JP2005285576A - Manufacturing device of in-line type organic electroluminescent element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing device of an in-line type electroluminescent element with improved film-forming quality and high production efficiency. <P>SOLUTION: In the manufacturing device of the in-line type organic electroluminescent element, a holder integrated with a mask is used to retain a substrate, to which a cooling plate is fitted to suppress temperature rise of the substrate and continuous conveyance is carried out. Further, a structure is realized in which the substrate is continuously conveyed without stop between treatment rooms of different degrees of vacuum, with differential exhaust parts D1 to D4 provided inside the device. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an in-line organic EL manufacturing apparatus that continuously conveys a substrate and deposits an evaporation material such as an organic material to form an organic electroluminescence (hereinafter abbreviated as EL) element.

FIG. 10 shows an organic EL manufacturing apparatus that is currently generally used.
The apparatus shown in FIG. 10 is a so-called cluster type apparatus, in which a transfer chamber having a robot hand is formed in a polygonal shape, and a plurality of processing chambers are provided around the transfer chamber. As shown in FIG. 10, in the case of the organic EL manufacturing apparatus 40, the film forming process unit 41 includes a transfer chamber 42 that transfers a substrate to each processing chamber, a substrate carry-in port 43 that carries a substrate, A cleaning chamber 44 for cleaning and film forming chambers 45, 46, 47 for forming a film on the substrate are provided, and these processing chambers are arranged around the transfer chamber 42 via a plurality of gate valves 48. Is done. Since the organic EL element is composed of a plurality of thin films including the electrode layer, the organic EL manufacturing apparatus 40 is provided with film forming chambers 45, 46, 47 serving as processing chambers for each thin film (“organic EL From the Nikkan Kogyo Shimbun, p98, Fig. 53).

  When film formation is performed on the substrate, the substrate carried into the substrate carry-in port 43 is opened into the processing chamber (for example, the film formation chamber 45) by opening the gate door 48, the gate door 48 is closed, and the degree of vacuum is adjusted. After that, the first layer is formed on the substrate. After the film formation for the first layer is completed, the gate door 48 is opened again, the substrate is unloaded from the film formation chamber 45, and the substrate is loaded into the next processing chamber (for example, the film formation chamber 46). Film formation is performed in the same manner. The substrate thus formed is transported to the process unit 50 through the delivery chamber 49 and bonded to the cover glass that has been pretreated in the process units 51 and 52 to form an FPD (flat panel display). A finished product of the organic EL element is produced.

JP 2002-348659 A JP 2003-157773 A

  In FPDs using organic EL elements, reduction of manufacturing costs is a major issue in the future. For this purpose, it is essential to shorten the manufacturing time per substrate and improve the material utilization efficiency. However, the cluster type organic EL manufacturing apparatus shown in FIG. 10 has an independent processing chamber for each thin film, and it is necessary to carry in and out the substrate for each processing chamber, and the degree of vacuum for each processing chamber. Therefore, there is a problem that the manufacturing time per substrate is long.

On the other hand, in order to shorten the manufacturing time, an organic EL manufacturing apparatus called an inline type has been proposed (for example, Patent Document 1 and Patent Document 2).
The in-line type organic EL manufacturing apparatus has a configuration in which a plurality of film forming chambers for organic EL elements are linearly arranged in the same vacuum container, and a gate valve between these film forming chambers is eliminated. At the time of film formation, the substrate is formed while being continuously transferred over a plurality of film formation chambers, so that the time required for substrate transfer and vacuum adjustment is shortened, thereby reducing the manufacturing time. Is.

  However, the organic EL manufacturing apparatus has a plurality of processing chambers having different atmospheres (degrees of vacuum) (for example, the cleaning chamber 44, the electrode film forming chamber 47 in FIG. Even if only the film forming chamber for forming the organic EL element is disposed in the same vacuum vessel, a gate valve is still necessary between the other processing chambers. Therefore, when transferring a substrate between these processing chambers, it is necessary to open and close the gate valve each time the transfer is performed, and it is necessary to adjust the degree of vacuum in each processing chamber each time the gate valve is opened and closed. is there. Some of them have a vacuum degree adjustment chamber, and after adjusting the degree of vacuum in the vacuum degree adjustment chamber, the substrate is transferred to the processing chamber. Since it takes time to adjust the degree, there is a limit to shortening the manufacturing time, and improvement in production efficiency cannot be expected.

  Further, in the in-line type organic EL manufacturing apparatus, since the substrate is continuously transported in the film forming chamber for forming the organic EL element, the influence of the temperature of the evaporation source in the film forming chamber is continuously affected. The substrate temperature tends to rise. The increase in the substrate temperature causes re-evaporation of the thin film and causes deterioration of the quality of the thin film. In particular, in order to increase the deposition rate, it is desirable to reduce the ineffective vapor, so it is desirable to bring the evaporation source closer to the substrate, but the substrate temperature is more susceptible to the evaporation source and the deposition rate is improved. And film quality cannot be improved at the same time. In addition, when the evaporation source is kept away from the substrate and the substrate temperature is appropriately maintained, the film formation quality is improved, but the amount of ineffective vapor is increased and the film formation rate is decreased. It is impossible to improve film quality. That is, in the in-line type organic EL manufacturing apparatus, it is difficult to improve the film formation quality and shorten the manufacturing time, and it is impossible to improve the production efficiency.

  In addition, in the in-line type organic EL manufacturing apparatus, in the film forming chamber for forming the organic EL element, for example, the film is formed while the substrate is continuously transferred on the belt type transfer apparatus. Therefore, the position of the substrate is likely to be displaced, and in particular, in the case of a large-sized substrate, there is a problem of the deflection of the substrate itself, and film formation is liable to occur.

  As described above, in the in-line organic EL manufacturing apparatus, many problems remain to be solved in terms of film formation quality, production efficiency, and the like when mass productivity is considered.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an in-line type organic EL manufacturing apparatus with high production efficiency while improving film formation quality.

The in-line type organic EL manufacturing apparatus according to claim 1 of the present invention for solving the above-described problems is
A plurality of processing chambers capable of independently controlling the atmosphere and the degree of vacuum;
Transport means for continuously transporting the substrate to the plurality of processing chambers,
An in-line type organic EL manufacturing apparatus that forms an organic EL element on the substrate through predetermined processing in the plurality of processing chambers,
A mask having a thin film pattern formed on the substrate; and holding means for holding the substrate while preventing deflection.
The transport means transports the substrate continuously to the plurality of processing chambers using the holding means.
By integrating the mask for patterning and the holding means for holding the substrate, the holding means can have the mask function of the substrate, and the individual mask to the manufacturing apparatus and the manufacturing apparatus can be used. It is not necessary to attach the mask to the substrate, and the process time for the mask can be shortened. Further, since the substrate is held by the holding means, it is possible to prevent the substrate from being bent due to its own weight or the like.

