JP2010170776A - Organic electroluminescent element and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an organic EL element of high durability and enhanced in the adhesion of sealing members, in the method which comprises a process of forming organic EL structures on a long-size base material in a roll-to-roll system, and a process of bonding the long-size sealing members to each other with an adhesive layer to prevent them from being deteriorated due to moisture or oxygen. <P>SOLUTION: The manufacturing method of the organic electroluminescent elements comprising a process of continuously forming on a base material organic electroluminescent structures each provided with an anode and a cathode and an organic light-emitting layer pinched by the both electrodes, bonding the sealing members to each other through an adhesive layer on a face of the base material on which the organic electroluminescent structures are formed, also involves an adhesion strengthening process of giving treatment for reinforcing an adhesive force of the base material with the sealing member at least to a part around each organic electroluminescent structure. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for producing an organic electronics element, which includes a step of forming an organic electronics structure on a substrate and a step of bonding a sealing member to the surface of the formed organic electronics structure via an adhesive layer. About.

  In recent years, development of various organic electronics elements such as organic electroluminescence elements (hereinafter referred to as “organic EL elements”), organic photoelectric conversion elements, organic photoconductors for electrophotography, organic transistors and the like has been studied.

  Organic electronics elements are elements that perform electrical operations using organic substances, and are expected to exhibit features such as energy saving, low cost, and flexibility, and are attracting attention as a technology that can replace conventional inorganic semiconductors based on silicon. ing.

  These organic electronic elements are elements that emit light, generate power, charge, or control current and voltage by passing a current through an extremely thin film of an organic substance through an electrode.

  Among these, an organic EL element, which is one of organic electronic elements, has attracted attention as a self-luminous element.

  An organic EL element includes an organic EL structure having a structure in which a light emitting layer of an organic compound (hereinafter also referred to as an organic light emitting layer or an organic layer) is sandwiched between two electrodes, a cathode and an anode, on a substrate such as glass. The device emits light from the organic light emitting layer by supplying a current between the anode and the anode. Recently, organic EL elements using a flexible base material such as a resin film have also appeared due to expansion of applications of the organic EL element, and roll-to-roll by using such a flexible base material. An organic EL element has also been manufactured by a roll method (see, for example, Patent Document 1).

  Here, the roll-to-roll manufacturing method refers to forming a substrate wound in a roll shape to form an organic EL structure on the substrate, and winding the substrate on which the EL structure has been formed again on a roll. Although the manufacturing method of a form is called, the roll-to-roll system also includes the one-part production process from feeding a base material wound in a roll shape to forming an organic EL element. The roll-to-roll manufacturing has the advantage that production efficiency can be improved because continuous production is possible.

  By the way, the organic light emitting layer is easily influenced by moisture and oxygen, and if left in the air, the quality is deteriorated by moisture and oxygen. Therefore, in the manufacture of organic EL elements, the effect of outside air called sealing is reduced. A step of forming a protective film is added.

  As a sealing technique of the organic EL element, for example, a method of coating a thin film such as nitride or nitride oxide on the organic EL structure by an electron beam method, a sputtering method, a plasma CVD method, an ion plating method, or the like. Specifically, a sealing technique using a facing target type sputtering apparatus (see, for example, Patent Document 2), or a peripheral portion of a container such as a sealing can on an organic EL structure base material with an adhesive. A method of adhering and covering (for example, refer to Patent Document 3), and a technique for performing sealing by bonding a sheet-shaped sealing member to an organic EL structure through an adhesive layer (for example, refer to Patent Document 4). Etc.

  A sealing technique for bonding a sheet-shaped sealing member is performed by continuously bonding and covering a long sealing member on a substrate on which an organic EL structure is formed. Since the sealing member covers the entire organic EL structure, an insulating material is selected for the sealing member so as not to cause a short circuit when the organic EL structure is energized.

  In a roll-to-roll production system, a long sealing member having an adhesive layer on an organic EL structure continuously formed at a predetermined interval on a long base material. An organic EL element can be manufactured by continuously covering and then cutting each organic EL structure.

  As the adhesive layer, one that has been patterned in advance according to the formation pattern of the organic EL structure or one that has an adhesive layer formed on the entire surface can be selected. This improves the workability of the sealing work.

