JP2007149482A - Manufacturing method of organic el element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an organic EL element by a roll-to-roll method capable of carrying out stable sealing operation without reducing quality of the organic EL element. <P>SOLUTION: The manufacturing method of the organic EL element is consisting of a washing process 110, a forming process 120 of an organic EL structure, and a covering treatment process 130. A flexible substrate rolled up into a roll form is reeled off, and washing of the substrate in the washing process 110, formation of the organic EL structure composed of a first electrode, an organic layer, and a second electrode in the process 120 of forming the organic EL structure, and the covering treatment for protective films in the covering treatment process 130 are carried out in an in-line system, and the substrate is rolled up into the roll form. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an organic EL element, and particularly relates to a method for manufacturing an organic EL element using a flexible long base material.

  In recent years, organic electroluminescence elements (hereinafter also referred to as organic EL elements) have attracted attention as self-luminous elements. An organic EL element is an element that emits light by disposing an organic EL structure having a light emitting layer of an organic compound sandwiched between electrodes on a substrate such as glass and supplying a current between the electrodes. Recently, organic EL elements using a flexible base material such as a resin film have also appeared due to the expansion of applications of the organic EL element, and roll-to-roll by using such a flexible base material. Manufacture of organic EL elements has also been performed (see, for example, Patent Document 1). Here, the roll-to-roll organic EL element manufacturing method refers to forming a substrate wound in a roll shape to form an organic EL structure on the substrate, and then rolling the substrate on which the structure is formed again. A manufacturing method in which an organic EL element is produced by winding the film on a sheet. The roll-to-roll manufacturing has the advantage that production efficiency can be improved because continuous production is possible.

  By the way, in the manufacture of organic EL elements, in order to avoid the influence of moisture and oxygen on the organic EL structure and to maintain high quality and high reliability, the influence of the outside air called sealing is completely shut out. An operation for forming a protective film is performed. As a sealing technique of the organic EL element, for example, a method of coating a thin film such as nitride or nitride oxide on the organic EL structure by an electron beam method, a sputtering method, a plasma CVD method, an ion plating method, or the like. Specifically, a sealing technique using a facing target type sputtering apparatus (for example, refer to Patent Document 2) or a technique for performing sealing by bonding a sheet-shaped sealing member to an organic EL structure (for example, a patent). Reference 3).

  The formation of the organic EL structure by vapor deposition or the like is performed in an environment close to a vacuum. Therefore, in the roll-to-roll method, the substrate is unwound from the roll in an environment close to a vacuum to form the organic EL structure. After carrying out, it is wound again on a roll, and the wound roll is housed in a container filled with an inert gas to prevent deterioration of the organic EL structure due to moisture and oxygen, and is put into a sealing process in another line. A method has been adopted.

However, putting the wound roll into a sealing process on another line makes the process complicated, and the container filled with an inert gas for transporting the roll maintains the environment in which the organic EL structure is formed. In some cases, the organic EL structure of the contained base material is affected by moisture and oxygen remaining in the container, which may affect the quality degradation and life of the product.
International Publication No. 01/005194 Pamphlet JP 2002-332567 A JP 2005-4063 A

  An object of this invention is to provide the manufacturing method of the organic EL element by the roll-to-roll system which can perform stable sealing operation, without reducing the quality of an organic EL element.

  The above-mentioned subject is achieved by the following means.

1. Having a step of forming at least an organic EL structure on a flexible long substrate by a roll-to-roll method,
The manufacturing method of the organic EL element characterized by having the process of adjusting the pressure added to this elongate base material before and after the process of forming this organic EL structure.

2. 2. The method for producing an organic EL element according to 1, wherein a pressure applied to the long base material is 1 × 10 ⁻⁴ Pa or less in the step of forming the organic EL structure.

3. Before the step of forming the organic EL structure, the step of performing a plasma treatment on the long substrate,
3. The method for producing an organic EL element according to 1 or 2, wherein in the step of performing the plasma treatment, a pressure applied to the long base material is 1 × 10 ⁻³ Pa or more and atmospheric pressure or less.

  4). 3. The method for producing an organic EL element according to 3, wherein a step of adjusting a pressure applied to the long base material is provided before the step of subjecting the long base material to plasma treatment.

