TW201733182A - Substrate stretching unit, film forming device, and method for manufacturing film and organic electronic device - Google Patents
Substrate stretching unit, film forming device, and method for manufacturing film and organic electronic device Download PDFInfo
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- TW201733182A TW201733182A TW105130641A TW105130641A TW201733182A TW 201733182 A TW201733182 A TW 201733182A TW 105130641 A TW105130641 A TW 105130641A TW 105130641 A TW105130641 A TW 105130641A TW 201733182 A TW201733182 A TW 201733182A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
Description
本發明，係有關透過將基板拉伸從而防止基板的鬆弛的基板拉伸裝置。 The present invention relates to a substrate stretching apparatus that prevents stretching of a substrate by stretching the substrate.
基板的自重隨著基板的大型化而增加，故水平保持大型的基板時，有時基板由於基板的自重而朝下方撓曲，在基板發生鬆弛。例如於專利文獻1，係已記載一種裝置，其係透過將對向之基板的端部互相拉伸，從而防止發生基板的鬆弛。 Since the self-weight of the substrate increases as the size of the substrate increases, when the substrate is held horizontally at a large level, the substrate may be deflected downward due to the weight of the substrate, and the substrate may be slack. For example, Patent Document 1 describes a device that prevents the occurrence of slack in a substrate by stretching the ends of the opposing substrates to each other.
[專利文獻1]韓國專利案第10-1456671號公報 [Patent Document 1] Korean Patent Publication No. 10-1456671
在記載於專利文獻1的基板夾持機構方面，係作成如下構造：使用將複數個被細分化的基板支撐片作了結合的平板，透過此平板而將基板朝兩側進行拉伸驅動。 In the substrate holding mechanism described in Patent Document 1, a flat plate in which a plurality of subdivided substrate supporting sheets are joined is used, and the substrate is stretched and driven to the both sides through the flat plate.
另外，依支撐的基板的材質/形狀/面積等，基板的鬆弛程度有所不同。在如專利文獻1的構造，係依支撐的基板，在各支撐片間將基板夾壓之力發生不平衡，或基板在夾壓之力弱的支撐片間滑動，使得在拉伸基板時，在平板的長邊方向上的基板拉伸力發生不平衡。為此，存在無法消除基板的鬆弛或反而助長基板的鬆弛之虞。 Further, the degree of slack of the substrate differs depending on the material, shape, area, and the like of the supported substrate. In the configuration of Patent Document 1, depending on the supported substrate, the force of sandwiching the substrate between the support sheets is unbalanced, or the substrate is slid between the support sheets having weak force of clamping, so that when the substrate is stretched, The substrate stretching force in the longitudinal direction of the flat plate is unbalanced. For this reason, there is a possibility that the slack of the substrate cannot be eliminated or the slack of the substrate is promoted.
若基板的鬆弛大，無法進行均勻的成膜時，使用遮罩在基板上形成薄膜的情況下，係成為在成膜圖案發生大的偏差的原因。 When the slack of the substrate is large and uniform film formation cannot be performed, when a film is formed on the substrate by using a mask, the film formation pattern is largely deviated.
此外，由於為針對結合全部的支撐片下的平板進行拉伸驅動的構造，故為了消除以夾壓的力為弱的支撐片下的基板的滑動而加強夾壓的力時，夾壓的力恐因位置變得過強而使基板破損。再者，需要拉伸力大的驅動裝置，故基板拉伸所需的耗能會增加，拉伸裝置恐大型化。 In addition, since it is a structure for performing stretching drive for all the flat plates under the support sheets, the force of the pinching force is suppressed in order to eliminate the force of the pinching of the substrate under the support piece which is weak by the pinching force. The position of the cause is too strong and the substrate is broken. Further, since a driving device having a large tensile force is required, the energy required for stretching the substrate increases, and the stretching device tends to be large.
本發明，係鑑於如上述之現狀而創作者，本發明相關的基板拉伸裝置，係具備彼此對向之一對的夾持機構的基板拉伸裝置，前述夾持機構具備複數個將基板從上下夾持的把持部，按前述把持部各者具備將供於把持前述基板用的按壓力及供於將前述基板朝外側拉伸用的拉伸力傳達至 前述把持部的驅動手段。 The present invention is directed to a substrate stretching apparatus according to the present invention, and a substrate stretching apparatus according to the present invention is a substrate stretching apparatus including a pair of clamping mechanisms that face each other, and the clamping mechanism includes a plurality of substrates Each of the gripping portions that are vertically clamped has a pressing force for holding the substrate and a tensile force for stretching the substrate to the outside. The driving means of the grip portion.
依本發明相關的基板拉伸裝置時，可予以施展因應了基板的鬆弛情況的基板按壓力及基板拉伸力，而將對向之基板的邊部間均等地拉伸，使得可有效地減低基板的鬆弛。並且，將本發明相關的基板拉伸裝置用於成膜裝置時，在基板不易發生鬆弛，使得可實現均勻的被膜的形成、使用遮罩下的高精度的成膜等。 According to the substrate stretching apparatus according to the present invention, the substrate pressing force and the substrate stretching force can be applied in accordance with the slack of the substrate, and the edges of the opposing substrates can be uniformly stretched, so that the substrate can be effectively reduced. Relaxation of the substrate. Further, when the substrate stretching apparatus according to the present invention is used in a film forming apparatus, it is less likely to cause slack in the substrate, so that formation of a uniform film can be achieved, and high-precision film formation under a mask can be used.
1‧‧‧基板 1‧‧‧Substrate
2‧‧‧邊部 2‧‧‧Edge
3、4‧‧‧把持片 3, 4‧‧‧ holding pieces
[圖1]本實施例的概略說明透視圖。 Fig. 1 is a schematic perspective view showing the present embodiment.
[圖2]本實施例的主要部分的放大說明透視圖。 Fig. 2 is an enlarged perspective view showing the main part of the embodiment.
[圖3]本實施例的主要部分的放大說明透視圖。 Fig. 3 is an enlarged perspective view showing the main part of the embodiment.
[圖4]本實施例的夾持機構的動作說明圖。 Fig. 4 is an explanatory view of the operation of the clamp mechanism of the present embodiment.
[圖5]本實施例的夾持機構的動作說明圖。 Fig. 5 is an explanatory view of the operation of the clamp mechanism of the present embodiment.
[圖6]本實施例的夾持機構的動作說明圖。 Fig. 6 is an explanatory view of the operation of the clamp mechanism of the present embodiment.
[圖7]蒸鍍裝置的示意說明正面圖。 Fig. 7 is a front view showing a schematic view of a vapor deposition device.
[圖8](a)係運用本發明相關的真空蒸鍍裝置而製作的有機EL顯示裝置的透視圖，(b)係(a)的A-B線剖面圖。 8] (a) is a perspective view of an organic EL display device produced by using the vacuum vapor deposition device according to the present invention, and (b) is a cross-sectional view taken along line A-B of (a).
針對認為適合之本發明的實施形態，基於圖1示出本 發明的作用而簡單進行說明。 For the embodiment of the present invention that is considered suitable, the present invention is shown based on FIG. The effect of the invention will be briefly explained.
透過夾持機構而分別把持基板1的對向之邊部2，同時在以不會發生鬆弛的方式朝外側拉伸之狀態下支撐基板1。 The opposite side portions 2 of the substrate 1 are held by the holding mechanism, and the substrate 1 is supported while being stretched outward without being slack.