  However, the organic EL element formed in this way has a decrease in sealing ability due to peeling of the adhesive at the periphery of the organic EL element and a deterioration of the element resulting from the deterioration, and in particular, a decrease in adhesive strength at the cut surface. It was a big problem.

  An organic photoelectric conversion element, which is one of organic electronic elements, is an element that generates electricity when irradiated with light, with a structure in which a power generation layer made of a thin film of an organic compound is sandwiched between electrodes. Therefore, if a thin-film organic photoelectric conversion element is used as a solar cell, it is easy to reduce the size and weight, and the output is relatively stable even in low-light and high-temperature environments compared to existing inorganic semiconductor solar cells. The solar cell can be obtained.

  In the organic photoelectric conversion element, similarly to the organic EL element, carrier traps are formed in the power generation layer due to the influence of moisture, oxygen, and the like, and current collection of carriers generated by charge separation is inhibited. As a result, not only the power generation efficiency is lowered, but also the life of the element is affected. Therefore, in the organic photoelectric conversion element, it has been studied to secure performance by using a sealing material having barrier performance against gas components such as moisture and oxygen. It was found that there is a problem common to the case of the element.

International Publication No. 01/005194 Pamphlet JP 2002-332567 A JP 2006-210154 A JP 2005-4063 A

  An object of the present invention is to form an organic electronics structure on a long base material by a roll-to-roll method, and a long sealing member having an adhesive layer in order to prevent deterioration due to moisture and oxygen In the manufacturing method of the organic electronics element which has the process of bonding, it is providing the manufacturing method of the organic electronics element with high adhesive force of a sealing member, and high durability.

  The problem to be solved by the present invention is achieved by the following means.

  1. On the base material, a step of continuously forming an organic electronics structure having an anode and a cathode, and an organic layer sandwiched between the electrodes, and the surface of the base material on which the organic electronics structure is formed, In the manufacturing method of an organic electronics element having a step of bonding a sealing member through an adhesive layer, the adhesive force between the base material and the sealing member is enhanced on a part of the periphery of the organic electronics structure The manufacturing method of the organic electronics element characterized by having the adhesive force reinforcement | strengthening process which performs the process to perform.

  2. 2. The method of manufacturing an organic electronic element according to 1, wherein the adhesion strengthening step is performed at least when the organic layer is formed.

  3. 3. The method of manufacturing an organic electronics element according to 1 or 2, wherein an adhesive layer is formed on the entire surface of the sealing member.

  4). The above-mentioned 1-3, wherein the adhesive of the sealing member is a heat-reactive adhesive, and has an adhesive layer curing step of heating the adhesive layer in the region treated in the adhesive strength strengthening step The manufacturing method of the organic electronics element of any one of Claims.

  5. The above-mentioned 1 to 3, wherein the adhesive of the sealing member is a photoreactive adhesive and has an adhesive layer curing step of irradiating light to the adhesive layer in the region treated in the adhesive strength enhancing step. 4. The method for producing an organic electronic device according to any one of 3 above.

  6). 6. The method of manufacturing an organic electronics element according to any one of 1 to 5, wherein the adhesion strengthening step is a cleaning step of cleaning a part of the periphery of the organic electronics structure on the substrate.

  7). 7. The method of manufacturing an organic electronics element as described in 6 above, wherein the cleaning step is a cleaning step using a solvent.

  8). 7. The method of manufacturing an organic electronics element as described in 6 above, wherein the cleaning step is a cleaning step by plasma surface treatment.

  9. 7. The method of manufacturing an organic electronics element according to 6, wherein the cleaning step is a cleaning step by UV surface treatment.

  10. 6. The organic electronics according to any one of 1 to 5, wherein the adhesion strengthening step is a roughening treatment step of roughening a part of the periphery of the organic electronics structure on the substrate. Device manufacturing method.