The in-line type organic EL manufacturing apparatus according to claim 2 of the present invention for solving the above-described problems is
A plurality of processing chambers capable of independently controlling the atmosphere and the degree of vacuum;
Transport means for continuously transporting the substrate to the plurality of processing chambers,
An in-line type organic EL manufacturing apparatus that forms an organic EL element on the substrate through predetermined processing in the plurality of processing chambers,
A first holding means comprising a mask on which a pattern of an organic thin film formed on the substrate is formed, preventing the deflection and holding the substrate;
A second holding means comprising a mask on which a pattern of an electrode thin film formed on the substrate is formed, preventing the deflection and holding the substrate;
An exchange means for changing the substrate from the first holding means to the second holding means inside the apparatus,
The transfer means may transfer the substrate continuously to the plurality of processing chambers using the first holding means or the second holding means.
For example, an exchange means is provided between the processing chamber for forming the organic thin film and the processing chamber for forming the electrode thin film, and the substrate is transferred from the first holding means to the second holding means after the organic thin film is formed. To.

The in-line type organic EL manufacturing apparatus according to claim 3 of the present invention for solving the above-described problems is
A plurality of processing chambers capable of independently controlling the atmosphere and the degree of vacuum;
Transport means for continuously transporting the substrate to the plurality of processing chambers,
An in-line type organic EL manufacturing apparatus that forms an organic EL element on the substrate through predetermined processing in the plurality of processing chambers,
Provided between the processing chambers having different vacuum degrees, and having a differential exhaust unit that can independently control the intermediate vacuum degree in each processing chamber,
The transporting means transports the substrate continuously between the processing chambers having different degrees of vacuum through the differential exhaust unit.
For example, by providing a differential evacuation unit between the processing chamber for forming the organic thin film and the processing chamber for forming the electrode thin film, a gate valve is not required, and the substrate can be continuously transferred without stopping. It is possible to carry out the substrate efficiently. In addition, since the processing chambers are connected via the differential evacuation unit, the degree of vacuum of each processing chamber does not affect each processing chamber.

The in-line type organic EL manufacturing apparatus according to claim 4 of the present invention for solving the above-described problems is
A plurality of processing chambers capable of independently controlling the atmosphere and the degree of vacuum;
Transport means for continuously transporting the substrate to the plurality of processing chambers,
An in-line type organic EL manufacturing apparatus that forms an organic EL element on the substrate through predetermined processing in the plurality of processing chambers,
A cooling member for suppressing temperature rise of the substrate;
The transport means transports the substrate together with the cooling member to the plurality of processing chambers.
For example, the cooling member should have good heat dissipation or a large heat capacity, and heat conduction from the substrate to the cooling member can suppress the temperature rise of the substrate and increase the substrate transport speed. It is possible to continuously form a film on the substrate, and to improve the production efficiency.

The in-line type organic EL manufacturing apparatus according to claim 5 of the present invention for solving the above-described problems is
In the inline-type organic EL manufacturing apparatus,
Provided between the processing chambers having different vacuum degrees, and having a differential exhaust unit that can independently control the intermediate vacuum degree in each processing chamber,
The transfer means continuously moves the substrate between the processing chambers having different degrees of vacuum using the holding means, the first holding means, or the second holding means via the differential exhaust section. It is transported.

The in-line type organic EL manufacturing apparatus according to claim 6 of the present invention for solving the above-described problems is
In the inline-type organic EL manufacturing apparatus,
A cooling member that suppresses the temperature rise of the substrate is provided in the holding means, the first holding means, or the second holding means,
The transport means transports the substrate continuously to the plurality of processing chambers using the holding means, the first holding means, or the second holding means.

The in-line type organic EL manufacturing apparatus according to claim 7 of the present invention for solving the above-mentioned problems is
In the inline-type organic EL manufacturing apparatus,
A cooling member that suppresses the temperature rise of the substrate is provided in the holding means, the first holding means, or the second holding means,
The transfer means continuously moves the substrate between the processing chambers having different degrees of vacuum using the holding means, the first holding means, or the second holding means via the differential exhaust section. It is transported.

An in-line type organic EL manufacturing apparatus according to claim 8 of the present invention for solving the above-described problems is
In the inline-type organic EL manufacturing apparatus,
A cleaning means for cleaning the holding means, the first holding means or the second holding means;
The holding means, the first holding means, or the second holding means can be reused.

The in-line type organic EL manufacturing apparatus according to claim 9 of the present invention for solving the above-described problems is
In the inline-type organic EL manufacturing apparatus,
The conveying means includes a positioning member for positioning the holding means, the first holding means, or the second holding means.
Accordingly, since the positioning means of the holding means, the first holding means, or the second holding means is improved in the transfer means that performs continuous transfer, the positioning accuracy of the substrate itself is improved, and film formation defects can be prevented.

The in-line type organic EL manufacturing apparatus according to claim 10 of the present invention for solving the above-described problems is
In the inline-type organic EL manufacturing apparatus,
A cassette capable of accommodating a plurality of the holding means, the first holding means or the second holding means;
Using the cassette, a large change in the degree of vacuum in a predetermined processing chamber,
The conveying means continuously conveys the holding means, the first holding means or the second holding means from the cassette after changing the degree of vacuum.
For example, the degree of vacuum around a cassette that accommodates a plurality of substrates is switched between a high degree of vacuum / atmospheric pressure in a processing room between a processing room for film formation and a processing room for sealing. .

An in-line type organic EL manufacturing apparatus according to claim 11 of the present invention for solving the above-described problems is provided.
In the inline-type organic EL manufacturing apparatus,
The differential exhaust unit includes another differential exhaust unit having a higher degree of vacuum.
For example, a differential exhaust unit having an intermediate degree of vacuum is provided between processing chambers that do not want to affect each other, such as between a processing chamber for forming an organic thin film and a processing chamber for forming an electrode thin film. In addition, a differential exhaust unit having a higher degree of vacuum is additionally provided so that the atmosphere of each processing chamber does not affect each processing chamber.

The in-line type organic EL manufacturing apparatus according to claim 12 of the present invention for solving the above-described problems is
In the inline-type organic EL manufacturing apparatus,
A heat conduction member for conducting and diffusing heat from the substrate to the cooling member is provided between the substrate and the cooling member.
As the heat conducting member, for example, a soft material having heat conductivity and capable of following the surface roughness of the contact surface is used.

The in-line type organic EL manufacturing apparatus according to claim 13 of the present invention for solving the above-described problems is
In the inline-type organic EL manufacturing apparatus,
The cooling member is reusable.

