CN101068949A - Film forming device, thin-film manufacturing apparatus, and film forming method - Google Patents
Film forming device, thin-film manufacturing apparatus, and film forming method Download PDFInfo
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- CN101068949A CN101068949A CNA2006800013382A CN200680001338A CN101068949A CN 101068949 A CN101068949 A CN 101068949A CN A2006800013382 A CNA2006800013382 A CN A2006800013382A CN 200680001338 A CN200680001338 A CN 200680001338A CN 101068949 A CN101068949 A CN 101068949A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Abstract
The invention relates to a film forming device capable of forming multiple layers of film in a short time. Each of the film forming devices (5R), (5G), and (5B) comprises a moving chamber (45) and a turn table (51). A loading plate (61) for loading a substrate (9) thereon is placed on the window part (52) of the turn table (51). When the turn table (51) is rotated and the window part (52) is moved, the loading plate (61) is moved together with the window part (52) on which the substrate (9) is loaded. By merely rotating the turn table (51) by a prescribed angle, a new substrate (9) can be fed from a carrying-in place (56a), the film-formed substrate (9) can be fed to the other film forming place (57), and the empty loading plate (61) can be returned from a carrying-out place (56b) to the carrying-in place (56a). Since all of these operations can be performed at once, a time required for carrying the substrate (9) to the places (56a), (56b), and (57) and a time required for returning the loading plate (61) can be reduced.
Description
Technical field
The invention provides a kind of film deposition system and film.
Background technology
In the past, as the organic electroluminescent element on a substrate in the film deposition system of stacked multiple film, use connects the film deposition system of a plurality of filming chamber a mobile chamber, in a filming chamber film forming substrate utilization of a kind of film be arranged at and move indoor conveyance robot and temporarily take out mobile chamber, conveyance afterwards is to other filming chamber and the new film of film forming.
Yet, in film deposition system in the past, generally speaking, 1 conveyance robot carries out taking out of of substrate and moves into, when therefore making a plurality of substrate with a film deposition system simultaneously, time-consuming problem on the moving into, take out of of substrate is arranged between mobile chamber and a plurality of filming chamber.
If a plurality of conveyance robot is set, spend the time of moving into, taking out of at substrate though can shorten, but in order to ensure the place that is provided with of conveyance robot, and maximized in mobile chamber, and the quantity of conveyance robot also can increase, and correspondingly causes the film deposition system price high.
A plurality of film deposition sources are listed as linearity, make a plurality of substrates film deposition system by the tandem type that constitutes on each film deposition source successively, the mobile simultaneously multi-piece substrate owing to the conveyance robot that does not need complex structure, therefore can shorten substrate is delivered to the time required on the film deposition source, but the film deposition system of tandem type also there is the spatial problem that is provided with that needs broad.
Moreover the film deposition system of tandem type rotates and the conveyance substrate rotation roller of load board, can produce dust during the rotation of rotation roller.On film deposition source, the rotation roller need be arranged on the film deposition source during moving substrate, when this dust drops in the film deposition source, the problem of polluting film deposition source be arranged also.
Patent documentation 1: TOHKEMY 2003-27213 communique
Summary of the invention
The present invention makes in order to solve above-mentioned the problems of the prior art, its purpose be to provide a kind of when the continuous film forming multi-piece substrate, can shorten produce pitch time and be provided with the place narrow also can film deposition system.
In order to solve above-mentioned class, the present invention is a kind of film deposition system, it is characterized in that, comprising: mobile chamber; Be disposed at the above-mentioned indoor turntable that moves; A plurality of filming chamber that are connected with above-mentioned mobile chamber respectively, above-mentioned each filming chamber has the film deposition source that is disposed at above-mentioned turntable below, above-mentioned film deposition source is emitted the film forming material particle, on above-mentioned turntable, be formed with a plurality of window portion, in above-mentioned each window portion, dispose can mounting process object thing the mounting plate, make above-mentioned turntable when the horizontal plane internal rotation, above-mentioned each window portion can move to the film forming place of above-mentioned film deposition source top.
The present invention is a film deposition system, and above-mentioned window portion forms a line on the same circumference at center with separating equal intervals, and when making above-mentioned window portion be still in a film forming place, above-mentioned window portion also is still in other film forming place.
The present invention is a film deposition system, above-mentioned mobile chamber is connected with moves into the chamber, move into the indoor conveyance robot that disposes above-mentioned, the mobile route that above-mentioned window portion moves is provided with the above-mentioned process object thing mounting moved into from the above-mentioned chamber of moving into by above-mentioned conveyance robot and moves into the place on above-mentioned mounting plate, the number of above-mentioned window portion is more than the number in film forming place, when making above-mentioned window portion be still in above-mentioned each film forming place respectively, above-mentioned window portion also is still in the above-mentioned place of moving into.
The present invention is a film deposition system, above-mentioned mobile chamber is connected with moves into the chamber, move into the indoor conveyance robot that disposes above-mentioned, above-mentioned mobile route is provided with by above-mentioned conveyance robot above-mentioned process object thing is taken out of the place of moving into of taking out of the chamber to above-mentioned from the above-mentioned mounting plate in the above-mentioned window portion, it is above-mentioned when moving into the place that above-mentioned window portion is still in, and above-mentioned window portion also is still in the above-mentioned place of taking out of.
