WO2006134818A1 - Film forming device, thin-film manufacturing apparatus, and film forming method - Google Patents

Film forming device, thin-film manufacturing apparatus, and film forming method Download PDF

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Publication number
WO2006134818A1
WO2006134818A1 PCT/JP2006/311498 JP2006311498W WO2006134818A1 WO 2006134818 A1 WO2006134818 A1 WO 2006134818A1 JP 2006311498 W JP2006311498 W JP 2006311498W WO 2006134818 A1 WO2006134818 A1 WO 2006134818A1
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WO
WIPO (PCT)
Prior art keywords
film forming
chamber
film
carry
window
Prior art date
Application number
PCT/JP2006/311498
Other languages
French (fr)
Japanese (ja)
Inventor
Toshio Negishi
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to JP2007521256A priority Critical patent/JP4855398B2/en
Publication of WO2006134818A1 publication Critical patent/WO2006134818A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002Preparing wafers
    • H01L21/02005Preparing bulk and homogeneous wafers
    • H01L21/02008Multistep processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Definitions

  • Film forming apparatus thin film manufacturing apparatus, and film forming method
  • the present invention provides a film forming apparatus and a film forming method.
  • a film forming apparatus in which a plurality of types of films are stacked on one substrate, such as an organic EL element, includes a film forming apparatus in which a plurality of film forming chambers are connected to one moving chamber.
  • the substrate on which one type of film is formed in one film forming chamber is once taken out to the moving chamber by a transfer robot installed in the moving chamber and then transferred to another film forming chamber. A new film is formed.
  • An in-line type film forming apparatus configured such that a plurality of film forming sources are arranged in a straight line and a plurality of substrates pass in sequence on each film forming source does not require a complicated structure of a transfer robot.
  • the time required to send the substrate onto the deposition source can be shortened.
  • the in-line type deposition system has the problem of requiring a large installation space.
  • in-line type film forming apparatuses rotate a rotating roller on which a substrate is placed to convey the substrate, and dust may be generated when the rotating roller rotates.
  • the substrate is moved on the film forming source, it is necessary to install a rotating roller on the film forming source. If the dust falls on the film forming source, the film forming source is contaminated.
  • Patent Document 1 Japanese Patent Laid-Open No. 2003-27213
  • the present invention was created to solve the above-described disadvantages of the prior art.
  • the purpose of the present invention is to shorten the tact time and narrow the installation place when continuously forming a plurality of substrates.
  • the present invention provides a film forming apparatus.
  • the present invention provides a film forming apparatus comprising: a moving chamber; a turntable disposed in the moving chamber; and a plurality of film forming chambers connected to the moving chamber.
  • Each film forming chamber has a film forming source disposed below the turntable, and the film forming source is configured to release film forming material particles, and the turntable includes a plurality of film forming sources.
  • a window portion is formed, and a placement plate on which a processing object can be placed is disposed on each window portion, and when the turntable is rotated in a horizontal plane, each window portion is formed with the film.
  • a film forming apparatus configured to be able to move a film forming place above a source.
  • the present invention is a film forming apparatus, wherein the window portions are arranged in a line at equal intervals on the same circumference around the rotation center of the turntable, and the window portions are statically placed in one film forming location.
  • the film forming apparatus is configured such that when stopped, the window portion also stops at other film forming locations.
  • the present invention is a film forming apparatus, wherein a carrying-in chamber is connected to the moving chamber, a carrying robot is arranged in the carrying-in chamber, and a moving robot moves on the moving path along which the window portion moves.
  • Carrying-in chamber force A carrying-in place is provided where the processed object to be carried is placed on the placing plate, and the number of the window portions is larger than the number of film-forming places.
  • the film forming apparatus is configured such that when each of the window portions is stationary, the window portion is also stationary at the loading place.
  • the present invention is a film forming apparatus, wherein a carry-out chamber is connected to the moving chamber, a transfer robot is arranged in the carry-out chamber, and the object to be processed is placed on the moving path by the transfer robot. An unloading place to be carried out from the mounting plate on the part to the unloading chamber is provided, and when the window part is made stationary at the carrying-in place, the window part is also made stationary at the unloading place. Film forming apparatus.
  • the present invention is a film forming apparatus, wherein the film forming place is arranged between the carrying-in place and the carrying-out place, and between the carrying-in place and the film-forming place adjacent to the carrying-in place.
  • a film forming apparatus in which a distance, a distance between the unloading place and the film forming place adjacent to the unloading position, and a distance between the film forming place and the film forming place are substantially equal to each other.
  • This invention is a film-forming apparatus, Comprising: The space
  • the present invention is a film forming apparatus, wherein the placement plate includes a placement portion smaller than the window portion, and a claw portion provided around the placement portion.
  • the claw portion is placed on the edge of the window portion and disposed on the window portion, the window portion has a notch in the periphery, and rotates the mounting plate located above the turntable, and the claw portion When the claw portion is allowed to pass through the notch of the window portion located on the film forming chamber in a state where the portion is aligned with the position of the notch, the mounting plate moves below the turn table.
  • the film forming apparatus is configured as described above.
  • the present invention is a film forming apparatus having a holding portion capable of holding the mounting plate, and the mounting plate is held by the holding portion and passes through the window portion together with the holding portion.
  • the film forming apparatus is configured to be possible.
  • the present invention is a film forming apparatus, wherein the holding unit is configured to be rotatable in a horizontal plane together with the mounting plate held by the holding unit.
  • the present invention is a manufacturing apparatus having a plurality of film forming apparatuses, and each of the film forming apparatuses includes a moving chamber, a turntable disposed in the moving chamber, and a plurality of components connected to the moving chamber.
  • Each film forming chamber has a film forming source disposed below the turntable, and the film forming source is configured to discharge film forming material particles, and the turntable
  • a plurality of windows are formed on each of the windows, and a mounting plate on which a processing object can be placed is disposed on each of the windows, and when the turntable is rotated in a horizontal plane
  • the unit is configured to be able to move a film forming location above the film forming source, and each moving chamber is connected to a loading chamber and a loading chamber, respectively, and is transported to the inside of the loading chamber and the inside of the unloading chamber.
  • Each robot is arranged on the moving path along which the window moves.
  • a loading place where the processing object carried in from the loading chamber by the transport robot is placed on the mounting plate, and the processing target object from the mounting plate on the window section by the transport robot.
  • Each unloading place to be unloaded to the unloading chamber is set up.
  • the number of the window portions is larger than the number of film formation locations, and when the window portions are stopped at the respective film formation locations, the window portions are also provided at the carry-in location and the carry-out location.
  • Each of the film forming chambers is configured to be stationary, and the carry-in chamber of one film forming chamber is a manufacturing apparatus connected to the carry-out chamber of the other film forming chamber.
  • the substrate is sequentially transferred onto a plurality of film forming sources, and the film forming material discharged from the film forming source is made to reach the surface of the substrate on each film forming source.
  • the present invention is a film forming method, wherein each of the windows provided on the turntable is stationary on the film forming source, the substrate is lowered through the windows on the film forming source, In this film formation method, one substrate is brought close to a film formation source, and film formation is performed on the substrate surface on each film formation source.
  • the step of sending a substrate from the carry-in location to the first deposition location, the step of sending the substrate from one deposition location to another deposition location, and the delivery from the last deposition location Since the process of sending the substrate to the place and the process of returning the empty placement plate to the unloading place / loading place are performed each time, the time for carrying the substrate to each place is shortened. Since the loading and unloading of the substrate and the movement to the film formation place are all performed on the same turntable, the installation place is smaller than the conventional inline type. Since the substrate is transported by rotating the turntable, no dust is generated on the film forming source and the film forming source is not contaminated.
  • FIG. 1 is a cross-sectional view illustrating an example of an organic EL element
  • FIG. 2 is a diagram for explaining an example of the production apparatus of the present invention.
  • FIG. 3 is a partial sectional view of the film forming apparatus of the present invention.
  • FIG.4 Diagram explaining the positional relationship between the loading location, deposition location, and unloading location
  • FIG. 6 (a): Plan view when placing the placement plate on the edge of the window, (b): Placement plate is the window Plan view when passing through
  • FIG. 7 (a), (b): Cross-sectional views explaining the process of lowering the mounting plate
  • FIG. 8 (a), (b): Cross-sectional views explaining the process of raising the mounting plate
  • FIG. 9 (a) to (c): Cross-sectional views explaining the process of manufacturing an organic EL device
  • Reference numeral 10 in Fig. 1 shows an example of an organic EL element manufactured by using the film forming apparatus of the present invention.
  • the organic EL element 10 has a transparent support plate 11. Convex partition walls 29 are regularly arranged on the surface of the support plate 11, and the lower electrode film 13 is disposed between the partition walls 29.
  • light emitting dots 20R, 20G, and 20B of three different colors are arranged on the lower electrode film 13.
  • the light emitting dots 20R, 20G, and 20B have red, green, or blue light emitting layers 16R, 16G, and 16B, and a voltage is applied between the upper electrode film 19 and the lower electrode film 13 at the top. When it is energized, it emits light in red, green, and blue, respectively.
  • each of the light emitting dots 20R, 20G, and 20B has the same configuration except that the colors of the light emitting layers 16R, 16G, and 16B are different, and each of the light emitting dots 20R, 20G, and 20B has a hole from the lower layer.
  • the injection layer 14, the hole transport layer 15, the light emitting layers 16 R, 16 G, and 16 B, the electron transport layer 17, the electron injection layer 18, and the upper electrode film 19 are configured.
  • Reference numeral 1 in FIG. 2 shows an example of the manufacturing apparatus of the present invention for manufacturing the organic EL element 10.
  • the manufacturing apparatus 1 includes a carry-in part A, a film forming part L, and a carry-out part M.
  • the film forming unit L includes one or more film forming apparatuses 5R, 5G, and 5B.
  • the film forming apparatuses 5R, 5G, and 5B have the same structure. First, the film forming apparatuses 5R, 5G, and 5B will be described. Each of the film forming apparatuses 5R, 5G, and 5B includes a moving chamber 45, a loading chamber 41, and a loading chamber 42. The carry-in chamber 41 and the carry-out chamber 42 are connected to the moving chamber 45.
  • a rotating shaft 77 is inserted in an airtight manner into the bottom wall of the moving chamber 45, and a turntable 51 is attached to the upper end thereof (FIG. 3).
  • a first motor 76 is arranged outside the moving chamber 45, and the lower end of the rotating shaft 77 is connected to the first motor 76.
  • the inner space of the moving chamber 45 is Rotating shaft 77 rotates around its rotational axis P while the external atmospheric force is cut off, and turntable 51 rotates around rotational axis P together with rotating shaft 77! /.
  • the turntable 51 rotates in a horizontal plane.
  • the symbol C in FIG. 4 is a point on the rotation axis P and indicates the center of rotation of the turntable 51.
  • the turntable 51 is formed with four or more substantially circular window portions 52 penetrating the surface force to the back surface.
  • Each window 52 is located on the circumference of the same circle centered on the rotation center C, and when the turntable 51 rotates about the rotation center C, the window 52 moves along the circumference described above. And move along the circumference! /
  • the center angle between the windows is equal in each window 52. Therefore, the length of the arc connecting the centers of the adjacent window parts 52, that is, the distance between the window parts along the circumference between the centers of the adjacent window parts 52 is equal. They are arranged at regular intervals along the route.
  • a transfer robot (not shown) Inside the carry-in chamber 41 and the carry-out chamber 42, a transfer robot (not shown) is arranged.
  • Reference numeral 50 in FIG. 4 indicates a processing object.
  • the transfer robot 56 in the loading chamber 41 moves to the loading place 56a where the processing object 50 loaded into the moving chamber 45 is placed and the transfer robot in the unloading chamber 42.
  • the unloading place 56b to be loaded and unloaded from the moving chamber 45 to the unloading chamber 42 is set.
  • a plurality of through holes 55 are provided on the bottom wall of the moving chamber 45.
  • the centers of the through holes 55 are arranged in a line on the circumference centering on the same rotation axis C with the same radius as the circumference where the window portion 52 is arranged.
  • the number of through-holes 55 is two fewer than the number of window portions 52.
  • each film forming chamber 30 is disposed below each through hole 55.
  • Each film forming chamber 30 has a vacuum chamber 31.
  • a connection port 36 consisting of a through hole is formed in the ceiling of the vacuum chamber 31, and the film forming chamber 30 is hermetically connected to the periphery of the through hole 55 above the edge force of the connection port 36.
  • the internal space and the internal space of the moving chamber 45 are connected via the connection port 36 and the through hole 55.
  • the through holes 55 are arranged in a line on the circumference, with the through hole 55 at the position adjacent to the carry-in place 56a as the head, and the through hole 55 at the position adjacent to the carry-out place 56b as the tail. Then, each through hole 55 is arranged in a line along the circumference at the same interval as the interval between the window portions 52 from the first through hole 55 to the last through hole 55.
  • a through hole 55 is located directly under each window 52.
