WO2006134818A1 - Dispositif de formation de film, appareil de fabrication de film mince et procédé de formation de film - Google Patents

Dispositif de formation de film, appareil de fabrication de film mince et procédé de formation de film Download PDF

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Publication number
WO2006134818A1
WO2006134818A1 PCT/JP2006/311498 JP2006311498W WO2006134818A1 WO 2006134818 A1 WO2006134818 A1 WO 2006134818A1 JP 2006311498 W JP2006311498 W JP 2006311498W WO 2006134818 A1 WO2006134818 A1 WO 2006134818A1
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WO
WIPO (PCT)
Prior art keywords
film forming
chamber
film
carry
window
Prior art date
Application number
PCT/JP2006/311498
Other languages
English (en)
Japanese (ja)
Inventor
Toshio Negishi
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to JP2007521256A priority Critical patent/JP4855398B2/ja
Publication of WO2006134818A1 publication Critical patent/WO2006134818A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Definitions

  • Film forming apparatus thin film manufacturing apparatus, and film forming method
  • the present invention provides a film forming apparatus and a film forming method.
  • a film forming apparatus in which a plurality of types of films are stacked on one substrate, such as an organic EL element, includes a film forming apparatus in which a plurality of film forming chambers are connected to one moving chamber.
  • the substrate on which one type of film is formed in one film forming chamber is once taken out to the moving chamber by a transfer robot installed in the moving chamber and then transferred to another film forming chamber. A new film is formed.
  • An in-line type film forming apparatus configured such that a plurality of film forming sources are arranged in a straight line and a plurality of substrates pass in sequence on each film forming source does not require a complicated structure of a transfer robot.
  • the time required to send the substrate onto the deposition source can be shortened.
  • the in-line type deposition system has the problem of requiring a large installation space.
  • in-line type film forming apparatuses rotate a rotating roller on which a substrate is placed to convey the substrate, and dust may be generated when the rotating roller rotates.
  • the substrate is moved on the film forming source, it is necessary to install a rotating roller on the film forming source. If the dust falls on the film forming source, the film forming source is contaminated.
  • Patent Document 1 Japanese Patent Laid-Open No. 2003-27213
  • the present invention was created to solve the above-described disadvantages of the prior art.
  • the purpose of the present invention is to shorten the tact time and narrow the installation place when continuously forming a plurality of substrates.
  • the present invention provides a film forming apparatus.
  • the present invention provides a film forming apparatus comprising: a moving chamber; a turntable disposed in the moving chamber; and a plurality of film forming chambers connected to the moving chamber.
  • Each film forming chamber has a film forming source disposed below the turntable, and the film forming source is configured to release film forming material particles, and the turntable includes a plurality of film forming sources.
  • a window portion is formed, and a placement plate on which a processing object can be placed is disposed on each window portion, and when the turntable is rotated in a horizontal plane, each window portion is formed with the film.
  • a film forming apparatus configured to be able to move a film forming place above a source.
  • the present invention is a film forming apparatus, wherein the window portions are arranged in a line at equal intervals on the same circumference around the rotation center of the turntable, and the window portions are statically placed in one film forming location.
  • the film forming apparatus is configured such that when stopped, the window portion also stops at other film forming locations.
  • the present invention is a film forming apparatus, wherein a carrying-in chamber is connected to the moving chamber, a carrying robot is arranged in the carrying-in chamber, and a moving robot moves on the moving path along which the window portion moves.
  • Carrying-in chamber force A carrying-in place is provided where the processed object to be carried is placed on the placing plate, and the number of the window portions is larger than the number of film-forming places.
  • the film forming apparatus is configured such that when each of the window portions is stationary, the window portion is also stationary at the loading place.
  • the present invention is a film forming apparatus, wherein a carry-out chamber is connected to the moving chamber, a transfer robot is arranged in the carry-out chamber, and the object to be processed is placed on the moving path by the transfer robot. An unloading place to be carried out from the mounting plate on the part to the unloading chamber is provided, and when the window part is made stationary at the carrying-in place, the window part is also made stationary at the unloading place. Film forming apparatus.
