CN102947481A - Substrate inverting apparatus, vacuum film-forming apparatus, and substrate inverting method - Google Patents
Substrate inverting apparatus, vacuum film-forming apparatus, and substrate inverting method Download PDFInfo
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- CN102947481A CN102947481A CN2010800675717A CN201080067571A CN102947481A CN 102947481 A CN102947481 A CN 102947481A CN 2010800675717 A CN2010800675717 A CN 2010800675717A CN 201080067571 A CN201080067571 A CN 201080067571A CN 102947481 A CN102947481 A CN 102947481A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Robotics (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Disclosed is a technology of rapidly inverting a substrate in vacuum. A substrate inverting apparatus (20) has: a lift mechanism (60) which lifts the substrate (50) in a chamber (21), i.e., a vacuum chamber; substrate holding mechanisms (4A-4D) having holding sections (41a, 42a) that hold the substrate (50) by having the substrate therebetween; and a substrate rotating mechanism (30), which inverts the top-bottom relationship of the substrate (50) by rotating the holding sections (41a, 42a) of the substrate holding mechanisms (4A-4D). In the state wherein the substrate (50) is held, the substrate rotating mechanism (30) is rotated 180 DEG by having, as a rotating axis, a straight line extending in the horizontal direction.
Description
Technical field
The present invention relates in vacuum tank, to make the technology of the upper and lower relation counter-rotating of substrate, the technology that the film forming face such as organic EL or resin substrate are reversed up and down.
Background technology
In the past, as the organic EL manufacturing technology, known had such technology: form lower electrode, organic luminous layer and upper electrode at substrate, and form the protective membranes such as silicon nitride or silicon oxynitride at this substrate.
Such silicon nitride (SiN) or silicon oxynitride (SiON) are by supplying with SiH in vacuum tank
4Deng Si supply gas and N
2, NH
3And O
2Produce Deng reactant gases and in vacuum tank plasma body method, be so-called plasma CVD method and film forming.At this moment, in the vacuum tank beyond the film forming object, also form the film of silicon nitride or silicon oxynitride.
In addition, in plasma CVD method, utilize so that film forming face is positioned at the what is called that the mode of top forms film and carry out film forming to deposit (Deposition Down).
On the other hand, well-known, the organic layer of organic EL utilizes vacuum vapour deposition to carry out.
In vacuum vapour deposition, usually utilize so that film forming face be positioned at what is called that the mode of below forms film upwards deposition (Deposition up) carry out film forming.
Therefore, in the situation that utilize vacuum method to make organic EL, in technique, need to make the operation of substrate counter-rotating.
In recent years, the mass production of organic EL develops, and seeks to make rapidization of the operation of substrate counter-rotating.
Patent documentation 1: TOHKEMY 2000-239833 communique.
Summary of the invention
The present invention finishes for the problem that solves such prior art, and its purpose is, provides and makes in a vacuum the rapidly technology of counter-rotating of substrate.
The present invention who finishes in order to reach above-mentioned purpose is a kind of substrate reversing gear, has: vacuum tank; Hoisting appliance is arranged in the above-mentioned vacuum tank, is used for making substrate elevating; Substrate holding mechanism is arranged in the above-mentioned vacuum tank, has the maintaining part that a plurality of modes with the clamping substrate keep substrate; And the substrate reversing device, be arranged in the above-mentioned vacuum tank, make the maintaining part of aforesaid substrate maintaining body rotate to make the upper and lower relation of this substrate to reverse.
Also can be that above-mentioned hoisting appliance has a plurality of supporting pins of the downside of supporting substrates in the present invention.
Also can be that the above-mentioned maintaining part of aforesaid substrate maintaining body has a pair of parts of controlling of controlling the edge of substrate by elastic force from both sides in the present invention.
In the present invention, to constitute in the situation that the straight line that extends take along continuous straight runs is rotated as turning axle in above-mentioned maintaining part also be effective to the aforesaid substrate maintaining body.
And the present invention is a kind of vacuum film formation apparatus, has: the vacuum carrying chamber with transfer robot; The aforesaid substrate reversing gear, it is connected with above-mentioned vacuum carrying chamber; And the filming chamber that is connected with above-mentioned vacuum carrying chamber.