  11. A step of continuously forming a plurality of rows of organic electronics structures having an anode and a cathode, and an organic layer sandwiched between the electrodes on the substrate, and the surface of the substrate on which the organic electronics structures are formed In the method for manufacturing an organic electronics element having a step of bonding a sealing member, an adhesion strengthening step for strengthening the adhesive force between the base material and the sealing member around a part of the organic electronics structure A method for producing an organic electronics element, comprising: cutting a part of an adhesive strength-enhanced region formed in an adhesive strength-enhancing step after bonding a sealing member.

  12 12. The method of manufacturing an organic electronic element according to 11, wherein the adhesion strengthening step is performed at least when the organic layer is formed.

  13. 13. The method for producing an organic electronic element according to 11 or 12, wherein an adhesive layer is formed on the entire surface of the sealing member.

  14 14. An organic electronic element formed by the manufacturing method according to any one of 1 to 13 above.

  15. 14. An organic electroluminescence element formed by the manufacturing method according to any one of 1 to 13 above.

  By carrying out the adhesion strengthening step of the present invention, it was possible to improve the adhesion between the substrate and the sealing member at the cutting site, and to provide a method for producing a highly durable organic electronic device.

It is a schematic diagram which shows the structure of an organic EL element. It is a block diagram which shows the manufacturing process of the organic EL element of this invention. It is a schematic diagram of an organic EL structure forming step of forming an organic EL structure on a substrate by a dry method. It is a schematic diagram of the organic EL structure formation process which forms an organic EL structure on a base | substrate by a wet application system. As an example of the adhesion strengthening process of the present invention, a cleaning process for cleaning a part of the periphery of the element with a solvent is shown. It is a perspective view which shows a sealing member adhesion process and an adhesive bond layer hardening process. The cutting process which cuts the adhesive force reinforcement area | region with a cutting blade is shown.

  Hereinafter, the best mode for carrying out the present invention will be described in detail.

  The manufacturing method of the present invention comprises a step of continuously forming an organic electronics structure having an anode and a cathode on the substrate, and an organic layer sandwiched between the electrodes, and the organic electronics structure of the substrate. In the manufacturing method of the organic electronics element which has the process of bonding a sealing member to the surface in which the body was formed, and the process of cutting a base material for every organic electronics structure, the base material and the sealing in a manufacturing process It is characterized by having an adhesive strength enhancing step for improving the adhesive strength of the stop member, and further preferably cutting at an adhesive strength enhancing portion formed in the adhesive strength enhancing step.

  The method for producing an organic electronic device of the present invention can be suitably used particularly as a method for producing an organic EL device.

  Embodiments according to the present invention will be described below using an organic EL element as an example of an organic electronics element.

  First, the organic EL element will be described with reference to the drawings.

  FIG. 1 is a schematic diagram showing a configuration of an organic EL element. 1A is a plan view of the organic EL element 10, FIG. 1B is a cross-sectional view taken along the line AA ′ of the organic EL element 10, and FIG. It is B 'sectional drawing. As shown in FIG. 1B, the organic EL element 10 includes a first electrode 12, an organic light emitting layer 13, and a second electrode 14 formed on a substrate 11 to form an organic EL structure 20. The structure 20 has a configuration in which the upper surface of the structure 20 is laminated with the sealing member 16 via the adhesive layer 15. As shown in FIG. 1B, the organic EL structure 20 has an upper surface portion including the organic light emitting layer 13 covered with a sealing member 16, and the first electrode 12 is formed on the upper portion of the sealing member 16 in the drawing. A part of the second electrode 14 is exposed at a lower portion of the sealing member 16 in the figure. The organic light emitting layer 13 emits light by supplying current from the exposed portions of the sealing members 16 of the first and second electrodes at the top and bottom of the drawing. The portion of the first electrode 12 exposed at the top of the sealing member 16 is referred to as a first electrode lead portion 12a. Similarly, the portion of the second electrode 14 exposed at the bottom of the sealing member 16 is the second electrode lead-out. This will be referred to as part 14a.

  The substrate 11 is made of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polyetherimide, polyetheretherketone, polyphenylene sulfide, polyarylate, polyimide, polycarbonate (PC), cellulose triacetate ( TAC), cellulose acetate propionate (CAP) and the like.

