KR101302886B1 - Substrate mounting stage, method for forming resin protrudent layer to surface of substrate mounting stage, and resin protrudent layer transfering member - Google Patents

Abstract

A method of forming a resin projection layer on a substrate mounting surface on which a resin projection layer can be formed on the substrate mounting surface without heating the substrate mounting table is provided.
The base material sheet 41, the resin protrusion layer 43 adhere | attached on one side of the base material sheet 41 with the 1st adhesive layer 42 interposed, and the 2nd adhesive layer apply | coated to the resin protrusion layer 43 The resin projection layer 43 is pressed against the substrate mounting surface 13a by pressing the second pressure-sensitive adhesive layer 44 applied to the resin projection layer 43 of the resin projection layer transfer member 40 having the (44) onto the substrate mounting surface ( 13A), and a base sheet peeling step of peeling the base sheet 41 from the adhered resin protrusion layer 43.

Description

SUBSTRATE MOUNTING STAGE, METHOD FOR FORMING RESIN PROTRUDENT LAYER TO SURFACE OF SUBSTRATE MOUNTING STAGE, AND RESIN PROTRUDENT LAYER TRANSFERING MEMBER}

The present invention relates to a substrate mounting table for mounting a substrate in a processing chamber of a substrate processing apparatus, a method of forming a resin projection layer on a substrate mounting surface of the substrate mounting table, and a resin projection layer transfer member to be applied to the method.

BACKGROUND OF THE INVENTION In a manufacturing process of a flat panel display (FPD) including a liquid crystal display (LCD), a substrate processing apparatus that performs a plasma treatment on various substrates including a glass substrate is known.

In such a substrate processing apparatus, a substrate mounting table for supporting a glass substrate (hereinafter simply referred to as a "substrate") in a processing chamber (hereinafter referred to as "chamber"), and the substrate mounting table and the processing space therebetween. A high frequency power (RF) for plasma generation is applied to a substrate mounting table that has an upper electrode disposed so as to face the lower electrode, and a plasma is generated by introducing a processing gas into the processing space to generate a plasma. The predetermined plasma processing is performed with respect to the board | substrate mounted on the board | substrate mounting surface of the board | substrate mounting table | surface.

On the substrate mounting surface of the substrate mounting stand, an alumina (AL ₂ O ₃ ) thermal sprayed coating is usually formed as an insulating layer. Since the hardness of the alumina constituting the alumina thermal sprayed coating is about HV1000 and is harder than that of HV640, which is the hardness of a general glass substrate, when the substrate is mounted on a substrate mount and electrostatically adsorbed by an electrostatic chuck, There is a problem of flaw in the surface.

On the other hand, when the substrate is mounted on a planar substrate mounting surface, there is a problem that foreign matter is easily attached to the back surface of the substrate. In order to avoid this, a projection layer is formed on the substrate mounting surface to make point contact with the substrate. Attempts have been made to support it, and a technique for forming a projection layer having a plurality of projections on a substrate mounting surface has been developed (see Patent Document 1, for example).

Patent Document 1: Japanese Patent Laid-Open No. 2008-251574

However, in order to prevent adhesion of foreign matter such as dust and prevent scratches on the back surface of the substrate, a projection made of a material having a hardness smaller than that of glass, which is the material of the substrate, must be formed on the substrate mounting surface. In addition, it is very difficult to form a plurality of projections on the substrate mounting surface at one time.

By the way, it is a material with hardness smaller than glass, and is applicable in the process chamber of a substrate processing apparatus, For example, resin, such as polytetrafluoroethylene (product surface: Teflon (registered trademark)), is mentioned. As a method of transferring a projection made of a Teflon (registered trademark) film or Teflon (registered trademark) to the surface of the structural member, generally, powder made of Teflon (registered trademark) is applied to the surface to be transferred by electrostatic powder coating. Although the baking method which adsorb | sucks and heats about 400 degreeC is employ | adopted, the heat-resistant temperature of a board | substrate mounting table is 100 degrees C or less, for example, and it is impossible to employ | adopt such a baking method.

