KR20120113699A - Substrate processing apparatus and method for manufacturing display element - Google Patents

Abstract

The substrate processing apparatus includes a processing portion that performs a predetermined process on the substrate, and a substrate holding portion that holds the substrate while moving to the processing portion and forming a to-be-processed surface of the substrate.

Description

Substrate processing apparatus and manufacturing method of display element {SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING DISPLAY ELEMENT}

TECHNICAL FIELD This invention relates to the manufacturing method of a substrate processing apparatus and a display element.

This application claims priority based on Japanese Patent Application No. 2009-268789 for which it applied to Japan on November 26, 2009, and uses the content here.

As a display element which comprises display apparatuses, such as a display apparatus, organic electroluminescent (organic EL) element is known, for example. The organic EL device has an anode and a cathode on a substrate, and has an organic light emitting layer sandwiched between these anodes and cathodes. In the organic EL device, holes are injected from the anode into the organic light emitting layer to bond holes and electrons in the organic light emitting layer, and display light is obtained by the light emitted during the bonding. have. In the organic EL device, for example, an electric circuit connected to an anode and a cathode is formed on a substrate.

As one of the methods of manufacturing an organic EL element, the method called the roll-to-roll system (henceforth only a "roll system") is known (for example, See Patent Document 1). The roll method conveys a board | substrate, sending out the sheet-like board | substrate wound around the roller of the board | substrate supply side, winding up the board | substrate which was sent out by the roller of the board | substrate collection | recovery side, In the processing apparatus, a light emitting layer, an anode, a cathode, an electric circuit, and the like constituting an organic EL element are sequentially formed on a substrate.

Patent Document 1: International Publication No. 2006/100100868 Pamphlet

However, in such a roll system, when using a board | substrate with a thin plate thickness, there existed a problem that it was difficult to ensure flatness of a board | substrate. For this reason, the improvement of the processing precision in the formation process, alignment process, etc. of a light emitting layer, an electrode, etc. was hindered.

The aspect which concerns on this invention aims at providing the board | substrate processing apparatus excellent in processing precision, and the manufacturing method of a display element.

A substrate processing apparatus according to the aspect of the present invention is a substrate that holds a substrate while moving to the processing portion and the processing portion that performs a predetermined treatment with respect to the substrate and forming a to-be-processed surface of the substrate. A holding part is provided.

The manufacturing method of the display element in the aspect which concerns on this invention hold | maintains a board | substrate, forming a to-be-processed surface of a board | substrate by the process process of performing a predetermined process with respect to the to-be-processed surface of a board | substrate, and a board | substrate holding part. It has a board | substrate holding process and the moving process which moves the board | substrate holding part arrange | positioned at an endless support member to a conveyance direction of a board | substrate.

According to the aspect which concerns on this invention, the manufacturing method of the substrate processing apparatus and display element excellent in the processing precision can be provided.

1A is a configuration diagram of an organic EL element.
1B is a b-b cross-sectional view of the organic EL element in FIG. 1A.
1C is a c-c cross-sectional view of the organic EL element in FIG. 1A.
2 is a diagram illustrating a configuration of a substrate processing apparatus.
3 is a diagram illustrating a configuration of a substrate processing unit.
4 is a diagram illustrating a configuration of a droplet applying apparatus.
5 is a diagram illustrating a configuration of a transport mechanism.
6 is a diagram illustrating a configuration of a conveyance mechanism.
7 is a diagram illustrating a configuration of a conveyance mechanism.
8 is a diagram illustrating a configuration of a conveyance mechanism.
9 is a diagram illustrating a configuration of a conveyance mechanism.
10 is a view showing a partition wall forming step of a substrate processing unit;
11 is a view showing the shape and arrangement of partition walls formed on a sheet substrate.
12 is a cross-sectional view of a partition wall formed on a sheet substrate.
13A is a view showing an application operation of droplets.
13B is a cross sectional view of a droplet applied between partition walls;
14A is a sectional view of a thin film formed between partition walls;
14B is a diagram illustrating a configuration of a thin film formed between partition walls.
FIG. 15 shows a process of forming a gate insulating layer on a sheet substrate; FIG.
The figure which shows the process of cutting the wiring of a sheet | seat board | substrate.
17 is a diagram showing a step of forming a thin film in a source drain formation region.
18 shows a step of forming an organic semiconductor layer.
19 shows an example of alignment;
20 is a diagram illustrating an operation of a conveyance mechanism.
21 is a diagram illustrating a modification of the transport mechanism.

[First Embodiment]

EMBODIMENT OF THE INVENTION Hereinafter, with reference to drawings, 1st Embodiment which concerns on this invention is described.

(Organic EL device)

1A is a plan view showing the structure of an organic EL element. FIG. 1: B is sectional drawing b-b in FIG. 1A. FIG. 1C is a cross-sectional view taken along line c-c in FIG. 1A.

1A to 1C, in the organic EL element 50, a gate electrode G and a gate insulating layer I are formed on a sheet substrate FB, and a source electrode S and a drain electrode are formed thereon. After (D) and the pixel electrode P are formed, it is a bottom contact type in which the organic-semiconductor layer OS was formed.

As shown in FIG. 1B, the gate insulating layer I is formed on the gate electrode G. As shown in FIG. On the gate insulating layer I, a source electrode S of a source bus line SBL is formed, and a drain electrode D connected to the pixel electrode P is formed. An organic semiconductor layer OS is formed between the source electrode S and the drain electrode D. FIG. This completes the field effect transistor. Moreover, on the pixel electrode P, as shown to FIG. 1B and 1C, the light emitting layer IR is formed and the transparent electrode ITO is formed in this light emitting layer IR.

As shown in FIGS. 1B and 1C, for example, partition walls BA and bank layers are formed in the sheet substrate FB. As shown in FIG. 1C, the source bus line SBL is formed between the partitions BA. In this way, the presence of the partition BA allows the source bus line SBL to be formed with high accuracy, and the pixel electrode P and the light emitting layer IR are also formed accurately. Although not shown in FIGS. 1B and 1C, the gate bus line GBL is also formed between the partitions BA similarly to the source bus line SBL.

This organic EL element 50 is used very suitably also for the display part of an electronic device, etc., including a display apparatus, such as a display apparatus. In this case, what formed the organic electroluminescent element 50 in panel form, for example is used. In manufacturing such an organic EL element 50, it is necessary to form a substrate on which a thin film transistor (TFT) and a pixel electrode are formed. In order to precisely form at least one organic compound layer (light emitting element layer) including a light emitting layer on the pixel electrode on the substrate, it is preferable to form partition walls BA and bank layers easily and accurately in the boundary region of the pixel electrode. .

(Substrate processing unit)

2 is a schematic diagram showing the configuration of a substrate processing apparatus 100 that performs processing using a sheet substrate FB having flexibility.

The substrate processing apparatus 100 is an apparatus which forms the organic electroluminescent element 50 shown to FIG. 1A-FIG. 1C using strip | belt-shaped sheet | seat board | substrate FB. As shown in FIG. 2, the substrate processing apparatus 100 includes a substrate supply unit 101, a substrate processing unit 102, a substrate recovery unit 103, and a control unit 104. The sheet substrate FB is conveyed from the substrate supply part 101 to the substrate recovery part 103 via the substrate processing part 102. The control unit 104 collectively controls the operation of the substrate processing apparatus 100.

