TWI691111B - Substrate stretching unit, film forming device, and method for manufacturing film and organic electronic device - Google Patents

Substrate stretching unit, film forming device, and method for manufacturing film and organic electronic device Download PDF

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TWI691111B
TWI691111B TW105130641A TW105130641A TWI691111B TW I691111 B TWI691111 B TW I691111B TW 105130641 A TW105130641 A TW 105130641A TW 105130641 A TW105130641 A TW 105130641A TW I691111 B TWI691111 B TW I691111B
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substrate
stretching
driving means
patent application
gripping
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TW105130641A
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TW201733182A (en
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鈴木健太郎
佐藤智之
塩入信朗
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日商佳能特機股份有限公司
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • C23C14/543Controlling the film thickness or evaporation rate using measurement on the vapor source
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Metallurgy (AREA)
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  • Organic Chemistry (AREA)
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  • Computer Hardware Design (AREA)
  • Electroluminescent Light Sources (AREA)
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  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)

Abstract

提供一種基板拉伸裝置,可予以施展因應了基板的鬆弛情況下的基板拉伸力,不易發生基板的鬆弛,可使遮罩與基板良好地重疊,使得可進行高精度之成膜。 A substrate stretching device is provided, which can exert the substrate stretching force in response to the slack of the substrate, and the slack of the substrate is less likely to occur. The mask and the substrate can be overlapped well, so that the film can be formed with high accuracy.

一種基板拉伸裝置,具備彼此對向之一對的夾持機構,採取如下構成:前述夾持機構,係具備複數個將基板從上下夾持的把持部,按前述把持部各者具備將供於把持前述基板用的按壓力及供於將前述基板朝外側拉伸用的拉伸力傳達至前述把持部的驅動手段。 A substrate stretching device includes a pair of clamping mechanisms facing each other, and has the following structure: the clamping mechanism includes a plurality of gripping portions for gripping a substrate from above and below, and each of the gripping portions includes A driving means for transmitting the pressing force for holding the substrate and the stretching force for drawing the substrate to the outside to the holding portion.

Description

基板拉伸裝置、成膜裝置、膜的製造方法及有機電子裝置的製造方法 Substrate stretching device, film forming device, film manufacturing method, and organic electronic device manufacturing method

本發明,係有關透過將基板拉伸從而防止基板的鬆弛的基板拉伸裝置。 The present invention relates to a substrate stretching device that prevents slack in a substrate by stretching the substrate.

基板的自重隨著基板的大型化而增加,故水平保持大型的基板時,有時基板由於基板的自重而朝下方撓曲,在基板發生鬆弛。例如於專利文獻1,係已記載一種裝置,其係透過將對向之基板的端部互相拉伸,從而防止發生基板的鬆弛。 The weight of the substrate increases as the size of the substrate increases. Therefore, when the large-sized substrate is held horizontally, the substrate may deflect downward due to the weight of the substrate, causing slack in the substrate. For example, in Patent Document 1, a device has been described which prevents the occurrence of slack in the substrate by stretching the ends of the opposing substrates against each other.

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]韓國專利案第10-1456671號公報 [Patent Document 1] Korean Patent Publication No. 10-1456671

在記載於專利文獻1的基板夾持機構方面,係作成如下構造:使用將複數個被細分化的基板支撐片作了結合的平板,透過此平板而將基板朝兩側進行拉伸驅動。 The substrate clamping mechanism described in Patent Document 1 is configured to use a flat plate in which a plurality of subdivided substrate support pieces are joined, and the substrate is stretched and driven to both sides through the flat plate.

另外,依支撐的基板的材質/形狀/面積等,基板的鬆弛程度有所不同。在如專利文獻1的構造,係依支撐的基板,在各支撐片間將基板夾壓之力發生不平衡,或基板在夾壓之力弱的支撐片間滑動,使得在拉伸基板時,在平板的長邊方向上的基板拉伸力發生不平衡。為此,存在無法消除基板的鬆弛或反而助長基板的鬆弛之虞。 In addition, depending on the material/shape/area of the supported substrate, the degree of slack in the substrate varies. According to the structure of Patent Document 1, depending on the supported substrate, the force of clamping the substrate between the support pieces is unbalanced, or the substrate slides between the support pieces with weak clamping force, so that when the substrate is stretched, Unbalance occurs in the tensile force of the substrate in the longitudinal direction of the flat plate. For this reason, there is a possibility that the slack of the substrate cannot be eliminated or the slack of the substrate is promoted instead.

若基板的鬆弛大,無法進行均勻的成膜時,使用遮罩在基板上形成薄膜的情況下,係成為在成膜圖案發生大的偏差的原因。 If the slack of the substrate is large and uniform film formation cannot be performed, when a thin film is formed on the substrate using a mask, it may cause a large deviation in the film formation pattern.

此外,由於為針對結合全部的支撐片下的平板進行拉伸驅動的構造,故為了消除以夾壓的力為弱的支撐片下的基板的滑動而加強夾壓的力時,夾壓的力恐因位置變得過強而使基板破損。再者,需要拉伸力大的驅動裝置,故基板拉伸所需的耗能會增加,拉伸裝置恐大型化。 In addition, since it is a structure in which the flat plate under all the supporting pieces is combined and driven to stretch, the clamping force is strengthened when the clamping force is strengthened in order to eliminate the slippage of the substrate under the supporting pieces whose clamping force is weak. The substrate may be damaged because the position becomes too strong. Furthermore, a driving device with a large stretching force is required, so that the energy consumption required for substrate stretching increases, and the stretching device may become large.

本發明,係鑑於如上述之現狀而創作者,本發明相關的基板拉伸裝置,係具備彼此對向之一對的夾持機構的基板拉伸裝置,前述夾持機構具備複數個將基板從上下夾持的把持部,按前述把持部各者具備將供於把持前述基板用的按壓力及供於將前述基板朝外側拉伸用的拉伸力傳達至 前述把持部的驅動手段。 The present invention was created in view of the above-mentioned current situation. The substrate stretching device according to the present invention is a substrate stretching device provided with a pair of clamping mechanisms facing each other. The clamping mechanism includes a plurality of The gripping parts sandwiched up and down are each provided with a pressing force for gripping the substrate and a stretching force for stretching the substrate outwardly according to the gripping part The driving means of the aforementioned grip.

依本發明相關的基板拉伸裝置時,可予以施展因應了基板的鬆弛情況的基板按壓力及基板拉伸力,而將對向之基板的邊部間均等地拉伸,使得可有效地減低基板的鬆弛。並且,將本發明相關的基板拉伸裝置用於成膜裝置時,在基板不易發生鬆弛,使得可實現均勻的被膜的形成、使用遮罩下的高精度的成膜等。 According to the substrate stretching device of the present invention, the substrate pressing force and the substrate stretching force in response to the slack of the substrate can be applied, and the edges of the opposing substrates can be evenly stretched, which can effectively reduce Substrate relaxation. In addition, when the substrate stretching apparatus according to the present invention is used in a film forming apparatus, the substrate is less likely to be slack, so that uniform film formation, high-precision film formation using a mask, etc. can be achieved.

1:基板 1: substrate

2:邊部 2: side

3、4:把持片 3, 4: hold the film

5:框體 5: frame

6:升降板 6: Lifting board

7:連結體 7: Connection

8:底板 8: bottom plate

9:固定台 9: fixed table

10:電動缸 10: electric cylinder

11、12:板部 11, 12: Board Department

13:連結板部 13: Link board

14:夾持體 14: clamping body

15:可動體 15: movable body

16:水平板部 16: Horizontal Board Department

17:垂直板部 17: Vertical board

18:站立板部 18: Standing board

19:水平部 19: Level

20:邊部 20: Edge

21:基板支撐爪 21: base plate support claw

22:電動缸 22: electric cylinder

23:可動前端部 23: movable front end

24:升降棒 24: Lifting rod

25:防脫卡止部 25: Anti-drop lock

26:徑大部 26: Most of the diameter

27:彈簧 27: Spring

28:前端垂下部 28: front end hanging down

29:輥子 29: Roller

30:溝部 30: Ditch

31:承載部 31: Carrying Department

32:導引塊 32: Guide block

33:導軌 33: rail

34:拉伸力傳達體 34: Stretching force transmission body

35:轉動軸 35: Rotating shaft

36:軸承部 36: Bearing Department

37:輥子 37: Roller

38:電動缸 38: Electric cylinder

39:可動前端部 39: movable front end

40:承載體 40: Carrier

41:輥子 41: Roller

42:承載片 42: Carrier sheet

43:鬆緊螺旋扣 43: Elastic screw buckle

44:溝部 44: Ditch

45:導引棒 45: Guide rod

46:直線軸承 46: Linear bearing

60:顯示裝置 60: display device

61:顯示區域 61: display area

62:像素 62: pixels

62B:第1發光元件 62B: The first light-emitting element

62G:第2發光元件 62G: Second light-emitting element

62R:第3發光元件 62R: Third light-emitting element

63:基板 63: substrate

64:第1電極 64: 1st electrode

65:電洞傳輸層 65: hole transport layer

66B、66G、66R:發光層 66B, 66G, 66R: light emitting layer

67:電子傳輸層 67: electron transport layer

68:第2電極 68: 2nd electrode

69:絕緣層 69: Insulation

70:保護層 70: protective layer

80:真空槽 80: vacuum tank

81:基板 81: substrate

82:膜厚監控器 82: Film thickness monitor

83:膜厚計 83: Film thickness meter

84:加熱器用電源 84: Power supply for heater

85:蒸發源 85: evaporation source

86:遮罩 86: Mask

[圖1]本實施例的概略說明透視圖。 [Fig. 1] A schematic explanatory perspective view of this embodiment.