此情況下，透過按夾持機構的沿著基板1的對向之邊部2而分別設置的複數個把持部各者而設的驅動手段，使得可按把持部各者設定供於把持基板用的按壓力或供於朝外側拉伸用的拉伸力，例如即使基板1的鬆弛在基板1的對向之邊部2之中央側與端部側不同，仍使得可將基板1的對向之邊部間以鬆弛消失的方式均等地拉伸。 In this case, the driving means provided for each of the plurality of gripping portions provided along the opposing side portions 2 of the substrate 1 of the holding mechanism can be set for each of the holding portions for the holding substrate. The pressing force or the tensile force for stretching outward, for example, even if the slack of the substrate 1 is different from the center side and the end side of the opposite side portion 2 of the substrate 1, the alignment of the substrate 1 can be made The sides are stretched evenly in such a manner that the slack disappears.
此外，由於為按把持部各者設置驅動手段的構成，故不需要拉伸力大的驅動裝置，在驅動手段方面可採用小型者，使得耗能亦相應減少。 Further, since the driving means is provided for each of the grip portions, a driving device having a large tensile force is not required, and a small size can be employed for the driving means, so that the energy consumption is also reduced accordingly.
基於圖式說明有關本發明的具體實施例。 Specific embodiments related to the present invention are illustrated based on the drawings.
本實施例，係一種基板拉伸裝置，具備可把持基板1的對向之邊部2並將此對向之邊部2分別朝外側拉伸之一對的夾持機構。 In the present embodiment, a substrate stretching device is provided, which is provided with a clamping mechanism capable of holding the opposite side portions 2 of the substrate 1 and stretching the opposite side portions 2 outward.
本實施例的夾持機構係分別沿著把持之前述基板1的邊部2而配置複數個從上下夾持基板1之把持部，按把持部各者具備對前述基板1的邊部2傳達供於把持基板1用的按壓力及供於將基板1朝外側拉伸用的拉伸力的驅動手段。 In the clamping mechanism of the present embodiment, a plurality of gripping portions for sandwiching the substrate 1 from the upper and lower sides are disposed along the side portions 2 of the substrate 1 that are gripped, and each of the gripping portions is provided to the side portion 2 of the substrate 1. The pressing force for holding the substrate 1 and the driving means for the tensile force for stretching the substrate 1 to the outside.
亦即，本實施例，係採取透過各前述夾持機構而把持基板1的對向之一對的邊部2，並在把持的狀態下使對向之把持部彼此互相分離而將基板1朝外側拉伸。 That is, in the present embodiment, the side portions 2 facing the opposite sides of the substrate 1 are held by the respective clamping mechanisms, and the opposing grip portions are separated from each other in the gripped state, and the substrate 1 is placed toward each other. Stretched on the outside.
本實施例，係如圖示於圖1，為透過將設置夾持機構的框體5垂設於升降板6的連結體7而以吊掛狀態而連結的構成，設有相對於底板8使升降板6升降的升降機構。此外，連結體7係設為將升降板6及框體5的四角部分別連結，於底板8係設有連結體7插穿的插穿孔。 In the present embodiment, as shown in FIG. 1 , the frame body 5 provided with the clamp mechanism is suspended from the connection body 7 of the lift plate 6 and connected in a hanging state, and is provided with respect to the bottom plate 8 . A lifting mechanism for lifting and lowering the lifting plate 6. Further, the connecting body 7 is provided to connect the lifting plate 6 and the four corners of the frame 5, respectively, and the bottom plate 8 is provided with an insertion hole through which the connecting body 7 is inserted.
升降板6，係在底板8之上方隔既定間隔而平行設置。在升降板6之上方，係設有4個腳部插穿升降板6的插穿孔而固定於底板8的固定台9。在升降機構方面，係採用基端側固定於固定台9且可動前端側固定於升降板6的內建伺服馬達、滾珠螺桿等的電動缸10。 The lifting plates 6 are arranged in parallel above the bottom plate 8 at regular intervals. Above the lifting plate 6, there are four fixing portions 9 which are inserted into the bottom plate 8 by inserting the through holes of the lifting plate 6. In the lift mechanism, an electric cylinder 10 having a base end side fixed to the fixed table 9 and having a movable front end side fixed to the lift plate 6 and a built-in servo motor or a ball screw is used.
因此，在基板交換時等，使電動缸10的可動前端進退並相對於底板8使升降板6升降，使得可使吊掛狀態地連結於升降板6的框體5(夾持機構)升降。升降板6的升降係被透過固定台9的腳部而導引。 Therefore, when the substrate is exchanged, the movable front end of the electric cylinder 10 is moved forward and backward, and the lift plate 6 is lifted and lowered with respect to the bottom plate 8, so that the frame 5 (clamping mechanism) connected to the lift plate 6 in a hanging state can be moved up and down. The lifting and lowering of the lifting plate 6 is guided through the leg of the fixing table 9.
在使基板保持靜止下進行成膜的真空成膜裝置設置本實施例的基板拉伸裝置的情況下，將底板8的下表面外周部固定於真空成膜室的頂面部，將比底板8下側的部分配置於真空成膜室內，並將底板8及比底板8上側的部分配置於真空成膜室外的大氣區域的即可。底板8兼當成膜裝置的腔室之上表面壁時，由於可削減成膜裝置所需的構材故為優選。在使基板移動而進行成膜的真空成膜裝置設置 本實施例的基板拉伸裝置的情況下，將示於圖1的基板拉伸裝置整體配置於裝置內，連結於裝置的基板搬送機構即可。此情況下，由於底板8變不需要故可省略。 When the substrate forming apparatus of the present embodiment is provided in a vacuum film forming apparatus that performs film formation while holding the substrate stationary, the outer peripheral portion of the lower surface of the bottom plate 8 is fixed to the top surface portion of the vacuum film forming chamber, and is lower than the bottom plate 8. The side portion is disposed in the vacuum film forming chamber, and the bottom plate 8 and the upper portion of the bottom plate 8 may be disposed in an atmosphere region outside the vacuum film forming chamber. When the bottom plate 8 also serves as the upper surface wall of the chamber of the film forming apparatus, it is preferable because the material required for the film forming apparatus can be reduced. Vacuum film forming apparatus setting for moving a substrate to form a film In the case of the substrate stretching device of the present embodiment, the entire substrate stretching device shown in FIG. 1 may be disposed in the device and connected to the substrate transfer mechanism of the device. In this case, since the bottom plate 8 is not required, it can be omitted.
前述夾持機構，係前述把持部被以一對的把持片3、4而構成，並以透過此一對的把持片3、4從上下按壓基板1並將所把持的基板1朝外側拉伸的方式構成前述驅動手段。 In the above-described clamping mechanism, the grip portion is constituted by a pair of holding pieces 3 and 4, and the substrate 1 is pressed up and down by the pair of holding pieces 3 and 4, and the held substrate 1 is stretched outward. The manner of the above constitutes the aforementioned driving means.
把持部，係如圖示於圖2，採取如下構成：分別設有由對向之上下的板部11、12及將此等連結的連結板部13所成的剖視ㄈ字形的夾持體14、和可動自如地設於此夾持體14的可動體15。具體而言，採取設為使把持片3、4分別對向於夾持體14的下板部12的前端與可動體15的前端的構成。 The grip portion is configured as shown in Fig. 2, and is provided with a cross-sectional U-shaped holder formed by the upper and lower plate portions 11 and 12 and the connecting plate portion 13 connected thereto. 14. A movable body 15 that is movably provided on the holder 14. Specifically, a configuration is adopted in which the holding pieces 3 and 4 are respectively opposed to the distal end of the lower plate portion 12 of the holder 14 and the distal end of the movable body 15.