In the following description, the positional relationship of each member is demonstrated, setting an XYZ rectangular coordinate system and referring this XYZ rectangular coordinate system. In the horizontal plane, the direction in which the conveyance direction of the sheet substrate FB is in the X axis direction, and the direction orthogonal to the X axis direction in the horizontal plane is the direction orthogonal to each of the Y axis direction, the X axis direction and the Y axis direction (that is, the vertical direction). Set it to the Z-axis direction. In addition, the rotation (inclination) directions around the X-axis, Y-axis, and Z-axis are respectively θX, θY, and θZ directions.

As the sheet | seat board | substrate FB, a heat resistant resin film, stainless steel, etc. can be used, for example. For example, the resin film is polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate Materials, such as resin, can be used. The dimension of the Y direction of the sheet | seat board | substrate FB is formed in 1 m-about 2 m, for example, and the dimension of X direction is formed in 10 m or more, for example. Of course, this dimension is merely an example, and the present invention is not limited thereto. For example, the dimension of the Y direction of the sheet | seat board | substrate FB may be 50 cm or less, and may be 2 m or more. Moreover, the dimension of the X direction of the sheet | seat board | substrate FB may be 10 m or less. In addition, the flexibility in this embodiment means the property which can bend the said board | substrate, without disconnection or breaking even if the board | substrate has a predetermined force of at least about self-weight, for example. Moreover, the said flexibility changes with the environment, such as the material, size, thickness, or temperature of the said board | substrate.

It is preferable that the sheet | seat board | substrate FB has a small thermal expansion coefficient so that a dimension does not change even if it receives the heat of about 200 degreeC, for example. For example, an inorganic filler can be mixed with a resin film and a thermal expansion coefficient can be made small. As an example of an inorganic filler, titanium oxide, zinc oxide, alumina, silicon oxide, etc. are mentioned.

The substrate supply part 101 is connected to 102 A of supply side connection parts provided in the substrate processing part 102. The board | substrate supply part 101 supplies the sheet | seat board | substrate FB wound by roll shape, for example to the board | substrate process part 102. FIG. The substrate recovery part 103 recovers the sheet substrate FB after being processed by the substrate processing part 102. In addition, in the board | substrate supply part 101, it is not limited to the structure in which the sheet | seat board | substrate FB is accommodated in the state wound by roll shape, For example, the structure in which the sheet | seat board | substrate FB is accommodated in the laminated | stacked state may be sufficient. . The stacked state also includes a state in which wrinkles do not occur, and even if a predetermined force of at least about the own weight is applied to the substrate, disconnection or fracture does not occur.

3 is a diagram illustrating the configuration of the substrate processing unit 102.

As shown in FIG. 3, the substrate processing unit 102 includes a transfer unit 105, an element formation unit 106, an alignment unit 107, and a substrate cutting unit 108. The substrate processing unit 102 forms each component of the organic EL element 50 on the sheet substrate FB while conveying the sheet substrate FB supplied from the substrate supply unit 101, and the organic EL element ( It is a part which sends the sheet | seat board | substrate FB in which 50 was formed to the board | substrate collection | recovery part 103. FIG.

The element formation part 106 has the partition formation part 91, the electrode formation part 92, and the light emitting layer formation part 93. As shown in FIG. The partition formation part 91, the electrode formation part 92, and the light emitting layer formation part 93 are the partition formation part 91 and the electrode formation part from the upstream to downstream of the conveyance direction of the sheet | seat board | substrate FB. 92) and the light emitting layer forming unit 93 in this order. Hereinafter, each structure of the element formation part 106 is demonstrated.

The partition formation part 91 has the imprint roller 110 and the thermal transfer roller 115. The partition formation part 91 forms the partition BA with respect to the sheet | seat board | substrate FB sent out from the board | substrate supply part 101. FIG. In the partition formation part 91, while pressing the sheet | seat board | substrate FB with the imprint roller 110, and glass sheet board | substrate FB with the thermal transfer roller 115 so that the pressurized partition BA may maintain shape. Heat above the transition point. For this reason, the frame shape formed on the roller surface of the imprint roller 110 is transferred to the sheet | seat board | substrate FB. The sheet | seat board | substrate FB is heated by the thermal transfer roller 115 about 200 degreeC, for example.

The roller surface of the imprint roller 110 is mirror-processed, and the fine imprint mold 111 comprised from materials, such as SiC and Ta, is attached to the roller surface. The fine imprint mold 111 forms a wiring stamper and a color filter stamper of the thin film transistor.

The imprint roller 110 forms the alignment mark AM on the sheet | seat board | substrate FB using the fine mold 111 for imprint. In order to form alignment marks AM on both sides of the Y-axis direction in the width direction of the sheet substrate FB, the fine imprint mold 111 has a stamper for alignment marks AM.

The electrode formation part 92 is provided in the + X side of the partition formation part 91, and forms a thin film transistor using an organic semiconductor, for example. Specifically, after forming the gate electrode G, the gate insulating layer I, the source electrode S, the drain electrode D, and the pixel electrode P as shown in FIGS. 1A to 1C, the organic semiconductor Form a layer (OS).

The thin film transistor TFT may be an inorganic semiconductor system or an organic semiconductor may be used. Although an inorganic silicon thin film transistor is known as an inorganic semiconductor thin film transistor, a thin film transistor using an organic semiconductor may be used. If a thin film transistor is formed using this organic semiconductor, a thin film transistor can be formed using a printing technique or a droplet coating technique. Among the thin film transistors using organic semiconductors, field effect transistors (FETs) as shown in Figs. 1A to 1C are particularly preferable.

The electrode formation part 92 has the droplet applying apparatus 120, the heat processing apparatus BK, the cutting device 130, etc.

In the present embodiment, as the droplet applying apparatus 120, for example, the droplet applying apparatus 120G used when forming the gate electrode G and the droplet applying apparatus used when forming the gate insulating layer I ( 120I), the droplet applying apparatus 120SD used when forming the source electrode S, the drain electrode D, and the pixel electrode P, and the droplet applying apparatus 120OS used when forming the organic semiconductor OS. Etc. are used.

4 is a plan view showing the configuration of the droplet applying apparatus 120. In FIG. 4, the structure at the time of seeing the droplet applying apparatus 120 from the + Z side is shown. The droplet applying apparatus 120 is formed long in the Y-axis direction. The droplet applying apparatus 120 is provided with the drive device which is not shown in figure. The droplet applying apparatus 120 is movable by the said drive apparatus, for example in the X direction, a Y direction, and (theta) Z direction.

A plurality of nozzles 122 are formed in the droplet applying device 120. The nozzle 122 is provided in the surface which opposes the sheet | seat board | substrate FB in the droplet applying apparatus 120. FIG. The nozzles 122 are arranged along the Y-axis direction, for example, and two rows of nozzles (for example, nozzle rows) are formed. The control part 104 can apply | coat a droplet to all the nozzles 122 collectively, and can adjust the timing which apply | coats a droplet with respect to each nozzle 122 individually.