  • the present invention is a film forming apparatus, wherein the film forming place is arranged between the carrying-in place and the carrying-out place, and between the carrying-in place and the film-forming place adjacent to the carrying-in place.
  • a film forming apparatus in which a distance, a distance between the unloading place and the film forming place adjacent to the unloading position, and a distance between the film forming place and the film forming place are substantially equal to each other.
  • This invention is a film-forming apparatus, Comprising: The space
  • the present invention is a film forming apparatus, wherein the placement plate includes a placement portion smaller than the window portion, and a claw portion provided around the placement portion.
  • the claw portion is placed on the edge of the window portion and disposed on the window portion, the window portion has a notch in the periphery, and rotates the mounting plate located above the turntable, and the claw portion When the claw portion is allowed to pass through the notch of the window portion located on the film forming chamber in a state where the portion is aligned with the position of the notch, the mounting plate moves below the turn table.
  • the film forming apparatus is configured as described above.
  • the present invention is a film forming apparatus having a holding portion capable of holding the mounting plate, and the mounting plate is held by the holding portion and passes through the window portion together with the holding portion.
  • the film forming apparatus is configured to be possible.
  • the present invention is a film forming apparatus, wherein the holding unit is configured to be rotatable in a horizontal plane together with the mounting plate held by the holding unit.
  • the present invention is a manufacturing apparatus having a plurality of film forming apparatuses, and each of the film forming apparatuses includes a moving chamber, a turntable disposed in the moving chamber, and a plurality of components connected to the moving chamber.
  • Each film forming chamber has a film forming source disposed below the turntable, and the film forming source is configured to discharge film forming material particles, and the turntable
  • a plurality of windows are formed on each of the windows, and a mounting plate on which a processing object can be placed is disposed on each of the windows, and when the turntable is rotated in a horizontal plane
  • the unit is configured to be able to move a film forming location above the film forming source, and each moving chamber is connected to a loading chamber and a loading chamber, respectively, and is transported to the inside of the loading chamber and the inside of the unloading chamber.
  • Each robot is arranged on the moving path along which the window moves.
  • a loading place where the processing object carried in from the loading chamber by the transport robot is placed on the mounting plate, and the processing target object from the mounting plate on the window section by the transport robot.
  • Each unloading place to be unloaded to the unloading chamber is set up.
  • the number of the window portions is larger than the number of film formation locations, and when the window portions are stopped at the respective film formation locations, the window portions are also provided at the carry-in location and the carry-out location.
  • Each of the film forming chambers is configured to be stationary, and the carry-in chamber of one film forming chamber is a manufacturing apparatus connected to the carry-out chamber of the other film forming chamber.
  • the substrate is sequentially transferred onto a plurality of film forming sources, and the film forming material discharged from the film forming source is made to reach the surface of the substrate on each film forming source.
  • the present invention is a film forming method, wherein each of the windows provided on the turntable is stationary on the film forming source, the substrate is lowered through the windows on the film forming source, In this film formation method, one substrate is brought close to a film formation source, and film formation is performed on the substrate surface on each film formation source.
  • the step of sending a substrate from the carry-in location to the first deposition location, the step of sending the substrate from one deposition location to another deposition location, and the delivery from the last deposition location Since the process of sending the substrate to the place and the process of returning the empty placement plate to the unloading place / loading place are performed each time, the time for carrying the substrate to each place is shortened. Since the loading and unloading of the substrate and the movement to the film formation place are all performed on the same turntable, the installation place is smaller than the conventional inline type. Since the substrate is transported by rotating the turntable, no dust is generated on the film forming source and the film forming source is not contaminated.
  • FIG. 1 is a cross-sectional view illustrating an example of an organic EL element
  • FIG. 2 is a diagram for explaining an example of the production apparatus of the present invention.
  • FIG. 3 is a partial sectional view of the film forming apparatus of the present invention.
  • FIG.4 Diagram explaining the positional relationship between the loading location, deposition location, and unloading location
  • FIG. 6 (a): Plan view when placing the placement plate on the edge of the window, (b): Placement plate is the window Plan view when passing through
  • FIG. 7 (a), (b): Cross-sectional views explaining the process of lowering the mounting plate
  • FIG. 8 (a), (b): Cross-sectional views explaining the process of raising the mounting plate
  • FIG. 9 (a) to (c): Cross-sectional views explaining the process of manufacturing an organic EL device
  • Reference numeral 10 in Fig. 1 shows an example of an organic EL element manufactured by using the film forming apparatus of the present invention.
