JP2003031361A - Manufacturing device for organic el element - Google Patents
Manufacturing device for organic el elementInfo
- Publication number
- JP2003031361A JP2003031361A JP2001211909A JP2001211909A JP2003031361A JP 2003031361 A JP2003031361 A JP 2003031361A JP 2001211909 A JP2001211909 A JP 2001211909A JP 2001211909 A JP2001211909 A JP 2001211909A JP 2003031361 A JP2003031361 A JP 2003031361A
- Authority
- JP
- Japan
- Prior art keywords
- film forming
- substrate
- chamber
- organic
- shaft member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 107
- 239000010408 film Substances 0.000 claims abstract description 95
- 230000007246 mechanism Effects 0.000 claims abstract description 51
- 239000010409 thin film Substances 0.000 claims abstract description 17
- 238000012546 transfer Methods 0.000 claims description 24
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 238000004904 shortening Methods 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 9
- 238000007740 vapor deposition Methods 0.000 description 9
- 230000008020 evaporation Effects 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000009751 slip forming Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000434 metal complex dye Substances 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、複数の成膜室内で
基板上に金属薄膜及び有機薄膜を連続的に成膜すること
により有機エレクトロルミネッセンス素子（有機ＥＬ素
子）を製造する製造装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing apparatus for manufacturing an organic electroluminescent element (organic EL element) by continuously forming a metal thin film and an organic thin film on a substrate in a plurality of film forming chambers. Is.
【０００２】[0002]
【従来の技術】図４は、有機ＥＬ素子を示す断面図であ
る。ガラス基板３０上には、蒸着又はスパッタリングに
より成膜され、パターニングされた例えばＩＴＯ等の透
明電極３１が形成されている。透明電極３１上にはテト
ラアリールジアミン誘導体などからなる正孔注入輸送層
３２が形成されている。この正孔注入輸送層３２上には
発光層３３が形成されている。この発光層３３上には金
属錯体色素等からなる電子注入輸送層３４が形成されて
いる。電子注入輸送層３４上には仕事関数の小さい材料
からなる陰極３５が形成されている。この陰極３５上に
は、酸化を防止するためのＳｉ層３６がコーティングさ
れている。陰極３５及びガラス基板３０の上にはＳｉＯ
2などからなる保護膜３７が形成されており、この保護
膜３７は陰極３５から電子注入輸送層３４の酸化を防止
するものである。2. Description of the Related Art FIG. 4 is a sectional view showing an organic EL element. On the glass substrate 30, a transparent electrode 31 such as ITO, which is formed by vapor deposition or sputtering and patterned, is formed. A hole injecting and transporting layer 32 made of a tetraaryldiamine derivative or the like is formed on the transparent electrode 31. A light emitting layer 33 is formed on the hole injecting and transporting layer 32. An electron injecting and transporting layer 34 made of a metal complex dye or the like is formed on the light emitting layer 33. A cathode 35 made of a material having a low work function is formed on the electron injecting and transporting layer 34. The cathode 35 is coated with a Si layer 36 for preventing oxidation. SiO is formed on the cathode 35 and the glass substrate 30.
A protective film 37 made of 2 or the like is formed, and this protective film 37 prevents the cathode 35 from oxidizing the electron injecting and transporting layer 34.
【０００３】図５（Ａ）は、従来の有機ＥＬ素子の製造
装置の構成を示す平面図である。図５（Ｂ）は、図５
（Ａ）に示すＡ−Ａ線に沿った断面図であり、図５
（Ｃ）は、図５（Ａ）に示すＢ−Ｂ線に沿った断面図で
ある。この有機ＥＬ素子の製造装置は、前記正孔注入輸
送層３２から保護膜３７の形成を作業用真空室１１〜１
６で順次行うものである。FIG. 5A is a plan view showing the structure of a conventional apparatus for manufacturing an organic EL element. FIG. 5B is the same as FIG.
5 is a cross-sectional view taken along the line AA shown in FIG.
5C is a cross-sectional view taken along the line BB shown in FIG. In this organic EL element manufacturing apparatus, the working vacuum chambers 11 to 1 are used to form the protective film 37 from the hole injecting and transporting layer 32.
6 sequentially.
【０００４】図５（Ａ）に示すように、有機ＥＬ素子の
製造装置は真空槽１、ロボット２、先端保持部３、被処
理基板としての有機ＥＬ基板（ガラス基板）４、基板挿
入取出部１０、作業用真空室１１〜１６及びゲートバル
ブ２０などから構成されている。真空槽１内にはロボッ
ト２及び先端保持部３が配置されている。真空槽１内に
は基板挿入取出部１０が形成されている。真空槽１は、
透明電極３１を形成したガラス基板３０に、正孔注入輸
送層３２、発光層３３、電子注入輸送層３４、陰極３
５、Ｓｉ層３６、保護膜３７を連続的に形成するもので
ある。真空槽１の周辺にはクラスタ状に真空室１１〜１
６が配置されている。As shown in FIG. 5 (A), the organic EL element manufacturing apparatus includes a vacuum chamber 1, a robot 2, a tip holding portion 3, an organic EL substrate (glass substrate) 4 as a substrate to be processed, and a substrate insertion / ejection portion. 10, the work vacuum chambers 11 to 16, the gate valve 20, and the like. A robot 2 and a tip holder 3 are arranged in the vacuum chamber 1. A substrate insertion / ejection section 10 is formed in the vacuum chamber 1. The vacuum tank 1
On the glass substrate 30 on which the transparent electrode 31 is formed, the hole injecting / transporting layer 32, the light emitting layer 33, the electron injecting / transporting layer 34, the cathode 3
5, the Si layer 36 and the protective film 37 are continuously formed. The vacuum chambers 11 to 1 are clustered around the vacuum chamber 1.
6 are arranged.