  • the unloading place 56b, and the film forming place 57 are arranged in a line on the same circumference around the rotation center C.
  • the window portion 52 of the carry-in location 56a is shown.
  • the turntable 51 is rotated in the direction of rotation toward the first film deposition location 57 and the window on one location is moved to an adjacent location, the other windows are also moved to the adjacent location.
  • the carry-out place 56 b window 52 returns to entry point 56a.
  • a placement plate 61 is placed on each window 52. When the window 52 moves, the placement plate 61 also moves together.
  • the mounting plate 61 will be described with reference to FIG. 5.
  • the mounting plate 61 includes a disc-shaped mounting portion 62 and one or more of the peripheral force of the mounting portion 62 protruding.
  • a claw portion 63 and an opening 64 provided in the placement portion 62 are provided.
  • each claw portion 63 is evenly arranged around the placement portion 62, and the distance from the center of the placement portion 62 to the tip of each claw portion 63 This is larger than the distance from the center of the window 52 to the edge of the window 52.
  • the tip of each claw portion 63 gets on the edge of the window portion 52.
  • the placement part 62 is formed smaller than the window part 52, and when the tip of each claw part 63 gets on the edge of the window part 52, the placement part 62 is held inside the outer periphery of the window part 52.
  • the opening 64 is a through-hole penetrating the mounting portion 62 up to the surface force back surface, and the processing object 50 described above is placed on the edge of the opening 64 in a state where a mask to be described later is faced down. As described above, when the placement plate 61 is disposed on the window portion 52, the processing object 50 is also disposed on the window portion 52.
  • FIG. 3 shows a state in which the window portion 52 and the processing object 50 arranged on the window portion 52 are stationary at the film forming place 57.
  • a second motor 49 is disposed above the through hole 55 outside the moving chamber 45.
  • a lift shaft 47 is inserted into the moving chamber 45 in an airtight and vertical manner. The upper end of the lift shaft 47 is attached to the second motor 49, and the lower end of the lift shaft 47 is located directly above the through hole 55.
  • the holding part 48 is attached as shown.
  • the second motor 49 is configured to move the elevating shaft 47 up and down or rotationally.
  • the holding portion 48 moves up and down to rotate the elevating shaft 47.
  • the holding part 48 rotates in a horizontal plane.
  • the holding unit 48 has a holding device (not shown) and can hold the mounting plate 61.
  • the holding device can be made of, for example, an electromagnet, and the mounting plate 61 is provided with a locking member such as a protrusion.
  • the holding device can be provided with a hook and the hook can be locked to the locking member to hold the mounting plate 61.
  • the holding portion 48 is configured to be stationary at a position directly above the mounting plate 61, and the holding portion 48 is lowered and brought into contact with the mounting plate 61 for holding.
  • the mounting plate 61 is held by the holding portion 48 when a magnetic force is generated by energization.
  • the holding part 48 is lifted by being attracted to the surface, the mounting plate 61 is lifted from the turntable 51 (FIG. 7 (b)).
  • a number of notches 53 having the same number of forces as the claw portion 63 are provided at positions corresponding to the claw portion 63, and the holding portion 48 is rotated so that one claw portion 63 is rotated.
  • the other claw portions 63 are also stopped at positions immediately above the other notches 53 (Fig. 6 (b)).
  • the shape of the claw part 63 is smaller than the cut 53, and the outer shape of the holding part 48 is smaller than that of the window part 52. Therefore, when the claw part 63 is positioned right above the notch 53 and lowered vertically, the mounting plate 61 and the holding part 48 pass through without contacting the outer periphery of the window part 52. .
  • the processing object 50 carried from the carry-in chamber 41 is placed on the mounting plate 61.
  • the outer shape of the processing object 50 is also smaller than the window part 52, and the processing object can be positioned above and below the turntable 51 by moving the mounting plate 61 up and down together with the holding part 48. (Fig. 8 (a)).
  • the mounting plate 61 held by the holding part 48 rotates the holding part 48 to retract the claw part 63 from the cut 53, and put the claw part 63 on the edge of the window part 52.
  • the processing object 50 can be placed on the turntable 51 (Fig. 8 (b)
  • the mounting plate 61 is provided with an opening 64, and the processing object 50 is exposed on the bottom surface of the opening 64.
  • the processing object 50 on the mounting plate 61 passes through the opening 64. Facing the internal space of the vacuum chamber 31.
  • a film forming source 35 is disposed inside the vacuum chamber 31, and the film forming source 35 includes one or more containers 32 and 33. Vapor deposition materials are arranged in the containers 32 and 33, respectively, and vapor of the vapor deposition material is discharged from one or more containers 32 and 33 in a state where the processing object 50 faces the vacuum chamber 31. Then, the vapor reaches the substrate through the opening of the mask on the bottom surface of the opening 64, and a thin film is formed.
  • the vacuum chamber 31 of the film formation location adjacent to the carry-in location 56a starts, and is adjacent to the carry-out location 56b. If the vacuum chamber 31 of the film formation site 57 to be used is the last, a hole injecting substance and a hole transporting organic substance are arranged in the top vacuum chamber 31, and the next vacuum chamber 31 has an electron transport. An organic substance capable of feeding and a coloring organic substance as an additive are arranged.
  • the next vacuum chamber 31 is provided with an electron injecting substance, and the last vacuum chamber 31 is provided with an electrode material.
  • Each of the film forming apparatuses 5R, 5G, and 5B includes a hole injecting substance (for example, CuPC; copper phthalocyanine), a hole transporting substance (for example, ⁇ -NPD; bis [N- (1-naphthyl) -N [Fer] benzidine), an electron transporting substance (eg, Alq3; tris (8-quinolinolato) aluminum complex), an electron injecting substance (eg, LiF), and an electrode material (eg, metallic aluminum) are arranged.
  • the additive is different in each of the film forming apparatuses 5R, 5G, and 5B, and the red, green, and blue coloring organic substances are arranged here as the additive, respectively.
  • a hole injection layer 14 When the vapor of the vapor deposition material is discharged in each vacuum chamber 31, a hole injection layer 14, a hole transport layer 15, a light emitting layer 16R, 16G, 16B, an electron transport layer 17, an electron injection layer 18, and an upper electrode layer 19 is formed.
  • the light emitting layers 16R, 16G, and 16B emit light in red, green, or blue.
  • Reference numeral 9 in FIG. 9A denotes a substrate that is carried into the manufacturing apparatus and forms the organic EL element 10.
  • the substrate 9 has a support plate 11, a lower electrode film 13 formed on the surface of the support plate 11, and a partition wall 29.
  • the carry-in section A shown in FIG. 2 has replacement chambers 21 and 22, a drying chamber 23, a cleaning chamber 24, a cooling chamber 25, and a standby chamber 26, and the cleaned substrate 9
  • an inert gas for example, N2 gas
  • N2 gas for example, N2 gas
  • the inside is connected to the inside of the drying chamber 23 and the substrate 9 is carried into the drying chamber 23.
  • a drying gas is introduced into the drying chamber 23, the interior atmosphere is changed to a dry gas atmosphere, moisture on the surface of the substrate 9 is removed, and the substrate 9 is carried into the cleaning chamber 24.
  • Ultraviolet rays are generated inside the cleaning chamber 24, and the ultraviolet rays are irradiated on the surface of the substrate 9 to decompose and remove contaminants, and then are carried into the cooling chamber 25.
  • a cooling device (not shown) is arranged in the cooling chamber 25. Then, after the substrate 9 is cooled, it is carried into the standby chamber 26.
  • Each film forming apparatus 5R, 5G, 5B has an evacuation system (not shown), and the film forming apparatuses 5R, 5G, 5B have a moving chamber 45, a loading chamber 41, and a loading chamber 41 in advance. A vacuum atmosphere is formed.
  • the unloading chamber 42 of the first film forming apparatus 5R is connected to the loading chamber 41 of the next film forming apparatus 5B, and the unloading chamber 42 of the film forming apparatus 5B is the last.
  • the standby chamber 26 is connected to the carry-in chamber 41 of the first film formation apparatus 5R, and the cooled substrate 9 is first carried into the carry-in chamber 41 of the first film formation apparatus 5R through the standby chamber 26.
  • the mask stocker 43 and 44 are connected to the carry-in chamber 41 and the carry-out chamber 42 of each film forming apparatus 5R, 5G, and 5B, and the red mask 70R is moved from the mask stocker 43 to the carry-in chamber 41.
  • the mask 70R and the substrate 9 are overlapped by an alignment apparatus (not shown) and fixed by the fixing member 71 to form the processing object 50.
  • FIG. 9 (b) shows the substrate 9 in this state, and the substrate 9 on which the red light emitting dots 20R are formed also transfers the loading plate 61 force of the unloading place 56b to the unloading chamber 42.
  • the film formation at each film formation place 57 is completed, and from the film formation place 57 to the next film formation place 57 or
  • the turntable 51 rotates to be sent to the unloading place 56b
  • the unloading place 56b returns to the loading place 56a.
  • the mounting plate 61 on which the unprocessed processing object 50 is placed is sent from the carry-in location 56a to the first film-forming location 57.
  • a separation mechanism (not shown) is arranged in the unloading chamber 42, the processing object 50 moved to the unloading chamber 42 is separated into the mask 70R and the substrate 9, and the mask 70R is returned to the mask stocker 44. Base The plate 9 is sent to the loading chamber 41 of the next film forming apparatus 5G.
  • the mask stocker 43 of the second film-forming apparatus 5G and the last film-forming apparatus 5B contains a green mask 70G and a blue mask 70B.
  • a green mask 70G and a blue mask 70B When 70G and 70B are superimposed on the substrate, only the position where the green light emitting dot should be formed or the position where the blue light emitting dot should be formed is exposed at the openings of the masks 70G and 70B, and the other positions are masks. Covered with 70G, 70B.
  • a green mask 70G is superimposed on the substrate 9 in the loading chamber of the second film forming apparatus 5G, and is already formed by moving in the moving chamber 45 as in the case of the first film forming apparatus 5R. No film is formed at the position of the red light emitting dot 20R and the next light emitting dot to be formed, but the green light emitting dot 20G is formed at the position where the green light emitting dot is to be formed (FIG. 9). (c)) 0
  • the mask G is exchanged with the blue mask 70B in the carry-out chamber 42 of the second film-forming apparatus 5G and the carry-in chamber 42 of the last film-forming apparatus 5B, and the processing object 50 is similarly transferred to the moving chamber.
  • the processing object 50 is similarly transferred to the moving chamber.
  • no film is formed on the already formed light emitting dots 20R, 20G, but blue light emitting dots 20B are formed at positions where blue light emitting dots are to be formed.
  • the carry-in part M has a discharge standby chamber 28, and the carry-out chamber 42 of the last film forming apparatus 5 B is connected to the discharge standby chamber 28. If the substrate 9 on which the light emitting dots 20B of the above colors are formed is moved from the moving chamber 45 to the unloading chamber 42, the mask 70B is removed, and then the substrate 9 is taken out to the outside atmosphere through the discharge waiting chamber 28, FIG. An organic EL device 10 as shown in Fig. 1 is obtained.
  • the processing object 50 is lifted from the placement plate 61 by the transfer robot, and the window 52 on which the placement plate 61 is placed is kept stationary, that is, a new processing object 5 is placed on the same window 52. 0 may be placed on the mounting plate 61. In short, the carry-in place and the carry-out place may be the same place.
  • the number of window portions 52 is not particularly limited.
  • the number of windows 52 is larger than the sum of the number of carry-in places 56a, the number of carry-out places 56b, and the number of film-formation places 57, so that the windows at the carry-in places 56a, the carry-out places 56b, and the respective film-formation places 57
  • one or more window sections 52 may be stationary in places other than those places 56a, 56b, 57.
  • the number of window portions 52 is set to be smaller than the sum of the number of carry-in places 56a, the number of carry-out places 56b, and the number of film-forming places 57, so that the window at the carry-in place 56a When the part 52 is stationary, the window part 52 may not be positioned at one or more film forming places 57 or the unloading place 56b.
  • the number of film forming apparatuses 5R, 5G, and 5B is determined according to the type of mask to be replaced, and the number is not particularly limited.
  • the deposition apparatus 5R to which the substrate 9 is transported first is the first
  • the deposition apparatus 5B to be transported last is the last
  • the intermediate deposition apparatus 5G is between the first and last deposition apparatuses 5R and 5B.
  • the number of intermediate film forming apparatuses 5G is one.
  • the carry-in chamber 41 of the first intermediate film forming apparatus 5G is the top.
  • the carry-in chamber 41 of the other intermediate film-forming apparatus 5G is connected to the carry-out chamber 42 of the other intermediate film-forming apparatus 5G.
  • the carry-out chamber 42 of the last intermediate film formation apparatus 5G is connected to the carry-in chamber 41 of the last film formation apparatus 5B, and the carry-out chamber 42 of the other intermediate film formation apparatus 5G is another intermediate film formation. Connected to loading room 41 of device 5G.