An in-line type organic EL manufacturing apparatus according to claim 14 of the present invention for solving the above-mentioned problems is provided.
In the inline-type organic EL manufacturing apparatus,
The substrate and the cooling member, or radiant heat absorbing means for absorbing radiant heat from the substrate or the cooling member is provided.
For example, using a cryo-surface of a helium refrigerator as a radiant heat absorption means, absorbing radiant heat from the substrate and the cooling member, suppressing the temperature rise of the substrate, and continuing to the substrate even when the substrate transport speed is increased Film formation is possible, and production efficiency can be improved.

An in-line type organic EL manufacturing apparatus according to claim 15 of the present invention for solving the above-mentioned problems is provided.
In the inline-type organic EL manufacturing apparatus,
The transport means has a constant transport speed,
It is characterized in that the film forming speed of the thin film in each of the plurality of processing chambers is controlled.

  According to the present invention, since the holding means (holder) for holding the substrate and the mask for the substrate are integrated and the substrate is held using the holder, the substrate can be prevented from being bent with a simple structure. The holder can have a mask function. By preventing the deflection of the substrate, film formation defects due to the deflection of the substrate can be reduced, and by providing the holder with a mask function, the process time related to the mask can be shortened, resulting in production efficiency. Can be improved. In addition, a thin film with a different pattern can be formed on the substrate by attaching a mask with a different pattern to the holder according to the thin film to be formed and replacing the holder in the manufacturing apparatus. .

  According to the present invention, since the intermediate pressure chamber by the differential evacuation unit is provided between the processing chambers having different vacuum degrees, it is not necessary to install a gate valve between the processing chambers having different vacuum degrees, and pressure adjustment is performed. Therefore, continuous conveyance can be performed without stopping the substrate. As a result, the conveyance speed can be easily increased, and the production efficiency can be improved.

  According to the present invention, since the cooling member via the heat conducting member or the radiant heat absorbing means for absorbing radiant heat is used, the temperature rise of the substrate can be suppressed, and the film is continuously formed at a high transfer speed. Production efficiency can be improved. Further, by suppressing the temperature rise of the substrate, the distance between the substrate and the evaporation source can be reduced, and the amount of ineffective vapor can be reduced, thereby reducing the waste of the evaporation material.

  According to the present invention, since the holder positioning member is provided in the transfer means, it is possible to improve the positioning accuracy in the processing chamber in which film formation is performed, and to prevent the occurrence of film formation defects and improve production efficiency. Can be made.

  According to the present invention, since a cassette that can accommodate a plurality of holders is used not only in the loading / unloading section of the apparatus, but also between processing chambers having a large pressure change inside the apparatus, a plurality of substrates and holders together with the cassette are used. By changing the degree of vacuum around the chamber at once, the adjustment time associated with the change in the degree of vacuum is shortened, the extra waiting time is reduced, and the processing chamber for film formation, the processing chamber for sealing, etc. Production efficiency can be improved by making full use of the processing capacity.

  In the in-line type organic EL manufacturing apparatus of the present invention, in order to improve the mass productivity, the part relating to the substrate transport and the part relating to the substrate temperature are devised by paying attention to the film forming film quality and the production efficiency. Some of the specific embodiments are shown in FIGS. 1 to 9, and in particular, the portion related to the efficiency of substrate transfer is shown in FIGS. 1 to 4, the portion related to the substrate temperature is shown in FIGS. 5 to 8, and The configuration of the entire apparatus is shown in FIG. 9 and will be described in detail.

1 and 2 show an embodiment of a holder used in an inline-type organic EL manufacturing apparatus according to the present invention.
1 (a) and 2 (a) are perspective views of the substrate and the holder, and FIGS. 1 (b) and 2 (b) are cross-sectional views taken along line AA in FIG. 1 (a). FIG. 3 is a cross-sectional view taken along line BB in FIG. 2 (a).

  As shown in FIG. 1, the holder 1A (holding means) is arranged in a cross shape at the center of the frame 3a and an L-shaped frame 3a that holds the peripheral edge of the rectangular substrate 2a from below. A holding member 4a for holding the substrate 2a from below is provided, and a mask 5a on which a thin film pattern to be formed is formed is disposed in an opening formed by the frame 3a and the cross-shaped holding member 4a. Is. Note that the holding member 4a is not limited to a cross shape, and may be, for example, one in the center or a combination of many. In the holder 1A, a single substrate 2a is installed from above the holder 1A, and a pattern is formed on the lower surface side of the substrate 2a in FIG. 1 by the mask 5a. In the example of FIG. A thin film to be an organic EL element is formed. The pattern of the holding member 4a and the mask 5a is determined by the size of the organic EL element, and four, six, eight, etc. organic EL elements are formed from a single substrate 2a according to the size. Be filmed. That is, the holder 1A corresponds to the single substrate 2a, holds the peripheral portion of the single substrate 2a by the frame 3a and the holding member 4a, and prevents deflection due to its own weight, etc. The mask function of the pattern formed on the substrate 2a by the mask 5a is provided. The mask 5a is integrated with the holding member 4a and is located on the side in contact with the substrate 2a.

  Further, as shown in FIG. 2, the holder 1B (holding means) includes a plurality (four in FIG. 2) of L-shaped cross-section frames 3b that hold the peripheral edge of the rectangular substrate 2b from the lower side. The mask 5b on which the pattern of the thin film to be formed is formed is disposed in the opening formed by each frame 3b. In the holder 1B, four substrates 2b are installed from above the holder 1B, a pattern is formed by the mask 5b on the lower surface side of the substrate 2b in FIG. 2, and a thin film of an organic EL element is formed on each of the four substrates 2b. A film is formed. That is, the holder 1B corresponds to the substrate 2b of the cut plate, holds the peripheral edge portion of the substrate 2b of the cut plate by the frame 3b, prevents deflection due to its own weight, etc., and moves to the substrate 2b by the mask 5b. The mask function of the pattern to form into a film is provided.

  Although not shown in FIGS. 1 and 2, in order to more effectively suppress the deflection of the substrates 2a and 2b, a pressing member for pressing the substrates 2a and 2b from above is provided. May be. For example, the cooling plate 13 shown in FIG. 7 described later also functions as a pressing member. Moreover, you may hold | maintain so that the board | substrates 2a and 2b may be pinched | interposed between flame | frame 3a, 3b and a pressing member using an electrostatic chuck and a magnet chuck.