  • the organic EL element 10 has a transparent support plate 11. Convex partition walls 29 are regularly arranged on the surface of the support plate 11, and the lower electrode film 13 is disposed between the partition walls 29.
  • light emitting dots 20R, 20G, and 20B of three different colors are arranged on the lower electrode film 13.
  • the light emitting dots 20R, 20G, and 20B have red, green, or blue light emitting layers 16R, 16G, and 16B, and a voltage is applied between the upper electrode film 19 and the lower electrode film 13 at the top. When it is energized, it emits light in red, green, and blue, respectively.
  • each of the light emitting dots 20R, 20G, and 20B has the same configuration except that the colors of the light emitting layers 16R, 16G, and 16B are different, and each of the light emitting dots 20R, 20G, and 20B has a hole from the lower layer.
  • the injection layer 14, the hole transport layer 15, the light emitting layers 16 R, 16 G, and 16 B, the electron transport layer 17, the electron injection layer 18, and the upper electrode film 19 are configured.
  • Reference numeral 1 in FIG. 2 shows an example of the manufacturing apparatus of the present invention for manufacturing the organic EL element 10.
  • the manufacturing apparatus 1 includes a carry-in part A, a film forming part L, and a carry-out part M.
  • the film forming unit L includes one or more film forming apparatuses 5R, 5G, and 5B.
  • the film forming apparatuses 5R, 5G, and 5B have the same structure. First, the film forming apparatuses 5R, 5G, and 5B will be described. Each of the film forming apparatuses 5R, 5G, and 5B includes a moving chamber 45, a loading chamber 41, and a loading chamber 42. The carry-in chamber 41 and the carry-out chamber 42 are connected to the moving chamber 45.
  • a rotating shaft 77 is inserted in an airtight manner into the bottom wall of the moving chamber 45, and a turntable 51 is attached to the upper end thereof (FIG. 3).
  • a first motor 76 is arranged outside the moving chamber 45, and the lower end of the rotating shaft 77 is connected to the first motor 76.
  • the inner space of the moving chamber 45 is Rotating shaft 77 rotates around its rotational axis P while the external atmospheric force is cut off, and turntable 51 rotates around rotational axis P together with rotating shaft 77! /.
  • the turntable 51 rotates in a horizontal plane.
  • the symbol C in FIG. 4 is a point on the rotation axis P and indicates the center of rotation of the turntable 51.
  • the turntable 51 is formed with four or more substantially circular window portions 52 penetrating the surface force to the back surface.
  • Each window 52 is located on the circumference of the same circle centered on the rotation center C, and when the turntable 51 rotates about the rotation center C, the window 52 moves along the circumference described above. And move along the circumference! /
  • the center angle between the windows is equal in each window 52. Therefore, the length of the arc connecting the centers of the adjacent window parts 52, that is, the distance between the window parts along the circumference between the centers of the adjacent window parts 52 is equal. They are arranged at regular intervals along the route.
  • a transfer robot (not shown) Inside the carry-in chamber 41 and the carry-out chamber 42, a transfer robot (not shown) is arranged.
  • Reference numeral 50 in FIG. 4 indicates a processing object.
  • the transfer robot 56 in the loading chamber 41 moves to the loading place 56a where the processing object 50 loaded into the moving chamber 45 is placed and the transfer robot in the unloading chamber 42.
  • the unloading place 56b to be loaded and unloaded from the moving chamber 45 to the unloading chamber 42 is set.
  • a plurality of through holes 55 are provided on the bottom wall of the moving chamber 45.
  • the centers of the through holes 55 are arranged in a line on the circumference centering on the same rotation axis C with the same radius as the circumference where the window portion 52 is arranged.
  • the number of through-holes 55 is two fewer than the number of window portions 52.
  • each film forming chamber 30 is disposed below each through hole 55.
  • Each film forming chamber 30 has a vacuum chamber 31.
