JP2009242901A - Sputtering apparatus and sputtering method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sputtering apparatus and a sputtering method which can efficiently cool a workpiece with a simple constitution. <P>SOLUTION: The sputtering apparatus for depositing a material of targets 33c, 35c arranged opposite to the workpiece W in sputtering chambers 33, 35 on the workpiece W by the sputtering in a film shape has a susceptor S affixed to the workpiece W via a gel G. A cooling chamber 34 for cooling the susceptor S is provided separate from the sputtering chambers 33, 35, and a transfer device for transferring the susceptor S, to which the workpiece W is affixed via the gel G, is provided between the sputtering chamber 33 and the cooling chamber 34. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a sputtering apparatus and method for depositing a thin film of a target material on a surface of an object to be processed by sputtering, for example.

  In recent years, in a manufacturing process of various products such as a semiconductor device, a liquid crystal display, and an optical disk, a sputtering-type film forming apparatus (hereinafter, “ "Sputtering apparatus" is widely used.

  In such a sputtering apparatus, a target of a predetermined deposit provided in a vacuum vessel is biased to the cathode, and against this, ions of a discharge gas such as argon (Ar) are collided, A material constituting the target is knocked out in the form of atoms, molecules, or clusters, and deposited as a thin film on an object to be processed (hereinafter referred to as a workpiece).

  Thus, when forming a thin film by sputtering, the workpiece | work is heated when the molecule | numerator etc. of a target material collide violently with a workpiece | work. However, depending on the material and type of the workpiece, there is a possibility that the upper limit of the temperature allowed during sputtering may be reached, so it is necessary to take measures to avoid the temperature rise as much as possible.

In order to cope with this, Patent Document 1 discloses a sputtering apparatus provided with a cooling device for cooling a table on which a workpiece is placed.
JP 2002-302766 A

  By the way, in the above sputtering apparatus, generally, a workpiece is placed on a susceptor and conveyed, and is sputtered on the susceptor. Such a susceptor is constituted by a flat surface such as a metal having a high thermal conductivity, like the fixed base. However, the workpiece to be sputtered is not necessarily flat. For example, a reflective film may be formed on a substrate by sputtering in order to manufacture a vehicle rearview mirror. Such a substrate has a three-dimensional complicated curved surface shape. For this reason, even if the work is placed on a flat surface, a gap is generated between the work and the flat surface, and heat from the work is not efficiently transferred to the metal.

  Further, even when a flat plate-like workpiece is considered, such as a substrate for an optical disk, a gap is formed between the flat surface and a subtle warp of each workpiece. Furthermore, the workpiece is deformed by heat input during sputtering, and a gap is formed between the flat surface and the workpiece.

  In order to cope with this, it is conceivable that the contact surface of the susceptor with the workpiece matches the shape of the workpiece, but it is difficult to match the complicated curved surface shape. Further, in the case of warpage or the like, the shape differs depending on the individual workpiece, and therefore it is impossible to preliminarily manufacture a shape that matches this.

  Further, at the time of sputtering, it is necessary to fix the work to the susceptor in order to prevent the work from shifting. For this reason, a special suction mechanism such as an electrostatic chuck, a vacuum chuck, or a mechanical presser is required for the susceptor. Therefore, it leads to complication, enlargement, and cost increase of the apparatus.

  The present invention has been proposed to solve the above-described problems of the prior art, and an object of the present invention is to provide a sputtering apparatus and method capable of efficiently cooling an object to be processed with a simple configuration. It is in.

  In order to achieve the above object, a first aspect of the present invention is a sputtering apparatus for depositing a target material disposed in a sputtering chamber so as to face a workpiece on the workpiece by sputtering. It has the cooling member stuck to the processed material through the gel, It is characterized by the above-mentioned.

  According to a fifth aspect of the present invention, there is provided a sputtering method in which a target material disposed facing a workpiece in the sputtering chamber is deposited on the workpiece by sputtering, and the workpiece is cooled via a gel. Sputtering is performed in a state of being attached to the substrate.

