CN1676659A - Straight-line organic electroluminescence mfg. device - Google Patents

Straight-line organic electroluminescence mfg. device Download PDF

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Publication number
CN1676659A
CN1676659A CNA2005100547673A CN200510054767A CN1676659A CN 1676659 A CN1676659 A CN 1676659A CN A2005100547673 A CNA2005100547673 A CN A2005100547673A CN 200510054767 A CN200510054767 A CN 200510054767A CN 1676659 A CN1676659 A CN 1676659A
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China
Prior art keywords
bracing
substrate
strutting arrangement
manufacturing installation
straight
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Granted
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CN100482850C (en
Inventor
神川进
森崎裕彦
和田宏三
吉武隆
合田圣彦
平井悦郎
小林敏郎
加藤光雄
平野龙也
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Mitsubishi Heavy Industries Ltd
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Mitsubishi Heavy Industries Ltd
Mitsubishi Hitachi Metals Machinery Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Abstract

In the manufacturing device of the in-line type organic electroluminescent element, a holder integrated with a mask is used to retain a substrate, to which a cooling plate is fitted to suppress temperature rise of the substrate and continuous conveyance is carried out. Further, a structure is realized in which the substrate is continuously conveyed without stop between treatment rooms of different degrees of vacuum, with differential exhaust parts D1 to D4 provided inside the device. So that, this invention provides a manufacturing device of an in-line type electroluminescent element with improved film-forming quality and high production efficiency.

Description

The straight-line organic electroluminescence manufacturing installation
Technical field
The present invention relates to a kind of array (inline) formula organic electroluminescence mfg. device, its continuous conveying substrate, evaporating materials such as evaporation organic materials are formed with organic electro luminescent (hereinafter to be referred as EL) element.
Background technology
Figure 10 represents now generally organic EL manufacturing installation of use.
Device shown in Figure 10 is the device that what is called is called as cluster (cluster) type, and a plurality of conveying chambers with mechanical manipulator are polygonal shape, and is provided with a plurality of treatment chambers around conveying chamber.As shown in figure 10, organic EL manufacturing installation 40, its film formation process unit 41 has: to the conveying chamber 42 of chambers conveying substrate; Substrate is sent into the substrate of conveying chamber and sent into mouth 43; The purge chamber 44 of cleaning base plate; Film forming filming chamber 45,46,47 on substrate, these treatment chambers by a plurality of sluice valves 48 be configured in conveying chamber 42 around.Organic EL is made of a plurality of films, comprising electrode layer, so be provided with the filming chamber 45,46,47 (seeing " organic EL ", the p98 of Nikkan Kogyo Shimbun, Figure 53) of the treatment chamber that becomes each film in organic EL manufacturing installation 40.
On substrate, during film forming, fence gate 48 is opened, is sent into mouthfuls 43 substrate and send into treatment chamber (for example filming chamber 45), close fence gate 48 being sent to substrate, adjust vacuum tightness after, on substrate, form first tunic.After first tunic forms, open fence gate 48 once more, substrate is transported out from treatment chamber 45, send into next treatment chamber (for example filming chamber 46), form second tunic in an identical manner.Substrate after the film forming is by handing-over chamber 49 like this, and 51,52 paste the cover glass of treated mistake in the operation unit, make the finished product of the organic EL that becomes FPD (flat-panel screens).
Patent documentation 1: the spy opens the 2002-348659 communique
Patent documentation 2: the spy opens the 2003-157973 communique
In the FPD that uses organic EL, key subjects from now on are to reduce production costs.For this reason, must shorten the production time of every substrate, improve material use efficiency.; organic EL manufacturing installation of cluster type shown in Figure 10 exists such problem: corresponding each film all has independently treatment chamber; each treatment chamber all need be sent substrate to and send, and needs to adjust the vacuum tightness of each treatment chamber, thereby the required production time of every substrate is very long.
To this, in order to shorten the production time, people have proposed to be called as organic EL manufacturing installation (as: patent documentation 1,2) of straight-line type.
Organic EL manufacturing installation of straight-line type, a plurality of filming chamber that organic EL is used linearly are arranged in the same vacuum vessel, and do not need the sluice valve between these filming chamber.During film forming, substrate continuous conveying above a plurality of filming chamber forms film simultaneously, shortens time that vacuum tightness was carried and adjusted to substrate with this, and then shortens the production time.
But, organic EL manufacturing installation is carrying out outside the film forming filming chamber of organic EL, (for example also have the different a plurality of treatment chambers of atmosphere (vacuum tightness), purge chamber 44 among Figure 10, electrode filming chamber 47 etc.), even only that the organic EL film forming is required filming chamber is arranged in the same vacuum vessel, and other treatment chamber between still need sluice valve.Therefore, when conveying substrate, still need the breaker family of power and influence between these treatment chambers, when the breaker family of power and influence, still need to adjust the vacuum tightness of chambers.The device that wherein has is provided with vacuum and adjusts the chamber, and after vacuum is adjusted chamber adjustment vacuum tightness, again substrate is carried to treatment chamber, it still is in the state that can not carry continuously in fact, and need the time to adjust vacuum tightness, so it shortens the production time is limited, also can not enhance productivity.
In addition, organic EL manufacturing installation of straight-line type because substrate is carried continuously, is subjected to the Temperature Influence of filming chamber's evaporation source continuously in the filming chamber that the organic EL film forming is used, and the temperature of substrate easily rises.Substrate temperature rises, and becomes and causes that film evaporates once more, the reason that film quality descends.Particularly, can reduce invalid steam in order to improve film forming speed, thus preferably make evaporation source near substrate, but substrate temperature is more vulnerable to the influence of evaporation source, can not realize improving film forming speed simultaneously and improve quality of forming film.In addition, when keeping suitable substrate temperature, though can improve quality of forming film, invalid steam increases evaporation source away from substrate, film forming speed reduces, and still can not realize improving film forming speed simultaneously and improve quality of forming film.That is, organic EL manufacturing installation of above-mentioned straight-line type is difficult to shorten the production time when seeking to improve quality of forming film, enhances productivity.
In addition, organic EL manufacturing installation of above-mentioned straight-line type is being used for the film forming filming chamber of organic EL, for example on the belt conveying device, substrate is film forming when carrying continuously, so easily occurrence positions skew, especially large substrate, because the problem of substrate bending itself, it is not good that quality of forming film takes place easily.
As mentioned above, organic EL manufacturing installation of above-mentioned straight-line type also has many problems that should solve at aspects such as quality of forming film, production efficiencys when considering production.
Summary of the invention
The present invention proposes in view of the above problems, and its objective is provides a kind of straight-line type organic EL manufacturing installation, enhances productivity when improving quality of forming film.
