JP2012028622A - Substrate mounting table, resin protrusion layer formation method on substrate mounting surface, and resin protrusion layer transfer member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin protrusion layer formation method on a substrate mounting surface, capable of forming a resin protrusion layer on the substrate mounting surface without heating a substrate mounting table.SOLUTION: The resin protrusion layer formation method includes: an adhesion step for adhering a resin protrusion layer 43 on a substrate mounting surface 13a, by depressing to the substrate mounting surface 13a a second adhesive agent layer 44 coated on the resin protrusion layer 43 of a resin protrusion layer transfer member 40, including a base material sheet, the resin protrusion layer 43 adhered to one surface of the base material sheet via a first adhesive agent layer, and the second adhesive agent layer 44 coated on the resin protrusion layer 43; and a base material sheet exfoliation step for exfoliating the base material sheet from the adhered resin protrusion layer 43.

Description

  The present invention relates to a substrate mounting table for mounting a substrate in a processing chamber of a substrate processing apparatus, a method for forming a resin protrusion layer on a substrate mounting surface of the substrate mounting table, and a resin protrusion layer transfer member applied to this method About.

  2. Description of the Related Art A substrate processing apparatus that performs plasma processing on various substrates including a glass substrate in a manufacturing process of an FPD (Flat Panel Display) including a liquid crystal display device (LCD) is known.

  In such a substrate processing apparatus, a substrate mounting table that supports a glass substrate (hereinafter simply referred to as “substrate”) in a processing chamber (hereinafter referred to as “chamber”), the substrate mounting table and a processing space are provided. A high-frequency power (RF) for plasma generation is applied to a substrate mounting table that functions as a lower electrode, and a processing gas is introduced into the processing space to generate plasma. A predetermined plasma process is performed on the substrate placed on the substrate placement surface of the substrate placement table using the generated plasma.

An alumina (AL ₂ O ₃ ) sprayed film is usually formed as an insulating layer on the substrate mounting surface of the substrate mounting table. The hardness of alumina constituting the alumina sprayed film is about HV1000, which is harder than HV640, which is a general glass substrate hardness, and thus the substrate was placed on the substrate mounting table and electrostatically adsorbed by the electrostatic chuck. However, there is a problem that the back surface of the substrate is damaged by the alumina sprayed film.

  On the other hand, when a substrate is placed on a flat substrate placement surface, there is a problem that foreign matter tends to adhere to the back surface of the substrate. To avoid this, a protrusion layer is formed on the substrate placement surface. Attempts have been made to support the substrate by point contact, and a technique for forming a projection layer having a large number of projections on the substrate mounting surface has been developed (see, for example, Patent Document 1).

JP 2008-251574 A

  However, in order to prevent the adhesion of foreign substances such as dust and to prevent the back surface of the substrate from being scratched, it is necessary to form protrusions made of a material having a lower hardness than glass, which is the material of the substrate, on the substrate mounting surface. is there. In addition, it is very difficult to form a large number of protrusions on the substrate mounting surface at a time.

  By the way, as a material having a hardness lower than that of glass and applicable in a processing chamber of a substrate processing apparatus, for example, a resin such as polytetrafluoroethylene (commercial surface: Teflon (registered trademark)) can be given. As a method for transferring a Teflon (registered trademark) film or a projection made of Teflon (registered trademark) to the surface of a component, generally, a powder made of Teflon (registered trademark) is adsorbed on the transfer surface by electrostatic powder coating. However, the heat-resistant temperature of the substrate mounting table is, for example, 100 ° C. or less, and such a baking method cannot be employed.

  A first object of the present invention is to provide a substrate mounting table that does not damage the back surface of the substrate mounted on the substrate mounting surface due to the material of the substrate mounting surface. A second problem of the present invention is to provide a resin protrusion layer transfer member capable of forming a resin protrusion layer composed of a large number of resin protrusions at once on the substrate mounting surface of the substrate mounting table. is there. The third object of the present invention is to provide a method for forming a resin protrusion layer on a substrate mounting surface, which can form a resin protrusion layer on the substrate mounting surface without heating the substrate mounting table. There is.