As the droplet applying apparatus 120, for example, an inkjet method, a dispenser method, or the like can be adopted. Examples of the inkjet method include a charge control method, a pressure vibration method, an electromechanical conversion type, an electrothermal conversion method, an electrostatic suction method, and the like. The droplet applying method is less wasteful in the use of the material, and moreover, it is possible to accurately arrange the desired amount of material at a desired position. In addition, the drop amount of the metal ink applied by the droplet applying method is, for example, 1 to 300 nanograms.

Returning to FIG. 3, the droplet applying apparatus 120G applies metal ink into the partition BA of the gate bus line GBL. The droplet applying apparatus 120I applies the electrically insulating ink of polyimide resin or urethane resin to a switching part. The droplet applying apparatus 120SD applies metal ink in the partition BA of the source bus line SBL and the partition BA of the pixel electrode P. FIG. The droplet applying apparatus 120OS applies an organic semiconductor ink to the switching part between the source electrode S and the drain electrode D. FIG.

The metal ink is a liquid in which a conductor having a particle diameter of about 5 nm is stable and dispersed in a solvent at room temperature, and carbon, silver (Ag), gold (Au), or the like is used as the conductor. The compound forming the organic semiconductor ink may be a single crystal material or an amorphous material, or may be a low molecule or a polymer. Particularly preferred among the compounds forming the organic semiconductor ink is a monocrystal or π-conjugated system of a cyclic aromatic aromatic hydrocarbon compound represented by pentacene, triphenylene, anthracene, or the like. And polymers.

Heat treatment apparatus BK is arrange | positioned at the + X side (substrate conveyance direction downstream side) of each droplet applying apparatus 120, respectively. The heat treatment apparatus BK is capable of radiating, for example, hot air or far infrared rays with respect to the sheet substrate FB. The heat treatment apparatus BK uses these radiant heat to dry or bake (bak) the droplets applied to the sheet substrate FB to cure them.

The cutting device 130 is provided on the upstream side of the droplet applying apparatus 120OS on the + X side of the droplet applying apparatus 120SD. The cutting device 130 cuts the source electrode S and the drain electrode D formed by the droplet applying apparatus 120SD, for example using a laser beam or the like. The cutting device 130 has a light source (not shown) and a galvano mirror 131 for irradiating the laser light from the light source onto the sheet substrate FB.

As a kind of laser light, the laser of the wavelength which absorbs with respect to the metal film to cut | disconnect is preferable, and 2, 3, 4 times harmonics, such as YAG, are preferable as a wavelength conversion laser. Moreover, by using a pulsed laser, thermal diffusion can be prevented and damages other than a cutting part can be reduced. If the material is aluminum, a femtosecond laser of 760 nm wavelength is preferred.

In this embodiment, the femtosecond laser irradiation part which used the titanium sapphire laser as a light source is used, for example. The femtosecond laser irradiation unit is configured to irradiate the laser light LL with a pulse of 10 KHz to 40 KHz, for example.

Since the femtosecond laser is used in the present embodiment, the submicron order can be processed, and the gap between the source electrode S and the drain electrode D which accurately determines the performance of the field effect transistor is accurately cut. I can do it. The interval between the source electrode S and the drain electrode D is, for example, about 3 μm to about 30 μm.

In addition to the femtosecond laser described above, for example, a carbon dioxide gas laser, a green laser, or the like can be used. Moreover, it is good also as a structure which cuts mechanically with a dicing saw etc. other than a laser.

The galvano mirror 131 is arranged in the optical path of the laser light LL. The galvano mirror 131 reflects the laser light LL from the light source on the sheet substrate FB. The galvano mirror 131 is provided to be rotatable in the θX direction, the θY direction, and the θZ direction, for example. As the galvano mirror 131 rotates, the irradiation position of the laser light LL changes.

By using both of the partition formation part 91 and the electrode formation part 92, even if a so-called photography process is not used, a thin film transistor etc. can be formed using a printing technique or the droplet coating technique. It is supposed to be. For example, in the case where only the electrode forming portion 92 in which a printing technique, a droplet applying technique, or the like is used is used, a thin film transistor or the like may not be obtained with high accuracy due to the spreading and spreading of the ink.

On the other hand, since the partition BA is formed by using the partition formation part 91, the spread and spread of ink are prevented. Moreover, the space | interval between the source electrode S and the drain electrode D which determines the performance of a thin film transistor is formed by laser processing or machining.

The light emitting layer forming unit 93 is disposed on the + X side of the electrode forming unit 92. The light emitting layer forming part 93 forms the light emitting layer IR, the pixel electrode ITO, etc. which are a component of organic electroluminescent apparatus, for example on the sheet | seat board | substrate FB in which the electrode was formed. The light emitting layer formation part 93 has the droplet applying apparatus 140 and the heat processing apparatus BK.

The light emitting layer IR formed in the light emitting layer formation part 93 contains a host compound and a phosphorescent compound (also called a "phosphorescent compound"). A host compound is a compound contained in a light emitting layer. A phosphorescent compound is a compound in which luminescence from an excitation triplet is observed, and phosphorescence emits at room temperature.

In this embodiment, as the droplet applying apparatus 140, for example, the droplet applying apparatus 140Re which forms a red light emitting layer, the droplet applying apparatus 140Gr which forms a green light emitting layer, and the droplet applying apparatus 140Bl which forms a blue emitting layer. ), A droplet applying apparatus 140I for forming an insulating layer, a droplet applying apparatus 140IT for forming a pixel electrode ITO, and the like are used.

As the droplet applying apparatus 140, an inkjet method or a dispenser method can be adopted similarly to the droplet applying apparatus 120. When providing a hole transport layer, an electron transport layer, etc. as a component of the organic EL element 50, for example, the apparatus which forms these layers (for example, droplet application | coating) Device, etc.) separately.

The droplet applying device 140Re applies the R solution onto the pixel electrode P. FIG. In the droplet applying apparatus 140Re, the discharge amount of the R solution is adjusted so that the film thickness after drying is 100 nm. As R solution, the solution which melt | dissolved the red dopant in 1, 2-dichloroethane in polyvinylcarbazole (PVK) of a host material, for example is used.

The droplet applying apparatus 140Gr applies G solution on the pixel electrode P. FIG. As G solution, the solution which melt | dissolved the rust dopant in 1, 2-dichloroethane in the host material PVK is used, for example.

The droplet applying apparatus 140Bl applies B solution on the pixel electrode P. FIG. As B solution, the solution which melt | dissolved the blue dopant in 1, 2-dichloroethane in the host material PVK is used, for example.

The droplet applying apparatus 120I applies electrically insulating ink to a part of the gate bus line GBL or the source bus line SBL. As the electrically insulating ink, for example, ink of polyimide resin or urethane resin is used.

The droplet applying apparatus 120IT applies ITO (Indium Tin Oxide: Indium Tin Oxide) ink on red, green, and blue light emitting layers. As the ITO ink, such as the addition of several percent of tin oxide (SnO ₂₎ of indium oxide (In ₂ O ₃₎ compound is used. The okay to use a material that can produce a transparent conductive film such as an amorphous _{IDIXO (In 2 O 3 -ZnO)} . It is preferable that the transmittance | permeability of a transparent conductive film is 90% or more.