將此夾持體14，在沿著所把持的基板1的邊部2的框體5的一對的第一邊部，分別配置複數個(本實施例係8個)。以夾持體14把持基板的長邊時，比起把持短邊的情況，可減小為了基板的鬆弛減低在各把持部所需的拉伸力故為優選。此外，採取如下構成：在沿著未被把持的基板1的邊部20的框體5的一對的第二邊部，係設置基板支撐爪21。具體而言，框體5的第一邊部係採取在水平板部16的兩端使垂直板部17垂下的構成，而第二邊部係以連結於第一邊部的垂直板部17的站立板部18與將此站立板部18的下端彼此連結的水平部19而構成。基板支撐爪21係朝此水平部19的內側而突設。因此，從第二邊 部側的基板1的搬入被良好地進行。 The holder 14 is placed in a plurality of first side portions of the frame 5 along the side portion 2 of the substrate 1 to be held (eight in the present embodiment). When the long side of the substrate is held by the holder 14, it is preferable to reduce the stretching force required for each of the grip portions for the relaxation of the substrate, compared to the case where the short side is gripped. Further, a configuration is adopted in which the substrate supporting claws 21 are provided on a pair of second side portions of the frame body 5 along the side portion 20 of the substrate 1 that is not gripped. Specifically, the first side portion of the frame body 5 has a configuration in which the vertical plate portion 17 is suspended at both ends of the horizontal plate portion 16, and the second side portion is connected to the vertical plate portion 17 of the first side portion. The standing plate portion 18 is configured by a horizontal portion 19 that connects the lower ends of the standing plate portions 18 to each other. The substrate supporting claws 21 are protruded toward the inner side of the horizontal portion 19. So from the second side The loading of the substrate 1 on the side is performed satisfactorily.
以下，詳述如何在前述各把持部(一對的把持片3、4)對於基板1的邊部2傳達供於把持基板1用的按壓力及供於將基板1朝外側拉伸用的拉伸力。 Hereinafter, it is explained in detail how the pressing force for holding the substrate 1 and the pulling for pulling the substrate 1 outward are transmitted to the side portions 2 of the substrate 1 in the respective holding portions (the pair of holding pieces 3, 4). Stretching.
在夾持體14之上板部11，係設有上端與電動缸22的可動前端部23卡止且下端與可動體15卡止的升降棒24插穿的插穿孔。在此升降棒24的下端係設有與可動體15的下表面卡止的防脫卡止部25，在可動體15之上表面與設於升降棒24之中間部的徑大部26的下表面之間設有彈簧27。另外，電動缸22的基端側係固定於升降板6。 The plate portion 11 of the holder body 14 is provided with an insertion hole through which the upper end is locked with the movable distal end portion 23 of the electric cylinder 22 and the lower end is inserted into the lifting rod 24 of the movable body 15. At the lower end of the lifting rod 24, a retaining prevention portion 25 that is locked to the lower surface of the movable body 15 is provided, and the upper surface of the movable body 15 and the large diameter portion 26 provided at the intermediate portion of the lifting rod 24 are provided. A spring 27 is provided between the surfaces. Further, the base end side of the electric cylinder 22 is fixed to the lift plate 6.
此外，在上板部11與下板部12之間，係設有與連結板部13平行的左右一對的導引棒45。在可動體15係形成有此導引棒45分別插穿的插穿孔。圖中，符號46係直線軸承。 Further, between the upper plate portion 11 and the lower plate portion 12, a pair of right and left guide bars 45 that are parallel to the connecting plate portion 13 are provided. In the movable body 15, an insertion hole through which the guide bars 45 are inserted is formed. In the figure, the symbol 46 is a linear bearing.
因此，電動缸22的可動前端部23所致的按壓力係經由彈簧27而傳達至可動體15，進行透過可動體15的把持片4及夾持體14的把持片3所為的基板1的把持(圖5參照)。依如此之構成時，由於將電動缸22分別設於各夾持體14，使得可按把持部各者控制按壓力，使得可因應基板1的鬆弛而良好地把持基板1。再者，透過將彈簧27酌情交換為彈性係數不同的彈簧，使得可調整從電動缸22傳至把持部的力，亦即可調整把持力。 Therefore, the pressing force by the movable distal end portion 23 of the electric cylinder 22 is transmitted to the movable body 15 via the spring 27, and the holding of the holding piece 3 of the movable body 15 and the holding piece 3 of the holding body 14 is performed. (Refer to Figure 5). According to this configuration, since the electric cylinders 22 are provided in the respective holding bodies 14, the pressing force can be controlled by each of the gripping portions, so that the substrate 1 can be satisfactorily gripped in response to the slack of the substrate 1. Further, by exchanging the springs 27 as springs having different elastic coefficients as appropriate, the force transmitted from the electric cylinder 22 to the grip portion can be adjusted, and the gripping force can be adjusted.
此外，於本實施例中，係採取裝卸自如地將合成樹脂製的把持片4設於可動體15的前端垂下部28的下端的構 成。合成樹脂方面係可採用矽、氯丁橡膠、丁腈橡膠等。因此，把持片4磨耗/劣化時可酌情交換。另外，於本實施例中雖下板部12的前端的把持片3係與下板部12一體地設置的構成，惟亦可採取在下板部12的前端裝卸自如地設置合成樹脂製的把持片3的構成。 Further, in the present embodiment, the holding member 4 made of synthetic resin is detachably provided at the lower end of the front end portion 28 of the movable body 15. to make. As the synthetic resin, ruthenium, chloroprene rubber, nitrile rubber or the like can be used. Therefore, when the holding piece 4 is worn/degraded, it can be exchanged as appropriate. Further, in the present embodiment, the holding piece 3 at the distal end of the lower plate portion 12 is integrally provided with the lower plate portion 12, but a holding piece made of synthetic resin may be detachably provided at the distal end of the lower plate portion 12. The composition of 3.
此外，雖未圖示，惟亦可變更把持片4的厚度，或使其他構材介於可動體15的前端垂下部28的下端與把持片4之間從而調整把持片4與把持片3之間隔，而調整各把持片的把持力。此外，亦可使彈簧等的彈性構材介於可動體15的前端垂下部28的下端與把持片4之間，而透過酌情設定此彈性構材的彈性(彈簧時彈性係數)，從而調整各把持片的把持力。 Further, although not shown, the thickness of the holding piece 4 may be changed, or the other member may be interposed between the lower end of the distal end portion 28 of the movable body 15 and the holding piece 4 to adjust the holding piece 4 and the holding piece 3 Interval, and adjust the holding power of each grip. Further, an elastic member such as a spring may be interposed between the lower end of the front end portion 28 of the movable body 15 and the holding piece 4, and the elasticity of the elastic member (elastic coefficient at the spring) may be set as appropriate to adjust each Holding the grip of the film.