5. After the step of forming the organic EL structure, the organic EL structure is subjected to a coating process,
5. The manufacturing of the organic EL element according to any one of 1 to 4, wherein in the step of applying the coating treatment, a pressure applied to the long base material is 1 × 10 ⁻³ Pa or more and atmospheric pressure or less. Method.

  6). 6. The method for producing an organic EL element according to 5, wherein a step of adjusting a pressure applied to the long base material is provided after the step of coating the organic EL structure.

  According to the first and second aspects of the invention, it is possible to provide a method for manufacturing an organic EL element by a roll-to-roll method capable of performing in-line the steps before and after the step of forming the organic EL structure.

  According to the first to fourth aspects of the present invention, it is possible to provide a method for manufacturing an organic EL element by a roll-to-roll method capable of performing plasma processing in-line before forming the organic EL element.

  According to the first, second, fifth, and sixth aspects of the invention, a roll-to-roll organic EL element manufacturing method capable of performing coating treatment in-line after the step of forming the organic EL structure can be provided.

  That is, according to the present invention, in the manufacture of an organic EL element in which an organic EL element is formed on a flexible substrate by a roll-to-roll method, the substrate is washed and decontaminated, the organic EL element is formed, the organic EL element It is possible to provide a method for manufacturing an organic EL element in which the formation of the barrier film is performed in-line.

  Hereinafter, the best mode for carrying out the present invention will be described in detail.

  The roll-to-roll system in the present invention is a flexible long base material wound in a roll shape, for example, a film, and an organic EL structure on the base material while being intermittently or continuously conveyed. This is a method of forming a body and winding it again on a roll.

  Before and after the step of forming the organic EL structure, a circuit pattern for driving the element or a protective film covering the organic EL structure may be attached and wound on a roll.

  Comparing the single-wafer method and the roll-to-roll method, in which the individually separated base material is transported for each process, the single-wafer method requires that a base material carry-in part and a carry-out part be provided in each process. However, with the roll-to-roll method, the base material flows intermittently or continuously between the processes, so the processes can be connected to each other, reducing the work involved in transporting the base material and downsizing the equipment. It becomes possible.

  In the roll-to-roll system in the present invention, in-line means that the base material wound in a roll shape is in the process from being fed out to the process of forming the organic EL structure until being wound up by the roll again. “Off-line” means that the substrate on which the organic EL structure is formed is once wound up in a roll shape and then put into another process.

  Further, the vacuum condition in the present invention means an environment under a pressure environment of 100 Pa or less, which is an environment in which moisture and oxygen remain little and deterioration of the organic EL structure is reduced. The atmospheric pressure environment means a pressure environment of 10,000 Pa to 200,000 Pa, and is an environment where much moisture and oxygen remain as compared with a vacuum environment.

(Embodiment of the Invention)
An embodiment of the present invention will be described below with reference to the drawings.

  First, the organic EL element will be described below. FIG. 1 is a schematic diagram of an organic EL element 10. In FIG. 1, an organic EL element 10 is an element in which an organic EL structure composed of a first electrode 12, an organic layer 13, and a second electrode 14 is laminated on a substrate 11.

  The first electrode 12 is an anode, and when transparent, indium tin oxide (ITO), indium zinc oxide (IZO), gold, tin oxide, zinc oxide and the like have a work function of 4 eV or more and a transmittance of 40%. This is an electrode made of the above conductive material.

  The organic layer 13 is a single layer or a plurality of layers made of an organic material such as an organic compound or a complex of several nm to several μm including the light emitting layer. For example, the light emitting device includes a hole transporting layer in contact with the anode and a light emitting material. 3 layers of an electron transport layer in contact with the cathode, a lithium fluoride layer, an inorganic metal salt layer, or a layer containing them may be disposed at an arbitrary position.

  The second electrode 14 is a cathode and is an electrode made of a metal material having a work function of less than 4 eV and a reflectivity of 60% or more, such as aluminum, sodium, lithium, magnesium, silver, calcium, etc. is there.

  The substrate 11 is made of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polyetherimide, polyetheretherketone, polyphenylene sulfide, polyarylate, polyimide, polycarbonate (PC), cellulose triacetate ( TAC), cellulose acetate propionate (CAP) and the like.