The present invention is a film deposition system, above-mentioned film forming place is arranged in above-mentioned move into place and above-mentioned taking out of between the place, above-mentioned move into the place and and the above-mentioned above-mentioned film forming place of moving into the place adjacency between the interval, above-mentioned take out of the place and and above-mentioned above-mentioned film forming place of taking out of the place adjacency between the interval, and above-mentioned film forming place and above-mentioned film forming place between the interval mutually about equally.
The present invention is a film deposition system, and the above-mentioned place of taking out of is identical with the interval between above-mentioned film forming place and the above-mentioned film forming place with the above-mentioned interval of moving between the place.
The present invention is a film deposition system, above-mentioned mounting plate has than little mounting portion of above-mentioned window portion and is arranged at claw around the above-mentioned mounting portion, this claw of this mounting plate is equipped on the edge of above-mentioned window portion and is disposed in the above-mentioned window portion, above-mentioned window portion has breach around, be positioned at the above-mentioned mounting plate rotation above the above-mentioned turntable and make under the state of position consistency of above-mentioned claw and above-mentioned breach making, above-mentioned claw is by being positioned at the above-mentioned breach of the above-mentioned window portion in the above-mentioned filming chamber, and above-mentioned mounting plate moves to the below of above-mentioned turntable.
The present invention is a film deposition system, has the maintaining part that can keep above-mentioned mounting plate, and above-mentioned mounting plate is in that remain under the state of above-mentioned maintaining part can be with above-mentioned maintaining part by above-mentioned window portion.
The present invention is a film deposition system, and above-mentioned maintaining part can be with the above-mentioned mounting plate that remains in above-mentioned maintaining part at the horizontal plane internal rotation.
The present invention is the manufacturing installation with a plurality of film deposition systems, it is characterized in that, above-mentioned each film deposition system has: mobile chamber; Be disposed at the above-mentioned indoor turntable that moves; A plurality of filming chamber that are connected with above-mentioned mobile chamber respectively, above-mentioned each filming chamber has the film deposition source that is disposed at above-mentioned turntable below, above-mentioned film deposition source is emitted the film forming material particle, be formed with a plurality of window portion at above-mentioned turntable, in above-mentioned each window portion, dispose can mounting process object thing the mounting plate, make above-mentioned turntable when the horizontal plane internal rotation, above-mentioned each window portion can move to the film forming place of above-mentioned film deposition source top, above-mentioned each chamber of moving is connected with respectively to be moved into the chamber and takes out of the chamber, dispose the conveyance robot respectively in above-mentioned inside and the above-mentioned inside of taking out of the chamber of moving into the chamber, on the mobile route that above-mentioned window portion moves, be respectively arranged with: on above-mentioned mounting plate, move into the place from the above-mentioned above-mentioned process object thing mounting moved into the chamber moved into by above-mentioned conveyance robot; With by above-mentioned conveyance robot above-mentioned process object thing is taken out of the place of taking out of of taking out of the chamber to above-mentioned from the above-mentioned mounting plate in the above-mentioned window portion, the number of above-mentioned window portion is more than the number in film forming place, when making above-mentioned window portion be still in above-mentioned each film forming place respectively, above-mentioned window portion also is still in above-mentioned place and the above-mentioned place of taking out of moved into respectively, and the above-mentioned chamber of moving into of an above-mentioned filming chamber is connected with the above-mentioned chamber of taking out of of other above-mentioned filming chamber.
The present invention is a film, substrate is transported on a plurality of film deposition sources successively, on above-mentioned each film deposition source, make the film forming material of emitting arrive the aforesaid substrate surface respectively from above-mentioned film deposition source, film forms the above-mentioned film forming material of multiwalled on the aforesaid substrate surface, be disposed at mounting aforesaid substrate on the turntable of a plurality of above-mentioned film deposition sources, make above-mentioned turntable at the horizontal plane internal rotation, aforesaid substrate is transported on the above-mentioned film deposition source successively.
The present invention is a film, the window portion that is arranged at above-mentioned turntable is still in respectively on the above-mentioned film deposition source, above-mentioned each window portion that aforesaid substrate is passed through on the above-mentioned film deposition source descends, make 1 aforesaid substrate respectively near above-mentioned each film deposition source, film forming is carried out on the surface to aforesaid substrate on above-mentioned each film deposition source.
According to the present invention, owing to once carry out: from moving into the place with the operation of substrate transferring to file leader's film forming place; Substrate is delivered to the operation in other film forming places from a film forming place; Substrate is delivered to the operation of taking out of the place from last film forming place; From taking out of the place mounting plate of sky is returned to the operation of moving into the place, therefore can shorten the time of substrate transferring to each place.The moving into of substrate taken out of and all carried out on identical turntable to moving of film forming place, compares with tandem type in the past therefore that the place is set is narrow also harmless.Owing to carry out the conveyance of substrate by the rotation of turntable, therefore on film deposition source, can not produce dust, can not pollute film deposition source yet.
Description of drawings
Fig. 1 is the sectional view of an example of explanation organic electroluminescent device.
Fig. 2 is the figure of an example of explanation manufacturing installation of the present invention.
Fig. 3 is the part sectioned view of film deposition system of the present invention.
Fig. 4 is the explanatory view of moving into place, film forming place and taking out of the position relation in place.
Fig. 5 is the vertical view of mounting plate.
Fig. 6 (a) is with the vertical view of mounting plate mounting when the edge of window portion, and Fig. 6 (b) is the vertical view of mounting plate during by window portion.
It (b) is the sectional view that explanation makes the operation of mounting plate decline that Fig. 7 (a) reaches.