[圖2]本實施例的主要部分的放大說明透視圖。 [Fig. 2] An enlarged explanatory perspective view of a main part of this embodiment.

[圖3]本實施例的主要部分的放大說明透視圖。 [Fig. 3] An enlarged explanatory perspective view of a main part of this embodiment.

[圖4]本實施例的夾持機構的動作說明圖。 [Fig. 4] An operation explanatory view of the clamping mechanism of this embodiment.

[圖5]本實施例的夾持機構的動作說明圖。 [Fig. 5] An operation explanatory view of the clamping mechanism of this embodiment.

[圖6]本實施例的夾持機構的動作說明圖。 [Fig. 6] An operation explanatory view of the clamping mechanism of this embodiment.

[圖7]蒸鍍裝置的示意說明正面圖。 [Fig. 7] A schematic front view of a vapor deposition device.

[圖8](a)係運用本發明相關的真空蒸鍍裝置而製作的有機EL顯示裝置的透視圖,(b)係(a)的A-B線剖面圖。 [Fig. 8] (a) is a perspective view of an organic EL display device produced by using a vacuum evaporation device according to the present invention, and (b) is a cross-sectional view taken along line A-B of (a).

針對認為適合之本發明的實施形態,基於圖1示出本 發明的作用而簡單進行說明。 For an embodiment of the present invention deemed suitable, the present invention is shown based on FIG. 1 The effect of the invention will be described briefly.

透過夾持機構而分別把持基板1的對向之邊部2,同時在以不會發生鬆弛的方式朝外側拉伸之狀態下支撐基板1。 The opposing side portions 2 of the substrate 1 are respectively held by the clamping mechanism, and the substrate 1 is supported while being stretched outward without slack.

此情況下,透過按夾持機構的沿著基板1的對向之邊部2而分別設置的複數個把持部各者而設的驅動手段,使得可按把持部各者設定供於把持基板用的按壓力或供於朝外側拉伸用的拉伸力,例如即使基板1的鬆弛在基板1的對向之邊部2之中央側與端部側不同,仍使得可將基板1的對向之邊部間以鬆弛消失的方式均等地拉伸。 In this case, the driving means provided for each of the plurality of gripping parts respectively provided along the opposing side portions 2 of the substrate 1 of the clamping mechanism makes it possible for each gripping part to be set for gripping the substrate The pressing force or the tensile force for stretching outwards, for example, even if the slack of the substrate 1 is different between the central side and the end side of the opposite side portion 2 of the substrate 1, the opposite direction of the substrate 1 can be made The edges are stretched evenly so that the slack disappears.

此外,由於為按把持部各者設置驅動手段的構成,故不需要拉伸力大的驅動裝置,在驅動手段方面可採用小型者,使得耗能亦相應減少。 In addition, since the driving means is provided for each of the gripping parts, a driving device with a large tensile force is not required, and a smaller one can be used for the driving means, so that the energy consumption is reduced accordingly.

[實施例] [Example]

基於圖式說明有關本發明的具體實施例。 A specific embodiment of the present invention will be explained based on the drawings.

本實施例,係一種基板拉伸裝置,具備可把持基板1的對向之邊部2並將此對向之邊部2分別朝外側拉伸之一對的夾持機構。 This embodiment is a substrate stretching device, which is provided with a pair of clamping mechanisms that can hold the opposing side portions 2 of the substrate 1 and stretch the opposing side portions 2 outward.

本實施例的夾持機構係分別沿著把持之前述基板1的邊部2而配置複數個從上下夾持基板1之把持部,按把持部各者具備對前述基板1的邊部2傳達供於把持基板1用的按壓力及供於將基板1朝外側拉伸用的拉伸力的驅動手段。 The gripping mechanism of this embodiment is to arrange a plurality of gripping portions for gripping the substrate 1 from above and below along the side portions 2 of the substrate 1 to be gripped, and each gripping portion is provided with Driving means for pressing force for holding the substrate 1 and stretching force for pulling the substrate 1 outward.

亦即,本實施例,係採取透過各前述夾持機構而把持基板1的對向之一對的邊部2,並在把持的狀態下使對向之把持部彼此互相分離而將基板1朝外側拉伸。 That is, in this embodiment, a pair of opposing side portions 2 of the substrate 1 is grasped by each of the aforementioned clamping mechanisms, and the opposing grasping portions are separated from each other to hold the substrate 1 toward Stretch outside.

本實施例,係如圖示於圖1,為透過將設置夾持機構的框體5垂設於升降板6的連結體7而以吊掛狀態而連結的構成,設有相對於底板8使升降板6升降的升降機構。此外,連結體7係設為將升降板6及框體5的四角部分別連結,於底板8係設有連結體7插穿的插穿孔。 This embodiment, as shown in FIG. 1, is configured to be connected in a suspended state by hanging the frame 5 provided with the clamping mechanism on the connecting body 7 of the lifting plate 6, and provided with respect to the bottom plate 8. A lifting mechanism for lifting the lifting plate 6. In addition, the connecting body 7 is configured to connect the four corners of the lifting plate 6 and the frame 5 respectively, and the bottom plate 8 is provided with an insertion hole through which the connecting body 7 is inserted.

升降板6,係在底板8之上方隔既定間隔而平行設置。在升降板6之上方,係設有4個腳部插穿升降板6的插穿孔而固定於底板8的固定台9。在升降機構方面,係採用基端側固定於固定台9且可動前端側固定於升降板6的內建伺服馬達、滾珠螺桿等的電動缸10。 The lifting plate 6 is arranged in parallel above the bottom plate 8 at predetermined intervals. Above the lifting plate 6, a fixing base 9 is provided with four legs inserted through the insertion holes of the lifting plate 6 and fixed to the bottom plate 8. In terms of the lifting mechanism, an electric cylinder 10 such as a built-in servo motor, a ball screw, etc., which is fixed to the fixed table 9 at the base end side and fixed at the movable front end side is adopted.

因此,在基板交換時等,使電動缸10的可動前端進退並相對於底板8使升降板6升降,使得可使吊掛狀態地連結於升降板6的框體5(夾持機構)升降。升降板6的升降係被透過固定台9的腳部而導引。 Therefore, at the time of substrate replacement, etc., the movable front end of the electric cylinder 10 is moved forward and backward and the lifting plate 6 is raised and lowered relative to the bottom plate 8 so that the frame 5 (clamping mechanism) connected to the lifting plate 6 in a suspended state can be raised and lowered. The lifting system of the lifting plate 6 is guided through the legs of the fixed table 9.

在使基板保持靜止下進行成膜的真空成膜裝置設置本實施例的基板拉伸裝置的情況下,將底板8的下表面外周部固定於真空成膜室的頂面部,將比底板8下側的部分配置於真空成膜室內,並將底板8及比底板8上側的部分配置於真空成膜室外的大氣區域的即可。底板8兼當成膜裝置的腔室之上表面壁時,由於可削減成膜裝置所需的構材故為優選。在使基板移動而進行成膜的真空成膜裝置設置 本實施例的基板拉伸裝置的情況下,將示於圖1的基板拉伸裝置整體配置於裝置內,連結於裝置的基板搬送機構即可。此情況下,由於底板8變不需要故可省略。 In the case where the vacuum film forming apparatus that performs film formation while keeping the substrate still is provided with the substrate stretching apparatus of this embodiment, the lower surface outer peripheral portion of the bottom plate 8 is fixed to the top surface portion of the vacuum film forming chamber, which is lower than the bottom plate 8 The portion on the side may be arranged in the vacuum film forming chamber, and the bottom plate 8 and the portion above the bottom plate 8 may be arranged in the atmospheric area outside the vacuum film forming area. When the bottom plate 8 also serves as the upper surface wall of the chamber of the film forming apparatus, it is preferable because the structural material required for the film forming apparatus can be reduced. Installed in a vacuum film forming apparatus that moves a substrate to form a film In the case of the substrate stretching apparatus of this embodiment, the entire substrate stretching apparatus shown in FIG. 1 may be arranged in the apparatus and connected to the substrate transport mechanism of the apparatus. In this case, since the bottom plate 8 becomes unnecessary, it can be omitted.

前述夾持機構,係前述把持部被以一對的把持片3、4而構成,並以透過此一對的把持片3、4從上下按壓基板1並將所把持的基板1朝外側拉伸的方式構成前述驅動手段。 The clamping mechanism is configured such that the holding portion is formed by a pair of holding pieces 3, 4 and the substrate 1 is pressed from above and below by the pair of holding pieces 3, 4 and the held substrate 1 is stretched outward Constitutes the aforementioned driving means.

把持部,係如圖示於圖2,採取如下構成:分別設有由對向之上下的板部11、12及將此等連結的連結板部13所成的剖視ㄈ字形的夾持體14、和可動自如地設於此夾持體14的可動體15。具體而言,採取設為使把持片3、4分別對向於夾持體14的下板部12的前端與可動體15的前端的構成。 The gripping part, as shown in FIG. 2, adopts the following structure: each is provided with a cross-sectional, zigzag-shaped clamping body formed by opposed upper and lower plate parts 11 and 12 and a connecting plate part 13 connecting the same 14. A movable body 15 which is movably provided on the holding body 14. Specifically, a configuration is adopted such that the holding pieces 3 and 4 face the front end of the lower plate portion 12 of the holder 14 and the front end of the movable body 15, respectively.