The 1st subject of this invention is providing the board | substrate mounting stand which does not produce the flaw resulting from the material of a board | substrate mounting surface on the back surface of the board | substrate mounted on the board | substrate mounting surface. Moreover, the 2nd subject of this invention is providing the resin protrusion layer transfer member which can form the resin protrusion layer which consists of many resin protrusions on the board | substrate mounting surface of a board | substrate mounting board at once. Moreover, the 3rd subject of this invention is providing the method of forming a resin protrusion layer in the board | substrate mounting surface which can form a resin protrusion layer in the board mounting surface, without heating a board | substrate mounting table.

In order to solve the said 1st subject, the board mounting table of a 1st characteristic is a board mounting board which mounts the said board | substrate in the processing chamber of the substrate processing apparatus which performs a plasma processing on a rectangular board | substrate, and the board mounting to which the said board | substrate is mounted It is characterized in that the resin protrusion layer in which the some resin protrusion adhered on the said board | substrate mounting surface through the adhesive layer is arranged is formed.

The board | substrate mounting stand of a 2nd characteristic is a board mounting stand of a 1st characteristic WHEREIN: The said resin projection layer has many cylindrical resin projections of 0.5-2.0 mm diameter and 30-80 micrometers in height in 2-10 mm pitch in cross section. It is characterized by the arrangement.

The board mount according to the third feature is the board mount according to the first or second feature, wherein the resin protrusion is made of polytetrafluoroethylene, an epoxy resin, a silicone resin, a polyimide resin, a polyetherimide resin, and a heat resistant rubber. It is characterized by consisting of any one of.

In order to solve the said 2nd subject, the resin protrusion layer transfer member of a 4th characteristic has a resin protrusion on the board | substrate mounting surface of the board mounting base which mounts the said board | substrate in the processing chamber of the substrate processing apparatus which performs a plasma process on a rectangular board | substrate. A resin protrusion layer transfer member for transferring a water layer, comprising: a base sheet, a first pressure sensitive adhesive layer applied to one side of the base material sheet, a resin protrusion layer bonded to the first pressure sensitive adhesive layer, and a resin protrusion It has a 2nd adhesive layer apply | coated to the water layer, It is characterized by the above-mentioned.

The resin projection layer transfer member of the fifth aspect is the resin projection layer transfer member of the fourth aspect, wherein the resin projection layer has a cylindrical resin projection having a cross section of 0.5 to 2.0 mm in diameter and having a height of 30 to 80 µm. It is characterized in that a large number arranged in a pitch of 2 ~ 10mm.

The resin projection layer transfer member of the sixth feature is the resin projection layer transfer member of the fourth or fifth feature, wherein the resin projection is formed of polytetrafluoroethylene, epoxy resin, silicone resin, polyimide resin, or polyether resin. It is characterized by consisting of any one of a mid resin and a heat resistant rubber | gum.

The resin protrusion layer transfer member of the seventh aspect is the resin protrusion layer transfer member of any one of the fourth to sixth aspects, wherein the adhesive force between the second pressure sensitive adhesive layer and the substrate mounting surface is equal to the first pressure sensitive adhesive layer; It is characterized by greater than the adhesive force of the resin projection layer.

The resin projection layer transfer member of the eighth feature is the resin projection layer transfer member of any one of the fourth to seventh aspects, and a protective sheet is adhered on the second adhesive layer.

In order to solve the said 3rd subject, the method of forming a resin projection layer in the board | substrate mounting surface of 9th characteristic is a board mounting table which mounts the said board | substrate in the processing chamber of the substrate processing apparatus which performs a plasma process on a rectangular board | substrate. A method of forming a resin projection layer on a substrate mounting surface, comprising: a substrate sheet, a resin projection layer adhered to one surface of the substrate sheet via a first adhesive layer, and a second adhesive layer applied to the resin projection layer. An adhesion step of pressing the second pressure-sensitive adhesive layer applied to the resin protrusion layer of the resin protrusion layer transfer member onto the substrate mounting surface and adhering the resin protrusion layer to the substrate mounting surface; and the substrate sheet from the bonded resin protrusion layer It characterized by having a substrate sheet peeling step of peeling off.

