KR101225213B1 - Oled encapsulation apparatus and method of the same - Google Patents

Abstract

The present invention relates to an OLED encapsulation device and method, and more particularly, to an OLED encapsulation device and method capable of continuously performing a series of processes for encapsulation because the substrate is supplied to each process chamber by rotating the moving chamber. It is about.
The OLED encapsulation device according to the present invention includes a main chamber having a plurality of openings formed on sidewalls; At least one moving chamber provided inside the main chamber to move the OLED element by rotation; A first process chamber provided outside the opening of the main chamber and forming a first protective layer with respect to the OLED device supplied through the moving chamber; And a second process chamber provided outside the opening of the main chamber and forming a second protective layer on the OLED device supplied through the moving chamber.

Description

OLED encapsulation device and method {OLED ENCAPSULATION APPARATUS AND METHOD OF THE SAME}

The present invention relates to an OLED encapsulation device and method for encapsulating the thin film to prevent oxidation and penetration of moisture after the formation of the OLED thin film, and more particularly, to supply a substrate to each process chamber in a standing state by rotating a moving chamber. Therefore, the present invention relates to an OLED encapsulation device and method capable of continuously performing a series of processes for encapsulation.

1 illustrates a general OLED device. As shown, the thin film layer 120 is formed on the substrate 100, and the first protective layer 130 and the second protective layer 140 are formed on the thin film layer 120 as a thin film encapsulation structure. The thin film layer 120 includes an anode, a hole injection layer (hereinafter referred to as "HIL"), a hole transfer layer (hereinafter referred to as "HTL"), and a light emitting layer on a substrate. emitting layer, hereinafter referred to as 'EL'), eletron transfer layer (hereinafter referred to as 'ETL'), electron injection layer (hereinafter referred to as 'EIL'), cathode It is laminated | stacked and formed in this order.

In addition, the first protective layer is a ceramic layer, the second protective layer is formed of a polymer layer. The ceramic layer is used as a blocking layer to prevent the penetration of moisture and gas, and the polymer layer is used as a buffer layer to relieve internal stress of the ceramic blocking layer or to fill the microcracks and pin holes of the blocking layer.

In order to encapsulate an OLED device as described above, a cluster type encapsulation system for processing a substrate while being transported in a horizontal state has been disclosed.

The cluster type device 200 will be described with reference to FIG. 1.

A conveying chamber 210 having a conveying robot 211 is provided at a center thereof, and a loading chamber 220, a first mask stocker 330, and a second mask stocker 240 are provided on an outer wall of the conveying chamber 210. ), A first process chamber 250, a second process chamber 260, and an unloading chamber 270.

The substrate stocker 220 includes a plurality of substrates stacked in a horizontal state, and the first mask stocker 230 and a second mask stocker 240 each stack a plurality of first masks and a second mask in a horizontal state. It is.

In addition, the first process chamber 250 and the second process chamber 260 form a first protective layer and a second protective layer, respectively.

A method of encapsulating an OLED device with the apparatus 200 shown in FIG. 1 will be described.

First, the substrate in the substrate stocker 220 is loaded into the first process chamber 250 by the transfer robot 211, and the first mask in the first mask stocker 230 is transferred to the first process chamber 250 by the transfer robot 211. Into the chamber 250, a second mask in the second mask stocker 240 is brought into the second process chamber 260.

Next, after aligning the substrate and the first mask, a first protective layer is formed in the first process chamber 250.

Next, the substrate in the first process chamber 250 is loaded into the second process chamber 260 by the transfer robot 211, the substrate and the second mask are aligned, and then in the second process chamber 260. A second protective layer is formed.

In this manner, the substrate on which the first protective layer and the second protective layer are formed is conveyed to the unloading chamber 270.

On the other hand, in recent years, as the process is standardized, a large area of the substrate has been increased. In the case of a cluster type substrate processing system, as the area of the substrate increases, the transfer chamber becomes too large to cope with the large area of the substrate. In addition, as described above, the number of process chambers provided on the outer side of the transfer chamber is limited.