將此夾持體14,在沿著所把持的基板1的邊部2的框體5的一對的第一邊部,分別配置複數個(本實施例係8個)。以夾持體14把持基板的長邊時,比起把持短邊的情況,可減小為了基板的鬆弛減低在各把持部所需的拉伸力故為優選。此外,採取如下構成:在沿著未被把持的基板1的邊部20的框體5的一對的第二邊部,係設置基板支撐爪21。具體而言,框體5的第一邊部係採取在水平板部16的兩端使垂直板部17垂下的構成,而第二邊部係以連結於第一邊部的垂直板部17的站立板部18與將此站立板部18的下端彼此連結的水平部19而構成。基板支撐爪21係朝此水平部19的內側而突設。因此,從第二邊 部側的基板1的搬入被良好地進行。 A plurality of the holding bodies 14 are arranged on the pair of first side portions of the frame body 5 along the side portions 2 of the substrate 1 to be held (eight in the present embodiment). When the long side of the substrate is gripped by the holding body 14, it is preferable to reduce the tensile force required at each grip portion for the slack of the substrate, as compared to the case of gripping the short side. In addition, a configuration is adopted in which a pair of second side portions of the frame body 5 along the side portion 20 of the substrate 1 that is not held is provided with substrate support claws 21. Specifically, the first side portion of the frame 5 adopts a configuration in which the vertical plate portion 17 is suspended at both ends of the horizontal plate portion 16, and the second side portion is connected to the vertical plate portion 17 of the first side portion The standing plate portion 18 and the horizontal portion 19 connecting the lower ends of the standing plate portion 18 are configured. The substrate support claw 21 protrudes toward the inside of the horizontal portion 19. Therefore, from the second side The loading of the substrate 1 on the side is performed satisfactorily.

以下,詳述如何在前述各把持部(一對的把持片3、4)對於基板1的邊部2傳達供於把持基板1用的按壓力及供於將基板1朝外側拉伸用的拉伸力。 Hereinafter, it will be described in detail how to transmit the pressing force for holding the substrate 1 and the pulling force for stretching the substrate 1 outwards to the side portions 2 of the substrate 1 at the respective holding portions (a pair of holding pieces 3 and 4). Stretching force.

在夾持體14之上板部11,係設有上端與電動缸22的可動前端部23卡止且下端與可動體15卡止的升降棒24插穿的插穿孔。在此升降棒24的下端係設有與可動體15的下表面卡止的防脫卡止部25,在可動體15之上表面與設於升降棒24之中間部的徑大部26的下表面之間設有彈簧27。另外,電動缸22的基端側係固定於升降板6。 The upper plate portion 11 of the clamping body 14 is provided with an insertion hole through which the upper end is locked with the movable front end portion 23 of the electric cylinder 22 and the lower end is locked with the movable body 15. The lower end of the lifting rod 24 is provided with an anti-disengagement locking portion 25 that is locked to the lower surface of the movable body 15, and the upper surface of the movable body 15 is below the large diameter portion 26 provided at the middle portion of the lifting rod 24. A spring 27 is provided between the surfaces. In addition, the base end side of the electric cylinder 22 is fixed to the lifting plate 6.

此外,在上板部11與下板部12之間,係設有與連結板部13平行的左右一對的導引棒45。在可動體15係形成有此導引棒45分別插穿的插穿孔。圖中,符號46係直線軸承。 In addition, between the upper plate portion 11 and the lower plate portion 12, a pair of left and right guide bars 45 parallel to the coupling plate portion 13 are provided. The movable body 15 is formed with insertion holes through which the guide rods 45 are respectively inserted. In the figure, symbol 46 is a linear bearing.

因此,電動缸22的可動前端部23所致的按壓力係經由彈簧27而傳達至可動體15,進行透過可動體15的把持片4及夾持體14的把持片3所為的基板1的把持(圖5參照)。依如此之構成時,由於將電動缸22分別設於各夾持體14,使得可按把持部各者控制按壓力,使得可因應基板1的鬆弛而良好地把持基板1。再者,透過將彈簧27酌情交換為彈性係數不同的彈簧,使得可調整從電動缸22傳至把持部的力,亦即可調整把持力。 Therefore, the pressing force caused by the movable front end portion 23 of the electric cylinder 22 is transmitted to the movable body 15 via the spring 27, and the substrate 1 held by the holding piece 4 of the movable body 15 and the holding piece 3 of the clamping body 14 is held (Refer to Figure 5). In such a configuration, since the electric cylinders 22 are provided in the respective clamping bodies 14, the pressing force can be controlled by each of the gripping portions, so that the substrate 1 can be gripped well in response to the slack of the substrate 1. Furthermore, by exchanging the spring 27 for a spring having a different elastic coefficient as appropriate, the force transmitted from the electric cylinder 22 to the grip portion can be adjusted, that is, the grip force can be adjusted.

此外,於本實施例中,係採取裝卸自如地將合成樹脂製的把持片4設於可動體15的前端垂下部28的下端的構 成。合成樹脂方面係可採用矽、氯丁橡膠、丁腈橡膠等。因此,把持片4磨耗/劣化時可酌情交換。另外,於本實施例中雖下板部12的前端的把持片3係與下板部12一體地設置的構成,惟亦可採取在下板部12的前端裝卸自如地設置合成樹脂製的把持片3的構成。 In addition, in the present embodiment, a structure in which a grip piece 4 made of synthetic resin is detachably provided at the lower end of the front end hanging portion 28 of the movable body 15 to make. For synthetic resin, silicon, neoprene, nitrile rubber, etc. can be used. Therefore, when the grip piece 4 is worn/degraded, it can be exchanged as appropriate. In addition, in this embodiment, although the gripping piece 3 at the front end of the lower plate portion 12 is integrally provided with the lower plate portion 12, a gripping piece made of synthetic resin may be detachably provided at the front end of the lower plate portion 12 3 composition.

此外,雖未圖示,惟亦可變更把持片4的厚度,或使其他構材介於可動體15的前端垂下部28的下端與把持片4之間從而調整把持片4與把持片3之間隔,而調整各把持片的把持力。此外,亦可使彈簧等的彈性構材介於可動體15的前端垂下部28的下端與把持片4之間,而透過酌情設定此彈性構材的彈性(彈簧時彈性係數),從而調整各把持片的把持力。 In addition, although not shown, the thickness of the gripping piece 4 may be changed, or other members may be interposed between the lower end of the front end of the movable body 15 and the gripping piece 4 to adjust between the gripping piece 4 and the gripping piece 3 Interval, and adjust the holding force of each holding piece. In addition, an elastic member such as a spring may be interposed between the lower end of the front end of the movable body 15 and the lower end of the lower part 28 and the grip piece 4, and by setting the elasticity of the elastic member (coefficient of elasticity at the time of spring) as appropriate to adjust each Holding power of the film.

此外,升降棒24的前端係形成為正面視T字狀,在此T字狀的前端的兩端部分別設有輥子29。此升降棒24的前端,係配置於固定於電動缸22的可動前端部23的前方被開放的剖視ㄈ字形且設有避開升降棒24之中間部分的溝部30的承載部31內。承載部31之上下板部之間隔係設定為比輥子29的直徑若干寬的間隔。卡止於承載部31的升降棒24的前端,係隔著承載部31的內面與輥子29而接觸,平滑地進行傳達後述的拉伸力時的夾持體14的水平滑動。 In addition, the front end of the lifting rod 24 is formed in a T-shape in front view, and rollers 29 are provided at both ends of the T-shaped front end, respectively. The front end of the lifting rod 24 is arranged in a supporting portion 31 provided with a groove 30 that avoids the middle portion of the lifting rod 24 in a cross-sectional zigzag shape opened in front of the movable front end portion 23 fixed to the electric cylinder 22. The interval between the upper and lower plate portions of the bearing portion 31 is set to be an interval slightly wider than the diameter of the roller 29. The front end of the lifting rod 24 that is locked to the bearing portion 31 comes into contact with the roller 29 across the inner surface of the bearing portion 31 to smoothly perform horizontal sliding of the clamping body 14 when a tensile force described later is transmitted.

傳達拉伸力時的夾持體14的水平移動,係可透過設於夾持體14之上板部11與框體5的水平板部16之間的線性導軌而實現。具體而言,再夾持體14之上板部11之 上表面,係設有設於框體5的水平板部16的下表面的導引塊32嵌合的導軌33。因此,夾持體14(把持部)係相對於框體5而水平滑動。 The horizontal movement of the clamping body 14 when the tensile force is transmitted can be realized by a linear guide provided between the plate portion 11 above the clamping body 14 and the horizontal plate portion 16 of the frame 5. Specifically, the upper plate portion 11 of the re-clamping body 14 On the upper surface, a guide rail 33 into which the guide block 32 provided on the lower surface of the horizontal plate portion 16 of the frame 5 is fitted is provided. Therefore, the clamp body 14 (grip portion) slides horizontally with respect to the frame body 5.