  • a connection port 36 consisting of a through hole is formed in the ceiling of the vacuum chamber 31, and the film forming chamber 30 is hermetically connected to the periphery of the through hole 55 above the edge force of the connection port 36.
  • the internal space and the internal space of the moving chamber 45 are connected via the connection port 36 and the through hole 55.
  • the through holes 55 are arranged in a line on the circumference, with the through hole 55 at the position adjacent to the carry-in place 56a as the head, and the through hole 55 at the position adjacent to the carry-out place 56b as the tail. Then, each through hole 55 is arranged in a line along the circumference at the same interval as the interval between the window portions 52 from the first through hole 55 to the last through hole 55.
  • a through hole 55 is located directly under each window 52.
  • the unloading place 56b, and the film forming place 57 are arranged in a line on the same circumference around the rotation center C.
  • the window portion 52 of the carry-in location 56a is shown.
  • the turntable 51 is rotated in the direction of rotation toward the first film deposition location 57 and the window on one location is moved to an adjacent location, the other windows are also moved to the adjacent location.
  • the carry-out place 56 b window 52 returns to entry point 56a.
  • a placement plate 61 is placed on each window 52. When the window 52 moves, the placement plate 61 also moves together.
  • the mounting plate 61 will be described with reference to FIG. 5.
  • the mounting plate 61 includes a disc-shaped mounting portion 62 and one or more of the peripheral force of the mounting portion 62 protruding.
  • a claw portion 63 and an opening 64 provided in the placement portion 62 are provided.
  • each claw portion 63 is evenly arranged around the placement portion 62, and the distance from the center of the placement portion 62 to the tip of each claw portion 63 This is larger than the distance from the center of the window 52 to the edge of the window 52.
  • the tip of each claw portion 63 gets on the edge of the window portion 52.
  • the placement part 62 is formed smaller than the window part 52, and when the tip of each claw part 63 gets on the edge of the window part 52, the placement part 62 is held inside the outer periphery of the window part 52.
  • the opening 64 is a through-hole penetrating the mounting portion 62 up to the surface force back surface, and the processing object 50 described above is placed on the edge of the opening 64 in a state where a mask to be described later is faced down. As described above, when the placement plate 61 is disposed on the window portion 52, the processing object 50 is also disposed on the window portion 52.
  • FIG. 3 shows a state in which the window portion 52 and the processing object 50 arranged on the window portion 52 are stationary at the film forming place 57.
  • a second motor 49 is disposed above the through hole 55 outside the moving chamber 45.
  • a lift shaft 47 is inserted into the moving chamber 45 in an airtight and vertical manner. The upper end of the lift shaft 47 is attached to the second motor 49, and the lower end of the lift shaft 47 is located directly above the through hole 55.
  • the holding part 48 is attached as shown.
  • the second motor 49 is configured to move the elevating shaft 47 up and down or rotationally.
  • the holding portion 48 moves up and down to rotate the elevating shaft 47.
  • the holding part 48 rotates in a horizontal plane.
  • the holding unit 48 has a holding device (not shown) and can hold the mounting plate 61.
  • the holding device can be made of, for example, an electromagnet, and the mounting plate 61 is provided with a locking member such as a protrusion.
  • the holding device can be provided with a hook and the hook can be locked to the locking member to hold the mounting plate 61.
  • the holding portion 48 is configured to be stationary at a position directly above the mounting plate 61, and the holding portion 48 is lowered and brought into contact with the mounting plate 61 for holding.
  • the mounting plate 61 is held by the holding portion 48 when a magnetic force is generated by energization.
  • the holding part 48 is lifted by being attracted to the surface, the mounting plate 61 is lifted from the turntable 51 (FIG. 7 (b)).
  • a number of notches 53 having the same number of forces as the claw portion 63 are provided at positions corresponding to the claw portion 63, and the holding portion 48 is rotated so that one claw portion 63 is rotated.
  • the other claw portions 63 are also stopped at positions immediately above the other notches 53 (Fig. 6 (b)).
  • the shape of the claw part 63 is smaller than the cut 53, and the outer shape of the holding part 48 is smaller than that of the window part 52. Therefore, when the claw part 63 is positioned right above the notch 53 and lowered vertically, the mounting plate 61 and the holding part 48 pass through without contacting the outer periphery of the window part 52. .