For addressing the above problem, the straight-line organic electroluminescence manufacturing installation in first invention of the present invention has: can independent controlled atmosphere and a plurality of treatment chambers of vacuum tightness; With e Foerderanlage to the continuous conveying substrate of described a plurality of treatment chambers, and through the predetermined process in described a plurality of treatment chambers, on described substrate, form organic electroluminescent device, it is characterized in that: have bracing or strutting arrangement, described bracing or strutting arrangement possesses the mask that is formed with the figure of film forming film on described substrate, and support described substrate and prevent its bending, described e Foerderanlage utilizes described bracing or strutting arrangement to carry described substrate continuously to described a plurality of treatment chambers.
The bracing or strutting arrangement that is used to form the mask of figure and supporting substrate is integrally formed, can make bracing or strutting arrangement have the mask function of substrate with this, do not need the installation of the mask substrate on manufacturing installation single conveying mask monomer and manufacturing installation, can shorten the activity time of mask.In addition, because by the bracing or strutting arrangement supporting substrate, so can prevent to wait the curved substrate that causes by deadweight.
For addressing the above problem, the straight-line organic electroluminescence manufacturing installation in second invention of the present invention has: can independent controlled atmosphere and a plurality of treatment chambers of vacuum tightness; With e Foerderanlage to the continuous conveying substrate of described a plurality of treatment chambers, and through the predetermined process in described a plurality of treatment chambers, on described substrate, form organic electroluminescent device, it is characterized in that: have: the 1st bracing or strutting arrangement, described the 1st bracing or strutting arrangement possess the mask that is formed with the figure of film forming organic film on described substrate and support described substrate and prevent its bending; The 2nd bracing or strutting arrangement, described the 2nd bracing or strutting arrangement possess the mask that is formed with the figure of film forming electrode film on described substrate and support described substrate and prevent its bending; And switch, described switch exchanges to described 2nd bracing or strutting arrangement from described the 1st bracing or strutting arrangement with described substrate in device, described e Foerderanlage utilizes described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement to carry described substrate continuously to described a plurality of treatment chambers.
For example, switch is set making the film forming treatment chamber of organic film and make between the film forming treatment chamber of electrode film, after the organic film film forming, substrate is exchanged to the 2nd bracing or strutting arrangement from the 1st bracing or strutting arrangement.
For addressing the above problem, the straight-line organic electroluminescence manufacturing installation in the 3rd invention of the present invention has: can independent controlled atmosphere and a plurality of treatment chambers of vacuum tightness; With e Foerderanlage to the continuous conveying substrate of described a plurality of treatment chambers, and through the predetermined process in described a plurality of treatment chambers, on described substrate, form organic electroluminescent device, it is characterized in that: have differential exhaust portion, described differential exhaust portion is arranged between the mutually different treatment chamber of vacuum tightness, and can independently control the intermediary vacuum tightness of the vacuum tightness of chambers, described e Foerderanlage is carried described substrate continuously by described differential exhaust portion between the different treatment chamber of described vacuum tightness.
For example, differential exhaust portion is set making the film forming treatment chamber of organic film and make between the film forming treatment chamber of electrode film, can need sluice valve like this, substrate is ceaselessly transmitted continuously, improve the transport efficiency of substrate.In addition, chambers connects by differential exhaust portion, and the vacuum tightness of chambers can not impact mutually.
For addressing the above problem, the straight-line organic electroluminescence manufacturing installation in the 4th invention of the present invention has: can independent controlled atmosphere and a plurality of treatment chambers of vacuum tightness; With e Foerderanlage to the continuous conveying substrate of described a plurality of treatment chambers, and through the predetermined process in described a plurality of treatment chambers, on described substrate, form organic electroluminescent device, it is characterized in that: have and suppress the cooling-part that described substrate temperature rises, described e Foerderanlage is carried described substrate to described a plurality of treatment chambers continuously together with described cooling-part.
For example, making cooling-part is the parts that exothermicity is good or thermal capacity is big, by heat is transmitted to cooling-part from substrate, the temperature that suppresses substrate rises, even under the state that improves the substrate transfer rate, also film forming on substrate is continuously enhanced productivity.
For addressing the above problem, the organic EL manufacturing installation of straight-line type in the 5th invention of the present invention, it is characterized in that: in the organic EL manufacturing installation of above-mentioned straight-line type, have differential exhaust portion, described differential exhaust portion is arranged between the mutually different treatment chamber of vacuum tightness, and can independently control the intermediary vacuum tightness of the vacuum tightness of chambers, described e Foerderanlage is by described differential exhaust portion, and use described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement, between the different treatment chamber of described vacuum tightness, carry described substrate continuously.
For addressing the above problem, the organic EL manufacturing installation of straight-line type in the 6th invention of the present invention, it is characterized in that: the cooling-part that will suppress described substrate temperature rising in the organic EL manufacturing installation of above-mentioned straight-line type is arranged on described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement, and described e Foerderanlage uses described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement to carry described substrate continuously to described a plurality of treatment chambers.
For addressing the above problem, the organic EL manufacturing installation of straight-line type in the 7th invention of the present invention, it is characterized in that: the cooling-part that will suppress described substrate temperature rising in the organic EL manufacturing installation of above-mentioned straight-line type is arranged on described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement, described e Foerderanlage is by described differential exhaust portion, and use described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement, between the different treatment chamber of described vacuum tightness, carry described substrate continuously.
For addressing the above problem, the organic EL manufacturing installation of straight-line type in the 8th invention of the present invention, it is characterized in that: in the organic EL manufacturing installation of above-mentioned straight-line type, be provided with the washing unit that cleans described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement, make described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or the described the 2nd support reusable.
For addressing the above problem, the organic EL manufacturing installation of straight-line type in the 9th invention of the present invention, it is characterized in that: in the organic EL manufacturing installation of above-mentioned straight-line type, described e Foerderanlage has the positioning element of the position of determining described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement.
Therefore, in the e Foerderanlage of carrying continuously, also improved the bearing accuracy of bracing or strutting arrangement, the 1st bracing or strutting arrangement or the 2nd bracing or strutting arrangement,, prevented that film forming is not good so also can improve the bearing accuracy of substrate itself.
For addressing the above problem, the organic EL manufacturing installation of straight-line type in the tenth invention of the present invention, it is characterized in that: in the organic EL manufacturing installation of above-mentioned straight-line type, have the box body that can hold a plurality of described bracing or strutting arrangements, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement, use described box body, change vacuum tightness significantly in the predetermined process chamber, and, described e Foerderanlage is carried described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement continuously from described box body in vacuum tightness after changing.