  • the mask is not changed, and the film formed by the first film forming apparatus 5R is Laminate a new film with other film deposition equipment 5G, 5B.
  • the film forming apparatuses 5R, 5G, and 5B are not directly connected to each other, and a cooling chamber or the like is provided between the film forming apparatus 5R and the film forming apparatus 5b.
  • Another processing chamber may be provided, and the substrate 9 subjected to the film forming process by the one film forming apparatus 5R may be transferred to the other film forming apparatus 5G through the processing chamber.
  • the position where the mounting plate 61 is lowered may be a position above the through hole 55 as long as the film forming material particles (vapor, sputtered particles) can reach the substrate 9.
  • the number of film forming chambers 30 is not particularly limited.
  • the number of films to be deposited in the vacuum chamber 31 of each deposition chamber 30 is not limited to 1 or 2, and three or more layers may be formed in one vacuum chamber 31.
  • the present invention is not limited to this, for example, a processing chamber other than the film forming chamber 30 in the through hole 55. If the window 52 is stationary at a position on the processing chamber and the processing object 50 is lowered together with the mounting plate 61 in the above-described process, the processing object is processed in the processing chamber. 50 can be processed.
  • the manufacturing apparatus 1 and the manufacturing method of the present invention are used for manufacturing the organic EL element 10 has been described above, the present invention is not limited to this. Any laminate of the above films can be used for various purposes, and various film forming materials can be used.
  • the shape of the window 52 and the number and shape of the notches 53 are not particularly limited.
  • the shape of the mounting plate 61 and the number and shape of the claw parts 63 are determined so that the mounting plate 61 passes through the window part 52 when the claw part 63 and the cut 53 overlap, and the claw part 63 is cut 53.

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Abstract

A film forming device capable of forming multiple layers of film in a short time, a thin-film manufacturing apparatus, and a film forming method. Each of the film forming devices (5R), (5G), and (5B) comprises a moving chamber (45) and a turn table (51). A loading plate (61) for loading a substrate (9) thereon is placed on the window part (52) of the turn table (51). When the turn table (51) is rotated and the window part (52) is moved, the loading plate (61) is moved together with the window part (52) on which the substrate (9) is loaded. By merely rotating the turn table (51) by a prescribed angle, a new substrate (9) can be fed from a carrying-in place (56a), the film-formed substrate (9) can be fed to the other film forming place (57), and the empty loading plate (61) can be returned from a carrying-out place (56b) to the carrying-in place (56a). Since all of these operations can be performed at once, a time required for carrying the substrate (9) to the places (56a), (56b), and (57) and a time required for returning the loading plate (61) can be reduced.

Description

明 細 書  Specification
成膜装置、薄膜の製造装置、及び成膜方法  Film forming apparatus, thin film manufacturing apparatus, and film forming method
技術分野  Technical field
[0001] 本発明は成膜装置及び成膜方法を提供するものである。  The present invention provides a film forming apparatus and a film forming method.
背景技術  Background art
[0002] 従来より、有機 EL素子のように、 1つの基板上に複数種類の膜を積層する成膜装 置には、 1つの移動室に複数の成膜室が接続された成膜装置が用いられており、 1 つの成膜室で 1種類の膜が成膜された基板は、移動室内に設置された搬送ロボット で、一旦移動室に取り出された後、他の成膜室に搬送され、新たな膜が成膜される。  Conventionally, a film forming apparatus in which a plurality of types of films are stacked on one substrate, such as an organic EL element, includes a film forming apparatus in which a plurality of film forming chambers are connected to one moving chamber. The substrate on which one type of film is formed in one film forming chamber is once taken out to the moving chamber by a transfer robot installed in the moving chamber and then transferred to another film forming chamber. A new film is formed.
[0003] し力 ながら、従来の成膜装置では、通常 1台の搬送ロボットが、移動室と複数の成 膜室との間で基板の搬出入を行うため、複数の基板を同時に 1つの成膜装置で製造 する時には、基板の搬出入に時間が力かるという問題があった。  [0003] However, in the conventional film forming apparatus, since one transfer robot normally carries in and out the substrate between the moving chamber and the plurality of film forming chambers, a plurality of substrates are simultaneously formed on one substrate. When manufacturing with a membrane device, there was a problem that it took time to carry the substrate in and out.
[0004] 搬送ロボットを複数設置すれば、基板の搬出入に力かる時間を短縮できるが、搬送 ロボットの設置場所を確保するために、移動室が大型化する上、搬送ロボットの数を 増やす分、成膜装置が高価になるという問題があった。  [0004] If multiple transfer robots are installed, the time required for loading and unloading substrates can be shortened. However, in order to secure the installation location of the transfer robot, the size of the moving chamber is increased and the number of transfer robots is increased. There is a problem that the film forming apparatus becomes expensive.
[0005] 複数の成膜源を直線状に並べ、複数の基板が各成膜源上を順番に通過するように 構成されたインライン型の成膜装置は、複雑な構造の搬送ロボットが不要である上、 複数の基板が同時に移動するため、成膜源上に基板を送るのに要する時間が短くて すむ力 インライン型の成膜装置は広い設置スペースが必要になるという問題があつ た。  [0005] An in-line type film forming apparatus configured such that a plurality of film forming sources are arranged in a straight line and a plurality of substrates pass in sequence on each film forming source does not require a complicated structure of a transfer robot. In addition, since multiple substrates move at the same time, the time required to send the substrate onto the deposition source can be shortened. The in-line type deposition system has the problem of requiring a large installation space.
[0006] 更に、インライン型の成膜装置は、基板を乗せた回転ローラを回転させて、基板を 搬送させており、回転ローラが回転するときにダストが生じることがある。基板を成膜 源上で移動させる時には、回転ローラを成膜源上に設置する必要があり、そのダスト が成膜源に落下すると、成膜源が汚染されるという問題もあった。  [0006] Furthermore, in-line type film forming apparatuses rotate a rotating roller on which a substrate is placed to convey the substrate, and dust may be generated when the rotating roller rotates. When the substrate is moved on the film forming source, it is necessary to install a rotating roller on the film forming source. If the dust falls on the film forming source, the film forming source is contaminated.
特許文献 1:特開 2003— 27213号公報  Patent Document 1: Japanese Patent Laid-Open No. 2003-27213
発明の開示  Disclosure of the invention
発明が解決しょうとする課題 [0007] 本発明は上記従来技術の不都合を解決するために創作されたものであり、その目 的は、複数の基板を連続成膜する際にタクトタイムが短ぐかつ設置場所が狭くてす む成膜装置を提供することである。 Problems to be solved by the invention [0007] The present invention was created to solve the above-described disadvantages of the prior art. The purpose of the present invention is to shorten the tact time and narrow the installation place when continuously forming a plurality of substrates. The present invention provides a film forming apparatus.
課題を解決するための手段  Means for solving the problem
[0008] 上記課題を解決するために本発明は成膜装置であって、移動室と、前記移動室内 に配置されたターンテーブルと、前記移動室にそれぞれ接続された複数の成膜室と を有し、前記各成膜室は前記ターンテーブルの下方に配置された成膜源を有し、前 記成膜源は成膜材料粒子を放出するように構成され、前記ターンテーブルには複数 の窓部が形成され、前記各窓部上には、処理対象物が載置可能な載置プレートが 配置され、前記ターンテーブルを水平面内で回転させたときに、前記各窓部は前記 成膜源の上方の成膜場所を移動できるように構成された成膜装置である。 [0008] In order to solve the above problems, the present invention provides a film forming apparatus comprising: a moving chamber; a turntable disposed in the moving chamber; and a plurality of film forming chambers connected to the moving chamber. Each film forming chamber has a film forming source disposed below the turntable, and the film forming source is configured to release film forming material particles, and the turntable includes a plurality of film forming sources. A window portion is formed, and a placement plate on which a processing object can be placed is disposed on each window portion, and when the turntable is rotated in a horizontal plane, each window portion is formed with the film. A film forming apparatus configured to be able to move a film forming place above a source.
本発明は成膜装置であって、前記窓部は前記ターンテーブルの回転中心を中心と した同一円周上に一列に等間隔を空けて並べられ、一の成膜場所に前記窓部を静 止させた時に、他の成膜場所にも前記窓部が静止するように構成された成膜装置で ある。  The present invention is a film forming apparatus, wherein the window portions are arranged in a line at equal intervals on the same circumference around the rotation center of the turntable, and the window portions are statically placed in one film forming location. The film forming apparatus is configured such that when stopped, the window portion also stops at other film forming locations.
本発明は成膜装置であって、前記移動室には搬入室が接続され、前記搬入室内 には搬送ロボットが配置され、前記窓部が移動する移動経路上には、前記搬送ロボ ットによって前記搬入室力 搬入された前記処理対象物が前記載置プレート上に載 置される搬入場所が設けられ、前記窓部の個数は成膜場所の個数よりも多ぐ前記 各成膜場所に前記窓部をそれぞれ静止させたときには、前記搬入場所にも前記窓 部が静止するように構成された成膜装置である。  The present invention is a film forming apparatus, wherein a carrying-in chamber is connected to the moving chamber, a carrying robot is arranged in the carrying-in chamber, and a moving robot moves on the moving path along which the window portion moves. Carrying-in chamber force A carrying-in place is provided where the processed object to be carried is placed on the placing plate, and the number of the window portions is larger than the number of film-forming places. The film forming apparatus is configured such that when each of the window portions is stationary, the window portion is also stationary at the loading place.
本発明は成膜装置であって、前記移動室には搬出室が接続され、前記搬出室内 には搬送ロボットが配置され、前記移動経路上には、前記搬送ロボットによって前記 処理対象物が前記窓部上の前記載置プレートから前記搬出室へ搬出される搬出場 所が設けられ、前記搬入場所に前記窓部を静止させたときには、前記搬出場所にも 前記窓部が静止するように構成された成膜装置である。  The present invention is a film forming apparatus, wherein a carry-out chamber is connected to the moving chamber, a transfer robot is arranged in the carry-out chamber, and the object to be processed is placed on the moving path by the transfer robot. An unloading place to be carried out from the mounting plate on the part to the unloading chamber is provided, and when the window part is made stationary at the carrying-in place, the window part is also made stationary at the unloading place. Film forming apparatus.
本発明は成膜装置であって、前記成膜場所は、前記搬入場所と前記搬出場所の 間に並べられ、前記搬入場所と前記搬入場所に隣接する前記成膜場所との間の間 隔と、前記搬出場所と前記搬出場所に隣接する前記成膜場所との間の間隔と、前記 成膜場所と前記成膜場所との間の間隔は、互いに略等しくされた成膜装置である。 本発明は成膜装置であって、前記搬出場所と前記搬入場所との間の間隔は、前記 成膜場所と前記成膜場所との間の間隔と同じにされた成膜装置である。 The present invention is a film forming apparatus, wherein the film forming place is arranged between the carrying-in place and the carrying-out place, and between the carrying-in place and the film-forming place adjacent to the carrying-in place. A film forming apparatus in which a distance, a distance between the unloading place and the film forming place adjacent to the unloading position, and a distance between the film forming place and the film forming place are substantially equal to each other. . This invention is a film-forming apparatus, Comprising: The space | interval between the said carrying-out place and the said carrying-in place is a film-forming apparatus made the same as the space | interval between the said film-forming place and the said film-forming place.
本発明は成膜装置であって、前記載置プレートは前記窓部よりも小さな載置部と、 前記載置部の周囲に設けられた爪部とを有し、該載置プレートは、該爪部が前記窓 部の縁上に乗せられて前記窓部上に配置され、前記窓部は周囲に切れ込みを有し 、前記ターンテーブルの上方に位置する前記載置プレートを回転させ、前記爪部を 前記切れ込みの位置に一致させた状態で、前記爪部が、前記成膜室上に位置する 前記窓部の前記切れ込みを通過させられると、前記載置プレートは前記ターンテー ブルの下方に移動されるように構成された成膜装置である。  The present invention is a film forming apparatus, wherein the placement plate includes a placement portion smaller than the window portion, and a claw portion provided around the placement portion. The claw portion is placed on the edge of the window portion and disposed on the window portion, the window portion has a notch in the periphery, and rotates the mounting plate located above the turntable, and the claw portion When the claw portion is allowed to pass through the notch of the window portion located on the film forming chamber in a state where the portion is aligned with the position of the notch, the mounting plate moves below the turn table. The film forming apparatus is configured as described above.
本発明は成膜装置であって、前記載置プレートを保持可能な保持部を有し、 前記載置プレートは前記保持部に保持された状態で、前記保持部と一緒に前記窓 部を通過可能に構成された成膜装置である。  The present invention is a film forming apparatus having a holding portion capable of holding the mounting plate, and the mounting plate is held by the holding portion and passes through the window portion together with the holding portion. The film forming apparatus is configured to be possible.
本発明は成膜装置であって、前記保持部は、前記保持部に保持された前記載置 プレートと一緒に、水平面内で回転可能に構成された成膜装置である。  The present invention is a film forming apparatus, wherein the holding unit is configured to be rotatable in a horizontal plane together with the mounting plate held by the holding unit.