  • the processing object 50 carried from the carry-in chamber 41 is placed on the mounting plate 61.
  • the outer shape of the processing object 50 is also smaller than the window part 52, and the processing object can be positioned above and below the turntable 51 by moving the mounting plate 61 up and down together with the holding part 48. (Fig. 8 (a)).
  • the mounting plate 61 held by the holding part 48 rotates the holding part 48 to retract the claw part 63 from the cut 53, and put the claw part 63 on the edge of the window part 52.
  • the processing object 50 can be placed on the turntable 51 (Fig. 8 (b)
  • the mounting plate 61 is provided with an opening 64, and the processing object 50 is exposed on the bottom surface of the opening 64.
  • the processing object 50 on the mounting plate 61 passes through the opening 64. Facing the internal space of the vacuum chamber 31.
  • a film forming source 35 is disposed inside the vacuum chamber 31, and the film forming source 35 includes one or more containers 32 and 33. Vapor deposition materials are arranged in the containers 32 and 33, respectively, and vapor of the vapor deposition material is discharged from one or more containers 32 and 33 in a state where the processing object 50 faces the vacuum chamber 31. Then, the vapor reaches the substrate through the opening of the mask on the bottom surface of the opening 64, and a thin film is formed.
  • the vacuum chamber 31 of the film formation location adjacent to the carry-in location 56a starts, and is adjacent to the carry-out location 56b. If the vacuum chamber 31 of the film formation site 57 to be used is the last, a hole injecting substance and a hole transporting organic substance are arranged in the top vacuum chamber 31, and the next vacuum chamber 31 has an electron transport. An organic substance capable of feeding and a coloring organic substance as an additive are arranged.
  • the next vacuum chamber 31 is provided with an electron injecting substance, and the last vacuum chamber 31 is provided with an electrode material.
  • Each of the film forming apparatuses 5R, 5G, and 5B includes a hole injecting substance (for example, CuPC; copper phthalocyanine), a hole transporting substance (for example, ⁇ -NPD; bis [N- (1-naphthyl) -N [Fer] benzidine), an electron transporting substance (eg, Alq3; tris (8-quinolinolato) aluminum complex), an electron injecting substance (eg, LiF), and an electrode material (eg, metallic aluminum) are arranged.
  • the additive is different in each of the film forming apparatuses 5R, 5G, and 5B, and the red, green, and blue coloring organic substances are arranged here as the additive, respectively.
  • a hole injection layer 14 When the vapor of the vapor deposition material is discharged in each vacuum chamber 31, a hole injection layer 14, a hole transport layer 15, a light emitting layer 16R, 16G, 16B, an electron transport layer 17, an electron injection layer 18, and an upper electrode layer 19 is formed.
  • the light emitting layers 16R, 16G, and 16B emit light in red, green, or blue.
  • Reference numeral 9 in FIG. 9A denotes a substrate that is carried into the manufacturing apparatus and forms the organic EL element 10.
  • the substrate 9 has a support plate 11, a lower electrode film 13 formed on the surface of the support plate 11, and a partition wall 29.
  • the carry-in section A shown in FIG. 2 has replacement chambers 21 and 22, a drying chamber 23, a cleaning chamber 24, a cooling chamber 25, and a standby chamber 26, and the cleaned substrate 9
  • an inert gas for example, N2 gas
  • N2 gas for example, N2 gas
  • the inside is connected to the inside of the drying chamber 23 and the substrate 9 is carried into the drying chamber 23.
  • a drying gas is introduced into the drying chamber 23, the interior atmosphere is changed to a dry gas atmosphere, moisture on the surface of the substrate 9 is removed, and the substrate 9 is carried into the cleaning chamber 24.
  • Ultraviolet rays are generated inside the cleaning chamber 24, and the ultraviolet rays are irradiated on the surface of the substrate 9 to decompose and remove contaminants, and then are carried into the cooling chamber 25.
  • a cooling device (not shown) is arranged in the cooling chamber 25. Then, after the substrate 9 is cooled, it is carried into the standby chamber 26.