  The in-line type organic EL manufacturing apparatus (hereinafter abbreviated as the present manufacturing apparatus) according to the present invention performs film formation while transporting a substrate. By transporting the substrate using the holders 1A and 1B, it is possible to prevent the substrate from being bent and to form a film while transporting it, and to prevent a film formation defect caused by the deflection of the substrate. Further, if a holder having a mask on which a different pattern is formed according to the thin film pattern is prepared in advance, it is possible to form different thin film patterns. For example, in this manufacturing apparatus, the holder A (first holding means) having a mask for an organic thin film and the holder B (second holding means) having a mask for an electrode thin film are separately used, which are different from each other. A thin film pattern can be formed. Also, as shown in FIG. 9 to be described later, cleaning chambers 24 and 29 (cleaning means) for cleaning the holder are provided, and the holder can be reused by cleaning and circulating the holder after use. It is possible to improve efficiency. Further, by integrating the holder and the mask, it is possible to eliminate the need for individual conveyance of the mask alone, and it is not necessary to separately provide a conveyance device for the mask.

A plurality of holders 1 are accommodated in a cassette 6 as shown in FIG. 3 and installed together with the cassette 6 at an apparatus carry-in entrance (for example, refer to the carry-in part E1 in FIG. 9). The cassette 6 is provided with a plurality of opposed groove portions 6a in a box-shaped housing having an opening, and a single holder 1 is inserted and installed in a pair of groove portions 6a. 1 is accommodated in one cassette 6. In this way, by using the cassette 6 that can accommodate a plurality of holders 1 at a place where a large change in atmosphere (vacuum degree) is required, such as an apparatus carry-in port, a plurality of holders, that is, a plurality of substrates, can be used. The pressure can be adjusted to a desired atmosphere (pressure) by a single pressure control, and the adjustment time of the atmosphere (pressure) can be shortened. Further, once the pressure (atmosphere) is switched to a desired value, the film formation process is performed while the holder 1 is sequentially taken out from the cassette 6 and continuously conveyed without affecting the atmosphere (vacuum degree) of the film formation chamber or the like. Therefore, it is possible to reduce extra conveyance time, adjustment time of atmosphere (degree of vacuum), etc., and improve production efficiency. For example, in FIG. 9, the atmosphere / vacuum switching chambers 22a and 22b (atmosphere / vacuum switching), the vacuum / N ₂ switching chamber 31 (vacuum / N ₂ switching), and the N ₂ / atmosphere switching chambers 35a and 35b (N ₂ / air switching), the cassette 6 is used, and a plurality of holders 1 can be passed together with the cassette 6 between processing chambers of different atmospheres (degrees of vacuum).

In FIG. 4, an example of embodiment of the conveying apparatus used with this manufacturing apparatus is shown.
4A is a schematic view of the transfer device in the film forming chamber as viewed from the side, and FIG. 4B is a cross-sectional view taken along the line CC in FIG. 4A.

  The holder 1A has a deflection preventing function and a mask function. However, the holder 1A uses the positioning members 8a and 8b provided in the transport device 7 (transport means), so that the position on the transport device 7 is transported. It also functions as a guide (guide) for improving accuracy. Specifically, the conveying device 7 has two belts 7a arranged in a straight line and a plurality of rollers 7b for driving the belts 7a, and is positioned at a predetermined position on the two belts 7a. Members 8a and 8b are disposed. The positioning member 8a is for positioning the holder 1A in the traveling direction, and the positioning member 8b is for positioning in the direction perpendicular to the traveling direction of the holder 1A. The belt 7a and the roller 7b are disposed at a position that does not affect the film forming portion of the substrate, specifically, the frame 3a portion of the holder 1A, and supports the substrate together with the holder 1A so that the substrate can be conveyed. When film formation is performed, the holder 1A is moved at a constant predetermined speed so that the film thickness of the thin film to be formed becomes uniform along the substrate transport direction.

  As described above, the positioning member 8a, 8b accurately positions the holder 1A during conveyance, so that the substrate included in the holder 1A is also accurately positioned. That is, the positioning accuracy at the time of film formation is improved with respect to the evaporation source 9 that is disposed below the holder 1A and supplies the evaporation material, and it is possible to reduce film formation defects due to misalignment. Become. In the present embodiment, the convex positioning members 8a and 8b are provided only on the belt 7a side, but the concave portions corresponding to the positioning members 8a and 8b are provided on the holder 1A side and are fitted to each other. Alternatively, positioning may be performed, or conversely, a concave portion may be provided on the belt 7a side and a convex portion provided on the holder 1A side, and positioning may be performed by fitting each other. In addition, even if it arrange | positions a roll appropriately and the frictional force between a roll and the holder 1A can be hold | maintained without slipping the holder 1A, even if it conveys the holder 1A with a roller type conveyor instead of a belt type conveyor Good.

  In an in-line organic EL manufacturing apparatus, in order to improve production efficiency, evaporation sources that supply thin film evaporation materials are arranged linearly in one vacuum chamber, and substrates are continuously conveyed above each evaporation source. However, the film is formed. In the conventional in-line type organic EL manufacturing apparatus, the substrate temperature is likely to rise due to the above-described configuration, and the production efficiency and the film formation quality are in a trade-off relationship. Therefore, in this manufacturing apparatus, even in the state where the substrate is deposited while being continuously conveyed, the production efficiency is improved by suppressing the temperature rise of the substrate so as to obtain a favorable film formation state. Specific embodiments thereof are shown in FIGS.

FIG. 5 is a schematic view showing the inside of a vacuum vessel in which a plurality of evaporation sources 9 are arranged.
As shown in FIG. 5, the manufacturing apparatus includes cryopanels 10a and 10b (radiant heat absorbing means) that absorb radiant heat from the substrate and a cooling plate 12 (see FIG. 7) described later in order to suppress an increase in the substrate temperature. . The cryopanels 10 a and 10 b are arranged in parallel so as to be close to both surfaces of the holder 1 in a space that does not hinder evaporation of the evaporation material supplied from the evaporation source 9, depending on the number of evaporation sources 9. A plurality of them are provided along the conveying device. The cryopanels 10a and 10b are equivalent to a cryopanel used inside a cryopump or the like, and use a cryosurface of a refrigerator using liquid He or the like.

  Inside the vacuum container, since the periphery of the substrate is a vacuum, there is almost no gas that mediates heat conduction from the substrate. Therefore, in the present invention, the cryopanels 10a and 10b that can be maintained at a low temperature (−20 ° C. to −200 ° C.) are used to actively absorb the radiant heat from the substrate or the like (cold radiation), thereby increasing the temperature of the substrate. To prevent.

FIG. 6 shows the temperature change of the substrate when the cryopanel is not used and when it is used.
This is because the initial temperature of the glass substrate is 25 ° C., the temperature of the cryopanels 10a and 10b is −200 ° C., the temperature of the evaporation source 9 is 300 ° C., and the substrate transport speed is 5.8 mm / sec. This was done 12 times.