And the present invention is a kind of substrate inverting method that makes substrate counter-rotating in vacuum tank, and this substrate inverting method has following operation: utilize transfer robot that substrate is moved into operation in the above-mentioned vacuum tank; The supporting aforesaid substrate also makes this substrate elevating and is disposed at the operation in predetermined position; The mode that is disposed at the aforesaid substrate in predetermined position with clamping keeps the operation of aforesaid substrate; Keeping under the state of aforesaid substrate, the straight line that extends take along continuous straight runs is the operation of turning axle Rotate 180 °; Remove the maintenance of aforesaid substrate and supporting aforesaid substrate to carry out lifting and be disposed at the operation in predetermined position; And the operation of utilizing transfer robot that aforesaid substrate is discharged from above-mentioned vacuum tank.
In situation of the present invention, in vacuum tank, possess: the hoisting appliance that is used for making substrate elevating; Have a plurality of modes with the clamping substrate and keep the substrate holding mechanism of the maintaining part of substrate; And the maintaining part that makes substrate holding mechanism rotates to make the substrate reversing device of upper and lower relation counter-rotating, therefore, needn't use the complicated and large-scale mechanism that utilizes the transfer robot rotation such, just can in vacuum tank, make rapidly and reliably the upper and lower relation counter-rotating of substrate.
Consequently, according to the present invention, even if to deposit with in the situation that upwards technique of deposition is mixed, also can utilize simple structure to provide to carry out the rapidly vacuum unit vacuum system of film forming and processing.
The invention effect
According to the present invention, the upper and lower relation of substrate is promptly reversed.
Description of drawings
Fig. 1 is that expression is for the vertical view of the structure example of the protection membrane formation device that forms protective membrane at organic EL.
Fig. 2 is the Sketch front view of the substrate reversing gear of present embodiment.
Fig. 3 is the Sketch vertical view of this substrate reversing gear.
The (a) and (b) of Fig. 4 be the counter-rotating action of substrate in the expression present embodiment explanatory view (one of).
The (a) and (b) of Fig. 5 are explanatory views (two) of the counter-rotating action of substrate in the expression present embodiment.
The (a) and (b) of Fig. 6 are explanatory views (three) of the counter-rotating action of substrate in the expression present embodiment.
The (a) and (b) of Fig. 7 are explanatory views (four) of the counter-rotating action of substrate in the expression present embodiment.
The (a) and (b) of Fig. 8 are explanatory views (five) of the counter-rotating action of substrate in the expression present embodiment.
The (a) and (b) of Fig. 9 are explanatory views (six) of the counter-rotating action of substrate in the expression present embodiment.
Description of reference numerals
4A～4D substrate holding mechanism; 10 protection membrane formation devices; 11 filming chamber; 13 carrying rooms; Counter-rotating chambers 14; 20 substrate reversing gears; 34 CD-ROM drive motors; 40 main parts; 41 first component parts; 41a handle part (maintaining part); 42 second component parts; 42a handle part (maintaining part); 44 slip-proofing devices; 45 slip-proofing devices; 50 film forming objects (substrate); 51 force application mechanisms; 52 force application mechanisms; 60 substrate elevating mechanisms; 63 lifter pins; 64 supports.
Embodiment
Below, the preferred implementation that present invention will be described in detail with reference to the accompanying.
Fig. 1 is that expression is for the vertical view of the structure example of the protection membrane formation device that forms protective membrane at organic EL.
As shown in Figure 1, the protection membrane formation device 10 of present embodiment has filming chamber 11, moves into chamber 12, carrying room 13, counter-rotating chamber 14, takes out of chamber 15.Each chamber interior of protection membrane formation device 10 in the running except taking out of chamber 15 when taking out of the film forming object is kept vacuum.
Carry out the film forming of protective membrane in the inside of filming chamber 11, filming chamber 11 is provided with a plurality of around carrying room 13.In present embodiment shown in Figure 1, be provided with five filming chamber 11
1～11
5
Moving into chamber 12 is be used to the chamber of moving into the organic EL that will form protective membrane.Usually, organic EL with depositional mode film forming the first electrode, organic luminous layer and the second electrode of making progress, therefore, is moved into chamber 12 as the substrate 50 of film forming object with the prone state of film forming by evaporation.
