TWI691111B - Substrate stretching unit, film forming device, and method for manufacturing film and organic electronic device - Google Patents
Substrate stretching unit, film forming device, and method for manufacturing film and organic electronic device Download PDFInfo
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
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Abstract
提供一種基板拉伸裝置,可予以施展因應了基板的鬆弛情況下的基板拉伸力,不易發生基板的鬆弛,可使遮罩與基板良好地重疊,使得可進行高精度之成膜。 A substrate stretching device is provided, which can exert the substrate stretching force in response to the slack of the substrate, and the slack of the substrate is less likely to occur. The mask and the substrate can be overlapped well, so that the film can be formed with high accuracy.
一種基板拉伸裝置,具備彼此對向之一對的夾持機構,採取如下構成:前述夾持機構,係具備複數個將基板從上下夾持的把持部,按前述把持部各者具備將供於把持前述基板用的按壓力及供於將前述基板朝外側拉伸用的拉伸力傳達至前述把持部的驅動手段。 A substrate stretching device includes a pair of clamping mechanisms facing each other, and has the following structure: the clamping mechanism includes a plurality of gripping portions for gripping a substrate from above and below, and each of the gripping portions includes A driving means for transmitting the pressing force for holding the substrate and the stretching force for drawing the substrate to the outside to the holding portion.
Description
本發明,係有關透過將基板拉伸從而防止基板的鬆弛的基板拉伸裝置。 The present invention relates to a substrate stretching device that prevents slack in a substrate by stretching the substrate.
基板的自重隨著基板的大型化而增加,故水平保持大型的基板時,有時基板由於基板的自重而朝下方撓曲,在基板發生鬆弛。例如於專利文獻1,係已記載一種裝置,其係透過將對向之基板的端部互相拉伸,從而防止發生基板的鬆弛。
The weight of the substrate increases as the size of the substrate increases. Therefore, when the large-sized substrate is held horizontally, the substrate may deflect downward due to the weight of the substrate, causing slack in the substrate. For example, in
[專利文獻1]韓國專利案第10-1456671號公報 [Patent Document 1] Korean Patent Publication No. 10-1456671
在記載於專利文獻1的基板夾持機構方面,係作成如下構造:使用將複數個被細分化的基板支撐片作了結合的平板,透過此平板而將基板朝兩側進行拉伸驅動。
The substrate clamping mechanism described in
另外,依支撐的基板的材質/形狀/面積等,基板的鬆弛程度有所不同。在如專利文獻1的構造,係依支撐的基板,在各支撐片間將基板夾壓之力發生不平衡,或基板在夾壓之力弱的支撐片間滑動,使得在拉伸基板時,在平板的長邊方向上的基板拉伸力發生不平衡。為此,存在無法消除基板的鬆弛或反而助長基板的鬆弛之虞。
In addition, depending on the material/shape/area of the supported substrate, the degree of slack in the substrate varies. According to the structure of
若基板的鬆弛大,無法進行均勻的成膜時,使用遮罩在基板上形成薄膜的情況下,係成為在成膜圖案發生大的偏差的原因。 If the slack of the substrate is large and uniform film formation cannot be performed, when a thin film is formed on the substrate using a mask, it may cause a large deviation in the film formation pattern.
此外,由於為針對結合全部的支撐片下的平板進行拉伸驅動的構造,故為了消除以夾壓的力為弱的支撐片下的基板的滑動而加強夾壓的力時,夾壓的力恐因位置變得過強而使基板破損。再者,需要拉伸力大的驅動裝置,故基板拉伸所需的耗能會增加,拉伸裝置恐大型化。 In addition, since it is a structure in which the flat plate under all the supporting pieces is combined and driven to stretch, the clamping force is strengthened when the clamping force is strengthened in order to eliminate the slippage of the substrate under the supporting pieces whose clamping force is weak. The substrate may be damaged because the position becomes too strong. Furthermore, a driving device with a large stretching force is required, so that the energy consumption required for substrate stretching increases, and the stretching device may become large.
本發明,係鑑於如上述之現狀而創作者,本發明相關的基板拉伸裝置,係具備彼此對向之一對的夾持機構的基板拉伸裝置,前述夾持機構具備複數個將基板從上下夾持的把持部,按前述把持部各者具備將供於把持前述基板用的按壓力及供於將前述基板朝外側拉伸用的拉伸力傳達至 前述把持部的驅動手段。 The present invention was created in view of the above-mentioned current situation. The substrate stretching device according to the present invention is a substrate stretching device provided with a pair of clamping mechanisms facing each other. The clamping mechanism includes a plurality of The gripping parts sandwiched up and down are each provided with a pressing force for gripping the substrate and a stretching force for stretching the substrate outwardly according to the gripping part The driving means of the aforementioned grip.
依本發明相關的基板拉伸裝置時,可予以施展因應了基板的鬆弛情況的基板按壓力及基板拉伸力,而將對向之基板的邊部間均等地拉伸,使得可有效地減低基板的鬆弛。並且,將本發明相關的基板拉伸裝置用於成膜裝置時,在基板不易發生鬆弛,使得可實現均勻的被膜的形成、使用遮罩下的高精度的成膜等。 According to the substrate stretching device of the present invention, the substrate pressing force and the substrate stretching force in response to the slack of the substrate can be applied, and the edges of the opposing substrates can be evenly stretched, which can effectively reduce Substrate relaxation. In addition, when the substrate stretching apparatus according to the present invention is used in a film forming apparatus, the substrate is less likely to be slack, so that uniform film formation, high-precision film formation using a mask, etc. can be achieved.