  From the comparison between the case where the cryopanel of FIG. 6A is not used and the case of using the cryopanel of FIG. 6B, it can be seen that the rise in the substrate temperature is considerably suppressed by the cooling by the cryopanel.

FIG. 7 is a cross-sectional view showing a configuration in which a heat conducting member and a cooling member are provided on the holder 1A shown in FIG.
The holder shown in FIG. 7 is obtained by providing a flexible structure 11 (heat conducting member) and a cooling plate 12 (cooling member) on the holder 1A shown in FIG. Specifically, the flexible structure 11 is disposed on the substrate 2 a held by the holder 1 </ b> A, and the cooling plate 12 is disposed on the flexible structure 11. The flexible structure 11 and the cooling plate 12 are disposed on the surface opposite to the surface on which the substrate 2a is formed. If the thermal conductivity from the substrate 2a to the cooling plate 12 can be sufficiently secured, the flexible structure 11 is not necessarily provided.

  The above configuration is intended to suppress the temperature rise of the substrate 2a by positively conducting heat conduction and heat diffusion from the substrate 2a to the cooling plate 12 side. Specifically, the cooling plate 12 is made of a material having high thermal conductivity such as Cu, the substrate 2a is brought into contact with the cooling plate 12, the temperature of the substrate 2a is released by heat conduction and thermal diffusion, and the substrate 2a itself is released. Temperature rise is prevented. In addition, the temperature on the substrate 2a side including the cooling plate 12 may be difficult to increase by increasing the heat capacity of the cooling plate 12 itself, such as by increasing the volume of the cooling plate 12 itself. Further, in order to improve the thermal conductivity between the cooling plate 12 and the substrate 2a, the flexible structure 11 that improves the adhesion between the contact surfaces may be sandwiched between the cooling plate 12 and the substrate 2a. Good. As the flexible structure 11, for example, silicon rubber, graphite sheet, carbon sheet, or the like is used. Even if the thermal conductivity is about 0.2 W / (m · K), it can be used as a flexible structure if it has a low degassing amount in vacuum and has good adhesion to the substrate. For example, a gel-like one can also be used.

  In the present manufacturing apparatus, before the substrate 2a is carried in, the cooling plate 12 is mounted on the substrate 2a in advance, and after the film formation and sealing processing of the substrate 2a, it is removed from the substrate 2a when carried out. In this case, the cooling plate 12 once used is cooled to about 20 ° C. and reused. Further, in the present manufacturing apparatus, the cooling plate 12 may be attached to the substrate 2a before film formation, and the cooling plate 12 may be removed from the substrate 2a after film formation. In this case, if the cooling plate 12 once used can be cooled in the manufacturing apparatus, the cooling plate 12 can be circulated in the apparatus and reused.

FIG. 8 shows the temperature change of the substrate when the flexible structure is not sandwiched between the substrate and the cooling plate.
This is because the initial temperature of the glass substrate is 25 ° C., the thickness of the flexible structure 11 (silicon rubber) is 1 mm, the thickness of the cooling plate 12 (Cu) is 5 mm, the temperature of the evaporation source is 300 ° C., and the conveyance speed of the substrate is 5 8 mm / sec, the number of film formations was continuously performed 12 times.

  From the comparison between the case where the flexible structure in FIG. 8A is not sandwiched and the case where the flexible structure in FIG. 8B is sandwiched, the heat conduction and thermal diffusion from the substrate 2a to the cooling plate 12 have good contact. It can be seen that the increase in the substrate temperature is considerably suppressed by the flexible structure 11. Further, by using the cryopanels 10a and 10b shown in FIG. 5 together, as shown in FIG. 8C, it is possible to more effectively suppress the substrate temperature from rising.

  As described above, since the temperature rise of the substrate can be suppressed by absorbing the thermal irradiance and cooling the substrate using heat conduction, the film can be continuously formed even when the substrate transport speed is high. It is possible to improve production efficiency. In addition, since the temperature rise of the substrate can be suppressed, it is possible to perform film formation in a state where the distance between the substrate and the evaporation source is reduced and the amount of ineffective vapor is reduced, and waste of the evaporation material can be reduced. .

FIG. 9 shows a schematic plan view of the manufacturing apparatus.
In the figure, “P” indicates a vacuum pump, and “N ₂ ” indicates a nitrogen supply line.

  As shown in FIG. 9, this manufacturing apparatus is configured to perform in-line formation of organic EL elements in an FPD, and includes a plurality of processing chambers capable of independently controlling the atmosphere and the degree of vacuum, and a plurality of processing chambers. And a transfer device for continuously transferring the substrate to the process chamber, and each process chamber can be configured to execute a predetermined process for each purpose under different conditions.

  In this manufacturing apparatus, the time required for opening and closing the gate door 21 and the time for adjusting the degree of vacuum are reduced by reducing the number of installation locations of the gate door 21 as much as possible. As a result, without stopping the substrate, The substrate can be continuously transferred to each processing chamber. Specifically, the gate valve 21 is provided only in the connection portion with the processing chamber that greatly changes the atmosphere (degree of vacuum), and in other portions, the differential exhaust portions D1 to D1 that perform differential exhaust for setting an intermediate pressure. By providing D4, the pressure difference between the processing chambers is maintained.

The gate valve 21 is provided before and after the processing chamber in which the atmosphere (degree of vacuum) changes greatly. In the differential exhaust parts D1 to D4, the substrate is continuously conveyed, whereas the gate valve 21 is provided. Before and after the processing chamber, the transfer of the substrate is stopped until the atmosphere is changed to a predetermined atmosphere (degree of vacuum). Thus, in this manufacturing apparatus, by using the cassette 6 that can accommodate a plurality of holders for holding the substrate, the atmosphere around the plurality of holders 1 and the substrate can be switched together with the cassette 6. The atmosphere around the cassette 6 is changed to air / vacuum, vacuum / N ₂ , N ₂ / air, etc. in a predetermined processing chamber. Further, by using the cassette 6, it is possible to continuously transport the substrate after switching the atmosphere, and to improve the production efficiency. In particular, by using the cassette 6 in the processing chambers before and after the sealing chamber 33 inside the apparatus, the atmosphere is changed at once, the holder 1 and the substrate are moved at once, and the adjustment time for changing the atmosphere is shortened. The extra waiting time is reduced to prevent a decrease in processing capability of the film forming process and the sealing process.