此外，升降棒24的前端係形成為正面視T字狀，在此T字狀的前端的兩端部分別設有輥子29。此升降棒24的前端，係配置於固定於電動缸22的可動前端部23的前方被開放的剖視ㄈ字形且設有避開升降棒24之中間部分的溝部30的承載部31內。承載部31之上下板部之間隔係設定為比輥子29的直徑若干寬的間隔。卡止於承載部31的升降棒24的前端，係隔著承載部31的內面與輥子29而接觸，平滑地進行傳達後述的拉伸力時的夾持體14的水平滑動。 Further, the front end of the lifting rod 24 is formed in a front T-shape, and a roller 29 is provided at each end portion of the T-shaped front end. The front end of the elevating rod 24 is disposed in a receiving portion 31 of the groove portion 30 that is fixed to the front end of the movable distal end portion 23 of the electric cylinder 22 and that is opened in the shape of a U-shaped portion that avoids the intermediate portion of the elevating rod 24. The interval between the upper and lower plate portions of the carrying portion 31 is set to be somewhat wider than the diameter of the roller 29. The front end of the lifting rod 24 of the carrying portion 31 is brought into contact with the roller 29 via the inner surface of the carrying portion 31, and the horizontal sliding of the holding body 14 when the tensile force described later is transmitted smoothly is performed.
傳達拉伸力時的夾持體14的水平移動，係可透過設於夾持體14之上板部11與框體5的水平板部16之間的線性導軌而實現。具體而言，再夾持體14之上板部11之 上表面，係設有設於框體5的水平板部16的下表面的導引塊32嵌合的導軌33。因此，夾持體14(把持部)係相對於框體5而水平滑動。 The horizontal movement of the holder 14 when the tensile force is transmitted is realized by a linear guide provided between the upper plate portion 11 of the holder 14 and the horizontal plate portion 16 of the frame 5. Specifically, the upper portion 14 of the re-clamping body 14 is On the upper surface, a guide rail 33 to which the guide block 32 provided on the lower surface of the horizontal plate portion 16 of the casing 5 is fitted is provided. Therefore, the holder 14 (holding portion) slides horizontally with respect to the frame 5.
於圖3，示出針對把持部從外側視看下的構成。在框體5的水平板部16的前述塊體32的外側，係設有承載設於傳達拉伸力的剖視略L字狀的拉伸力傳達體34的彎曲部的轉動軸35的軸承部36。拉伸力傳達體34，係構成為能以設於彎曲部的轉動軸35為中心而轉動。拉伸力傳達體34的前端係形成為正面視T字狀，在此T字狀的前端的兩端部分別設有輥子37。拉伸力傳達體34的前端，係被固定於電動缸38的可動前端部39的前方開放的剖視ㄈ字形的承載體40承載。承載體40之上下板部之間隔係設定為比輥子37的直徑若干寬的間隔。另外，電動缸38的基端側係固定於升降板6。 FIG. 3 shows a configuration in which the grip portion is viewed from the outside. On the outer side of the block 32 of the horizontal plate portion 16 of the casing 5, a bearing for supporting the rotating shaft 35 of the bending portion of the tensile force transmitting body 34 having a slightly L-shaped cross-sectional shape for transmitting the tensile force is provided. Part 36. The tensile force transmitting body 34 is configured to be rotatable about a rotation axis 35 provided on the bending portion. The front end of the tensile force transmitting body 34 is formed in a front T-shape, and a roller 37 is provided at each end of the T-shaped distal end. The front end of the tensile force transmitting body 34 is carried by a cross-sectional U-shaped carrier 40 that is fixed to the front of the movable distal end portion 39 of the electric cylinder 38. The interval between the upper and lower plate portions of the carrier 40 is set to be somewhat wider than the diameter of the roller 37. Further, the base end side of the electric cylinder 38 is fixed to the lift plate 6.
此外，拉伸力傳達體34的基端亦同樣形成為正面視T字狀，在此T字狀的基端的兩端部分別設有輥子41。拉伸力傳達體34的基端，係配置於設於夾持體14的連結板部13的背面的由水平片與垂直片所成的剖視L字狀的承載片42與連結板部13的背面之間。連結板部13的背面與承載片42的垂直片之間隔係設定為比輥子41的直徑若干寬的間隔。 Further, the base end of the tensile force transmitting body 34 is also formed in a front T-shape, and a roller 41 is provided at each end portion of the T-shaped base end. The base end of the tensile force transmitting body 34 is a L-shaped carrier piece 42 and a connecting plate portion 13 which are formed by a horizontal piece and a vertical piece which are provided on the back surface of the connecting plate portion 13 of the holder 14. Between the backs. The interval between the back surface of the connecting plate portion 13 and the vertical piece of the carrier sheet 42 is set to be somewhat wider than the diameter of the roller 41.
因此，驅動電動缸38的可動前端部39而使拉伸力傳達體34的前端卡止的承載體40上升移動，使得拉伸力傳達體34的基端以設於彎曲部的轉動軸35為中心朝外側轉 動，拉伸力傳達體34的基端將承載片42的垂直片壓往外側，使得夾持體14(把持部)係移動至外側，於基板1傳達拉伸力(圖6參照)。 Therefore, the movable end portion 39 of the electric cylinder 38 is driven to move the carrier 40 of the end of the tensile force transmitting body 34 upward, so that the base end of the tensile force transmitting body 34 is set to the rotating shaft 35 provided on the curved portion. Center to the outside At the base end of the tensile force transmitting body 34, the vertical piece of the carrier sheet 42 is pressed outward, so that the holder 14 (holding portion) is moved to the outside, and the tensile force is transmitted to the substrate 1 (refer to FIG. 6).
在此拉伸力傳達體34的彎曲部與基端之間，係設有鬆緊螺旋扣43，使此鬆緊螺旋扣43旋轉而調整彎曲部與基端之間的距離，使得可調整從電動缸38傳至把持部的力，亦即可調整拉伸力(增加彎曲部與基端部之間的距離使得可增加拉伸力)。具體而言，採取將從彎曲部朝向基端側而延伸的螺絲部與從基端朝向彎曲部而延伸的反向螺絲部透過鬆緊螺旋扣43而螺合連結的構成。 Between the curved portion and the base end of the tensile force transmitting body 34, a tensioning screw buckle 43 is provided to rotate the elastic screw buckle 43 to adjust the distance between the bending portion and the base end, so that the adjustable electric cylinder can be adjusted. The force transmitted to the gripping portion 38 can also adjust the stretching force (increasing the distance between the curved portion and the base end portion to increase the tensile force). Specifically, the screw portion extending from the curved portion toward the proximal end side and the reverse screw portion extending from the proximal end toward the curved portion are screwed and coupled to each other through the elastic screw buckle 43 .
此外，前述夾持機構，係採取以下構成：具備可將按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者按驅動手段各者個別調整的個別調整手段；或者，可將按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者，按驅動手段各者個別控制的個別控制手段。在本實施例，係彈簧27相當於調整按壓力的個別調整手段，鬆緊螺旋扣43相當於調整拉伸力的個別調整手段。並且，電動缸22相當於調整按壓力的個別控制手段，電動缸38相當於調整拉伸力的個別控制手段。另外，雖透過設置個別調整手段，使得可最佳化供於進一步減低基板的鬆弛用的按壓力與拉伸力，惟未必需要設置按壓手段與拉伸力傳達手段雙方，亦可省略任一方或雙方。 Further, the clamping mechanism has a configuration in which a pressing force or a tensile force that can drive the driving means provided in each of the gripping portions or an individual adjustment in which each of the driving means is individually adjusted is provided. Alternatively, the respective pressing force or tensile force of the driving means provided in each of the gripping portions, or both of them may be individually controlled by the driving means. In the present embodiment, the spring 27 corresponds to an individual adjustment means for adjusting the pressing force, and the elastic buckle 43 corresponds to an individual adjustment means for adjusting the tensile force. Further, the electric cylinder 22 corresponds to an individual control means for adjusting the pressing force, and the electric cylinder 38 corresponds to an individual control means for adjusting the tensile force. Further, by providing individual adjustment means, it is possible to optimize the pressing force and the tensile force for further reducing the slack of the substrate, but it is not necessary to provide both the pressing means and the stretching force transmitting means, and either one of them may be omitted or both sides.