  In order to solve the first problem, the substrate mounting table according to claim 1 is a substrate mounting table for mounting the substrate in a processing chamber of a substrate processing apparatus for performing plasma processing on a rectangular substrate, A resin protrusion layer in which a plurality of resin protrusions adhered to the substrate mounting surface via an adhesive layer is arranged is formed on the substrate mounting surface on which the substrate is mounted. And

  The substrate mounting table according to claim 2 is the substrate mounting table according to claim 1, wherein the resin protrusion layer has a columnar resin protrusion having a cross section of 0.5 to 2.0 mmφ and a height of 30 to 80 μm. It is characterized by being arranged in a large number at a pitch of 2 to 10 mm.

  The substrate mounting table according to claim 3 is the substrate mounting table according to claim 1 or 2, wherein the resin protrusions are polytetrafluoroethylene, epoxy resin, silicon resin, polyimide resin, polyetherimide resin, and heat-resistant rubber. It is characterized by being comprised by either of these.

  In order to solve the second problem, the resin protrusion layer transfer member according to claim 4 is a substrate mounting table on which the substrate is mounted in a processing chamber of a substrate processing apparatus that performs plasma processing on a rectangular substrate. A resin protrusion layer transfer member for transferring a resin protrusion layer onto a mounting surface, the substrate sheet, a first adhesive layer applied to one side of the substrate sheet, and the first adhesive It has the resin protrusion layer stuck to the layer, and the 2nd adhesive layer apply | coated to this resin protrusion layer, It is characterized by the above-mentioned.

  The resin protrusion layer transfer member according to claim 5 is the resin protrusion layer transfer member according to claim 4, wherein the resin protrusion layer has a cross section of 0.5 to 2.0 mmφ and a height of 30 to 80 μm. A large number of cylindrical resin protrusions are arranged at a pitch of 2 to 10 mm.

  The resin protrusion layer transfer member according to claim 6 is the resin protrusion layer transfer member according to claim 4 or 5, wherein the resin protrusion is polytetrafluoroethylene, epoxy resin, silicon resin, polyimide resin, polyether. It is comprised by either imide resin and heat resistant rubber, It is characterized by the above-mentioned.

  The resin protrusion layer transfer member according to claim 7 is the resin protrusion layer transfer member according to any one of claims 4 to 6, wherein the adhesive between the second pressure-sensitive adhesive layer and the substrate mounting surface is used. The force is greater than the adhesive force between the first pressure-sensitive adhesive layer and the resin protrusion layer.

  The resin protrusion layer transfer member according to claim 8 is the resin protrusion layer transfer member according to any one of claims 4 to 7, wherein a protective sheet is attached on the second pressure-sensitive adhesive layer. It is characterized by being.

  In order to solve the third problem, a method for forming a resin protrusion layer on a substrate mounting surface according to claim 9 is the method of mounting the substrate in a processing chamber of a substrate processing apparatus for performing plasma processing on a rectangular substrate. A method of forming a resin protrusion layer on a substrate mounting surface of a substrate mounting table to be placed, the base sheet and a resin protrusion bonded to one side of the base sheet via a first adhesive layer A second adhesive layer applied to the resin protrusion layer of the resin protrusion layer transfer member having an object layer and a second adhesive layer applied to the resin protrusion layer. A bonding step of pressing the resin protrusion layer on the substrate mounting surface and a base sheet peeling step of peeling the base sheet from the bonded resin protrusion layer. Features.

  The method for forming a resin protrusion layer on the substrate mounting surface according to claim 10 is the method for forming a resin protrusion layer on the substrate mounting surface according to claim 9, wherein the resin protrusion layer has a cross section of 0. A large number of cylindrical resin projections having a diameter of 5 to 2.0 mmφ and a height of 30 to 80 μm are arranged at a pitch of 2 to 10 mm.

  The method for forming a resin protrusion layer on a substrate mounting surface according to claim 11 is the method for forming a resin protrusion layer on a substrate mounting surface according to claim 9 or 10, wherein the resin protrusion is made of polytetra It is composed of any one of fluoroethylene, epoxy resin, silicon resin, polyimide resin, polyetherimide resin, and heat resistant rubber.