For example, the treatment chamber between the treatment chamber that is used for film forming treatment chamber and is used to seal, the box body vacuum tightness on every side that will hold a plurality of substrates is switched between condition of high vacuum degree/normal atmosphere.
For addressing the above problem, the organic EL manufacturing installation of straight-line type in the 11 invention of the present invention is characterized in that: in the organic EL manufacturing installation of above-mentioned straight-line type, described differential exhaust portion also has other higher differential exhaust portion of vacuum tightness.
For example, between the treatment chamber of treatment chamber that forms organic film and formation electrode film etc., do not wish to influence each other between the treatment chamber of atmosphere, differential exhaust portion with middle vacuum tightness not only is set, also be provided with the higher differential exhaust portion of vacuum tightness in addition, the atmosphere of chambers just can not influence other treatment chamber like this.
For addressing the above problem, the organic EL manufacturing installation of straight-line type in the invention of the present invention's the tenth binomial, it is characterized in that: in the organic EL manufacturing installation of above-mentioned straight-line type, be provided with heat-conduction component between described substrate and the described cooling-part, described heat-conduction component is to the conduction of described cooling-part and the diffusion heat from described substrate.
As heat-conduction component, for example use to have heat conductivity, and can follow the flexible materials of the surfaceness of contact surface.
For addressing the above problem, the organic EL manufacturing installation of straight-line type in the 13 invention of the present invention is characterized in that: in the organic EL manufacturing installation of above-mentioned straight-line type, described cooling-part is reusable.
For addressing the above problem, the organic EL manufacturing installation of straight-line type in the 14 invention of the present invention, it is characterized in that: in the organic EL manufacturing installation of above-mentioned straight-line type, be provided with the radiant heat absorption unit, described radiant heat absorption unit absorbs from described substrate and described cooling-part, or the radiant heat of described substrate or described cooling-part.
For example, as the radiant heat absorption unit, use the low temperature face absorptive substrate of helium refrigerator, the radiant heat of cooling-part, rise with this temperature that suppresses substrate, even under the state that improves the substrate transfer rate, still can be on substrate continuous film forming, enhance productivity.
For addressing the above problem, the organic EL manufacturing installation of straight-line type in the 15 invention of the present invention, it is characterized in that: in the organic EL manufacturing installation of above-mentioned straight-line type, the transfer rate of described e Foerderanlage is a constant, controls the film forming speed of the film in a plurality of treatment chambers simultaneously respectively.
According to the present invention, the bracing or strutting arrangement of supporting substrate (support) forms one with substrate with mask, uses the stent support substrate, and is therefore simple in structure, when preventing curved substrate, can make support have the function of mask.By preventing curved substrate, it is good to reduce the film forming that curved substrate causes, and in addition, has the function of mask by making support, can shorten the required activity time of mask, boosts productivity.In addition, according to film forming film, the mask that will be formed with different figures is installed on the support, by exchange support in manufacturing installation, can form different graphic films on substrate.
According to the present invention, between the treatment chamber of different vacuum tightness, the intermediate pressure chamber by differential exhaust portion control is set, so need between the treatment chamber of different vacuum tightness, sluice valve be set, do not need to adjust pressure yet, can ceaselessly carry continuously substrate.Its result is easy to realize the high speed of transfer rate, enhances productivity.
According to the present invention, because use, can be enhanced productivity with high speed transfer rate continuous film forming so can suppress the rising of substrate temperature by the cooling-part and the absorbing radiation radiation of heat thermal absorption device of heat-conduction component.In addition, rise, can make the distance of substrate and evaporation source approaching, reduce invalid quantity of steam, reduce the waste of evaporating materials owing to suppressed the temperature of substrate.
According to the present invention, the positioning element of support is set on e Foerderanlage, so can improve the bearing accuracy of film forming treatment chamber, it is not good to prevent film forming, enhances productivity.
According to the present invention, not only the device loading part, unloading part, and between device internal pressure variation treatment chamber greatly, also use the box body that can hold a plurality of supports, so by changing the vacuum tightness of box body and a plurality of substrate, a frame peripheral simultaneously, can shorten the change required adjustment time of vacuum tightness, reduce the unnecessary waiting time, give full play to film forming with treatment chamber, sealing processing power, enhance productivity with treatment chamber etc.
Description of drawings
Fig. 1 represents an embodiment of the support that the organic EL manufacturing installation of straight-line type of the present invention uses.
Fig. 2 represents another embodiment of the support that the organic EL manufacturing installation of straight-line type of the present invention uses.
Fig. 3 represents to hold the box body of the support shown in Fig. 1,2.
Fig. 4 represents an embodiment of the e Foerderanlage that the organic EL manufacturing installation of straight-line type of the present invention uses.
Fig. 5 represents an embodiment of the radiant heat absorption unit that the organic EL manufacturing installation of straight-line type of the present invention uses.
Fig. 6 is the graphic representation of radiant heat absorption unit effect more shown in Figure 5.
Fig. 7 represents the cooling-part of the organic EL manufacturing installation use of straight-line type of the present invention, an embodiment of heat-conduction component.
Fig. 8 is the graphic representation of the effect of heat-conduction component more shown in Figure 7.
Fig. 9 is the vertical view of an embodiment of the organic EL manufacturing installation of expression straight-line type of the present invention.
Figure 10 is the sketch chart of organic EL manufacturing installation of cluster type in the past.
Among the figure: 1,1A, 1B-support, 6-box body, 8a, 8b-positioning element, 10a, 10b-low temperature panel, 11-flexible structure thing, 12-cooling plate, D1, D2, the differential exhaust portion of D3, D4-.
Embodiment
The present invention is in order to improve the production of the organic EL manufacturing installation of array (inline) formula, to be conceived to quality of forming film and production efficiency, has carried out improved invention to relating to the part that substrate carries and the part of substrate temperature.Fig. 1～Fig. 9 represents that its several embodiments, especially Fig. 1～Fig. 4 represent to relate to the part of substrate transport efficiency, and Fig. 5～Fig. 8 represents to relate to the part of substrate temperature, and Fig. 9 represents the structure of whole device.
Embodiment 1
Fig. 1, Fig. 2 represent the example of the employed support of the organic EL manufacturing installation of straight-line type of the present invention.
In addition, Fig. 1 (a), Fig. 2 (a) are the stereographic maps of substrate and support, and Fig. 1 (b), Fig. 2 (b) the A-A alignment of presentation graphs 1 (a) respectively look sectional view, and the B-B alignment of Fig. 2 (a) is looked sectional view.