The heat processing apparatus BK is arrange | positioned at the + X side (substrate conveyance direction downstream) of each droplet applying apparatus 140, respectively. Similar to the heat treatment apparatus BK used by the electrode formation part 92, the heat treatment apparatus BK is able to radiate hot air, far-infrared rays, etc. with respect to the sheet | seat board | substrate FB. The heat treatment apparatus BK uses these radiant heat to dry or bake (bak) the droplets applied to the sheet substrate FB to cure them.

The conveyance part 105 has the some roller RR and the conveyance mechanism TR arrange | positioned at the position along the X direction. As the roller RR rotates, the sheet substrate FB is conveyed in the X-axis direction. The roller RR may be a rubber roller in which the sheet substrate FB is inserted from both sides, or may be a roller RR on which a ratchet is mounted as long as the sheet substrate FB has a perforation. Some rollers RR of the some roller RR are movable to the Y-axis direction orthogonal to a conveyance direction. The conveyance mechanism TR is arrange | positioned in the position corresponding to the electrode formation part 92 and the light emitting layer formation part 93 among the element formation parts 106 on the X direction.

The alignment unit 107 has a plurality of alignment cameras CA (CA1 to CA8) provided along the X direction. Alignment camera CA may image by CCD or CMOS under visible light illumination, may process the picked-up image, and detect the position of alignment mark AM, irradiates laser mark to alignment mark AM, and the scattered light The position of alignment mark AM may be detected by receiving light.

Alignment camera CA1 is arrange | positioned at the + X side of the thermal transfer roller 115. FIG. The alignment camera CA1 detects the position of the alignment mark AM formed by the thermal transfer roller 115 on the sheet | seat board | substrate FB. Alignment cameras CA2-CA8 are arrange | positioned at the + X side of heat processing apparatus BK, respectively. Alignment cameras CA2-CA8 detect the position of the alignment mark AM of the sheet | seat board | substrate FB via the heat processing apparatus BK.

By passing through the thermal transfer roller 115 and the heat processing apparatus BK, the sheet | seat board | substrate FB may expand and contract in an X-axis direction and a Y-axis direction. By disposing the alignment camera CA on the + X side of the thermal transfer roller 115 subjected to the heat treatment or on the + X side of the heat treatment apparatus BK, the positional shift of the sheet substrate FB due to thermal deformation or the like can be detected. It is supposed to be.

The detection result by alignment camera CA1-CA8 is transmitted to the control part 104. As shown in FIG. The control part 104 adjusts the application | coating position and timing of the ink of the droplet applying apparatus 120 and the droplet applying apparatus 140 based on the detection result of alignment camera CA1-CA8, and the board | substrate supply part 101, for example. Adjustment of the feed speed of the sheet | seat board | substrate FB, the conveyance speed of the roller RR, adjustment of the movement to the Y direction by the roller RR, adjustment of the cutting position and timing of the cutting device 130, etc. It is to be carried out.

(Transport mechanism)

Next, the structure of the conveyance mechanism TR provided in the said substrate processing part 102 is demonstrated. 5 is a diagram illustrating the configuration of the transport mechanism TR. The several conveyance mechanism TR shown by the said FIG. 3 is comprised in the same structure, respectively. For this reason, in FIG. 5, the conveyance mechanism TR arrange | positioned corresponding to the droplet applying apparatus 120 among the said some conveyance mechanisms TR is demonstrated as an example.

As shown in FIG. 5, the transport mechanism TR has a belt mechanism 10, a belt drive mechanism 20, and an air pad mechanism 40. The belt mechanism 10 and the belt drive mechanism 20 are arranged on the -Z side with respect to the sheet substrate FB. Moreover, the air pad mechanism 40 is arrange | positioned at the + Z side with respect to the sheet | seat board | substrate FB.

The belt mechanism 10 is disposed along the θY direction around the belt drive mechanism 20. The belt mechanism 10 has the rotating part 11 and the suction holding plate (substrate holding part 12). The rotation part 11 is comprised by the some support member 13 connected in endless form. Specifically, the support members 13 adjacent to each other in the θY direction are rotatably connected by one common shaft member 14. This structure is provided continuously in the (theta) Y direction, and the rotating part 11 is formed endlessly. The belt mechanism 10 is provided by the belt drive mechanism 20 so that rotation is possible in the (theta) Y direction.

The suction holder plate 12 is provided on the outer circumferential surface of each support member 13. The adsorption holding plate 12 is a plate-like member formed in a rectangular shape, for example. The suction holder plate 12 has a suction holder surface 12a for suctioning and holding the sheet substrate FB. The suction holding surface 12a is provided outside the belt mechanism 10.

6 is a view when the transport mechanism TR is viewed from the + Z side. As shown in FIG. 6, the suction holding plate 12 is formed so that it may protrude in the Y direction with respect to the sheet | seat board | substrate FB. 5 and 6, the transport mechanism TR holds the sheet substrate FB by the four adsorption holding plates 12 (S) in the center in the X direction.

FIG.7 and FIG.8 is a figure which shows the structure of one adsorption holding plate 12. As shown in FIG. FIG. 7: is a figure when the adsorption holding plate 12 is seen from the + Z side, and FIG. 8 is a figure which shows the structure of AA 'cross section in FIG.

As shown in FIG. 7 and FIG. 8, the adsorption holding plate 12 has a configuration in which the holding member 15 and the adsorption pad 16 are disposed on the support plate 17, respectively. As for the holding member 15, the Y direction of the support plate 17 is arrange | positioned substantially in the center, and it is the dimension which covers the to-be-processed part FBA of the sheet | seat board | substrate FB shown in FIG. Formed. Therefore, at least the to-be-processed part FBA of the sheet | seat board | substrate FB is hold | maintained by the holding member 15. FIG.

The + Z side surface of the holding member 15 in FIGS. 7 and 8 is a holding surface 15a holding the sheet substrate FB. The holding member 15 is formed so that this holding surface 15a may become flat. For this reason, the to-be-processed part FBA of the sheet | seat board | substrate FB hold | maintained by the holding surface 15a is hold | maintained flat by the holding surface 15a.

The suction pad 16 is arrange | positioned with respect to the holding member 15 one by one at both ends of a Y direction. The suction pad 16 is located at the short side in the Y direction from the portion FBA in the sheet substrate FB (for example, a position other than the portion FBA in the sheet substrate FB). It is supposed to adsorb.

The adsorption pad 16 is hold | maintained by the pad support member 17b, and is comprised so that it may become a negative pressure in the adsorption surface 16a of the + Z side in FIG.7 and FIG.8. The suction pad 16 is configured to vacuum suction the sheet substrate FB on the suction surface 16a. As an example, the -Z side of the suction pad 16 is connected to the pipe support 16b formed in the pad support member 17b and the support plate 17, and the pipe 16b is an external pipe 17c of the support plate 17. ) The piping 17c is connected to the pump mechanism 18 shown in FIG. 9, and the adsorption surface 16a is formed with the negative pressure by the said pump mechanism 18. FIG.

This suction surface 16a is formed so that there may be no step between the holding surface 15a of the holding member 15, and there is no step. Therefore, the adsorption holding surface 12a by the adsorption holding plate 12 is formed by the holding surface 15a and the adsorption surface 16a which were formed in the state without a step | step with each other. The sheet | seat board | substrate FB is attracted by the adsorption surface 16a provided in the both ends of the Y direction among the adsorption holding surfaces 12a, and it is set as the structure which is not adsorbed by the center holding surface 15a of the Y direction.