1:基板 1: substrate
2:邊部 2: side
3、4:把持片 3, 4: hold the film
5:框體 5: frame
6:升降板 6: Lifting board
7:連結體 7: Connection
8:底板 8: bottom plate
9:固定台 9: fixed table
10:電動缸 10: electric cylinder
11、12:板部 11, 12: Board Department
13:連結板部 13: Link board
14:夾持體 14: clamping body
15:可動體 15: movable body
16:水平板部 16: Horizontal Board Department
17:垂直板部 17: Vertical board
18:站立板部 18: Standing board
19:水平部 19: Level
20:邊部 20: Edge
21:基板支撐爪 21: base plate support claw
22:電動缸 22: electric cylinder
23:可動前端部 23: movable front end
24:升降棒 24: Lifting rod
25:防脫卡止部 25: Anti-drop lock
26:徑大部 26: Most of the diameter
27:彈簧 27: Spring
28:前端垂下部 28: front end hanging down
29:輥子 29: Roller
30:溝部 30: Ditch
31:承載部 31: Carrying Department
32:導引塊 32: Guide block
33:導軌 33: rail
34:拉伸力傳達體 34: Stretching force transmission body
35:轉動軸 35: Rotating shaft
36:軸承部 36: Bearing Department
37:輥子 37: Roller
38:電動缸 38: Electric cylinder
39:可動前端部 39: movable front end
40:承載體 40: Carrier
41:輥子 41: Roller
42:承載片 42: Carrier sheet
43:鬆緊螺旋扣 43: Elastic screw buckle
44:溝部 44: Ditch
45:導引棒 45: Guide rod
46:直線軸承 46: Linear bearing
60:顯示裝置 60: display device
61:顯示區域 61: display area
62:像素 62: pixels
62B:第1發光元件 62B: The first light-emitting element
62G:第2發光元件 62G: Second light-emitting element
62R:第3發光元件 62R: Third light-emitting element
63:基板 63: substrate
64:第1電極 64: 1st electrode
65:電洞傳輸層 65: hole transport layer
66B、66G、66R:發光層 66B, 66G, 66R: light emitting layer
67:電子傳輸層 67: electron transport layer
68:第2電極 68: 2nd electrode
69:絕緣層 69: Insulation
70:保護層 70: protective layer
80:真空槽 80: vacuum tank
81:基板 81: substrate
82:膜厚監控器 82: Film thickness monitor
83:膜厚計 83: Film thickness meter
84:加熱器用電源 84: Power supply for heater
85:蒸發源 85: evaporation source
86:遮罩 86: Mask
[圖1]本實施例的概略說明透視圖。 [Fig. 1] A schematic explanatory perspective view of this embodiment.
[圖2]本實施例的主要部分的放大說明透視圖。 [Fig. 2] An enlarged explanatory perspective view of a main part of this embodiment.
[圖3]本實施例的主要部分的放大說明透視圖。 [Fig. 3] An enlarged explanatory perspective view of a main part of this embodiment.
[圖4]本實施例的夾持機構的動作說明圖。 [Fig. 4] An operation explanatory view of the clamping mechanism of this embodiment.
[圖5]本實施例的夾持機構的動作說明圖。 [Fig. 5] An operation explanatory view of the clamping mechanism of this embodiment.
[圖6]本實施例的夾持機構的動作說明圖。 [Fig. 6] An operation explanatory view of the clamping mechanism of this embodiment.
[圖7]蒸鍍裝置的示意說明正面圖。 [Fig. 7] A schematic front view of a vapor deposition device.
[圖8](a)係運用本發明相關的真空蒸鍍裝置而製作的有機EL顯示裝置的透視圖,(b)係(a)的A-B線剖面圖。 [Fig. 8] (a) is a perspective view of an organic EL display device produced by using a vacuum evaporation device according to the present invention, and (b) is a cross-sectional view taken along line A-B of (a).
針對認為適合之本發明的實施形態,基於圖1示出本 發明的作用而簡單進行說明。 For an embodiment of the present invention deemed suitable, the present invention is shown based on FIG. 1 The effect of the invention will be described briefly.
透過夾持機構而分別把持基板1的對向之邊部2,同時在以不會發生鬆弛的方式朝外側拉伸之狀態下支撐基板1。
The opposing
此情況下,透過按夾持機構的沿著基板1的對向之邊部2而分別設置的複數個把持部各者而設的驅動手段,使得可按把持部各者設定供於把持基板用的按壓力或供於朝外側拉伸用的拉伸力,例如即使基板1的鬆弛在基板1的對向之邊部2之中央側與端部側不同,仍使得可將基板1的對向之邊部間以鬆弛消失的方式均等地拉伸。
In this case, the driving means provided for each of the plurality of gripping parts respectively provided along the opposing
此外,由於為按把持部各者設置驅動手段的構成,故不需要拉伸力大的驅動裝置,在驅動手段方面可採用小型者,使得耗能亦相應減少。 In addition, since the driving means is provided for each of the gripping parts, a driving device with a large tensile force is not required, and a smaller one can be used for the driving means, so that the energy consumption is reduced accordingly.
基於圖式說明有關本發明的具體實施例。 A specific embodiment of the present invention will be explained based on the drawings.