It (b) is the sectional view that explanation makes the operation of mounting plate rising that Fig. 8 (a) reaches.
Fig. 9 (a) to (c) is the sectional view that the operation of organic electroluminescent device is made in explanation.
Label declaration
1: manufacturing installation
5R, 5G, 5B: film deposition system
30: filming chamber
35: film deposition source
45: mobile chamber
48: maintaining part
50: the process object thing
51: turntable
52: window portion
53: breach
56a: move into the place
56b: take out of the place
57: the film forming place
61: the mounting plate
62: mounting portion
63: claw
C: rotation center
Embodiment
An example of the organic electroluminescent device of film deposition system manufacturing of the present invention is used in Reference numeral 10 expressions of Fig. 1.Organic electroluminescent device 10 has transparent supporting plate 11.The surface of supporting plate 11 disposes the next door 29 of convex regularly, disposes lower electrode film 13 between the next door 29.
On lower electrode film 13, dispose different trichromatic luminous point 20R, 20G, 20B.Luminous point 20R, 20G, 20B have redness, green or blue luminescent layer 16R, 16G, 16B at this, when applying voltage and switch between the upper electrode film 19 of topmost and lower electrode film 13, send red light, green light, blue light respectively.
At this, each luminous point 20R, 20G, 20B are except the color difference of luminescent layer 16R, 16G, 16B, all the other have identical formation, each luminous point 20R, 20G, 20B are made of hole injection layer 14, hole transmission layer 15, luminescent layer 16R, 16G, 16B, electron transfer layer 17, electron injecting layer 18 and upper electrode film 19 from lower floor.
An example of the manufacturing installation of the present invention of above-mentioned organic electroluminescent device 10 is made in Reference numeral 1 expression of Fig. 2.This manufacturing installation 1 has: move into the A of portion, become membranous part L and take out of the M of portion.Become membranous part L to have film deposition system 5R, 5G, the 5B of platform at the most.
Each film deposition system 5R, 5G, 5B are identical construction, at first, each film deposition system 5R, 5G, 5B are described.Each film deposition system 5R, 5G, 5B have mobile chamber 45 respectively, move into chamber 41 and take out of chamber 42, move into chamber 41 and take out of chamber 42 and be connected with mobile chamber 45.
Diapire in mobile chamber 45 is hermetic inserted logical turning axle 77, and turntable 51 (Fig. 3) is installed in the top.Exterior arrangement in mobile chamber 45 has first motor 76, the lower end of turning axle 77 is connected with first motor 76, when making 76 actions of first motor, the internal space and the outside atmosphere gas of mobile chamber 45 are cut off, turning axle 77 is that the center rotates with its rotation P, and turntable 51 is that the center rotates with turning axle 77 with rotation P.
At this, rotation P is towards vertical direction, and turntable 51 becomes and flatly is installed on turning axle 77, so turntable 51 is at the horizontal plane internal rotation.The reference number C of Fig. 4 is the point on the rotation P, the rotation center of expression turntable 51.
In the circular window portion 52 that turntable 51 forms more than 4, its front from turntable 51 connects to the back side.Each window portion 52 to be centered close to rotation center C be on the circumference of identical circle at center, when turntable 51 was the center rotation with this rotation center C, window portion 52 was made as mobile route with above-mentioned circumference and moves along above-mentioned circumference.
When the center that will link adjacent window portion 52 and these 2 angles that line segment constituted of rotation center C are made as between window portion the center angle, the center angle is what equate in each window portion 52 between window portion, thereby, link the window portion 52 abut one another the center circular arc length, promptly in the adjacent window portion 52 between in the heart the window portion of above-mentioned circumference distance equate that each window portion 52 reserves uniformly-spaced along mobile route and disposes.
In the internal configuration of moving into chamber 41 and taking out of chamber 42 not shown conveyance robot is arranged.The Reference numeral 50 expression process object things of Fig. 4.On the mobile route of window portion 52, be set with: dispose by what move into that conveyance robot in the chamber 41 moves into process object thing 50 in the mobile chamber 45 and move into place 56a; And move to the conveyance robots that take out of in the chamber 42 and take out of chamber 42 from mobile chamber 45 take out of place 56b.
Diapire in mobile chamber 45 is provided with a plurality of communicating poress 55.The center of each communicating pores 55 with the radius identical with fenestrate 52 circumference of configuration arow to be disposed at identical rotation C be on the circumference at center.
The quantity of communicating pores 55 is lacked 2 than the quantity of window portion 52, when moving into place 56a and taking out of place 56b when respectively disposing a window portion 52, each communicating pores 55 be configured to be positioned at other window portion 52 under.
Below each communicating pores 55, dispose filming chamber 30 respectively.Each filming chamber 30 has vacuum tank 31.Be formed with the Link Port 36 that constitutes by communicating pores at the top of vacuum tank 31, be tightly connected around the edge section of the Link Port 36 of filming chamber 30 and the above-mentioned communicating pores 55, so the internal space of the internal space of vacuum tank 31 and mobile chamber 45 is connected with communicating pores 55 via Link Port 36.
Each communicating pores 55 arow is disposed on the circumference, with with the communicating pores 55 of moving into place 56a adjoining position be beginning, to be made as afterbody with the communicating pores 55 of taking out of place 56b adjoining position, in each communicating pores 55, the communicating pores 55 to the end of communicating pores 55 from the outset, with and window portion 52 between the interval identical distance dispose along the circumference arow.