本発明は複数の成膜装置を有する製造装置であって、前記各成膜装置は、移動 室と、前記移動室内に配置されたターンテーブルと、前記移動室にそれぞれ接続さ れた複数の成膜室とを有し、前記各成膜室は前記ターンテーブルの下方に配置され た成膜源を有し、前記成膜源は成膜材料粒子を放出するように構成され、前記ター ンテーブルには複数の窓部が形成され、前記各窓部上には、処理対象物が載置可 能な載置プレートが配置され、前記ターンテーブルを水平面内で回転させたときに、 前記各窓部は前記成膜源の上方の成膜場所を移動できるように構成され、前記各 移動室には搬入室と搬出室がそれぞれ接続され、前記搬入室の内部と前記搬出室 の内部には搬送ロボットがそれぞれ配置され、前記窓部が移動する移動径路上には 、前記搬送ロボットによって前記搬入室から搬入された前記処理対象物が前記載置 プレート上に載置される搬入場所と、前記搬送ロボットによって前記処理対象物が前 記窓部上の前記載置プレートから前記搬出室へ搬出される搬出場所がそれぞれ設 けられ、前記窓部の個数は、成膜場所の個数よりも多ぐ前記各成膜場所に前記窓 部をそれぞれ静止させたときには、前記搬入場所と前記搬出場所にも前記窓部がそ れぞれ静止するように構成され、一の前記成膜室の前記搬入室は、他の前記成膜室 の前記搬出室に接続された製造装置である。 The present invention is a manufacturing apparatus having a plurality of film forming apparatuses, and each of the film forming apparatuses includes a moving chamber, a turntable disposed in the moving chamber, and a plurality of components connected to the moving chamber. Each film forming chamber has a film forming source disposed below the turntable, and the film forming source is configured to discharge film forming material particles, and the turntable A plurality of windows are formed on each of the windows, and a mounting plate on which a processing object can be placed is disposed on each of the windows, and when the turntable is rotated in a horizontal plane, The unit is configured to be able to move a film forming location above the film forming source, and each moving chamber is connected to a loading chamber and a loading chamber, respectively, and is transported to the inside of the loading chamber and the inside of the unloading chamber. Each robot is arranged on the moving path along which the window moves. A loading place where the processing object carried in from the loading chamber by the transport robot is placed on the mounting plate, and the processing target object from the mounting plate on the window section by the transport robot. Each unloading place to be unloaded to the unloading chamber is set up. The number of the window portions is larger than the number of film formation locations, and when the window portions are stopped at the respective film formation locations, the window portions are also provided at the carry-in location and the carry-out location. Each of the film forming chambers is configured to be stationary, and the carry-in chamber of one film forming chamber is a manufacturing apparatus connected to the carry-out chamber of the other film forming chamber.
本発明は、複数の成膜源上に基板を順番に送り、前記各成膜源上で前記基板表 面に前記成膜源カゝら放出される成膜材料をそれぞれ到達させ、前記基板表面上に 複数層の前記成膜材料の膜形成する成膜方法であって、複数の前記成膜源上に配 置されたターンテーブルに前記基板を載置し、前記ターンテーブルを水平面内で回 転させて、前記成膜源上に前記基板を順番に送る成膜方法である。  In the present invention, the substrate is sequentially transferred onto a plurality of film forming sources, and the film forming material discharged from the film forming source is made to reach the surface of the substrate on each film forming source. A film forming method for forming a plurality of layers of the film forming material on the substrate, placing the substrate on a turntable disposed on the plurality of film forming sources, and rotating the turntable in a horizontal plane. In this film forming method, the substrate is sequentially transferred onto the film forming source.
本発明は成膜方法であって、前記ターンテーブルに設けられた窓部を前記成膜源 上にそれぞれ静止させ、前記成膜源上の前記各窓部を通して前記基板をそれぞれ 下降させ、前記各成膜源に 1枚の前記基板をそれぞれ近づけ、前記各成膜源上で 前記基板表面への成膜を行う成膜方法である。  The present invention is a film forming method, wherein each of the windows provided on the turntable is stationary on the film forming source, the substrate is lowered through the windows on the film forming source, In this film formation method, one substrate is brought close to a film formation source, and film formation is performed on the substrate surface on each film formation source.
発明の効果  The invention's effect
[0009] 本発明によれば、搬入場所から先頭の成膜場所に基板を送る工程と、一の成膜場 所から他の成膜場所へ基板を送る工程と、最後の成膜場所から搬出場所へ基板を 送る工程と、空の載置プレートを搬出場所力 搬入場所へ戻す工程とがー度に行わ れるので、各場所へ基板を搬送する時間が短縮される。基板の搬出入と、成膜場所 への移動は全て同じターンテーブル上で行われるので、従来のインライン型に比べ て設置場所が狭くてすむ。基板の搬送はターンテーブルの回転によって行われるた め、成膜源上でダストが発生せず、成膜源が汚染されない。  [0009] According to the present invention, the step of sending a substrate from the carry-in location to the first deposition location, the step of sending the substrate from one deposition location to another deposition location, and the delivery from the last deposition location Since the process of sending the substrate to the place and the process of returning the empty placement plate to the unloading place / loading place are performed each time, the time for carrying the substrate to each place is shortened. Since the loading and unloading of the substrate and the movement to the film formation place are all performed on the same turntable, the installation place is smaller than the conventional inline type. Since the substrate is transported by rotating the turntable, no dust is generated on the film forming source and the film forming source is not contaminated.
図面の簡単な説明  Brief Description of Drawings
[0010] [図 1]有機 EL素子の一例を説明する断面図 [0010] FIG. 1 is a cross-sectional view illustrating an example of an organic EL element
[図 2]本発明の製造装置の一例を説明する図  FIG. 2 is a diagram for explaining an example of the production apparatus of the present invention.
[図 3]本発明の成膜装置の部分断面図  FIG. 3 is a partial sectional view of the film forming apparatus of the present invention.
[図 4]搬入場所と成膜場所と搬出場所の位置関係を説明する図  [Fig.4] Diagram explaining the positional relationship between the loading location, deposition location, and unloading location
[図 5]載置プレートの平面図  [Figure 5] Plan view of mounting plate
[図 6] (a):載置プレートを窓部の縁に乗せるときの平面図、(b):載置プレートが窓部 を通過する時の平面図 [Fig. 6] (a): Plan view when placing the placement plate on the edge of the window, (b): Placement plate is the window Plan view when passing through
[図 7] (a)、 (b):載置プレートを下降させる工程を説明する断面図  [FIG. 7] (a), (b): Cross-sectional views explaining the process of lowering the mounting plate
[図 8] (a)、 (b):載置プレートを上昇させる工程を説明する断面図  [FIG. 8] (a), (b): Cross-sectional views explaining the process of raising the mounting plate
[図 9] (a)〜 (c):有機 EL素子を製造する工程を説明する断面図  [FIG. 9] (a) to (c): Cross-sectional views explaining the process of manufacturing an organic EL device
符号の説明  Explanation of symbols
[0011] 1……製造装置 5R、 5G、5B……成膜装置 30……成膜室 35……成膜 源 45……移動室 48……保持部 50……処理対象物 51……ターンテー ブル 52……窓部 53……切れ込み 56a……搬入場所 56b……搬出場 所 57……成膜場所 61……載置プレート 62……載置部 63……爪部 C……回転中心  [0011] 1 …… Manufacturing equipment 5R, 5G, 5B …… Deposition equipment 30 …… Deposition chamber 35 …… Deposition source 45 …… Transfer chamber 48 …… Holding part 50 …… Processing object 51 …… Turn table Bull 52 …… Window 53 …… Incision 56a …… Loading place 56b …… Unloading place 57 …… Deposition place 61 …… Mounting plate 62 …… Mounting part 63 …… Claw part C …… Center of rotation
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0012] 図 1の符号 10は本発明の成膜装置を用いて製造される有機 EL素子の一例を示し ている。有機 EL素子 10は、透明な支持板 11を有している。支持板 11の表面は、凸 状の隔壁 29が規則正しく配置されており、隔壁 29の間には、下部電極膜 13が配置 されている。 [0012] Reference numeral 10 in Fig. 1 shows an example of an organic EL element manufactured by using the film forming apparatus of the present invention. The organic EL element 10 has a transparent support plate 11. Convex partition walls 29 are regularly arranged on the surface of the support plate 11, and the lower electrode film 13 is disposed between the partition walls 29.
[0013] 下部電極膜 13上には、異なる三色の発光ドット 20R、 20G、 20Bが配置されている 。発光ドット 20R、 20G、 20Bは、ここでは赤色、緑色、又は青色の発光層 16R、 16G 、 16Bを有しており、最上部の上部電極膜 19と下部電極膜 13の間に電圧を印加し て通電すると、赤色、緑色、青色にそれぞれ発光するようになっている。  [0013] On the lower electrode film 13, light emitting dots 20R, 20G, and 20B of three different colors are arranged. Here, the light emitting dots 20R, 20G, and 20B have red, green, or blue light emitting layers 16R, 16G, and 16B, and a voltage is applied between the upper electrode film 19 and the lower electrode film 13 at the top. When it is energized, it emits light in red, green, and blue, respectively.
[0014] ここでは、各発光ドット 20R、 20G、 20Bは、発光層 16R、 16G, 16Bの色が異なる 以外は同じ構成を有しており、各発光ドット 20R、 20G、 20Bは下層から、ホール注 入層 14と、ホール輸送層 15と、発光層 16R、 16G、 16Bと、電子輸送層 17と、電子 注入層 18と、上部電極膜 19とで構成されている。  Here, each of the light emitting dots 20R, 20G, and 20B has the same configuration except that the colors of the light emitting layers 16R, 16G, and 16B are different, and each of the light emitting dots 20R, 20G, and 20B has a hole from the lower layer. The injection layer 14, the hole transport layer 15, the light emitting layers 16 R, 16 G, and 16 B, the electron transport layer 17, the electron injection layer 18, and the upper electrode film 19 are configured.
[0015] 図 2の符号 1は、上記有機 EL素子 10を製造する本発明の製造装置の一例を示し ている。この製造装置 1は、搬入部 Aと、成膜部 Lと、搬出部 Mとを有している。成膜 部 Lは、一乃至複数台の成膜装置 5R、 5G、 5Bを有している。  Reference numeral 1 in FIG. 2 shows an example of the manufacturing apparatus of the present invention for manufacturing the organic EL element 10. The manufacturing apparatus 1 includes a carry-in part A, a film forming part L, and a carry-out part M. The film forming unit L includes one or more film forming apparatuses 5R, 5G, and 5B.
[0016] 各成膜装置 5R、 5G、 5Bは同じ構造であり、先ず、各成膜装置 5R、 5G、 5Bを説明 する。各成膜装置 5R、 5G、 5Bは、移動室 45と、搬入室 41と、搬出室 42とをそれぞ れ有しており、搬入室 41と搬出室 42は移動室 45に接続されている。 [0016] The film forming apparatuses 5R, 5G, and 5B have the same structure. First, the film forming apparatuses 5R, 5G, and 5B will be described. Each of the film forming apparatuses 5R, 5G, and 5B includes a moving chamber 45, a loading chamber 41, and a loading chamber 42. The carry-in chamber 41 and the carry-out chamber 42 are connected to the moving chamber 45.
[0017] 移動室 45の底壁には回転軸 77が気密に挿通されており、その上端にはターンテ 一ブル 51が取り付けられている(図 3)。移動室 45の外部には第一のモータ 76が配 置されており、回転軸 77の下端は第一のモータ 76に接続され、第一のモータ 76を 動作させると、移動室 45の内部空間を外部雰囲気力も遮断したまま、回転軸 77がそ の回転軸線 Pを中心として回転し、回転軸 77と一緒にターンテーブル 51が回転軸線 Pを中心として回転するようになって!/、る。 A rotating shaft 77 is inserted in an airtight manner into the bottom wall of the moving chamber 45, and a turntable 51 is attached to the upper end thereof (FIG. 3). A first motor 76 is arranged outside the moving chamber 45, and the lower end of the rotating shaft 77 is connected to the first motor 76. When the first motor 76 is operated, the inner space of the moving chamber 45 is Rotating shaft 77 rotates around its rotational axis P while the external atmospheric force is cut off, and turntable 51 rotates around rotational axis P together with rotating shaft 77! /.
[0018] ここでは、回転軸線 Pは垂直に向けられ、ターンテーブル 51は水平になるように回 転軸 77に取り付けられているので、ターンテーブル 51は水平面内で回転するように なっている。図 4の符号 Cは回転軸線 P上の点であり、ターンテーブル 51の回転中心 を示している。 Here, since the rotation axis P is oriented vertically and the turntable 51 is attached to the rotation shaft 77 so as to be horizontal, the turntable 51 rotates in a horizontal plane. The symbol C in FIG. 4 is a point on the rotation axis P and indicates the center of rotation of the turntable 51.