The pad support member 17b is provided to be movable in the Y direction by the actuator 17a for the Y direction. By this structure, the position of the Y direction of the suction pad 16 can be moved to a Y direction.

With this configuration, for example, the sheet substrate FB is adsorbed by the two adsorption pads 16, the + Y side adsorption pad 16 is moved in the + Y direction, and the -Y side adsorption pad ( By moving 16) in the -Y direction, the tension can be applied to the sheet substrate FB in the Y direction while maintaining the holding state on the holding surface 15a.

9 is a cross-sectional view showing the configuration of a pump mechanism 18 connected to the suction pad 16.

As shown in FIG. 9, the pump mechanism 18 has the fixed cylindrical shaft 30, the rotating cylinder 31, and the suction pump 32. As shown in FIG.

The fixed cylindrical shaft 30 is formed in the cylindrical shape as seen from the Y direction, and is being kept in the fixed position. The fixed cylindrical shaft 30 has the convex part 30a, the suction supply port 30b, and the air | atmosphere release port 30c. Two convex parts 30a are provided on the + Z side of the outer surface of the fixed cylindrical shaft 30. The convex part 30a is provided along the Y direction over the both ends of the Y direction of the fixed cylindrical shaft 30, respectively.

The suction supply port 30b is an opening formed along the Y direction inside the fixed cylindrical shaft 30, and is connected to the suction pump 32. The suction supply port 30b is provided with a branch portion 30d formed in the + Z direction in the figure. The branch portion 30d is formed to be connected between the two convex portions 30a. For this reason, the suction action of the suction pump 32 extends between the two convex portions 30a via the suction supply port 30b and the branch portion 30d. The atmospheric release port 30c is formed between the both ends of the Y direction of the fixed cylindrical shaft 30, and is connected to the atmosphere at the both ends. The air release port 30c has the branch part 30e. The branch portion 30e is connected to a position deviated from the two convex portions 30a.

The rotary cylinder 31 is provided so that the fixed cylindrical shaft 30 may be enclosed. The rotary cylinder 31 is arrange | positioned with the fixed clearance gap between the fixed cylindrical shaft 30 through the spacer 33 provided in the both ends of a Y direction, etc., for example. The inner surface of the rotating cylinder 31 is made to contact the two convex parts 30a of the fixed cylindrical shaft 30 without a gap, with the spacer 33 interposed. For this reason, the space between the outer surface of the fixed cylindrical shaft 30 and the inner surface of the rotating cylinder 31 is divided into the space S1 and the space S2 by the two convex portions 30a. have. Among them, the space S1 is in a state of being sucked by the suction pump 32, and the space S2 is always in an atmosphere released state.

The rotating cylinder 31 has provided the some opening part 31a along the (theta) Y direction. Each opening 31a is connected to the pipe 16c, respectively. The opening part 31a connected to space S1 among the some opening part 31a is made to suck inside part by the said suction pump 32. As shown in FIG. Moreover, the rotating cylinder 31 is made to rotate in accordance with the rotational speed of the belt mechanism 10 by the rotation mechanism which is not shown in figure, and the opening part 31a suctioned is switched with rotation. In this embodiment, a suction action is exerted on the opening part 31a connected to the four rotating parts 11 which support the sheet | seat board | substrate FB.

Moreover, in order to smoothly take over the sheet | seat board | substrate FB, in this pump mechanism 18, the adsorption | suction holding plate 12 of the most-(theta) Y side among four adsorption holding plates 12 hold | maintains the sheet | seat board | substrate FB. The suction is started before the position is reached, and it is preferable that the suction holding plate 12 on the + Y side is formed so as to be released from the position holding the sheet substrate FB and at the same time, the suction is released (atmosphere release).

Returning to FIG. 5, the belt drive mechanism 20 has the base part 21, the belt press part 22, and the belt press actuator 23. As shown in FIG. The base part 21 is fixed with respect to another part (for example, a bottom part, a plate part, etc.) of the board | substrate process part 102, and the position does not change. The belt press part 22 is arrange | positioned in multiple numbers along the (theta) Y direction with respect to the base part 21, and rotates the rotation part 11 corresponding to each adsorption holding plate 12 of the belt mechanism 10 in a rotation path (for example, It is provided so that it may press outward of the rotation path of the rotating part 11, the outer periphery of the rotating belt mechanism 10, etc.). The belt mechanism 10 is supported by these belt press parts 22. The front end of the belt pressing portion 22 is in contact with the belt mechanism 10 via a roller that can rotate in the θY direction.

The belt press part 22 is provided in plurality along the rotation direction of the belt mechanism 10. The plurality of belt pressing portions 22 are arranged in accordance with the pitch of the suction holder plate 12. As an example, four belt pressing portions 22 are arranged on the + Z side of the base portion 21 so as to press each of the four suction holding plates 12 holding the sheet substrate FB one by one. In addition, four belt pressing parts 22 are arranged on the + X side and the -X side of the base part 21 so as not to bend the belt mechanism 10. Among the plurality of belt pressing portions 22, for example, four belt pressing portions 22 disposed on the + Z side of the base portion 21 are connected to the belt pressing actuator 23, respectively. These belt press portions 22 are provided to be movable in the Z direction in the drawing by the belt press actuator 23. For this reason, the four adsorption holding plates 12 arrange | positioned at the + Z side of the base part 21 are pressed to the + Z side. In addition, the said four adsorption holding boards 12 are arrange | positioned in the position processed by the droplet applying apparatus 120, and its vicinity. For this reason, the suction holding plate 12 is pressurized by the belt pressing portion 22 at least at the processing position of the droplet applying device 120. Moreover, the eight belt pressing parts 22 arrange | positioned at the + X side and -X side of the base part 21 are being fixed with respect to the base part 21, respectively. In addition, as an example, the belt press part 22 may be comprised by the member which has high rigidity, and may be comprised by the elastic member like a spring.

The air pad mechanism 40 (base layer formation part) has the pad member 41, the airflow adjustment mechanism 42, and the piping 43. As shown in FIG. The pad member 41 is provided one by one on the upstream side (+ X side) and the downstream side (-X side) of the droplet applying apparatus 120, for example. Each of the pad members 41 is provided with a plurality of gas ejection openings 41a for ejecting gas (for example, inert gas such as air and nitrogen) and a plurality of gas suction ports 41b for sucking gas on the -Z side. . The gas jet port 41a and the gas suction port 41b are respectively connected to the airflow adjusting mechanism 42 through the pipe 43. The airflow adjusting mechanism 42 adjusts the ejection amount of the gas ejection port 41a and the suction amount of the gas suction port 41b. The blowing amount and the suction amount are adjusted by the airflow adjusting mechanism 42, so that a gas layer (gas layer or receiving portion) is formed on the -Z side of the pad member 41 with a constant layer thickness in the Z direction.

In addition, as shown in FIG. 3, in the light emitting layer formation part 93, although the conveyance mechanism TR is arrange | positioned over droplet applying apparatus 140R, 140G, and 140B, it is not limited to this structure, For example, The conveyance mechanism TR may be a structure provided separately with respect to each droplet applying apparatus 140R, 140G, and 140B, and may be set as the structure arrange | positioned over two of three droplet applying apparatus 140. FIG. .