Be positioned in window portion 52 and move into place 56a and take out of under the state on the 56b of place, when making turntable 51 static, except being positioned at the window portion 52 that moves into place 56a and taking out of the window portion 52 of place 56b, communicating pores 55 be positioned at each window portion 52 under.
When the top position with the communicating pores on the mobile route of window portion 52 55 was made as film forming place 57, moving into place 56a, taking out of place 56b and film forming place 57 was that the center forms row and is configured on the identical circumference with rotation center C.
In film forming place 57, be made as file leader's film forming place 57 on the communicating pores 55 with the file leader, be made as last film forming place 57 on the communicating pores 55 with the last person, when the window portion 52 that is moving into place 56a revolving-turret 51 on the sense of rotation in file leader's film forming place 57, and when making a window portion on the place move to the place of adjacency, other window portion also moves to the place of adjacency.Therefore, when the window portion 52 that moves into place 56a moves to file leader's film forming place 57, when the window portion 52 in film forming place 57 moved to the film forming place 57 of adjacency on sense of rotation or takes out of place 56b, the window portion 52 that takes out of place 56b turned back to and moves into place 56a.
In each window portion 52 mounting mounting plate 61 is arranged, when window portion 52 moved, mounting plate 61 also moved together.With reference to Fig. 5, when mounting plate 61 was described, mounting plate 61 had: discoid mounting portion 62, the outstanding claw more than 1 or 2 63 and the opening 64 that is arranged on mounting portion 62 around the mounting portion 62.
At this, claw 63 is a plurality of, each claw 63 be configured in equably mounting portion 62 around, the distance till from the center of mounting portion 62 to the front end of each claw 63 is bigger than the distance till from the center of window portion 52 to the edge of window portion 52.
Thereby shown in Fig. 6 (a), when mounting portion 62 more was positioned at the inboard than the edge of window portion 52, the front end of each claw 63 was equipped on the edge of window portion 52.Mounting portion 62 forms littler than window portion 52, and when the front end of each claw 63 was equipped on the edge of window portion 52, mounting portion 62 remained on the place, periphery inside than window portion 52.
Fig. 3 is expression window portion 52 and is disposed at process object thing 50 immobilized state in film forming place 57 in the window portion 52.As shown in Figure 3, dispose second motor 49 respectively in the top position of the communicating pores 55 of 45 outsides, mobile chamber.Hermetic vertical inserting is connected with lifting shaft 47 in mobile chamber 45, and the upper end of lifting shaft 47 is installed on second motor 49, in the mode that is positioned at directly over the communicating pores 55 maintaining part 48 is installed in the lower end of lifting shaft 47.
Maintaining part 48 has not shown holding device, can keep mounting plate 61.When mounting plate 61 was made of by the adsorbed material of magnetic force metal etc., holding device for example constituted with electro-magnet, and when mounting plate 61 is provided with the latch for printed circuit of projection etc., at holding device hook was set, and made dogging terminate in latch for printed circuit and can keep mounting plate 61.
Shown in Fig. 7 (a), maintaining part 48 constitute can be directly over mounting plate 61 position static, when being descended, maintaining part 48 contact and during with electro-magnet formation holding device with mounting plate 61, when energising produces magnetic, mounting plate 61 is adsorbed on maintaining part 48, when maintaining part 48 rose, mounting plate 61 was from turntable 51 be picked up (Fig. 7 (b)).
On position corresponding around the window portion 52 with claw 63, be provided with claw 63 identical numbers or more than the breach 53 of the quantity of claw 63, make maintaining part 48 rotations, make a claw 63 be still in breach 53 directly over during the position, other claw 63 also be still in respectively other breach 53 directly over position (Fig. 6 (b)).
The shape of claw 63 is littler than breach 53, and the profile of maintaining part 48 is littler than window portion 52.Thereby, when make claw 63 be positioned at breach 53 directly over and when vertically descending, mounting plate 61 and maintaining part 48 can not passed through contiguously with the periphery of window portion 52.
On this mounting plate 61, be equipped with the process object thing of moving into chamber 41 from moving into 50.The profile of process object thing 50 makes mounting plate 61 lifting moving also less than window portion 52 with maintaining part 48, can make the process object thing be positioned at turntable 51 above or below position (Fig. 8 (a)).
Again, remain in the mounting plate 61 of maintaining part 48, make claw 63 keep out of the way, claw 63 is equipped on the edge of window portion 52 from breach 53 making maintaining part 48 rotation and when eliminating the adsorptive power of maintaining part 48, can make process object thing 50 be positioned at (Fig. 8 (b)) on the turntable 51.
Be provided with opening 64 at mounting plate 61, process object thing 50 exposes to the bottom surface of opening 64.Mounting plate 61 is moved to than turntable 51 below more, and when dropping to than the inside of communicating pores 55 or communicating pores 55 more during the position of below, the process object thing 50 on the mounting plate 61 is via the internal space of opening 64 in the face of vacuum tank 31.
As shown in Figure 3, in the internal configuration of vacuum tank 31 film deposition source 35 is arranged, film deposition source 35 has one or more container 32,33.In each container 32,33, dispose deposition material respectively, face under the state of vacuum tank 31 at process object thing 50, emit the steam of deposition material respectively from one or more container 32,33, the opening of this steam by the mask of opening 64 bottom surfaces arrives substrate and forms film.
To be made as the file leader with the vacuum tank 31 in the film forming place of moving into place 56a adjacency, to be made as the last person with the vacuum tank 31 in the film forming place 57 of taking out of place 56b adjacency, dispose the organism of hole injection material and hole transport ability at file leader's vacuum tank 31, after vacuum tank 31 dispose the organism of electron-transporting and as the color development organism of additive.