  The first electrode 12 is an anode, and when transparent, indium tin oxide (ITO), indium zinc oxide (IZO), gold, tin oxide, zinc oxide and the like have a work function of 4 eV or more and a transmittance of 40%. This is an electrode made of the above conductive material. The first electrode 12 has a first electrode lead portion 12a which is a lead portion at one end thereof. The first electrode lead portion 12a is exposed without being covered with the sealing member 16, and current can be supplied to the first electrode 12 from the outside via the first electrode lead portion 12a.

  The organic light emitting layer 13 is composed of a single layer or a plurality of layers made of an organic material such as an organic compound or a complex of several nm to several μm including the light emitting layer. The light-emitting layer includes three layers such as an electron transport layer in contact with the cathode, and a lithium fluoride layer, an inorganic metal salt layer, or a layer containing them may be disposed at an arbitrary position.

  The second electrode 14 is a cathode and is an electrode made of a metal material having a work function of less than 4 eV and a reflectivity of 60% or more, such as aluminum, sodium, lithium, magnesium, silver, calcium, etc. is there. The second electrode 14 has a second electrode lead portion 14a which is a lead portion at one end thereof. The second electrode lead portion 14a is exposed without being covered with the sealing member 16, and current can be supplied to the second electrode 14 from the outside via the second electrode lead portion 14a.

  In the organic EL device according to the present invention, electrons and holes are combined in the organic light emitting layer 13 by an electric current supplied from the outside to the first electrode (anode) 12 and the second electrode (cathode) 14, and the excitation generated by the combination. The element emits light using energy, and light from the organic light emitting layer 13 is extracted through the transparent first electrode (anode) 12. Examples of light emission using excitation energy include fluorescence that uses singlet excitation energy for light emission, and phosphorescence that uses triplet excitation energy for light emission. In particular, phosphorescence is desirable light emission as a light source because triplet excitons contribute to light emission, and thus higher light emission efficiency can be obtained than fluorescence.

  Light emitted from the light emitting layer of the organic EL element 10 is extracted through the first electrode 12 and the base material 11. The second electrode (cathode) is formed by laminating a thin film cathode material and a highly transparent anode material. It is also possible to adopt a so-called top emission configuration in which the light is extracted from the cathode.

  Next, the manufacturing method of the organic EL element according to the present invention will be described.

  FIG. 2 is a block diagram showing a manufacturing process of the organic EL element of the present invention. The manufacturing process of the organic EL element of the present invention is a process of feeding a continuous roll-shaped substrate, forming an organic EL structure forming step 120 on the substrate, and forming an adhesive strength enhancing region 140 on the periphery of the organic EL structure. The organic EL element is formed through a sealing member adhesion step 150, an adhesive layer curing step 160, and a cutting step 170, and an adhesion strength strengthening step for strengthening the adhesion force between the base material and the sealing member. It is characterized by having.

  FIG. 3 is a schematic diagram of an organic EL structure forming step 120 for forming an organic EL structure on a substrate.

  In addition, although the example using the base material which has already formed the first electrode (anode) is shown here, the patterning of the anode may be performed in-line, and organic EL due to scattering of metal powder at the time of electrode formation, etc. When there is a concern about a short circuit between the electrodes of the structure, it is necessary to take measures to block the metal powder from forming the organic EL structure.

  In addition, the patterning of the first electrode (anode) is an active type in which electrodes are patterned on the surface for lighting applications, or an active type in which TFTs are arranged in advance in a matrix for display applications, or wiring. A passive type patterned in a matrix may be used.

  The substrate 11 wound in the form of a roll having the first electrode (anode) 12 is fed to the cleaning step 110, immersed in the ultrasonic cleaning tank 111 and subjected to ultrasonic cleaning, and then rinsed with the shower head 113. And dried in the drying zone 114.

  Thereafter, the transfer speed with the subsequent process is adjusted by the buffer zone 115 and transferred to the organic EL structure forming process 120.

  Here, the formation process by the dry method is shown as the organic EL structure forming process 120. First, it is transferred to the plasma tank 121, and the plasma tank 121 is a vacuum environment having a pressure of 1 Pa or less, and cleans the substrate 11 with oxygen plasma.