The method of forming the resin projection layer on the substrate mounting surface of the tenth aspect is a method of forming the resin projection layer on the substrate mounting surface of the ninth aspect, wherein the resin projection layer has a cross section of 0.5 to 2.0 mmφ and has a height. It is characterized in that a large number of 30 ~ 80㎛ cylindrical resin projections arranged in a pitch of 2 ~ 10mm.

The method for forming the resin projection layer on the substrate mounting surface of the eleventh aspect is a method of forming the resin projection layer on the substrate mounting surface of the ninth or tenth aspect, wherein the resin projection is polytetrafluoroethylene, An epoxy resin, a silicone resin, a polyimide resin, a polyetherimide resin, and heat resistant rubber are comprised, It is characterized by the above-mentioned.

A method of forming the resin projection layer on the substrate mounting surface of the twelfth feature is a method of forming the resin projection layer on the substrate mounting surface of any one of the ninth to eleventh features, wherein the substrate mounting surface is used for alumina. The desert is formed, and the adhesive force between the second pressure sensitive adhesive layer and the alumina thermal sprayed coating is larger than that of the first pressure sensitive adhesive layer and the resin protrusion layer.

The method of forming the resin projection layer on the substrate mounting surface of the thirteenth feature is a method of forming the resin projection layer on the substrate mounting surface of any one of the ninth to twelfth features. A protective sheet is bonded to the second pressure sensitive adhesive layer, and a protective sheet peeling step of peeling the protective sheet is provided at the front end of the bonding step.

The method of forming the resin projection layer on the substrate mounting surface of the fourteenth aspect is a method of forming the resin projection layer on the substrate mounting surface of any one of the ninth to thirteenth aspects, wherein the rear end of the substrate sheet peeling step is performed. And (iii) an application step of applying a coating agent to cover the resin projection layer adhered to the substrate mounting surface.

According to the board | substrate mounting base of this invention, the groove | channel which originates in the material of a board | substrate mounting surface is not cut out to the back surface of the board | substrate mounted on the board | substrate mounting surface. Moreover, according to the resin protrusion layer transfer member of this invention, the resin protrusion layer which consists of many resin protrusions can be formed in the board | substrate mounting surface of the board | substrate mounting board at once. Moreover, according to the method of forming a resin protrusion layer on the board | substrate mounting surface of this invention, a resin protrusion layer can be formed on a board | substrate mounting surface, without heating a board | substrate mounting table.

1 is a cross-sectional view showing a schematic configuration of a substrate processing apparatus to which a substrate mounting table according to an embodiment of the present invention is applied;
2 is a cross-sectional view showing a schematic configuration of a resin protrusion layer transfer member according to an embodiment of the present invention;
3 is a process chart of a method of forming a resin projection layer on a substrate mounting surface according to an embodiment of the present invention;
4 is a plan view showing the board mounting surface of the board mounting table according to the present invention, wherein the resin mounting layer is formed on the board mounting surface.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described concretely, referring drawings.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows schematic structure of the substrate processing apparatus to which the board mounting base which concerns on embodiment of this invention is applied. This substrate processing apparatus performs predetermined plasma processing on the glass substrate for liquid crystal display device (LCD) manufacture, for example.

In FIG. 1, the substrate processing apparatus 10 has the processing chamber (chamber) 11 which accommodates the rectangular glass substrate G (henceforth simply a "substrate"), for example, one side several m. 11) The mounting table (susceptor) 12 which mounts the board | substrate G is arrange | positioned below in the figure inside. The susceptor 12 is composed of, for example, a base 13 made of aluminum whose surface is anodized, and the base 13 has a bottom of the chamber 11 with an insulating member 14 interposed therebetween. It is supported by wealth. The base material 13 exhibits a cross-sectional convex shape, and an electrostatic chuck 54 incorporating the electrostatic electrode plate 16 is provided on the upper side thereof, and the upper plane is a substrate mounting surface 13a on which the substrate G is mounted.