Again, dispose the material of electronics injection, dispose electrode materials at the last person's vacuum tank 31 at next vacuum tank 31.
Copper phthalocyanine), hole transport ability material (α-NPD for example each film deposition system 5R, 5G, 5B dispose: hole injection material (CuPC for example:; 2[N-(1-naphthyl)-N-phenyl] p-diaminodiphenyl), electron-transporting material (Alq3 for example; Oxine aluminium (Tris (8-hydroxyquinoline) aluminum) misfit thing), electronics injection material (LiF for example; Lithium fluoride) and electrode materials (for example metallic aluminium).Again, additive is different in each film deposition system 5R, 5G, 5B, disposes the color development organism of redness, green, blueness as additive respectively at this.
When in each vacuum tank 31, emitting the steam of deposition material material, form hole injection layer 14, hole transmission layer 15, luminescent layer 16R, 16G, 16B, electron transfer layer 17, electron injecting layer 18, reach upper electrode film 19.Again, luminescent layer 16R, 16G, 16B send red, green or blue light.
Then, the operation of using above-mentioned manufacturing installation 1 manufacturing organic electroluminescent device 10 is described.
The A of the portion that moves into shown in Figure 2 has: displacement chamber 21,22, kiln 23, purge chamber 24, cooling room 25 and treat unit room 26, the substrate 9 that has cleaned is moved into displacement chamber 21,22, with non-active gas (N for example
2Gas) be directed into displacement chamber 21,22, after the environmental gas in the non-active gas displacement displacement chamber 21,22, will replace 21,22 inside, chamber and 23 inner connections of kiln, substrate 9 is moved into to kiln 23.Dry gas is directed into the inside of kiln 23, this internal medium gas is made as the dry gas environment, the moisture content on substrate 9 surfaces is removed, and moved into to purge chamber 24.24 inner produce ultraviolet ray in the purge chamber, should ultraviolet ray and decompose and remove after the pollution substance to substrate 9 surface irradiations, move in the cooling room 25.In cooling room 25, dispose not shown refrigerating unit, make after substrate 9 coolings, move into and treat in the unit room 26.
Each film deposition system 5R, 5G, 5B have not shown vacuum evacuating system, in the mobile chamber 45 of each film deposition system 5R, 5G, 5B, move into chamber 41 and move into 41 inside, chamber and be pre-formed vacuum environment.
The chamber 42 of taking out of of the file leader's of film deposition system 5R, 5G, 5B film deposition system 5R is connected with the chamber 41 of moving into of next film deposition system 5G, and the chamber 42 of taking out of of this film deposition system 5G is connected with the chamber 41 of moving into of the last person's film deposition system 5B.Treat that unit room 26 is connected with the chamber 41 of moving into of file leader's film deposition system 5R, the substrate 9 that has been cooled is at first by treating unit room 26, move into again the file leader film deposition system 5R move into chamber 41.
Moving into chamber 41 and taking out of chamber 42 of each film deposition system 5R, 5G, 5B is connected with mask holder 43,44, from mask holder 43 the mask 70R of redness usefulness is moved to and to move in the chamber 41, by not shown alignment device this mask 70R is overlapped with substrate 9, fix and formation process object thing 50 with fixing part 71.
This mask 70R is formed with opening on the position that should be formed with emitting red light point, process object thing 50 waltzs through above-mentioned film forming place 57 and forms hole injection layer 14, hole transmission layer 15, luminescent layer 16R (being redness at this), electron transfer layer 17, electron injecting layer 18 and upper electrode film 19 successively.Fig. 9 (b) represents the substrate 9 of this state, the substrate 9 that will be formed with emitting red light point 20R from mounting plate 61 conveyances of taking out of place 56b to taking out of chamber 42.
Taking out of the mounting plate 61 that place 56b removes process object thing 50 and becomes zero load, when delivering to next film forming place 57 finishing film forming in each film forming place 57 and revolving-turret 51 from film forming place 57 or taking out of place 56b, return and move into place 56a from taking out of place 56b.At this moment, be equipped with the mounting plate 61 of untreated process object thing 50 from moving into the film forming place 57 that place 56a delivers to the file leader.
So, by making turntable 51 rotations, make each window portion 52 move to next place 56a, 56b, 57, and process object thing 50 is moved towards next place 56a, 56b, 57 together, and make and be positioned at the mounting plate 61 of taking out of place 56b and return and move into place 56a.
Dispose not shown separation mechanism taking out of chamber 42, make to move to the process object thing 50 of taking out of chamber 42 and be separated into mask 70R and substrate 9, make mask 70R get back to mask holder 44, move into chamber 41 what substrate 9 was delivered to next film deposition system 5G.
The mask holder 43 of the 2nd film deposition system 5G and last film deposition system 5B contains green with mask 70G and the blue mask 70B that uses, when move into chamber 41 make these masks 70G, when 70B overlaps with substrate, opening at mask 70G, 70B only exposes the position that the position that should form green luminous point maybe should form blue luminous point, and other position is covered with mask 70G, 70B.
Indoor moving into of the 2nd film deposition system 5G, the mask 70G of green usefulness is overlapped with substrate 9, identical with the situation of above-mentioned file leader's film deposition system 5R, when in mobile chamber 45 when mobile, on the position of the emitting red light point 20R that has formed and the next luminous point that should form, be not formed with film, but on the position that should form green luminous point, form viridescent luminous point 20G (Fig. 9 (c)).