  In the inventions of claims 1 and 5 as described above, the object to be processed and the cooling member can be brought into close contact with each other regardless of the shape of the object to be processed. Heat can be efficiently released to the cooling member. In addition, since the gel is sticky, an adsorption mechanism or the like for fixing to the cooling member becomes unnecessary.

  According to a second aspect of the present invention, in the sputtering apparatus of the first aspect, a cooling chamber for cooling the cooling member is provided separately from the sputtering chamber, and the gel is interposed between the sputtering chamber and the cooling chamber. The present invention is characterized in that a transfer device is provided for transferring a cooling member to which an object to be processed is attached.

  The invention according to claim 6 is the sputtering method according to claim 5, wherein sputtering in the sputtering chamber and cooling in the cooling chamber for cooling the cooling member are performed on an object to be processed attached to the cooling member via a gel. A multilayer film is formed by repeating the above.

  In the inventions of claims 2 and 6 as described above, since the cooling chamber is provided separately from the sputtering chamber, the cooling capacity required for the cooling chamber is low, and the apparatus can be simplified and the cost can be reduced. It becomes. Also, since the multilayer film can be formed while moving the workpiece between the sputtering chamber and the cooling chamber, the workpiece is compared with the case where sputtering is continuously performed in the same sputtering chamber for multilayering. Can be prevented from becoming high temperature.

  The invention of claim 3 is characterized in that, in the sputtering apparatus of claim 1 or claim 2, it has an attachment device for attaching a material that lowers the adhesiveness to a part of the surface of the gel to be treated with the object to be processed. To do.

  A seventh aspect of the invention is characterized in that, in the sputtering method of the fifth or sixth aspect, a material for reducing the adhesiveness is attached to a part of the surface of the gel to be treated with the object to be processed.

  In the inventions of claims 3 and 7 as described above, since the adhesiveness of a part of the gel is low, the gel can be easily peeled off from the object to be processed after film formation.

According to a fourth aspect of the present invention, in the sputtering apparatus according to any one of the first to third aspects, the apparatus includes a peeling device that peels the cooling member together with the gel from the object to be processed.
In the invention of claim 4 as described above, the gel can be peeled from the object to be processed by the peeling device, and the transition to the next process can be performed smoothly.

  According to the present invention, it is possible to provide a sputtering apparatus and method capable of efficiently cooling an object to be processed with a simple configuration.

Next, embodiments of the present invention (hereinafter referred to as embodiments) will be described in detail with reference to the drawings.
[Constitution]
First, the configuration of the sputtering apparatus of the present embodiment (hereinafter referred to as the present apparatus) will be described with reference to FIGS. That is, the apparatus includes a susceptor processing unit 1, a transport unit 2, a substrate processing unit 3, and a peeling unit 4 as shown in FIG. In addition, this apparatus uses a susceptor S as shown in FIG. The workpiece W is attached to the susceptor S via the gel G.

  The workpiece W is a disk-shaped substrate that is an object to be processed. The susceptor S is a cooling member having the same shape as the workpiece W. The susceptor S is made of a material having high thermal conductivity. For example, it may be a metal such as copper or silver, but is not limited thereto. The gel G has the same shape as the workpiece W and the susceptor S. As this gel G, for example, silicone gel, acrylic gel, urethane gel or the like can be used, but is not limited thereto. From the viewpoint of heat resistance, silicone gel is desirable.

  The susceptor processing unit 1 includes a turntable 11, a loading unit 12, a sticking device 13, an attaching device 14, and a sticking unit 15. The turntable 11 is a means for conveying the susceptor S. The turntable 11 is configured to intermittently rotate to positions corresponding to the input unit 12, the sticking device 13, the adhering device 14, and the sticking unit 15 by a driving source (not shown).

  The loading unit 12 is a position where the susceptor S is loaded on the turntable 11 by a loading unit (not shown). The sticking device 13 is a means for sticking the gel G to the susceptor S as shown in FIG. The sticking device 13 is provided with a pressing portion 13a for holding the gel G so as to be movable in the horizontal and vertical directions by a driving mechanism (not shown).