The sealing ring 15 as a shield member is provided so that the circumference | surroundings of the board | substrate mounting surface 13a may be provided, and the sealing ring 15 is a combination of the ring component parts which are long shape objects comprised, for example from insulating ceramics, such as alumina. Consists of

When the direct current power source 17 is connected to the electrostatic electrode plate 16, and a positive DC voltage is applied to the electrostatic electrode plate 16, the electrostatic electrode on the substrate G mounted on the substrate mounting surface 13a is provided. A negative potential is generated on the surface on the plate 16 side (hereinafter referred to as the "rear surface"), which causes a potential difference between the electrostatic electrode plate 16 and the back surface of the substrate G. The substrate G is adsorbed and held on the substrate mounting surface 13a by the Coulomb force or the Johnson-rahbek force due to the potential difference.

The inside of the base material 13 is provided with the temperature control mechanism (not shown) for adjusting the temperature of the board | substrate G mounted in the base material 13 and the board | substrate mounting surface 13a. With this temperature regulating mechanism, for example, a coolant such as cooling water or powdered dendritic powder is circulated and supplied, and the substrate 13 cooled by the coolant cools the substrate G.

In the periphery of the base material 13, the insulating ring 18 as a side sealing member which covers the side surface containing the junction part of the sealing ring 15 and the base material 13 is arrange | positioned. The insulating ring 18 is made of an insulating ceramic such as alumina.

The lifting pins 21 are inserted into the through-holes through the bottom wall of the chamber 11, the insulating member 14, and the base material 13 so as to be able to move up and down. The lifting pins 21 operate at the time of carrying in and out of the substrate G mounted on the substrate mounting surface 13a, and the susceptor is used to carry the substrate G into or out of the chamber 11. It rises to the upper conveyance position of (12), and when it is other, it is accommodated in the embedding state in the board | substrate mounting surface 13a.

A plurality of heat transfer gas supply holes (not shown) are opened in the substrate mounting surface 13a. The plurality of heat transfer gas supply holes are connected to the heat transfer gas supply section, and, for example, helium (He) gas is supplied from the heat transfer gas supply section to the gap between the substrate mounting surface 13a and the back surface of the substrate G. The helium gas supplied to the gap between the substrate mounting surface 13a and the rear surface of the substrate G effectively transfers the heat of the substrate G to the susceptor 12.

A high frequency power supply 23 for supplying high frequency power is connected to the base material 13 of the susceptor 12 through a matching device 24. From the high frequency power supply 23, for example, a high frequency power RF of 13.56 MHz is applied, and the susceptor 12 functions as a lower electrode. The matcher 24 reduces the reflection of the high frequency power from the susceptor 12 to maximize the application efficiency of the high frequency power to the susceptor 12.

In the substrate processing apparatus 10, the side exhaust path 26 is formed by the inner wall of the chamber 11 and the side surface of the susceptor 12. The side air exhaust passage 26 is connected to the exhaust device 28 via an exhaust pipe 27. The turbo molecular pump (TMP) and the dry pump (DP) (both not shown) as the exhaust device 28 vacuum-reduce the inside of the chamber 11 by vacuum suction. Specifically, the DP depressurizes the inside of the chamber 11 from the atmospheric pressure to the medium vacuum state (for example, 1.3 x 10 Pa (0.1 Torr or less)), and the TMP cooperates with the DP to operate the medium vacuum in the chamber 11. The pressure is reduced to a high vacuum state (for example, 1.3 × 10 ⁻³ Pa (1.0 × 10 ⁻⁵ Torr or less)) which is a pressure lower than the state. In addition, the pressure in the chamber 11 is controlled by an APC valve (not shown).

In the ceiling part of the chamber 11, the shower head 30 is arrange | positioned so that the susceptor 12 may be opposed. The shower head 30 has an internal space 31 and has a plurality of gas holes 32 for discharging the processing gas into the processing space S between the susceptor 12. The shower head 30 is grounded and comprises a pair of parallel flat electrodes with the susceptor 12 which functions as a lower electrode.