【０００５】ロボット２は、有機ＥＬ基板を順次作業用
真空室１１〜１６に挿入し、取出すためのものであり、
例えば３本のアーム２−１、２−２、２−３を有してい
る。これらのアーム２−１〜２−３は、アーム２−３の
先端に形成された先端保持部３が上下左右の３６０°の
全方向に移動回転可能に構成されている。先端保持部３
は、有機ＥＬ基板４が保持された保持板（図示せず）を
載置するものである。The robot 2 is for sequentially inserting the organic EL substrates into the working vacuum chambers 11 to 16 and taking them out.
For example, it has three arms 2-1, 2-2, 2-3. These arms 2-1 to 2-3 are configured such that a tip holding portion 3 formed at the tip of the arm 2-3 can move and rotate in all directions of 360 ° vertically and horizontally. Tip holding part 3
Is for mounting a holding plate (not shown) holding the organic EL substrate 4.
【０００６】作業用真空室１１は、例えば正孔注入輸送
層３２を蒸着する蒸着工程用の真空室である。図５
（Ｂ）に示すように、作業用真空室１１内には支持基部
６、加熱部７、蒸着源１７が配置されている。The working vacuum chamber 11 is, for example, a vacuum chamber for a vapor deposition process for depositing the hole injecting and transporting layer 32. Figure 5
As shown in (B), a support base 6, a heating unit 7, and a vapor deposition source 17 are arranged in the working vacuum chamber 11.
【０００７】支持基部６は、有機ＥＬ基板が保持された
保持板が載置されるものである。保持板はロボット２に
より支持基部６上の所定の位置に載置される。この状態
で、ゲートバルブ２０を閉じ、加熱部７に通電すれば、
蒸着源１７が有機ＥＬ基板４上に蒸着される。そして、
蒸着終了後、再びゲートバルブ２０を開き、ロボット２
の先端保持部３に蒸着処理された有機ＥＬ基板４を載置
させ、先端保持部３を作業用真空室１１の外に移動さ
せ、次の作業用真空室１２内の支持基部６上に同様に載
置する。このようにして順次作業用真空室における成膜
処理を行うことができる。The support base 6 has a holding plate on which an organic EL substrate is held. The holding plate is placed by the robot 2 at a predetermined position on the support base 6. In this state, if the gate valve 20 is closed and the heating part 7 is energized,
The vapor deposition source 17 is vapor deposited on the organic EL substrate 4. And
After vapor deposition, the gate valve 20 is opened again, and the robot 2
The vapor-deposited organic EL substrate 4 is placed on the tip holding part 3 of the above, and the tip holding part 3 is moved to the outside of the work vacuum chamber 11, and similarly on the support base 6 in the next work vacuum chamber 12. Place on. Thus, the film forming process in the working vacuum chamber can be sequentially performed.
【０００８】作業用真空室１２は発光層３３を蒸着する
ものであり、作業用真空室１３は電子注入輸送層３４を
蒸着するものであり、作業用真空室１４は陰極２５を蒸
着するものであるので、これら各室は前記作業用真空室
１１と同様に構成されている。The working vacuum chamber 12 is for depositing the light emitting layer 33, the working vacuum chamber 13 is for depositing the electron injecting and transporting layer 34, and the working vacuum chamber 14 is for depositing the cathode 25. Therefore, each of these chambers is configured similarly to the working vacuum chamber 11.
【０００９】作業用真空室１５は例えばＳｉ層３６をス
パッタリングにより形成するスパッタリング工程用の真
空室である。図５（Ｃ）に示すように、スパッタリング
用の作業用真空室１５でも蒸着用の作業用真空室と同様
に支持基部６が設けられており、その上方に電極１８が
設置され、その前面にターゲット１９が配置されてい
る。電極１８には高周波源８により高周波電圧が印加さ
れ、室内に発生した高周波放電によりターゲット１９が
スパッタリングされ、支持基部６上に載置された有機Ｅ
Ｌ基板４上にＳｉ層３６が形成される。The work vacuum chamber 15 is a vacuum chamber for a sputtering process for forming the Si layer 36 by sputtering, for example. As shown in FIG. 5 (C), also in the work vacuum chamber 15 for sputtering, the support base 6 is provided in the same manner as the work vacuum chamber for vapor deposition, and the electrode 18 is installed above the support base 6, and on the front surface thereof. A target 19 is arranged. A high-frequency voltage is applied to the electrode 18 by the high-frequency source 8, and the target 19 is sputtered by the high-frequency discharge generated in the room, so that the organic E mounted on the support base 6 is discharged.
The Si layer 36 is formed on the L substrate 4.
【００１０】作業用真空室１６は、例えば保護膜３７を
スパッタリングにより形成するスパッタリング工程用の
真空室であり、前記作業用真空室１５と同様に構成され
ている。The work vacuum chamber 16 is, for example, a vacuum chamber for a sputtering process in which the protective film 37 is formed by sputtering, and has the same structure as the work vacuum chamber 15.
【００１１】[0011]
【発明が解決しようとする課題】上記従来の有機ＥＬ素
子の製造装置では、作業用真空室１１で有機ＥＬ基板４
に正孔注入輸送層３２を蒸着させた後、ゲートバルブ２
０を開き、ロボット２の先端保持部３を駆動して有機Ｅ
Ｌ基板４を作業用真空室１１から取出し、次の作業用真
空室１２内に有機ＥＬ基板４を挿入して支持基部に載置
し、作業用真空室１２からロボット２の先端保持部３を
抜き出し、ゲートバルブ２０を閉じる。このような動作
を繰り返して次の作業用真空室１２〜１６に順に有機Ｅ
Ｌ基板を搬送することにより、ガラス基板に有機ＥＬ素
子を形成する。In the above-described conventional apparatus for manufacturing an organic EL element, the organic EL substrate 4 is placed in the working vacuum chamber 11.