本實施例,係一種基板拉伸裝置,具備可把持基板1的對向之邊部2並將此對向之邊部2分別朝外側拉伸之一對的夾持機構。
This embodiment is a substrate stretching device, which is provided with a pair of clamping mechanisms that can hold the opposing
本實施例的夾持機構係分別沿著把持之前述基板1的邊部2而配置複數個從上下夾持基板1之把持部,按把持部各者具備對前述基板1的邊部2傳達供於把持基板1用的按壓力及供於將基板1朝外側拉伸用的拉伸力的驅動手段。
The gripping mechanism of this embodiment is to arrange a plurality of gripping portions for gripping the
亦即,本實施例,係採取透過各前述夾持機構而把持基板1的對向之一對的邊部2,並在把持的狀態下使對向之把持部彼此互相分離而將基板1朝外側拉伸。
That is, in this embodiment, a pair of opposing
本實施例,係如圖示於圖1,為透過將設置夾持機構的框體5垂設於升降板6的連結體7而以吊掛狀態而連結的構成,設有相對於底板8使升降板6升降的升降機構。此外,連結體7係設為將升降板6及框體5的四角部分別連結,於底板8係設有連結體7插穿的插穿孔。
This embodiment, as shown in FIG. 1, is configured to be connected in a suspended state by hanging the
升降板6,係在底板8之上方隔既定間隔而平行設置。在升降板6之上方,係設有4個腳部插穿升降板6的插穿孔而固定於底板8的固定台9。在升降機構方面,係採用基端側固定於固定台9且可動前端側固定於升降板6的內建伺服馬達、滾珠螺桿等的電動缸10。
The lifting
因此,在基板交換時等,使電動缸10的可動前端進退並相對於底板8使升降板6升降,使得可使吊掛狀態地連結於升降板6的框體5(夾持機構)升降。升降板6的升降係被透過固定台9的腳部而導引。
Therefore, at the time of substrate replacement, etc., the movable front end of the
在使基板保持靜止下進行成膜的真空成膜裝置設置本實施例的基板拉伸裝置的情況下,將底板8的下表面外周部固定於真空成膜室的頂面部,將比底板8下側的部分配置於真空成膜室內,並將底板8及比底板8上側的部分配置於真空成膜室外的大氣區域的即可。底板8兼當成膜裝置的腔室之上表面壁時,由於可削減成膜裝置所需的構材故為優選。在使基板移動而進行成膜的真空成膜裝置設置 本實施例的基板拉伸裝置的情況下,將示於圖1的基板拉伸裝置整體配置於裝置內,連結於裝置的基板搬送機構即可。此情況下,由於底板8變不需要故可省略。 In the case where the vacuum film forming apparatus that performs film formation while keeping the substrate still is provided with the substrate stretching apparatus of this embodiment, the lower surface outer peripheral portion of the bottom plate 8 is fixed to the top surface portion of the vacuum film forming chamber, which is lower than the bottom plate 8 The portion on the side may be arranged in the vacuum film forming chamber, and the bottom plate 8 and the portion above the bottom plate 8 may be arranged in the atmospheric area outside the vacuum film forming area. When the bottom plate 8 also serves as the upper surface wall of the chamber of the film forming apparatus, it is preferable because the structural material required for the film forming apparatus can be reduced. Installed in a vacuum film forming apparatus that moves a substrate to form a film In the case of the substrate stretching apparatus of this embodiment, the entire substrate stretching apparatus shown in FIG. 1 may be arranged in the apparatus and connected to the substrate transport mechanism of the apparatus. In this case, since the bottom plate 8 becomes unnecessary, it can be omitted.
前述夾持機構,係前述把持部被以一對的把持片3、4而構成,並以透過此一對的把持片3、4從上下按壓基板1並將所把持的基板1朝外側拉伸的方式構成前述驅動手段。
The clamping mechanism is configured such that the holding portion is formed by a pair of holding
把持部,係如圖示於圖2,採取如下構成:分別設有由對向之上下的板部11、12及將此等連結的連結板部13所成的剖視ㄈ字形的夾持體14、和可動自如地設於此夾持體14的可動體15。具體而言,採取設為使把持片3、4分別對向於夾持體14的下板部12的前端與可動體15的前端的構成。
The gripping part, as shown in FIG. 2, adopts the following structure: each is provided with a cross-sectional, zigzag-shaped clamping body formed by opposed upper and
將此夾持體14,在沿著所把持的基板1的邊部2的框體5的一對的第一邊部,分別配置複數個(本實施例係8個)。以夾持體14把持基板的長邊時,比起把持短邊的情況,可減小為了基板的鬆弛減低在各把持部所需的拉伸力故為優選。此外,採取如下構成:在沿著未被把持的基板1的邊部20的框體5的一對的第二邊部,係設置基板支撐爪21。具體而言,框體5的第一邊部係採取在水平板部16的兩端使垂直板部17垂下的構成,而第二邊部係以連結於第一邊部的垂直板部17的站立板部18與將此站立板部18的下端彼此連結的水平部19而構成。基板支撐爪21係朝此水平部19的內側而突設。因此,從第二邊
部側的基板1的搬入被良好地進行。
A plurality of the holding
以下,詳述如何在前述各把持部(一對的把持片3、4)對於基板1的邊部2傳達供於把持基板1用的按壓力及供於將基板1朝外側拉伸用的拉伸力。
Hereinafter, it will be described in detail how to transmit the pressing force for holding the
在夾持體14之上板部11,係設有上端與電動缸22的可動前端部23卡止且下端與可動體15卡止的升降棒24插穿的插穿孔。在此升降棒24的下端係設有與可動體15的下表面卡止的防脫卡止部25,在可動體15之上表面與設於升降棒24之中間部的徑大部26的下表面之間設有彈簧27。另外,電動缸22的基端側係固定於升降板6。