  The method for forming a resin protrusion layer on a substrate mounting surface according to claim 12, wherein the resin protrusion layer is formed on the substrate mounting surface according to any one of claims 9 to 11. An alumina sprayed film is formed on the mounting surface, and the adhesive force between the second adhesive layer and the alumina sprayed film is the adhesive force between the first adhesive layer and the resin protrusion layer. It is characterized by being larger than.

  The method for forming a resin protrusion layer on a substrate mounting surface according to claim 13 is the method for forming a resin protrusion layer on a substrate mounting surface according to any one of claims 9 to 12. A protective sheet is attached to the second pressure-sensitive adhesive layer of the material layer transfer member, and a protective sheet peeling step for peeling the protective sheet is provided before the sticking step.

  The method for forming a resin protrusion layer on a substrate placement surface according to claim 14 is the method for forming a resin protrusion layer on a substrate placement surface according to any one of claims 9 to 13. It has the application | coating step which apply | coats a coating agent so that the said resin protrusion layer stuck on the said board | substrate mounting surface may be covered in the back | latter stage of a material sheet peeling step.

  According to the substrate mounting table of the present invention, the back surface of the substrate mounted on the substrate mounting surface is not damaged due to the material of the substrate mounting surface. Moreover, according to the resin protrusion layer transfer member of the present invention, a resin protrusion layer composed of a large number of resin protrusions can be formed at a time on the substrate mounting surface of the substrate mounting table. Moreover, according to the method for forming the resin protrusion layer on the substrate mounting surface of the present invention, the resin protrusion layer can be formed on the substrate mounting surface without heating the substrate mounting table.

It is sectional drawing which shows schematic structure of the substrate processing apparatus with which the substrate mounting base concerning embodiment of this invention is applied. It is sectional drawing which shows schematic structure of the resin protrusion layer transfer member which concerns on embodiment of this invention. It is process drawing of the method of forming the resin protrusion layer on the board | substrate mounting surface which concerns on embodiment of this invention. FIG. 3 is a plan view showing a substrate mounting surface of the substrate mounting table according to the present invention, in which a resin protrusion layer is formed on the substrate mounting surface.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a cross-sectional view showing a schematic configuration of a substrate processing apparatus to which a substrate mounting table according to an embodiment of the present invention is applied. This substrate processing apparatus performs, for example, a predetermined plasma process on a glass substrate for manufacturing a liquid crystal display device (LCD).

  In FIG. 1, a substrate processing apparatus 10 includes a processing chamber (chamber) 11 that accommodates a rectangular glass substrate G (hereinafter simply referred to as “substrate”) with a side of several meters, for example. A mounting table (susceptor) 12 on which the substrate G is mounted is disposed below the figure. The susceptor 12 is composed of, for example, a base material 13 made of aluminum whose surface is anodized, and the base material 13 is supported on the bottom of the chamber 11 via an insulating member 14. The base material 13 has a convex cross section, and an electrostatic chuck 54 having a built-in electrostatic electrode plate 16 is installed at the top, and the upper plane is a substrate placement surface 13a on which the substrate G is placed. .

  A shield ring 15 as a shield member is provided so as to surround the periphery of the substrate mounting surface 13a. The shield ring 15 is a long component made of an insulating ceramic such as alumina, for example. It consists of a combination.

  A DC power source 17 is connected to the electrostatic electrode plate 16, and when a positive DC voltage is applied to the electrostatic electrode plate 16, the electrostatic electrode plate 16 on the substrate G placed on the substrate placement surface 13a. A negative potential is generated on the side surface (hereinafter referred to as “rear surface”), thereby generating a potential difference between the electrostatic electrode plate 16 and the rear surface of the substrate G, and Coulomb force or Johnson Rabeck resulting from the potential difference. The substrate G is attracted and held on the substrate placement surface 13a by the force.