After depositing the hole injecting and transporting layer 32 on the gate valve 2,
0 is opened and the tip holding part 3 of the robot 2 is driven to drive the organic E
The L substrate 4 is taken out from the work vacuum chamber 11, the organic EL substrate 4 is inserted into the next work vacuum chamber 12 and placed on the support base, and the tip holding portion 3 of the robot 2 is removed from the work vacuum chamber 12. Withdraw and close the gate valve 20. By repeating such an operation, the organic E
By transporting the L substrate, the organic EL element is formed on the glass substrate.
【００１２】しかし、このようなロボット２による有機
ＥＬ基板の搬送方式では、作業用真空室内で成膜処理を
施す時間に比べて搬送に長い時間を要することになる。
この搬送時間がスループットの低下の原因となってい
る。[0012] However, in the method of transferring the organic EL substrate by the robot 2 as described above, it takes a long time to carry the film as compared with the time for performing the film forming process in the working vacuum chamber.
This transport time causes a decrease in throughput.
【００１３】本発明は上記のような事情を考慮してなさ
れたものであり、その目的は、基板の搬送時間を短縮す
ることによりスループットを向上できる有機ＥＬ素子の
製造装置を提供することにある。The present invention has been made in consideration of the above circumstances, and an object thereof is to provide an apparatus for manufacturing an organic EL element capable of improving throughput by shortening a substrate transfer time. .
【００１４】[0014]
【課題を解決するための手段】上記課題を解決するた
め、本発明に係る有機ＥＬ素子の製造装置は、複数の成
膜室内で被処理基板上に薄膜を連続的に成膜することに
より有機ＥＬ素子を製造する製造装置であって、回転軸
部材と、この回転軸部材を回転させる回転駆動機構と、
回転軸部材を上下に移動させる上下駆動機構と、回転軸
部材の円周上に配置された、薄膜を成膜する複数の成膜
室と、複数の成膜室の上に配置され、複数の成膜室の各
々と空間的に繋げられ、成膜室から成膜室に被処理基板
を搬送するための搬送室と、この搬送室内に配置され、
回転軸部材の上端に設けられた、複数の成膜室に対応し
た位置で複数の被処理基板を保持する保持部材と、を具
備することを特徴とする。In order to solve the above-mentioned problems, an apparatus for manufacturing an organic EL device according to the present invention is an organic EL device in which a thin film is continuously formed on a substrate to be processed in a plurality of film forming chambers. A manufacturing apparatus for manufacturing an EL element, comprising a rotary shaft member, a rotary drive mechanism for rotating the rotary shaft member,
A vertical drive mechanism for moving the rotating shaft member up and down, a plurality of film forming chambers arranged on the circumference of the rotating shaft member for forming a thin film, and a plurality of film forming chambers arranged on the plurality of film forming chambers. A transfer chamber that is spatially connected to each of the film forming chambers and that transfers a substrate to be processed from the film forming chamber to the film forming chamber, and is arranged in the transfer chamber.
And a holding member which is provided on the upper end of the rotating shaft member and holds a plurality of substrates to be processed at positions corresponding to the plurality of film forming chambers.
【００１５】上記有機ＥＬ素子の製造装置によれば、上
下駆動機構及び回転駆動機構を用いて回転軸部材を上方
に移動させ、回転させ、下方に移動させることにより、
被処理基板を成膜室から隣の成膜室に移動させることが
できる。これにより、従来の有機ＥＬ素子の製造装置に
比べて被処理基板の搬送時間を大幅に短縮することがで
きる。従って、有機ＥＬ素子の製造時間を短縮でき、ス
ループットを向上させることができる。According to the above-mentioned apparatus for manufacturing an organic EL element, by using the vertical drive mechanism and the rotary drive mechanism, the rotary shaft member is moved upward, rotated, and moved downward,
The substrate to be processed can be moved from the film formation chamber to the adjacent film formation chamber. As a result, the transport time of the substrate to be processed can be significantly shortened as compared with the conventional apparatus for manufacturing an organic EL element. Therefore, the manufacturing time of the organic EL element can be shortened and the throughput can be improved.
【００１６】また、本発明に係る有機ＥＬ素子の製造装
置において、上記回転軸部材の円周上には被処理基板を
ロード又はアンロードする予備排気室がさらに配置され
ていることが好ましい。In the organic EL device manufacturing apparatus according to the present invention, it is preferable that a preliminary exhaust chamber for loading or unloading the substrate to be processed is further arranged on the circumference of the rotary shaft member.
【００１７】また、本発明に係る有機ＥＬ素子の製造装
置においては、上記成膜室内の被処理基板を隣の成膜室
内に移動させるように回転駆動機構及び上下駆動機構を
制御する制御部であって、上下駆動機構により回転軸部
材を上方に移動させて搬送室内の上部に保持部材を移動
させることにより成膜室の上方に被処理基板を位置させ
た後、回転駆動機構により回転軸部材を回転させること
により被処理基板を隣の成膜室の上方に位置させ、上下
駆動機構により回転軸部材を下方に移動させて搬送室内
の下部に保持部材を移動させることにより隣の成膜室内
に被処理基板を移動させるように制御する制御部をさら
に含むことが好ましい。Further, in the organic EL element manufacturing apparatus according to the present invention, a control unit for controlling the rotation driving mechanism and the vertical driving mechanism so as to move the substrate to be processed in the film forming chamber to the adjacent film forming chamber. Then, after the rotating shaft member is moved upward by the vertical drive mechanism and the holding member is moved to the upper part of the transfer chamber to position the substrate to be processed above the film forming chamber, the rotary drive mechanism rotates the rotary shaft member. The substrate to be processed is positioned above the adjacent film forming chamber by rotating the substrate, and the rotating shaft member is moved downward by the vertical drive mechanism to move the holding member to the lower part of the transfer chamber. It is preferable to further include a control unit that controls to move the substrate to be processed.