In addition, the transfer robot is expensive, its control is difficult, and the transfer process of the substrate and the mask is very complicated and the process tack type is long.

Accordingly, an in-line encapsulation system for processing a substrate while transferring the substrate in a vertical state so as to encapsulate a large area substrate and effectively increase the number of process chambers has been disclosed. The in-line OLED encapsulation system is configured by placing a process chamber in-line according to the process order to load a substrate to form a thin film corresponding to the first protective layer and the second protective layer. Therefore, the in-line system has a problem in that the space occupied by the equipment is long, and thus, the process transfer time is long because the area for transferring the substrate becomes large.

In particular, a problem arises in the transfer of the mask used for each process.

The present invention has been made to solve the above-described problems, the object of the present invention is to rotate the moving chamber to supply the OLED element to each process chamber in the standing state, which can perform a series of processes for encapsulation continuously An OLED encapsulation device and method are provided.

In order to solve the above technical problem, the OLED encapsulation device according to the present invention comprises a main chamber in which a plurality of openings are formed on the sidewalls; At least one moving chamber provided inside the main chamber to move the OLED element by rotation; A first process chamber provided outside the opening of the main chamber and forming a first protective layer with respect to the OLED device supplied through the moving chamber; And a second process chamber provided outside the opening of the main chamber and forming a second protective layer on the OLED device supplied through the moving chamber.

In addition, it is preferable that the rotation means for rotating the moving chamber in the main chamber is further provided.

In addition, the rotating means is preferably a rotating table equipped with the moving chamber on the upper surface.

In addition, it is preferable that a sealing means for airflow communication between the main chamber and the opening of the moving chamber is further provided.

In addition, the sealing means is preferably a bellows.

In addition, the first process chamber and the second process chamber is preferably provided with a thin film forming means for forming the first protective layer or the second protective layer in the OLED device, respectively.

In addition, it is preferable that a mask stocker is further provided outside the first process chamber and the second process chamber.

In addition, the first process chamber and the second process chamber is preferably further provided with alignment means for aligning the mask and the OLED element.

In addition, the first and second process chambers are preferably provided with a plurality of alternating.

In addition, it is preferable that the OLED element is positioned in the moving chamber and the process chamber at a predetermined angle inclined from the vertical or vertical.

In addition, the main chamber is preferably a planar shape of a circular or polygonal.

The OLED encapsulation method according to the present invention comprises the steps of: 1) loading an OLED element into a rotatable moving chamber; 2) rotating the moving chamber to be in line with the first process chamber; 3) transferring the OLED element to the first process chamber; 4) forming a first protective layer on the OLED device in the first process chamber; 5) transferring the OLED element from the first process chamber to the moving chamber; 6) rotating the moving chamber to be in line with the second process chamber; 7) transferring the OLED element to the second process chamber; And 8) forming a second protective layer on the OLED device in the second process chamber.

In addition, it is preferable that the first protective layer is a ceramic, and the second protective layer is a polymer layer.

According to the present invention, since the substrate is supplied to each process chamber in a standing state by rotating the moving chamber, there is an effect that a series of processes for encapsulation can be continuously performed. In addition, since the movement path of the substrate is shortened and a plurality of process chambers can simultaneously process different substrates, there is an effect that the process tack time can be shortened.

1 illustrates an OLED device having a general thin film encapsulation structure.
Figure 2 shows a conventional OLED encapsulation device.
3 to 5 show an OLED encapsulation device according to the present invention.
6 to 11 show the operating state of the apparatus shown in FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, configurations and operating states of embodiments of the present invention will be described with reference to the accompanying drawings.

Referring to FIG. 3, according to the embodiment 1 of the present invention, a main chamber 10 is provided at a center thereof, and two first process chambers 51 and two second process chambers (outside the main chamber) are provided. 52, a mask stocker MS is disposed outside the first and second process chambers 51 and 52, and a moving chamber 20 is provided inside the main chamber 10.