Counter-rotating chamber 14 has substrate reversing gear 20, and this substrate reversing gear 20 will reverse up and down with the substrate 50 that the prone state handover of film forming comes and make film forming face upwards.This is in order to make as described later substrate 50 form protective membrane by the mode to deposit in filming chamber 11.
Take out of and filming chamber 11, formed the substrate 50 behind the protective membrane from taking out of chamber 15.The pressure of taking out of 15 inside, chamber is adjusted into atmosphere and vacuum, keeps under the state of vacuum at carrying room 13 thus, substrate 50 is taken out of to atmosphere from vacuum environment.
The substrate 50 of being moved into chamber 12 is transferred to counter-rotating chamber 14 by the transfer robot of carrying room 13, and up and down counter-rotating in counter-rotating chamber 14 is transferred to a plurality of filming chamber 11 by the transfer robot of carrying room 13
1～11
5In any.In filming chamber 11
1～11
5 Substrate 50 after the middle film forming is transferred to by the transfer robot of carrying room 13 and takes out of chamber 15, and takes out of from taking out of chamber 15.
Fig. 2 is the Sketch front view of the substrate reversing gear of present embodiment, and Fig. 3 is the Sketch vertical view of this substrate reversing gear.
As shown in Figures 2 and 3, the substrate reversing gear 20 of present embodiment consists of by the substrate rotating mechanism 30 that sets following explanation in chamber 21.
Reversing frame 31 is disposed at the zone of the inboard of chamber 21.And then reversing frame 31 is supported on the both ends of chamber 21, and to be positioned at centered by the fulcrum 32,33 on the straight line that along continuous straight runs extends along vertical direction rotation.
Here, the turning axle of the CD-ROM drive motor 34 that for example is made of pulse motor of fulcrum 32 and the sidepiece that is fixed in chamber 21 links, and thus, reversing frame 31 constitutes to predetermined direction rotation predetermined angular.
As shown in Figure 3, in the present embodiment, in the position that clips rotation center axis both sides of reversing frame 31, for example respectively be equipped with respectively two substrate holding mechanism 4A, 4B and 4C, 4D at the both ends of the lengthwise direction of reversing frame 31.
Here, four substrate holding mechanism 4A～4D have identical structure.In addition, in Fig. 2, only show two substrate holding mechanism 4A, 4C among four substrate holding mechanism 4A～4D.Below, as an example of a suitable substrate holding mechanism 4A example its structure is described.
The substrate holding mechanism 4A of present embodiment will be by consisting of main part 40 by i.e. the first and second component parts 41,42 combinations of two component parts of the large metal roughly same shape of rigidity.
The first and second component parts 41,42 consist of the arm shape linkage component greater than the opening angles of 90 degree of for example namely having of " く " word (" V " word of English alphabet) shape roughly.Here, with the part of the side in the first and second component parts 41,42 as handle part (maintaining part) 41a, 42a, with the part of opposite side as arm 41b, 42b.
And then constitute, under the first and second component parts 41,42 upturned states that the bending part of separately central authorities is overlapping, and centered by fulcrum 43 in the same plane for example as scissors to clockwise direction or counterclockwise rotation and open and close.
In this case, the first and second component parts 41,42 are by with dull and stereotyped slight curvature, make separately handle part 41a, 42a form that section is opposed endways.And then the opposed terminal portions at the first and second component parts 41,42 handle part 41a, 42a is equipped with the slip- proofing device 44,45 that for example is made of viton.
In addition, the first and second component parts 41, near 42 handle part 41a, 42a part above-mentioned fulcrum 43 are equipped with draft helical spring 46, an end of 47.These draft helical springs 46, the other end of 47 are installed on respectively the teat 37,38 on the reversing frame 31, and described teat 37,38 is arranged at the terminal part side of the first and second component parts 41,42 arm 41b, 42b.
And then the handle part 42a whisker 46 that is stretched stretches downwards, and the handle part 41a whisker 47 that is stretched stretches upward.