In addition, in the electrode formation part 92 of FIG. 3, although the conveyance mechanism TR is provided individually with respect to droplet applying apparatus 120G, 120I, and 120SD, it is not limited to this structure, For example, a conveyance mechanism (TR) may be a structure arrange | positioned over these droplet applying apparatuses 120G, 120I, and 120SD, and it is good also as a structure arrange | positioned over two of three droplet applying apparatuses 120.

(Operation of Substrate Processing Unit)

Next, operation | movement of the substrate processing apparatus 100 comprised as mentioned above is demonstrated.

As shown in FIG. 2, the substrate processing apparatus 100 supplies the sheet | seat board | substrate FB to the board | substrate process part 102 from the board | substrate supply part 101 on the said sheet | seat board | substrate FB. An element is formed in the. In the substrate processing unit 102, as shown in FIG. 3, the sheet substrate FB is transported by the roller RR and the transport mechanism TR.

The controller 104 adjusts the rotational speed of each of the rollers RR in the substrate processing unit 102 and the belt mechanism of the conveyance mechanism TR in accordance with the supply speed of the sheet substrate FB supplied from the substrate supply part 101. 10) adjust the rotation speed and so on. Moreover, the control part 104 detects whether the roller RR shift | deviates in the Y-axis direction, and, if it shifts, moves the roller RR and corrects a position. Moreover, the control part 104 carries out position correction of the sheet | seat board | substrate FB by moving the roller RR.

The sheet | seat board | substrate FB supplied from the board | substrate supply part 101 to the board | substrate process part 102 is conveyed to the partition formation part 91 first. In the partition forming portion 91, the sheet substrate FB is fitted to the imprint roller 110 and the thermal transfer roller 115 and pressed, and the partition BA and the alignment mark AM are formed on the sheet substrate by thermal transfer. do.

FIG. 10: is a figure which shows the state in which the partition BA and the alignment mark AM were formed in the sheet | seat board | substrate FB. FIG. 11 is an enlarged view of a portion of FIG. 10. FIG. 12: is a figure which shows the structure along the D-D 'cross section in FIG. 10 and 11 show a state when the sheet substrate FB is viewed from the + Z side.

As shown in FIG. 10, the partition BA is formed in the element formation area | region 60 of the center part of the Y direction of the sheet | seat board | substrate FB. As shown in FIG. 11, by forming the partition BA, in the element formation region 60, a region (gate formation region 52) and a source bus forming the gate bus line GBL and the gate electrode G are formed. The region (source drain formation region 53) forming the line SBL, the source electrode S, the drain electrode D and the anode P is partitioned. As shown in FIG. 12, the gate formation area 52 is formed in trapezoid shape when seen from a cross section. Although not shown, the source drain formation region 53 has the same shape. The widths W and μm in the partition BA become the line widths of the gate bus lines GBL. As this width | variety W, it is preferable to set it as about 2 times-about 4 times with respect to the droplet diameter (d, micrometer) apply | coated from 120 G of droplet applying apparatuses.

In addition, the cross-sectional shape of the gate formation area 52 and the source drain formation area 53 is taken in cross section so that the sheet substrate FB may peel easily after the fine imprint mold 111 presses the sheet substrate FB. In view of the above, it is preferable to have a V shape or a U shape. As other shapes, it is good also as a rectangular shape, for example from a cross section.

On the other hand, as shown in FIG. 10, a pair of alignment marks AM is formed in the edge area 61 of the both ends of the Y direction of the sheet | seat board | substrate FB. The partition BA and the alignment mark AM are formed at the same time because the mutual positional relationship is important. As shown in FIG. 11, the predetermined distance PY between the alignment mark AM and the gate formation region 52 is defined in the Y axis direction, and the alignment mark AM and the source are defined in the X axis direction. The predetermined distance PX between the drain formation region 53 is defined. For this reason, the shift | offset | difference in the X-axis direction, the shift | offset | difference in the Y-axis direction, and (theta) rotation of the sheet | seat board | substrate FB can be detected based on the position of a pair of alignment mark AM.

In FIGS. 10 and 11, a pair of alignment marks AM is provided for each of the plurality of partition walls BA in the X-axis direction, but is not limited thereto. For example, the alignment marks AM are each aligned row. (AM) may be provided. Moreover, if there is space in the sheet | seat board | substrate FB, you may provide the alignment mark AM in not only the edge area 61 of the sheet | seat board | substrate FB but also the element formation area | region 60. As shown in FIG. In addition, although alignment mark AM showed the cross shape in FIG. 10 and FIG. 11, other mark shapes, such as a circular mark and an inclined straight mark, may be sufficient.

Subsequently, the sheet substrate FB is conveyed to the electrode formation part 92 by the conveyance roller RR. In the electrode formation part 92, application | coating of the droplet by each droplet applying apparatus 120 is performed, and an electrode is formed on the sheet | seat board | substrate FB.

The control part 104 operates the air pump mechanism 40 of the conveyance mechanism TR, and operates the pump mechanism 18 before the sheet | seat board | substrate FB is conveyed by the conveyance mechanism TR. By this operation, the air layer AR (refer FIG. 20) of fixed thickness is formed in the -Z side of the pad member 41, and the suction operation | movement by the suction pad 16 of the rotating part 11 is started.

When the sheet board | substrate FB is conveyed to the conveyance mechanism TR in this state, the sheet | seat board | substrate FB is adsorb | sucked to the adsorption surface 16a by the adsorption pad 16, and the holding surface 15a of the holding member 15 is carried out. ) Is maintained. Therefore, the sheet | seat board | substrate FB is hold | maintained by the adsorption holding surface 12a. The control part 104 applies tension to the sheet | seat board | substrate FB by moving the pad support member 17b to a Y direction as needed, and raises the flatness of the sheet | seat board | substrate FB.

The control part 104 applies tension to the sheet | seat board | substrate FB, and, as shown in FIG. 20, moves the belt press part 22 to + Z side, and the base layer formed in the -Z side of the pad member 41 ( The sheet substrate FB is pushed to AR). In this operation, the sheet substrate FB is also pressed to the -Z side on the pad member 41 side by reaction. In this manner, the sheet substrate FB is sandwiched between the gas layer AR and the adsorption holding surface 12a by using the -Z side surface ARc of the gas layer AR as a reference surface. The flatness on the surface FBc to be processed is maintained. The control part 104 conveys the sheet | seat board | substrate FB to + X direction by rotating the belt mechanism 10, maintaining the flatness in the to-be-processed surface FBc of the sheet | seat board | substrate FB. Hereinafter, the control part 104 makes the same operation also in the conveyance mechanism TR downstream of the substrate processing part 102.

Thus, the control part 104 starts the operation | movement of the droplet applying apparatus 120 in the state which maintained the flatness of the to-be-processed surface FBc of the sheet | seat board | substrate FB. For example, first, on the sheet substrate FB, the gate bus line GBL and the gate electrode G are formed by the droplet applying apparatus 120G. FIG. 13A and FIG. 13B are diagrams showing the state of the sheet substrate FB subjected to the droplet application by the droplet applying apparatus 120G.