The main chamber 10 is a chamber in which a planar shape is made of a circle or a polygon, and a vacuum pump for forming a degree of vacuum is connected. In addition, the main chamber 10 has a plurality of openings 11 formed on sidewalls for entering and exiting OLED elements (hereinafter, referred to as substrates).

The first and second process chambers 51 and 52 are fixed to the outside of each opening 11 of the main chamber 10.

In addition, the mask stocker MS accommodates the mask to be supplied to or exchanged with the first and second process chambers 51 and 52.

In addition, a plurality of moving chambers 20 having openings formed at one side wall are provided in the main chamber 10. In this embodiment, the number of first and second process chambers 51 and 52 is provided. Alternatively, however, it can be configured in any suitable number. In addition, since the plurality of moving chambers 20 are provided on the rotary table 30, rotational movement is possible. Specifically, each moving chamber 20 is stepped to be in line with each of the process chambers 51 and 52.

In addition, a sealing means for airflow communication between the moving chamber 20 and each process chamber (51, 52) is provided. In this embodiment the sealing means consists of an expandable bellows B surrounding the opening 11 of the main chamber 10. That is, the bellows B is contracted so as not to interfere during the movement by the rotation of the moving chamber 20, the step movement of the moving chamber 20 is completed, and during the process, the bellows B is moved toward the moving chamber direction. By extending, the opening 11 of the main chamber 10 and the opening of the moving chamber 20 are in air communication.

In addition, in the present embodiment, the loading chamber 40 for loading the substrate and the unloading chamber 60 for unloading the processed substrate are provided with the gate valve G1 interposed outside of the main chamber 10. . Substrate stockers (SS) for loading a substrate are provided on the outside of the loading chamber 40 and the unloading chamber 60, respectively. Gate valves G2 are also provided between the substrate stocker SS and the loading chamber 40 and the unloading chamber 60, respectively. Alternatively, the loading / unloading chamber may be configured as one instead of the loading chamber 40 / unloading chamber 60 separately, or the substrate may be directly loaded into the first process chamber 51 or the second process chamber may be used. It is also possible to unload the substrate at 52.

In this embodiment, the substrate is standing in a state of being inclined at a predetermined angle from vertical or vertical, and is fixed and conveyed, and a process is performed.

Referring to FIG. 4, a mask stocker MS is fixedly installed outside the first process chamber 51, and a main chamber 10 and a moving chamber 20 are positioned inside the first process chamber 51. In addition, gate valves G2 and G1 are provided between the first process chamber 51 and the mask stocker MS and between the first process chamber 51 and the main chamber 10, respectively.

A plurality of mask frames MF on which the mask M is fixed are stored in the mask stocker MS. The mask M is a mask suitable for the process of the neighboring first process chamber 51. Accordingly, the mask stocker includes a mask to be supplied to the first process chamber and a mask which needs to be cleaned in an iterative process together with the mask frame MF. The gate valve G2 provided in the meantime opens only when conveying the mask M in this way, and closes during process execution.

However, when the gate valve G1 provided between the first process chamber 51 and the main chamber 10 maintains the vacuum while the main chamber 10 maintains a vacuum, only the first process chamber 51 is opened separately. will be. Therefore, the gate valve G1 is open during the non-maintenance process.

In addition, openings 51a and 51b are formed in both side walls of the first process chamber 51 to transport the substrate S and the mask M, respectively.

Referring to the process in the first process chamber 51, when the substrate S is supplied through the moving chamber 20, the bellows B is extended to move the moving chamber 20 and the first process chamber 51. In this state, the substrate S is brought into the first process chamber 51. On the other hand, the mask M loaded on the mask stocker MS is carried into the first process chamber 51.

Next, after aligning the substrate S and the mask M, a first protective layer is formed on the substrate S. FIG.