  The organic EL element in the present invention is produced by the combination of electrons and holes in the organic layer 13 due to the current supplied from the outside through the first electrode (anode) 12 and the second electrode (cathode) 14. The light emitted from the organic layer 13 is extracted through the first electrode (anode) 12. Examples of light emission using excitation energy include fluorescence that uses singlet excitation energy for light emission, and phosphorescence that uses triplet excitation energy for light emission. In particular, phosphorescence is desirable light emission as a light source because triplet excitons contribute to light emission, and thus higher light emission efficiency can be obtained than fluorescence.

  Light emitted from the light emitting layer of the organic EL element 10 is extracted through the first electrode 12 and the base material 11. The second electrode (cathode) is formed by laminating a thin film cathode material and a highly transparent anode material. It is also possible to adopt a so-called top emission configuration in which the light is extracted from the cathode.

  The present invention provides a manufacturing method in which the formation of an organic EL structure on a long base material and the coating treatment with a gas barrier protective film on the formed organic EL structure are performed in a roll-to-roll system in-line. Is.

  Next, a manufacturing process for forming the organic EL element according to the present invention will be described.

  FIG. 2 is a block diagram of the manufacturing process of the organic EL element. The method for manufacturing an organic EL device according to the present invention includes a cleaning step 110, an organic EL structure forming step 120, and a coating processing step 130. 110, cleaning the substrate, forming an organic EL structure composed of the first electrode 12, the organic layer 13, and the second electrode 14 in the organic EL structure forming step 120, and covering the protective film in the covering step 130 This is a method for producing a roll-to-roll organic EL element that is carried out in-line and winds a substrate into a roll. The base material on which the organic EL structure wound up in a roll is formed is cut into a predetermined size in an off-line cutting step 140 to form a single organic EL element.

  As for the base material, the 1st electrode (anode) is patterned beforehand. Patterning for electrode formation may be performed in-line, but there is a concern of short-circuiting between electrodes of the organic EL element due to scattering of metal powder at the time of electrode formation. In this case, formation of organic EL structure of metal powder Measures to shut off the process are necessary.

  The pattern of the first electrode (anode) is an active type in which electrodes are patterned on the surface for lighting applications, or an active type in which TFTs are arranged in a matrix in advance for display applications, or the wiring is in a matrix form It may be a passive type patterned on the surface.

  The cleaning step 110 is a step of cleaning the base material by a combination of wet cleaning, such as feeding out the base material wound in a roll shape and immersing it in an ultrasonic cleaning tank, and dry cleaning such as plasma cleaning. It is.

  The organic EL structure forming step 120 is a step in which the organic EL structure is formed on the substrate by a known technique such as a vapor deposition method, an inkjet method, a printing method, or a coating method.

  The coating process step 130 is a step of coating the organic EL structure with a protective film by a thin film manufacturing method such as an electron beam method, a sputtering method, a plasma CVD method, or an ion plating method after the organic EL structure is formed.

  The base material on which the surface of the organic EL structure is coated with the protective film is wound around the roll again.

  Thus, after covering the surface of the organic EL structure with a protective film by roll-to-roll, the substrate wound on the roll is cut into a predetermined size by an off-line cutting step 140, and the organic EL element is It is formed.

  Next, the detail of the specific manufacturing process of the organic EL element of this invention is demonstrated below.

  FIG. 3 is a schematic view of a manufacturing process of the organic EL element of the present invention. The base material 11 wound in a roll shape is fed to the cleaning process 110, immersed in the ultrasonic cleaning tank 111 and subjected to ultrasonic cleaning, and then rinsed with pure water in the rinsing tank 112 and the shower head 113. And is dried in the drying zone 114.

After that, the buffer zone 115 absorbs the difference in transport speed from the subsequent process and is transferred to the plasma tank 116 via the first buffer chamber 116a. In the plasma tank 116, the substrate 11 is subjected to plasma treatment with oxygen plasma, that is, plasma cleaning, in an environment where the pressure is 1 × 10 ⁻³ Pa or more and atmospheric pressure or less. The pressure of the plasma tank 116 in the embodiment is 100 Pa.