The
此外,在上板部11與下板部12之間,係設有與連結板部13平行的左右一對的導引棒45。在可動體15係形成有此導引棒45分別插穿的插穿孔。圖中,符號46係直線軸承。
In addition, between the
因此,電動缸22的可動前端部23所致的按壓力係經由彈簧27而傳達至可動體15,進行透過可動體15的把持片4及夾持體14的把持片3所為的基板1的把持(圖5參照)。依如此之構成時,由於將電動缸22分別設於各夾持體14,使得可按把持部各者控制按壓力,使得可因應基板1的鬆弛而良好地把持基板1。再者,透過將彈簧27酌情交換為彈性係數不同的彈簧,使得可調整從電動缸22傳至把持部的力,亦即可調整把持力。
Therefore, the pressing force caused by the movable
此外,於本實施例中,係採取裝卸自如地將合成樹脂製的把持片4設於可動體15的前端垂下部28的下端的構
成。合成樹脂方面係可採用矽、氯丁橡膠、丁腈橡膠等。因此,把持片4磨耗/劣化時可酌情交換。另外,於本實施例中雖下板部12的前端的把持片3係與下板部12一體地設置的構成,惟亦可採取在下板部12的前端裝卸自如地設置合成樹脂製的把持片3的構成。
In addition, in the present embodiment, a structure in which a
此外,雖未圖示,惟亦可變更把持片4的厚度,或使其他構材介於可動體15的前端垂下部28的下端與把持片4之間從而調整把持片4與把持片3之間隔,而調整各把持片的把持力。此外,亦可使彈簧等的彈性構材介於可動體15的前端垂下部28的下端與把持片4之間,而透過酌情設定此彈性構材的彈性(彈簧時彈性係數),從而調整各把持片的把持力。
In addition, although not shown, the thickness of the
此外,升降棒24的前端係形成為正面視T字狀,在此T字狀的前端的兩端部分別設有輥子29。此升降棒24的前端,係配置於固定於電動缸22的可動前端部23的前方被開放的剖視ㄈ字形且設有避開升降棒24之中間部分的溝部30的承載部31內。承載部31之上下板部之間隔係設定為比輥子29的直徑若干寬的間隔。卡止於承載部31的升降棒24的前端,係隔著承載部31的內面與輥子29而接觸,平滑地進行傳達後述的拉伸力時的夾持體14的水平滑動。
In addition, the front end of the lifting
傳達拉伸力時的夾持體14的水平移動,係可透過設於夾持體14之上板部11與框體5的水平板部16之間的線性導軌而實現。具體而言,再夾持體14之上板部11之
上表面,係設有設於框體5的水平板部16的下表面的導引塊32嵌合的導軌33。因此,夾持體14(把持部)係相對於框體5而水平滑動。
The horizontal movement of the clamping
於圖3,示出針對把持部從外側視看下的構成。在框體5的水平板部16的前述塊體32的外側,係設有承載設於傳達拉伸力的剖視略L字狀的拉伸力傳達體34的彎曲部的轉動軸35的軸承部36。拉伸力傳達體34,係構成為能以設於彎曲部的轉動軸35為中心而轉動。拉伸力傳達體34的前端係形成為正面視T字狀,在此T字狀的前端的兩端部分別設有輥子37。拉伸力傳達體34的前端,係被固定於電動缸38的可動前端部39的前方開放的剖視ㄈ字形的承載體40承載。承載體40之上下板部之間隔係設定為比輥子37的直徑若干寬的間隔。另外,電動缸38的基端側係固定於升降板6。
FIG. 3 shows the structure of the grip portion viewed from the outside. On the outer side of the
此外,拉伸力傳達體34的基端亦同樣形成為正面視T字狀,在此T字狀的基端的兩端部分別設有輥子41。拉伸力傳達體34的基端,係配置於設於夾持體14的連結板部13的背面的由水平片與垂直片所成的剖視L字狀的承載片42與連結板部13的背面之間。連結板部13的背面與承載片42的垂直片之間隔係設定為比輥子41的直徑若干寬的間隔。
In addition, the base end of the tensile
因此,驅動電動缸38的可動前端部39而使拉伸力傳達體34的前端卡止的承載體40上升移動,使得拉伸力傳達體34的基端以設於彎曲部的轉動軸35為中心朝外側轉
動,拉伸力傳達體34的基端將承載片42的垂直片壓往外側,使得夾持體14(把持部)係移動至外側,於基板1傳達拉伸力(圖6參照)。
Therefore, the movable
在此拉伸力傳達體34的彎曲部與基端之間,係設有鬆緊螺旋扣43,使此鬆緊螺旋扣43旋轉而調整彎曲部與基端之間的距離,使得可調整從電動缸38傳至把持部的力,亦即可調整拉伸力(增加彎曲部與基端部之間的距離使得可增加拉伸力)。具體而言,採取將從彎曲部朝向基端側而延伸的螺絲部與從基端朝向彎曲部而延伸的反向螺絲部透過鬆緊螺旋扣43而螺合連結的構成。
Between the bending portion of the tensile
此外,前述夾持機構,係採取以下構成:具備可將按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者按驅動手段各者個別調整的個別調整手段;或者,可將按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者,按驅動手段各者個別控制的個別控制手段。在本實施例,係彈簧27相當於調整按壓力的個別調整手段,鬆緊螺旋扣43相當於調整拉伸力的個別調整手段。並且,電動缸22相當於調整按壓力的個別控制手段,電動缸38相當於調整拉伸力的個別控制手段。另外,雖透過設置個別調整手段,使得可最佳化供於進一步減低基板的鬆弛用的按壓力與拉伸力,惟未必需要設置按壓手段與拉伸力傳達手段雙方,亦可省略任一方或雙方。
In addition, the above-mentioned clamping mechanism is configured to include an individual adjustment capable of individually adjusting the pressing force, the stretching force, or both of the driving means provided by each of the aforementioned gripping parts according to each of the driving means Means; Alternatively, the individual control means may be individually controlled by each of the driving means according to the respective pressing force, tensile force, or both of the driving means provided by each of the aforementioned gripping parts. In the present embodiment, the
於本實施例中,係如前所述,具備可個別調整按前述 把持部各者具備的驅動手段的拉伸力的個別調整手段及可個別控制按前述把持部各者具備的驅動手段的按壓力的個別控制手段。 In this embodiment, as described above, with individual adjustments as described above Individual adjustment means for the stretching force of the driving means provided by each gripping unit and individual control means capable of individually controlling the pressing force according to the driving means provided by each gripping section.