於本實施例中，係如前所述，具備可個別調整按前述 把持部各者具備的驅動手段的拉伸力的個別調整手段及可個別控制按前述把持部各者具備的驅動手段的按壓力的個別控制手段。 In the present embodiment, as described above, it can be individually adjusted as described above. The individual adjustment means for the tensile force of the driving means provided by each of the gripping portions and the individual control means for individually controlling the pressing force of the driving means provided for each of the gripping portions.
依本實施例相關的基板拉伸裝置時，可透過前述個別調整手段或前述個別控制手段，依在把持的基板的邊部產生的鬆弛的程度，而個別調整或個別控制按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者。 According to the substrate stretching apparatus according to the present embodiment, the individual adjustment means or the individual control means can individually adjust or individually control each of the holding portions depending on the degree of slack generated in the side portion of the substrate to be held. The respective pressing force or tensile force of the driving means provided, or both.
例如，可透過前述個別調整手段或前述個別控制手段，使按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者，在把持的基板的邊部之中央區域比在基板的邊部的端部區域高。 For example, the respective pressing force or tensile force of the driving means provided in each of the gripping portions or both of the two sides of the gripping substrate can be made by the individual adjusting means or the individual control means The area is higher than the end area at the side of the substrate.
此外，於本實施例中，承載體40係為了可統一操作一側的夾持機構的各夾持體14的各拉伸力傳達體34，而採取使各拉伸力傳達體34的前端分別卡止於長形的一個承載體40的構成(圖3參照)。亦即，採取使各拉伸傳達體34的前端以既定間隔卡止於前方開放的剖視ㄈ字形的長狀的一個承載體40的構成，採取可透過此一的承載體40的升降而將一側的夾持機構的全部的把持部進行拉伸的構成。於本實施例中，係採取以下構成：作成在承載體40的兩端部分別固定電動缸38的可動前端部39，而利用2個電動缸38統一將一側的夾持機構的全部的把持部進行拉伸。 Further, in the present embodiment, the carrier 40 is configured such that the respective tensile force transmitting members 34 of the respective holding bodies 14 of the holding mechanism on the one side can be operated, and the front ends of the respective tensile force transmitting bodies 34 are respectively The structure of one of the elongated carriers 40 is locked (see FIG. 3). In other words, a configuration in which one end of each of the tension transmitting members 34 is locked at a predetermined interval and has a long cross-sectional shape that is open at the front is formed, and the carrier 40 that can pass through the carrier 40 is lifted and lowered. The entire grip portion of one of the gripping mechanisms is configured to be stretched. In the present embodiment, the movable distal end portion 39 of the electric cylinder 38 is fixed to both end portions of the carrier 40, and all the holding mechanisms of the one clamping mechanism are unified by the two electric cylinders 38. The part is stretched.
此外，在承載體40之上板部，係設有避開拉伸力傳 達體34之中途部的溝部44。 In addition, the upper part of the carrier 40 is provided with a tensile force The groove portion 44 in the middle of the body 34.
另外，本實施例係雖構成為如上述，惟亦可採取以下構成：如同按壓力，在拉伸力方面亦於各夾持體分別設置各一個承載體40，按此承載體40各者設置電動缸38，以分別設置的電動缸38個別控制各夾持體的把持部的拉伸力。 Further, the present embodiment is configured as described above, but it is also possible to adopt a configuration in which, as in the pressing force, each of the holders 40 is provided in each of the holders in terms of tensile force, and the holder 40 is set in accordance with each of the holders 40. The electric cylinder 38 individually controls the tensile force of the grip portion of each of the clamp bodies by the electric cylinders 38 provided separately.
此外，各電動缸22、38的可動前端部23、39，係插穿底板8的插穿孔而連結於承載部31及承載體40。將基板拉伸裝置設置於真空裝置內的情況下，係採取將此插穿孔以設於底板8與升降板6之間的伸縮管等而包圍等而保持裝置內的真空的構成即可。 Further, the movable distal end portions 23 and 39 of the electric cylinders 22 and 38 are inserted through the insertion holes of the bottom plate 8 and coupled to the carrier portion 31 and the carrier 40. In the case where the substrate stretching device is installed in the vacuum device, the insertion hole may be surrounded by a bellows or the like provided between the bottom plate 8 and the lift plate 6 to hold the vacuum in the device.
使成膜裝置內為真空狀態而成膜時，有時由於作用於真空成膜室的頂面部的負壓使得該頂面部朝內側變形。底板8兼當真空裝置室的頂面部，或使底板8接於頂面部而固定時，頂板部的變形會對基板拉伸裝置造成影響而使基板的鬆弛增大。所以，使底板8的剛性比真空成膜室的頂面部高，或者，設置成以伸縮管、密封環等將底板8的下表面外周部與真空成膜室的頂面部之間密封即可。依如此之構成時，即使由於作用於真空成膜室的頂面部的負壓使得該頂面部朝內側變形，亦可抑制對於底板8的影響，可減低在成膜中頂面部朝內側變形的情況下的基板鬆弛，而達到成膜精度的提升。 When the film forming apparatus is formed into a vacuum state, the top surface may be deformed inward by the negative pressure acting on the top surface portion of the vacuum film forming chamber. When the bottom plate 8 serves as the top surface portion of the vacuum chamber or when the bottom plate 8 is attached to the top surface portion and fixed, the deformation of the top plate portion affects the substrate stretching device to increase the slack of the substrate. Therefore, the rigidity of the bottom plate 8 may be higher than the top surface portion of the vacuum film forming chamber, or may be provided between the outer peripheral portion of the lower surface of the bottom plate 8 and the top surface portion of the vacuum film forming chamber by a bellows, a seal ring or the like. According to this configuration, even if the top surface portion is deformed inward due to the negative pressure acting on the top surface portion of the vacuum film forming chamber, the influence on the bottom plate 8 can be suppressed, and the deformation of the top surface portion in the film formation can be reduced. The lower substrate is relaxed to achieve an increase in film formation precision.
此外，前述夾持機構，係可採取具備可將按前述把持部各者具備的驅動手段的前述個別控制手段彼此予以聯合 而控制的聯合控制手段的構成。在聯合控制手段方面，係可採用控制各電動缸的可動前端部的進退量、時機等的控制裝置等。 Further, the above-described gripping mechanism may be configured to include the aforementioned individual control means capable of driving means provided for each of the gripping portions And the composition of the joint control means of control. In the joint control means, a control device that controls the amount of advance and retreat of the movable front end portion of each electric cylinder, timing, and the like can be employed.
例如，前述聯合控制手段，係可構成為依在把持的基板的邊部產生的鬆弛的程度，而將按前述把持部各者具備的驅動手段的個別控制手段彼此予以聯合而控制。 For example, the joint control means may be configured to control the degree of slack generated in the side portion of the substrate to be held, and the individual control means of the driving means provided in each of the gripping portions are combined with each other.