As shown in Figure 1, support 1A (bracing or strutting arrangement) has the frame 3a that is alphabetical L type cross section that supports rectangular substrate 2a circumference from its lower side, with be cruciform arrangement in the central part of frame 3a and support the support component 4a of rectangular substrate 2a from its lower side, at frame 3a and be the formed opening portion of criss-cross support component 4a, be provided with formation by the mask 5a of film forming film pattern.In addition, support component 4a is not limited to be cruciform, for example, can have 1 in central authorities, also can be many combinations.On support 1A, from the top of support 1A a substrate 2a is set, the following side of the substrate 2a among Fig. 1, the figure of film forming mask 5a in the example of Fig. 1, can form the film that becomes four organic ELs on the substrate 2a.The figure of support component 4a and mask 5a can form four, six, eight by the size decision of organic EL according to size from a substrate 2a ... organic EL.That is, the corresponding substrate 2a of support 1A, the circumference by frame 3a and support component 4a support a substrate 2a when preventing because of distortion such as own wts, provides the mask function to the film forming figure of substrate 2a by mask 5a.In addition, mask 5a and support component 4a are integrally formed, are positioned at a side of joining with substrate 2a.
In addition, as shown in Figure 2, support 1B (bracing or strutting arrangement) becomes an integral body to form a plurality of frame 3b that are alphabetical L type cross section (among Fig. 2 4) planar configuration, its center 3b is used for supporting rectangular substrate 2b circumference from its lower side, the formed opening portion of each frame 3b is provided with formation by the mask 5b of film forming film pattern.On support 1B, from the top of support 1B four substrate 2b are set, side below the substrate 2b in Fig. 2, the figure of film forming mask 5b is opened the film that forms organic EL in each of four substrate 2b.That is, the substrate 2b that support 1B correspondence separates, the circumference by frame 3b supports the substrate 2b that separates when preventing because of distortion such as own wts, provides the mask function to the film forming figure of substrate 2b by mask 5b.
In addition, Fig. 1 is though not expression among Fig. 2 in order more effectively to suppress the distortion of substrate 2a, 2b, can be provided with the pressing component of pushing substrate 2a, 2b from the upper side of substrate 2a, 2b.For example, back cooling plate 13 shown in Figure 7 can play the effect of pressing component.In addition, also can use electrostatic chuck, magnet chuck to support, with clamping substrate 2a, 2b between frame 3a, 3b and pressing component.
The organic EL manufacturing installation of straight-line type involved in the present invention (hereinafter to be referred as this manufacturing installation) be in conveying substrate, carry out film forming.Use described support 1A, 1B conveying substrate can prevent curved substrate, in conveying substrate, carry out film forming, prevent that the film forming that is caused by curved substrate is not good.In addition,, prepare support in advance, just can form different film patterns respectively with the mask that is formed with different graphic if according to film pattern.For example, this manufacturing installation uses the support A (the 1st bracing or strutting arrangement) with mask that organic film uses respectively and has the support B (the 2nd bracing or strutting arrangement) of the mask that electrode film uses, and just can form different film patterns respectively.In addition, shown in Figure 9 as described later, the purge chamber 24,29 (washing unit) of cleaning support is set, clean the support after using, it is recycled, can realize the utilization again of support, enhance productivity.In addition, make support and mask integrated, can not need to carry separately the mask monomer, do not need to be provided with in addition the device of carrying mask.
Box body 6 shown in Figure 3 can hold a plurality of supports 1, and this support can be arranged on the sending into mouthful of device (for example, with reference to Fig. 9 loading part E1) together with box body 6.Box body 6 is provided with a plurality of slot part 6a, and this groove 6a inserts a support in the subtend setting of the inside of the body of the case shape with peristome among a pair of slot part 6a, hold a plurality of supports 1 in the box body 6.Send into the place that atmosphere such as mouth need do to change significantly like this at device and use the box body 6 that can hold a plurality of supports 1, just can realize a plurality of supports, be that pressure-controlling of a plurality of substrates promptly is adjustable to required atmosphere (pressure), can shorten the time of adjusting atmosphere (pressure).In addition, in case switch to required pressure (atmosphere), the atmosphere that just can not have influence on filming chamber takes out support 1 in turn (vacuum tightness) from box body 6, when carrying continuously, carrying out film forming handles, so can reduce the adjustment time of unnecessary time of delivery and atmosphere (vacuum tightness), enhance productivity.For example, among Fig. 9, switch chamber 22a, 22b (switching of atmosphere/vacuum), vacuum/N in atmosphere/vacuum 2Switch chamber 31 (vacuum/N 2Switching), N 2/ atmosphere switches chamber 35a, 35b (N 2/ atmospheric switching) etc. use box body 6, box body 6 and a plurality of support 1 can pass through between the treatment chamber of different atmosphere (vacuum tightness).
Fig. 4 represents an example of the employed e Foerderanlage of this manufacturing installation.
In addition, Fig. 4 (a) is a sketch of seeing the e Foerderanlage in the filming chamber from the side, and Fig. 4 (b) is that the C-C alignment of Fig. 4 (a) is looked sectional view.
Support 1A has anti-bending function and mask functions, uses e Foerderanlage 7 (e Foerderanlage) to go up set positioning element 8a, 8b, even can play in the process of carrying, also improves the effect of the guiding of the bearing accuracy on the e Foerderanlage 7.Specifically, e Foerderanlage 7 has linearly two travelling belt 7a of configuration and drives a plurality of deflector roll 7b of travelling belt 7a, at the prescribed position of 2 travelling belt 7a positioning element 8a, 8b is set.Positioning element 8a is used to carry out the location on the direct of travel of support 1A, and positioning element 8b is used to carry out the location with the vertical direction of the direct of travel of support 1A.Travelling belt 7a, deflector roll 7b are arranged on does not influence the position that substrate becomes membrane portions, particularly is arranged on the frame 3a part of support 1A, can carry the ground supporting substrate with support 1A.And, when film forming, make support 1A speed in accordance with regulations at the uniform velocity mobile, so that the thickness of film forming film is along the throughput direction unanimity of substrate.
Like this,, support 1A is correctly located when carrying, correctly carry out with this substrate orientation that support 1A is had by positioning element 8a, 8b.That is, even for being configured in support 1A lower side and supplying with the evaporation source 9 of evaporating materials, the bearing accuracy in the time of also can improving film forming, it is not good to reduce the film forming that is caused by position deviation.In addition, in the present embodiment, its structure is positioning element 8a, the 8b that convex only is set in conveying belt 7a side, but also can be provided with and positioning element 8a, 8b corresponding concave part in support 1A side, by mutual chimeric positioning, also can in conveying belt 7a side recess be set conversely, protuberance be set, by mutual chimeric positioning in support 1A side.In addition,, and can keep frictional force between cylinder and support 1A at suitable configuration cylinder, avoiding under the situation that support 1A skids, can be without the conveyer belt type transporter, and use drum-type transporter ittransfer gantry 1A.