[0019] ターンテーブル 51には表面力も裏面までを貫通する略円形の窓部 52が 4つ以上 形成されている。各窓部 52はその中心が回転中心 Cを中心とする同一の円の円周 上に位置し、ターンテーブル 51がその回転中心 Cを中心として回転すると、窓部 52 は上記円周を移動経路とし、上記円周に沿って移動するようになって!/、る。  [0019] The turntable 51 is formed with four or more substantially circular window portions 52 penetrating the surface force to the back surface. Each window 52 is located on the circumference of the same circle centered on the rotation center C, and when the turntable 51 rotates about the rotation center C, the window 52 moves along the circumference described above. And move along the circumference! /
[0020] 隣接する窓部 52の中心と回転中心 Cとを結んだ 2つの線分の成す角度を窓部間中 心角度とすると、窓部間中心角度は、各窓部 52において等しくなつており、従って、 互いに隣接する窓部 52の中心を結ぶ円弧の長さ、即ち、隣接する窓部 52の中心間 の上記円周に沿った窓部間距離は等しぐ各窓部 52は移動経路に沿って等間隔を あけて配置されている。  [0020] If the angle formed by the two line segments connecting the center of the adjacent window 52 and the rotation center C is the center angle between the windows, the center angle between the windows is equal in each window 52. Therefore, the length of the arc connecting the centers of the adjacent window parts 52, that is, the distance between the window parts along the circumference between the centers of the adjacent window parts 52 is equal. They are arranged at regular intervals along the route.
[0021] 搬入室 41と搬出室 42の内部には不図示の搬送ロボットが配置されている。 図 4の 符号 50は処理対象物を示している。窓部 52の移動経路上には、搬入室 41内の搬 送ロボットによって移動室 45内に搬入された処理対象物 50が配置される搬入場所 5 6aと、搬出室 42内の搬送ロボットに移載され、移動室 45から搬出室 42に搬出される 搬出場所 56bとが設定されて 、る。  [0021] Inside the carry-in chamber 41 and the carry-out chamber 42, a transfer robot (not shown) is arranged. Reference numeral 50 in FIG. 4 indicates a processing object. On the moving path of the window part 52, the transfer robot 56 in the loading chamber 41 moves to the loading place 56a where the processing object 50 loaded into the moving chamber 45 is placed and the transfer robot in the unloading chamber 42. The unloading place 56b to be loaded and unloaded from the moving chamber 45 to the unloading chamber 42 is set.
[0022] 移動室 45の底壁には、複数の貫通孔 55が設けられて 、る。各貫通孔 55の中心は 、窓部 52が配置された円周と同じ半径で、同じ回転軸線 Cを中心とする円周上に一 列に配置されている。 [0023] 貫通孔 55の数は窓部 52の数よりも 2個少ない数であり、搬入場所 56aと搬出場所 5 6bに窓部 52を 1個ずつ配置したときに、他の窓部 52の真下位置に各貫通孔 55が位 置するように配置されて 、る。 A plurality of through holes 55 are provided on the bottom wall of the moving chamber 45. The centers of the through holes 55 are arranged in a line on the circumference centering on the same rotation axis C with the same radius as the circumference where the window portion 52 is arranged. [0023] The number of through-holes 55 is two fewer than the number of window portions 52. When one window portion 52 is arranged at each of carry-in place 56a and carry-out place 56b, The through holes 55 are arranged so as to be positioned directly below.
[0024] 各貫通孔 55の下方には、成膜室 30がそれぞれ配置されて 、る。各成膜室 30は真 空槽 31を有して 、る。真空槽 31の天井には貫通孔からなる接続口 36が形成され、 成膜室 30は接続口 36の縁部分力 上記貫通孔 55の周囲に気密に接続されており 、従って、真空槽 31の内部空間と移動室 45の内部空間は、接続口 36と貫通孔 55を 介して接続されている。  [0024] Below each through hole 55, a film forming chamber 30 is disposed. Each film forming chamber 30 has a vacuum chamber 31. A connection port 36 consisting of a through hole is formed in the ceiling of the vacuum chamber 31, and the film forming chamber 30 is hermetically connected to the periphery of the through hole 55 above the edge force of the connection port 36. The internal space and the internal space of the moving chamber 45 are connected via the connection port 36 and the through hole 55.
[0025] 各貫通孔 55は、円周上に一列に配置されており、搬入場所 56aに隣接する位置の 貫通孔 55を先頭とし、搬出場所 56bに隣接する位置の貫通孔 55を最後尾とすると、 各貫通孔 55は、先頭の貫通孔 55から最後尾の貫通孔 55まで、窓部 52同士の間隔 と同じ間隔で円周に沿った一列配置されている。  [0025] The through holes 55 are arranged in a line on the circumference, with the through hole 55 at the position adjacent to the carry-in place 56a as the head, and the through hole 55 at the position adjacent to the carry-out place 56b as the tail. Then, each through hole 55 is arranged in a line along the circumference at the same interval as the interval between the window portions 52 from the first through hole 55 to the last through hole 55.
[0026] ターンテーブル 51を搬入場所 56aと搬出場所 56b上に窓部 52が位置する状態で 静止させたときに、搬入場所 56aに位置する窓部 52と搬出場所 56bに位置する窓部[0026] When the turntable 51 is stopped with the window 52 positioned on the loading place 56a and the loading place 56b, the window 52 located at the loading place 56a and the window located at the loading place 56b.
52を除き、各窓部 52の真下には貫通孔 55が位置する。 Except for 52, a through hole 55 is located directly under each window 52.
[0027] 窓部 52の移動経路上の貫通孔 55の上方位置を成膜場所 57とすると、搬入場所 5[0027] If the upper position of the through hole 55 on the moving path of the window 52 is defined as the film forming place 57, the loading place 5
6aと搬出場所 56bと成膜場所 57は、回転中心 Cを中心として同じ円周上に一列に配 置されている。 6a, the unloading place 56b, and the film forming place 57 are arranged in a line on the same circumference around the rotation center C.
[0028] 成膜場所 57のうち、先頭の貫通孔 55上を先頭の成膜場所 57、最後尾の貫通孔 5 5上を最後尾の成膜場所 57とすると、搬入場所 56aの窓部 52が先頭の成膜場所 57 に向かう回転方向に、ターンテーブル 51を回転させ、一の場所上の窓部を隣接する 場所に移動させると、他の窓部も隣接する場所に移動するように構成されている。従 つて、搬入場所 56aの窓部 52が先頭の成膜場所 57に移動し、成膜場所 57の窓部 5 2が回転方向に隣接する成膜場所 57又は搬出場所 56bへ移動すると、搬出場所 56 bの窓部 52は搬入場所 56aへ戻る。  [0028] Of the film formation locations 57, if the first film formation location 57 is on the top through-hole 55 and the last film formation location 57 is on the last through-hole 55, the window portion 52 of the carry-in location 56a is shown. When the turntable 51 is rotated in the direction of rotation toward the first film deposition location 57 and the window on one location is moved to an adjacent location, the other windows are also moved to the adjacent location. Has been. Accordingly, when the window 52 of the carry-in place 56a moves to the first film-formation place 57, and the window 52 of the film-formation place 57 moves to the film-formation place 57 or the carry-out place 56b adjacent in the rotation direction, the carry-out place 56 b window 52 returns to entry point 56a.
[0029] 各窓部 52には載置プレート 61が乗せられており、窓部 52が移動すると載置プレー ト 61も一緒に移動する。載置プレート 61について説明すると、図 5を参照し、載置プ レート 61は円盤状の載置部 62と、載置部 62の周囲力も突き出された 1又は 2以上の 爪部 63と、載置部 62に設けられた開口 64とを有している。 [0029] A placement plate 61 is placed on each window 52. When the window 52 moves, the placement plate 61 also moves together. The mounting plate 61 will be described with reference to FIG. 5. The mounting plate 61 includes a disc-shaped mounting portion 62 and one or more of the peripheral force of the mounting portion 62 protruding. A claw portion 63 and an opening 64 provided in the placement portion 62 are provided.
[0030] ここでは爪部 63は複数であって、各爪部 63は載置部 62の周囲に均等に配置され ており、載置部 62の中心から、各爪部 63の先端までの距離は、窓部 52の中心から 窓部 52の縁までの距離よりも大きくなつて 、る。 [0030] Here, there are a plurality of claw portions 63, and each claw portion 63 is evenly arranged around the placement portion 62, and the distance from the center of the placement portion 62 to the tip of each claw portion 63 This is larger than the distance from the center of the window 52 to the edge of the window 52.
[0031] 従って、図 6 (a)に示すように、載置部 62を窓部 52の縁よりも内側に位置させると、 各爪部 63の先端が窓部 52の縁に乗る。載置部 62は窓部 52よりも小さく形成されて おり、各爪部 63の先端が窓部 52の縁に乗る時には、載置部 62は窓部 52の外周より も内側で保持される。 Accordingly, as shown in FIG. 6 (a), when the placement portion 62 is positioned inside the edge of the window portion 52, the tip of each claw portion 63 gets on the edge of the window portion 52. The placement part 62 is formed smaller than the window part 52, and when the tip of each claw part 63 gets on the edge of the window part 52, the placement part 62 is held inside the outer periphery of the window part 52.
[0032] 開口 64は載置部 62を表面力 裏面まで貫通する貫通孔であって、上述した処理 対象物 50は後述するマスクが下側にされた状態で、開口 64の縁に乗せられるように 構成されており、上述したように載置プレート 61が窓部 52上に配置された時には、処 理対象物 50も窓部 52上に配置された状態になる。  [0032] The opening 64 is a through-hole penetrating the mounting portion 62 up to the surface force back surface, and the processing object 50 described above is placed on the edge of the opening 64 in a state where a mask to be described later is faced down. As described above, when the placement plate 61 is disposed on the window portion 52, the processing object 50 is also disposed on the window portion 52.
[0033] 図 3は窓部 52と、窓部 52上に配置された処理対象物 50とが成膜場所 57で静止し た状態を示している。図 3に示すように、移動室 45外部の貫通孔 55の上方位置には 第二のモータ 49がそれぞれ配置されている。移動室 45には昇降軸 47が気密に垂 直に挿通されており、昇降軸 47の上端は第二のモータ 49に取り付けられ、昇降軸 4 7の下端には貫通孔 55の真上に位置するように保持部 48が取り付けられて 、る。  FIG. 3 shows a state in which the window portion 52 and the processing object 50 arranged on the window portion 52 are stationary at the film forming place 57. As shown in FIG. 3, a second motor 49 is disposed above the through hole 55 outside the moving chamber 45. A lift shaft 47 is inserted into the moving chamber 45 in an airtight and vertical manner. The upper end of the lift shaft 47 is attached to the second motor 49, and the lower end of the lift shaft 47 is located directly above the through hole 55. The holding part 48 is attached as shown.
[0034] 第二のモータ 49は昇降軸 47を上下又は回転移動させるように構成されており、昇 降軸 47を上下に移動させると保持部 48が上下に移動し、昇降軸 47を回転させると 保持部 48が水平面内で回転するようになって 、る。  [0034] The second motor 49 is configured to move the elevating shaft 47 up and down or rotationally. When the elevating shaft 47 is moved up and down, the holding portion 48 moves up and down to rotate the elevating shaft 47. The holding part 48 rotates in a horizontal plane.
[0035] 保持部 48は不図示の保持装置を有しており、載置プレート 61を保持可能になって いる。載置プレート 61は金属等の磁力で吸着される材料で構成されている場合は、 保持装置は例えば電磁石で構成することができ、載置プレート 61に突起などの係止 部材が設けられている場合は、保持装置に鈎を設け、係止部材に鈎を係止させて載 置プレート 61を保持することができる。  The holding unit 48 has a holding device (not shown) and can hold the mounting plate 61. When the mounting plate 61 is made of a material adsorbed by a magnetic force such as metal, the holding device can be made of, for example, an electromagnet, and the mounting plate 61 is provided with a locking member such as a protrusion. In this case, the holding device can be provided with a hook and the hook can be locked to the locking member to hold the mounting plate 61.
[0036] 図 7 (a)に示すように、保持部 48は載置プレート 61の真上位置で静止可能に構成 されており、保持部 48を下降させて載置プレート 61に接触させ、保持装置が電磁石 で構成されている場合、通電して磁力を発生させると、載置プレート 61は保持部 48 に吸着され、保持部 48を上昇させると、載置プレート 61はターンテーブル 51から持 ち上げられる(図 7 (b) )。 [0036] As shown in Fig. 7 (a), the holding portion 48 is configured to be stationary at a position directly above the mounting plate 61, and the holding portion 48 is lowered and brought into contact with the mounting plate 61 for holding. When the device is composed of an electromagnet, the mounting plate 61 is held by the holding portion 48 when a magnetic force is generated by energization. When the holding part 48 is lifted by being attracted to the surface, the mounting plate 61 is lifted from the turntable 51 (FIG. 7 (b)).