此外，前述聯合控制手段，係可依使按前述把持部各者具備的驅動手段的分別的按壓力或拉伸力、或該等兩者在把持的基板的邊部之中央區域比在基板的邊部的端部區域高的設定，而控制按壓手段與拉伸力傳達手段。 Further, the joint control means may be configured such that a respective pressing force or tensile force of the driving means provided in each of the gripping portions or a central portion of the side portions of the substrates to be held is larger than that on the substrate The end portion of the side portion is set high, and the pressing means and the stretching force transmitting means are controlled.
前述把持的基板的鬆弛的傾向及程度，係因使用的基板的材質/形狀/面積/重量/縱橫比等的規格而異。所以，依規格將基板群組化，按各基板群各者預先測定基板鬆弛傾向。並且，基於此基板鬆弛傾向而決定在各把持部的基板的鬆弛程度，依所決定的基板的鬆弛程度而將按前述把持部各者具備的驅動手段的個別控制手段彼此聯合控制亦為優選。 The tendency and degree of slack of the substrate to be held differ depending on the specifications of the material, shape, area, weight, and aspect ratio of the substrate to be used. Therefore, the substrates are grouped according to specifications, and the substrate slack tendency is measured in advance for each of the substrate groups. In addition, it is preferable to determine the degree of slack in the substrate of each grip portion based on the slack tendency of the substrate, and to control the individual control means of the driving means provided in each of the gripping portions in accordance with the determined degree of slack of the substrate.
此外，亦可採取透過鬆弛檢測手段而檢測前述把持的基板的鬆弛的傾向及程度的構成。例如，可利用把持基板而透過影像處理或雷射位移計等檢測鬆弛的狀態的鬆弛檢測裝置等。使用此鬆弛檢測手段時，以基板拉伸裝置把持基板時，變得亦可確認基板的鬆弛是否已減低至容許範圍。 Further, it is also possible to adopt a configuration in which the tendency and degree of slack of the substrate to be held are detected by a slack detecting means. For example, a slack detecting device that detects a slack state by a video processing, a laser displacement meter, or the like can be used by holding a substrate. When the slack detecting means is used, when the substrate is held by the substrate stretching device, it is also confirmed whether or not the slack of the substrate has been reduced to an allowable range.
此外，前述個別調整手段或前述個別控制手段，針對 以按前述把持部各者具備的分別的驅動手段所為的將基板進行拉伸的時機，分別按驅動手段各者個別調整或個別控制亦為優選。 In addition, the aforementioned individual adjustment means or the aforementioned individual control means are directed to It is also preferable to individually or individually control the timing at which the substrate is stretched by the respective driving means provided in each of the gripping portions.
具體而言，使透過驅動手段所為的拉伸基板的時機，在把持的基板的邊部之中央區域比在把持的邊部的端部區域前面，或亦可作成進一步使透過驅動手段所為的拉伸基板的時機，隨著朝向把持的基板的邊部的端部區域而逐漸變晚。透過如此的控制，使得可進一步抑制基板的鬆弛。 Specifically, the timing of stretching the substrate by the driving means may be such that the central portion of the side portion of the substrate to be gripped is in front of the end portion of the gripped side portion, or may be further pulled by the transmission driving means. The timing of stretching the substrate gradually becomes later as it goes toward the end region of the side portion of the substrate to be held. Through such control, the slack of the substrate can be further suppressed.
例如，亦可採取以下構成：按各夾持體分別設置各一個承載體，按此承載體各者設置電動缸，並以各電動缸個別控制各夾持體的把持部的拉伸力；和構成為控制電動缸的驅動時機而從中央側朝向端部側依序操作拉伸力傳達體。 For example, it is also possible to adopt a configuration in which each of the holders is provided with one carrier, and each of the carriers is provided with an electric cylinder, and each of the electric cylinders individually controls the tensile force of the grip of each of the holders; The driving force timing of the electric cylinder is controlled, and the tensile force transmitting body is sequentially operated from the center side toward the end side.
此外在個別調整手段方面係例如，亦可採取如下構成：設置將示於圖4之夾持體14沿著導軌33朝內側(基板側)按壓的彈簧等(未圖示)，作成可按夾持體各者個別調整承載片42與連結板部13的背面之間隔，採取在輥子41接觸於承載片42的時間點產生對於基板的拉伸力的構成，從而個別調整拉伸基板的時機。 Further, in the case of the individual adjustment means, for example, a spring or the like (not shown) that presses the holder 14 shown in FIG. 4 toward the inner side (substrate side) along the guide rail 33 may be provided. Each of the holders individually adjusts the interval between the carrier sheet 42 and the back surface of the connecting plate portion 13, and adopts a configuration in which the tensile force on the substrate is generated when the roller 41 comes into contact with the carrier sheet 42, and the timing of stretching the substrate is individually adjusted.
另外，本實施例，係雖採用透過將把持的基板的對向之邊部進行把持的各夾持機構而分別將基板朝外側拉伸的構成，惟亦可採取如下構成：前述個別控制手段，係將設於對向之邊部之中任一側的前述夾持機構的驅動手段，分別控制成僅予以產生按壓力。 Further, in the present embodiment, the substrate is stretched outward by the respective clamping mechanisms for gripping the opposite side portions of the substrate to be held, but the above-described individual control means may be employed. The driving means of the chucking mechanism provided on either side of the opposite side is controlled to generate only the pressing force.
圖7，係將本發明相關的基板拉伸裝置應用於使基板保持靜止下進行成膜的真空蒸鍍裝置之例。實際上雖應用與圖1同樣的基板拉伸裝置，惟在圖7係簡略地示出所需最低限度的構材。此真空蒸鍍裝置，係為了在保持減壓環境的真空槽80內使薄膜形成於基板81，而使射出成膜材料的蒸發源85配設於與基板81對向之位置，並設有監控從蒸發源85所放出的蒸發粒子的蒸發率的膜厚監控器82、設於真空槽80外的將所監控的蒸發粒子的量換算成膜厚的膜厚計83、和為了以所換算的膜厚成為期望的膜厚的方式控制成膜材料的蒸發率而加熱蒸發源85的加熱器用電源84。此外，具有使蒸發源85移動於相對於紙面為垂直的方向上的移動機構，並設有使基板81與蒸發源85相對移動的相對移動機構。一面使蒸發源85相對於基板81移動一面進行成膜，使得可在整個基板整面形成均勻的膜厚的蒸鍍膜。再者，具有支撐遮罩86的遮罩支撐構材，可使用未圖示的對準機構，而將基板81與遮罩86的相對位置對準而進行成膜。 Fig. 7 is a view showing an example of a vacuum deposition apparatus in which a substrate stretching apparatus according to the present invention is used to form a film while holding a substrate stationary. Actually, the same substrate stretching device as that of Fig. 1 is applied, but in Fig. 7, the minimum required material is schematically shown. In the vacuum vapor deposition apparatus, in order to form a film on the substrate 81 in the vacuum chamber 80 in which the reduced pressure environment is maintained, the evaporation source 85 that emits the film formation material is disposed at a position facing the substrate 81, and is provided with monitoring. a film thickness monitor 82 that evaporates the evaporation particles from the evaporation source 85, a film thickness gauge 83 that is provided outside the vacuum chamber 80, and converts the amount of the evaporated particles to be measured into a film thickness, and is converted into a film thickness The heater power source 84 of the evaporation source 85 is heated by controlling the evaporation rate of the film formation material so that the film thickness becomes a desired film thickness. Further, there is a moving mechanism that moves the evaporation source 85 in a direction perpendicular to the paper surface, and a relative moving mechanism that relatively moves the substrate 81 and the evaporation source 85. The evaporation source 85 is formed while being moved relative to the substrate 81 so that a vapor deposition film having a uniform film thickness can be formed over the entire substrate. Further, the mask supporting member having the support mask 86 can be formed by aligning the relative positions of the substrate 81 and the mask 86 by using an alignment mechanism (not shown).