於圖3,示出針對把持部從外側視看下的構成。在框體5的水平板部16的前述塊體32的外側,係設有承載設於傳達拉伸力的剖視略L字狀的拉伸力傳達體34的彎曲部的轉動軸35的軸承部36。拉伸力傳達體34,係構成為能以設於彎曲部的轉動軸35為中心而轉動。拉伸力傳達體34的前端係形成為正面視T字狀,在此T字狀的前端的兩端部分別設有輥子37。拉伸力傳達體34的前端,係被固定於電動缸38的可動前端部39的前方開放的剖視ㄈ字形的承載體40承載。承載體40之上下板部之間隔係設定為比輥子37的直徑若干寬的間隔。另外,電動缸38的基端側係固定於升降板6。 FIG. 3 shows the structure of the grip portion viewed from the outside. On the outer side of the block 32 of the horizontal plate portion 16 of the frame 5, a bearing for supporting a rotating shaft 35 provided at a bent portion of a tensile force transmitting body 34 in a slightly L-shaped cross section that transmits tensile force部36. The tensile force transmitting body 34 is configured to be rotatable about the rotating shaft 35 provided in the bending portion. The front end of the tensile force transmitting body 34 is formed in a T-shape in front view, and rollers 37 are provided at both ends of the T-shaped front end, respectively. The front end of the tensile force transmitting body 34 is carried by a cross-sectional, zigzag-shaped carrier 40 fixed to the front of the movable front end 39 of the electric cylinder 38 and opened. The interval between the upper and lower plate portions of the carrier 40 is set to be an interval slightly wider than the diameter of the roller 37. In addition, the base end side of the electric cylinder 38 is fixed to the lifting plate 6.

此外,拉伸力傳達體34的基端亦同樣形成為正面視T字狀,在此T字狀的基端的兩端部分別設有輥子41。拉伸力傳達體34的基端,係配置於設於夾持體14的連結板部13的背面的由水平片與垂直片所成的剖視L字狀的承載片42與連結板部13的背面之間。連結板部13的背面與承載片42的垂直片之間隔係設定為比輥子41的直徑若干寬的間隔。 In addition, the base end of the tensile force transmitting body 34 is also formed in a T-shape in front view, and rollers 41 are provided at both ends of the T-shaped base end. The base end of the tensile force transmitting body 34 is an L-shaped cross section of the support plate 42 formed by the horizontal piece and the vertical piece and the connecting plate portion 13 disposed on the back surface of the connecting plate portion 13 provided on the holder 14 Between the back. The distance between the back surface of the connecting plate portion 13 and the vertical sheet of the carrier sheet 42 is set to be a slightly wider interval than the diameter of the roller 41.

因此,驅動電動缸38的可動前端部39而使拉伸力傳達體34的前端卡止的承載體40上升移動,使得拉伸力傳達體34的基端以設於彎曲部的轉動軸35為中心朝外側轉 動,拉伸力傳達體34的基端將承載片42的垂直片壓往外側,使得夾持體14(把持部)係移動至外側,於基板1傳達拉伸力(圖6參照)。 Therefore, the movable front end 39 of the electric cylinder 38 is driven to move up the carrier 40 in which the front end of the tensile force transmitting body 34 is locked, so that the base end of the tensile force transmitting body 34 takes the rotating shaft 35 provided in the bending portion as Center turned outward As a result, the base end of the tensile force transmitting body 34 presses the vertical piece of the carrier sheet 42 to the outside, so that the clamping body 14 (grip portion) moves to the outside, and transmits the tensile force to the substrate 1 (refer to FIG. 6 ).

在此拉伸力傳達體34的彎曲部與基端之間,係設有鬆緊螺旋扣43,使此鬆緊螺旋扣43旋轉而調整彎曲部與基端之間的距離,使得可調整從電動缸38傳至把持部的力,亦即可調整拉伸力(增加彎曲部與基端部之間的距離使得可增加拉伸力)。具體而言,採取將從彎曲部朝向基端側而延伸的螺絲部與從基端朝向彎曲部而延伸的反向螺絲部透過鬆緊螺旋扣43而螺合連結的構成。 Between the bending portion of the tensile force transmitting body 34 and the base end, an elastic screw buckle 43 is provided, and the elastic screw buckle 43 is rotated to adjust the distance between the bending portion and the base end so that the slave electric cylinder can be adjusted 38 The force transmitted to the grip portion, that is, the tensile force can be adjusted (increasing the distance between the bent portion and the base end portion can increase the tensile force). Specifically, a structure in which a screw portion extending from the curved portion toward the base end side and a reverse screw portion extending from the base end toward the curved portion are screwed and connected by an elastic screw 43.

此外,前述夾持機構,係採取以下構成:具備可將按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者按驅動手段各者個別調整的個別調整手段;或者,可將按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者,按驅動手段各者個別控制的個別控制手段。在本實施例,係彈簧27相當於調整按壓力的個別調整手段,鬆緊螺旋扣43相當於調整拉伸力的個別調整手段。並且,電動缸22相當於調整按壓力的個別控制手段,電動缸38相當於調整拉伸力的個別控制手段。另外,雖透過設置個別調整手段,使得可最佳化供於進一步減低基板的鬆弛用的按壓力與拉伸力,惟未必需要設置按壓手段與拉伸力傳達手段雙方,亦可省略任一方或雙方。 In addition, the above-mentioned clamping mechanism is configured to include an individual adjustment capable of individually adjusting the pressing force, the stretching force, or both of the driving means provided by each of the aforementioned gripping parts according to each of the driving means Means; Alternatively, the individual control means may be individually controlled by each of the driving means according to the respective pressing force, tensile force, or both of the driving means provided by each of the aforementioned gripping parts. In the present embodiment, the spring 27 corresponds to individual adjustment means for adjusting the pressing force, and the elastic screw 43 corresponds to individual adjustment means for adjusting the tensile force. The electric cylinder 22 corresponds to individual control means for adjusting the pressing force, and the electric cylinder 38 corresponds to individual control means for adjusting the stretching force. In addition, although individual adjustment means are provided to optimize the pressing force and tensile force for further reducing the relaxation of the substrate, it is not necessary to provide both the pressing means and the tensile force transmission means, and either one or both sides.

於本實施例中,係如前所述,具備可個別調整按前述 把持部各者具備的驅動手段的拉伸力的個別調整手段及可個別控制按前述把持部各者具備的驅動手段的按壓力的個別控制手段。 In this embodiment, as described above, with individual adjustments as described above Individual adjustment means for the stretching force of the driving means provided by each gripping unit and individual control means capable of individually controlling the pressing force according to the driving means provided by each gripping section.

依本實施例相關的基板拉伸裝置時,可透過前述個別調整手段或前述個別控制手段,依在把持的基板的邊部產生的鬆弛的程度,而個別調整或個別控制按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者。 According to the substrate stretching device related to this embodiment, the individual adjustment means or the individual control means can be used to individually adjust or individually control each of the aforementioned holding parts according to the degree of slack generated at the edge of the substrate to be held Separate pressing force, tensile force, or both of the driving means provided.

例如,可透過前述個別調整手段或前述個別控制手段,使按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者,在把持的基板的邊部之中央區域比在基板的邊部的端部區域高。 For example, the individual adjustment means or the individual control means can be used to make the pressing force, the tensile force, or both of the driving means provided by each of the gripping parts at the center of the edge of the gripped substrate The area is higher than the end area on the side of the substrate.

此外,於本實施例中,承載體40係為了可統一操作一側的夾持機構的各夾持體14的各拉伸力傳達體34,而採取使各拉伸力傳達體34的前端分別卡止於長形的一個承載體40的構成(圖3參照)。亦即,採取使各拉伸傳達體34的前端以既定間隔卡止於前方開放的剖視ㄈ字形的長狀的一個承載體40的構成,採取可透過此一的承載體40的升降而將一側的夾持機構的全部的把持部進行拉伸的構成。於本實施例中,係採取以下構成:作成在承載體40的兩端部分別固定電動缸38的可動前端部39,而利用2個電動缸38統一將一側的夾持機構的全部的把持部進行拉伸。 In addition, in this embodiment, the carrier 40 is configured to allow the tensile force transmitting bodies 34 of the clamping bodies 14 of the clamping mechanism on one side to be uniformly operated. The configuration of one long carrier 40 that is locked (refer to FIG. 3 ). That is, a configuration is adopted in which the front end of each tensile conveyance body 34 is locked at a predetermined interval to a long elongated carrier 40 that is open in a cross-sectional view, and can be moved up and down by this carrier 40. All the gripping parts of the one-side gripping mechanism are stretched. In this embodiment, the following configuration is adopted: the movable front end portions 39 of the electric cylinder 38 are fixed to both ends of the carrier 40, and the two electric cylinders 38 collectively hold all the clamping mechanisms on one side. The part is stretched.

此外,在承載體40之上板部,係設有避開拉伸力傳 達體34之中途部的溝部44。 In addition, a plate portion above the carrier 40 is provided with a mechanism for avoiding tensile force transmission The groove 44 in the middle of the body 34.

另外,本實施例係雖構成為如上述,惟亦可採取以下構成:如同按壓力,在拉伸力方面亦於各夾持體分別設置各一個承載體40,按此承載體40各者設置電動缸38,以分別設置的電動缸38個別控制各夾持體的把持部的拉伸力。 In addition, although this embodiment is configured as described above, the following configuration may also be adopted: as the pressing force, one carrier 40 is also provided in each clamping body in terms of tensile force, and each carrier 40 is provided according to this The electric cylinder 38 individually controls the tensile force of the grip portion of each holder with the electric cylinder 38 provided separately.