The differential exhaust parts D1 to D4 are formed by a partition wall having an opening through which the holder can pass. In order to maintain a pressure difference between the processing chambers adjacent to the differential exhaust units D1, D2, and D4 and having different vacuum degrees, the vacuum levels in the differential exhaust units D1, D2, and D4 are set to the respective process chambers. The degree of vacuum is controlled to an intermediate degree of vacuum. The degree of vacuum of the differential exhaust parts D1, D2, and D4 is controlled to an appropriate degree of vacuum by using a vacuum pump that exhausts the differential exhaust parts D1, D2, and D4 and N ₂ for balance (not shown). The differential exhaust unit D3 is provided for a different purpose from the differential exhaust units D1, D2, and D4. Specifically, the atmosphere between the processing chambers does not affect each other. Therefore, the pressure is controlled to a higher vacuum level than the vacuum level of each adjacent processing chamber.

  In this manufacturing apparatus, by providing the differential exhaust parts D1 and D2 between the plasma cleaning chamber 24 and the organic EL film forming chamber 25 and between the plasma cleaning chamber 24 and the holder transfer chamber 27, the degree of vacuum between the processing chambers can be increased. The pressure difference is maintained. For example, when the pressure of the plasma cleaning chamber 24 is Pl, the pressure of the organic EL film forming chamber 25 is P3, and Pl> P3, by providing a differential exhaust part D1 with a pressure P2 that satisfies Pl> P2> P3, It is easy to maintain the pressures of Pl and P3, and a gate valve between the processing chambers is not necessary. Similarly, since the pressure in the holder transfer chamber 27 is the same pressure P3 as the pressure in the organic EL film forming chamber 25, Pl and P3 are provided by providing a differential exhaust part D2 having a pressure P4 that satisfies Pl> P4> P3. Therefore, the gate valve between the processing chambers is unnecessary.

  Further, by providing a differential exhaust part D3 having a degree of vacuum higher than the vacuum degree of both processing chambers between the organic EL film forming chamber 25 and the electrode film forming chamber 28, the ineffective vapors of both processing chambers are prevented from entering each other. I have to. For example, when the pressure in the electrode film forming chamber 28 is P7, the differential exhaust part D3 having a pressure P5 satisfying P7> P3> P5 is provided, so that the atmosphere between the processing chambers is not affected. The gate valve is unnecessary. Further, when the pressure difference between P7 and P5 is large, the differential evacuation part D4 having the pressure P6 satisfying P7> P6> P5, that is, the vacuum degree of the adjacent electrode film forming chamber 28 and the differential evacuation part D3. If the differential exhaust part D4 having the intermediate pressure P6 is connected in series to the differential exhaust part D3, it becomes easy to maintain the pressure difference in the degree of vacuum between the two processing chambers.

  As described above, by providing the differential exhaust portions D1 to D4, it is not necessary to install the gate door 21, and continuous conveyance is possible without stopping the substrate, thereby improving the production efficiency.

The movements S1 to S3 of the substrate, the movements K1 to K3 of the cassette 6, and the movements H1 and H2 of the holder 1 in this manufacturing apparatus will be described.
Note that a holder in which a mask on which an organic EL element pattern is formed is mounted in advance is a holder A (first holding means), and a holder in which a mask on which an electrode pattern is formed is mounted in advance is a holder B (second holding means). The following explanation will be given.

  The substrate itself moves in the order of S1, S2, and S3, and in the course of the movement, a thin film of an organic EL element is formed in the organic EL film forming chamber 25, an electrode is formed in the electrode film forming chamber 28, and sealed. Sealing is performed in the stop treatment chamber 33, and the FPD by the organic EL element is manufactured.

  A substrate is set in the holder A. Then, a plurality of holders A having substrates are accommodated in the cassette 6 and installed in the carry-in part E1. When the manufacturing apparatus is started, the gate valve 21a is opened, the cassette 6 is moved to the atmosphere / vacuum switching chamber 22a, the gate valve 21a is closed, and then a predetermined vacuum is generated from the atmosphere by a vacuum pump in the atmosphere / vacuum switching chamber 22a. Exhaust to a degree. When the predetermined degree of vacuum is reached, the gate valve 21 b is opened and the cassette 6 is moved to the cassette standby chamber 23. From the cassette standby chamber 23 to the mask holder replacement chamber 26, the holder A is continuously transferred together with the substrate. After all the holders A have been unloaded from the cassette 6, the used holder A, that is, the empty holder A having no substrate, is returned to the empty cassette 6, and the cassette 6 together with the empty holder A is in the atmosphere / vacuum switching chamber. Moved to 22b. Then, after closing the gate valve 21c, the atmosphere / vacuum switching chamber 22b is returned to atmospheric pressure, and after opening the gate valve 21d, the cassette 6 is unloaded to the unloading section E2.

  As shown in the cassette movement range K1 in FIG. 9, since the cassette 6 used for carrying in the substrate and the holder A moves so as to circulate only within a predetermined area, if at least two or more cassettes 6 are used. In the air / vacuum switching chambers 22a and 22b, the air / vacuum switching is independently performed, so that the time required for air / vacuum switching can be reduced and the production efficiency can be increased. Further, if the atmosphere of the next cassette 6 is switched to vacuum in the atmosphere / vacuum switching chamber 22a while the plurality of holders A are continuously conveyed from the cassette standby chamber 23, the atmosphere / vacuum switching chamber 22a. The cassette 6 can be moved sequentially from the cassette standby chamber 23 to the cassette standby chamber 23, and a plurality of holders A accommodated in different cassettes 6 can be continuously conveyed into the processing chamber inside the manufacturing apparatus.

From the cassette 6 moved to the cassette standby chamber 23, the holder A is sequentially conveyed to the processing chamber inside the manufacturing apparatus. First, the substrate is moved to the plasma cleaning chamber 24 (cleaning means), and the film forming surface of the substrate together with the mask mounted on the holder A is cleaned using O ₂ plasma or the like. The cleaned holder A is sequentially transferred to the organic EL film forming chamber 25 through the differential exhaust part D1, and a plurality of layers of organic thin films are formed. The organic EL film forming chamber 25 has a transfer device as shown in FIG. 4, a cryopanel as shown in FIG. 5, a cooling plate as shown in FIG. In addition, it is possible to perform film formation while suppressing the temperature rise of the substrate within a predetermined range. In the organic EL film forming chamber 25, the transfer speed of the transfer device is set to a predetermined constant speed, and the film formation speed of each organic thin film is appropriately set so that an organic thin film having a predetermined thickness is formed. ing. The organic EL film forming chamber 25 is provided with a plurality of evaporation sources and the like depending on the number of thin films to be formed and the purpose thereof.

  After the organic thin film is formed in the organic EL film formation chamber 25, the holder A having the substrate is sequentially transferred to the mask holder replacement chamber 26 (exchange means), where only the substrate is removed from the holder A, It is replaced with the holder B. That is, the holder for holding the substrate is changed from the holder A for the organic EL element to the holder B for the electrode.