  • Each film forming apparatus 5R, 5G, 5B has an evacuation system (not shown), and the film forming apparatuses 5R, 5G, 5B have a moving chamber 45, a loading chamber 41, and a loading chamber 41 in advance. A vacuum atmosphere is formed.
  • the unloading chamber 42 of the first film forming apparatus 5R is connected to the loading chamber 41 of the next film forming apparatus 5B, and the unloading chamber 42 of the film forming apparatus 5B is the last.
  • the standby chamber 26 is connected to the carry-in chamber 41 of the first film formation apparatus 5R, and the cooled substrate 9 is first carried into the carry-in chamber 41 of the first film formation apparatus 5R through the standby chamber 26.
  • the mask stocker 43 and 44 are connected to the carry-in chamber 41 and the carry-out chamber 42 of each film forming apparatus 5R, 5G, and 5B, and the red mask 70R is moved from the mask stocker 43 to the carry-in chamber 41.
  • the mask 70R and the substrate 9 are overlapped by an alignment apparatus (not shown) and fixed by the fixing member 71 to form the processing object 50.
  • FIG. 9 (b) shows the substrate 9 in this state, and the substrate 9 on which the red light emitting dots 20R are formed also transfers the loading plate 61 force of the unloading place 56b to the unloading chamber 42.
  • the film formation at each film formation place 57 is completed, and from the film formation place 57 to the next film formation place 57 or
  • the turntable 51 rotates to be sent to the unloading place 56b
  • the unloading place 56b returns to the loading place 56a.
  • the mounting plate 61 on which the unprocessed processing object 50 is placed is sent from the carry-in location 56a to the first film-forming location 57.
  • a separation mechanism (not shown) is arranged in the unloading chamber 42, the processing object 50 moved to the unloading chamber 42 is separated into the mask 70R and the substrate 9, and the mask 70R is returned to the mask stocker 44. Base The plate 9 is sent to the loading chamber 41 of the next film forming apparatus 5G.
  • the mask stocker 43 of the second film-forming apparatus 5G and the last film-forming apparatus 5B contains a green mask 70G and a blue mask 70B.
  • a green mask 70G and a blue mask 70B When 70G and 70B are superimposed on the substrate, only the position where the green light emitting dot should be formed or the position where the blue light emitting dot should be formed is exposed at the openings of the masks 70G and 70B, and the other positions are masks. Covered with 70G, 70B.
  • a green mask 70G is superimposed on the substrate 9 in the loading chamber of the second film forming apparatus 5G, and is already formed by moving in the moving chamber 45 as in the case of the first film forming apparatus 5R. No film is formed at the position of the red light emitting dot 20R and the next light emitting dot to be formed, but the green light emitting dot 20G is formed at the position where the green light emitting dot is to be formed (FIG. 9). (c)) 0
  • the mask G is exchanged with the blue mask 70B in the carry-out chamber 42 of the second film-forming apparatus 5G and the carry-in chamber 42 of the last film-forming apparatus 5B, and the processing object 50 is similarly transferred to the moving chamber.
  • the processing object 50 is similarly transferred to the moving chamber.
  • no film is formed on the already formed light emitting dots 20R, 20G, but blue light emitting dots 20B are formed at positions where blue light emitting dots are to be formed.
  • the carry-in part M has a discharge standby chamber 28, and the carry-out chamber 42 of the last film forming apparatus 5 B is connected to the discharge standby chamber 28. If the substrate 9 on which the light emitting dots 20B of the above colors are formed is moved from the moving chamber 45 to the unloading chamber 42, the mask 70B is removed, and then the substrate 9 is taken out to the outside atmosphere through the discharge waiting chamber 28, FIG. An organic EL device 10 as shown in Fig. 1 is obtained.
  • the processing object 50 is lifted from the placement plate 61 by the transfer robot, and the window 52 on which the placement plate 61 is placed is kept stationary, that is, a new processing object 5 is placed on the same window 52. 0 may be placed on the mounting plate 61. In short, the carry-in place and the carry-out place may be the same place.
  • the number of window portions 52 is not particularly limited.