此外,各電動缸22、38的可動前端部23、39,係插穿底板8的插穿孔而連結於承載部31及承載體40。將基板拉伸裝置設置於真空裝置內的情況下,係採取將此插穿孔以設於底板8與升降板6之間的伸縮管等而包圍等而保持裝置內的真空的構成即可。 In addition, the movable front end portions 23 and 39 of the electric cylinders 22 and 38 are inserted through the insertion holes of the bottom plate 8 and connected to the bearing portion 31 and the bearing body 40. In the case where the substrate stretching device is installed in the vacuum device, it may be configured such that the insertion hole is surrounded by a telescopic tube or the like provided between the bottom plate 8 and the lifting plate 6 to maintain the vacuum in the device.

使成膜裝置內為真空狀態而成膜時,有時由於作用於真空成膜室的頂面部的負壓使得該頂面部朝內側變形。底板8兼當真空裝置室的頂面部,或使底板8接於頂面部而固定時,頂板部的變形會對基板拉伸裝置造成影響而使基板的鬆弛增大。所以,使底板8的剛性比真空成膜室的頂面部高,或者,設置成以伸縮管、密封環等將底板8的下表面外周部與真空成膜室的頂面部之間密封即可。依如此之構成時,即使由於作用於真空成膜室的頂面部的負壓使得該頂面部朝內側變形,亦可抑制對於底板8的影響,可減低在成膜中頂面部朝內側變形的情況下的基板鬆弛,而達到成膜精度的提升。 When forming a film in a vacuum state in the film forming apparatus, the top surface portion may be deformed inward due to the negative pressure acting on the top surface portion of the vacuum film forming chamber. The bottom plate 8 also serves as the top surface portion of the vacuum device chamber, or when the bottom plate 8 is fixed to the top surface portion, the deformation of the top plate portion will affect the substrate stretching device and increase the slack of the substrate. Therefore, the rigidity of the bottom plate 8 may be higher than that of the top surface of the vacuum deposition chamber, or it may be provided to seal the outer peripheral portion of the lower surface of the bottom plate 8 with the top surface of the vacuum deposition chamber with a telescopic tube, a seal ring, or the like. With this structure, even if the top surface portion is deformed inward due to the negative pressure acting on the top surface portion of the vacuum deposition chamber, the influence on the bottom plate 8 can be suppressed, and the deformation of the top surface portion toward the inside during film formation can be reduced The substrate underneath is relaxed, and the accuracy of film formation is improved.

此外,前述夾持機構,係可採取具備可將按前述把持部各者具備的驅動手段的前述個別控制手段彼此予以聯合 而控制的聯合控制手段的構成。在聯合控制手段方面,係可採用控制各電動缸的可動前端部的進退量、時機等的控制裝置等。 In addition, the clamping mechanism may be provided with the individual control means provided with the driving means provided for each of the gripping parts. The structure of the joint control means of control. In terms of the joint control means, a control device that controls the advance and retreat amount, timing, etc. of the movable front end of each electric cylinder can be used.

例如,前述聯合控制手段,係可構成為依在把持的基板的邊部產生的鬆弛的程度,而將按前述把持部各者具備的驅動手段的個別控制手段彼此予以聯合而控制。 For example, the above-mentioned joint control means may be configured to control each individual control means according to the driving means provided by each of the gripping units in conjunction with each other according to the degree of slack generated at the edge of the substrate to be gripped.

此外,前述聯合控制手段,係可依使按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者在把持的基板的邊部之中央區域比在基板的邊部的端部區域高的設定,而控制按壓手段與拉伸力傳達手段。 In addition, the above-mentioned joint control means can make the pressing force or the tensile force of the driving means provided by each of the holding parts, or both of them in the central area of the edge of the substrate held in The height of the end region of the side is set, and the pressing means and the tensile force transmitting means are controlled.

前述把持的基板的鬆弛的傾向及程度,係因使用的基板的材質/形狀/面積/重量/縱橫比等的規格而異。所以,依規格將基板群組化,按各基板群各者預先測定基板鬆弛傾向。並且,基於此基板鬆弛傾向而決定在各把持部的基板的鬆弛程度,依所決定的基板的鬆弛程度而將按前述把持部各者具備的驅動手段的個別控制手段彼此聯合控制亦為優選。 The tendency and degree of slack in the substrate to be gripped above vary depending on specifications such as material/shape/area/weight/aspect ratio of the substrate to be used. Therefore, the substrates are grouped according to specifications, and the tendency of substrate slack is measured in advance for each substrate group. In addition, it is also preferable to determine the degree of slack of the substrate in each gripping section based on this tendency of slack of the substrate, and it is also preferable to jointly control the individual control means according to the driving means of each gripping section according to the determined degree of slack of the substrate.

此外,亦可採取透過鬆弛檢測手段而檢測前述把持的基板的鬆弛的傾向及程度的構成。例如,可利用把持基板而透過影像處理或雷射位移計等檢測鬆弛的狀態的鬆弛檢測裝置等。使用此鬆弛檢測手段時,以基板拉伸裝置把持基板時,變得亦可確認基板的鬆弛是否已減低至容許範圍。 In addition, it is also possible to adopt a configuration for detecting the tendency and degree of slack of the substrate held by the slack detection means. For example, a slack detection device that grasps the substrate and detects the slack state through image processing, a laser displacement meter, or the like can be used. When using this slack detection means, when the substrate is held by the substrate stretching device, it can be confirmed whether the slack of the substrate has been reduced to an allowable range.

此外,前述個別調整手段或前述個別控制手段,針對 以按前述把持部各者具備的分別的驅動手段所為的將基板進行拉伸的時機,分別按驅動手段各者個別調整或個別控制亦為優選。 In addition, the aforementioned individual adjustment means or the aforementioned individual control means It is also preferable to individually adjust or individually control the driving means according to the timing of stretching the substrate according to the respective driving means provided for each of the aforementioned gripping parts.

具體而言,使透過驅動手段所為的拉伸基板的時機,在把持的基板的邊部之中央區域比在把持的邊部的端部區域前面,或亦可作成進一步使透過驅動手段所為的拉伸基板的時機,隨著朝向把持的基板的邊部的端部區域而逐漸遲延。透過如此的控制,使得可進一步抑制基板的鬆弛。 Specifically, the timing of stretching the substrate by the driving means may be made in front of the central region of the edge of the substrate to be grasped than by the end area of the grasping edge, or it may be made to further pull the substrate by the driving means. The timing of extending the substrate gradually delays toward the end region of the edge of the substrate to be grasped. Through such control, the slack of the substrate can be further suppressed.

例如,亦可採取以下構成:按各夾持體分別設置各一個承載體,按此承載體各者設置電動缸,並以各電動缸個別控制各夾持體的把持部的拉伸力;和構成為控制電動缸的驅動時機而從中央側朝向端部側依序操作拉伸力傳達體。 For example, the following configuration may also be adopted: one carrier body is provided for each clamping body, an electric cylinder is provided for each carrier body, and the stretching force of the grip portion of each clamping body is individually controlled by each electric cylinder; and It is configured to control the driving timing of the electric cylinder and sequentially operate the tensile force transmitting body from the center side toward the end side.

此外在個別調整手段方面係例如,亦可採取如下構成:設置將示於圖4之夾持體14沿著導軌33朝內側(基板側)按壓的彈簧等(未圖示),作成可按夾持體各者個別調整承載片42與連結板部13的背面之間隔,採取在輥子41接觸於承載片42的時間點產生對於基板的拉伸力的構成,從而個別調整拉伸基板的時機。 In addition, for individual adjustment means, for example, the following configuration may be adopted: a spring (not shown) that presses the holder 14 shown in FIG. 4 toward the inside (substrate side) along the guide rail 33 is provided, and the holder can be pressed. Each of the holders individually adjusts the interval between the carrier sheet 42 and the back surface of the connecting plate portion 13, and adopts a configuration in which a stretching force is applied to the substrate when the roller 41 contacts the carrier sheet 42 to individually adjust the timing of stretching the substrate.

另外,本實施例,係雖採用透過將把持的基板的對向之邊部進行把持的各夾持機構而分別將基板朝外側拉伸的構成,惟亦可採取如下構成:前述個別控制手段,係將設於對向之邊部之中任一側的前述夾持機構的驅動手段,分別控制成僅予以產生按壓力。 In addition, although the present embodiment adopts a structure in which the substrate is stretched outward by the clamping mechanisms that hold the opposed edges of the substrate, the following configuration may be adopted: The driving means of the clamping mechanism provided on either side of the opposing side portions are controlled so that only the pressing force is generated.