  Subsequently, the organic layer and the cathode are vapor-deposited in the vapor deposition tank 122, and if necessary, a barrier layer (not shown) is formed in the sputtering tank 123.

In the vapor deposition tank 122, an organic material or a metal material is sublimated from the vapor deposition source 35 in a vacuum environment at a pressure of 1 × 10 ⁻⁴ Pa or less, and is patterned in advance on the substrate 11 in a predetermined pattern by the mask 36. An organic layer and a cathode are stacked on the anode 12 to form the organic EL structure 20.

In the case of an organic EL structure having an anode / hole transport layer / light emitting layer / cathode structure, for example, the organic EL structure 20 is formed on the base material on which the first electrode (anode) is formed. (Α-NPD): 500 mm, light-emitting layer (Alq ₃ ): After sequentially forming with a thickness of 600 mm, a cathode (aluminum) is deposited thereon with a thickness of 2000 mm.

The structures of α-NPD and Alq ₃ used are shown below.

  Thereafter, this figure shows a step of forming a barrier layer in the sputtering vessel 123.

  The barrier layer is a layer including at least one kind of metal oxide film, oxynitride film, nitride film, metal thin film, and diamond-like carbon film. Preferred metals are metals such as silicon and aluminum. Examples of preferred barrier film materials include silicon oxynitride and silicon nitride. Here, a sputtering apparatus such as an RF magnetron sputtering apparatus is used.

  In addition, it is preferable that the alignment mark is provided in the edge part of the base material at equal intervals corresponding to the patterning position of the 1st electrode (anode). In the above-described organic EL structure forming process 120, adhesion strengthening process 140, sealing member bonding process 150, curing process 160, and cutting process 170, the respective process operations are executed with reference to the alignment mark. It is preferable.

  FIG. 4 shows an organic EL structure forming process by a wet coating method.

  Similar to the dry method of FIG. 3, the base material on which the first electrode 12 has already been formed is used, the transfer speed with the subsequent process is adjusted by the buffer zone 115, and transferred to the organic EL structure forming process 120. .

  The hole transport layer 13a is formed by the inkjet head 41 connected to the tank 43 in which the coating liquid for forming the hole transport layer is stored, corresponding to the patterning position of the first electrode (anode) of the substrate being conveyed. Then, the light emitting layer 13b is formed by the inkjet head 42 connected to the tank 44 in which the light emitting layer forming coating solution is stored, dried (not shown), and then the aluminum foil 45 is removed. The cathode 14 is formed by transferring by the transfer method, and the organic EL structure 20 is formed.

  As a method for forming the organic layer by a wet coating method, a printing method such as gravure printing, patterning using a special coater, or the like can be used in addition to the inkjet method.

  The adhesion strengthening step 140 of the present invention can be performed after forming the surface of the organic EL structure thus formed, that is, after forming the cathode and before adhering the encapsulant member, but before forming the organic layer, It may be performed during the formation of a plurality of organic layers, before the formation of the cathode after the formation of the organic layers, or in combination. In this invention, it is preferable to perform these adhesive force reinforcement | strengthening processes at the time of organic layer formation, and it is further more preferable to carry out in multiple places.

  In particular, in the step of forming the organic layer, when foreign matter adheres to the substrate surface or the formed organic layer surface, it is preferable to remove the foreign matter as quickly as possible. This is because there is a risk of lowering the adhesive force in bonding with the sealing member.

  As the adhesion strengthening step 140 of the present invention, a part of the periphery of the organic EL structure and preferably the surface of the substrate is cleaned by irradiating UV light, wiping with a solvent, plasma treatment, or the like, For example, a roughening treatment step for roughening the surface of the portion, and a combination of these treatments.

  FIG. 5 shows a cleaning process of wiping a part of the periphery of the organic EL structure and the surface of the substrate with a sponge roller impregnated with a solvent as an example of the adhesion strengthening process of the present invention.

  FIG. 5A shows a process of supplying the solvent from the solvent tank 51 to the cleaning roller 53 via the solvent supply pipe 52, and cleaning the peripheral portion of the organic EL structure and the substrate surface by rotating and sliding the roller. Indicates.