  The adhering device 14 is means for adhering a material that reduces the adhesiveness to the gel G adhered to the susceptor S. The attachment device 14 has a coating portion 14b that can be moved in the horizontal and vertical directions by a drive mechanism (not shown). The application part 14b is means for applying the powder material L with a brush. The powder material L may be talc powder used for baby powder, for example. The affixing unit 15 is a position for affixing the workpiece W held by the conveyance unit 2 described later to the gel G.

  The transport unit 2 is a device that transports the susceptor S among the susceptor processing unit 1, the substrate processing unit 2, and the peeling unit 4. As shown in FIG. 5, the transport unit 2 includes an arm 21, a holding unit 22, and a closing unit 23. The arm 21 is provided so as to be rotatable in the horizontal direction and movable in the vertical direction by a drive mechanism (not shown). The holding portions 22 are provided at both ends of the arm 21 and are provided so that the workpiece W can be sucked and held by an electrostatic chuck or the like. The closing part 23 is means for closing an upper part of a load lock chamber 32 described later.

  The substrate processing unit 3 is an apparatus for forming a film on the workpiece W by sputtering. As shown in FIG. 1, the substrate processing unit 3 includes a vacuum chamber 31, a load lock chamber 32, a sputtering chamber 33, a cooling chamber 34, a sputtering chamber 35, and the like. In addition, about the seal structure for maintaining the airtightness of each part, since all well-known techniques, such as an O-ring and packing, are applicable, description is abbreviate | omitted.

  As shown in FIGS. 5 to 10, the vacuum chamber 31 is configured by a container that can be evacuated. As shown in FIGS. 5 to 8, the load lock chamber 32 is means for enabling the work W to be loaded and unloaded while maintaining the vacuum in the vacuum chamber 31. The load lock chamber 32 has an upper opening that can be sealed and opened by the closing portion 23. A lower opening of the load lock chamber 32 is provided so as to be sealed and opened by a mounting table 37 described later. A vacuum source is connected to each of the vacuum chamber 31 and the load lock chamber 32, and evacuation is performed according to the operation of the vacuum source or the opening / closing of a valve.

  The sputtering chambers 33 and 35 are means for forming a film on the workpiece W. As shown in FIG. 11, the sputtering chambers 33 and 35 include sputtering chambers 33a and 35a, targets 33c and 35c, power supplies 33d and 35d, and the like. The lower openings of the sputtering chambers 33 a and 35 a are provided by the mounting table 37 so that they can be sealed and opened. Further, the sputtering chambers 33a and 35a are connected to introduction paths 33e and 35e connected to a process gas supply source and process gas exhaust paths 33f and 35f.

  The targets 33c and 35c are film materials deposited on the workpiece W by sputtering. The description of the backing plate that supports the targets 33c and 35c, the magnet unit that generates a magnetic field, and the like is omitted. Further, the power sources 33d and 35d are means for applying a sputtering voltage connected to the electrodes on the targets 33c and 35c side and the electrode on the workpiece W side.

  The cooling chamber 34 is a means for cooling the workpiece W. As shown in FIG. 12, the cooling chamber 34 includes a cooling chamber 34a and the like. The lower opening of the cooling chamber 34 a is provided by the mounting table 37 so that it can be sealed and opened.

  In addition, the transfer apparatus which transfers the workpiece | work W among the load lock chamber 32, the sputter | spatter chamber 33, the cooling chamber 34, and the sputter | spatter chamber 35 is comprised as follows. That is, the transfer device includes an index table 36, a mounting table 37, a pusher 38, and the like. The index table 36 is rotatably provided by a driving mechanism (not shown).

  The mounting table 37 is mounted at a position corresponding to each position of the load lock chamber 32, the sputtering chambers 33 and 35, and the cooling chamber 34 in the index table 36. The mounting table 37 is mounted with the susceptor S and is lifted separately from the index table 36, thereby forming a closed chamber in contact with the lower openings of the load lock chamber 32, the sputtering chambers 33 and 35, and the cooling chamber 34.

  The mounting table 37 is provided with support means for supporting the susceptor S. As this support means, it is conceivable to use a mechanical or electrostatic chuck, but since it is a well-known technique, its description is omitted. Similarly to the susceptor S, the mounting table 37 is also made of a material having high thermal conductivity, and also functions as a cooling member.