【００１８】[0018]
【発明の実施の形態】以下、図面を参照して本発明の実
施の形態について説明する。図１は、本発明の実施の形
態による有機ＥＬ素子の製造装置の概略構成を示す平面
図である。図２は、図１に示すＣ−Ｃ線に沿った断面図
である。図３は、図１に示すＤ−Ｄ線に沿った断面図で
ある。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a schematic configuration of an organic EL element manufacturing apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line C-C shown in FIG. FIG. 3 is a cross-sectional view taken along the line D-D shown in FIG.
【００１９】有機ＥＬ素子の製造装置４０は、金属成膜
室４２，４３内及び有機成膜室４４〜４８内で基板ホル
ダー７１〜７８に保持された被処理基板（図示せず）上
に金属薄膜及び有機薄膜を連続的に成膜することにより
有機ＥＬ素子を製造する装置である。The apparatus 40 for manufacturing an organic EL element is configured such that a metal is formed on a substrate (not shown) held by substrate holders 71 to 78 in the metal film forming chambers 42 and 43 and the organic film forming chambers 44 to 48. This is an apparatus for manufacturing an organic EL element by continuously forming a thin film and an organic thin film.
【００２０】図１に示すように、有機ＥＬ素子の製造装
置４０は、被処理基板を保持した基板ホルダーをロード
又はアンロードする予備排気室（ロードロック室）４
１、被処理基板に金属薄膜を成膜する金属成膜室４２，
４３、被処理基板に有機薄膜を成膜する有機成膜室４４
〜４８、制御部（図示せず）を有している。この制御部
は、後述するような動作を装置に行わせるように駆動機
構やポンプ等を制御するものである。As shown in FIG. 1, an organic EL element manufacturing apparatus 40 includes a preliminary evacuation chamber (load lock chamber) 4 for loading or unloading a substrate holder holding a substrate to be processed.
1, a metal film forming chamber 42 for forming a metal thin film on a substrate to be processed,
43, an organic film forming chamber 44 for forming an organic thin film on the substrate to be processed
.About.48, a control unit (not shown). The control unit controls a drive mechanism, a pump, and the like so that the device performs an operation described below.
【００２１】ロードロック室４１、金属成膜室４２，４
３及び有機成膜室４４〜４８は円周上に配置されてお
り、その円の中心には図２に示す回転軸部材５９が配置
されている。この回転軸部材５９は、これを回転させる
回転駆動機構６１に接続されていると共に、これを上下
に移動させる上下駆動機構６２に接続されている。Load lock chamber 41, metal film forming chambers 42, 4
3 and the organic film forming chambers 44 to 48 are arranged on the circumference, and the rotary shaft member 59 shown in FIG. 2 is arranged at the center of the circle. The rotary shaft member 59 is connected to a rotary drive mechanism 61 that rotates the rotary shaft member 59, and is also connected to a vertical drive mechanism 62 that vertically moves the rotary shaft member 59.
【００２２】ロードロック室４１、金属成膜室４２，４
３及び有機成膜室４４〜４８の上には搬送室５１が設け
られている。この搬送室５１は、ロードロック室４１、
金属成膜室４２，４３及び有機成膜室４４〜４８それぞ
れと空間的に繋げられており、これらの成膜室から成膜
室に被処理基板を保持した基板ホルダーを搬送するもの
である。Load lock chamber 41, metal film forming chambers 42, 4
3 and the organic film forming chambers 44 to 48 are provided with a transfer chamber 51. The transfer chamber 51 includes a load lock chamber 41,
The metal film forming chambers 42 and 43 and the organic film forming chambers 44 to 48 are spatially connected to each other, and the substrate holder holding the substrate to be processed is transported from these film forming chambers to the film forming chamber.
【００２３】図２に示すように、回転軸部材５９の上端
には基板ホルダー７１〜７８を保持する保持部材５３が
設けられており、この保持部材５３は円板形状を有して
いる。保持部材５３の下面には、基板ホルダー７１〜７
８を保持する第１〜第８の基板保持機構８１〜８８が設
けられている。これら基板保持機構は、基板ホルダーを
保持するフックを有しており、このフックを動かすこと
により基板ホルダーを保持したり基板ホルダーを離脱さ
せたりするように構成されている。As shown in FIG. 2, a holding member 53 for holding the substrate holders 71 to 78 is provided on the upper end of the rotary shaft member 59, and the holding member 53 has a disc shape. Substrate holders 71 to 7 are provided on the lower surface of the holding member 53.
First to eighth substrate holding mechanisms 81 to 88 for holding 8 are provided. These substrate holding mechanisms have a hook for holding the substrate holder, and are configured to hold the substrate holder or detach the substrate holder by moving the hook.
【００２４】搬送室５１は１×１０-6〜１×１０-7Ｔｏ
ｒｒ程度まで真空引き可能なクライオポンプ６３に接続
されており、クライオポンプ６３によって搬送室５１内
を真空引きするようになっている。回転軸部材５９の上
部側は、搬送室５１内に配置されており、上下駆動機構
６２により上下に移動するようになっている。このよう
に搬送室５１の内部と外部を移動する回転軸部材５９と
搬送室壁との間には気密性を保つシール機構が設けられ
ており、このシール機構としては例えば溶接ベローズが
使用されている。The transfer chamber 51 is 1 × 10 −6 to 1 × 10 −7 To.
It is connected to a cryopump 63 capable of vacuuming up to about rr, and the cryopump 63 vacuums the inside of the transfer chamber 51. The upper side of the rotary shaft member 59 is arranged in the transfer chamber 51, and is vertically moved by the vertical drive mechanism 62. In this way, a seal mechanism for maintaining airtightness is provided between the rotary shaft member 59 that moves inside and outside the transfer chamber 51 and the transfer chamber wall. For example, a welding bellows is used as this seal mechanism. There is.