  FIG. 5B is a diagram showing a part of the periphery of the organic EL structure processed by the adhesion strengthening step 140 and the adhesion strengthening region 55 on the substrate surface, and the treatment region is indicated by hatching in the drawing. It was.

  In addition, it is necessary to perform these adhesive force reinforcement | strengthening process processes to the peripheral part of an organic EL structure, and it is preferable that it is a part of light emission surface of the organic EL structure 20, Preferably it is 1% or more of light emission area. It is preferably 20% or less, and more preferably 10% or less.

  In addition, the light emission area said here means the area of the area | region where the 1st electrode 12, the organic light emitting layer 13, and the 2nd electrode 14 which comprise the organic EL structure 20 overlap.

  FIG. 6 is a perspective view showing the sealing member bonding step 150 and the adhesive layer curing step 160. The step of pressure-bonding the sealing member 16 via the adhesive layer 15 on the surface where the peripheral portion of the organic EL structure has been processed by the adhesion strengthening step 140, and then the surface of the organic EL structure by the curing step 160 This is a step of curing the adhesive layer of the sealing member formed in the step by the curing processing means 61 and 62.

  In the sealing member used in the present invention, an adhesive layer is formed in advance, but any method may be used for forming the adhesive layer on the substrate of the sealing member, for example, a die coating method. Various methods such as a printing method can be used.

  The adhesive layer may be formed on almost the entire surface of the base material of the sealing member, or may be obtained by previously patterning the adhesive layer into a necessary shape corresponding to the organic EL structure. Alternatively, an adhesive layer may be formed on almost the entire surface and then patterned. In the production method of the present invention, the adhesive layer is preferably formed on the entire surface of the substrate of the sealing member and bonded directly onto the organic EL structure.

  As an adhesive for forming a sealing member on the surface of the organic EL structure, a heat-reactive (thermoplastic or thermosetting) adhesive or a photoreactive (for example, ultraviolet curable) adhesive is used. Can do.

  The curing processing means 61 and 62 are means for curing the adhesive, and the adhesive layer is cured by heat treatment or light irradiation depending on the type of adhesive used.

  The adhesive used in the present embodiment is preferably an epoxy type, acrylic type, acrylic urethane type or the like that is cured with ultraviolet rays, but is not limited to the type that is cured with ultraviolet rays.

  In the sealing member bonding step 150, a long sealing member is bonded onto the roll of the base material 11 on which the organic EL structure 20 is formed, and the organic EL structure is sealed via the adhesive layer 15. It is a step of pasting the stop member 16. After the sealing member 16 is bonded onto the organic EL structure 20, the organic light emitting layer of the organic EL structure is covered with the sealing member by curing the adhesive layer in the adhesive layer curing step 160, and air High quality and high reliability can be maintained without deteriorating quality due to moisture and oxygen in the inside.

  In addition, when the base material on which the organic EL structure is formed has a plurality of rows of organic EL structures, the plurality of rows of sealing members on which the adhesive layer is formed may be bonded. A method may be used in which an organic EL element is obtained by adhering a sealing member having a row of adhesive layers and then cutting the sealing member.

  FIG. 7 shows a cutting step 170 and shows a step of cutting the adhesive strength reinforcing region 55 with the cutting blade 171. Fig.7 (a) is a front view of a cutting process, FIG.7 (b) is the top view.

  The cutting means for cutting the adhesion strengthening region has a cutting blade 171 and cuts the sealing member and the base material at a predetermined position with each cutting blade.

  The cutting blade to be used is not particularly limited, but various methods such as a rotary roll type or a guillotine type cutting blade can be used.

  EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited thereto.

Example 1
<< Preparation of organic EL structure >>
<Base material and anode>
A long film (as described in JP 2007-83644 A) formed by forming a gas barrier film on polyethylene naphthalate (film made by Teijin DuPont, PEN) having a thickness of 100 μm, a width of 200 mm, and a length of 500 m as a base material. As a positive electrode, an ITO film having a thickness of 150 nm was formed, and anode patterning was performed with a width of 190 mm × a length of 100 mm and an interval of 10 mm.

<Formation of organic layer>
As the organic layer, the following hole transport layer and light emitting layer were formed.