  The peeling unit 4 is a device that peels the susceptor S together with the gel G from the film-formed workpiece W. As shown in FIGS. 13 to 18, the peeling portion 4 includes a pressing portion 41, a rod 42, a hook 43, and the like. The pressing portion 41 has a substantially U-shaped insertion portion that is inserted into the side surface of the gel G below the workpiece W, and is provided so as to be movable in the horizontal direction by a driving mechanism (not shown). As shown in FIGS. 15 to 17, the rod 42 is provided so as to be movable up and down and rotatable by a drive mechanism (not shown). The hooking tool 43 is provided at the tip of the rod 42 and is configured to enter a hooking hole Sh formed in the lower part of the susceptor S as shown in FIG.

  The operation of each part is controlled by a control device. This control device can be realized by, for example, a dedicated electronic circuit or a computer operating with a predetermined program. Therefore, a computer program for controlling the operation of the apparatus according to the procedure described below and a recording medium recording the computer program are also one aspect of the present invention.

[Action]
The operation of the apparatus as described above will be described. First, as shown in FIG. 1, the susceptor S is loaded into the loading unit 12 of the turntable 11, and moves to the sticking device 13 by the rotation of the turntable 11. The pressing part 13a of the sticking device 13 presses the gel G against the susceptor S to be stuck as shown in FIG. The susceptor S moves to the attachment device 14 by the rotation of the turntable 11. As shown in FIG. 4, the application unit 14 b of the attachment device 14 rotates to adhere the powder material L to the entire periphery on the upper surface of the gel G.

  The susceptor S moves to the sticking part 15 by the rotation of the turntable 11. As shown in FIGS. 5 and 6, the work W held by the holding part 22 is attached to the gel G in the sticking part 15 as shown in FIGS. 5 and 6 (see the left in FIG. 6). Prior to this, the workpiece W which is held by the holding portion 22 and attached to the gel G and comes to the upper part of the load lock chamber 32 by the rotation of the arm 21 is lowered together with the gel G and the susceptor S by the lowering of the arm 21. Then, it is mounted on the mounting table 37 (see the right side of FIG. 6). At this time, the upper portion of the load lock chamber 32 is closed by the closing portion 23. The lower portion of the load lock chamber 32 is closed by the mounting table 37.

  In this state, after the load lock chamber 32 is evacuated, as shown in FIG. 7, the pusher 38 is lowered together with the mounting table 37, so that the susceptor S is carried into the vacuum chamber 31. Then, when the pusher 38 is further lowered and the index table 36 rotates, the work W on the susceptor S comes to a position corresponding to the sputtering chamber 33 as shown in FIG.

  Thereafter, as shown in FIG. 8, the next mounting table 37 comes to the position of the load lock chamber 32 and is lifted by the pusher 38 to close the lower portion of the load lock chamber 32. Thereby, even if the arm 21 is next raised and the closing portion 23 opens the upper portion of the load lock chamber 32, the vacuum in the vacuum chamber 31 is maintained.

  In the sputtering chamber 33, as shown in FIGS. 10 and 11, after the pusher 38 is raised and the mounting table 37 seals the sputtering chamber 33a, a process gas is introduced, and voltage is applied to the electrodes. Sputtering onto the workpiece W on 37 is performed. Thereby, the film material from the target 33c is deposited on the workpiece W to form a film. At this time, since the heat of the workpiece W heated by sputtering moves to the susceptor S through the gel G, overheating of the workpiece W is suppressed.

  Thereafter, the sputtering chamber 33 a is opened by exhausting the process gas and lowering the mounting table 37, and the index table 36 rotates, so that the susceptor S comes to a position corresponding to the cooling chamber 34. Then, as shown in FIG. 12, the pusher 38 is raised and the mounting table 37 seals the cooling chamber 34a and then left for a predetermined time, so that the heat remaining on the workpiece W is transferred to the susceptor S via the gel G. Since the workpiece W moves to the mounting table 37, the workpiece W is cooled to a temperature before sputtering.