【００２５】上下駆動機構６２は、保持部材５３が搬送
室５１内の上部と下部の間を移動するように回転軸部材
５９を上下移動させるものである。回転駆動機構６１
は、保持部材５３が搬送室５１内の上部に位置する時に
矢印６５の方向に回転するものであって、被処理基板を
保持した基板ホルダーが隣の成膜室上に位置するまでの
距離だけ回転するものである。つまり、図３に示すよう
に被処理基板が保持された基板ホルダーを各々の成膜室
内に配置して被処理基板への成膜処理が行われた後、保
持部材５３を上方に移動させ、その状態（図２に示すよ
うな状態）で保持部材５３を回転させて隣の成膜室上に
各々の基板ホルダーを位置させ、次に、保持部材５３を
下方に移動させることにより、各々の基板ホルダーを隣
の成膜室に搬送する。このように保持部材５３が移動す
るように上下駆動機構６２と回転駆動機構６１は制御さ
れる。これにより、従来の装置に比べて短時間で被処理
基板を次の成膜室に搬送することができる。The vertical drive mechanism 62 vertically moves the rotary shaft member 59 so that the holding member 53 moves between the upper part and the lower part in the transfer chamber 51. Rotary drive mechanism 61
Is to rotate in the direction of arrow 65 when the holding member 53 is located in the upper part of the transfer chamber 51, and is the distance until the substrate holder holding the substrate to be processed is located on the adjacent film forming chamber. It rotates. That is, as shown in FIG. 3, the substrate holders holding the substrate to be processed are placed in the respective film forming chambers to perform the film forming process on the substrate to be processed, and then the holding member 53 is moved upward. In that state (as shown in FIG. 2), the holding member 53 is rotated to position each substrate holder on the adjacent film forming chamber, and then the holding member 53 is moved downward to move each substrate holder. The substrate holder is transferred to the adjacent film forming chamber. The vertical drive mechanism 62 and the rotary drive mechanism 61 are controlled so that the holding member 53 moves in this manner. Thereby, the substrate to be processed can be transferred to the next film forming chamber in a shorter time than the conventional apparatus.
【００２６】ロードロック室４１の内部には、図２に示
すようにロボット５４及びそのアーム５５が配置されて
いる。ロードロック室４１の下にはロボット５４及びそ
のアーム５５を駆動させる駆動機構５６が設けられてい
る。ロードロック室４１内のロボット５４の一方側に
は、被処理基板が保持された基板ホルダーを載置する載
置台５２が設けられている。この載置台５２の下には該
載置台５２を上下方向５８に移動させる上下駆動機構５
７が設けられている。ロードロック室４１内の載置台５
２上に被処理基板を載置させ、上下駆動機構５７により
載置台５２を上方に移動させ、アーム５５により載置台
５２上の被処理基板をつかみ、載置台とは逆側に被処理
基板を移動させ、この被処理基板を第１の基板保持機構
８１によって保持された基板ホルダー７１に保持させ
る。このようにロボット５４及び載置台５２が動くよう
に駆動機構５６及び上下駆動機構５７は制御される。Inside the load lock chamber 41, a robot 54 and its arm 55 are arranged as shown in FIG. A drive mechanism 56 for driving the robot 54 and its arm 55 is provided below the load lock chamber 41. On one side of the robot 54 in the load lock chamber 41, a mounting table 52 for mounting a substrate holder holding a substrate to be processed is provided. Below the mounting table 52, a vertical drive mechanism 5 for moving the mounting table 52 in the vertical direction 58.
7 is provided. Mounting table 5 in the load lock chamber 41
The substrate to be processed is placed on the substrate 2, the mounting table 52 is moved upward by the vertical drive mechanism 57, the substrate to be processed on the mounting table 52 is grasped by the arm 55, and the substrate to be processed is placed on the opposite side of the mounting table. The substrate to be processed is moved and held by the substrate holder 71 held by the first substrate holding mechanism 81. The drive mechanism 56 and the vertical drive mechanism 57 are controlled so that the robot 54 and the mounting table 52 move in this way.
【００２７】ロードロック室４１は１×１０-2〜１×１
０-3Ｔｏｒｒ程度まで真空引き可能なロータリーポンプ
６６に接続されており、ロータリーポンプ６６によって
搬送室５１内を真空引きするようになっている。なお、
ロータリーポンプ６６に替えてコンタミネーション防止
のためにドライポンプを使用することも可能である。The load lock chamber 41 is 1 × 10 -2 to 1 × 1
The rotary pump 66 is connected to a rotary pump 66 capable of vacuuming to about 0 −3 Torr, and the rotary pump 66 vacuums the inside of the transfer chamber 51. In addition,
A dry pump may be used instead of the rotary pump 66 to prevent contamination.
【００２８】有機成膜室４７内には、図３に示すように
マスクホルダー６９が配置されている。このマスクホル
ダー６９にはマスク９６が保持されている。このマスク
９６の下方にはＥＬ蒸着源９１が配置されており、この
ＥＬ蒸着源９１の下には加熱部９３が配置されている。
有機成膜室４７は、加熱部９３によりＥＬ蒸着源９１を
加熱して有機薄膜を被処理基板に蒸着するものである。
また、有機成膜室４７は１×１０-6〜１×１０-7Ｔｏｒ
ｒ程度まで真空引き可能なクライオポンプ６８に接続さ
れており、クライオポンプ６８によって有機成膜室４７
内を真空引きするようになっている。また、有機成膜室
４５の構造も、有機成膜室４７と同様であって図２に示
すように構成されている。また、有機成膜室４４，４
６，４８は、上述した有機成膜室４５，４７と同様に構
成されている。In the organic film forming chamber 47, a mask holder 69 is arranged as shown in FIG. A mask 96 is held on the mask holder 69. An EL evaporation source 91 is arranged below the mask 96, and a heating unit 93 is arranged below the EL evaporation source 91.
The organic film forming chamber 47 heats the EL vapor deposition source 91 by the heating unit 93 to deposit an organic thin film on the substrate to be processed.
In addition, the organic film forming chamber 47 is 1 × 10 −6 to 1 × 10 −7 Tor.