  The first buffer chamber 116a is composed of three pressure regulation chambers 116a1, 116a2, 116a3 separated by a partition wall. Film partitions are provided at the entrance of each pressure regulation chamber, between the pressure regulation chambers, and at the exit to the plasma tank 116. A seal roll 117 that allows the base material 11 to pass therethrough is provided. The seal roll 117 has a gap that allows the surface of the base material, particularly the surface on the organic EL structure forming side, to pass through without contact, and the base material 11 passes through the gap of the seal roll 117 and passes through the plasma tank 116. It is transferred to. The pressure adjustment chambers 116a1, 116a2, and 116a3 are exhausted by vacuum pumps (not shown) provided therein, and the pressure in each pressure adjustment chamber is sequentially increased from the atmospheric pressure on the inlet side of the pressure adjustment chamber 116a1 to the pressure adjustment chamber 116a3. The pressure is adjusted to reach the pressure of the plasma vessel 116 on the outlet side.

  By providing a step of adjusting the pressure applied to the base material 11 by the first buffer chamber 116a before the step of performing the plasma cleaning process in the plasma tank 116, the base material 11 is removed from the buffer zone 115 in the atmospheric pressure environment to the vacuum environment. The plasma chamber 116 can be continuously transferred to the plasma chamber 116 and can maintain a predetermined vacuum environment. Although the number of pressure adjusting chambers of the first buffer chamber 116a shown in the embodiment is three, it is not limited to three, and is appropriately determined depending on the vacuum conditions of the plasma tank 116 and the capacity conditions of the vacuum pump. Good.

After cleaning with oxygen plasma in the plasma tank 116, the substrate 11 is transferred to the organic EL structure forming step 120 via the second buffer chamber 121a. The vapor deposition tank 121 in which the organic EL structure is formed in the organic EL structure forming step 120 has a pressure of 1 × 10 ⁻⁴ Pa or less and a vacuum environment with a higher degree of vacuum than the plasma tank 116.

  The second buffer chamber 121a includes two pressure regulation chambers 121a1 and 121a2 separated by a partition wall, and a film-like substrate is provided at the entrance of each pressure regulation chamber, between the pressure regulation chambers, and at the exit to the vapor deposition tank 121. 11 is provided with a seal roll 117 that allows 11 to pass therethrough. The seal roll 117 has a gap that allows the surface of the base material, particularly the surface on the organic EL structure forming side, to pass through without contact, and the base material 11 passes through the gap of the seal roll 117 and passes through the plasma tank 116. To the vapor deposition tank 121.

  The pressure adjustment chambers 121a1 and 121a2 are evacuated by vacuum pumps (not shown) provided therein, and the pressure in each pressure adjustment chamber is sequentially increased from the pressure of the plasma tank 116 on the inlet side of the pressure adjustment chamber 121a1. It adjusts so that it may reach the pressure of the vapor deposition tank 121 of the exit side.

  By providing a step of adjusting the pressure applied to the base material 11 by the second buffer chamber 121a before the step of forming the organic EL structure in the vapor deposition tank 121, the base material 11 is more advanced than the plasma tank 116 of the previous step. It can be continuously transferred to the vapor deposition tank 121 in a vacuum environment, and the plasma tank 116 and the vapor deposition tank 121 can maintain a predetermined pressure environment. Further, it is possible to prevent the exhaust gas from the plasma tank from being mixed into the vapor deposition tank 121. Note that the number of pressure adjusting chambers in the second buffer chamber 121a described in the embodiment is two, but the number is not limited to two. Depending on the pressure conditions of the plasma tank 116 and the vapor deposition tank 121 and the capacity conditions of the vacuum pump. It may be determined as appropriate.

  In the organic EL structure forming step 120, the marking hole 15 provided at the end of the base 11 corresponding to the patterning position of the first electrode (anode) on the base 11 is at a predetermined position in the vapor deposition tank. When reaching, the conveyance is stopped, or the vapor deposition is performed in the vapor deposition tank 121 by controlling the conveyance speed. The buffer zone 115 absorbs the speed difference between the transport speed of the base material 11 during vapor deposition in the organic EL structure forming process 120 and the transport speed between the cleaning processes 111 to 114.

In the vapor deposition tank 121, an organic material or a metal material is sublimated from the vapor deposition source 122 on the first electrode (anode) patterned on the substrate 11 in a vacuum environment with a pressure of 1 × 10 ⁻⁴ Pa or less. Then, the organic layer and the cathode are laminated in a predetermined pattern by the mask 123 to form an organic EL structure.