  Next, the susceptor S moves to the sputtering chamber 35 by the rotation of the index table 36. Then, sputtering is performed by the same procedure as the sputtering in the sputtering chamber 33 described above. Thereby, the film material from the target 35c is further deposited on the film-formed surface of the workpiece W to form a film. At this time, since the heat of the workpiece W heated by sputtering moves to the susceptor S and the mounting table 37 via the gel G, overheating of the workpiece W is suppressed.

  Next, the sputtering chamber 35 a is opened by exhausting the process gas and lowering the mounting table 37, and the index table 36 rotates to move the susceptor S to a position corresponding to the load lock chamber 32. In the load lock chamber 32, the upper portion is closed by the lowering of the closing portion 23, the lower portion is closed by the rising of the mounting table 37, and then vacuuming is performed. At this time, the work W on the mounting table 37 is held by the holding unit 22. And the work W, the gel G, and the susceptor S which were hold | maintained at the holding | maintenance part 22 raise with the atmospheric release of the load lock chamber 32 by the raise of the obstruction | occlusion part 23.

  Furthermore, the holding part 22 comes to the position corresponding to the peeling part 4 by rotation of the arm 21. In the peeling part 4, as shown in FIGS. 1, 13, and 14, the pressing part 41 moves, and the insertion part presses the side surface of the gel G and enters the lower part of the work W. And as shown in FIG.15 and FIG.16, the rod 42 raises and the hooking tool 43 enters into the hooking hole Sh. When the rod 42 rotates, as shown in FIGS. 16 and 17, the hooking tool 43 is hooked on the end of the hooking hole Sh.

  In this state, as shown in FIG. 18, when the rod 42 is lowered, the gel G is peeled from the workpiece W together with the susceptor S. Since the powder material L is applied to the periphery of the surface where the gel G is adhered to the workpiece W, the adhesive strength is reduced. For this reason, the gel G is peeled off from the workpiece W in a state of being attached to the susceptor S side. In this way, the work W that has been formed and from which the gel G has been peeled is carried out to the next step.

[effect]
According to the present embodiment as described above, since the workpiece W is attached to the susceptor S having a high thermal conductivity via the gel G, the gel G remains in the gap regardless of the shape of the workpiece W. The heat of the workpiece W can be efficiently released to the susceptor S.

  Moreover, since the workpiece | work W is fixed to the susceptor S by the gel G, the shift | offset | difference of the workpiece | work W can be prevented even if it does not provide a special adsorption | suction mechanism. Therefore, the entire apparatus can be simplified, reduced in size, and reduced in cost. In particular, when a mechanical chuck is used, an extra space for the chuck, such as a margin, is required on the processing surface of the workpiece W. However, in this embodiment, such a space is unnecessary.

  In addition, since the cooling chamber 34 is provided separately from the sputtering chambers 33 and 35 that are high in temperature, the workpiece W can be cooled in a short time even if the cooling capacity required for the cooling chamber 34 is low. The entire device can be simplified and the cost can be reduced.

  Further, since the multilayer film can be formed while moving the workpiece W between the sputtering chambers 33 and 35 and the cooling chamber 34, compared to the case where sputtering is continuously performed in the same sputtering chamber for multilayering. The overheating of the workpiece W can be prevented.

  Furthermore, the susceptor S can be automatically peeled off from the workpiece W together with the gel G by the peeling portion 4, and at that time, there are places where the adhesive strength is reduced, such as a peeling start place, thereby easily and reliably peeling off. Is possible. Therefore, the transition to the next process can be performed smoothly.

[Other Embodiments]
The present invention is not limited to the embodiment as described above. For example, the cooling member may be of any size and shape as long as it is a material having high thermal conductivity and can place an object to be processed. As a stand to which the cooling member is fixed, an object to be processed may be pasted through a gel. Furthermore, the gel may be easily peeled off by providing the cooling member so as to be bendable or being provided so as to be divided into a plurality of parts. For example, as shown in FIGS. 19 and 20, the bend F that can be bent is provided on the susceptor S, so that the gel G can be easily peeled off along with the bending of the workpiece W.