And the first and second component parts 41,42 arm 41b, the terminal part of 42b constitute, by for example using compressed-air actuated force application mechanism 51,52 action respectively to handle part 41a, the 42a side application of force.
By such structure, when making each force application mechanism 51,52 actions to the first and second component parts 41,42 arm 41b, 42b during to handle part 41a, the 42a side application of force, the first and second component parts 41,42 handle part 41a, 42a overcome each draft helical spring 46,47 elastic force and move to the direction that is separated from each other (opening) from horizontal direction, on the other hand.When force application mechanism 51,52 action were stopped, the first and second component parts 41,42 handle part 41a, 42a were by each draft helical spring 46,47 elastic force and move and in the horizontal direction in opposite directions to the direction of (closure) close to each other.
In addition, in the situation that makes the first and second component parts 41,42 handle part 41a, 42a closure, the slip- proofing device 44,45 that is arranged at respectively handle part 41a, 42a is set as little the getting final product of thickness than substrate 50 each other.
Below reversing frame 31, be provided with substrate elevating mechanism 60.
This substrate elevating mechanism 60 has and links with not shown lift motor and along the lifting shaft 61 that vertical direction is extended, flat pedestal 62 is installed in the upper end of this lifting shaft 61.
As shown in Figure 3, this pedestal 62 is disposed at the zone of the inboard of each above-mentioned substrate holding mechanism 4A～4D, at vertical a plurality of (being eight the here) lifter pin 63 that is provided with of the upper surface of this pedestal 62.
In the present embodiment, the support 64 of the upper end of each lifter pin 63 constitutes, and rises to the slightly high position, position of the first and second component parts 41 than each substrate holding mechanism 4A～4D, 42 handle part 41a, 42a.
The (a) and (b) of (a) and (b)～Fig. 9 of Fig. 4 are explanatory views of the counter-rotating action of the substrate 50 in the expression present embodiment.
In the present embodiment with such structure, in the situation of the counter-rotating of carrying out substrate 50, shown in Fig. 4 (a), make force application mechanism 51 action of the downside of each substrate holding mechanism 4A～4D, the handle part 41a that makes the first component parts 41 is moved upward with respect to the handle part 42a of the second component parts 42 and separates.
Then, under this state, use the transfer robot in the carrying room 13, and substrate 50 is positioned on its mounting portion 70 substrate 50 is moved in the counter-rotating chamber 14.
Then, shown in Fig. 4 (b), substrate elevating mechanism 60 is risen, utilize its support 64 supporting substrates 50 and substrate 50 is floated a little from the mounting portion 70 of transfer robot, and the mounting portion 70 of transfer robot is turned back in the carrying room 13.
Then, shown in Fig. 5 (a), substrate elevating mechanism 60 is descended.Thus, substrate 50 is by the handle part 42a supporting of the second component parts 42 of each substrate holding mechanism 4A～4D.
And then, the action of force application mechanism 51 of the downside of each substrate holding mechanism 4A～4D is stopped.Consequently, by the elastic force of each draft helical spring 46, make the handle part 41a of the first component parts 41 mobile downwards.
Thus, shown in Fig. 5 (b), the edge of substrate 50 keeps substrate 50 by the first and second component parts 41,42 handle part 41a, 42a clamping.
Then, under this state, make CD-ROM drive motor 34 action, the reversing frame 31 that makes substrate rotating mechanism 30 centered by fulcrum 32,33 along 180 ° of vertical direction rotations.
Thus, shown in Fig. 6 (a), the upper and lower relation counter-rotating of the first and second component parts 41 of each substrate holding mechanism 4A～4D, 42 handle part 41a, 42a, the upper and lower relation of substrate 50 also reverses, and (in the example shown in Fig. 6 (a), the film forming face 50a of substrate 50 becomes upside.）。
Then, make force application mechanism 52 action of the downside of each substrate holding mechanism 4A～4D, shown in Fig. 6 (b), the handle part 42a that makes the second component parts 42 is moved upward and separates from the handle part 41a of the first component parts 41.