依本實施例相關的基板拉伸裝置時,可透過前述個別調整手段或前述個別控制手段,依在把持的基板的邊部產生的鬆弛的程度,而個別調整或個別控制按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者。 According to the substrate stretching device related to this embodiment, the individual adjustment means or the individual control means can be used to individually adjust or individually control each of the aforementioned holding parts according to the degree of slack generated at the edge of the substrate to be held Separate pressing force, tensile force, or both of the driving means provided.
例如,可透過前述個別調整手段或前述個別控制手段,使按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者,在把持的基板的邊部之中央區域比在基板的邊部的端部區域高。 For example, the individual adjustment means or the individual control means can be used to make the pressing force, the tensile force, or both of the driving means provided by each of the gripping parts at the center of the edge of the gripped substrate The area is higher than the end area on the side of the substrate.
此外,於本實施例中,承載體40係為了可統一操作一側的夾持機構的各夾持體14的各拉伸力傳達體34,而採取使各拉伸力傳達體34的前端分別卡止於長形的一個承載體40的構成(圖3參照)。亦即,採取使各拉伸傳達體34的前端以既定間隔卡止於前方開放的剖視ㄈ字形的長狀的一個承載體40的構成,採取可透過此一的承載體40的升降而將一側的夾持機構的全部的把持部進行拉伸的構成。於本實施例中,係採取以下構成:作成在承載體40的兩端部分別固定電動缸38的可動前端部39,而利用2個電動缸38統一將一側的夾持機構的全部的把持部進行拉伸。
In addition, in this embodiment, the
此外,在承載體40之上板部,係設有避開拉伸力傳
達體34之中途部的溝部44。
In addition, a plate portion above the
另外,本實施例係雖構成為如上述,惟亦可採取以下構成:如同按壓力,在拉伸力方面亦於各夾持體分別設置各一個承載體40,按此承載體40各者設置電動缸38,以分別設置的電動缸38個別控制各夾持體的把持部的拉伸力。
In addition, although this embodiment is configured as described above, the following configuration may also be adopted: as the pressing force, one
此外,各電動缸22、38的可動前端部23、39,係插穿底板8的插穿孔而連結於承載部31及承載體40。將基板拉伸裝置設置於真空裝置內的情況下,係採取將此插穿孔以設於底板8與升降板6之間的伸縮管等而包圍等而保持裝置內的真空的構成即可。
In addition, the movable
使成膜裝置內為真空狀態而成膜時,有時由於作用於真空成膜室的頂面部的負壓使得該頂面部朝內側變形。底板8兼當真空裝置室的頂面部,或使底板8接於頂面部而固定時,頂板部的變形會對基板拉伸裝置造成影響而使基板的鬆弛增大。所以,使底板8的剛性比真空成膜室的頂面部高,或者,設置成以伸縮管、密封環等將底板8的下表面外周部與真空成膜室的頂面部之間密封即可。依如此之構成時,即使由於作用於真空成膜室的頂面部的負壓使得該頂面部朝內側變形,亦可抑制對於底板8的影響,可減低在成膜中頂面部朝內側變形的情況下的基板鬆弛,而達到成膜精度的提升。 When forming a film in a vacuum state in the film forming apparatus, the top surface portion may be deformed inward due to the negative pressure acting on the top surface portion of the vacuum film forming chamber. The bottom plate 8 also serves as the top surface portion of the vacuum device chamber, or when the bottom plate 8 is fixed to the top surface portion, the deformation of the top plate portion will affect the substrate stretching device and increase the slack of the substrate. Therefore, the rigidity of the bottom plate 8 may be higher than that of the top surface of the vacuum deposition chamber, or it may be provided to seal the outer peripheral portion of the lower surface of the bottom plate 8 with the top surface of the vacuum deposition chamber with a telescopic tube, a seal ring, or the like. With this structure, even if the top surface portion is deformed inward due to the negative pressure acting on the top surface portion of the vacuum deposition chamber, the influence on the bottom plate 8 can be suppressed, and the deformation of the top surface portion toward the inside during film formation can be reduced The substrate underneath is relaxed, and the accuracy of film formation is improved.
此外,前述夾持機構,係可採取具備可將按前述把持部各者具備的驅動手段的前述個別控制手段彼此予以聯合 而控制的聯合控制手段的構成。在聯合控制手段方面,係可採用控制各電動缸的可動前端部的進退量、時機等的控制裝置等。 In addition, the clamping mechanism may be provided with the individual control means provided with the driving means provided for each of the gripping parts. The structure of the joint control means of control. In terms of the joint control means, a control device that controls the advance and retreat amount, timing, etc. of the movable front end of each electric cylinder can be used.