圖7,係將本發明相關的基板拉伸裝置應用於使基板保持靜止下進行成膜的真空蒸鍍裝置之例。實際上雖應用與圖1同樣的基板拉伸裝置,惟在圖7係簡略地示出所需最低限度的構材。此真空蒸鍍裝置,係為了在保持減壓環境的真空槽80內使薄膜形成於基板81,而使射出成膜材料的蒸發源85配設於與基板81對向之位置,並設有監控從蒸發源85所放出的蒸發粒子的蒸發率的膜厚監控器82、設於真空槽80外的將所監控的蒸發粒子的量換算成膜厚的膜厚計83、和為了以所換算的膜厚成為期望的膜厚的方式控制成膜材料的蒸發率而加熱蒸發源85的加熱器用電源84。此外,具有使蒸發源85移動於相對於紙面為垂直的方向上的移動機構,並設有使基板81與蒸發源85相對移動的相對移動機構。一面使蒸發源85相對於基板81移動一面進行成膜,使得可在整個基板整面形成均勻的膜厚的蒸鍍膜。再者,具有支撐遮罩86的遮罩支撐構材,可使用未圖示的對準機構,而將基板81與遮罩86的相對位置對準而進行成膜。 FIG. 7 is an example of applying the substrate stretching apparatus according to the present invention to a vacuum evaporation apparatus that performs film formation while keeping the substrate still. In practice, although the same substrate stretching apparatus as that in FIG. 1 is used, FIG. 7 shows the minimum required structural members briefly. This vacuum evaporation apparatus is to form a thin film on a substrate 81 in a vacuum tank 80 that maintains a reduced-pressure environment, and to evaporate the film-forming material evaporation source 85 at a position opposed to the substrate 81, and is provided with a monitor A film thickness monitor 82 for the evaporation rate of the evaporated particles discharged from the evaporation source 85, a film thickness meter 83 provided outside the vacuum chamber 80 that converts the amount of the monitored evaporated particles into a film thickness, and The heater power supply 84 for heating the evaporation source 85 is controlled by controlling the evaporation rate of the film forming material so that the film thickness becomes a desired film thickness. In addition, a moving mechanism for moving the evaporation source 85 in a direction perpendicular to the paper surface is provided, and a relative moving mechanism for moving the substrate 81 and the evaporation source 85 relatively is provided. The film is formed while moving the evaporation source 85 relative to the substrate 81 so that a vapor-deposited film with a uniform film thickness can be formed on the entire surface of the substrate. In addition, the mask support member having the support mask 86 can be formed by aligning the relative positions of the substrate 81 and the mask 86 using an alignment mechanism (not shown).

另外,本發明,係不限於本實施例,可酌情設計各構成要件的具體構成。 In addition, the present invention is not limited to this embodiment, and the specific structure of each constituent element can be designed as appropriate.

接著,說明有關使用具備本發明相關的基板拉伸裝置的真空蒸鍍裝置,而作為有機電子裝置之例製造有機EL顯示裝置的實施例。 Next, an example of manufacturing an organic EL display device as an example of an organic electronic device using a vacuum evaporation device provided with a substrate stretching device according to the present invention will be described.

首先,說明有關要製造的有機EL顯示裝置。圖8(a)係有機EL顯示裝置60的整體圖,圖8(b)係顯示 1像素的剖面構造。 First, the organic EL display device to be manufactured will be explained. 8(a) is an overall view of an organic EL display device 60, and FIG. 8(b) is a display 1 pixel cross-sectional structure.

如示於圖8(a),在顯示裝置60的顯示區域61,係矩陣狀地配置複數個像素62,該像素62係具備複數個發光元件。發光元件各者,係具有具備被一對的電極所夾的有機層的構造,細節於後進行說明。另外,此處所謂的像素,係指可在顯示區域61中顯示期望的顏色的最小單位。本實施例相關的顯示裝置的情況下,透過展現彼此不同的發光的第1發光元件62R、第2發光元件62G、第3發光元件62B的組合從而構成像素62。像素62,係多以紅色發光元件、綠色發光元件、和藍色發光元件的組合而構成,惟黃色發光元件、青藍發光元件、白色發光元件的組合亦可,只要至少1色以上即不特別限制。 As shown in FIG. 8( a ), in the display area 61 of the display device 60, a plurality of pixels 62 are arranged in a matrix, and the pixels 62 are provided with a plurality of light-emitting elements. Each light-emitting element has a structure including an organic layer sandwiched by a pair of electrodes, and details will be described later. In addition, the pixel here refers to the smallest unit that can display a desired color in the display area 61. In the case of the display device according to this embodiment, the pixel 62 is formed by a combination of the first light-emitting element 62R, the second light-emitting element 62G, and the third light-emitting element 62B that exhibit different light emission from each other. The pixel 62 is mostly composed of a combination of red light-emitting elements, green light-emitting elements, and blue light-emitting elements, but a combination of yellow light-emitting elements, cyan blue light-emitting elements, and white light-emitting elements may also be used, as long as there is at least one color or more. limit.

圖8(b),係在圖8(a)的A-B線的部分剖面示意圖。像素62,係具有一有機EL元件,該有機EL元件係在基板63上具備第1電極(陽極)64、電洞傳輸層65、發光層66R、66G、66B中的任一者、電子傳輸層67、和第2電極(陰極)68。此等之中,電洞傳輸層65、發光層66R、66G、66B、電子傳輸層67相當於有機層。此外,在本實施形態,發光層66R係發出紅色的有機EL層,發光層66G係發出綠色的有機EL層,發光層66B係發出藍色的有機EL層。發光層66R、66G、66B,係分別形成為對應於發出紅色、綠色、藍色的發光元件(有時亦記述為有機EL元件)的圖案。此外,第1電極64,係按發光元件各者分離而形成。電洞傳輸層65、電子傳輸層 67、第2電極68,係可與複數個發光元件62共通而形成,亦可按發光元件各者而形成。另外,為了防止第1電極64與第2電極68因異物而短路,在第1電極64間設有絕緣層69。再者,有機EL層會因水分、氧等而劣化,故設有供於從水分、氧等保護有機EL元件用的保護層70。 FIG. 8(b) is a schematic cross-sectional view taken along line A-B of FIG. 8(a). The pixel 62 has an organic EL element which includes a first electrode (anode) 64, a hole transport layer 65, a light emitting layer 66R, 66G, 66B, an electron transport layer on a substrate 63 67, and the second electrode (cathode) 68. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to the organic layer. In this embodiment, the light-emitting layer 66R is a red organic EL layer, the light-emitting layer 66G is a green organic EL layer, and the light-emitting layer 66B is a blue organic EL layer. The light-emitting layers 66R, 66G, and 66B are formed into patterns corresponding to light-emitting elements (also sometimes described as organic EL elements) that emit red, green, and blue, respectively. In addition, the first electrode 64 is formed by separating each light-emitting element. Hole transport layer 65, electron transport layer 67. The second electrode 68 may be formed in common with a plurality of light-emitting elements 62, or may be formed for each light-emitting element. In addition, in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by a foreign substance, an insulating layer 69 is provided between the first electrode 64. In addition, the organic EL layer deteriorates due to moisture, oxygen, etc., so a protective layer 70 for protecting the organic EL element from moisture, oxygen, etc. is provided.

要將有機EL層以發光元件單位而形成,係採用隔著遮罩而成膜的方法。近年來,顯示裝置的高精細化進展,在有機EL層的形成方面係採用開口的寬度為數十μm的遮罩。採用了如此的遮罩的成膜的情況下,遮罩在成膜中從蒸發源受熱而熱變形時遮罩與基板的位置會偏差,形成於基板上的薄膜的圖案會從期望的位置偏離而形成。所以,在此等有機EL層的成膜方面係適合採用本發明相關的真空蒸鍍裝置。 To form the organic EL layer in units of light-emitting elements, a method of forming a film through a mask is used. In recent years, with the advancement of high-definition display devices, a mask with an opening width of several tens of μm has been used in the formation of an organic EL layer. In the case of film formation using such a mask, the position of the mask and the substrate may deviate when the mask is heated from the evaporation source during the film formation and thermally deformed, and the pattern of the thin film formed on the substrate may deviate from the desired position While forming. Therefore, in terms of film formation of these organic EL layers, it is suitable to use the vacuum deposition apparatus related to the present invention.

接著,具體說明有關有機EL顯示裝置的製造方法之例。 Next, an example of a method for manufacturing an organic EL display device will be specifically described.

首先,準備形成有供於驅動有機EL顯示裝置用的電路(未圖示)及第1電極64的基板63。 First, the substrate 63 on which the circuit (not shown) for driving the organic EL display device and the first electrode 64 are formed is prepared.

在形成有第1電極64的基板63之上以旋轉塗佈形成丙烯酸樹脂,將丙烯酸樹脂透過光刻法從而圖案化為在形成有第1電極64的部分形成有開口並形成絕緣層69。此開口部相當於發光元件實際上發光的發光區域。 An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by photolithography so that an opening is formed in the portion where the first electrode 64 is formed and an insulating layer 69 is formed. This opening corresponds to a light-emitting area where the light-emitting element actually emits light.

將絕緣層69被圖案化的基板63搬入真空蒸鍍裝置,以本發明相關的基板拉伸裝置將基板進行保持,使電洞傳 輸層65成膜為在顯示區域的第1電極64之上共通的層。透過真空蒸鍍而形成電洞傳輸層65。實際上電洞傳輸層65係形成為比顯示區域61大的尺寸,故不需要高精細的遮罩。 The substrate 63 on which the insulating layer 69 is patterned is carried into a vacuum evaporation device, and the substrate stretching device according to the present invention is used to hold the substrate to transfer holes. The transport layer 65 is formed as a layer common to the first electrode 64 in the display area. The hole transport layer 65 is formed by vacuum evaporation. In fact, the hole transport layer 65 is formed to have a larger size than the display area 61, so a high-definition mask is not required.