<Formation of hole transport layer>
The PEN film on which the anode was formed was fed out and the surface was subjected to a charge removal treatment. Then, the following hole transport layer was applied, dried, heat-treated and wound into a roll.

  As a hole transporting layer, a solution obtained by diluting polyethylene dioxythiophene / polystyrene sulfonate (PEDOT / PSS, Baytron P AI 4083 manufactured by Bayer) with 65% aqueous methanol solution to a concentration of 5% by the extrusion coating method, 5 mm on both sides. The film was formed such that the total coating width was 180 mm and the thickness after drying was 50 nm so that the anode of the film was exposed.

<Formation of light emitting layer>
[Coating equipment]
A light emitting layer was formed using an ink jet recording apparatus.

  The light emitting layer was applied with a total coating width of 180 mm so that a light emitting layer pattern film was formed on the hole transport layer of the PEN film on which the ITO anode and the hole transport layer were formed.

In the light emitting layer, the host material polyvinyl carbazole (PVK) is mixed with Ir (ppy) ₃ , FIr (pic), Btp ₂ Ir (acac) (1: 1: 1 mixture) as dopant materials to 10 mass%. Then, it was dissolved in 1,2-dichloroethane to obtain a 1% by mass solid content concentration. This solution was formed on the first hole transport layer so as to have a thickness of 100 nm after drying using an inkjet method, and a light emitting layer was provided.

  Then, it dried at 60 degreeC using the drying furnace similar to a positive hole injection transport layer, and heat-processed at 100 degreeC continuously.

  The structural formula of the dopant material used is shown below.

<Formation of electron transport layer, cathode, sealing film>
Next, the film having the element formed up to the light emitting layer is energized in a boat containing lithium fluoride in a vacuum tank under a vacuum of 5 × 10 ⁻⁴ Pa, and the deposition rate is 0.01 nm / second to 0.00. A cathode buffer layer having a thickness of 0.5 nm was provided at 02 nm / second, and then a boat containing aluminum was energized to attach a cathode having a thickness of 150 nm at a deposition rate of 1 nm / second to 2 nm / second to obtain an organic EL structure. It was.

  Further, the organic EL structure was wound up in a nitrogen atmosphere (under a high purity nitrogen gas having a purity of 99.999% or more) without being brought into contact with the air.

《Adhesion Strengthening Process》
The adhesion strengthening step of the present invention was performed after the organic layer formation step and / or after the formation of the organic EL structure, and was washed and wiped by a sponge roller method shown in FIG. 5 using toluene as a solvent.

《Sealing work》
<Preparation of sealing member>
As a base material, a sealing film was produced by laminating a barrier film of aluminum foil 30 μm on a polyethylene terephthalate film having a thickness of 50 μm.

<Application of adhesive layer>
A UV curable epoxy resin (UV resin XNR5516 manufactured by Nagase ChemteX Corporation) was applied on the entire surface of the barrier film of the sealing film having the barrier film under a nitrogen atmosphere to form a sealing member.

<Lamination>
Passing between the opposing rollers so that the organic EL structure surface of the substrate on which the organic EL structure is formed is opposed so as to face the sealing member on which the adhesive layer is formed, and performing pressure bonding and bonding, The adhesive layer was cured by UV irradiation from the anode side to the adhesive layer with a UV lamp.

《Cutting process》
Subsequently, the periphery of the organic EL structure processed by the step of strengthening the adhesion of the organic EL structure continuously formed on the continuous base film is cut using a cutting blade, and the single organic EL element 1 is cut. Formed.

  Moreover, the comparative sample which did not perform the adhesive force reinforcement | strengthening process at all and the sample which changed the adhesive force reinforcement | strengthening process into what was shown in Table 1 were produced, respectively, and the following evaluation was performed.

  A commercially available thermosetting adhesive having a melting point of 120 ° C. was used as the thermosetting adhesive, and the adhesive layer was cured by thermocompression bonding at 120 ° C. during bonding.

[Evaluation]
After storing for 24 hours in a reduced pressure environment 33330 Pa at a temperature of 25 ° C., the area of the light emitting part excluding non-light emitting parts such as dark spots after storage under accelerated deterioration conditions (60 ° C. 90% RH, 250 hours) was measured. The ratio with the initial light emission area was expressed in the following evaluation rank.