The organic EL manufacturing installation of straight-line type is for enhancing productivity, and disposes the evaporation source of the evaporating materials of supply film in a vacuum chamber linearlyly, and substrate is in film forming in the process above each evaporation source continuously.The organic EL manufacturing installation of existing straight-line type because said structure, and easily makes substrate temperature rise, make production efficiency and quality of forming film be in can not be satisfactory to both parties relation in.Therefore,, form good one-tenth membrane stage, enhance productivity even this manufacturing installation under the film forming state, also can suppress the temperature rising of substrate at substrate in carrying continuously.The example that it is concrete such as Fig. 5, shown in Figure 7.
Fig. 5 is the sketch of inside that the vacuum vessel of a plurality of evaporation sources 9 is disposed in expression.
As shown in Figure 5, this manufacturing installation rises in order to suppress substrate temperature, is provided with low temperature panel 10a, 10b (radiant heat absorption unit), in order to absorb the radiant heat from substrate and cooling plate described later 12 (with reference to Fig. 7).Low temperature panel 10a, 10b are not hindering from the space of the evaporation of the evaporating materials of evaporation source 9 supply, be arranged in parallel near two faces of support 1, and according to the quantity of evaporation source 9, are provided with a plurality of along e Foerderanlage.The low temperature panel that use the inside of low temperature panel 10a, 10b and cryopump etc. is identical, is to use the parts of the low temperature face of refrigerator, and this refrigerator uses liquid He etc.
In the inside of vacuum vessel, be vacuum around the substrate, so almost there is not the gas of conduction from the heat of substrate.Therefore the present invention uses low temperature panel 10a, the 10b that can keep low temperature (20 ℃～-200 ℃), and the radiant heat (cold emission) by positive absorptive substrate etc. prevents that substrate temperature from rising.
Fig. 6 represents the temperature variation of substrate when not using the low temperature panel and when using the low temperature panel.
Working conditions is that the initial temperature of glass substrate is 25 ℃, the temperature of low temperature panel 10a, 10b for-200 ℃, the temperature of evaporation source 9 are that 300 ℃, the transfer rate of substrate are 5.8mm/sec, continuous 12 film forming.
More as can be known, because the cooling effect of low temperature panel, the rising of substrate temperature is subjected to suppressing fully from the situation of the use low temperature panel that does not use low temperature panel and Fig. 6 (b) of Fig. 6 (a).
Fig. 7 is illustrated in the sectional view that support 1A shown in Figure 1 is provided with the structure of heat-conduction component, cooling-part.
Support shown in Figure 7 support 1A shown in Figure 1 is provided with flexible structure thing 11 (heat-conduction component), cooling plate 12 (cooling-part).Concrete structure is, on support 1A substrate supported 2a flexible structure thing 11 is set, and cooling plate 12 is set on flexible structure thing 11 again.These flexible structure things 11, cooling plate 12 are arranged on the face of an opposite side of film forming face of substrate 2a.In addition, if can fully guarantee from substrate 2a to cooling plate 12 heat conductivity, just not necessarily need to be provided with flexible structure thing 11.
To the conduction of cooling plate 12 sides and the diffusion heat from substrate 2a, the temperature that suppresses substrate 2a rises said structure by actively.Specifically be to constitute cooling plate 12, substrate 2a is contacted with cooling plate 12, the temperature of substrate 2a is discharged by thermal conduction, thermodiffusion, prevent that substrate 2a self-temperature from rising by the high material of heat conductivities such as Cu.In addition, also can strengthen the volume of cooling plate 12 itself etc., strengthen the thermal capacity of cooling plate 12 itself, make the temperature of the substrate 2a side that comprises cooling plate 12 be difficult for rising by this structure.Also have,, can between cooling plate 12 and substrate 2a, put into the flexible structure thing 11 of the connecting airtight property of improving mutual contact surface for further improving the heat conductivity of cooling plate 12 and substrate 2a.Flexible structure thing 11 uses such as silicon rubber, graphite thin plate, carbon thin plate etc.In addition, good with the connecting airtight property of substrate even about thermal conductivity 0.2W/ (mK) as amount of gas evolved is few in a vacuum, can be used as the flexible structure thing, as using gelatinous thing.
This manufacturing installation is positioned on cooling plate 12 on the substrate 2a before sending into substrate 2a in advance, takes off from substrate 2a when sending after substrate 2a film forming, encapsulation process.At this moment, reuse after being cooled to used cooling plate 12 about 20 ℃.In addition,, can before film forming, cooling plate 12 be positioned on the substrate 2a, take off cooling plate 12 from substrate 2a after the film forming in the inside of this manufacturing installation.If can cool off used cooling plate 12 this moment in the inside of this manufacturing installation, just can carry out cycling and reutilization to cooling plate in device.
Fig. 8 is illustrated in when not putting into the flexible structure thing between substrate and the cooling plate and the substrate temperature when putting into the flexible structure thing changes.
Working conditions is that the initial temperature of glass substrate is that 25 ℃, the thickness of flexible structure thing 11 (silicon rubber) are that the thickness of 1mm, cooling plate 12 (Cu) is that the temperature of 5mm, evaporation source is that 300 ℃, the transfer rate of substrate are 5.8mm/sec, continuous 12 film forming.
The situation of putting into the flexible structure thing of not putting into flexible structure thing and Fig. 8 (b) of comparison diagram 8 (a) by the heat of the good flexible structure thing 11 of contact to cooling plate 12 conduction, diffusion substrate 2a, fully suppresses substrate temperature and rises as can be known.Also have, use low temperature panel 10a, 10b shown in Figure 5 simultaneously, shown in Fig. 8 (c), can more effectively suppress substrate temperature and rise.
Like this,, can suppress substrate temperature and rise,, enhance productivity so, also can carry out film forming continuously even under the state of high speed conveying substrate by utilizing absorptive thermal radiation and thermal conduction cooling base.In addition, rise because can suppress substrate temperature, thus can the distance of substrate and evaporation source near and reduce under the state of invalid quantity of steam and carry out film forming, reduce the waste of evaporating materials.
Fig. 9 represents the concise and to the point vertical view of this manufacturing installation.
In addition, " P " expression vacuum pump among the figure, " N 2" expression nitrogen supply line.
As shown in Figure 9, this manufacturing installation is for the organic EL that forms FPD with straight column mode constitutes, and having can independent controlled atmosphere and a plurality of treatment chambers of vacuum tightness; With e Foerderanlage to the continuous conveying substrate of a plurality of treatment chambers, manage the chamber throughout, under different conditions, can carry out and reach the predetermined process of purpose separately.