  Inside the base material 13, a temperature adjustment mechanism (not shown) for adjusting the temperature of the base material 13 and the substrate G placed on the substrate placement surface 13a is provided. For example, coolant such as cooling water or Galden (registered trademark) is circulated and supplied to the temperature adjusting mechanism, and the base material 13 cooled by the coolant cools the substrate G.

  Around the base material 13, an insulating ring 18 is disposed as a side seal member that covers a side surface including a contact portion between the shield ring 15 and the base material 13. The insulating ring 18 is made of an insulating ceramic such as alumina.

  An elevating pin 21 is inserted in a through-hole penetrating the bottom wall of the chamber 11, the insulating member 14 and the base material 13 so as to be movable up and down. The elevating pins 21 operate when the substrate G placed on the substrate placement surface 13a is carried in and out, and when the substrate G is carried into or out of the chamber 11, the susceptor 12 is moved. The substrate moves up to the upper transfer position, and is otherwise housed in the substrate placement surface 13a.

  A plurality of heat transfer gas supply holes (not shown) are opened in the substrate mounting surface 13a. The plurality of heat transfer gas supply holes are connected to the heat transfer gas supply unit, and for example, helium (He) gas is supplied from the heat transfer gas supply unit to the gap between the substrate mounting surface 13a and the back surface of the substrate G. The The helium gas supplied to the gap between the substrate placement surface 13 a and the back surface of the substrate G effectively transfers the heat of the substrate G to the susceptor 12.

  A high frequency power source 23 for supplying high frequency power is connected to the base material 13 of the susceptor 12 via a matching unit 24. A high frequency power (RF) of 13.56 MHz, for example, is applied from the high frequency power supply 23, and the susceptor 12 functions as a lower electrode. The matching unit 24 reduces the reflection of the high frequency power from the susceptor 12 to maximize the application efficiency of the high frequency power to the susceptor 12.

In the substrate processing apparatus 10, a side exhaust path 26 is formed by the inner wall of the chamber 11 and the side surface of the susceptor 12. The side exhaust path 26 is connected to an exhaust device 28 via an exhaust pipe 27. A TMP (Turbo Molecular Pump) and a DP (Dry Pump) (both not shown) as the exhaust device 28 evacuate the chamber 11 to reduce the pressure. Specifically, DP depressurizes the inside of the chamber 11 from atmospheric pressure to a medium vacuum state (for example, 1.3 × 10 Pa (0.1 Torr) or less), and TMP cooperates with the DP to medium vacuum in the chamber 11. The pressure is reduced to a high vacuum state (for example, 1.3 × 10 ⁻³ Pa (1.0 × 10 ⁻⁵ Torr or less)) that is lower than the state. The pressure in the chamber 11 is controlled by an APC valve (not shown).

  A shower head 30 is disposed on the ceiling portion of the chamber 11 so as to face the susceptor 12. The shower head 30 has an internal space 31 and a plurality of gas holes 32 for discharging a processing gas into the processing space S between the shower head 30 and the susceptor 12. The shower head 30 is grounded and constitutes a pair of parallel plate electrodes together with the susceptor 12 functioning as a lower electrode.

  The shower head 30 is connected to a processing gas supply source 39 via a gas supply pipe 36. The gas supply pipe 36 is provided with an open / close valve 37 and a mass flow controller 38. A substrate loading / unloading port 34 is provided on the side wall of the processing chamber 11, and the substrate loading / unloading port 34 can be opened and closed by a gate valve 35. Then, the substrate G to be processed is carried in / out through the gate valve 35.

  In the substrate processing apparatus 10, the processing gas is supplied from the processing gas supply source 39 through the processing gas introduction pipe 36. The supplied processing gas is introduced into the processing space S of the chamber 11 through the internal space 31 and the gas hole 32 of the shower head 30. The introduced processing gas is excited by high-frequency power (RF) for plasma generation applied to the processing space S from the high-frequency power source 23 via the susceptor 12 and becomes plasma. Ions in the plasma are attracted toward the substrate G, and the substrate G is subjected to a predetermined plasma etching process.