[0037] 窓部 52の周囲には爪部 63と同じ数力 それ以上の数の切れ込み 53が爪部 63と 対応する位置に設けられており、保持部 48を回転させ、一の爪部 63を切れ込み 53 の真上位置で静止させると、他の爪部 63もそれぞれ他の切れ込み 53の真上位置で 静止する(図 6 (b) )。 [0037] Around the window portion 52, a number of notches 53 having the same number of forces as the claw portion 63 are provided at positions corresponding to the claw portion 63, and the holding portion 48 is rotated so that one claw portion 63 is rotated. When is stopped at a position directly above the notch 53, the other claw portions 63 are also stopped at positions immediately above the other notches 53 (Fig. 6 (b)).
[0038] 爪部 63の形状は切れ込み 53よりも小さくなつており、保持部 48の外形は、窓部 52 よりも小さくされている。従って、爪部 63を切れ込み 53の真上に位置させ、鉛直に降 下させると、載置プレート 61と保持部 48は、窓部 52の外周と接触することなく通過す るようになっている。  [0038] The shape of the claw part 63 is smaller than the cut 53, and the outer shape of the holding part 48 is smaller than that of the window part 52. Therefore, when the claw part 63 is positioned right above the notch 53 and lowered vertically, the mounting plate 61 and the holding part 48 pass through without contacting the outer periphery of the window part 52. .
[0039] その載置プレート 61上には、搬入室 41から搬入された処理対象物 50が乗せられ ている。処理対象物 50の外形も、窓部 52よりも小さくなつており、保持部 48と共に載 置プレート 61を昇降移動させることで、処理対象物をターンテーブル 51の上方にも 下方にも位置させることができるように構成されて 、る(図 8 (a) )。  [0039] On the mounting plate 61, the processing object 50 carried from the carry-in chamber 41 is placed. The outer shape of the processing object 50 is also smaller than the window part 52, and the processing object can be positioned above and below the turntable 51 by moving the mounting plate 61 up and down together with the holding part 48. (Fig. 8 (a)).
[0040] また、保持部 48に保持された載置プレート 61は、保持部 48を回転させて、爪部 63 を切れ込み 53上から退避させ、爪部 63を窓部 52の縁上に乗せ、保持部 48の吸着 力を消滅させると、処理対象物 50をターンテーブル 51上に置くことができる(図 8 (b) [0040] Further, the mounting plate 61 held by the holding part 48 rotates the holding part 48 to retract the claw part 63 from the cut 53, and put the claw part 63 on the edge of the window part 52. When the suction force of the holding part 48 is extinguished, the processing object 50 can be placed on the turntable 51 (Fig. 8 (b)
) o ) o
[0041] 載置プレート 61には開口 64が設けられており、開口 64の底面には、処理対象物 5 0が露出している。載置プレート 61をターンテーブル 51よりも下方に移動させ、貫通 孔 55の内部又は貫通孔 55よりも下方位置まで下降させると、載置プレート 61上の処 理対象物 50は、開口 64を介して真空槽 31の内部空間と面する。  The mounting plate 61 is provided with an opening 64, and the processing object 50 is exposed on the bottom surface of the opening 64. When the mounting plate 61 is moved below the turntable 51 and lowered to the inside of the through hole 55 or to a position below the through hole 55, the processing object 50 on the mounting plate 61 passes through the opening 64. Facing the internal space of the vacuum chamber 31.
[0042] 図 3に示したように、真空槽 31の内部には成膜源 35が配置されており、成膜源 35 は一乃至複数個の容器 32、 33を有している。各容器 32、 33内にはそれぞれ蒸着材 料が配置されており、処理対象物 50が真空槽 31に面した状態で、一乃至複数個の 容器 32、 33から蒸着材料の蒸気をそれぞれ放出させると、その蒸気は開口 64底面 のマスクの開口を通って基板に到達し、薄膜が形成される。  As shown in FIG. 3, a film forming source 35 is disposed inside the vacuum chamber 31, and the film forming source 35 includes one or more containers 32 and 33. Vapor deposition materials are arranged in the containers 32 and 33, respectively, and vapor of the vapor deposition material is discharged from one or more containers 32 and 33 in a state where the processing object 50 faces the vacuum chamber 31. Then, the vapor reaches the substrate through the opening of the mask on the bottom surface of the opening 64, and a thin film is formed.
[0043] 搬入場所 56aに隣接する成膜場所の真空槽 31を先頭とし、搬出場所 56bに隣接 する成膜場所 57の真空槽 31を最後尾とすると、先頭の真空槽 31にはホール注入性 物質とホール輸送性の有機物とが配置されており、その次の真空槽 31には、電子輸 送性の有機物と、添加物である発色有機物とが配置されて ヽる。 [0043] The vacuum chamber 31 of the film formation location adjacent to the carry-in location 56a starts, and is adjacent to the carry-out location 56b. If the vacuum chamber 31 of the film formation site 57 to be used is the last, a hole injecting substance and a hole transporting organic substance are arranged in the top vacuum chamber 31, and the next vacuum chamber 31 has an electron transport. An organic substance capable of feeding and a coloring organic substance as an additive are arranged.
また、次の真空槽 31には電子注入性の物質が配置されており、最後尾の真空槽 3 1には、電極材料が配置されている。  The next vacuum chamber 31 is provided with an electron injecting substance, and the last vacuum chamber 31 is provided with an electrode material.
[0044] 各成膜装置 5R、 5G、 5Bには、ホール注入性物質(例えば CuPC ;銅フタロシア- ン)、ホール輸送性物質(例えば α— NPD ;ビス〔N— (1—ナフチル)— N—フエ-ル 〕ベンジジン)、電子輸送性物質 (例えば Alq3;トリス (8—キノリノラト)アルミニウム錯体 )、電子注入性物質 (例えば LiF)、電極材料 (例えば金属アルミニウム)が配置されて いる。また、添加物は各成膜装置 5R、 5G、 5Bで異なっており、添加物としてここでは 赤色、緑色、青色の発色有機物がそれぞれ配置されている。  [0044] Each of the film forming apparatuses 5R, 5G, and 5B includes a hole injecting substance (for example, CuPC; copper phthalocyanine), a hole transporting substance (for example, α-NPD; bis [N- (1-naphthyl) -N [Fer] benzidine), an electron transporting substance (eg, Alq3; tris (8-quinolinolato) aluminum complex), an electron injecting substance (eg, LiF), and an electrode material (eg, metallic aluminum) are arranged. In addition, the additive is different in each of the film forming apparatuses 5R, 5G, and 5B, and the red, green, and blue coloring organic substances are arranged here as the additive, respectively.
[0045] 各真空槽 31内で蒸着材料物質の蒸気を放出させると、ホール注入層 14、ホール 輸送層 15、発光層 16R、 16G、 16B、電子輸送層 17、電子注入層 18、上部電極層 19が形成される。また、発光層 16R、 16G、 16Bは、赤、緑、又は青色に発光するも のである。  When the vapor of the vapor deposition material is discharged in each vacuum chamber 31, a hole injection layer 14, a hole transport layer 15, a light emitting layer 16R, 16G, 16B, an electron transport layer 17, an electron injection layer 18, and an upper electrode layer 19 is formed. The light emitting layers 16R, 16G, and 16B emit light in red, green, or blue.
[0046] 次に、上記製造装置 1を用いて有機 EL素子 10を製造する工程について説明する 図 9 (a)の符号 9は上記製造装置に搬入して有機 EL素子 10を形成する基板を示し ており、ここでは基板 9は支持板 11と、支持板 11の表面にそれぞれ形成された下部 電極膜 13と、隔壁 29とを有している。  Next, a process for manufacturing the organic EL element 10 using the manufacturing apparatus 1 will be described. Reference numeral 9 in FIG. 9A denotes a substrate that is carried into the manufacturing apparatus and forms the organic EL element 10. Here, the substrate 9 has a support plate 11, a lower electrode film 13 formed on the surface of the support plate 11, and a partition wall 29.
[0047] 図 2に示した搬入部 Aは置換室 21、 22と、乾燥室 23と、洗浄室 24と、冷却室 25と 、待機室 26とを有しており、洗浄された基板 9を置換室 21、 22に搬入し、置換室 21 、 22に不活性ガス (例えば N2ガス)を導入し、置換室 21、 22内の雰囲気が不活性 ガスで置換された後、置換室 21、 22内部を乾燥室 23内部に接続して基板 9を乾燥 室 23に搬入する。乾燥室 23の内部に乾燥ガスを導入し、その内部雰囲気を乾燥ガ ス雰囲気にして基板 9を表面の水分を除去し、洗浄室 24内に搬入する。洗浄室 24 内部では紫外線を発生させ、基板 9表面にその紫外線を照射して汚染物質を分解 除去した後、冷却室 25内に搬入する。冷却室 25内には不図示の冷却装置が配置さ れており、基板 9を冷却した後、待機室 26内に搬入する。 The carry-in section A shown in FIG. 2 has replacement chambers 21 and 22, a drying chamber 23, a cleaning chamber 24, a cooling chamber 25, and a standby chamber 26, and the cleaned substrate 9 It is carried into the replacement chambers 21 and 22, an inert gas (for example, N2 gas) is introduced into the replacement chambers 21 and 22, and the atmosphere in the replacement chambers 21 and 22 is replaced with the inert gas. The inside is connected to the inside of the drying chamber 23 and the substrate 9 is carried into the drying chamber 23. A drying gas is introduced into the drying chamber 23, the interior atmosphere is changed to a dry gas atmosphere, moisture on the surface of the substrate 9 is removed, and the substrate 9 is carried into the cleaning chamber 24. Ultraviolet rays are generated inside the cleaning chamber 24, and the ultraviolet rays are irradiated on the surface of the substrate 9 to decompose and remove contaminants, and then are carried into the cooling chamber 25. A cooling device (not shown) is arranged in the cooling chamber 25. Then, after the substrate 9 is cooled, it is carried into the standby chamber 26.
[0048] 各成膜装置 5R、 5G、 5Bは不図示の真空排気系を有しており、各成膜装置 5R、 5 G、 5Bの移動室 45と搬入室 41と搬入室 41内部に予め真空雰囲気を形成しておく。  [0048] Each film forming apparatus 5R, 5G, 5B has an evacuation system (not shown), and the film forming apparatuses 5R, 5G, 5B have a moving chamber 45, a loading chamber 41, and a loading chamber 41 in advance. A vacuum atmosphere is formed.
[0049] 成膜装置 5R、 5G、 5Bは、先頭の成膜装置 5Rの搬出室 42が、次の成膜装置 5B の搬入室 41に接続され、その成膜装置 5Bの搬出室 42が最後尾の成膜装置 5Bの 搬入室 41に接続されて ヽる。待機室 26は先頭の成膜装置 5Rの搬入室 41に接続さ れており、冷却された基板 9は先ず、待機室 26を通って先頭の成膜装置 5Rの搬入 室 41に搬入される。  [0049] In the film forming apparatuses 5R, 5G, and 5B, the unloading chamber 42 of the first film forming apparatus 5R is connected to the loading chamber 41 of the next film forming apparatus 5B, and the unloading chamber 42 of the film forming apparatus 5B is the last. Connected to the loading chamber 41 of the tail deposition system 5B. The standby chamber 26 is connected to the carry-in chamber 41 of the first film formation apparatus 5R, and the cooled substrate 9 is first carried into the carry-in chamber 41 of the first film formation apparatus 5R through the standby chamber 26.
[0050] 各成膜装置 5R、 5G、 5Bの搬入室 41と搬出室 42にはマスクストッカー 43、 44力接 続されており、マスクストッカー 43から赤色用のマスク 70Rを搬入室 41に移動させ、 不図示のァライメント装置によってそのマスク 70Rと基板 9とを重ね合わせ、固定部材 71で固定して処理対象物 50を形成する。  [0050] The mask stocker 43 and 44 are connected to the carry-in chamber 41 and the carry-out chamber 42 of each film forming apparatus 5R, 5G, and 5B, and the red mask 70R is moved from the mask stocker 43 to the carry-in chamber 41. The mask 70R and the substrate 9 are overlapped by an alignment apparatus (not shown) and fixed by the fixing member 71 to form the processing object 50.
[0051] このマスク 70Rには赤色の発光ドットが形成されるべき位置に開口が形成されてお り、処理対象物 50が上記各成膜場所 57を順場に通過して、ホール注入層 14と、ホ ール輸送層 15と、発光層 16R (ここでは赤色)と、電子輸送層 17と、電子注入層 18と 、上部電極膜 19を記載した順番に形成する。図 9 (b)はその状態の基板 9を示して おり、赤色の発光ドット 20Rが形成された基板 9を、搬出場所 56bの載置プレート 61 力も搬出室 42へ搬送する。  [0051] An opening is formed in the mask 70R at a position where a red light emitting dot is to be formed, and the processing object 50 passes through each of the film forming locations 57 in succession, and the hole injection layer 14 Then, the hole transport layer 15, the light emitting layer 16R (here red), the electron transport layer 17, the electron injection layer 18, and the upper electrode film 19 are formed in the order described. FIG. 9 (b) shows the substrate 9 in this state, and the substrate 9 on which the red light emitting dots 20R are formed also transfers the loading plate 61 force of the unloading place 56b to the unloading chamber 42.