This manufacturing installation is by reducing the position that is provided with of fence gate 21 as far as possible, reduces the required time of switch fence gate 21, thereby reduces the time of adjusting vacuum tightness, consequently can realize continuously ceaselessly to the chambers conveying substrate.Specifically be, only in the connection portion with the treatment chamber that will change atmosphere (vacuum tightness) significantly sluice valve 21 be set, other parts are provided with differential exhaust portion D1～D4, carry out differential exhaust with the formation intermediate pressure, thereby keep the pressure difference between chambers.
Sluice valve 21 is arranged on the front and back of the treatment chamber that will change atmosphere (vacuum tightness) significantly, differential exhaust portion D1～D4 is with respect to continuous conveying substrate, in the front and back of the treatment chamber that is provided with sluice valve 21, before atmosphere (vacuum tightness) reaches required standard, stop conveying substrate.Therefore, this manufacturing installation can be with the atmosphere around box body 6 switches a plurality of supports 1, substrate by using the box body 6 of the support that can hold a plurality of supporting substrates.Atmosphere around the box body 6 changes to atmosphere/vacuum, vacuum/N in the predetermined process chamber 2, N 2/ atmosphere etc.In addition,, can realize that the substrate after atmosphere is switched is carried continuously, enhance productivity by using box body 6.Especially, use box body 6 by treatment chamber in the front and back of the sealing chamber 33 that is in device inside, can change atmosphere simultaneously, while traversing carriage 1, substrate, shorten the required adjustment time of atmosphere that changes, reduce the unnecessary waiting time, thereby prevent that film formation process, sealing process processing power from descending.
The space of differential exhaust portion D1～D4 forms by the spaced walls of the peristome that has support and can pass through.For keep with differential exhaust portion D1, D2, D4 in abutting connection with and have pressure difference between the chambers of different vacuum tightnesss, the vacuum degree control among differential exhaust portion D1, D2, the D4 is the intermediary vacuum tightness of the vacuum tightness of chambers.The vacuum tightness of differential exhaust portion D1, D2, D4 is by using the balance N that does not indicate among vacuum pump that the gas among differential exhaust portion D1, D2, the D4 is discharged and the figure 2, be controlled to be appropriate vacuum.Differential exhaust portion D3 is used for and differential exhaust portion D1, D2, purpose that D4 is different, specifically is not influence each other the vacuum tightness pressure that each vacuum chamber that connects near being controlled to be is higher for making the atmosphere between chambers.
This manufacturing installation keeps the pressure difference of the vacuum tightness between two treatment chambers between the plasma purge chamber organic EL of the 24-filming chamber 25, between the 24-of the plasma purge chamber support conveying chamber 27 differential exhaust portion D1, D2 are set with this.For example, be that the pressure of P1, organic EL filming chamber 25 is P3 with the pressure of plasma purge chamber 24, when P1＞P3, the differential exhaust portion D1 of the pressure P 2 of P1＞P2＞P3 is set, make the pressure of P1, P3 be easy to keep, thereby do not need the sluice valve between treatment chamber.Equally, the pressure of support conveying chamber 27 is and the identical pressure P 3 of pressure of organic EL filming chamber 25, so the differential exhaust portion D2 of the pressure P 4 of P1＞P4＞P3 is set, makes the pressure of P1, P3 be easy to keep, thereby do not need the sluice valve between treatment chamber.
In addition, between the organic EL 25-of the filming chamber electrode filming chamber 28, the differential exhaust portion D3 higher than this two treatment chambers vacuum tightness is set, thereby do not make the invalid steam of this two treatment chamber enter the other side's treatment chamber mutually.For example, be P7 with the pressure of electrode filming chamber 28, the differential exhaust portion D3 of the pressure P 5 of P7＞P3＞P5 is set, thereby the atmosphere of mutual treatment chamber is influenced each other, and do not need the sluice valve between treatment chamber.Also have, when the pressure difference of P7 and P5 is big, at the differential exhaust portion D3 differential exhaust portion D4 that the pressure P 6 of P7＞P6＞P5 is set with connecting in upright arrangement, promptly, the differential exhaust portion D4 of the intermediate pressure P6 of each vacuum tightness of the electrode filming chamber 28 of adjacency, differential exhaust portion D3 can easily keep the pressure difference of the vacuum tightness between two treatment chambers.
Like this,, can not need to be provided with fence gate 21 by differential exhaust portion D1～D4 is set, and can be continuously conveying substrate ceaselessly, enhance productivity.
The following describes action S1～S3, the action K1～K3 of box body 6, action H1, the H2 of support 1 of the substrate of this manufacturing installation.
In addition, below be support A (the 1st bracing or strutting arrangement) with the support that the mask that has formed the organic EL figure is installed in advance, be support B (the 2nd bracing or strutting arrangement) with the support that the mask that has formed electrode pattern is installed in advance, describe.
Substrate itself moves by the order of S1, S2, S3, forms the organic EL films in organic EL filming chamber 25 in its moving process, forms electrodes in electrode filming chamber 28, after sealing processing chamber 33 seals, produces the FPD of organic EL.
On support A, substrate is set.And after a plurality of support A that will have substrate are accommodated into box body 6, turn to loading part E1 to be provided with.After this manufacturing installation was started working, the valve 21a that opens the sluices sent box body 6 into atmosphere/vacuum and switches chamber 22a, behind the closed shutter valve 21a, discharged with the atmosphere that vacuum pump switches chamber 22a with atmosphere/vacuum, until the specified vacuum degree.After reaching the specified vacuum degree, the valve 21b that opens the sluices moves on to box body waiting room 23 with box body 6.To mask support switch room 26, support A carries continuously with substrate from box body waiting room 23.After all support A take out of from box body 6, the support A after the use, promptly do not have the empty support A of substrate to return sylphon body 6, then, empty support A and box body 6 enter atmosphere/vacuum jointly and switch chamber 22b.Lubricated, behind the closed shutter valve 21c, make atmosphere/vacuum switch chamber 22b and recover normal atmosphere, behind the valve 21d that opens the sluices, box body 6 is sent to unloading part E2.