It is connected to a cryopump 68 capable of vacuuming up to about r, and the organic film forming chamber 47 is connected by the cryopump 68.
The inside is evacuated. The structure of the organic film forming chamber 45 is similar to that of the organic film forming chamber 47, and is configured as shown in FIG. In addition, the organic film forming chambers 44, 4
6, 48 are configured similarly to the organic film forming chambers 45, 47 described above.
【００２９】金属成膜室４３内には、図３に示すように
マスクホルダー６９が配置されている。このマスクホル
ダー６９にはマスク９８が保持されている。このマスク
９８の下方には電子ビーム利用の金属蒸着源（ＥＢ−Ｇ
ＵＮ）９５が配置されている。金属成膜室４３は、電子
ビームを蒸発材に照射して加熱することにより蒸発させ
て金属薄膜を被処理基板に蒸着するものである。また、
金属成膜室４３は１×１０-6〜１×１０-7Ｔｏｒｒ程度
まで真空引き可能なクライオポンプ６７に接続されてお
り、クライオポンプ６７によって金属成膜室４３内を真
空引きするようになっている。また、金属成膜室４２
は、上述した金属成膜室４３と同様に構成されている。In the metal film forming chamber 43, a mask holder 69 is arranged as shown in FIG. A mask 98 is held on the mask holder 69. Below the mask 98, a metal vapor deposition source (EB-G) utilizing an electron beam is used.
UN) 95 is arranged. The metal film forming chamber 43 irradiates an evaporation material with an electron beam and heats the evaporation material to evaporate the evaporation material to deposit a metal thin film on a substrate to be processed. Also,
The metal film forming chamber 43 is connected to a cryopump 67 capable of evacuating to about 1 × 10 −6 to 1 × 10 −7 Torr, and the cryopump 67 evacuates the metal film forming chamber 43. ing. In addition, the metal film forming chamber 42
Is configured similarly to the metal film forming chamber 43 described above.
【００３０】次に、上記有機ＥＬ素子の製造装置４０の
動作について説明する。まず、ロードロック室４１内に
被処理基板が保持された基板ホルダーを挿入し、この基
板ホルダーを載置台５２上に載置させる。次いで、ロー
ドロック室４１内をロータリーポンプにより真空引きし
た後、上下駆動機構５７により載置台５２を上方に移動
させる。この際、保持部材５３は搬送室５１の下部に位
置させてある。次いで、アーム５５により基板ホルダー
を載置台５２上から基板保持機構８１側に移動させ、こ
の基板保持機構８１に基板ホルダー７１を保持させる。
なお、各成膜室は真空引きされた状態にある。Next, the operation of the organic EL device manufacturing apparatus 40 will be described. First, the substrate holder holding the substrate to be processed is inserted into the load lock chamber 41, and the substrate holder is mounted on the mounting table 52. Next, after vacuuming the inside of the load lock chamber 41 with a rotary pump, the mounting table 52 is moved upward by the vertical drive mechanism 57. At this time, the holding member 53 is located below the transfer chamber 51. Then, the arm 55 moves the substrate holder from the mounting table 52 to the substrate holding mechanism 81 side, and the substrate holding mechanism 81 holds the substrate holder 71.
Each film forming chamber is in a vacuumed state.
【００３１】この後、上下駆動機構６２により回転軸部
材５９を上方に移動させることにより、搬送室５１の上
部に保持部材５３を位置させる。次に、回転駆動機構６
１により回転軸部材５９を矢印６５の方向に回転させて
基板ホルダー７１を有機成膜室４８の上方に移動させ、
該基板ホルダー７１のピン嵌め込み穴を有機成膜室４８
内のマスクホルダー上のピンに位置合わせする。次に、
上下駆動機構６２により回転軸部材５９を下方に移動さ
せることにより、搬送室５１の下部に保持部材５３を位
置させて基板ホルダー７１を有機成膜室４８内のマスク
ホルダー上のピンに嵌め込んで設置する。After that, the holding shaft 53 is moved upward by the vertical drive mechanism 62 to position the holding member 53 above the transfer chamber 51. Next, the rotation drive mechanism 6
1, the rotary shaft member 59 is rotated in the direction of arrow 65 to move the substrate holder 71 above the organic film forming chamber 48.
The organic film forming chamber 48 is provided with a pin fitting hole of the substrate holder 71.
Align the pins on the mask holder inside. next,
By moving the rotary shaft member 59 downward by the vertical drive mechanism 62, the holding member 53 is positioned below the transfer chamber 51 and the substrate holder 71 is fitted into the pin on the mask holder in the organic film forming chamber 48. Install.
【００３２】次に、マスクホルダーに保持されたマスク
を用いて被処理基板に有機薄膜を蒸着法により成膜す
る。これと同時に、他の有機成膜室４４〜４７及び金属
成膜室４２，４３においてもマスクホルダーに保持され
たマスクを用いて被処理基板に有機薄膜、金属薄膜を蒸
着法により成膜する。Next, an organic thin film is formed on the substrate to be processed by vapor deposition using the mask held by the mask holder. At the same time, in the other organic film forming chambers 44 to 47 and the metal film forming chambers 42 and 43, the organic thin film and the metal thin film are formed on the substrate to be processed by the vapor deposition method using the mask held by the mask holder.
【００３３】この後、上下駆動機構６２及び回転駆動機
構６１により回転軸部材５９を前述したように動かして
有機成膜室４８内で成膜処理した被処理基板を次の有機
成膜室４７内の移動させる。次に、前述したように有機
成膜室４４〜４８及び金属成膜室４２，４３において被
処理基板に成膜処理を行う。Thereafter, the rotating shaft member 59 is moved by the vertical drive mechanism 62 and the rotary drive mechanism 61 as described above, and the substrate to be processed in the organic film forming chamber 48 is processed in the next organic film forming chamber 47. To move. Next, as described above, the film formation process is performed on the substrate to be processed in the organic film formation chambers 44 to 48 and the metal film formation chambers 42 and 43.