  The operation of each component of the substrate processing apparatus 10 is controlled by a CPU of a control unit (not shown) provided in the substrate processing apparatus 10 according to a program corresponding to the plasma etching process.

  Next, a resin protrusion layer transfer member applied when forming a resin protrusion layer on the substrate mounting surface 13a of the substrate mounting table 12 in the substrate processing apparatus 10 of FIG. 1 will be described.

  FIG. 2 is a cross-sectional view showing a schematic configuration of the resin protrusion layer transfer member according to the embodiment of the present invention.

  In FIG. 2, the resin protrusion layer transfer member 40 includes a base sheet 41, a first adhesive layer 42 applied to one side of the base sheet 41, and the first adhesive layer 42. It is mainly composed of a resin protrusion layer 43 in which a plurality of bonded resin protrusions 43a are arranged, and a second adhesive layer 44 applied to the surface of each protrusion 43a of the resin protrusion layer 43. Has been. A protective sheet 45 is attached to the surface of the second pressure-sensitive adhesive layer 44 as necessary. Thereby, it is possible to prevent the adhesion of foreign matters to the surface of the resin protrusion layer 43 and to ensure a clean state.

  The resin protrusion layer transfer member 40 is manufactured as follows, for example.

  For example, a base sheet 41 made of polyethylene terephthalate (PET) and having a thickness of 50 to 100 μm is prepared, and an acrylic pressure-sensitive adhesive as a first pressure-sensitive adhesive is evenly applied to one side of the base sheet 41 by a coater. The first pressure-sensitive adhesive layer 42 is formed. The thickness of the 1st adhesive layer 42 is 30-100 micrometers, for example.

  Next, the resin protrusion layer 43 in which a large number of resin protrusions 43a are arranged in, for example, an embossed shape is attached to the first pressure-sensitive adhesive layer. Specifically, the resin protrusion layer 43 is formed, for example, by punching a sheet-like material made of Teflon (registered trademark) using a punching metal-like template having a large number of holes. The surface of the base sheet 41 coated with the first adhesive layer 42 is pressed against the formed embossed resin projection layer 43 to wind the resin projection layer 43. take.

  The surface of the resin protrusion layer 43 formed in this way, that is, the surface opposite to the surface of the resin protrusion 43a of the resin protrusion 43a that is in contact with the first adhesive layer 42, is used as the second adhesive. A silicone pressure-sensitive adhesive is applied by, for example, a coater to form the second pressure-sensitive adhesive layer 44, and the resin protrusion transfer member 40 is obtained. The thickness of the second pressure-sensitive adhesive layer is, for example, 10 to 30 μm.

  According to the present embodiment, the resin protrusion layer 43 composed of a large number of resin protrusions 43a is attached to one surface of the base sheet 41 via the first adhesive layer 42, and the second adhesive is attached to the surface thereof. Since the agent layer 44 is applied, the second pressure-sensitive adhesive layer 44 is pressed against the substrate mounting surface as a transfer material for transferring the resin protrusion layer 43, and then the substrate sheet 41 is peeled off to thereby remove the substrate. The resin protrusion layer 43 including a large number of resin protrusions 43a can be formed on the mounting surface at a time.

  In the present embodiment, PP, polyester or the like can be used as the base sheet 41 in addition to PET. Further, as the first pressure-sensitive adhesive forming the first pressure-sensitive adhesive layer 42, in addition to acrylic, a silicone-based or rubber-based pressure-sensitive adhesive can be used, and the second pressure-sensitive adhesive layer 44 is formed. As the pressure-sensitive adhesive 2, for example, an acrylic pressure-sensitive adhesive can be used in addition to the silicone type. As the protective sheet 45, for example, PET, PP, or the like is suitably applied.

  Next, a method for forming the resin protrusion layer on the substrate mounting surface according to the embodiment of the present invention will be described.

  FIG. 3 is a process diagram of a method for forming a resin protrusion layer on a substrate mounting surface according to an embodiment of the present invention.