For example, when the organic EL structure has a structure of anode / hole transport layer / light emitting layer / cathode, a hole transport layer (α-NPD); 500 mm, light emitting layer (on the substrate on which the anode is formed) Alq ₃ ): After sequentially forming a thickness of 600 mm, a cathode (aluminum) is deposited thereon with a thickness of 2000 mm.

  The base material 11 on which the organic EL structure is formed in the vapor deposition tank 121 is conveyed to the coating processing step 130 via the third buffer chamber 121b.

In the sputtering tank 131 of the coating process 130, the target 132 was sputtered by the sputtering gas plasma generated in the counter target 132 and formed on the substrate 11 under environmental conditions of 10 ⁻³ Pa to atmospheric pressure. The organic EL structure is covered.

  The third buffer chamber 121b is composed of two pressure regulation chambers 121b1 and 121b2 separated by a partition wall, and a film-like base is provided at the entrance of each pressure regulation chamber, between the pressure regulation chambers, and the partition wall at the exit to the sputtering tank 131. A seal roll 117 that allows the material 11 to pass therethrough is provided. The seal roll 117 has a gap that allows the substrate surface, particularly the surface on which the organic EL structure is formed, to pass through without contact, and the base material 11 on which the organic EL structure is formed has a gap between the seal roll 117 and the seal roll 117. And is transferred from the vapor deposition tank 121 to the sputtering tank 131.

  The pressure adjustment chambers 121b1 and 121b2 are exhausted by vacuum pumps (not shown) provided therein, and the pressure in each pressure adjustment chamber is sequentially increased from the pressure of the vapor deposition tank 121 on the inlet side of the pressure adjustment chamber 121b1. The pressure is adjusted so as to reach the pressure in the sputter tank 131 on the outlet side of the gas.

  After the step of forming the organic EL structure in the vapor deposition tank 121, the base material 11 is continuously transferred from the vapor deposition tank 121 to the sputtering tank 131 by providing a step of adjusting the pressure applied to the base material 11 by the third buffer chamber 121b. The vapor deposition tank 121 and the sputtering tank 131 can maintain a predetermined pressure environment. Although the number of pressure adjusting chambers of the third buffer chamber 121b shown in the embodiment is two, it is not limited to two, and depends on the pressure conditions of the vapor deposition tank 121 and the sputtering tank 131 and the capacity conditions of the vacuum pump. It may be determined as appropriate.

  The protective film covering the organic EL structure is a film including at least one kind of metal oxide film, oxynitride film, nitride film, metal thin film, and diamond-like carbon film. Preferred metals are metals such as silicon and aluminum. Examples of preferred protective film materials include silicon oxynitride and silicon nitride. In the present embodiment, the protective film is formed by sputtering using, for example, an RF magnetron sputtering apparatus, but may be formed by using a thin film forming method such as CVD or ion plating.

  In the sputtering tank 131, similarly to the organic EL structure forming step 120, the conveyance is stopped at a predetermined position of the marking hole 15 provided at the end of the substrate 11, and sputtering is performed at the predetermined position. In the sputtering tank 131, the target 132 is sputtered by the sputtering gas plasma generated in the counter target 132, and a protective film is formed so as to cover the organic EL structure formed on the substrate 11 in the vapor deposition tank 121. It is formed.

The target 132 is made of the same material as the constituent material of the protective film formed on the organic EL structure or the same material as the constituent material by reaction with the sputtering gas. For example, a silicon oxynitride film is formed using, for example, argon containing 5% by volume of oxygen as a sputtering gas and Si ₃ N ₄ as a target.

  Thus, the base material 11 on which the organic EL structure and the protective film are formed in-line is transferred from the sputtering tank 131 to the atmospheric pressure environment via the fourth buffer chamber 131b, and is wound up in a roll shape.

  The fourth buffer chamber 131b is composed of three pressure regulation chambers 131b1 and 131b3 separated by a partition wall, and a film-like base is formed at the entrance of each pressure regulation chamber, between the pressure regulation chambers, and at the exit to the atmospheric pressure environment. A seal roll 117 that allows the material 11 to pass therethrough is provided. The seal roll 117 has a gap that allows the substrate surface, particularly the surface on which the organic EL structure is formed, to pass through without contact, and the base material 11 on which the organic EL structure and the protective film are formed includes a seal roll It is transferred to the atmospheric pressure environment through the gap 117.