【００３４】このように有機成膜室４４〜４８及び金属
成膜室４２，４３で成膜処理が行われた被処理基板は、
ロードロック室４１に移動され、ロードロック室４１か
ら外部に取出される。次いで、新しい被処理基板が保持
された基板ホルダーを前述したようにロードロック室４
１内に挿入し、この基板ホルダーを載置台５２上に載置
させ、前述したような処理が連続して行われる。The substrate to be processed, which has been subjected to the film forming process in the organic film forming chambers 44 to 48 and the metal film forming chambers 42 and 43, is
It is moved to the load lock chamber 41 and taken out of the load lock chamber 41. Then, the substrate holder holding the new substrate to be processed is loaded into the load lock chamber 4 as described above.
1, and the substrate holder is mounted on the mounting table 52, and the above-described processing is continuously performed.
【００３５】上記実施の形態によれば、回転軸部材５９
を上方に移動させ、回転させ、下方に移動させるという
動作により、被処理基板を有機成膜室から隣の有機成膜
室に移動させることができる。これにより、従来の有機
ＥＬ素子の製造装置に比べて被処理基板の搬送時間を大
幅に短縮することができる。従って、有機ＥＬ素子の製
造時間を短縮でき、スループットを向上させることがで
きる。According to the above embodiment, the rotary shaft member 59
The substrate to be processed can be moved from the organic film forming chamber to the adjacent organic film forming chamber by the operation of moving the substrate upward, rotating it, and moving it downward. As a result, the transport time of the substrate to be processed can be significantly shortened as compared with the conventional apparatus for manufacturing an organic EL element. Therefore, the manufacturing time of the organic EL element can be shortened and the throughput can be improved.
【００３６】尚、本発明は上記実施の形態に限定され
ず、本発明の主旨を逸脱しない範囲内で種々変更して実
施することが可能である。The present invention is not limited to the above-mentioned embodiment, and various modifications can be made without departing from the gist of the present invention.
【００３７】[0037]
【発明の効果】以上説明したように本発明に係る有機Ｅ
Ｌ素子の製造装置によれば、上下駆動機構及び回転駆動
機構を用いて回転軸部材を上方に移動させ、回転させ、
下方に移動させることにより、被処理基板を成膜室から
隣の成膜室に移動させることができる。したがって、基
板の搬送時間を短縮することができ、それによりスルー
プットを向上させることができる。As described above, the organic E according to the present invention
According to the L element manufacturing apparatus, the rotary shaft member is moved upward and rotated by using the vertical drive mechanism and the rotary drive mechanism,
By moving it downward, the substrate to be processed can be moved from the film formation chamber to the adjacent film formation chamber. Therefore, the transfer time of the substrate can be shortened, and thus the throughput can be improved.
【図１】本発明の実施の形態による有機ＥＬ素子の製造
装置の概略構成を示す平面図である。FIG. 1 is a plan view showing a schematic configuration of an organic EL element manufacturing apparatus according to an embodiment of the present invention.
【図２】図１に示すＣ−Ｃ線に沿った断面図である。FIG. 2 is a cross-sectional view taken along the line CC shown in FIG.
【図３】図１に示すＤ−Ｄ線に沿った断面図である。FIG. 3 is a cross-sectional view taken along the line DD shown in FIG.
【図４】有機ＥＬ素子を示す断面図である。FIG. 4 is a cross-sectional view showing an organic EL element.
【図５】（Ａ）は、従来の有機ＥＬ素子の製造装置の構
成を示す平面図であり、（Ｂ）は、（Ａ）に示すＡ−Ａ
線に沿った断面図であり、（Ｃ）は、（Ａ）に示すＢ−
Ｂ線に沿った断面図である。5A is a plan view showing a configuration of a conventional organic EL element manufacturing apparatus, and FIG. 5B is a sectional view taken along line AA shown in FIG.
It is sectional drawing which followed the line, (C) is B- shown in (A).
It is sectional drawing along the B line.
１…真空槽 ２…ロボット ２−１，２−２，２−３…アーム ３…先端保持部 ４…有機ＥＬ基板 ６…支持基部 ７…加熱部 ８…高周波源 １０…基板挿入取出部 １１〜１６…作業用真空室 １７…蒸着源 １８…電極 １９…ターゲット ２０…ゲートバルブ ２５…陰極 ３０…ガラス基板 ３１…透明電極 ３２…正孔注入輸送層 ３３…発光層 ３４…電子注入輸送層 ３５…陰極 ３６…Ｓｉ層 ３７…保護膜 ４０…有機ＥＬ素子の製造装置 ４１…予備排気室（ロードロック室） ４２，４３…金属成膜室 ４４〜４８…有機成膜室 ５１…搬送室 ５２…載置台 ５３…保持部材 ５４…ロボット ５５…ロボットのアーム ５６…駆動機構 ５７…上下駆動機構 ５８…上下方向 ５９…回転軸部材 ６１…回転駆動機構 ６２…上下駆動機構 ６３，６４，６７，６８…クライオポンプ ６５…矢印 ６６…ロータリーポンプ ６９…マスクホルダー ７１〜７８…基板ホルダー ８１〜８８…第１〜第８の基板保持機構 ９１，９２…ＥＬ蒸着源 ９３，９４…加熱部 ９５…電子ビーム利用の金属蒸着源（ＥＢ−ＧＵＮ） ９６〜９８…マスク 1 ... vacuum tank 2 ... robot 2-1, 2-2, 2-3 ... Arm 3 ... Tip holding part 4 ... Organic EL substrate 6 ... Support base 7 ... Heating part 8 ... High frequency source 10 ... Board insertion / ejection section 11 to 16 ... Work vacuum chamber 17 ... evaporation source 18 ... Electrode 19 ... Target 20 ... Gate valve 25 ... Cathode 30 ... Glass substrate 31 ... Transparent electrode 32 ... Hole injecting and transporting layer 33 ... Light emitting layer 34 ... Electron injection transport layer 35 ... Cathode 36 ... Si layer 37 ... Protective film 40 ... Manufacturing device for organic EL element 41 ... Preliminary exhaust chamber (load lock chamber) 42, 43 ... Metal film forming chamber 44-48 ... Organic film forming chamber 51 ... Transport room 52 ... Mounting table 53 ... Holding member 54 ... Robot 55 ... Robot arm 56 ... Drive mechanism 57 ... Vertical drive mechanism 58 ... Vertical direction 59 ... Rotating shaft member 61 ... Rotation drive mechanism 62 ... Vertical drive mechanism 63, 64, 67, 68 ... Cryopump 65 ... Arrow 66 ... Rotary pump 69 ... Mask holder 71-78 ... substrate holder 81-88 ... 1st-8th substrate holding mechanism 91, 92 ... EL evaporation source 93, 94 ... Heating unit 95 ... Metal evaporation source using electron beam (EB-GUN) 96-98 ... Mask