  The removed holder A passes through the holder transfer chamber 27, passes through the differential exhaust portion D2, is cleaned in the plasma cleaning chamber 24, and then is sequentially returned to the cassette 6 in the cassette standby chamber 23. When the maximum number of holders A mounted in the cassette 6 are returned, the cassette 6 is moved to the atmosphere / vacuum switching chamber 22b, switched to the atmosphere, and then carried out to the carry-out part E2. In this way, as shown by the movement path H1 of the holder in FIG. 9, the holder A is loaded together with the cassette 6 from the loading portion E1, passes through a plurality of processing chambers, and is then cleaned in the plasma cleaning chamber 24. At the same time, it is returned to the carry-out part E2. Since the holder A is cleaned in the plasma cleaning chamber 24, it can be reused. For example, if the cassette standby chamber 23 or the like is configured so that only the substrate can be placed in the holder A, only the substrate is used in the manufacturing apparatus. You only need to set it in the loading section E1.

On the other hand, a plurality of electrode holders B are accommodated in the cassette 6 and installed in the carry-in section E3 without a substrate being installed. When this manufacturing apparatus is started, the gate valve 21g is opened, the cassette 6 is moved to the atmosphere / vacuum / N ₂ switching chamber 35a, and the gate valve 21g is closed. Thereafter, the air is evacuated from the atmosphere to a predetermined degree of vacuum by a vacuum pump in the atmosphere / vacuum / N ₂ switching chamber 35a. When the degree of vacuum is reached, N ₂ is supplied to switch to the N ₂ atmosphere. Then, the gate valve 21 h is opened, and the cassette 6 is moved to the cassette standby chamber 34. After carrying out all the holders B from the cassette 6, the used holder B is returned to the empty cassette 6. At this time, the holder B is provided with a substrate on which an organic EL element is formed and a sealing process is performed. Thereafter, the cassette 6 together with the substrate and the holder B is moved to the atmosphere / vacuum / N ₂ switching chamber 35b, and after closing the gate valve 21i, the atmosphere / vacuum / N ₂ switching chamber 35b is returned to atmospheric pressure. After the atmosphere / vacuum / N ₂ switching chamber 35b returns to atmospheric pressure, the gate valve 21j is opened, and the cassette 6 is unloaded together with the substrate and holder B to the unloading section E4.

As shown in the cassette movement range K3 in FIG. 9, the cassette 6 used for carrying in the holder B also moves so as to circulate only within a predetermined area. Therefore, if at least two or more cassettes 6 are used, the atmosphere / vacuum / N ₂ switching chambers 35a and 35b can be switched to the atmosphere / vacuum / N ₂ by independently switching the atmosphere / vacuum. It is possible to increase the production efficiency by reducing the time involved. If the atmosphere of the next cassette 6 is switched to N ₂ in the atmosphere / vacuum / N ₂ switching chamber 35a while the plurality of holders B are continuously conveyed from the cassette standby chamber 34, the atmosphere / vacuum / The cassette 6 can be sequentially moved from the vacuum / N ₂ switching chamber 35a to the cassette standby chamber 34, and a plurality of holders B accommodated in different cassettes 6 can be continuously transferred into the processing chamber inside the manufacturing apparatus. It becomes possible.

As shown by the movement path H2 of the holder in FIG. 9, the holder B is carried together with the cassette 6 from the carry-in section E3 and is sequentially transferred from the cassette 6 moved to the cassette standby chamber 34 into the processing chamber. 6 is returned to the unloading section E4. Inside the manufacturing apparatus, the holder B is moved from the cassette 6 moved to the cassette standby chamber 34 to the cassette 6 in the cassette standby chamber 32 through the sealing processing chamber 33. Then, opening the gate valve 21f, the holder B to move to the vacuum / N ₂ switching compartment 31 with cassette 6, after closing the gate valve 21f, switching from N ₂ atmosphere to a predetermined degree of vacuum by using a vacuum pump. After reaching a predetermined degree of vacuum, the gate valve 21 e is opened, and the holder B is moved to the cassette standby chamber 30 together with the cassette 6. Then, the holder B is sequentially transported from the cassette 6 moved to the cassette standby chamber 30 and cleaned with the mask in the holder cleaning chamber 29 (cleaning means), passes through the differential exhaust parts D4 and D3, and replaces the holder. It is conveyed to the chamber 26.

In the holder exchange chamber 26, the substrate changed to the holder B passes through the differential exhaust parts D 3 and D 4 together with the holder B, and is sequentially transferred to the electrode film forming chamber 28. In the electrode film forming chamber 28, a metal thin film that forms the wiring of the organic EL element is formed. The substrate on which the metal thin film is formed is sequentially returned to the cassette 6 in the cassette standby chamber 30 together with the holder B. When the maximum number of holders B are returned to the cassette 6, the gate valve 21e is opened, the holder B is moved together with the cassette 6 to the vacuum / N ₂ switching chamber 31, the gate valve 21e is closed, and N ₂ is supplied. Switch from vacuum to N ₂ atmosphere. Then, the gate valve 21f is opened, the holder B is moved together with the cassette 6 to the cassette standby chamber 32, and the gate valve 21f is closed. Thereafter, the holder B is sequentially transferred from the cassette 6 moved to the cassette standby chamber 32 to the sealing processing chamber 33, and the organic EL element is sealed using a sealing material. After sealing, the holder B is sequentially transferred to the cassette 6 in the cassette standby chamber 34. When the maximum number of holders B returns to the cassette 6, the gate valve 21i is opened, and the holder B is moved to the atmosphere / vacuum / N ₂ together with the cassette 6. It moves to the switching chamber 35b. After the gate valve 21i is closed, the atmosphere / vacuum / N ₂ switching chamber 35b is returned to atmospheric pressure, and then the gate valve 21j is opened to carry the holder B together with the cassette 6 to the carry-out section E4. At this time, together with the holder B, the substrate on which the organic EL element is formed and the sealing process is performed, that is, the FPD of the organic EL element is completed, is carried out.

It is a figure which shows an example of embodiment of the holder used with the in-line type organic EL manufacturing apparatus which concerns on this invention. It is a figure which shows another example of embodiment of the holder used with the in-line type organic EL manufacturing apparatus which concerns on this invention. It is a figure which shows the cassette which accommodates the holder shown in FIG. It is a figure which shows an example of embodiment of the conveying apparatus used with the in-line type organic EL manufacturing apparatus which concerns on this invention. It is a figure which shows an example of embodiment of the radiant heat absorption means used with the in-line type organic EL manufacturing apparatus which concerns on this invention. It is a graph which compares the effect of the radiant heat absorption means shown in FIG. It is a figure which shows an example of embodiment of the cooling member used with the in-line type organic EL manufacturing apparatus which concerns on this invention, and a heat conductive member. It is a graph which compares the effect of the heat conductive member shown in FIG. It is a top view which shows an example of embodiment of the in-line type organic EL manufacturing apparatus which concerns on this invention. It is the schematic of the conventional cluster type organic electroluminescent manufacturing apparatus.