Shown in the box body moving range K1 of Fig. 9, the box body of sending into 6 that is used for substrate and support A, because only the regional internal recycle in regulation moves, so as a plurality of box bodys 6 of use more than at least 2, then by switching chamber 22a, 22b in atmosphere/vacuum, independently carry out the switching of atmosphere/vacuum, just can shorten atmosphere/vacuum and switch the required time, enhance productivity.In addition, during a plurality of support A of box body waiting room 23 continuous conveyings, switch chamber 22a at atmosphere/vacuum and switch to vacuum as atmosphere with the box body 6 of back, then can switch chamber 22a and move box body 6, a plurality of support A that are contained in different box body 6 can be sent in the treatment chamber of this manufacturing installation inside continuously to box body waiting room 23 consecutive orders from atmosphere/vacuum.
From box body 6 order that moves to box body waiting room 23 treatment chamber ittransfer gantry A to this manufacturing installation inside.At first, move to plasma purge chamber 24 (washing unit), and use O 2Plasma cleans support A and goes up the mask of installation and the film forming face of substrate.Support A after the cleaning is by differential exhaust portion D1, and order is sent into organic EL filming chamber 25, forms the multilayer organic film.Organic EL filming chamber 25 has e Foerderanlage shown in Figure 4, the described low temperature panel of Fig. 5, and cooling plate shown in Figure 7 etc., so can not realize the conveying of support A, film forming is carried out in the control of the temperature of substrate can being risen simultaneously within the limits prescribed with misplacing.Organic EL filming chamber 25 is set at the constant fixing speed with the transfer rate of e Foerderanlage, and suitably sets the film forming speed of each organic film, to form the organic film of specific thickness.In addition, organic EL filming chamber 25 is provided with a plurality of evaporation sources etc. according to the film forming film number of plies and its purpose.
After organic EL filming chamber 25 formed organic films, the support A with substrate was sent into mask support switch room 26 (switch) in proper order, only substrate is unloaded from support A at this, changes to support B.That is, the support with supporting substrate exchanges to electrode support B from organic EL with support A.
The support A that unloads is by support conveying chamber 27, and via differential exhaust portion D2, after plasma purge chamber 24 was cleaned, order was returned the box body 6 of box body waiting room 23.After the support A of maximum lift-launch amount got back to box body 6, box body 6 just was moved to atmosphere/vacuum and switches chamber 22b, delivered to unloading part E2 after switching to atmosphere.Like this, support A sends into box body 6 together from loading part E1 shown in the support motion track H1 of Fig. 9, and through behind a plurality of treatment chambers, 24 clean in the plasma purge chamber, and return unloading part E2 together with box body 6.Support A 24 cleans in the plasma purge chamber, so reusable, for example, at box body waiting room 23 etc., if substrate only can be set on support A, the loading part E1 that so only substrate is arranged at this manufacturing installation gets final product.
On the other hand, electrode a plurality ofly is not accommodated in it in box body 6 and turns to loading part E3 to be provided with under the state of substrate is set with support B.After this manufacturing installation was started working, the valve 21a that opens the sluices sent box body 6 into atmosphere/vacuum/N 2Switch chamber 35a, and closed shutter valve 21g.After this, with vacuum pump with atmosphere/vacuum/N 2The atmosphere that switches chamber 35a is discharged, and up to reaching the specified vacuum degree, promptly supplies N after reaching the specified vacuum degree 2, switch to N 2Atmosphere.The valve 21h that opens the sluices then moves on to box body waiting room 34 with box body 6.After all support B took out of from box body 6, the support B after the use returned sylphon body 6.At this moment, setting is formed with organic EL and has carried out the substrate after the encapsulation process on support B.After this, box body 6 and substrate, support B are simultaneously to atmosphere/vacuum/N 2Switch chamber 35b and move, behind the closed shutter valve 21i, atmosphere/vacuum/N 2Switch chamber 35b and recover normal atmosphere.Atmosphere/vacuum/N 2After switching chamber 35b recovery normal atmosphere, the valve 21j that opens the sluices, box body 6 is delivered to unloading part E4 simultaneously with substrate, support B.
Shown in the box body moving range K3 of Fig. 9, be used for the box body of sending into 6 of support B, also only move at the regional internal recycle of stipulating.Therefore, as using a plurality of box bodys 6 more than at least 2, at atmosphere/vacuum/N 2Switch chamber 35a, 35b, independently carry out the switching of atmosphere/vacuum, just can shorten atmosphere/vacuum/N 2Switch the required time, enhance productivity.In addition, during a plurality of support A of box body waiting room 34 continuous conveyings, at atmosphere/vacuum/N 2Switch chamber 35a, switch to N as atmosphere with the box body 6 of back 2, just can be from atmosphere/vacuum/N 2Switch chamber 35a to the mobile box body 6 of box body waiting room 34 orders, a plurality of support B that are contained in different box body 6 can be sent in the treatment chamber of this manufacturing installation continuously.
Shown in the support motion track H2 of Fig. 9, support B sends into from loading part E3 together with box body 6, and carries in treatment chamber from box body 6 orders that move to box body waiting room 34, returns unloading part E4 together with box body 6 then.In this manufacturing installation inside, support B passes through sealing processing chamber 33 from the box body 6 that moves to box body waiting room 34, and moves to the box body 6 of box body waiting room 32.The valve 21f that opens the sluices then, with support B with box body 6 together to vacuum/N 2Switch chamber 31 and move, behind the closed shutter valve 21f, use vacuum pump from N 2Atmosphere is switched to the specified vacuum degree.After reaching the specified vacuum degree, the valve 21e that opens the sluices moves support B together with box body 6 to box body waiting room 30.Then, support B order from the box body 6 that moves to box body waiting room 30 is sent, and after support purge chamber 29 (washing unit) cleans together with mask, by differential exhaust portion D4, D3, sends into support switch room 26.
In support switch room 26, change to substrate on the support B with support B together by differential exhaust portion D3, D4, order enters electrode filming chamber 28.In electrode filming chamber 28, become the metallic film of the wiring of organic EL.The substrate that is formed with metallic film returns the box body 6 of box body waiting room 30 with support B order together.After the maximum support B that carries number returned box body 6, the valve 21e that opens the sluices sent into vacuum/N with support B together with box body 6 2Switch chamber 31, behind the closed shutter valve 21e, supply N 2And switch to N from vacuum atmosphere 2Atmosphere.The valve 21f that then opens the sluices moves support B together with box body 6 to box body waiting room 32, and closed shutter valve 21f.Then support B is sent into sealing processing chamber 33 from box body 6 orders that move to box body waiting room 32, use sealing material sealing organic el element.After the sealing, support B is sent into the box body 6 of box body waiting room 34 in proper order, and after the maximum support B that carries number returned box body 6, the valve 21i that opens the sluices sent into atmosphere/vacuum/N with support B together with box body 6 2Switch chamber 35b.Behind the closed shutter valve 21i, atmosphere/vacuum/N 2Switch chamber 35b and recover normal atmosphere, the valve 21j that opens the sluices then sends into unloading part E4 with support B together with box body 6.At this moment, formed organic EL and finished the substrate of encapsulation process, promptly the FPD of organic EL is sent device together with support B under the state of finishing.