例如,前述聯合控制手段,係可構成為依在把持的基板的邊部產生的鬆弛的程度,而將按前述把持部各者具備的驅動手段的個別控制手段彼此予以聯合而控制。 For example, the above-mentioned joint control means may be configured to control each individual control means according to the driving means provided by each of the gripping units in conjunction with each other according to the degree of slack generated at the edge of the substrate to be gripped.
此外,前述聯合控制手段,係可依使按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者在把持的基板的邊部之中央區域比在基板的邊部的端部區域高的設定,而控制按壓手段與拉伸力傳達手段。 In addition, the above-mentioned joint control means can make the pressing force or the tensile force of the driving means provided by each of the holding parts, or both of them in the central area of the edge of the substrate held in The height of the end region of the side is set, and the pressing means and the tensile force transmitting means are controlled.
前述把持的基板的鬆弛的傾向及程度,係因使用的基板的材質/形狀/面積/重量/縱橫比等的規格而異。所以,依規格將基板群組化,按各基板群各者預先測定基板鬆弛傾向。並且,基於此基板鬆弛傾向而決定在各把持部的基板的鬆弛程度,依所決定的基板的鬆弛程度而將按前述把持部各者具備的驅動手段的個別控制手段彼此聯合控制亦為優選。 The tendency and degree of slack in the substrate to be gripped above vary depending on specifications such as material/shape/area/weight/aspect ratio of the substrate to be used. Therefore, the substrates are grouped according to specifications, and the tendency of substrate slack is measured in advance for each substrate group. In addition, it is also preferable to determine the degree of slack of the substrate in each gripping section based on this tendency of slack of the substrate, and it is also preferable to jointly control the individual control means according to the driving means of each gripping section according to the determined degree of slack of the substrate.
此外,亦可採取透過鬆弛檢測手段而檢測前述把持的基板的鬆弛的傾向及程度的構成。例如,可利用把持基板而透過影像處理或雷射位移計等檢測鬆弛的狀態的鬆弛檢測裝置等。使用此鬆弛檢測手段時,以基板拉伸裝置把持基板時,變得亦可確認基板的鬆弛是否已減低至容許範圍。 In addition, it is also possible to adopt a configuration for detecting the tendency and degree of slack of the substrate held by the slack detection means. For example, a slack detection device that grasps the substrate and detects the slack state through image processing, a laser displacement meter, or the like can be used. When using this slack detection means, when the substrate is held by the substrate stretching device, it can be confirmed whether the slack of the substrate has been reduced to an allowable range.
此外,前述個別調整手段或前述個別控制手段,針對 以按前述把持部各者具備的分別的驅動手段所為的將基板進行拉伸的時機,分別按驅動手段各者個別調整或個別控制亦為優選。 In addition, the aforementioned individual adjustment means or the aforementioned individual control means It is also preferable to individually adjust or individually control the driving means according to the timing of stretching the substrate according to the respective driving means provided for each of the aforementioned gripping parts.
具體而言,使透過驅動手段所為的拉伸基板的時機,在把持的基板的邊部之中央區域比在把持的邊部的端部區域前面,或亦可作成進一步使透過驅動手段所為的拉伸基板的時機,隨著朝向把持的基板的邊部的端部區域而逐漸遲延。透過如此的控制,使得可進一步抑制基板的鬆弛。 Specifically, the timing of stretching the substrate by the driving means may be made in front of the central region of the edge of the substrate to be grasped than by the end area of the grasping edge, or it may be made to further pull the substrate by the driving means. The timing of extending the substrate gradually delays toward the end region of the edge of the substrate to be grasped. Through such control, the slack of the substrate can be further suppressed.
例如,亦可採取以下構成:按各夾持體分別設置各一個承載體,按此承載體各者設置電動缸,並以各電動缸個別控制各夾持體的把持部的拉伸力;和構成為控制電動缸的驅動時機而從中央側朝向端部側依序操作拉伸力傳達體。 For example, the following configuration may also be adopted: one carrier body is provided for each clamping body, an electric cylinder is provided for each carrier body, and the stretching force of the grip portion of each clamping body is individually controlled by each electric cylinder; and It is configured to control the driving timing of the electric cylinder and sequentially operate the tensile force transmitting body from the center side toward the end side.
此外在個別調整手段方面係例如,亦可採取如下構成:設置將示於圖4之夾持體14沿著導軌33朝內側(基板側)按壓的彈簧等(未圖示),作成可按夾持體各者個別調整承載片42與連結板部13的背面之間隔,採取在輥子41接觸於承載片42的時間點產生對於基板的拉伸力的構成,從而個別調整拉伸基板的時機。
In addition, for individual adjustment means, for example, the following configuration may be adopted: a spring (not shown) that presses the
另外,本實施例,係雖採用透過將把持的基板的對向之邊部進行把持的各夾持機構而分別將基板朝外側拉伸的構成,惟亦可採取如下構成:前述個別控制手段,係將設於對向之邊部之中任一側的前述夾持機構的驅動手段,分別控制成僅予以產生按壓力。 In addition, although the present embodiment adopts a structure in which the substrate is stretched outward by the clamping mechanisms that hold the opposed edges of the substrate, the following configuration may be adopted: The driving means of the clamping mechanism provided on either side of the opposing side portions are controlled so that only the pressing force is generated.