  The size, shape, thickness, etc. of the gel are not limited to specific ones. For example, as illustrated in FIG. 21, the diameter of the gel G may be set smaller than the workpiece W so that the presser portion 41 can easily enter the lower portion of the workpiece W when the gel G is peeled off. Not limited to this, as shown in FIG. 22, if a part of the gel G is recessed inward from the side surface of the workpiece W, the projection formed on the holding portion 41 is fitted and the workpiece W is fitted. Can be supported. In addition, even if it does not provide a dent in a gel, it is also possible to dent with the pressure of a pressing part.

  The material to be attached in order to reduce the tackiness of the gel is not limited to talc. For example, powdery minerals, metals, resins, and the like are easy to use, but powders derived from organisms such as plants and animals may be used. Furthermore, for example, a resin thin sheet or film may be attached. Also, the attachment position is not limited to the entire periphery of the gel. For example, as shown in FIG. 23, it may be annularly attached to the inner periphery. As shown in FIG. 24, it may be attached to a plurality of points in a scattered manner. Furthermore, you may make it adhere to a part of periphery, without making it a perimeter.

  The transfer device that transfers the susceptor between the sputtering chamber and the cooling chamber is not limited to a specific structure, and any known technique can be applied. For example, a structure in which the turntable on which the susceptor S is placed rotates intermittently according to the position corresponding to each part may be used. A structure in which the holding portion that holds the susceptor at the tip of the arm rotates intermittently in accordance with the position corresponding to each portion may be used. In these cases, the vacuum chamber prepared in each position may be configured to perform sputtering and cooling by moving up and down on the turntable and the holding unit.

  The device for attaching the gel to the susceptor and the device for attaching the work to the gel are not limited to a specific structure, and any known technique can be applied. It may be an apparatus having a configuration in which it is applied while being leveled by a roller or the like. Moreover, after affixing a gel on the workpiece side, the gel may be affixed to a susceptor. It is not always necessary to reattach the gel to the susceptor or the like. If the surface of a member that comes into contact with the gel for pasting, such as a pressing part or a roller, is a material with low adhesiveness, it is easy to paste.

  The number of sputtering chambers and cooling chambers, the number of times of sputtering and cooling, and the like are arbitrary. One sputtering chamber and one cooling chamber may be provided. In this case, in order to form a multilayer film, it is considered that the sputtering chamber and the cooling chamber are reciprocated to repeat the sputtering and cooling. It is also possible to repeat the sputtering and cooling by arranging a number of sputtering chambers and cooling chambers alternately.

  The arrangement of the sputtering chamber and the cooling chamber is not limited to an annular shape, and may be linear or endless. The sputtering chamber and the cooling chamber may not be configured in a common vacuum chamber, but may be configured in independent chambers. A means for forcibly cooling the object to be processed and the cooling member may be added to the cooling chamber. For example, as shown in FIG. 25, a cooling path 34c for circulating the cooling medium may be provided in the cooling plate 34b on which the susceptor S is placed. Further, the cooling gas may be introduced into the cooling chamber.

  Further, the configuration of the peeling portion is not limited to that exemplified in the above embodiment. For example, as shown in FIG. 26, the gel G can be peeled off by supporting the work W by pushing the gel G from a position opposed by the pair of pressing portions 41 and pulling down the susceptor S. Moreover, as shown in FIG. 27, the structure which peels the gel G from the workpiece | work W by pulling up the pressing part 41 side may be sufficient.

  Further, the object to be processed is applicable to any size, shape and material as long as it can be formed by sputtering. As the sputtering apparatus, any type that can be used now or in the future can be adopted depending on the film forming material and the object to be processed.

