HK1174316A1 - Substrate processing apparatus and method for manufacturing display element - Google Patents

Substrate processing apparatus and method for manufacturing display element

Info

Publication number
HK1174316A1
HK1174316A1 HK13101660.2A HK13101660A HK1174316A1 HK 1174316 A1 HK1174316 A1 HK 1174316A1 HK 13101660 A HK13101660 A HK 13101660A HK 1174316 A1 HK1174316 A1 HK 1174316A1
Authority
HK
Hong Kong
Prior art keywords
processing apparatus
display element
substrate processing
manufacturing display
manufacturing
Prior art date
Application number
HK13101660.2A
Other languages
Chinese (zh)
Inventor
宫地章
木內徹
奈良圭
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1174316A1 publication Critical patent/HK1174316A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
HK13101660.2A 2009-11-26 2013-02-06 Substrate processing apparatus and method for manufacturing display element HK1174316A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009268789 2009-11-26
PCT/JP2010/071124 WO2011065478A1 (en) 2009-11-26 2010-11-26 Substrate processing apparatus and method for manufacturing display element

Publications (1)

Publication Number Publication Date
HK1174316A1 true HK1174316A1 (en) 2013-06-07

Family

ID=44066582

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13101660.2A HK1174316A1 (en) 2009-11-26 2013-02-06 Substrate processing apparatus and method for manufacturing display element

Country Status (5)

Country Link
JP (1) JP5887935B2 (en)
KR (3) KR101880017B1 (en)
CN (1) CN102666323B (en)
HK (1) HK1174316A1 (en)
WO (1) WO2011065478A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013107684A2 (en) * 2012-01-17 2013-07-25 Asml Netherlands B.V. A method of loading a flexible substrate, a device manufacturing method, an apparatus for loading a flexible substrate, and a lithography apparatus
KR20210003358A (en) 2019-07-01 2021-01-12 삼성디스플레이 주식회사 Apparatus and method for manufacturing a display device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2639246B2 (en) * 1991-08-30 1997-08-06 凸版印刷株式会社 Substrate positioning device
JPH09306974A (en) * 1996-05-14 1997-11-28 Toshiba Corp Work holder
JPH11293459A (en) * 1998-04-07 1999-10-26 Murata Mfg Co Ltd Multilayer film forming device
JP2003174074A (en) * 2001-12-06 2003-06-20 Seiko Epson Corp Substrate suction pad, substrate carrier, substrate processing system and substrate carrying method
JP2006116435A (en) * 2004-10-21 2006-05-11 Seiko Epson Corp Liquid droplet discharge device, work adapted thereto, manufacturing method of electrooptical device, electrooptical device and electronic device
JP4313284B2 (en) * 2004-11-15 2009-08-12 大日本スクリーン製造株式会社 Substrate processing equipment
JP2006245302A (en) * 2005-03-03 2006-09-14 Fuji Photo Film Co Ltd Sheet body holding mechanism and drawing device using the same
WO2006100868A1 (en) 2005-03-18 2006-09-28 Konica Minolta Holdings, Inc. Method of forming organic compound layer, process for producing organic el device, and organic el device
JP4672480B2 (en) * 2005-08-10 2011-04-20 東京エレクトロン株式会社 Application processing equipment
JP5023542B2 (en) * 2006-04-17 2012-09-12 富士ゼロックス株式会社 Droplet discharge device
JP2008063020A (en) * 2006-09-04 2008-03-21 Olympus Corp Substrate carrying device, and substrate inspection system using it
JP4740414B2 (en) * 2007-04-24 2011-08-03 東京エレクトロン株式会社 Substrate transfer device
JP2008302487A (en) * 2007-06-11 2008-12-18 Olympus Corp Substrate sucking device, substrate transporting device, and outside appearance inspecting device
JP5092627B2 (en) * 2007-08-29 2012-12-05 凸版印刷株式会社 Substrate transfer device and substrate inspection device
JP2009218505A (en) * 2008-03-12 2009-09-24 Sumitomo Heavy Ind Ltd Unload chamber, and method for operating the same

Also Published As

Publication number Publication date
CN102666323B (en) 2015-06-03
KR101843545B1 (en) 2018-03-30
WO2011065478A1 (en) 2011-06-03
KR101880017B1 (en) 2018-07-18
KR20120113699A (en) 2012-10-15
CN102666323A (en) 2012-09-12
KR20180033596A (en) 2018-04-03
JP5887935B2 (en) 2016-03-16
JPWO2011065478A1 (en) 2013-04-18
KR20180084144A (en) 2018-07-24
KR101906129B1 (en) 2018-10-08

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20201122