Explanation of symbols

1, 1A, 1B Holder 6 Cassette 8a, 8b Positioning member 10a, 10b Cryopanel 11 Flexible structure 12 Cooling plate D1, D2, D3, D4 Differential exhaust part

Claims (15)

A plurality of processing chambers capable of independently controlling the atmosphere and the degree of vacuum;
Transport means for continuously transporting the substrate to the plurality of processing chambers,
An in-line type organic electroluminescence manufacturing apparatus for forming an organic electroluminescence element on the substrate through a predetermined process in the plurality of processing chambers,
A mask having a thin film pattern formed on the substrate; and holding means for holding the substrate while preventing deflection.
The in-line type organic electroluminescence manufacturing apparatus, wherein the transport unit transports the substrate continuously to the plurality of processing chambers using the holding unit. A plurality of processing chambers capable of independently controlling the atmosphere and the degree of vacuum;
Transport means for continuously transporting the substrate to the plurality of processing chambers,
An in-line type organic electroluminescence manufacturing apparatus for forming an organic electroluminescence element on the substrate through a predetermined process in the plurality of processing chambers,
A first holding means comprising a mask on which a pattern of an organic thin film formed on the substrate is formed, preventing the deflection and holding the substrate;
A second holding means comprising a mask on which a pattern of an electrode thin film formed on the substrate is formed, preventing the deflection and holding the substrate;
An exchange means for changing the substrate from the first holding means to the second holding means inside the apparatus,
The in-line type organic electroluminescence manufacturing apparatus, wherein the transport unit transports the substrate continuously to the plurality of processing chambers using the first holding unit or the second holding unit. A plurality of processing chambers capable of independently controlling the atmosphere and the degree of vacuum;
Transport means for continuously transporting the substrate to the plurality of processing chambers,
An in-line type organic electroluminescence manufacturing apparatus that forms an organic electroluminescence element on the substrate through predetermined processing in the plurality of processing chambers,
Provided between the processing chambers having different vacuum degrees, and having a differential exhaust unit that can independently control the intermediate vacuum degree in each processing chamber,
The in-line type organic electroluminescence manufacturing apparatus, wherein the transport means transports the substrate continuously between the processing chambers having different degrees of vacuum through the differential exhaust section. A plurality of processing chambers capable of independently controlling the atmosphere and the degree of vacuum;
Transport means for continuously transporting the substrate to the plurality of processing chambers,
An in-line type organic electroluminescence manufacturing apparatus for forming an organic electroluminescence element on the substrate through a predetermined process in the plurality of processing chambers,
A cooling member for suppressing temperature rise of the substrate;
The in-line type organic electroluminescence manufacturing apparatus, wherein the transport means transports the substrate continuously with the cooling member to the plurality of processing chambers. In the in-line type organic electroluminescence manufacturing apparatus according to claim 1 or 2,
Provided between the processing chambers having different vacuum degrees, and having a differential exhaust unit that can independently control the intermediate vacuum degree in each processing chamber,
The transfer means continuously moves the substrate between the processing chambers having different degrees of vacuum using the holding means, the first holding means, or the second holding means via the differential exhaust section. An in-line type organic electroluminescence manufacturing apparatus characterized by transporting. In the in-line type organic electroluminescence manufacturing apparatus according to claim 1 or 2,
A cooling member that suppresses the temperature rise of the substrate is provided in the holding means, the first holding means, or the second holding means,
The in-line type organic electroluminescence characterized in that the transport means continuously transports the substrate to the plurality of processing chambers using the holding means, the first holding means, or the second holding means. manufacturing device. In the in-line type organic electroluminescence manufacturing apparatus according to claim 5,
A cooling member that suppresses the temperature rise of the substrate is provided in the holding means, the first holding means, or the second holding means,
The transfer means continuously moves the substrate between the processing chambers having different degrees of vacuum using the holding means, the first holding means, or the second holding means via the differential exhaust section. An in-line type organic electroluminescence manufacturing apparatus characterized by transporting. In the in-line type organic electroluminescence manufacturing apparatus according to claim 1, claim 2, claim 5, claim 6, or claim 7,
A cleaning means for cleaning the holding means, the first holding means or the second holding means;
The in-line type organic electroluminescence manufacturing apparatus, wherein the holding means, the first holding means, or the second holding means can be reused. In the in-line type organic electroluminescence manufacturing apparatus according to any one of claims 1, 2, 5, 6, 7, or 8,
The in-line type organic electroluminescence manufacturing apparatus, wherein the transport unit includes a positioning member that positions the holding unit, the first holding unit, or the second holding unit. In the in-line type organic electroluminescence manufacturing apparatus according to claim 1, claim 2, claim 5, claim 6, claim 7, claim 8 or claim 9,
A cassette capable of accommodating a plurality of the holding means, the first holding means or the second holding means;
Using the cassette, a large change in the degree of vacuum in a predetermined processing chamber,
The in-line type organic electroluminescence manufacturing apparatus according to claim 1, wherein the transport unit continuously transports the holding unit, the first holding unit, or the second holding unit from the cassette after changing the degree of vacuum. In the in-line type organic electroluminescence manufacturing apparatus according to any one of claims 3, 5 and 7,
The differential exhaust unit further includes another differential exhaust unit having a higher degree of vacuum. In the in-line type organic electroluminescence manufacturing apparatus according to any one of claims 4, 6, and 7,
An in-line type organic electroluminescence manufacturing apparatus, wherein a heat conduction member that conducts and diffuses heat from the substrate to the cooling member is provided between the substrate and the cooling member. In the in-line type organic electroluminescence manufacturing apparatus according to any one of claims 4, 6, 7, and 12,
The in-line type organic electroluminescence manufacturing apparatus, wherein the cooling member is reusable. In the in-line type organic electroluminescence manufacturing apparatus according to any one of claims 1 to 13,
An in-line type organic electroluminescence manufacturing apparatus, comprising: the substrate and the cooling member; or radiant heat absorption means for absorbing radiant heat from the substrate or the cooling member. In the in-line type organic electroluminescence manufacturing apparatus according to any one of claims 1 to 14,
The transport means has a constant transport speed,
An in-line type organic electroluminescence manufacturing apparatus, wherein the film forming speeds of thin films in a plurality of processing chambers are respectively controlled.

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