As shown to FIG. 13A, 120 G of droplet applying apparatuses apply | coat a metal ink to the gate formation area | region 52 of the sheet | seat board | substrate FB in which the partition BA was formed, for example in the order of 1-9. This order is a procedure to apply | coat in linear form, for example by tension of metal ink. It is a figure which shows the state to which one drop of metal ink was apply | coated, for example. As shown in FIG. 13B, since the partition wall BA is provided, the metal ink applied to the gate formation region 52 is maintained without diffusion. In this way, the droplet applying apparatus 120G applies a metal ink to the entire gate formation region 52.

After metal ink is apply | coated to the gate formation area 52, the sheet | seat board | substrate FB is conveyed so that the apply | coated part of this metal ink may be located in the -Z side of the heat processing apparatus BK. The heat treatment apparatus BK heat-treats the metal ink apply | coated on the sheet | seat board | substrate FB, and this metal ink is dried. FIG. 14A is a diagram showing a state of the gate formation region 52 after drying the metal ink. As shown in FIG. 14A, the conductors contained in the metal ink are laminated in a thin film by drying the metal ink. Such a thin-film conductor is formed in the entire gate formation region 52, and as shown in FIG. 14B, the gate bus line GBL and the gate electrode G are formed on the sheet substrate FB.

Next, the sheet substrate FB is conveyed to the -Z side of the droplet applying apparatus 120I. In the droplet applying apparatus 120I, an electrically insulating ink is apply | coated to the sheet | seat board | substrate FB. In the droplet applying apparatus 120I, for example, as shown in FIG. 15, an electrically insulating ink is applied onto the gate bus line GBL and the gate electrode G passing through the source-drain formation region 53.

After the electrically insulating ink is applied, the sheet substrate FB is conveyed to the -Z side of the heat treatment apparatus BK, and the heat insulating apparatus BK performs heat treatment on the electrically insulating ink. By this heat treatment, the electrically insulating ink is dried to form the gate insulating layer (I). In FIG. 15, although the gate insulating layer I was formed in the circular shape so that it may hang on the partition BA, it is not necessary to form especially beyond the partition BA.

After the gate insulating layer I is formed, the sheet substrate FB is conveyed to the -Z side of the droplet applying apparatus 120SD. In the droplet applying apparatus 120SD, metal ink is apply | coated to the source-drain formation area 53 of the sheet | seat board | substrate FB. For the portion of the source drain formation region 53 that covers the gate insulating layer I, metal ink is discharged in the order of 1 to 9 shown in FIG. 16, for example.

After discharge of a metal ink, the sheet | seat board | substrate FB is conveyed to the -Z side of the heat processing apparatus BK, and the drying process of a metal ink is performed. After the drying treatment, the conductors included in the metal ink are laminated in a thin film form, and source bus lines SBL, source electrodes S, drain electrodes D, and anodes P are formed. In this step, however, the source electrode S and the drain electrode D are connected to each other.

Next, the sheet substrate FB is conveyed to the -Z side of the cutting device 130. The sheet | seat board | substrate FB is cut | disconnected between the source electrode S and the drain electrode D in the cutting device 130. FIG. FIG. 17: is a figure which shows the state which cut | disconnected the space | interval of the source electrode S and the drain electrode D with the cutting device 130. As shown in FIG. In the cutting device 130, cutting is performed, using the galvano mirror 131, adjusting the irradiation position of the laser beam LL to the sheet | seat board | substrate FB.

After cut | disconnected between the source electrode S and the drain electrode D, the sheet | seat board | substrate FB is conveyed to the -Z side of droplet applying apparatus OS. In the droplet applying apparatus OS, the organic semiconductor layer OS is formed on the sheet | seat board | substrate FB. In the region overlapping with the gate electrode G on the sheet substrate FB, the organic semiconductor ink is discharged so as to cover the source electrode S and the drain electrode D. FIG.

After discharge of organic-semiconductor ink, the sheet | seat board | substrate FB is conveyed to the -Z side of the heat processing apparatus BK, and the drying process of organic-semiconductor ink is performed. After this drying process, the semiconductor contained in an organic semiconductor ink is laminated | stacked in thin film form, and an organic semiconductor (OS) is formed as shown in FIG. Through the above steps, the field effect transistor and the connection wiring are formed on the sheet substrate FB.

Next, the sheet substrate FB is conveyed to the light emitting layer formation part 93 by the conveyance roller RR (refer FIG. 3). In the light emitting layer forming unit 93, red, green, and blue light emitting layers IR are formed by the droplet applying apparatus 140Re, the droplet applying apparatus 140Gr, the droplet applying apparatus 140Bl, and the heat treatment apparatus BK, respectively. . Since the partition BA is formed on the sheet | seat board | substrate FB, even if it apply | coats red, green, and blue light emitting layer IR continuously without heat-processing with the heat processing apparatus BK, a solution will be made to the adjacent pixel area | region. By overflowing, mixed color does not arise.

After the formation of the light emitting layer IR, the sheet substrate FB is formed with the insulating layer I through the droplet applying apparatus 140I and the heat treatment apparatus BK, and the droplet applying apparatus 140IT and the heat treatment apparatus BK are formed. Transparent electrode IT is formed through. Through such a process, the organic EL element 50 shown in FIGS. 1A to 1C is formed on the sheet substrate FB.

In the element formation operation, in order to prevent the sheet substrate FB from shifting in the X direction, the Y direction, and the θZ direction in the process of forming the organic EL element 50 while conveying the sheet substrate FB as described above, The alignment operation is performed. The alignment operation will be described below with reference to FIG. 19.

In the alignment operation | movement, the some alignment camera CA (CA1-CA8) provided in each part detects the alignment mark AM formed in the sheet | seat board | substrate FB suitably, and transmits a detection result to the control part 104. FIG. The control unit 104 executes the alignment operation based on the transmitted detection result.

For example, the control part 104 detects the transmission speed of the sheet | seat board | substrate FB based on the imaging interval of alignment mark AM which the alignment cameras CA (CA1-CA8) detect, etc., and the roller RR For example, it is determined whether or not it is rotating at a predetermined speed. When it is determined that the roller RR is not rotating at a predetermined speed, the control unit 104 gives a feedback by adjusting the rotation speed of the roller RR.

For example, the control part 104 detects whether the position of the alignment mark AM in the Y-axis direction shift | deviated based on the imaging result of the alignment mark AM, and determines the Y-axis of the sheet | seat board | substrate FB. The presence or absence of position shift in a direction is detected. When the position shift is detected, the control unit 104 detects how long the position shift continues for the state in which the sheet substrate FB is conveyed.

If the time of position shift is a short time, it responds by switching the nozzle 122 which apply | coats a droplet among the some nozzle 122 of the droplet applying apparatus 120. FIG. If the shift | offset | difference of the Y-axis direction of the sheet | seat board | substrate FB is continued for a long time, the position correction of the Y-axis direction of the sheet | seat board | substrate FB is performed by the movement of the roller RR.

For example, the control part 104 determines whether the sheet | seat board | substrate FB is shift | deviated to (theta) Z direction based on the position of the X-axis and Y-axis direction of the alignment mark AM which the alignment camera CA detects. Detect. When the position shift is detected, the control part 104 detects how long the position shift continues in the state which conveyed the sheet | seat board | substrate FB similarly to the detection of the position shift of the Y-axis direction.