另外，本發明，係不限於本實施例，可酌情設計各構成要件的具體構成。 Further, the present invention is not limited to the embodiment, and the specific configuration of each constituent element can be designed as appropriate.
接著，說明有關使用具備本發明相關的基板拉伸裝置的真空蒸鍍裝置，而作為有機電子裝置之例製造有機EL顯示裝置的實施例。 Next, an embodiment in which an organic EL display device is manufactured as an example of an organic electronic device using a vacuum vapor deposition device including the substrate stretching device according to the present invention will be described.
首先，說明有關要製造的有機EL顯示裝置。圖8(a)係有機EL顯示裝置60的整體圖，圖8(b)係顯示 1像素的剖面構造。 First, an organic EL display device to be manufactured will be described. Fig. 8(a) is an overall view of the organic EL display device 60, and Fig. 8(b) is a view 1 pixel cross-sectional structure.
如示於圖8(a)，在顯示裝置60的顯示區域61，係矩陣狀地配置複數個像素62，該像素62係具備複數個發光元件。發光元件各者，係具有具備被一對的電極所夾的有機層的構造，細節於後進行說明。另外，此處所謂的像素，係指可在顯示區域61中顯示期望的顏色的最小單位。本實施例相關的顯示裝置的情況下，透過展現彼此不同的發光的第1發光元件62R、第2發光元件62G、第3發光元件62B的組合從而構成像素62。像素62，係多以紅色發光元件、綠色發光元件、和藍色發光元件的組合而構成，惟黃色發光元件、青藍發光元件、白色發光元件的組合亦可，只要至少1色以上即不特別限制。 As shown in FIG. 8(a), in the display area 61 of the display device 60, a plurality of pixels 62 are arranged in a matrix, and the pixels 62 are provided with a plurality of light-emitting elements. Each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes, and the details will be described later. In addition, a pixel referred to herein means a minimum unit that can display a desired color in the display area 61. In the case of the display device according to the present embodiment, the pixel 62 is configured by transmitting a combination of the first light-emitting element 62R, the second light-emitting element 62G, and the third light-emitting element 62B that emit light that are different from each other. The pixel 62 is mainly composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element may be used as long as it is at least one color or more. limit.
圖8(b)，係在圖8(a)的A-B線的部分剖面示意圖。像素62，係具有一有機EL元件，該有機EL元件係在基板63上具備第1電極(陽極)64、電洞傳輸層65、發光層66R、66G、66B中的任一者、電子傳輸層67、和第2電極(陰極)68。此等之中，電洞傳輸層65、發光層66R、66G、66B、電子傳輸層67相當於有機層。此外，在本實施形態，發光層66R係發出紅色的有機EL層，發光層66G係發出綠色的有機EL層，發光層66B係發出藍色的有機EL層。發光層66R、66G、66B，係分別形成為對應於發出紅色、綠色、藍色的發光元件(有時亦記述為有機EL元件)的圖案。此外，第1電極64，係按發光元件各者分離而形成。電洞傳輸層65、電子傳輸層 67、第2電極68，係可與複數個發光元件62共通而形成，亦可按發光元件各者而形成。另外，為了防止第1電極64與第2電極68因異物而短路，在第1電極64間設有絕緣層69。再者，有機EL層會因水分、氧等而劣化，故設有供於從水分、氧等保護有機EL元件用的保護層70。 Fig. 8(b) is a partial cross-sectional view taken along line A-B of Fig. 8(a). The pixel 62 has an organic EL element including the first electrode (anode) 64, the hole transport layer 65, the light-emitting layers 66R, 66G, and 66B, and the electron transport layer on the substrate 63. 67, and a second electrode (cathode) 68. Among these, the hole transport layer 65, the light-emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to an organic layer. Further, in the present embodiment, the light-emitting layer 66R emits a red organic EL layer, the light-emitting layer 66G emits a green organic EL layer, and the light-emitting layer 66B emits a blue organic EL layer. The light-emitting layers 66R, 66G, and 66B are respectively formed in a pattern corresponding to a light-emitting element that emits red, green, and blue (may also be described as an organic EL element). Further, the first electrode 64 is formed by separating the light-emitting elements. Hole transport layer 65, electron transport layer 67. The second electrode 68 may be formed in common with a plurality of light-emitting elements 62, or may be formed by each of the light-emitting elements. Further, in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter, the insulating layer 69 is provided between the first electrodes 64. Further, since the organic EL layer is deteriorated by moisture, oxygen, or the like, the protective layer 70 for protecting the organic EL element from moisture, oxygen, or the like is provided.
要將有機EL層以發光元件單位而形成，係採用隔著遮罩而成膜的方法。近年來，顯示裝置的高精細化進展，在有機EL層的形成方面係採用開口的寬度為數十μm的遮罩。採用了如此的遮罩的成膜的情況下，遮罩在成膜中從蒸發源受熱而熱變形時遮罩與基板的位置會偏差，形成於基板上的薄膜的圖案會從期望的位置偏離而形成。所以，在此等有機EL層的成膜方面係適合採用本發明相關的真空蒸鍍裝置。 In order to form the organic EL layer in units of light-emitting elements, a method of forming a film through a mask is employed. In recent years, high definition of display devices has progressed, and in the formation of an organic EL layer, a mask having an opening width of several tens of μm has been used. In the case of film formation using such a mask, when the mask is thermally deformed from the evaporation source during film formation, the position of the mask and the substrate may be deviated, and the pattern of the film formed on the substrate may deviate from the desired position. And formed. Therefore, in the film formation of these organic EL layers, the vacuum vapor deposition apparatus according to the present invention is suitably employed.
接著，具體說明有關有機EL顯示裝置的製造方法之例。 Next, an example of a method of manufacturing an organic EL display device will be specifically described.
首先，準備形成有供於驅動有機EL顯示裝置用的電路(未圖示)及第1電極64的基板63。 First, a substrate 63 on which a circuit (not shown) for driving an organic EL display device and the first electrode 64 are formed is prepared.
在形成有第1電極64的基板63之上以旋轉塗佈形成丙烯酸樹脂，將丙烯酸樹脂透過光刻法從而圖案化為在形成有第1電極64的部分形成有開口並形成絕緣層69。此開口部相當於發光元件實際上發光的發光區域。 An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by photolithography so that an opening is formed in a portion where the first electrode 64 is formed, and the insulating layer 69 is formed. This opening corresponds to a light-emitting region in which the light-emitting element actually emits light.
將絕緣層69被圖案化的基板63搬入真空蒸鍍裝置，以本發明相關的基板拉伸裝置將基板進行保持，使電洞傳 輸層65成膜為在顯示區域的第1電極64之上共通的層。透過真空蒸鍍而形成電洞傳輸層65。實際上電洞傳輸層65係形成為比顯示區域61大的尺寸，故不需要高精細的遮罩。 The substrate 63 in which the insulating layer 69 is patterned is carried into a vacuum evaporation apparatus, and the substrate is held by the substrate stretching apparatus according to the present invention, so that the hole is transmitted. The transmission layer 65 is formed into a layer which is common to the first electrode 64 in the display region. The hole transport layer 65 is formed by vacuum evaporation. Actually, the hole transport layer 65 is formed to have a larger size than the display region 61, so that a high-definition mask is not required.