The shower head 30 is connected to the processing gas supply source 39 via the gas supply pipe 36. The gas supply pipe 36 is provided with an on-off valve 37 and a mass flow controller 38. Moreover, the board | substrate carrying in / out port 34 is provided in the side wall of the process chamber 11, and this board | substrate carrying in / out 34 is openable by the gate valve 35 and can open and close. Then, the substrate G to be processed is carried in and out through the gate valve 35.

In the substrate processing apparatus 10, a process gas is supplied from the process gas supply source 39 via the process gas introduction pipe 36. The supplied processing gas is introduced into the processing space S of the chamber 11 via the internal space 31 and the gas hole 32 of the shower head 30. The introduced process gas is excited by the high frequency power RF for plasma generation applied from the high frequency power supply 23 via the susceptor 12 to the processing space S to be plasma. Ions in the plasma are attracted toward the substrate G, and a predetermined plasma etching process is performed on the substrate G.

The operation of each component of the substrate processing apparatus 10 is controlled by a CPU of a controller (not shown) included in the substrate processing apparatus 10 according to a program corresponding to the plasma etching process.

Next, the resin protrusion layer transfer member applied when forming a resin protrusion layer on the board | substrate mounting surface 13a of the board mounting table 12 in the substrate processing apparatus 10 of FIG. 1 is demonstrated.

2 is a cross-sectional view showing a schematic configuration of a resin protrusion layer transfer member according to an embodiment of the present invention.

In FIG. 2, the resin protrusion layer transfer member 40 includes a base sheet 41, a first pressure sensitive adhesive layer 42 applied to one surface of the base sheet 41, and a first pressure sensitive adhesive layer ( 42 is a resin protrusion layer 43 in which a plurality of resin protrusions 43a adhered to each other are arranged, and a second pressure-sensitive adhesive layer coated on the surface of each protrusion 43a of the resin protrusion layer 43 ( 44). The protective sheet 45 is stuck to the surface of the 2nd adhesive layer 44 as needed. Thereby, foreign matter adheres to the surface of the resin protrusion layer 43, and a clean state can be ensured.

The resin protrusion layer transfer member 40 is manufactured as follows, for example.

For example, a base sheet 41 having a thickness of 50 to 100 μm made of polyethylene terephthalate (PET) is prepared, and one side of the base sheet 41 is uniformly coated with an acrylic adhesive as a first adhesive by a coater. The first adhesive layer 42 is formed. The thickness of the 1st adhesive layer 42 is 30-100 micrometers, for example.

Next, the resin protrusion 43a adheres to the 1st adhesive layer 42 the resin protrusion layer 43 arrange | positioned many in the embossing shape, for example. Specifically, the resin projection layer 43 is formed by punching out a sheet-like object made of Teflon (registered trademark), for example, using a punched metal template in which a plurality of holes are formed. On the formed embossed resin projection layer 43, the surface on which the first pressure sensitive adhesive layer 42 is applied on the base sheet 41 to which the first pressure sensitive adhesive layer 42 is applied is pressed to wind up the resin projection layer 43. .

The silicone-based adhesive is formed on the surface of the resin protrusion layer 43 thus formed, that is, on the surface opposite to the surface contacting the first pressure-sensitive adhesive layer 42 in the resin protrusion 43a of the resin protrusion layer 43. The pressure-sensitive adhesive is applied by, for example, a coater to form the second pressure-sensitive adhesive layer 44 to form the resin protrusion layer transfer member 40. The thickness of a 2nd adhesive layer is 10-30 micrometers, for example.

According to this embodiment, the resin protrusion layer 43 which consists of many resin protrusions 43a is adhere | attached on one surface of the base material sheet 41 with the 1st adhesive layer 42 interposed, Since the 2nd adhesive layer 44 was apply | coated, it presses the 2nd adhesive layer 44 to the board | substrate mounting surface as a transfer material which transfers the resin protrusion layer 43, and after that, peeling off the base material sheet 41 Thereby, the resin protrusion layer 43 which consists of many resin protrusions 43a can be formed in the board | substrate mounting surface at once.