If the time of position shift is a short time, it responds by switching the nozzle 122 which apply | coats a droplet among the some nozzle 122 of the droplet applying apparatus 120. FIG. If the misalignment is likely to continue for a long time, the two rollers RR provided at the position sandwiching the alignment camera CA which detected the misalignment are moved in the X direction or the Y direction, and the θZ direction of the sheet substrate FB is moved. Perform position correction.

In addition, in this embodiment, when the control part 104 controls the air pad mechanism 40, it controls the gas layer AR so that it may become a layer of uniform thickness, for example, alignment operation | movement, electrode formation operation | movement, In accordance with the processing of the substrate processing unit 102 in the above-described embodiments, such as the light emitting layer forming operation and the cutting operation of the sheet substrate FB, the layer thickness, the formation range of the gas layer AR, and the substrate from the pad member 41. It is preferable to control the feed rate or feed amount of the same.

As mentioned above, the substrate processing apparatus 100 in this embodiment is carried out to the droplet applying apparatuses 120 and 140 which perform predetermined | prescribed process with respect to the sheet | seat board | substrate FB, and the said droplet applying apparatuses 120 and 140. The suction holding plate 12 which holds the sheet substrate FB while forming the surface to be processed FBc of the sheet substrate FB is formed. Moreover, according to the substrate processing apparatus 100 of this embodiment, a process can be performed to the sheet | seat board | substrate FB, ensuring the flatness in the to-be-processed surface FBc of the sheet | seat board | substrate FB. Thereby, the substrate processing apparatus 100 which can form a high precision pattern with respect to a flexible board | substrate can be provided.

The technical scope of this invention is not limited to the said embodiment, A change can be suitably added in the range which does not deviate from the meaning of this invention.

For example, in the said embodiment, conveyance mechanism TR is made into a long length with respect to the bottom part of the substrate processing apparatus 100 in a conveyance direction (X direction), and has a short length in the vertical direction (Z direction) of a conveyance direction. Although it was comprised so that it may be limited to this, for example, as shown in FIG. 21, you may comprise so that it may become long in a Z direction. In this case, the sheet substrate FB is conveyed along the Z direction, and the process for the sheet substrate FB is performed in the X direction or the Y direction.

Moreover, in the said embodiment, although it set it as the structure which forms conveyance and a to-be-processed surface FBc using only the adsorption holding plate 12 of the + Z side of the base part 21 among conveyance mechanism TR, it was limited to this. For example, as shown in FIG. 21, the structure which conveys and forms to-be-processed surface FBc using the adsorption holding plate 12 of the -Z side of the base part 21 may be sufficient. In this case, for example, the droplet applying apparatus 120 of the electrode formation part 92 performs the process mentioned above with respect to the sheet | seat board | substrate FB using the adsorption holding plate 12 of the + Z side of the base part 21. As shown in FIG. The droplet applying apparatus 140 of the light emitting layer formation part 93 performs the process mentioned above with respect to the sheet | seat board | substrate FB using the adsorption holding plate 12 of the -Z side of the base part 21. As shown in FIG. Thereby, the size of the apparatus itself of the substrate processing apparatus 100 becomes small, and the space which arrange | positions the substrate processing apparatus 100 is saved.

In addition, in the said embodiment, although the conveyance mechanism TR was provided only in the position corresponding to the droplet applying apparatuses 120 and 140, you may arrange | position the conveyance mechanism TR in another position.

FB… Sheet substrate TR; Conveying mechanism
FBA… To-be-processed part S1... space
S2. Space 10... Belt mechanism
12 ... Adsorption holding plate 12a. Adsorption holding surface
13 ... Support member 14. Shaft member
15 ... Holding member 16. Absorption pad
16a. Adsorption surface 17. Support plate
17a... Actuator for Y direction 18.. Pump mechanism
20 ... Belt drive mechanism 22. Belt pressurization
23 ... Belt pressurized actuator 30. Fixed cylindrical shaft
31 ... Rotary cylinder 40... Air pad appliance
41…. Pad member 43. pipe
100 ... Substrate processing apparatus 104. The control unit
105. Carrier

Claims (24)

A processing unit that performs a predetermined process on the substrate,
A substrate processing apparatus comprising a substrate holding portion for holding the substrate while moving with respect to the processing portion and forming a surface to be processed of the substrate. The method according to claim 1,
A substrate processing apparatus provided with a plurality of said board | substrate holding parts. The method according to claim 1 or 2,
The substrate holding portion has a holding surface that makes the surface to be processed flat. The method according to any one of claims 1 to 3,
The substrate holding unit is disposed on an endless support member. The method according to any one of claims 1 to 4,
The substrate holding unit holds the substrate at a processing position by the processing unit. The method according to any one of claims 1 to 5,
And a pressing mechanism for pressing the substrate holding portion toward the processing portion side. The method of claim 6,
And a receiving portion receiving the substrate holding portion pressed by the pressing mechanism. The method of claim 7,
Further comprising a gas layer forming unit for forming a gas layer between the substrate holding unit,
The substrate processing apparatus in which the said gas layer is used as said receiving part. The method according to claim 7 or 8,
The substrate processing apparatus which forms the reference surface which becomes a reference | standard of the said to-be-processed surface using the said board | substrate holding part and the said receiving part. The method according to claim 9,
The substrate layer forming unit is provided so as to sandwich the processing unit in a moving direction of the substrate holding unit. The method according to any one of claims 1 to 10,
And a driving part for driving the substrate holding part. The method of claim 11,
Further provided with a substrate conveying unit for conveying the substrate,
The said drive part drives the said board | substrate holding part according to the conveyance speed of the said board | substrate. The method according to any one of claims 1 to 12,
The substrate holding apparatus has an adsorption section for adsorbing the substrate. The method according to claim 13,
The said adsorption part has a switching mechanism which switches the adsorption state of the said board | substrate. The method according to claim 14,
The said switching mechanism switches the said adsorption state according to the position of the said board | substrate holding part. The method according to any one of claims 13 to 15,
The said adsorption part is arrange | positioned corresponding to the edge part of the said board | substrate. The method according to any one of claims 13 to 16,
The substrate holding apparatus has a moving mechanism for moving the suction section. A processing step of performing a predetermined treatment on the surface to be processed of the substrate,
A substrate holding step of holding the substrate while forming a to-be-processed surface of the substrate by a substrate holding portion;
The manufacturing method of the display element which has a movement process which moves the said board | substrate holding part arrange | positioned at an endless support member to the conveyance direction of the said board | substrate. 19. The method of claim 18,
A manufacturing method of a display element having a forming step of forming a reference plane, which is a reference of the target surface, on the substrate. The method of claim 19,
The forming step includes supplying a gas toward the substrate to form a gas layer on the substrate. The method of claim 20,
The said forming process is a manufacturing method of the display element containing controlling the said gas layer according to the said predetermined process. The method according to any one of claims 18 to 21,
The manufacturing method of the display element which has a pressing process which presses the said board | substrate holding part toward the said board | substrate side. The method according to any one of claims 18 to 22,
The substrate holding step includes the step of adsorbing the substrate to the substrate holding portion and switching the adsorption state of the substrate in accordance with the position of the substrate holding portion. The method according to any one of claims 18 to 23,
The manufacturing method of the display element which has a conveyance process which conveys the said board | substrate with flexibility to the said conveyance direction.

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