接著,利用蒸鍍遮罩而在配置發出紅色的元件的部分,形成發出紅色的發光層66R。首先,將形成至電洞傳輸層65為止的基板63搬入圖7的真空蒸鍍裝置,以基板拉伸裝置進行保持。此時,為了使得基板的鬆弛落入容許範圍,使用個別控制手段、個別調整手段等而調整各把持部的按壓力與拉伸力。基板的鬆弛落入容許範圍時,進行與遮罩86的位置對準(alignment),其中該遮罩86係具有與形成第1發光元件62R的區域對應的開口。基板的鬆弛的容許範圍,係可依成膜所要求的精度而設定。 Next, a red light-emitting layer 66R is formed on the portion where the red-emitting element is arranged by the vapor deposition mask. First, the substrate 63 formed up to the hole transport layer 65 is carried into the vacuum deposition apparatus of FIG. 7 and held by the substrate stretching apparatus. At this time, in order to make the slack of the substrate fall within the allowable range, the pressing force and the tensile force of each gripping portion are adjusted using individual control means, individual adjustment means, or the like. When the slack of the substrate falls within the allowable range, alignment with the mask 86 having an opening corresponding to the area where the first light-emitting element 62R is formed is performed. The allowable range of substrate slack can be set according to the accuracy required for film formation.

在蒸發源85係收容是發光層66R的材料的有機EL材料,在為了使有機材料蒸發而附著於基板上的準備方面,進行預熱。預熱,係為了使收容於蒸發源85的成膜材料的熔化狀態穩定化,以與成膜溫度同等的溫度而預先加熱蒸發源85。在從利用膜厚監控器82而取得的成膜速度(蒸鍍率)的時間變化確認成膜材料的熔化狀態已穩定後再開始發光層66R的成膜時,變得可進行精度高的膜厚控制。 The evaporation source 85 system accommodates the organic EL material that is the material of the light-emitting layer 66R, and performs preheating in preparation for adhesion to the substrate to evaporate the organic material. The preheating is to preheat the evaporation source 85 at a temperature equal to the film formation temperature in order to stabilize the molten state of the film-forming material contained in the evaporation source 85. When it is confirmed from the time change of the film forming speed (evaporation rate) obtained by the film thickness monitor 82 that the film forming material has stabilized in the molten state and then the film formation of the light-emitting layer 66R is resumed, a film with high accuracy becomes possible Thick control.

依本例時,由於可針對整個基板整體減低基板63的鬆弛,故可使遮罩與基板良好地重疊,使得可進行高精度的成膜。 According to this example, since the slack of the substrate 63 can be reduced for the entire substrate, the mask and the substrate can be overlapped well, so that high-precision film formation can be performed.

如同發光層66R的成膜,使用具有與形成第2發光元件62G的區域對應的開口的遮罩而形成發出綠色的發光層66G,使用具有與形成第3發光元件62B的區域對應的開口的遮罩,形成發出藍色的發光層66B。 Like the film formation of the light-emitting layer 66R, a light-emitting layer 66G that emits green is formed using a mask having an opening corresponding to the area where the second light-emitting element 62G is formed, and a mask having an opening corresponding to the area where the third light-emitting element 62B is formed The cover forms a blue light-emitting layer 66B.

發光層66G、66B的成膜結束後,在顯示區域61整體形成電子傳輸層65。電子傳輸層65,係形成為第1至第3發光層共通的層。 After the film formation of the light-emitting layers 66G and 66B is completed, the electron transport layer 65 is formed on the entire display region 61. The electron transport layer 65 is formed as a layer common to the first to third light-emitting layers.

將形成有至電子傳輸層65為止的基板移動至濺鍍裝置,形成第2電極68,之後移動至電漿CVD裝置而形成保護層70,從而完成有機EL顯示裝置60。 The substrate up to the electron transport layer 65 is moved to the sputtering device to form the second electrode 68, and then moved to the plasma CVD device to form the protective layer 70, thereby completing the organic EL display device 60.

從將絕緣層69被圖案化的基板63搬入真空蒸鍍裝置起直到保護層70的成膜結束為止若曝露於包含水分、氧等的環境,則存在由有機EL材料所成的發光層因水分、氧等而劣化之虞。因此,於本例中,成膜裝置間的基板的搬入搬出,係在真空環境或惰性氣體環境下進行。 From the time when the substrate 63 with the insulating layer 69 patterned is carried into the vacuum evaporation device until the film formation of the protective layer 70 is completed, if it is exposed to an environment containing moisture, oxygen, etc., there is a light-emitting layer made of an organic EL material due to moisture. , Oxygen, etc. may deteriorate. Therefore, in this example, the loading and unloading of the substrate between the film forming apparatuses is performed in a vacuum environment or an inert gas environment.

如此而獲得的有機EL顯示裝置,係按發光元件各者精度佳地形成發光層。因此,使用上述製造方法時,可抑制因發光層的位置偏差而起的有機EL顯示裝置的不良的發生。 In the organic EL display device thus obtained, the light-emitting layer is accurately formed for each light-emitting element. Therefore, when the above manufacturing method is used, it is possible to suppress the occurrence of defects in the organic EL display device due to the positional deviation of the light emitting layer.

另外,於此,係論述有關使用遮罩而進行蒸鍍的有機EL顯示裝置的製造方法,惟本案發明相關的基板拉伸裝置的應用係不限於此。無論使用或不使用遮罩,在將基板的被處理面支撐於相對於重力方向而交叉的方向而進行成膜的情況下的成膜裝置方面,皆可應用本發明的基板拉伸 裝置。 In addition, here, a method for manufacturing an organic EL display device that performs vapor deposition using a mask is discussed, but the application of the substrate stretching device related to the present invention is not limited to this. Regardless of whether or not a mask is used, the substrate stretching of the present invention can be applied to a film forming apparatus in a case where a film is formed by supporting a surface to be processed in a direction crossing with respect to the gravity direction Device.

1‧‧‧基板 1‧‧‧ substrate

2‧‧‧邊部 2‧‧‧Border

5‧‧‧框體 5‧‧‧Frame

6‧‧‧升降板 6‧‧‧Lifting board

7‧‧‧連結體 7‧‧‧Connect

8‧‧‧底板 8‧‧‧Bottom plate

9‧‧‧固定台 9‧‧‧Fixed

10‧‧‧電動缸 10‧‧‧Electric cylinder

14‧‧‧夾持體 14‧‧‧Clamping body

16‧‧‧水平板部 16‧‧‧Horizontal Board Department

17‧‧‧垂直板部 17‧‧‧Vertical Board Department

18‧‧‧站立板部 18‧‧‧ Standing board

19‧‧‧水平部 19‧‧‧ Level

20‧‧‧邊部 20‧‧‧Border

21‧‧‧基板支撐爪 21‧‧‧Base support claw

22‧‧‧電動缸 22‧‧‧Electric cylinder

23‧‧‧可動前端部 23‧‧‧Moveable front end

38‧‧‧電動缸 38‧‧‧Electric cylinder

39‧‧‧可動前端部 39‧‧‧Moveable front end

40‧‧‧承載體 40‧‧‧Carrier

Claims (22)