[0052] 搬出場所 56bで処理対象物 50が取り除かれ、空になった載置プレート 61は、各成 膜場所 57での成膜が終了し、成膜場所 57から次の成膜場所 57又は搬出場所 56b へ送られるようにターンテーブル 51が回転するときに、搬出場所 56bから搬入場所 5 6aへ戻る。この時、未処理の処理対象物 50が乗せられた載置プレート 61は、搬入 場所 56aから先頭の成膜場所 57へ送られる。  [0052] After the processing object 50 is removed at the unloading place 56b and the mounting plate 61 that has become empty, the film formation at each film formation place 57 is completed, and from the film formation place 57 to the next film formation place 57 or When the turntable 51 rotates to be sent to the unloading place 56b, the unloading place 56b returns to the loading place 56a. At this time, the mounting plate 61 on which the unprocessed processing object 50 is placed is sent from the carry-in location 56a to the first film-forming location 57.
[0053] このように、各窓部 52が次の場所 56a、 56b、 57へ移動するようにターンテーブル 5 1を回転させることで、処理対象物 50が一斉に次の場所 56a、 56b、 57へ移動すると 共に、搬出場所 56bにある載置プレート 61を搬入場所 56aへ戻すことができる。  [0053] In this way, by rotating the turntable 51 so that each window 52 moves to the next place 56a, 56b, 57, the objects to be processed 50 are simultaneously moved to the next place 56a, 56b, 57. The loading plate 61 at the unloading place 56b can be returned to the loading place 56a.
[0054] 搬出室 42には不図示の分離機構が配置されており、搬出室 42に移動した処理対 象物 50を、マスク 70Rと基板 9に分離し、マスク 70Rをマスクストッカー 44へ戻し、基 板 9を次の成膜装置 5Gの搬入室 41へ送る。 [0054] A separation mechanism (not shown) is arranged in the unloading chamber 42, the processing object 50 moved to the unloading chamber 42 is separated into the mask 70R and the substrate 9, and the mask 70R is returned to the mask stocker 44. Base The plate 9 is sent to the loading chamber 41 of the next film forming apparatus 5G.
[0055] 2番目の成膜装置 5Gと、最後の成膜装置 5Bのマスクストッカー 43には、緑色用マ スク 70Gと、青色用のマスク 70Bが収容されており、搬入室 41でそれらのマスク 70G 、 70Bを基板に重ね合わせると、緑色の発光ドットが形成されるべき位置、又は青色 の発光ドットが形成されるべき位置だけがそれぞれマスク 70G、 70Bの開口に露出し 、他の位置はマスク 70G、 70Bで覆われる。  [0055] The mask stocker 43 of the second film-forming apparatus 5G and the last film-forming apparatus 5B contains a green mask 70G and a blue mask 70B. When 70G and 70B are superimposed on the substrate, only the position where the green light emitting dot should be formed or the position where the blue light emitting dot should be formed is exposed at the openings of the masks 70G and 70B, and the other positions are masks. Covered with 70G, 70B.
[0056] 2番目の成膜装置 5Gの搬入室で緑色用のマスク 70Gを基板 9と重ね合わせ、上記 先頭の成膜装置 5Rの場合と同じように移動室 45内を移動させると、すでに形成され た赤色発光ドット 20Rと、次に形成されるべき発光ドットの位置には膜が形成されな いが、緑色の発光ドットを形成すべき位置に緑色の発光ドット 20Gが形成される(図 9 (c) ) 0 [0056] A green mask 70G is superimposed on the substrate 9 in the loading chamber of the second film forming apparatus 5G, and is already formed by moving in the moving chamber 45 as in the case of the first film forming apparatus 5R. No film is formed at the position of the red light emitting dot 20R and the next light emitting dot to be formed, but the green light emitting dot 20G is formed at the position where the green light emitting dot is to be formed (FIG. 9). (c)) 0
[0057] 2番目の成膜装置 5Gの搬出室 42と、最後の成膜装置 5Bの搬入室 42とでマスク G を青色用のマスク 70Bに交換して、処理対象物 50を同様に移動室 45内を移動させ ると、既に形成された発光ドット 20R、 20Gには膜が形成されないが、青色の発光ドッ トを形成すべき位置に青色の発光ドット 20Bが形成される。  [0057] The mask G is exchanged with the blue mask 70B in the carry-out chamber 42 of the second film-forming apparatus 5G and the carry-in chamber 42 of the last film-forming apparatus 5B, and the processing object 50 is similarly transferred to the moving chamber. When moving within 45, no film is formed on the already formed light emitting dots 20R, 20G, but blue light emitting dots 20B are formed at positions where blue light emitting dots are to be formed.
[0058] 搬入部 Mは排出待機室 28を有しており、最後の成膜装置 5Bの搬出室 42は排出 待機室 28に接続されている。上記各色の発光ドット 20Bが形成された基板 9を、移動 室 45から搬出室 42へ移動し、マスク 70Bを取り除いた後、基板 9を排出待機室 28を 通して外部雰囲気に取り出せば、図 1に示したような有機 EL素子 10が得られる。  The carry-in part M has a discharge standby chamber 28, and the carry-out chamber 42 of the last film forming apparatus 5 B is connected to the discharge standby chamber 28. If the substrate 9 on which the light emitting dots 20B of the above colors are formed is moved from the moving chamber 45 to the unloading chamber 42, the mask 70B is removed, and then the substrate 9 is taken out to the outside atmosphere through the discharge waiting chamber 28, FIG. An organic EL device 10 as shown in Fig. 1 is obtained.
[0059] 以上は、処理対象物 50を持ち上げた後の載置プレート 61を搬出場所 56bから搬 入場所 56aへ移動させてから、新たな処理対象物 50を載置する場合につ ヽて説明 したが、本発明はこれに限定されるものではな 、。  [0059] The above is a description of the case where a new processing target 50 is mounted after the mounting plate 61 after lifting the processing target 50 is moved from the unloading location 56b to the loading location 56a. However, the present invention is not limited to this.
[0060] 搬送ロボットで処理対象物 50を載置プレート 61から持ち上げ、その載置プレート 6 1が乗せられた窓部 52を静止させたまま、即ち同じ窓部 52上で新たな処理対象物 5 0を載置プレート 61上に乗せてもよい。要するに、搬入場所と搬出場所を同じ場所と してちよい。  [0060] The processing object 50 is lifted from the placement plate 61 by the transfer robot, and the window 52 on which the placement plate 61 is placed is kept stationary, that is, a new processing object 5 is placed on the same window 52. 0 may be placed on the mounting plate 61. In short, the carry-in place and the carry-out place may be the same place.
[0061] また、処理対象物 50を移動室 45へ搬入する搬送ロボットと、移動室 45から搬出す る搬送ロボットを別々に設ける必要もなぐ 1つの搬送装置 (例えば搬送ロボット)で処 理対象物 50の搬出と搬入を行ってもよい。 [0061] In addition, it is not necessary to separately provide a transfer robot that carries the processing object 50 into the moving chamber 45 and a transfer robot that carries out the processing chamber 45. The physical object 50 may be carried out and carried in.
[0062] 窓部 52の数は特に限定されるものではない。窓部 52の数を、搬入場所 56aの数と 、搬出場所 56bの数と、成膜場所 57の数の合計よりも多くして、搬入場所 56aと搬出 場所 56bと各成膜場所 57に窓部 52を静止させた時に、それらの場所 56a、 56b、 57 以外の場所で 1以上の窓部 52が静止するようにしてもょ 、。  [0062] The number of window portions 52 is not particularly limited. The number of windows 52 is larger than the sum of the number of carry-in places 56a, the number of carry-out places 56b, and the number of film-formation places 57, so that the windows at the carry-in places 56a, the carry-out places 56b, and the respective film-formation places 57 When the section 52 is stationary, one or more window sections 52 may be stationary in places other than those places 56a, 56b, 57.
[0063] またこれとは逆に、窓部 52の数を、搬入場所 56aの数と、搬出場所 56bの数と、成 膜場所 57の数の合計よりも少なくして、搬入場所 56aで窓部 52を静止した時に、 1以 上の成膜場所 57又は搬出場所 56bに窓部 52が位置しな 、ようにしても良 、。  [0063] On the other hand, the number of window portions 52 is set to be smaller than the sum of the number of carry-in places 56a, the number of carry-out places 56b, and the number of film-forming places 57, so that the window at the carry-in place 56a When the part 52 is stationary, the window part 52 may not be positioned at one or more film forming places 57 or the unloading place 56b.
[0064] 成膜装置 5R、 5G、 5Bの数は、交換するマスクの種類に応じて決定されるものであ つて、その数も特に限定されるものではない。基板 9が最初に搬送される成膜装置 5 Rを先頭、最後に搬送される成膜装置 5Bを最後、先頭と最後の成膜装置 5R, 5Bの 間を中間の成膜装置 5Gとすると、上記の製造装置 1では中間の成膜装置 5Gの数は 1台であつたが、中間の成膜装置 5Gが複数台の場合は、最初の中間の成膜装置 5 Gの搬入室 41は先頭の成膜装置 5Rの搬出室 42に接続され、その他の中間の成膜 装置 5Gの搬入室 41は他の中間の成膜装置 5Gの搬出室 42に接続されて 、る。また 、最後の中間の成膜装置 5Gの搬出室 42は、上記最後の成膜装置 5Bの搬入室 41 に接続され、その他の中間の成膜装置 5Gの搬出室 42は他の中間の成膜装置 5G の搬入室 41に接続されて 、る。  [0064] The number of film forming apparatuses 5R, 5G, and 5B is determined according to the type of mask to be replaced, and the number is not particularly limited. When the deposition apparatus 5R to which the substrate 9 is transported first is the first, the deposition apparatus 5B to be transported last is the last, and the intermediate deposition apparatus 5G is between the first and last deposition apparatuses 5R and 5B. In the manufacturing apparatus 1 described above, the number of intermediate film forming apparatuses 5G is one. However, when there are a plurality of intermediate film forming apparatuses 5G, the carry-in chamber 41 of the first intermediate film forming apparatus 5G is the top. The carry-in chamber 41 of the other intermediate film-forming apparatus 5G is connected to the carry-out chamber 42 of the other intermediate film-forming apparatus 5G. The carry-out chamber 42 of the last intermediate film formation apparatus 5G is connected to the carry-in chamber 41 of the last film formation apparatus 5B, and the carry-out chamber 42 of the other intermediate film formation apparatus 5G is another intermediate film formation. Connected to loading room 41 of device 5G.
[0065] また、 1の成膜装置 5Rから他の成膜装置 5G、 5Bに基板 9を送る際に、マスクを交 換せず、 1の成膜装置 5Rで成膜された膜上に、他の成膜装置 5G、 5Bで新たな膜を 積層してちょい。  [0065] Further, when the substrate 9 is sent from the first film forming apparatus 5R to the other film forming apparatuses 5G and 5B, the mask is not changed, and the film formed by the first film forming apparatus 5R is Laminate a new film with other film deposition equipment 5G, 5B.
[0066] 成膜装置 5R、 5G、 5Bを複数設ける場合、成膜装置 5R、 5G、 5B同士を直接接続 せずに、成膜装置 5Rと成膜装置 5bとの間に冷却室のような他の処理室を設け、 1の 成膜装置 5Rで成膜処理された基板 9を、処理室を介して他の成膜装置 5Gに搬送し てもよい。  [0066] When a plurality of film forming apparatuses 5R, 5G, and 5B are provided, the film forming apparatuses 5R, 5G, and 5B are not directly connected to each other, and a cooling chamber or the like is provided between the film forming apparatus 5R and the film forming apparatus 5b. Another processing chamber may be provided, and the substrate 9 subjected to the film forming process by the one film forming apparatus 5R may be transferred to the other film forming apparatus 5G through the processing chamber.
[0067] 以上は成膜源 35が成膜材料の蒸気を放出する場合について説明したが、本発明 はこれに限定されず、成膜源 35で成膜材料力 Sスパッタされ、スパッタ粒子が放出され る場合も本発明には含まれる。 [0068] 載置プレート 61を下降させる位置は、基板 9に成膜材料の粒子 (蒸気、スパッタ粒 子)が到達可能な位置であれば、貫通孔 55よりも上方位置であってもよい。 [0067] The case where the film forming source 35 releases the vapor of the film forming material has been described above, but the present invention is not limited to this, and the film forming material force S is sputtered by the film forming source 35 and the sputtered particles are released. Such cases are also included in the present invention. The position where the mounting plate 61 is lowered may be a position above the through hole 55 as long as the film forming material particles (vapor, sputtered particles) can reach the substrate 9.