In the present embodiment, in addition to PET, PP, polyester, or the like can be used as the base sheet 41. As the first pressure-sensitive adhesive for forming the first pressure-sensitive adhesive layer 42, silicone, rubber-based pressure-sensitive adhesive, etc. can be used in addition to acrylics, and as the second pressure-sensitive adhesive for forming the second pressure-sensitive adhesive layer 44, for example, An acrylic adhesive etc. can be used. As the protective sheet 45, for example, PET, PP or the like is suitably applied.

Next, the method of forming a resin protrusion layer on the board | substrate mounting surface which concerns on embodiment of this invention is demonstrated.

3 is a flowchart of a method of forming a resin projection layer on a substrate mounting surface according to an embodiment of the present invention.

When forming the resin projection layer on the substrate mounting surface of the substrate mounting table, it is preferable to provide a stepped portion protruding around the substrate mounting surface by the same height as the thickness of the resin projection layer formed on the substrate mounting surface. Thereby, peeling, damage, etc. in the resin protrusion layer formed in the board | substrate mounting surface can be avoided, and the heat transfer gas supplied on a mounting surface can be sealed and heat transfer efficiency can be improved.

Hereinafter, using the resin protrusion layer transfer member 40 of FIG. 2, the method of forming a resin protrusion layer in the board | substrate mounting surface of the board mounting base which has a level | step difference part around the board mounting surface is demonstrated.

First, a board mounting table having a stepped portion around the board mounting surface is prepared (FIG. 3A). The substrate mounting table 12 is mainly composed of a base material 13 made of anodized aluminum and an electrostatic chuck 54 provided in the upper plane of the convex portion of the base material 13. The electrostatic chuck 54 is composed of an insulating alumina (Al ₂ O ₃ ) layer 52 and an electrostatic electrode plate 16 embedded in the alumina layer 52, and of the upper plane of the alumina layer 52. It has the step part 56 of the same height as the resin protrusion layer formed in the board | substrate mounting surface around.

Next, the 2nd adhesive agent apply | coated to the resin protrusion layer 43 of the resin protrusion layer transfer member 40 of FIG. 2 to the board | substrate mounting surface 13a of the electrostatic chuck 54 in such a board | substrate mounting table 12. Next, as shown in FIG. Layer 44 is bonded. Specifically, the protective sheet 45 of the resin protrusion layer transfer member 40 is peeled off (protective sheet peeling step), whereby the resin protrusion layer 43 in which a plurality of resin protrusions 43a are arranged in an embossed shape. ), The second pressure-sensitive adhesive layer 44 on the resin protrusion layer 43 is bonded to the substrate mounting surface 13a in this state, and the resin protrusion layer 43 is bonded (Fig. 3 (b)).

Next, one surface of the base sheet 41 of the resin protrusion layer transfer member 40 in the state where the resin protrusion layer 43 is adhered to the substrate mounting surface 13a is evenly directed toward the substrate mounting surface 13a. By pressing, the resin protrusion layer 43 is firmly bonded to the substrate mounting surface 13a. In this way, after sticking the resin protrusion layer 43, the base material sheet 41 is peeled off slowly. Thereby, the board | substrate mounting table in which the resin protrusion layer 43 was transferred to the board | substrate mounting surface 13a is obtained (FIG. 3 (c)).

Next, if necessary, a coating layer is formed so as to cover the resin protrusion layer 43 on the substrate mounting surface on which the embossed resin protrusion layer 43 is formed. As the coating agent, for example, a silicone resin is suitably used. Thereby, the adhesive force of the resin protrusion layer 43 of the embossing shape formed in the board | substrate mounting surface 13a can be improved, and strength can be ensured.

4 is a plan view showing the substrate mounting surface 13a of the substrate mounting table on which the resin protrusion layer 43 is formed on the substrate mounting surface 13a.

In FIG. 4, the resin protrusion layer 43 in which the resin protrusion 43a is arranged in the embossing shape is formed in the board | substrate mounting surface 13a of the board | substrate mounting table 12. As shown in FIG.