Claims (3)
連続的に成膜することにより有機ＥＬ素子を製造する製
造装置であって、 回転軸部材と、 この回転軸部材を回転させる回転駆動機構と、 回転軸部材を上下に移動させる上下駆動機構と、 回転軸部材の円周上に配置された、薄膜を成膜する複数
の成膜室と、 複数の成膜室の上に配置され、複数の成膜室の各々と空
間的に繋げられ、成膜室から成膜室に被処理基板を搬送
するための搬送室と、 この搬送室内に配置され、回転軸部材の上端に設けられ
た、複数の成膜室に対応した位置で複数の被処理基板を
保持する保持部材と、 を具備することを特徴とする有機ＥＬ素子の製造装置。1. A manufacturing apparatus for manufacturing an organic EL element by continuously forming a thin film on a substrate to be processed in a plurality of film forming chambers, wherein the rotating shaft member and the rotating shaft member are rotated. A rotary drive mechanism, a vertical drive mechanism for moving the rotary shaft member up and down, a plurality of film forming chambers for forming thin films arranged on the circumference of the rotary shaft member, and a plurality of film forming chambers And a transfer chamber that is spatially connected to each of the plurality of film forming chambers and that transfers a substrate to be processed from the film forming chamber to the film forming chamber. An apparatus for manufacturing an organic EL element, comprising: a holding member which holds a plurality of substrates to be processed at positions provided corresponding to a plurality of film forming chambers.
をロード又はアンロードする予備排気室がさらに配置さ
れていることを特徴とする請求項1に記載の有機ＥＬ素
子の製造装置。2. The apparatus for manufacturing an organic EL device according to claim 1, further comprising a preliminary exhaust chamber arranged on the circumference of the rotary shaft member for loading or unloading the substrate to be processed. .
内に移動させるように回転駆動機構及び上下駆動機構を
制御する制御部であって、上下駆動機構により回転軸部
材を上方に移動させて搬送室内の上部に保持部材を移動
させることにより成膜室の上方に被処理基板を位置させ
た後、回転駆動機構により回転軸部材を回転させること
により被処理基板を隣の成膜室の上方に位置させ、上下
駆動機構により回転軸部材を下方に移動させて搬送室内
の下部に保持部材を移動させることにより隣の成膜室内
に被処理基板を移動させるように制御する制御部をさら
に含むことを特徴とする請求項１又は２に記載の有機Ｅ
Ｌ素子の製造装置。3. A control unit for controlling a rotation drive mechanism and a vertical drive mechanism so as to move a substrate to be processed in the film formation chamber to an adjacent film formation chamber, wherein the rotation shaft member is moved upward by the vertical drive mechanism. After the substrate to be processed is positioned above the film forming chamber by moving the holding member to the upper part of the transfer chamber, the substrate to be processed is formed on the adjacent film by rotating the rotary shaft member by the rotation drive mechanism. A control unit that is located above the chamber and moves the rotating shaft member downward by the vertical drive mechanism to move the holding member to the lower part of the transfer chamber to move the substrate to be processed into the adjacent film forming chamber. The organic E according to claim 1 or 2, further comprising:
L element manufacturing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001211909A JP3843225B2 (en) | 2001-07-12 | 2001-07-12 | Organic EL device manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001211909A JP3843225B2 (en) | 2001-07-12 | 2001-07-12 | Organic EL device manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003031361A true JP2003031361A (en) | 2003-01-31 |
| JP3843225B2 JP3843225B2 (en) | 2006-11-08 |
Family
ID=19047152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001211909A Expired - Fee Related JP3843225B2 (en) | 2001-07-12 | 2001-07-12 | Organic EL device manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3843225B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006134818A1 (en) * | 2005-06-15 | 2006-12-21 | Ulvac, Inc. | Film forming device, thin-film manufacturing apparatus, and film forming method |
| KR100800236B1 (en) * | 2005-04-20 | 2008-02-01 | 어플라이드 매터리얼스 게엠베하 운트 컴퍼니 카게 | Continuous OLED coating machine |
-
2001
- 2001-07-12 JP JP2001211909A patent/JP3843225B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100800236B1 (en) * | 2005-04-20 | 2008-02-01 | 어플라이드 매터리얼스 게엠베하 운트 컴퍼니 카게 | Continuous OLED coating machine |
| WO2006134818A1 (en) * | 2005-06-15 | 2006-12-21 | Ulvac, Inc. | Film forming device, thin-film manufacturing apparatus, and film forming method |
| JP4855398B2 (en) * | 2005-06-15 | 2012-01-18 | 株式会社アルバック | Film forming apparatus, thin film manufacturing apparatus, and film forming method |
| TWI393793B (en) * | 2005-06-15 | 2013-04-21 | Ulvac Inc | Film forming device, manufacturing device of thin film, and film forming method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3843225B2 (en) | 2006-11-08 |
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