圖7,係將本發明相關的基板拉伸裝置應用於使基板保持靜止下進行成膜的真空蒸鍍裝置之例。實際上雖應用與圖1同樣的基板拉伸裝置,惟在圖7係簡略地示出所需最低限度的構材。此真空蒸鍍裝置,係為了在保持減壓環境的真空槽80內使薄膜形成於基板81,而使射出成膜材料的蒸發源85配設於與基板81對向之位置,並設有監控從蒸發源85所放出的蒸發粒子的蒸發率的膜厚監控器82、設於真空槽80外的將所監控的蒸發粒子的量換算成膜厚的膜厚計83、和為了以所換算的膜厚成為期望的膜厚的方式控制成膜材料的蒸發率而加熱蒸發源85的加熱器用電源84。此外,具有使蒸發源85移動於相對於紙面為垂直的方向上的移動機構,並設有使基板81與蒸發源85相對移動的相對移動機構。一面使蒸發源85相對於基板81移動一面進行成膜,使得可在整個基板整面形成均勻的膜厚的蒸鍍膜。再者,具有支撐遮罩86的遮罩支撐構材,可使用未圖示的對準機構,而將基板81與遮罩86的相對位置對準而進行成膜。
FIG. 7 is an example of applying the substrate stretching apparatus according to the present invention to a vacuum evaporation apparatus that performs film formation while keeping the substrate still. In practice, although the same substrate stretching apparatus as that in FIG. 1 is used, FIG. 7 shows the minimum required structural members briefly. This vacuum evaporation apparatus is to form a thin film on a
另外,本發明,係不限於本實施例,可酌情設計各構成要件的具體構成。 In addition, the present invention is not limited to this embodiment, and the specific structure of each constituent element can be designed as appropriate.
接著,說明有關使用具備本發明相關的基板拉伸裝置的真空蒸鍍裝置,而作為有機電子裝置之例製造有機EL顯示裝置的實施例。 Next, an example of manufacturing an organic EL display device as an example of an organic electronic device using a vacuum evaporation device provided with a substrate stretching device according to the present invention will be described.
首先,說明有關要製造的有機EL顯示裝置。圖8(a)係有機EL顯示裝置60的整體圖,圖8(b)係顯示
1像素的剖面構造。
First, the organic EL display device to be manufactured will be explained. 8(a) is an overall view of an organic
如示於圖8(a),在顯示裝置60的顯示區域61,係矩陣狀地配置複數個像素62,該像素62係具備複數個發光元件。發光元件各者,係具有具備被一對的電極所夾的有機層的構造,細節於後進行說明。另外,此處所謂的像素,係指可在顯示區域61中顯示期望的顏色的最小單位。本實施例相關的顯示裝置的情況下,透過展現彼此不同的發光的第1發光元件62R、第2發光元件62G、第3發光元件62B的組合從而構成像素62。像素62,係多以紅色發光元件、綠色發光元件、和藍色發光元件的組合而構成,惟黃色發光元件、青藍發光元件、白色發光元件的組合亦可,只要至少1色以上即不特別限制。
As shown in FIG. 8( a ), in the
圖8(b),係在圖8(a)的A-B線的部分剖面示意圖。像素62,係具有一有機EL元件,該有機EL元件係在基板63上具備第1電極(陽極)64、電洞傳輸層65、發光層66R、66G、66B中的任一者、電子傳輸層67、和第2電極(陰極)68。此等之中,電洞傳輸層65、發光層66R、66G、66B、電子傳輸層67相當於有機層。此外,在本實施形態,發光層66R係發出紅色的有機EL層,發光層66G係發出綠色的有機EL層,發光層66B係發出藍色的有機EL層。發光層66R、66G、66B,係分別形成為對應於發出紅色、綠色、藍色的發光元件(有時亦記述為有機EL元件)的圖案。此外,第1電極64,係按發光元件各者分離而形成。電洞傳輸層65、電子傳輸層
67、第2電極68,係可與複數個發光元件62共通而形成,亦可按發光元件各者而形成。另外,為了防止第1電極64與第2電極68因異物而短路,在第1電極64間設有絕緣層69。再者,有機EL層會因水分、氧等而劣化,故設有供於從水分、氧等保護有機EL元件用的保護層70。
FIG. 8(b) is a schematic cross-sectional view taken along line A-B of FIG. 8(a). The
要將有機EL層以發光元件單位而形成,係採用隔著遮罩而成膜的方法。近年來,顯示裝置的高精細化進展,在有機EL層的形成方面係採用開口的寬度為數十μm的遮罩。採用了如此的遮罩的成膜的情況下,遮罩在成膜中從蒸發源受熱而熱變形時遮罩與基板的位置會偏差,形成於基板上的薄膜的圖案會從期望的位置偏離而形成。所以,在此等有機EL層的成膜方面係適合採用本發明相關的真空蒸鍍裝置。 To form the organic EL layer in units of light-emitting elements, a method of forming a film through a mask is used. In recent years, with the advancement of high-definition display devices, a mask with an opening width of several tens of μm has been used in the formation of an organic EL layer. In the case of film formation using such a mask, the position of the mask and the substrate may deviate when the mask is heated from the evaporation source during the film formation and thermally deformed, and the pattern of the thin film formed on the substrate may deviate from the desired position While forming. Therefore, in terms of film formation of these organic EL layers, it is suitable to use the vacuum deposition apparatus related to the present invention.
接著,具體說明有關有機EL顯示裝置的製造方法之例。 Next, an example of a method for manufacturing an organic EL display device will be specifically described.