Take out of the moving in the chamber 42 of chamber 42 and last film deposition system 5B at the 2nd film deposition system 5G, mask G is replaced by the mask 70B exchange of blue usefulness, similarly in mobile chamber 45 during mobile process object thing 50, though be not formed with film at the luminous point 20R, the 20G that have formed, on the position that should form blue luminous point, be formed with blue luminous point 20B.
The portion M of moving into has discharge and treats unit room 28, and the chamber 42 of taking out of of last film deposition system 5B treats that with discharge unit room 28 is connected.The substrate 9 that will be formed with above-mentioned luminous point 20B of all kinds from mobile chamber 45 moves to takes out of chamber 42, after removing mask 70B, substrate 9 is treated that by discharge unit room 28 is fetched in the outside atmosphere gas, obtains organic electroluminescent device shown in Figure 1 10.
More than, though bright from take out of place 56b will lift mounting plate 61 after the process object thing 50 move to move into place 56a after, the situation of the process object thing 50 that mounting is new, the present invention is not limited thereto.
Also can process object thing 50 be lifted and window portion 52 that mounting plate 61 is carried is static from mounting plate 61, promptly, in identical window portion 52, new process object thing 50 is positioned on the mounting plate 61 with the conveyance robot.In a word, move into the place and take out of the place and can be made as identical place.
Do not need to be provided with respectively process object thing 50 is taken out of to the conveyance robot of mobile chamber 45 and the conveyance robot that takes out of from mobile chamber 45, and can carry out moving into and taking out of of process object thing 50 with a carrying device (for example conveyance robot) again.
The quantity of window portion 52 is not particularly limited.The quantity of window portion 52 can be made as more than the summation in the quantity of moving into place 56a, the quantity of taking out of place 56b and film forming place 57, also can work as window portion 52 and be still in when moving into place 56a and taking out of place 56b and each film forming place 57, more than one window portion 52 is still in the place beyond these places 56a, the 56b, 57.
Again, in contrast, also the quantity of window portion 52 can be made as than the quantity of moving into place 56a, take out of place 56b quantity, and the summation in film forming place 57 lack, when window portion 52 is still in when moving into place 56a, window portion 52 is not positioned at more than one film forming place 57 or takes out of place 56b.
The quantity of film deposition system 5R, 5G, 5B determines that according to the mask kind of changing its quantity is not particularly limited.The film deposition system 5R of initial conveyance substrate 9 is made as the file leader, the film deposition system 5B of last conveyance is made as the last person, film deposition system 5R with the file leader and the last person, when the film deposition system between the 5B is made as intermediary film deposition system 5G, in above-mentioned manufacturing installation 1, though the quantity of intermediary film deposition system 5G is 1, but when intermediary film deposition system 5G is many, the chamber 41 of moving into of initial intermediary film deposition system 5G is connected with the chamber 42 of taking out of of file leader's film deposition system 5R, and the chamber 41 of moving into of other intermediary film deposition system 5G is connected with the chamber 42 of taking out of of other intermediary film deposition system 5G.Again, the chamber 42 of moving into of last intermediary film deposition system 5G is connected with the chamber 41 of moving into of above-mentioned last film deposition system 5B, and the chamber 42 of taking out of of other intermediary film deposition system 5G is to be connected with other the chamber 41 of moving into of intermediary film deposition system 5G.
Again, when 1 film deposition system 5R delivers to other film deposition systems 5G, 5B with substrate 9, also can not change mask, and on by 1 film forming film of film deposition system 5R in other film deposition systems 5G, 5B stacked new film.
When a plurality of film deposition system 5R, 5G, 5B are set, also can film deposition system 5R, 5G, directly do not connect between the 5B, and between film deposition system 5R and film deposition system 5B, be provided with as other treatment chambers of cooling room, other film deposition system 5G is arrived in substrate 9 conveyances that will be handled by film forming in 1 film deposition system 5R via treatment chamber.
More than, though explanation film deposition source 35 is emitted the situation of the steam of film forming material, the present invention is not limited to this, forming sputtering film material in the film deposition source 35 and situation of emitting the sputter particle also is contained in the present invention.
If the position that mounting plate 61 is descended is the position that the particle (steam, sputter particle) of film forming material can arrive substrate 9, then also can be positioned at than communicating pores 55 position of top more.
The quantity of filming chamber 30 also has no particular limits.Again, the quantity of film forming film is not defined as 1 or 2 in the vacuum tank 31 of each filming chamber 30, can form the film more than 3 layers in 1 vacuum tank 31 yet.
More than, though the bright situation that connects filming chamber 30 at communicating pores 55, but the present invention is not limited to this, for example also other treatment chambers beyond the filming chamber 30 can be connected in communicating pores 55, make window portion 52 be still in position on the treatment chamber, in above operation, process object thing 50 is descended with mounting plate 61 and can in treatment chamber, handle process object thing 50.
More than, though illustrate manufacturing installation 1 of the present invention and manufacture method be used in the situation that organic electroluminescent device 10 is made, but the present invention is not limited thereto, the present invention is if be the sandwich of the film more than 2 layers on the identical substrate, then can be used for various purposes, also can use various film forming material.
The quantity or the shape of the shape of window portion 52 or breach 53 are not particularly limited.Again, about the shape of mounting plate 61 or the quantity or the shape of claw 63, if when mounting plate 61 when claw 63 and breach 53 are overlapping by window portion 52, the edge that mounting plate 61 was not equipped on window portion 52 when claw 63 did not overlap with breach 53 then is not particularly limited on justifying.