  When forming the resin protrusion layer on the substrate mounting surface of the substrate mounting table, a stepped portion protruding by the same height as the thickness of the resin protrusion layer formed on the substrate mounting surface is provided around the substrate mounting surface. It is preferable to keep it. As a result, it is possible to avoid peeling, damage, etc. in the resin protrusion layer formed on the substrate mounting surface, and to seal the heat transfer gas supplied onto the mounting surface and improve the heat transfer efficiency. Can do.

  Hereinafter, a method of forming the resin protrusion layer on the substrate mounting surface of the substrate mounting table having the stepped portion around the substrate mounting surface using the resin protrusion transferring member 40 of FIG. 2 will be described.

First, a substrate mounting table having a step portion around the substrate mounting surface is prepared (FIG. 3A). The substrate mounting table 12 is mainly composed of a base material 13 made of aluminum whose surface is anodized and an electrostatic chuck 54 provided on the upper plane of the convex portion of the base material 13. The electrostatic chuck 54 includes an insulating alumina (Al ₂ O ₃ ) layer 52 and the electrostatic electrode plate 16 built in the alumina layer 52, and the substrate is placed around the upper plane of the alumina layer 52. A stepped portion 56 having the same height as the resin protrusion layer formed on the surface is provided.

  Next, the second pressure-sensitive adhesive layer 44 applied to the resin protrusion layer 43 of the resin protrusion layer transfer member 40 of FIG. 2 on the substrate mounting surface 13a of the electrostatic chuck 54 in the substrate mounting table 12 as described above. Abut. Specifically, the protective sheet 45 of the resin protrusion layer transfer member 40 is peeled off (protective sheet peeling step), thereby exposing the resin protrusion layer 43 in which a large number of resin protrusions 43a are arranged in an embossed shape. In this state, the second pressure-sensitive adhesive layer 44 on the resin protrusion layer 43 is brought into contact with the substrate mounting surface 13a, and the resin protrusion layer 43 is adhered (FIG. 3B).

  Next, one surface of the base material sheet 41 of the resin protrusion layer transfer member 40 in a state where the resin protrusion layer 43 is adhered to the substrate placement surface 13a is pressed evenly toward the substrate placement surface 13a. The protrusion layer 43 is securely attached to the substrate placement surface 13a. Thus, after sticking the resin protrusion layer 43, the base material sheet 41 is peeled off slowly. Thus, a substrate mounting table in which the resin protrusion layer 43 is transferred and formed on the substrate mounting surface 13a is obtained (FIG. 3C).

  Next, if necessary, a coating layer is formed so as to cover the resin protrusion layer 43 on the substrate mounting surface on which the embossed resin protrusion layer 43 is formed. As the coating agent, for example, a silicone resin is preferably used. Thereby, the adhesion force of the embossed resin projection layer 43 formed on the substrate mounting surface 13a can be increased and the strength can be ensured.

  FIG. 4 is a plan view showing the substrate placement surface 13a of the substrate placement table in which the resin protrusion layer 43 is formed on the substrate placement surface 13a.

  In FIG. 4, a resin protrusion layer 43 in which a large number of resin protrusions 43 a are arranged in an embossed shape is formed on the substrate mounting surface 13 a of the substrate mounting table 12.

  According to the present embodiment, since the resin protrusion layer 43 is transferred and adhered to the substrate mounting surface 13a using an adhesive, the substrate mounting surface is not heated without heating the substrate mounting table 12. The resin protrusion layer 43 can be formed on 13a. Therefore, the present invention can be sufficiently applied to a substrate mounting table having a heat resistant temperature as low as 100 ° C. or lower, for example.

  In addition, since a special processing device or jig is not required by a simple method, the resin protrusion layer 43 can be easily installed and replaced in the field.

  In the present embodiment, the size of the resin protrusion 43a in the resin protrusion layer 43 is, for example, a cylindrical shape having a cross section of 0.5 to 2.0 mmφ and a height of 30 to 80 μm, for example. The pitch of the resin protrusions 43a is, for example, 5 mm. Therefore, tens of thousands of resin protrusions 43a are formed on the substrate mounting surface 55. The pitch of the resin protrusions 43a is preferably 2 to 10 mm, and more preferably 4 to 7 mm. If the pitch is too small, it is difficult to form the protrusion layer, and if it is too large, the strength as the protrusion may be insufficient.