[0069] 成膜室 30の数も特に限定されるものではない。また、各成膜室 30の真空槽 31で 成膜する膜の数も 1又は 2に限定されず、 1つの真空槽 31で 3層以上の膜を形成して ちょい。  [0069] The number of film forming chambers 30 is not particularly limited. In addition, the number of films to be deposited in the vacuum chamber 31 of each deposition chamber 30 is not limited to 1 or 2, and three or more layers may be formed in one vacuum chamber 31.
[0070] 以上は、貫通孔 55に成膜室 30を接続する場合について説明したが、本発明はこ れに限定されるものではなぐ例えば貫通孔 55に成膜室 30以外の他の処理室を接 続することも可能であり、窓部 52を処理室上の位置で静止させ、上述した工程で載 置プレート 61と一緒に処理対象物 50を下降させれば、処理室内で処理対象物 50を 処理可能である。  [0070] Although the case where the film forming chamber 30 is connected to the through hole 55 has been described above, the present invention is not limited to this, for example, a processing chamber other than the film forming chamber 30 in the through hole 55. If the window 52 is stationary at a position on the processing chamber and the processing object 50 is lowered together with the mounting plate 61 in the above-described process, the processing object is processed in the processing chamber. 50 can be processed.
[0071] 以上は、本発明の製造装置 1と製造方法を、有機 EL素子 10の製造に用いる場合 について説明したが、本発明はこれに限定されるものではなぐ本発明は同じ基板に 2層以上の膜の積層物であれば、種々の目的に用いることが可能であり、成膜材料も 種々のものを用いることができる。  [0071] Although the case where the manufacturing apparatus 1 and the manufacturing method of the present invention are used for manufacturing the organic EL element 10 has been described above, the present invention is not limited to this. Any laminate of the above films can be used for various purposes, and various film forming materials can be used.
[0072] 窓部 52の形状や、切れ込み 53の数や形状も特に限定されるものではない。また、 載置プレート 61の形状や、爪部 63の数や形状は、爪部 63と切れ込みが 53が重なり 合った時に載置プレート 61が窓部 52を通過し、爪部 63が切れ込み 53と重なり合わ ない時に載置プレート 61が窓部 52の縁に乗せられるものであれば、特に限定される ものではない。  [0072] The shape of the window 52 and the number and shape of the notches 53 are not particularly limited. In addition, the shape of the mounting plate 61 and the number and shape of the claw parts 63 are determined so that the mounting plate 61 passes through the window part 52 when the claw part 63 and the cut 53 overlap, and the claw part 63 is cut 53. There is no particular limitation as long as the placing plate 61 can be placed on the edge of the window 52 when not overlapping.

Claims

請求の範囲 The scope of the claims
[1] 移動室と、  [1] A mobile room,
前記移動室内に配置されたターンテーブルと、  A turntable disposed in the moving chamber;
前記移動室にそれぞれ接続された複数の成膜室とを有し、  A plurality of film forming chambers each connected to the moving chamber;
前記各成膜室は前記ターンテーブルの下方に配置された成膜源を有し、 前記成膜源は成膜材料粒子を放出するように構成され、  Each film forming chamber has a film forming source disposed below the turntable, and the film forming source is configured to discharge film forming material particles,
前記ターンテーブルには複数の窓部が形成され、  A plurality of windows are formed on the turntable,
前記各窓部上には、処理対象物が載置可能な載置プレートが配置され、 前記ターンテーブルを水平面内で回転させたときに、前記各窓部は前記成膜源の 上方の成膜場所を移動できるように構成された成膜装置。  A placement plate on which a processing object can be placed is disposed on each window, and when the turntable is rotated in a horizontal plane, each window is formed above the film formation source. A film forming apparatus configured to be able to move between places.
[2] 前記窓部は前記ターンテーブルの回転中心を中心とした同一円周上に一列に等 間隔を空けて並べられ、  [2] The window portions are arranged at equal intervals in a line on the same circumference around the rotation center of the turntable,
一の成膜場所に前記窓部を静止させた時に、他の成膜場所にも前記窓部が静止 するように構成された請求項 1記載の成膜装置。  2. The film forming apparatus according to claim 1, wherein when the window portion is stationary at one film forming location, the window portion is also stationary at another film forming location.
[3] 前記移動室には搬入室が接続され、 [3] A loading room is connected to the moving room,
前記搬入室内には搬送ロボットが配置され、  A transfer robot is disposed in the carry-in chamber,
前記窓部が移動する移動経路上には、前記搬送ロボットによって前記搬入室から 搬入された前記処理対象物が前記載置プレート上に載置される搬入場所が設けら れ、  On the moving path along which the window portion moves, a loading place where the processing object loaded from the loading chamber by the transfer robot is placed on the mounting plate is provided,
前記窓部の個数は成膜場所の個数よりも多ぐ前記各成膜場所に前記窓部をそれ ぞれ静止させたときには、前記搬入場所にも前記窓部が静止するように構成された 請求項 1記載の成膜装置。  The number of the window portions is larger than the number of film formation locations, and when the window portions are stationary at the respective film formation locations, the window portions are also configured to be stationary at the loading location. Item 2. The film forming apparatus according to Item 1.
[4] 前記移動室には搬出室が接続され、前記搬出室内には搬送ロボットが配置され、 前記移動経路上には、前記搬送ロボットによって前記処理対象物が前記窓部上の 前記載置プレートから前記搬出室へ搬出される搬出場所が設けられ、 [4] A carry-out chamber is connected to the moving chamber, a transfer robot is disposed in the carry-out chamber, and the object to be processed is placed on the window by the transfer robot on the moving path. An unloading place to be unloaded from the unloading chamber is provided,
前記搬入場所に前記窓部を静止させたときには、前記搬出場所にも前記窓部が静 止するように構成された請求項 3記載の成膜装置。  4. The film forming apparatus according to claim 3, wherein when the window portion is stationary at the carry-in location, the window portion is also stationary at the carry-out location.
[5] 前記成膜場所は、前記搬入場所と前記搬出場所の間に並べられ、 前記搬入場所と前記搬入場所に隣接する前記成膜場所との間の間隔と、前記搬 出場所と前記搬出場所に隣接する前記成膜場所との間の間隔と、前記成膜場所と 前記成膜場所との間の間隔は、互いに略等しくされた請求項 4記載の成膜装置。 [5] The film formation place is arranged between the carry-in place and the carry-out place, An interval between the carry-in location and the film-forming location adjacent to the carry-in location, an interval between the carry-out location and the film-formation location adjacent to the carry-out location, the film-formation location, and the formation location. 5. The film forming apparatus according to claim 4, wherein the distance between the film locations is substantially equal to each other.
[6] 前記搬出場所と前記搬入場所との間の間隔は、前記成膜場所と前記成膜場所との 間の間隔と同じにされた請求項 5記載の成膜装置。 6. The film forming apparatus according to claim 5, wherein an interval between the carry-out place and the carry-in place is the same as an interval between the film-formation place and the film-formation place.
[7] 前記載置プレートは前記窓部よりも小さな載置部と、前記載置部の周囲に設けられ た爪部とを有し、 [7] The placement plate has a placement portion smaller than the window portion, and a claw portion provided around the placement portion,
該載置プレートは、該爪部が前記窓部の縁上に乗せられて前記窓部上に配置され 前記窓部は周囲に切れ込みを有し、前記ターンテーブルの上方に位置する前記 載置プレートを回転させ、前記爪部を前記切れ込みの位置に一致させた状態で、前 記爪部が、前記成膜室上に位置する前記窓部の前記切れ込みを通過させられると、 前記載置プレートは前記ターンテーブルの下方に移動されるように構成された請求 項 1記載の成膜装置。  The mounting plate has the claw portion placed on the edge of the window portion and is disposed on the window portion, and the window portion has a notch in the periphery and is positioned above the turntable. When the claw portion is allowed to pass through the cut of the window portion located on the film forming chamber in a state where the claw portion is aligned with the position of the cut, the mounting plate is 2. The film forming apparatus according to claim 1, wherein the film forming apparatus is configured to be moved below the turntable.
[8] 前記載置プレートを保持可能な保持部を有し、 [8] having a holding portion capable of holding the mounting plate,
前記載置プレートは前記保持部に保持された状態で、前記保持部と一緒に前記窓 部を通過可能に構成された請求項 7記載の成膜装置。  8. The film forming apparatus according to claim 7, wherein the mounting plate is configured to be able to pass through the window portion together with the holding portion while being held by the holding portion.
[9] 前記保持部は、前記保持部に保持された前記載置プレートと一緒に、水平面内で 回転可能に構成された請求項 8記載の成膜装置。 [9] The film forming apparatus according to [8], wherein the holding unit is configured to be rotatable in a horizontal plane together with the mounting plate held by the holding unit.
[10] 複数の成膜装置を有する製造装置であって、 [10] A manufacturing apparatus having a plurality of film forming apparatuses,
前記各成膜装置は、移動室と、  Each of the film forming apparatuses includes a moving chamber,
前記移動室内に配置されたターンテーブルと、  A turntable disposed in the moving chamber;
前記移動室にそれぞれ接続された複数の成膜室とを有し、  A plurality of film forming chambers each connected to the moving chamber;
前記各成膜室は前記ターンテーブルの下方に配置された成膜源を有し、 前記成膜源は成膜材料粒子を放出するように構成され、  Each film forming chamber has a film forming source disposed below the turntable, and the film forming source is configured to discharge film forming material particles,
前記ターンテーブルには複数の窓部が形成され、  A plurality of windows are formed on the turntable,
前記各窓部上には、処理対象物が載置可能な載置プレートが配置され、 前記ターンテーブルを水平面内で回転させたときに、前記各窓部は前記成膜源の 上方の成膜場所を移動できるように構成され、 A placement plate on which a processing object can be placed is disposed on each window, and when the turntable is rotated in a horizontal plane, each window is a film source. It is configured to be able to move the upper film formation place,
前記各移動室には搬入室と搬出室がそれぞれ接続され、  A loading chamber and a unloading chamber are connected to each of the moving chambers,
前記搬入室の内部と前記搬出室の内部には搬送ロボットがそれぞれ配置され、 前記窓部が移動する移動径路上には、前記搬送ロボットによって前記搬入室から 搬入された前記処理対象物が前記載置プレート上に載置される搬入場所と、前記搬 送ロボットによって前記処理対象物が前記窓部上の前記載置プレートから前記搬出 室へ搬出される搬出場所がそれぞれ設けられ、  A transfer robot is disposed inside each of the carry-in chamber and the carry-out chamber, and the processing object carried in from the carry-in chamber by the transfer robot is described above on a moving path along which the window portion moves. A carrying-in place for placing on the placing plate and a carrying-out place for carrying out the object to be processed from the placing plate on the window by the carrying robot to the carrying-out chamber, respectively.
前記窓部の個数は、成膜場所の個数よりも多ぐ前記各成膜場所に前記窓部をそ れぞれ静止させたときには、前記搬入場所と前記搬出場所にも前記窓部がそれぞれ 静止するように構成され、  The number of the window portions is larger than the number of film formation locations. When the window portions are stationary at the respective film formation locations, the window portions are also stationary at the carry-in location and the carry-out location, respectively. Configured to
一の前記成膜室の前記搬入室は、他の前記成膜室の前記搬出室に接続された製 造装置。  A manufacturing apparatus in which the carry-in chamber of one film formation chamber is connected to the carry-out chamber of another film formation chamber.
[11] 複数の成膜源上に基板を順番に送り、前記各成膜源上で前記基板表面に前記成 膜源カゝら放出される成膜材料をそれぞれ到達させ、前記基板表面上に複数層の前 記成膜材料の膜形成する成膜方法であって、  [11] The substrate is sequentially transferred onto a plurality of film forming sources, and the film forming material released from the film forming source source is made to reach the substrate surface on each film forming source, respectively. A film forming method for forming a film of the film forming material of a plurality of layers,
複数の前記成膜源上に配置されたターンテーブルに前記基板を載置し、前記ター ンテーブルを水平面内で回転させて、前記成膜源上に前記基板を順番に送る成膜 方法。  A film forming method in which the substrate is placed on a turntable disposed on a plurality of film forming sources, the turn table is rotated in a horizontal plane, and the substrates are sequentially transferred onto the film forming source.
[12] 前記ターンテーブルに設けられた窓部を前記成膜源上にそれぞれ静止させ、 前記成膜源上の前記各窓部を通して前記基板をそれぞれ下降させ、前記各成膜 源に 1枚の前記基板をそれぞれ近づけ、前記各成膜源上で前記基板表面への成膜 を行う請求項 11記載の成膜方法。  [12] The windows provided on the turntable are stationary on the film formation source, the substrates are lowered through the windows on the film formation source, and one sheet is provided for each film formation source. 12. The film forming method according to claim 11, wherein the substrate is brought close to each other and film formation is performed on the substrate surface on each film forming source.
PCT/JP2006/311498 2005-06-15 2006-06-08 Film forming device, thin-film manufacturing apparatus, and film forming method WO2006134818A1 (en)

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