  • the number of windows 52 is larger than the sum of the number of carry-in places 56a, the number of carry-out places 56b, and the number of film-formation places 57, so that the windows at the carry-in places 56a, the carry-out places 56b, and the respective film-formation places 57
  • one or more window sections 52 may be stationary in places other than those places 56a, 56b, 57.
  • the number of window portions 52 is set to be smaller than the sum of the number of carry-in places 56a, the number of carry-out places 56b, and the number of film-forming places 57, so that the window at the carry-in place 56a When the part 52 is stationary, the window part 52 may not be positioned at one or more film forming places 57 or the unloading place 56b.
  • the number of film forming apparatuses 5R, 5G, and 5B is determined according to the type of mask to be replaced, and the number is not particularly limited.
  • the deposition apparatus 5R to which the substrate 9 is transported first is the first
  • the deposition apparatus 5B to be transported last is the last
  • the intermediate deposition apparatus 5G is between the first and last deposition apparatuses 5R and 5B.
  • the number of intermediate film forming apparatuses 5G is one.
  • the carry-in chamber 41 of the first intermediate film forming apparatus 5G is the top.
  • the carry-in chamber 41 of the other intermediate film-forming apparatus 5G is connected to the carry-out chamber 42 of the other intermediate film-forming apparatus 5G.
  • the carry-out chamber 42 of the last intermediate film formation apparatus 5G is connected to the carry-in chamber 41 of the last film formation apparatus 5B, and the carry-out chamber 42 of the other intermediate film formation apparatus 5G is another intermediate film formation. Connected to loading room 41 of device 5G.
  • the mask is not changed, and the film formed by the first film forming apparatus 5R is Laminate a new film with other film deposition equipment 5G, 5B.
  • the film forming apparatuses 5R, 5G, and 5B are not directly connected to each other, and a cooling chamber or the like is provided between the film forming apparatus 5R and the film forming apparatus 5b.
  • Another processing chamber may be provided, and the substrate 9 subjected to the film forming process by the one film forming apparatus 5R may be transferred to the other film forming apparatus 5G through the processing chamber.
  • the position where the mounting plate 61 is lowered may be a position above the through hole 55 as long as the film forming material particles (vapor, sputtered particles) can reach the substrate 9.
  • the number of film forming chambers 30 is not particularly limited.
  • the number of films to be deposited in the vacuum chamber 31 of each deposition chamber 30 is not limited to 1 or 2, and three or more layers may be formed in one vacuum chamber 31.
  • the present invention is not limited to this, for example, a processing chamber other than the film forming chamber 30 in the through hole 55. If the window 52 is stationary at a position on the processing chamber and the processing object 50 is lowered together with the mounting plate 61 in the above-described process, the processing object is processed in the processing chamber. 50 can be processed.
  • the manufacturing apparatus 1 and the manufacturing method of the present invention are used for manufacturing the organic EL element 10 has been described above, the present invention is not limited to this. Any laminate of the above films can be used for various purposes, and various film forming materials can be used.
  • the shape of the window 52 and the number and shape of the notches 53 are not particularly limited.
  • the shape of the mounting plate 61 and the number and shape of the claw parts 63 are determined so that the mounting plate 61 passes through the window part 52 when the claw part 63 and the cut 53 overlap, and the claw part 63 is cut 53.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La présente invention concerne un dispositif de formation de film pouvant former de multiples couches de film en peu de temps, un appareil de formation de film et un procédé de formation de film. Chacun des dispositifs de formation de film (5R), (5G) et (5B) comprend une chambre mobile (45) et un plateau rotatif (51). Une plaque de chargement (61) destinée à charger un substrat (9) sur celle-ci est placée sur la partie de fenêtre (52) du plateau rotatif (51). Lorsque le plateau rotatif (51) est mis en rotation et que la partie de fenêtre (52) est déplacée, la plaque de chargement (61) est déplacée conjointement avec la partie de fenêtre (52) sur laquelle le substrat (9) est chargé. En faisant simplement tourner le plateau rotatif (51) d’un angle prescrit, un nouveau substrat (9) peut être apporté depuis une place d’arrivée (56a), le substrat formé par des films (9) peut être introduit sur l’autre place de formation de film (57) et la plaque de chargement vide (61) peut être renvoyée depuis une place de sortie (56b) vers la place d’arrivée (56a). Étant donné que toutes ces opérations peuvent être réalisées en même temps, le temps nécessaire pour transporter le substrat (9) vers les places (56a), (56b) et (57) et le temps nécessaire pour renvoyer la plaque de chargement (61) peuvent être réduits.