Claims (12)
1. film deposition system is characterized in that having:
Mobile chamber;
Be disposed at the above-mentioned indoor turntable that moves;
A plurality of filming chamber that are connected with above-mentioned mobile chamber respectively,
Above-mentioned each filming chamber has the film deposition source that is disposed at above-mentioned turntable below,
Above-mentioned film deposition source is emitted the film forming material particle,
On above-mentioned turntable, be formed with a plurality of window portion,
In above-mentioned each window portion, dispose can mounting process object thing the mounting plate,
Make above-mentioned turntable when the horizontal plane internal rotation, above-mentioned each window portion can move to the film forming place of above-mentioned film deposition source top.
2. film deposition system as claimed in claim 1 is characterized in that, above-mentioned window portion forms a line on the same circumference at center with separating equal intervals,
When making above-mentioned window portion be still in a film forming place, above-mentioned window portion also is still in other film forming place.
3. film deposition system as claimed in claim 1 is characterized in that, above-mentioned mobile chamber is connected with moves into the chamber,
Move into the indoor conveyance robot that disposes above-mentioned,
The mobile route that above-mentioned window portion moves is provided with the above-mentioned process object thing mounting moved into from the above-mentioned chamber of moving into by above-mentioned conveyance robot and moves into the place on above-mentioned mounting plate,
The number of above-mentioned window portion is more than the number in film forming place, and when making above-mentioned window portion be still in above-mentioned each film forming place respectively, above-mentioned window portion also is still in the above-mentioned place of moving into.
4. film deposition system as claimed in claim 3 is characterized in that, above-mentioned mobile chamber is connected with takes out of the chamber, takes out of the indoor conveyance robot that disposes above-mentioned,
Above-mentioned mobile route is provided with by above-mentioned conveyance robot above-mentioned process object thing is taken out of the above-mentioned place of taking out of of taking out of the chamber from the above-mentioned mounting plate in the above-mentioned window portion,
It is above-mentioned when moving into the place that above-mentioned window portion is still in, and above-mentioned window portion also is still in the above-mentioned place of taking out of.
5. film deposition system as claimed in claim 4 is characterized in that, above-mentioned film forming place is arranged in above-mentioned move into place and above-mentioned taking out of between the place,
Above-mentioned move into the place and and the above-mentioned above-mentioned film forming place of moving into the place adjacency between the interval, above-mentioned take out of the place and and above-mentioned above-mentioned film forming place of taking out of the place adjacency between the interval, and above-mentioned film forming place and above-mentioned film forming place between the interval be made as mutually about equally.
6. film deposition system as claimed in claim 5 is characterized in that, the above-mentioned place of taking out of is identical with the interval between above-mentioned film forming place and the above-mentioned film forming place with the above-mentioned interval of moving between the place.
7. film deposition system as claimed in claim 1 is characterized in that, above-mentioned mounting plate has than little mounting portion of above-mentioned window portion and is arranged at claw around the above-mentioned mounting portion,
This claw of this mounting plate is equipped on the edge of above-mentioned window portion and is disposed in the above-mentioned window portion,
Above-mentioned window portion has breach around, be positioned at the above-mentioned mounting plate rotation above the above-mentioned turntable and make under the state of position consistency of above-mentioned claw and above-mentioned breach making, above-mentioned claw is when being positioned at the above-mentioned breach of the above-mentioned window portion in the above-mentioned filming chamber, and above-mentioned mounting plate moves to the below of above-mentioned turntable.
8. film deposition system as claimed in claim 7 is characterized in that, has the maintaining part that can keep above-mentioned mounting plate,
Above-mentioned mounting plate is in that remain under the state of above-mentioned maintaining part can be with above-mentioned maintaining part by above-mentioned window portion.
9. film deposition system as claimed in claim 8 is characterized in that, above-mentioned maintaining part can be with the above-mentioned mounting plate that remains in above-mentioned maintaining part at the horizontal plane internal rotation.
10. a manufacturing installation has a plurality of film deposition systems, it is characterized in that,
Above-mentioned each film deposition system has:
Mobile chamber;
Be disposed at the above-mentioned indoor turntable that moves;
A plurality of filming chamber that are connected with above-mentioned mobile chamber respectively,
Above-mentioned each filming chamber has the film deposition source that is disposed at above-mentioned turntable below,
Above-mentioned film deposition source is emitted the film forming material particle,
On above-mentioned turntable, be formed with a plurality of window portion,
In above-mentioned each window portion, dispose can mounting process object thing the mounting plate,
Make above-mentioned turntable when the horizontal plane internal rotation, above-mentioned each window portion can move to the film forming place of above-mentioned film deposition source top,
Above-mentioned each chamber of moving is connected with respectively to be moved into the chamber and takes out of the chamber,
Dispose the conveyance robot respectively in above-mentioned inside and the above-mentioned inside of taking out of the chamber of moving into the chamber,
On the mobile route that above-mentioned window portion moves, be respectively arranged with: will on above-mentioned mounting plate, move into the place from the above-mentioned above-mentioned process object thing mounting moved into the chamber moved into by above-mentioned conveyance robot; With by above-mentioned conveyance robot above-mentioned process object thing is taken out of the place of taking out of of taking out of the chamber to above-mentioned from the above-mentioned mounting plate in the above-mentioned window portion,
The number of above-mentioned window portion is more than the number in film forming place, and when making above-mentioned window portion be still in above-mentioned each film forming place respectively, above-mentioned window portion also is still in above-mentioned place and the above-mentioned place of taking out of moved into respectively,
The above-mentioned chamber of moving into of an above-mentioned filming chamber is connected with the above-mentioned chamber of taking out of of other above-mentioned filming chamber.