首先,準備形成有供於驅動有機EL顯示裝置用的電路(未圖示)及第1電極64的基板63。
First, the
在形成有第1電極64的基板63之上以旋轉塗佈形成丙烯酸樹脂,將丙烯酸樹脂透過光刻法從而圖案化為在形成有第1電極64的部分形成有開口並形成絕緣層69。此開口部相當於發光元件實際上發光的發光區域。
An acrylic resin is formed by spin coating on the
將絕緣層69被圖案化的基板63搬入真空蒸鍍裝置,以本發明相關的基板拉伸裝置將基板進行保持,使電洞傳
輸層65成膜為在顯示區域的第1電極64之上共通的層。透過真空蒸鍍而形成電洞傳輸層65。實際上電洞傳輸層65係形成為比顯示區域61大的尺寸,故不需要高精細的遮罩。
The
接著,利用蒸鍍遮罩而在配置發出紅色的元件的部分,形成發出紅色的發光層66R。首先,將形成至電洞傳輸層65為止的基板63搬入圖7的真空蒸鍍裝置,以基板拉伸裝置進行保持。此時,為了使得基板的鬆弛落入容許範圍,使用個別控制手段、個別調整手段等而調整各把持部的按壓力與拉伸力。基板的鬆弛落入容許範圍時,進行與遮罩86的位置對準(alignment),其中該遮罩86係具有與形成第1發光元件62R的區域對應的開口。基板的鬆弛的容許範圍,係可依成膜所要求的精度而設定。
Next, a red light-emitting
在蒸發源85係收容是發光層66R的材料的有機EL材料,在為了使有機材料蒸發而附著於基板上的準備方面,進行預熱。預熱,係為了使收容於蒸發源85的成膜材料的熔化狀態穩定化,以與成膜溫度同等的溫度而預先加熱蒸發源85。在從利用膜厚監控器82而取得的成膜速度(蒸鍍率)的時間變化確認成膜材料的熔化狀態已穩定後再開始發光層66R的成膜時,變得可進行精度高的膜厚控制。
The
依本例時,由於可針對整個基板整體減低基板63的鬆弛,故可使遮罩與基板良好地重疊,使得可進行高精度的成膜。
According to this example, since the slack of the
如同發光層66R的成膜,使用具有與形成第2發光元件62G的區域對應的開口的遮罩而形成發出綠色的發光層66G,使用具有與形成第3發光元件62B的區域對應的開口的遮罩,形成發出藍色的發光層66B。
Like the film formation of the light-emitting
發光層66G、66B的成膜結束後,在顯示區域61整體形成電子傳輸層65。電子傳輸層65,係形成為第1至第3發光層共通的層。
After the film formation of the light-emitting
將形成有至電子傳輸層65為止的基板移動至濺鍍裝置,形成第2電極68,之後移動至電漿CVD裝置而形成保護層70,從而完成有機EL顯示裝置60。
The substrate up to the
從將絕緣層69被圖案化的基板63搬入真空蒸鍍裝置起直到保護層70的成膜結束為止若曝露於包含水分、氧等的環境,則存在由有機EL材料所成的發光層因水分、氧等而劣化之虞。因此,於本例中,成膜裝置間的基板的搬入搬出,係在真空環境或惰性氣體環境下進行。
From the time when the
如此而獲得的有機EL顯示裝置,係按發光元件各者精度佳地形成發光層。因此,使用上述製造方法時,可抑制因發光層的位置偏差而起的有機EL顯示裝置的不良的發生。 In the organic EL display device thus obtained, the light-emitting layer is accurately formed for each light-emitting element. Therefore, when the above manufacturing method is used, it is possible to suppress the occurrence of defects in the organic EL display device due to the positional deviation of the light emitting layer.
另外,於此,係論述有關使用遮罩而進行蒸鍍的有機EL顯示裝置的製造方法,惟本案發明相關的基板拉伸裝置的應用係不限於此。無論使用或不使用遮罩,在將基板的被處理面支撐於相對於重力方向而交叉的方向而進行成膜的情況下的成膜裝置方面,皆可應用本發明的基板拉伸 裝置。 In addition, here, a method for manufacturing an organic EL display device that performs vapor deposition using a mask is discussed, but the application of the substrate stretching device related to the present invention is not limited to this. Regardless of whether or not a mask is used, the substrate stretching of the present invention can be applied to a film forming apparatus in a case where a film is formed by supporting a surface to be processed in a direction crossing with respect to the gravity direction Device.
1‧‧‧基板 1‧‧‧ substrate
2‧‧‧邊部 2‧‧‧Border
5‧‧‧框體 5‧‧‧Frame
6‧‧‧升降板 6‧‧‧Lifting board
7‧‧‧連結體 7‧‧‧Connect
8‧‧‧底板 8‧‧‧Bottom plate
9‧‧‧固定台 9‧‧‧Fixed
10‧‧‧電動缸 10‧‧‧Electric cylinder
14‧‧‧夾持體 14‧‧‧Clamping body
16‧‧‧水平板部 16‧‧‧Horizontal Board Department
17‧‧‧垂直板部 17‧‧‧Vertical Board Department
18‧‧‧站立板部 18‧‧‧ Standing board
19‧‧‧水平部 19‧‧‧ Level
20‧‧‧邊部 20‧‧‧Border
21‧‧‧基板支撐爪 21‧‧‧Base support claw
22‧‧‧電動缸 22‧‧‧Electric cylinder
23‧‧‧可動前端部 23‧‧‧Moveable front end
38‧‧‧電動缸 38‧‧‧Electric cylinder
39‧‧‧可動前端部 39‧‧‧Moveable front end
40‧‧‧承載體 40‧‧‧Carrier
Claims (22)
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CN106967957B (en) | 2020-11-13 |
CN106967957A (en) | 2017-07-21 |
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TW201733182A (en) | 2017-09-16 |
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