And then, shown in Fig. 7 (a), substrate elevating mechanism 60 is risen, substrate 50 is loaded on support 64, and leave from handle part 41a.Then, shown in Fig. 7 (b), make force application mechanism 51 actions, make handle part 41a mobile downwards.And then, substrate elevating mechanism 60 is descended, under this state, utilize not shown aligning guide to carry out the aligning of substrate 50.
After aim at finishing, shown in Fig. 8 (a), substrate elevating mechanism 60 is risen, and make substrate 50 between the first and second component parts 41,42 handle part 41a, 42a.
And then, under this state, shown in Fig. 8 (b), the mounting portion 70 of the transfer robot of carrying room 13 is moved in the counter-rotating chamber 14, and made mounting portion 70 be positioned at the bottom of substrate 50.
Then, shown in Fig. 9 (a), substrate elevating mechanism 60 is descended, substrate 50 is loaded on the mounting portion 70 of transfer robot.
Under this state, shown in Fig. 9 (b), the mounting portion 70 that makes transfer robot moves from counter-rotating chamber 14 and discharges substrate 50.
In addition, then, the action of force application mechanism 52 of the downside of each substrate holding mechanism 4A～4D is stopped and turning back to original state, and make as mentioned above CD-ROM drive motor 34 actions, the reversing frame 31 that makes substrate rotating mechanism 30 Rotate 180 ° centered by fulcrum 32,33 returns state shown in Figure 2.Then repeatedly carry out above-mentioned each action.
As mentioned above, according to present embodiment, in counter-rotating chamber 14, possess: the substrate elevating mechanism 60 that makes substrate 50 liftings; Have in the mode of clamping substrate 50 and keep the first and second component parts 41 of substrate 50, substrate holding mechanism 4A～4D of 42; And make substrate holding mechanism 4A～4D rotation so that the substrate rotating mechanism 30 of upper and lower relation counter-rotating, therefore, needn't use the complicated and large-scale mechanism that utilizes transfer robot rotation such, just can be in the counter-rotating chamber 14 rapidly interior and the upper and lower relation of substrate 50 is reversed.
Consequently, according to present embodiment, even if to deposit with in the situation that upwards technique of deposition is mixed, also can utilize simple structure to provide to carry out the rapidly vacuum unit vacuum system of film forming and processing.
Claims (6)
1. substrate reversing gear, this substrate reversing gear has:
Vacuum tank;
Hoisting appliance is arranged in the above-mentioned vacuum tank, is used for making substrate elevating;
Substrate holding mechanism is arranged in the above-mentioned vacuum tank, has the maintaining part that a plurality of modes with the clamping substrate keep substrate; And
The substrate reversing device is arranged in the above-mentioned vacuum tank, makes the maintaining part of aforesaid substrate maintaining body rotate to make the upper and lower relation of this substrate to reverse.
2. substrate reversing gear according to claim 1 is characterized in that,
Above-mentioned hoisting appliance has a plurality of supporting pins of the downside of supporting substrates.
3. substrate reversing gear according to claim 1 and 2 is characterized in that,
The above-mentioned maintaining part of aforesaid substrate maintaining body has a pair of parts of controlling, described a pair of parts are controlled substrate from both sides by elastic force the edge of controlling.
4. the described substrate reversing gear of each according to claim 1～3 is characterized in that,
The above-mentioned maintaining part of aforesaid substrate maintaining body constitutes, and the straight line that extends take along continuous straight runs is rotated as turning axle.
5. vacuum film formation apparatus, this vacuum film formation apparatus has:
Vacuum carrying chamber with transfer robot;
The described substrate reversing gear of in the claim 1～4 each, it is connected with above-mentioned vacuum carrying chamber; And
The filming chamber that is connected with above-mentioned vacuum carrying chamber.