11. a film is transported to substrate on a plurality of film deposition sources successively, makes the film forming material of emitting from above-mentioned film deposition source arrive the aforesaid substrate surface on above-mentioned each film deposition source respectively, forms the film of the above-mentioned film forming material of multilayer on the aforesaid substrate surface,
Mounting aforesaid substrate on the turntable that is disposed on a plurality of above-mentioned film deposition sources makes above-mentioned turntable transfer aforesaid substrate is transported on the above-mentioned film deposition source successively in the horizontal plane inward turning.
12. film as claimed in claim 11 is characterized in that, the window portion that is arranged at above-mentioned turntable is still in respectively on the above-mentioned film deposition source,
Above-mentioned each window portion that aforesaid substrate is passed through on the above-mentioned film deposition source descends, and the aforesaid substrate that makes 1 carries out film forming to the aforesaid substrate surface respectively near above-mentioned each film deposition source on above-mentioned each film deposition source.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005175491 | 2005-06-15 | ||
| JP175491/2005 | 2005-06-15 |
Publications (2)
| Publication Number | Publication Date |
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| CN101068949A true CN101068949A (en) | 2007-11-07 |
| CN100591799C CN100591799C (en) | 2010-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200680001338A Active CN100591799C (en) | 2005-06-15 | 2006-06-08 | Film forming device, thin-film manufacturing apparatus, and film forming method |
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| Country | Link |
|---|---|
| JP (1) | JP4855398B2 (en) |
| KR (1) | KR100893843B1 (en) |
| CN (1) | CN100591799C (en) |
| TW (1) | TWI393793B (en) |
| WO (1) | WO2006134818A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102177270A (en) * | 2008-11-14 | 2011-09-07 | 株式会社爱发科 | Organic thin film deposition device, organic EL element manufacturing device, and organic thin film deposition method |
| CN102947481A (en) * | 2010-06-21 | 2013-02-27 | 株式会社爱发科 | Substrate inverting apparatus, vacuum film-forming apparatus, and substrate inverting method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017171946A (en) * | 2015-03-13 | 2017-09-28 | 株式会社アルバック | Thin film deposition system |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0611913B2 (en) * | 1986-04-25 | 1994-02-16 | 株式会社シンクロン | Thin film manufacturing equipment |
| JPH05275511A (en) * | 1991-03-01 | 1993-10-22 | Tokyo Electron Ltd | Transferring system and treating device for object to be treated |
| JPH05156442A (en) * | 1991-11-30 | 1993-06-22 | Nec Home Electron Ltd | Vacuum film forming device and sputtering device |
| TW455912B (en) * | 1999-01-22 | 2001-09-21 | Sony Corp | Method and apparatus for film deposition |
| TW552306B (en) * | 1999-03-26 | 2003-09-11 | Anelva Corp | Method of removing accumulated films from the surfaces of substrate holders in film deposition apparatus, and film deposition apparatus |
| JP2002256432A (en) * | 2001-02-26 | 2002-09-11 | Stanley Electric Co Ltd | Apparatus for forming multilayer film |
| JP4463440B2 (en) * | 2001-03-02 | 2010-05-19 | 新明和工業株式会社 | Multilayer film forming method and vacuum film forming apparatus |
| JP3843225B2 (en) * | 2001-07-12 | 2006-11-08 | 日本政策投資銀行 | Organic EL device manufacturing equipment |
| JP2003303451A (en) * | 2002-04-04 | 2003-10-24 | Tdk Corp | Method for transferring substrate to film formation device for disk-like substrate, substrate transfer mechanism and mask used for the method and method for manufacturing disk-like recording medium using the method |
-
2006
- 2006-06-08 WO PCT/JP2006/311498 patent/WO2006134818A1/en active Application Filing
- 2006-06-08 JP JP2007521256A patent/JP4855398B2/en active Active
- 2006-06-08 KR KR1020077011432A patent/KR100893843B1/en active IP Right Grant
- 2006-06-08 CN CN200680001338A patent/CN100591799C/en active Active
- 2006-06-14 TW TW095121279A patent/TWI393793B/en active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102177270A (en) * | 2008-11-14 | 2011-09-07 | 株式会社爱发科 | Organic thin film deposition device, organic EL element manufacturing device, and organic thin film deposition method |
| CN102177270B (en) * | 2008-11-14 | 2013-09-04 | 株式会社爱发科 | Organic thin film deposition device, organic EL element manufacturing device, and organic thin film deposition method |
| CN102947481A (en) * | 2010-06-21 | 2013-02-27 | 株式会社爱发科 | Substrate inverting apparatus, vacuum film-forming apparatus, and substrate inverting method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200712229A (en) | 2007-04-01 |
| CN100591799C (en) | 2010-02-24 |
| TWI393793B (en) | 2013-04-21 |
| WO2006134818A1 (en) | 2006-12-21 |
| JPWO2006134818A1 (en) | 2009-01-08 |
| JP4855398B2 (en) | 2012-01-18 |
| KR100893843B1 (en) | 2009-04-17 |
| KR20070070223A (en) | 2007-07-03 |
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