PCT/JP2006/311498 2005-06-15 2006-06-08 Dispositif de formation de film, appareil de fabrication de film mince et procédé de formation de film WO2006134818A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007521256A JP4855398B2 (ja) 2005-06-15 2006-06-08 成膜装置、薄膜の製造装置、及び成膜方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-175491 2005-06-15
JP2005175491 2005-06-15

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WO2006134818A1 true WO2006134818A1 (fr) 2006-12-21

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JP (1) JP4855398B2 (fr)
KR (1) KR100893843B1 (fr)
CN (1) CN100591799C (fr)
TW (1) TWI393793B (fr)
WO (1) WO2006134818A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016147710A1 (fr) * 2015-03-13 2016-09-22 株式会社アルバック Appareil de formation de film mince

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010055876A1 (fr) * 2008-11-14 2010-05-20 株式会社アルバック Dispositif de dépôt de pellicule mince organique, dispositif de fabrication d’élément el organique, et procédé de dépôt de pellicule mince organique
WO2011161745A1 (fr) * 2010-06-21 2011-12-29 株式会社アルバック Appareil d'inversion de substrat, appareil filmogène à vide, et procédé d'inversion de substrat

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JPS62253768A (ja) * 1986-04-25 1987-11-05 Shinku Kikai Kogyo Kk 薄膜製造装置
JPH05156442A (ja) * 1991-11-30 1993-06-22 Nec Home Electron Ltd 真空成膜装置およびスパッタ装置
JPH05275511A (ja) * 1991-03-01 1993-10-22 Tokyo Electron Ltd 被処理体の移載システム及び処理装置
JP2002256432A (ja) * 2001-02-26 2002-09-11 Stanley Electric Co Ltd 多層膜成膜装置
JP2003031361A (ja) * 2001-07-12 2003-01-31 Utec:Kk 有機ｅｌ素子の製造装置

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TW455912B (en) * 1999-01-22 2001-09-21 Sony Corp Method and apparatus for film deposition
TW552306B (en) * 1999-03-26 2003-09-11 Anelva Corp Method of removing accumulated films from the surfaces of substrate holders in film deposition apparatus, and film deposition apparatus
JP4463440B2 (ja) * 2001-03-02 2010-05-19 新明和工業株式会社 多層膜の成膜方法、及び真空成膜装置
JP2003303451A (ja) * 2002-04-04 2003-10-24 Tdk Corp 円板状基板用成膜装置に対する基板の受け渡し方法、当該方法に用いられる基板受け渡し機構およびマスク、および当該方法を用いたディスク状記録媒体の製造方法

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JPS62253768A (ja) * 1986-04-25 1987-11-05 Shinku Kikai Kogyo Kk 薄膜製造装置
JPH05275511A (ja) * 1991-03-01 1993-10-22 Tokyo Electron Ltd 被処理体の移載システム及び処理装置
JPH05156442A (ja) * 1991-11-30 1993-06-22 Nec Home Electron Ltd 真空成膜装置およびスパッタ装置
JP2002256432A (ja) * 2001-02-26 2002-09-11 Stanley Electric Co Ltd 多層膜成膜装置
JP2003031361A (ja) * 2001-07-12 2003-01-31 Utec:Kk 有機ｅｌ素子の製造装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016147710A1 (fr) * 2015-03-13 2016-09-22 株式会社アルバック Appareil de formation de film mince
JPWO2016147710A1 (ja) * 2015-03-13 2017-11-24 株式会社アルバック 薄膜形成装置

Also Published As

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JPWO2006134818A1 (ja) 2009-01-08
TWI393793B (zh) 2013-04-21
JP4855398B2 (ja) 2012-01-18
CN100591799C (zh) 2010-02-24
TW200712229A (en) 2007-04-01
KR20070070223A (ko) 2007-07-03
CN101068949A (zh) 2007-11-07
KR100893843B1 (ko) 2009-04-17

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