Therefore, the first process chamber 51 is provided with alignment means (not shown) for aligning the substrate S and the mask M. FIG. The alignment means is known means, for example, a vision camera or mechanical alignment means.

In addition, the first process chamber 51 is provided with thin film forming means 51c for forming the first protective layer on the substrate. The first protective layer is formed by sputtering, chemical vapor deposition, or electron beam deposition, which are generally known using a gas and a high moisture barrier material such as various metals, metal oxides and metal nitrides as ceramic layers.

In addition, a mask conveying means (not shown) is provided for exchanging the mask M between the first process chamber 51 and the mask stocker MS. The mask conveying means (not shown) may use a known means, for example, a horizontal reciprocation between the first process chamber 51 and the mask stocker MS is provided with a mask frame for fixing the mask M in an upright state. And an LM guide for moving or a moving means of magnetic levitation type for vibration prevention.

Similarly, the substrate conveying means which conveys the board | substrate S between the said movement chamber 20 and the 1st process chamber 51 is provided. The substrate conveying means is a known means such as an LM guide for horizontally moving the substrate holder like the mask conveying means.

In the case of a predetermined substrate treatment, the substrate S and the mask M may be treated in a fixed state. Alternatively, the substrate S and the mask M may be fixed, or alternatively, between the first process chamber 51 or between the first process chamber 51 and the moving chamber 20. Can be processed while scanning.

Referring to FIG. 5, a mask stocker MS is fixedly installed on an outer side of the second process chamber 52, and a main chamber 10 and a moving chamber 20 are positioned on an inner side thereof. In addition, gate valves G2 and G1 are provided between the second process chamber 52 and the mask stocker MS and between the second process chamber 52 and the main chamber 10, respectively.

A plurality of mask frames MF on which the mask M is fixed are stored in the mask stocker MS. The mask M is a mask suitable for the process of the neighboring second process chamber 52. Accordingly, the mask stocker includes a mask to be supplied to the second process chamber and a mask to be cleaned in a repetitive process together with the mask frame MF. The gate valve G2 provided in the meantime opens only when conveying the mask M in this way, and closes during process execution.

However, when the gate valve G1 provided between the second process chamber 52 and the main chamber 10 maintains the vacuum while the main chamber 10 maintains a vacuum, only the second process chamber 52 is opened separately. will be. Therefore, the gate valve G1 is open during the non-maintenance process.

In addition, openings 52a and 52b are formed in both side walls of the second process chamber 52 to transport the substrate S and the mask M, respectively.

Referring to the process in the second process chamber 52, when the substrate S is supplied through the moving chamber 20, the bellows B is extended to move the moving chamber 20 and the second process chamber 52. In this state, the substrate S is carried into the second process chamber 52. On the other hand, the mask M loaded on the mask stocker MS is carried into the second process chamber 52.

Next, after aligning the substrate S and the mask M, a second protective layer is formed on the substrate S.

Therefore, the second process chamber 52 is provided with alignment means (not shown) for aligning the substrate S and the mask M. FIG. The alignment means is known means, for example, a vision camera or mechanical alignment means.

In addition, the second process chamber 52 is provided with thin film forming means 52c for forming the second protective layer on the substrate. As the second protective layer, a polymer layer is formed by depositing the acrylic or epoxy monomer in a vacuum, followed by curing by ultraviolet or electron beam irradiation, or polymerization in a plasma state in vacuum. In addition, a general method of coating a monomer in a solution or a liquid form at atmospheric pressure without using a vacuum, such as spin coating or casting, and then irradiating and curing ultraviolet rays is also used.

In FIG. 5, the thin film forming means 52c is connected to a crucible D for vaporizing a monomer.

The mask conveyance means (not shown) and the substrate conveyance means are as described above.

6 to 11, an operating state of the present embodiment and an OLED encapsulation method using the present embodiment will be described.