According to the present embodiment, the resin protrusion layer 43 is transferred to the substrate mounting surface 13a by means of an adhesive to be bonded to the substrate mounting surface 13a without heating the substrate mounting table 12. The resin protrusion layer 43 can be formed in the. Therefore, it can fully apply also to the board | substrate mounting table where heat resistance temperature is low, for example 100 degrees C or less.

In addition, since a special processing apparatus or jig is not required by a simple method, the resin projection layer 43 can be easily installed and reinstalled on the site.

In the present embodiment, the size of the resin protrusion 43a in the resin protrusion layer 43 is, for example, a cylinder having a cross section of 0.5 to 2.0 mmφ and a height of, for example, 30 to 80 μm. The pitch of the resin protrusion 43a is 5 mm, for example. Therefore, tens of thousands of resin protrusions 43a are formed on the substrate mounting surface 13a. It is preferable that the pitch of the resin protrusion 43a is 2-10 mm, More preferably, it is 4-7 mm. If the pitch is too small, it is difficult to form the projection layer, and if it is too large, the strength as the projection may be insufficient.

In the present embodiment, examples of the constituent material of the resin protrusion 43a include polytetrafluoroethylene (Teflon (registered trademark)), epoxy resin, silicone resin, polyimide resin, polyetherimide resin, and viton. Heat resistant rubber and the like can be applied, and in particular, Teflon (registered trademark) is suitably used.

By using Teflon (registered trademark) as a constituent material of the resin protrusion 43a, the following effects are obtained.

Teflon (registered trademark) has corrosion resistance and is resistant to various processing gases applied to plasma treatment. In addition, since Teflon (registered trademark) has a lower thermal conductivity than alumina, when Teflon (registered trademark) is used as the material of the projection and when alumina is used, the substrate mounting surface 13a and the substrate mounting surface 13a are used. The difference between the heat transfer method via the helium gas for heat transfer supplied to the gap between the back surface of the substrate G mounted on the substrate and the heat transfer method via the protrusion is smaller when using Teflon (registered trademark) for the protrusion, The occurrence of etching spots due to the heat distribution on the back surface of the substrate G can be suppressed. In addition, since Teflon (registered trademark) has a low dielectric constant and does not generate singular points such as extreme peaks in the electric field intensity distribution formed with helium gas, occurrence of etching spots due to the electric field distribution in the substrate G is prevented. It can be suppressed. In addition, since Teflon (registered trademark) has good slipperiness and less wear, it can be easily cleaned by wiping, for example.

In this embodiment, it is preferable that the adhesive force of the 2nd adhesive layer applied to the resin protrusion layer transfer member 40 is larger than the adhesive force of a 1st adhesive layer, More specifically, for example, an alumina thermal sprayed coating The first adhesive layer to which the adhesive force A of the alumina which comprises the board | substrate mounting surface 13a formed by 52, and the 2nd adhesive layer apply | coated on the surface of the resin protrusion layer 43 were apply | coated to the base material sheet 41 It is preferable to select each adhesive layer so that it may become larger than the adhesive force B of the resin protrusion layer 43 and it. Thereby, after sticking the resin protrusion layer 43 in the resin protrusion layer transfer member 40 to the board | substrate mounting surface 13a, when peeling the base material sheet 41, the resin protrusion layer 43 is a base material. It does not adhere to the sheet | seat 41, and peels from the board | substrate mounting surface 13a, and the resin protrusion layer 43 of the resin protrusion layer transfer member 40 can be reliably transferred to the board | substrate mounting surface 13a. On the other hand, in order to prevent the resin protrusion layer 43 from peeling from the base sheet 41 when peeling off the protective sheet 45, the adhesive force C of the protective sheet 45 and the 2nd adhesive layer is weaker than the said adhesive force B. The material must be selected from the protective sheet or non-tacked on the protective sheet.

According to the board | substrate mounting board which formed the resin protrusion layer 43 in which the some resin protrusion 43a was arrange | positioned at the board | substrate mounting board which concerns on this embodiment, ie, the board mounting surface on which the board | substrate is mounted, the board | substrate mounting board 13a There is no groove on the back surface of the substrate G mounted on the substrate. In addition, since the substrate can be supported by point contact, the opportunity to deposit deposits such as reaction by-products on the back surface of the substrate can be reduced.