Claims (15)

1. straight-line organic electroluminescence manufacturing installation, it has: can independent controlled atmosphere and a plurality of treatment chambers of vacuum tightness; With e Foerderanlage, and, on described substrate, form organic electroluminescent device, it is characterized in that through the predetermined process in described a plurality of treatment chambers to the continuous conveying substrate of described a plurality of treatment chambers:
Have bracing or strutting arrangement, described bracing or strutting arrangement possesses the mask that is formed with the figure of film forming film on described substrate, and supports described substrate and prevent its bending,
Described e Foerderanlage utilizes described bracing or strutting arrangement to carry described substrate continuously to described a plurality of treatment chambers.
2. straight-line organic electroluminescence manufacturing installation, it has: can independent controlled atmosphere and a plurality of treatment chambers of vacuum tightness; With e Foerderanlage, and, on described substrate, form organic electroluminescent device, it is characterized in that: have through the predetermined process in described a plurality of treatment chambers to the continuous conveying substrate of described a plurality of treatment chambers:
The 1st bracing or strutting arrangement, described the 1st bracing or strutting arrangement possess the mask that is formed with the figure of film forming organic film on described substrate and support described substrate and prevent its bending;
The 2nd bracing or strutting arrangement, described the 2nd bracing or strutting arrangement possess the mask that is formed with the figure of film forming electrode film on described substrate and support described substrate and prevent its bending; With
Switch, described switch exchanges to described 2nd bracing or strutting arrangement from described the 1st bracing or strutting arrangement with described substrate in device,
Described e Foerderanlage utilizes described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement to carry described substrate continuously to described a plurality of treatment chambers.
3. straight-line organic electroluminescence manufacturing installation, it has: can independent controlled atmosphere and a plurality of treatment chambers of vacuum tightness; With e Foerderanlage, and, on described substrate, form organic electroluminescent device, it is characterized in that through the predetermined process in described a plurality of treatment chambers to the continuous conveying substrate of described a plurality of treatment chambers:
Have differential exhaust portion, described differential exhaust portion is arranged between the mutually different treatment chamber of vacuum tightness, and can independently control the intermediary vacuum tightness of the vacuum tightness of chambers,
Described e Foerderanlage is carried described substrate continuously by described differential exhaust portion between the different treatment chamber of described vacuum tightness.
4. straight-line organic electroluminescence manufacturing installation, it has: can independent controlled atmosphere and a plurality of treatment chambers of vacuum tightness; With e Foerderanlage, and, on described substrate, form organic electroluminescent device, it is characterized in that through the predetermined process in described a plurality of treatment chambers to the continuous conveying substrate of described a plurality of treatment chambers:
Have and suppress the cooling-part that described substrate temperature rises,
Described e Foerderanlage is carried described substrate to described a plurality of treatment chambers continuously together with described cooling-part.
5. straight-line organic electroluminescence manufacturing installation according to claim 1 and 2, it is characterized in that: have differential exhaust portion, described differential exhaust portion is arranged between the mutually different treatment chamber of vacuum tightness, and can independently control the intermediary vacuum tightness of the vacuum tightness of chambers
Described e Foerderanlage is by described differential exhaust portion, and uses described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement, carries described substrate between the different treatment chamber of described vacuum tightness continuously.
6. straight-line organic electroluminescence manufacturing installation according to claim 1 and 2 is characterized in that: the cooling-part that will suppress described substrate temperature rising is arranged on described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement,
Described e Foerderanlage uses described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement to carry described substrate continuously to described a plurality of treatment chambers.
7. straight-line organic electroluminescence manufacturing installation according to claim 5 is characterized in that: the cooling-part that will suppress described substrate temperature rising is arranged on described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement,
Described e Foerderanlage is by described differential exhaust portion, and uses described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement, carries described substrate between the different treatment chamber of described vacuum tightness continuously.
8. according to any described straight-line organic electroluminescence manufacturing installation in the claim 1,2,5,6 or 7, it is characterized in that: be provided with the washing unit that cleans described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement,
Make described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or the described the 2nd support reusable.
9. according to any described straight-line organic electroluminescence manufacturing installation in the claim 1,2,5,6,7 or 8, it is characterized in that: described e Foerderanlage has the positioning element of the position of determining described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement.
10. according to any described straight-line organic electroluminescence manufacturing installation in the claim 1,2,5,6,7,8 or 9, it is characterized in that: have the box body that can hold a plurality of described bracing or strutting arrangements, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement,
Use described box body, change vacuum tightness significantly in the predetermined process chamber,
And described e Foerderanlage is carried described bracing or strutting arrangement, described the 1st bracing or strutting arrangement or described the 2nd bracing or strutting arrangement continuously from described box body in vacuum tightness after changing.
11. according to any described straight-line organic electroluminescence manufacturing installation in the claim 3,5 or 7, it is characterized in that: described differential exhaust portion also has other higher differential exhaust portion of vacuum tightness.
12. according to any described straight-line organic electroluminescence manufacturing installation in the claim 4,6 or 7, it is characterized in that: be provided with heat-conduction component between described substrate and described cooling-part, described heat-conduction component is to the conduction of described cooling-part and the diffusion heat from described substrate.
13. according to any described straight-line organic electroluminescence manufacturing installation in the claim 4,6,7 or 12, it is characterized in that: described cooling-part is reusable.
14. according to any described straight-line organic electroluminescence manufacturing installation in the claim 1～13, it is characterized in that: be provided with the radiant heat absorption unit, described radiant heat absorption unit absorbs the radiant heat from described substrate and described cooling-part or described substrate or described cooling-part.
15. according to any described straight-line organic electroluminescence manufacturing installation in the claim 1～14, it is characterized in that: the transfer rate of described e Foerderanlage is a constant,
And control the film forming speed of the film in a plurality of treatment chambers respectively.
CNB2005100547673A 2004-03-30 2005-03-11 Straight-line organic electroluminescence mfg. device Active CN100482850C (en)

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JP2004098403 2004-03-30
JP2004098403A JP2005285576A (en) 2004-03-30 2004-03-30 Manufacturing device of in-line type organic electroluminescent element

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CN1676659A true CN1676659A (en) 2005-10-05
CN100482850C CN100482850C (en) 2009-04-29

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TW200539740A (en) 2005-12-01
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TWI311895B (en) 2009-07-01
CN100482850C (en) 2009-04-29
KR20060043861A (en) 2006-05-15

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