First, the process chambers 51 and 52 are loaded into the process chamber in a state where a mask required for each process is fixed to the mask frame. In this state, after opening the gate valve G2 between the loading chamber 40 and the substrate stocker SS, the first substrate S1 loaded on the substrate stocker SS is loaded through the loading chamber 40. It carries in to the 1st moving chamber 21 (refer FIG. 6).

Next, the first moving chamber 21 is rotated using the rotary table 30 so as to be aligned with the first process chamber 51 (see FIG. 7).

Next, after transferring the first substrate S1 to the first process chamber 51, the mask M and the first substrate S1 are aligned, and then a first protective layer on the first substrate S1. To form. On the other hand, the second substrate S2 is loaded into the second moving chamber 22 from the substrate stocker SS (see FIG. 8).

Next, the first substrate S1 on which the first protective layer is formed in the first process chamber 51 is transferred to the first moving chamber 21 again (see FIG. 9).

Next, the moving chambers are rotated again using the rotary table 30. As a result, the first moving chamber 21 is located in line with the second process chamber 52, the second moving chamber 22 is located in line with the first process chamber 51, and the third moving chamber Reference numeral 23 is located in line with the loading chamber 40 (see Fig. 10).

In this state, the first substrate S1 is transferred to the second process chamber 52, and the second substrate S2 is transferred to the first process chamber 51. In this state, the mask M and the first substrate S1 are aligned to form a second protective layer, and the mask M and the second substrate S2 are aligned to form a first protective layer. On the other hand, the third substrate S3 is transferred from the substrate stocker SS to the third moving chamber 23.

This method is repeated to form a first protective layer, a second protective layer, a first protective layer, and a second protective layer on each substrate, and then to the substrate stocker (SS) through the unloading chamber 60.

Through such an embodiment to form a thin-film encapsulation structure by sequentially stepping while rotating the substrate.

According to the present invention, a large number of process chambers can be arranged outside the main chamber because the substrate is transported and processed in an upright state, and a mask stocker is provided on the outside of each process chamber. The replacement is very simple and can be made in a short time.

10: main chamber 20: moving chamber
30: rotary table 40: loading chamber
50: process chamber 60: unloading chamber
SS: Substrate Stocker MS: Mask Stocker

Claims (14)

A main chamber having a plurality of openings formed in sidewalls;
At least one moving chamber provided inside the main chamber to move the OLED element by rotation;
A first process chamber provided outside the opening of the main chamber and forming a first protective layer with respect to the OLED device supplied through the moving chamber;
A second process chamber provided outside the opening of the main chamber and forming a second protective layer on the OLED device supplied through the moving chamber; And
And a sealing means for communicating the opening of the main chamber and the moving chamber in an air flow.
The method of claim 1,
OLED encapsulation device further comprises a rotating means for rotating the moving chamber in the main chamber.
The method of claim 2,
The rotating means is an OLED encapsulation device, characterized in that the rotating table is mounted on the upper chamber.
delete The method of claim 1,
OLED sealing device, characterized in that the sealing means is a bellows.

delete The method of claim 1,
OLED encapsulation device, characterized in that the mask stocker is further provided on the outer side of the first process chamber and the second process chamber.
delete delete The method of claim 1,
And the OLED element is positioned in the moving chamber and the process chamber in a state in which the OLED element is inclined at a predetermined angle from vertical or vertical.
delete 1) loading the OLED element into the rotatable moving chamber;
2) rotating the moving chamber to be in line with the first process chamber;
3) transferring the OLED element to the first process chamber;
4) forming a first protective layer on the OLED device in the first process chamber;
5) transferring the OLED element from the first process chamber to the moving chamber;
6) rotating the moving chamber to be in line with the second process chamber;
7) transferring the OLED element to the second process chamber; And
8) forming a second protective layer on the OLED device in the second process chamber;
After the step 2), the moving chamber and the process chamber is in air flow communication; OLED encapsulation method comprising a further.
delete delete

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