In each of the above-described embodiments, the substrate is not only a glass substrate for liquid crystal display (LCD) but also various kinds of substrates used for flat panel display (FPD), including an electroluminescence (EL) display, a plasma display panel (PDP), and the like. It may be a substrate.

10: substrate processing apparatus
12: Board Mount (Susceptor)
13: substrate
13a: substrate mounting surface
40: resin protrusion layer transfer member
41: base material sheet
42: first pressure sensitive adhesive layer
43: resin projection layer
43a: resin projection
44: second pressure sensitive adhesive layer

Claims (14)

delete delete delete As a resin protrusion layer transfer member which transfers a resin protrusion layer to the board | substrate mounting surface of the board mounting base which mounts the said board | substrate in the processing chamber of the substrate processing apparatus which performs a plasma process on a rectangular board | substrate,
A base sheet,
A first pressure-sensitive adhesive layer applied to one side of the base sheet,
A resin protrusion layer adhered to the first pressure sensitive adhesive layer,
2nd adhesive layer apply | coated to the said resin protrusion layer
Resin protrusion layer transfer member having a.
5. The method of claim 4,
The resin protrusion layer has a cross section of 0.5 to 2.0 mmφ, and a plurality of cylindrical resin protrusions having a height of 30 to 80 μm are arranged at a pitch of 2 to 10 mm.
The method according to claim 4 or 5,
The resin protrusion layer transfer member is composed of any one of polytetrafluoroethylene, epoxy resin, silicone resin, polyimide resin, polyetherimide resin, and heat resistant rubber.
The method according to claim 4 or 5,
The adhesive force of the said 2nd adhesive layer and the said board | substrate mounting surface is larger than the adhesive force of the said 1st adhesive layer and said resin protrusion layer, The resin protrusion layer transfer member characterized by the above-mentioned.
The method according to claim 4 or 5,
A protective sheet is adhered on the second pressure sensitive adhesive layer, characterized in that the resin projection layer transfer member.
A method of forming a resin projection layer on a substrate mounting surface of a substrate mounting table on which a substrate is mounted in a processing chamber of a substrate processing apparatus that performs a plasma treatment on a rectangular substrate,
On the resin protrusion layer of the resin protrusion layer transfer member which has a base material sheet, the resin protrusion layer adhere | attached on one side of the said base material sheet with the 1st adhesive layer interposed, and the 2nd adhesive layer apply | coated to the said resin protrusion layer. An adhesive step of adhering the resin projection layer to the substrate mounting surface by pressing the applied second adhesive layer onto the substrate mounting surface;
Base sheet peeling step of peeling the base sheet from the bonded resin protrusion layer
A method of forming a resin projection layer on a substrate mounting surface comprising a.
The method of claim 9,
The resin protrusion layer is formed by arranging a plurality of cylindrical resin protrusions having a cross section of 0,5 to 2,0 mm, and a columnar resin protrusion having a height of 30 to 80 μm at a pitch of 2 to 10 mm. How to form a water layer.
11. The method according to claim 9 or 10,
The resin projections are formed of any one of polytetrafluoroethylene, epoxy resin, silicone resin, polyimide resin, polyetherimide resin, and heat resistant rubber.
11. The method according to claim 9 or 10,
The alumina thermal sprayed coating is formed in the said board | substrate mounting surface,
The adhesive force between the second pressure sensitive adhesive layer and the alumina thermal sprayed coating is greater than that between the first pressure sensitive adhesive layer and the resin protrusion layer.
A method of forming a resin projection layer on a substrate mounting surface, characterized in that.
11. The method according to claim 9 or 10,
A protective sheet is bonded to the second pressure sensitive adhesive layer of the resin protrusion layer transfer member, and a protective sheet peeling step of peeling the protective sheet is carried out at the front end of the bonding step. The method of forming a resin protrusion layer.
11. The method according to claim 9 or 10,
And a coating step of applying a coating agent to a rear end of the substrate sheet peeling step so as to cover the resin protrusion layer adhered to the substrate mounting surface.

Images