  In the present embodiment, as the constituent material of the resin protrusion 43a, for example, polytetrafluoroethylene (Teflon (registered trademark)), epoxy resin, silicon resin, polyimide resin, polyetherimide resin, heat-resistant rubber including Viton In particular, Teflon (registered trademark) is preferably used.

  By using Teflon (registered trademark) as a constituent material of the resin protrusion 43a, the following effects can be obtained.

  Teflon (registered trademark) has corrosion resistance and is resistant to various processing gases applied to plasma processing. In addition, since Teflon (registered trademark) has a lower thermal conductivity than alumina, the substrate mounting surface 13a and the substrate are used in the case where Teflon (registered trademark) is used as the material of the protrusion and the case where alumina is used. The difference between the way in which heat is transmitted through the heat transfer helium gas supplied to the gap between the back surface of the substrate G placed on the placement surface 13a and the way in which heat is transmitted through the protrusion is the protrusion. In the case where Teflon (registered trademark) is used, the generation of etching spots due to heat distribution on the back surface of the substrate G can be suppressed. Teflon (registered trademark) has a small dielectric constant and does not generate singular points such as extreme peaks in the electric field strength distribution formed with helium gas. Can be suppressed. Furthermore, since Teflon (registered trademark) has good slipperiness and less wear, for example, cleaning by wiping can be easily performed.

  In the present embodiment, the adhesive force of the second adhesive layer applied to the resin protrusion layer transfer member 40 is preferably larger than the adhesive force of the first adhesive layer, more specifically, For example, the adhesive force A between the alumina constituting the substrate mounting surface 13 a formed by the alumina sprayed coating 52 and the second adhesive layer applied to the surface of the resin protrusion layer 43 is applied to the base material sheet 41. It is preferable to select each pressure-sensitive adhesive layer so as to be larger than the adhesive force B between the applied first pressure-sensitive adhesive layer and the resin protrusion layer 43. Thus, after the resin projection layer 43 in the resin projection layer transfer member 40 is adhered to the substrate mounting surface 13a, the resin projection layer 43 is adhered to the substrate sheet 41 when the substrate sheet 41 is peeled off. Accordingly, the resin projection layer 43 of the resin projection layer transfer member 40 can be reliably transferred to the substrate placement surface 13a without being peeled off from the substrate placement surface 13a. On the other hand, the adhesive force C between the protective sheet 45 and the second adhesive layer is weaker than the adhesive force B in order to prevent the resin protrusion layer 43 from being peeled off from the base sheet 41 when the protective sheet 45 is peeled off. It is necessary to select a material for such a protective sheet or to perform a non-adhesive treatment on the protective sheet.

  According to the substrate mounting table according to the present embodiment, that is, the substrate mounting table in which the resin protrusion layer 43 in which the plurality of resin protrusions 43a are arranged is formed on the substrate mounting surface on which the substrate is mounted. The back surface of the substrate G placed on the placement surface 13a is not damaged. In addition, since the substrate can be supported by point contact, the chance of deposition of reaction by-products and the like on the back surface of the substrate can be reduced.

  In each of the above-described embodiments, the substrate is not only a glass substrate for a liquid crystal display (LCD) but also an FPD (Flat Panel) including an electroluminescence (EL) display, a plasma display panel (PDP), and the like. Various substrates used for (Display) may be used.