◎: 100 to 95% or more ○: Less than 95% to 90% or more △: Less than 90% to 85% or more ×: Less than 85%

  As can be seen from the results in Table 1, by carrying out the adhesion strengthening step of the present invention before adhering the sealing member, the adhesion strengthening step is performed both after the organic layer formation and after the organic EL structure formation. It can be seen that, by carrying out, excellent performance is exhibited with little reduction in light emitting area even under accelerated deterioration conditions.

  Moreover, similarly to the organic EL element, it was found that an organic photoelectric conversion element having excellent durability can be obtained by performing the adhesion strengthening step in the organic photoelectric conversion element.

10 Organic EL Element 11 Base Material 12 First Electrode (Anode)
13 Organic light emitting layer 14 Second electrode (cathode)
12a First electrode lead-out part 14a Second electrode lead-out part 15 Adhesive layer 16 Sealing member 20 Organic EL structure 55 Adhesive strength strengthening region 61, 62 Curing means 120 Organic EL structure forming step 140 Adhesive strength strengthening step 150 Sealing Stop member bonding process 160 Adhesive layer curing process 170 Cutting process 171 Cutting blade

Claims (15)

On the base material, a step of continuously forming an organic electronics structure having an anode and a cathode, and an organic layer sandwiched between the electrodes, and the surface of the base material on which the organic electronics structure is formed, In the manufacturing method of an organic electronics element having a step of bonding a sealing member through an adhesive layer, the adhesive force between the base material and the sealing member is enhanced on a part of the periphery of the organic electronics structure The manufacturing method of the organic electronics element characterized by having the adhesive force reinforcement | strengthening process which performs the process to perform. The method for producing an organic electronic element according to claim 1, wherein the adhesion strengthening step is performed at least when the organic layer is formed. The method for producing an organic electronic element according to claim 1, wherein an adhesive layer is formed on the entire surface of the sealing member. The adhesive of the said sealing member is a heat-reactive adhesive, and has the adhesive bond layer hardening process which heats the adhesive bond layer of the area | region processed by the said adhesive force reinforcement | strengthening process. The manufacturing method of the organic electronics element of any one of these. The adhesive of the sealing member is a photoreactive adhesive, and has an adhesive layer curing step of irradiating light to an adhesive layer in a region treated in the adhesive strength strengthening step. The manufacturing method of the organic electronics element in any one of -3. 6. The method of manufacturing an organic electronics element according to claim 1, wherein the adhesion strengthening step is a cleaning step of cleaning a part of the periphery of the organic electronics structure on the substrate. . The method of manufacturing an organic electronic element according to claim 6, wherein the cleaning step is a cleaning step using a solvent. The method of manufacturing an organic electronic device according to claim 6, wherein the cleaning step is a cleaning step by plasma surface treatment. The method of manufacturing an organic electronic device according to claim 6, wherein the cleaning step is a cleaning step by UV surface treatment. The organic material according to any one of claims 1 to 5, wherein the adhesion strengthening step is a roughening treatment step of roughening a part of the periphery of the organic electronics structure on the substrate. A method for manufacturing an electronic device. A step of continuously forming a plurality of rows of organic electronics structures having an anode and a cathode, and an organic layer sandwiched between the electrodes on the substrate, and the surface of the substrate on which the organic electronics structures are formed In the method for manufacturing an organic electronics element having a step of bonding a sealing member, an adhesion strengthening step for strengthening the adhesive force between the base material and the sealing member around a part of the organic electronics structure A method for producing an organic electronics element, comprising: cutting a part of an adhesive strength-enhanced region formed in an adhesive strength-enhancing step after bonding a sealing member. 12. The method of manufacturing an organic electronic element according to claim 11, wherein the adhesion strengthening step is performed at least when the organic layer is formed. The method for producing an organic electronic element according to claim 11, wherein an adhesive layer is formed on the entire surface of the sealing member. An organic electronic device formed by the manufacturing method according to claim 1. An organic electroluminescence element formed by the manufacturing method according to claim 1.

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