It is a simple arrangement block diagram which shows one Embodiment of this invention. It is a perspective view which shows the affixed state of the workpiece | work, gel, and susceptor in embodiment of FIG. It is a perspective view which shows the sticking apparatus in embodiment of FIG. It is a perspective view which shows the adhesion apparatus in embodiment of FIG. FIG. 2 is a simplified cross-sectional view illustrating a transfer unit and a load lock chamber in the embodiment of FIG. 1. FIG. 6 is a simplified cross-sectional view showing a lowered state of the transport unit in FIG. 5. FIG. 6 is a simplified cross-sectional view showing a lowered state of the mounting table in FIG. 5. FIG. 6 is a simplified cross-sectional view showing a lifted state of the transport unit in FIG. 5. FIG. 2 is a simplified cross-sectional view showing a sputtering chamber in the embodiment of FIG. 1. It is a simplified sectional view showing the rising state of the mounting table in the embodiment of FIG. FIG. 2 is a simplified cross-sectional view showing a sputtering chamber in the embodiment of FIG. 1. FIG. 2 is a simplified cross-sectional view showing a cooling chamber in the embodiment of FIG. 1. It is a simplified sectional view showing a peeling part in the embodiment of FIG. It is a top view which shows the press part of FIG. FIG. 14 is a simplified cross-sectional view showing the rise of the rod of FIG. 13. It is a top view which shows the hooking tool and hooking hole of FIG. FIG. 14 is a simplified cross-sectional view showing a state where the hooking tool of FIG. 13 is put in the hooking hole. FIG. 14 is a simplified cross-sectional view showing a peeled state of the gel of FIG. 13. It is a simplified sectional view showing an example of a susceptor in other embodiments of the present invention. FIG. 20 is a simplified cross-sectional view showing when the gel of FIG. 19 is peeled off. It is sectional drawing which shows the gel between the board | substrate and susceptor in other embodiment of this invention. It is a top view which shows an example of the gel which has a hollow in other embodiment of this invention. It is a perspective view which shows the gel in other embodiment of this invention. It is a perspective view which shows the gel in other embodiment of this invention. It is a simplified sectional view showing a cooling room in other embodiments of the present invention. It is a top view which shows an example of the pressing part in other embodiment of this invention. It is a simplified sectional view showing an example of the exfoliation part in other embodiments of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Susceptor processing part 2 ... Conveyance part 3 ... Substrate processing part 4 ... Stripping part 11 ... Turntable 12 ... Insertion part 13 ... Adhering device 13a ... Pressing part 14 ... Adhering device 14b ... Applying part 15 ... Adhering part 21 ... Arm 22 ... Holding part 23 ... Closing part 31 ... Vacuum chamber 32 ... Load lock chamber 33, 35 ... Sputtering chamber 33a, 35a ... Sputtering chamber 33c, 35c ... Target 33d, 35d ... Power source 33e, 35e ... Introducing path 33f, 35f ... Exhaust Path 34 ... Cooling chamber 34a ... Cooling chamber 34b ... Cooling plate 34c ... Circulation path 36 ... Index table 37 ... Mounting table 38 ... Pusher 41 ... Presser part 42 ... Rod 43 ... Hook

Claims (7)

In a sputtering apparatus for depositing a target material disposed in a sputtering chamber so as to face a workpiece on the workpiece by sputtering,
A sputtering apparatus comprising a cooling member attached to an object to be processed via a gel. A cooling chamber for cooling the cooling member is provided separately from the sputtering chamber;
The sputtering apparatus according to claim 1, further comprising a transfer device that moves a cooling member to which an object to be processed is attached via a gel between the sputtering chamber and the cooling chamber.   The sputtering apparatus according to claim 1, further comprising an attachment device that attaches a material that lowers the adhesiveness to a part of a surface of the gel attached to the object to be processed.   It has a peeling apparatus which peels a cooling member with a gel from a to-be-processed object, The sputtering device of any one of Claims 1-3 characterized by the above-mentioned. In a sputtering method for depositing a target material disposed in a sputtering chamber so as to face the object to be processed on the object to be processed by sputtering,
Sputtering characterized by performing sputtering in a state where an object to be processed is attached to a cooling member via a gel.   A multilayer film is formed by repeating sputtering in the sputtering chamber and cooling in the cooling chamber for cooling the cooling member with respect to the workpiece attached to the cooling member via the gel. The sputtering method according to claim 5.   The sputtering method according to claim 5 or 6, wherein a material for reducing the adhesiveness is attached to a part of a surface of the gel to be treated with the object to be treated.

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