6. a substrate inverting method makes the substrate counter-rotating in vacuum tank, and this substrate inverting method has following operation:
Utilize transfer robot that substrate is moved into operation in the above-mentioned vacuum tank;
The supporting aforesaid substrate also makes this substrate elevating and is disposed at the operation in predetermined position;
The mode that is disposed at the aforesaid substrate in predetermined position with clamping keeps the operation of substrate;
Keeping under the state of aforesaid substrate, the straight line that extends take along continuous straight runs is the operation of turning axle Rotate 180 °;
Remove the maintenance of aforesaid substrate and supporting aforesaid substrate to carry out lifting and be disposed at the operation in predetermined position; And
The operation of utilizing transfer robot that aforesaid substrate is discharged from above-mentioned vacuum tank.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2010/060437 WO2011161745A1 (en) | 2010-06-21 | 2010-06-21 | Substrate inverting apparatus, vacuum film-forming apparatus, and substrate inverting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102947481A true CN102947481A (en) | 2013-02-27 |
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ID=45370959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010800675717A Pending CN102947481A (en) | 2010-06-21 | 2010-06-21 | Substrate inverting apparatus, vacuum film-forming apparatus, and substrate inverting method |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20130041089A (en) |
| CN (1) | CN102947481A (en) |
| WO (1) | WO2011161745A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106967957A (en) * | 2015-10-01 | 2017-07-21 | 佳能特机株式会社 | The manufacture method of substrate stretching device, film formation device and film and organic electronic device |
| CN110310911A (en) * | 2019-06-26 | 2019-10-08 | 德淮半导体有限公司 | Semiconductor equipment, wafer transfer mechanism and operational method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240263299A1 (en) * | 2023-02-06 | 2024-08-08 | Applied Materials, Inc. | Module for flipping substrates in vacuum |
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| JP2005187114A (en) * | 2003-12-25 | 2005-07-14 | Shibaura Mechatronics Corp | Vacuum treatment device |
| CN1812051A (en) * | 2005-01-07 | 2006-08-02 | 东京毅力科创株式会社 | Substrate processing system and substrate processing program |
| CN101068949A (en) * | 2005-06-15 | 2007-11-07 | 株式会社爱发科 | Film forming device, thin-film manufacturing apparatus, and film forming method |
| WO2008126489A1 (en) * | 2007-03-30 | 2008-10-23 | Tokyo Electron Limited | Sputtering system and method for using sputtering system |
| CN101572184A (en) * | 2004-09-07 | 2009-11-04 | 佳能安内华股份有限公司 | Method of production of a magnetoresistance effect device |
| JP2009275260A (en) * | 2008-05-14 | 2009-11-26 | Olympus Corp | Handling mechanism and film formation system |
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2010
- 2010-06-21 KR KR1020137000628A patent/KR20130041089A/en active Search and Examination
- 2010-06-21 WO PCT/JP2010/060437 patent/WO2011161745A1/en active Application Filing
- 2010-06-21 CN CN2010800675717A patent/CN102947481A/en active Pending
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| JP2001158962A (en) * | 1999-11-30 | 2001-06-12 | Sumitomo Heavy Ind Ltd | Film forming apparatus and its method |
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| JP2001226769A (en) * | 2000-02-10 | 2001-08-21 | Matsushita Electric Ind Co Ltd | Film deposition system |
| JP2005187114A (en) * | 2003-12-25 | 2005-07-14 | Shibaura Mechatronics Corp | Vacuum treatment device |
| CN101572184A (en) * | 2004-09-07 | 2009-11-04 | 佳能安内华股份有限公司 | Method of production of a magnetoresistance effect device |
| CN1812051A (en) * | 2005-01-07 | 2006-08-02 | 东京毅力科创株式会社 | Substrate processing system and substrate processing program |
| CN101068949A (en) * | 2005-06-15 | 2007-11-07 | 株式会社爱发科 | Film forming device, thin-film manufacturing apparatus, and film forming method |
| WO2008126489A1 (en) * | 2007-03-30 | 2008-10-23 | Tokyo Electron Limited | Sputtering system and method for using sputtering system |
| JP2009275260A (en) * | 2008-05-14 | 2009-11-26 | Olympus Corp | Handling mechanism and film formation system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106967957A (en) * | 2015-10-01 | 2017-07-21 | 佳能特机株式会社 | The manufacture method of substrate stretching device, film formation device and film and organic electronic device |
| CN110310911A (en) * | 2019-06-26 | 2019-10-08 | 德淮半导体有限公司 | Semiconductor equipment, wafer transfer mechanism and operational method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011161745A1 (en) | 2011-12-29 |
| KR20130041089A (en) | 2013-04-24 |
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