10 substrate processing apparatus 12 substrate mounting table (susceptor)
13 Base material 13a Substrate mounting surface 40 Resin protrusion layer transfer member 41 Base sheet 42 First adhesive layer 43 Resin protrusion layer 43a Resin protrusion 44 Second adhesive layer

Claims (14)

A substrate mounting table for mounting the substrate in a processing chamber of a substrate processing apparatus that performs plasma processing on a rectangular substrate,
A resin protrusion layer in which a plurality of resin protrusions adhered to the substrate mounting surface via an adhesive layer is arranged on the substrate mounting surface on which the substrate is mounted is formed. A substrate mounting table.   The resin projection layer is formed by arranging a large number of cylindrical resin projections having a cross section of 0.5 to 2.0 mmφ and a height of 30 to 80 μm at a pitch of 2 to 10 mm. Item 1. A substrate mounting table according to Item 1.   The said resin protrusion is comprised by either of the polytetrafluoroethylene, an epoxy resin, a silicon resin, a polyimide resin, a polyetherimide resin, and heat resistant rubber, The Claim 1 or 2 characterized by the above-mentioned. Substrate mounting table. A resin protrusion layer transfer member that transfers a resin protrusion layer to a substrate mounting surface of a substrate mounting table for mounting the substrate in a processing chamber of a substrate processing apparatus that performs plasma processing on a rectangular substrate,
The base material sheet, the first pressure-sensitive adhesive layer applied to one side of the base material sheet, the resin protrusion layer adhered to the first pressure-sensitive adhesive layer, and the resin protrusion layer applied A resin protrusion layer transfer member, comprising: a second pressure-sensitive adhesive layer.   The resin projection layer is formed by arranging a large number of cylindrical resin projections having a cross section of 0.5 to 2.0 mmφ and a height of 30 to 80 μm at a pitch of 2 to 10 mm. Item 5. The resin protrusion layer transfer member according to Item 4.   The said resin protrusion is comprised by either of polytetrafluoroethylene, an epoxy resin, a silicone resin, a polyimide resin, a polyetherimide resin, and heat resistant rubber, The Claim 4 or 5 characterized by the above-mentioned. Resin protrusion layer transfer member.   The adhesive force between the second adhesive layer and the substrate mounting surface is larger than the adhesive force between the first adhesive layer and the resin protrusion layer. The resin projection layer transfer member according to claim 1.   The resin protrusion layer transfer member according to any one of claims 4 to 7, wherein a protective sheet is stuck on the second pressure-sensitive adhesive layer. A method of forming a resin protrusion layer on a substrate mounting surface of a substrate mounting table for mounting the substrate in a processing chamber of a substrate processing apparatus that performs plasma processing on a rectangular substrate,
A resin having a base sheet, a resin protrusion layer bonded to one side of the base sheet via a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer applied to the resin protrusion layer A sticking step of pressing the second pressure-sensitive adhesive layer applied to the resin protrusion layer of the protrusion layer transfer member against the substrate placement surface to adhere the resin protrusion layer to the substrate placement surface;
And a base material sheet peeling step for peeling the base material sheet from the stuck resin protrusion layer. A method for forming a resin protrusion layer on a substrate mounting surface.   The resin projection layer is formed by arranging a large number of cylindrical resin projections having a cross section of 0.5 to 2.0 mmφ and a height of 30 to 80 μm at a pitch of 2 to 10 mm. Item 10. A method for forming a resin protrusion layer on a substrate mounting surface according to Item 9.   The said resin protrusion is comprised by either of polytetrafluoroethylene, an epoxy resin, a silicon resin, a polyimide resin, a polyetherimide resin, and heat resistant rubber, The Claim 9 or 10 characterized by the above-mentioned. A method of forming a resin protrusion layer on a substrate mounting surface.   An alumina sprayed film is formed on the substrate mounting surface, and an adhesive force between the second pressure-sensitive adhesive layer and the alumina sprayed film is determined between the first pressure-sensitive adhesive layer and the resin protrusion layer. The method for forming a resin protrusion layer on a substrate mounting surface according to claim 9, wherein the resin protrusion layer is larger than an adhesive force.   A protective sheet is attached to the second pressure-sensitive adhesive layer of the resin protrusion layer transfer member, and a protective sheet peeling step for peeling the protective sheet is provided in the previous stage of the sticking step. A method for forming a resin protrusion layer on a substrate mounting surface according to claim 9.   14. The method according to claim 9, further comprising an application step of applying a coating agent so as to cover the resin protrusion layer adhered to the substrate mounting surface after the base sheet peeling step. A method of forming a resin protrusion layer on the substrate mounting surface according to claim 1.

Images