接著，利用蒸鍍遮罩而在配置發出紅色的元件的部分，形成發出紅色的發光層66R。首先，將形成至電洞傳輸層65為止的基板63搬入圖7的真空蒸鍍裝置，以基板拉伸裝置進行保持。此時，為了使得基板的鬆弛落入容許範圍，使用個別控制手段、個別調整手段等而調整各把持部的按壓力與拉伸力。基板的鬆弛落入容許範圍時，進行與遮罩86的位置對準(alignment)，其中該遮罩86係具有與形成第1發光元件62R的區域對應的開口。基板的鬆弛的容許範圍，係可依成膜所要求的精度而設定。 Next, a portion in which a red element is placed is formed by a vapor deposition mask to form a red light-emitting layer 66R. First, the substrate 63 formed up to the hole transport layer 65 is carried into the vacuum vapor deposition apparatus of FIG. 7, and is held by the substrate stretching apparatus. At this time, in order to make the slack of the substrate fall within the allowable range, the pressing force and the tensile force of each of the grip portions are adjusted using individual control means, individual adjustment means, and the like. When the slack of the substrate falls within an allowable range, alignment with the mask 86 is provided, and the mask 86 has an opening corresponding to a region where the first light-emitting element 62R is formed. The allowable range of slack of the substrate can be set according to the accuracy required for film formation.
在蒸發源85係收容是發光層66R的材料的有機EL材料，在為了使有機材料蒸發而附著於基板上的準備方面，進行預熱。預熱，係為了使收容於蒸發源85的成膜材料的熔化狀態穩定化，以與成膜溫度同等的溫度而預先加熱蒸發源85。在從利用膜厚監控器82而取得的成膜速度(蒸鍍率)的時間變化確認成膜材料的熔化狀態已穩定後再開始發光層66R的成膜時，變得可進行精度高的膜厚控制。 The evaporation source 85 accommodates an organic EL material which is a material of the light-emitting layer 66R, and preheats it in preparation for adhering to the substrate in order to evaporate the organic material. In order to stabilize the molten state of the film forming material accommodated in the evaporation source 85, the preheating is performed to heat the evaporation source 85 in advance at a temperature equal to the film forming temperature. When the film formation speed (vapor deposition rate) obtained by the film thickness monitor 82 is changed from the time of the film formation speed (vapor deposition rate), it is confirmed that the film formation of the light-emitting layer 66R is stabilized, and the film having high precision can be obtained. Thick control.
依本例時，由於可針對整個基板整體減低基板63的鬆弛，故可使遮罩與基板良好地重疊，使得可進行高精度的成膜。 According to the present example, since the slack of the substrate 63 can be reduced for the entire substrate as a whole, the mask can be well overlapped with the substrate, so that high-precision film formation can be performed.
如同發光層66R的成膜，使用具有與形成第2發光元件62G的區域對應的開口的遮罩而形成發出綠色的發光層66G，使用具有與形成第3發光元件62B的區域對應的開口的遮罩，形成發出藍色的發光層66B。 As the film formation of the light-emitting layer 66R, a green light-emitting layer 66G is formed using a mask having an opening corresponding to a region where the second light-emitting element 62G is formed, and a cover having an opening corresponding to a region where the third light-emitting element 62B is formed is used. The cover forms a blue light-emitting layer 66B.
發光層66G、66B的成膜結束後，在顯示區域61整體形成電子傳輸層65。電子傳輸層65，係形成為第1至第3發光層共通的層。 After the film formation of the light-emitting layers 66G and 66B is completed, the electron transport layer 65 is formed on the entire display region 61. The electron transport layer 65 is formed as a layer common to the first to third light-emitting layers.
將形成有至電子傳輸層65為止的基板移動至濺鍍裝置，形成第2電極68，之後移動至電漿CVD裝置而形成保護層70，從而完成有機EL顯示裝置60。 The substrate formed until the electron transport layer 65 is moved to a sputtering apparatus to form the second electrode 68, and then moved to the plasma CVD apparatus to form the protective layer 70, thereby completing the organic EL display device 60.
從將絕緣層69被圖案化的基板63搬入真空蒸鍍裝置起直到保護層70的成膜結束為止若曝露於包含水分、氧等的環境，則存在由有機EL材料所成的發光層因水分、氧等而劣化之虞。因此，於本例中，成膜裝置間的基板的搬入搬出，係在真空環境或惰性氣體環境下進行。 When the substrate 63 in which the insulating layer 69 is patterned is carried into the vacuum vapor deposition apparatus until the film formation of the protective layer 70 is completed, if it is exposed to an environment containing moisture, oxygen, or the like, the light-emitting layer formed of the organic EL material may be hydrated. Deterioration of oxygen, etc. Therefore, in this example, the loading and unloading of the substrate between the film forming apparatuses is performed in a vacuum environment or an inert gas atmosphere.
如此而獲得的有機EL顯示裝置，係按發光元件各者精度佳地形成發光層。因此，使用上述製造方法時，可抑制因發光層的位置偏差而起的有機EL顯示裝置的不良的發生。 In the organic EL display device thus obtained, the light-emitting layer is formed with excellent precision for each of the light-emitting elements. Therefore, when the above-described production method is used, occurrence of defects in the organic EL display device due to the positional deviation of the light-emitting layer can be suppressed.
另外，於此，係論述有關使用遮罩而進行蒸鍍的有機EL顯示裝置的製造方法，惟本案發明相關的基板拉伸裝置的應用係不限於此。無論使用或不使用遮罩，在將基板的被處理面支撐於相對於重力方向而交叉的方向而進行成膜的情況下的成膜裝置方面，皆可應用本發明的基板拉伸 裝置。 In addition, here, a method of manufacturing an organic EL display device using vapor deposition using a mask is described, but the application of the substrate stretching apparatus according to the present invention is not limited thereto. The substrate stretching of the present invention can be applied to the film forming apparatus in the case where the film to be processed is supported in a direction intersecting with the direction of gravity with or without the use of a mask. Device.
1‧‧‧基板 1‧‧‧Substrate
2‧‧‧邊部 2‧‧‧Edge
5‧‧‧框體 5‧‧‧ frame
6‧‧‧升降板 6‧‧‧ lifting plate
7‧‧‧連結體 7‧‧‧Connected body
8‧‧‧底板 8‧‧‧floor
9‧‧‧固定台 9‧‧‧ fixed table
10‧‧‧電動缸 10‧‧‧Electric cylinder
14‧‧‧夾持體 14‧‧‧Clamping body
16‧‧‧水平板部 16‧‧‧ horizontal board
17‧‧‧垂直板部 17‧‧‧Vertical board
18‧‧‧站立板部 18‧‧‧Standing board
19‧‧‧水平部 19‧‧‧ horizontal department
20‧‧‧邊部 20‧‧‧Edge
21‧‧‧基板支撐爪 21‧‧‧Substrate support claw
22‧‧‧電動缸 22‧‧‧Electric cylinder
23‧‧‧可動前端部 23‧‧‧ movable front end
38‧‧‧電動缸 38‧‧‧Electric cylinder
39‧‧‧可動前端部 39‧‧‧ movable front end
40‧‧‧承載體 40‧‧‧Carrier
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