  The pressure adjustment chambers 131b1, 131b2, 131b3 are evacuated by vacuum pumps (not shown) provided therein, and the pressure in each pressure adjustment chamber is sequentially adjusted from the pressure of the sputter tank 131 on the inlet side of the pressure adjustment chamber 131b1. It is adjusted to reach the atmospheric pressure on the outlet side of the chamber 116c.

  The substrate on which the organic EL structure and the protective film are formed by providing a step of adjusting the pressure applied to the substrate 11 by the fourth buffer chamber 131b after the step of coating the organic EL structure by the sputtering tank 131. The material 11 can be continuously conveyed from the sputtering vessel 131 to the atmospheric pressure environment, and the sputtering vessel 131 can maintain a predetermined pressure condition. Although the number of pressure adjusting chambers of the fourth buffer chamber 131b shown in the embodiment is three, it is not limited to three, and may be appropriately determined depending on the pressure condition of the sputtering tank 131 and the capacity condition of the vacuum pump. .

  The substrate 11 on which the organic EL structure wound in a roll shape and the protective film are formed is put into an off-line cutting step 140 (not shown) and cut into a predetermined size to form an organic EL panel. Is done. Since the organic EL structure is covered with the protective film, the base material 11 put into the cutting step 140 can be installed in an atmospheric pressure environment.

  As described above, a preferred embodiment of the method for manufacturing an organic EL element in which the substrate 11 is washed and decontaminated, the organic EL structure is formed, and the protective film is formed in-line by the roll-to-roll method according to the present invention is shown. It was.

  According to the present invention, in a method of manufacturing an organic EL element in which an organic EL structure is formed on a flexible substrate by a roll-to-roll method, the substrate is washed and decontaminated, the organic EL structure is formed, and the organic EL It is possible to provide a method for manufacturing an organic EL element capable of performing in-line up to formation of a protective film on a structure. In the manufacturing method according to the present invention, the formation of the organic EL structure on the substrate and the formation of the protective film are performed in-line, so that the influence of moisture and oxygen on the organic EL structure can be avoided, and high quality and high reliability are achieved. An organic EL element can be manufactured. In addition, it is possible to carry out processes performed in different conditions of vacuum environment or atmospheric pressure environment in a roll-to-roll method, and the process is simplified compared to a manufacturing method in which each process is performed off-line. The work efficiency can be improved and the process stop time can be shortened.

1 is a schematic diagram showing a configuration of an organic EL element 10. FIG. It is a block diagram of the manufacturing process of the organic EL element of this invention. It is a schematic diagram of the manufacturing process of the organic EL element of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Organic EL element 11 Base material 12 Anode 13 Organic layer 14 Cathode 110 Cleaning process 116 Plasma tank 116a First buffer chamber 120 Organic EL structure forming process 121 Deposition tank 121a Second buffer chamber 121b Third buffer chamber 130 Covering process process 131 Sputtering tank 131b Fourth buffer chamber 140 Cutting process

Claims (6)

Having a step of forming at least an organic EL structure on a flexible long substrate by a roll-to-roll method,
The manufacturing method of the organic EL element characterized by having the process of adjusting the pressure added to this elongate base material before and after the process of forming this organic EL structure. 2. The method of manufacturing an organic EL element according to claim 1, wherein in the step of forming the organic EL structure, a pressure applied to the long base material is 1 × 10 ⁻⁴ Pa or less. Before the step of forming the organic EL structure, the step of performing a plasma treatment on the long substrate,
3. The method of manufacturing an organic EL element according to claim 1, wherein in the step of performing the plasma treatment, a pressure applied to the long base material is 1 × 10 ⁻³ Pa or more and atmospheric pressure or less. The method for producing an organic EL element according to claim 3, further comprising a step of adjusting a pressure applied to the long base material before the step of subjecting the long base material to plasma treatment. After the step of forming the organic EL structure, the organic EL structure is subjected to a coating process,
5. The organic EL element according to claim 1, wherein in the step of performing the coating treatment, a pressure applied to the long base material is 1 × 10 ⁻³ Pa or more and atmospheric pressure or less. Manufacturing method. 6. The method of manufacturing an organic EL element according to claim 5, further comprising a step of adjusting a pressure applied to the long base material after the step of coating the organic EL structure.

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