emitting device which is a silicon nitride film. In any one of claims 1 to 5, wherein the load chamber and said unload chamber apparatus for manufacturing a light emitting device, characterized in that integrated. In any one of claims 1 to 6, the target used in the sputtering apparatus for manufacturing a light emitting device which is a vertically long rectangular shape. A first treatment for plasma treatment on the electrode, a second treatment for depositing a light emitter on the electrode using an inkjet method, and a third treatment for depositing a conductor on the light emitter using a sputtering method. A method of manufacturing an inline-type light emitting device including a fourth process of forming an insulator on the conductor using a sputtering method,
Having a turn room with a turntable;
In the first treatment, the second treatment, the third treatment, the fourth treatment, and the turning in the turning chamber, the angle formed between the film formation surface of the substrate to be processed provided with the electrode and the gravity direction is 0. It is performed while being held so as to be within 30 °,
The substrate to be processed is turned 180 ° in the turning chamber,
Under the substrate to be treated, there is provided a storage portion that stores a head portion for solution application and is filled with a gas in which a solvent is volatilized .
The substrate to be processed is supported by a susceptor made of a magnetic material ,
The head portion has a nozzle,
The nozzle has a hollow structure, and has a magnetic cap made of a material that exerts a repulsive force between the nozzle and the susceptor at a tip portion thereof. pushed within a method for manufacturing a light emitting device according to claim Rukoto internal solution is injected. 9. The light emitting device according to claim 8 , wherein the light emitter is any one of a light emitting layer, a hole injection layer, a hole transport layer, a hole blocking layer, an electron injection layer, an electron transport layer, and an electron blocking layer. Device fabrication method. 10. The method for manufacturing a light-emitting device according to claim 8 , wherein the conductor is a metal film containing an element belonging to Group 1 or Group 2 of the periodic table. 10. The method for manufacturing a light-emitting device according to claim 8 , wherein the conductor is an oxide conductive film. In any one of claims 8 to 11, wherein the insulator is a method for manufacturing a light-emitting device which is a silicon nitride film. In any one of claims 8 to 12, the target used in the sputtering method for manufacturing a light-emitting device which is a vertically long rectangular shape.

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