一種基板拉伸裝置,其為具備彼此對向之一對的夾持機構者,在前述夾持機構具備複數個將基板從上下夾持的把持部,按前述把持部各者具備一驅動手段,該驅動手段為將供於把持前述基板用的按壓力及供於將前述基板朝外側拉伸用的拉伸力傳達至前述把持部者,該驅動手段被構成為,在透過前述把持部分別把持前述基板的對向的一對的邊部的狀態下,使對向的前述把持部彼此分離,從而將前述基板朝外側拉伸,在前述夾持機構具備一個別調整手段,該個別調整手段為可將按前述把持部各者具備的前述驅動手段的個別的按壓力及拉伸力按驅動手段各者分別個別調整者。 A substrate stretching device is provided with a pair of clamping mechanisms facing each other, the clamping mechanism is provided with a plurality of gripping portions for clamping the substrate from above and below, and each of the gripping portions is provided with a driving means, The driving means is for transmitting a pressing force for holding the substrate and a stretching force for pulling the substrate outward to the holding portion, and the driving means is configured to hold the substrate through the holding portion In the state of the pair of opposing side portions of the substrate, the opposing holding portions are separated from each other to stretch the substrate outward, and the clamping mechanism is provided with a separate adjustment means, and the individual adjustment means is The individual pressing force and tensile force of the driving means provided by each of the gripping parts may be adjusted individually for each of the driving means. 如申請專利範圍第1項之基板拉伸裝置,其中,在前述夾持機構的前述把持部具備一對的把持片,前述驅動手段被構成為,透過該一對的把持片,從而從上下按壓前述基板,同時將把持的基板朝外側拉伸。 A substrate stretching device according to claim 1 of the patent application, wherein the gripping portion of the gripping mechanism includes a pair of gripping pieces, and the driving means is configured to be pressed from above and below through the pair of gripping pieces The aforementioned substrate simultaneously stretches the grasped substrate outward. 如申請專利範圍第1項之基板拉伸裝置,其中,在前述夾持機構具備一個別控制手段,該個別控制手段為可將按前述把持部各者具備的驅動手段的個別的按壓力或拉伸力、或該等兩者,按驅動手段各者個別進行控制者。 A substrate stretching device as claimed in item 1 of the patent application, wherein the clamping mechanism is provided with a separate control means, and the individual control means can be an individual pressing force or a pulling force according to the driving means provided by each of the gripping parts Stretching force, or both, is controlled individually by each driving means. 如申請專利範圍第3項之基板拉伸裝置,其中,在前述夾持機構具備一聯合控制手段,該聯合控制手段為可 使按前述把持部各者具備的驅動手段的前述個別控制手段彼此聯合而加以控制者。 For example, the substrate stretching device of claim 3, wherein the clamping mechanism is provided with a joint control means, the joint control means is The individual control means according to the driving means provided by each of the gripping units are controlled in conjunction with each other. 如申請專利範圍第1或2項之基板拉伸裝置,其中,前述個別調整手段被構成為,依在把持的基板的邊部產生的鬆弛的程度,個別調整按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者。 A substrate stretching device as claimed in item 1 or 2 of the patent application, wherein the individual adjustment means is configured to individually adjust the drive provided by each of the grasping parts according to the degree of slack generated at the edge of the grasped substrate Means of separate pressing force or stretching force, or both. 如申請專利範圍第3項之基板拉伸裝置,其中,前述個別控制手段被構成為,依在把持的基板的邊部產生的鬆弛的程度,個別控制按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者。 A substrate stretching device according to claim 3 of the patent application, wherein the individual control means is configured to individually control the driving means provided by each of the grasping parts according to the degree of slack generated at the edge of the grasped substrate Separate pressing force or tensile force, or both. 如申請專利範圍第1或2項之基板拉伸裝置,其中,前述個別調整手段被構成為,以在把持的基板的邊部之中央區域的按壓力或拉伸力、或該等兩者成為比在把持的基板的邊部的端部區域高的方式,個別調整按前述把持部各者的驅動手段。 A substrate stretching device as claimed in item 1 or 2 of the patent application, wherein the aforementioned individual adjustment means is configured such that the pressing force or the stretching force at the central region of the edge of the substrate to be held, or both The driving means of each of the aforementioned gripping sections is individually adjusted so as to be higher than the end area of the side of the substrate to be gripped. 如申請專利範圍第3項之基板拉伸裝置,其中,前述個別控制手段被構成為,以在把持的基板的邊部之中央區域的按壓力或拉伸力、或該等兩者成為比在把持的基板的邊部的端部區域高的方式,個別控制按前述把持部各者的驅動手段。 A substrate stretching device as claimed in item 3 of the patent application, wherein the aforementioned individual control means is configured such that the pressing force or the stretching force at the central region of the edge of the substrate to be held, or both The driving means of each of the aforementioned gripping sections is individually controlled so that the end regions of the sides of the gripped substrate are high. 如申請專利範圍第1或2項之基板拉伸裝置,其中,前述個別調整手段被構成為,針對以按前述把持部各者具備的分別的驅動手段所致的拉伸力將基板進行拉伸的時機,分別按驅動手段各者個別調整。 A substrate stretching device as claimed in item 1 or 2 of the patent application, wherein the individual adjustment means is configured to stretch the substrate with the stretching force due to the respective driving means provided by each of the gripping parts The timing of each is individually adjusted according to the driving means. 如申請專利範圍第3項之基板拉伸裝置,其中,前述個別控制手段被構成為,針對以按前述把持部各者具備的分別的驅動手段所致的拉伸力將基板進行拉伸的時機,分別按驅動手段各者個別控制。 A substrate stretching device as claimed in item 3 of the patent application, wherein the individual control means is configured for the timing of stretching the substrate by the stretching force caused by the respective driving means provided by each of the gripping parts , Individually controlled by each of the driving means. 如申請專利範圍第9項之基板拉伸裝置,其中,前述個別調整手段被構成為,以前述驅動手段所致的拉伸力將基板進行拉伸的時機,在把持的基板的邊部之中央區域,成為比在把持的邊部的端部區域前面。 A substrate stretching device as claimed in item 9 of the patent application, wherein the individual adjustment means is configured such that the timing of stretching the substrate with the stretching force caused by the driving means is at the center of the edge of the gripped substrate The area becomes more than the front of the end area of the holding edge. 如申請專利範圍第10項之基板拉伸裝置,其中,前述個別控制手段被構成為,以前述驅動手段所致的拉伸力將基板進行拉伸的時機,在把持的基板的邊部之中央區域,成為比在把持的邊部的端部區域前面。 A substrate stretching device as claimed in item 10 of the patent application, wherein the individual control means is configured such that the timing of stretching the substrate with the stretching force caused by the driving means is at the center of the edge of the gripped substrate The area becomes more than the front of the end area of the holding edge. 如申請專利範圍第11項之基板拉伸裝置,其中,前述個別調整手段被構成為,以前述驅動手段所致的拉伸力將基板進行拉伸的時機,隨著朝向把持的基板的邊部的端部區域而逐漸遲延。 A substrate stretching device as claimed in item 11 of the patent application, wherein the individual adjustment means is configured such that the timing of stretching the substrate with the stretching force caused by the driving means is directed toward the edge of the substrate being held The end of the area gradually delayed. 如申請專利範圍第12項之基板拉伸裝置,其中,前述個別控制手段被構成為,以前述驅動手段所致的拉伸力將基板進行拉伸的時機,隨著朝向把持的基板的邊部的端部區域而逐漸遲延。 A substrate stretching device as claimed in item 12 of the patent application, wherein the individual control means is configured such that the timing of stretching the substrate with the stretching force caused by the driving means is directed toward the edge of the substrate being held The end of the area gradually delayed. 如申請專利範圍第4項之基板拉伸裝置,其中,前述聯合控制手段被構成為,依在把持的基板的邊部產生的鬆弛的程度,將按前述把持部各者具備的驅動手段的個別控制手段彼此聯合而控制。 According to the substrate stretching device of claim 4 of the patent application, the aforementioned joint control means is configured such that, depending on the degree of slack generated at the edge of the substrate to be gripped, each of the driving means provided by each of the aforementioned gripping sections will be The control means are controlled in conjunction with each other. 如申請專利範圍第4項之基板拉伸裝置,其中,前述聯合控制手段被構成為,以在把持的基板的邊部之中央區域的按壓力或拉伸力、或該等兩者成為比在把持的邊部的端部區域高的方式,控制按前述把持部各者具備的驅動手段。 A substrate stretching device as claimed in item 4 of the patent application, wherein the aforementioned joint control means is configured such that the pressing force or the stretching force at the central region of the edge of the substrate to be held, or both The driving means provided for each of the aforementioned gripping sections is controlled so that the end area of the gripped side section is high. 如申請專利範圍第15項之基板拉伸裝置,其中,前述聯合控制手段被構成為,針對前述把持的基板的鬆弛的程度,運用按照依使用的基板的材質/形狀/面積/重量/縱橫比等而群組化的各基板群各者所預先測定的基板鬆弛傾向而決定,依所決定的基板的鬆弛程度,將按前述把持部各者具備的驅動手段的個別控制手段彼此聯合而控制。 A substrate stretching device as claimed in item 15 of the patent application, wherein the joint control means is configured to use the material/shape/area/weight/aspect ratio of the substrate used according to the degree of slack of the substrate held The substrate slack tendency measured in advance by each of the grouped substrate groups is determined, and in accordance with the determined degree of slack of the substrates, individual control means according to the driving means provided by each of the gripping units are controlled in conjunction with each other. 如申請專利範圍第1~4項中任1項之基板拉伸裝置,其具備針對前述把持的基板的鬆弛進行檢測的鬆弛檢測手段。 For example, the substrate stretching device according to any one of claims 1 to 4 includes a slack detection means for detecting the slack of the substrate held above. 如申請專利範圍第3項之基板拉伸裝置,其中,前述個別控制手段被構成為,針對對向之一對的前述夾持機構中的其中一夾持機構的前述驅動手段分別控制。 According to the substrate stretching device of claim 3, the individual control means is configured to separately control the driving means of one of the clamping mechanisms of the pair of opposed clamping mechanisms. 一種成膜裝置,其為對設置於成膜室內的基板進行成膜者:設有如申請專利範圍第1~19項中任一項的基板拉伸裝置。 A film forming device is a film forming device for a substrate provided in a film forming chamber: a substrate stretching device as described in any one of items 1 to 19 of the patent application range. 一種膜的製造方法,具有:將基板搬入成膜室的程序; 把持前述基板而朝外側拉伸的程序;和使膜附著於前述基板的程序;其中,於把持前述基板而朝外側拉伸的程序,使用如申請專利範圍第1~19項中任一項的基板拉伸裝置。 A method for manufacturing a film, including: a procedure for carrying a substrate into a film forming room; The procedure of stretching the substrate to the outside; and the procedure of attaching the film to the substrate; the procedure of stretching the substrate to the outside is as described in any of items 1 to 19 of the patent application Substrate stretching device. 一種有機電子裝置的製造方法,其為在基板之上具備複數個具備被一對的電極夾持的有機層之元件者,具有:將具備複數個電極的基板搬入蒸鍍室的程序;把持前述基板而朝外側拉伸的程序;將收容於蒸發源的有機材料進行加熱的程序;和使前述有機材料的蒸氣附著於前述基板的程序;其中,於把持前述基板而朝外側拉伸的程序,使用如申請專利範圍第1~19項中任一項的基板拉伸裝置。 A method of manufacturing an organic electronic device, comprising a plurality of elements provided with an organic layer sandwiched by a pair of electrodes on a substrate, having a procedure of carrying a substrate having a plurality of electrodes into a vapor deposition chamber; holding the aforementioned A procedure of stretching the substrate outward; a procedure of heating the organic material contained in the evaporation source; and a procedure of attaching the vapor of the organic material to the substrate; wherein, the procedure of stretching the substrate outward while holding the substrate, Use the substrate stretching device as described in any of items 1 to 19 of the patent application.
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