JP3427304B2 - Sputtering equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to an improvement in a sputtering apparatus used for forming a thin film of a metal, a semiconductor, or the like, and more particularly, to automatically supplying a substrate to a sputtering chamber. Further, the present invention relates to a sputtering apparatus capable of performing an efficient sputtering process by enhancing a cooling effect of a substrate. 2. Description of the Related Art Generally, when forming a thin film of metal, semiconductor, or the like, a substrate to be processed is placed on a plate surface of a tray and cooled, while a high voltage is applied to a target facing the plate surface of the tray. A sputtering method using a low-temperature treatment in which sputtering is performed inside a vacuum chamber by applying a voltage is applied. Conventionally, in the sputtering method for the substrate, the substrate is placed on the plate surface of the tray through indium gallium in order to increase the contact area between the substrate having minute irregularities and the tray and enhance the cooling effect of the substrate. To be placed on the floor. [0004] The indium gallium is in a liquid state at room temperature, and is manually poured onto the plate surface of the tray. Also, the substrate is manually placed on the plate surface of the tray to prevent the indium gallium injected on the plate surface of the tray from scattering. However, injecting indium gallium and placing the substrate relying on the manual operation requires a long setup time, which is not only inefficient, but also requires the setup to be performed while the vacuum chamber is open for a long time. ,
Dust enters the inside of the vacuum chamber. Further, since indium gallium is in a liquid state, it is inevitable that the indium gallium adheres to the substrate. An object of the present invention is to provide a sputtering apparatus capable of automatically supplying a substrate to a sputtering chamber and performing an efficient sputtering process by increasing a cooling effect of the substrate. Aim. In a sputtering apparatus according to the present invention, a vacuum chamber is divided into a charging chamber and a sputtering chamber, and a gate valve for opening and closing the sputtering chamber is provided between the two chambers. With the base as a base, a mounting table for stocking a plurality of substrates, and a carrier means for automatically taking the substrate in and out of the charging chamber and the sputtering chamber are disposed in the chamber of the charging chamber, and a sputtering target is provided. And a tray for cooling the substrate by circulating the cooling water and a tray for cooling the substrate in the chamber of the sputtering chamber. On the plate surface of the tray, a concave recess capable of accommodating the substrate is provided, and a concave groove capable of inserting one side of the chuck under the substrate accommodating the inside of the recess is provided. Provided continuously from the edge of the tray to the edge of the depression,
Further, the inside of the recess is provided with an indium foil for securing a contact area of the substrate. In the sputtering apparatus according to the present invention, a loading table for stocking a plurality of substrates and a carrier arm having a chuck for holding the substrates at the tip end as carrier means are provided in the chamber of the charging chamber. Therefore, not only can the substrate be automatically and continuously supplied to the sputter chamber from the mounting table in the preparation chamber by the carrier arm, but also a concave recess capable of accommodating the substrate is provided on the plate surface of the tray to secure the contact area of the substrate. Since the indium foil to be provided is provided inside the recess, the substrate accommodated in the recess can be effectively cooled.In addition, since the substrate needs to be taken in and out of the recess, one side of the chuck is placed in the recess. By providing a concave groove on the tray surface to be inserted below the substrate to be processed accommodated in the concave part, the substrate can be reliably taken out of the concave part by the carrier arm. Let me put in. FIG. 1 shows a direct current (DC) 2 applied to the formation of a thin film of a metal or a semiconductor as an example of a sputtering apparatus.
The polar type is shown. Its sputtering apparatus has a vacuum chamber 1 which inside is kept at a low pressure of about ¹⁰ 0 ^{to 10} -2 Torr is configured on the substrate. The vacuum chamber 1 is configured by partitioning the inside into a sputtering chamber 1a and a preparation chamber 1b, and equipping a gate valve 1c for opening and closing the sputtering chamber 1a between the two chambers. As shown in FIG. 2, a cooling water tray 3 is provided inside the sputtering chamber 1a by providing a cooling water circulation system 2. This tray 3 is a substrate B
Have a plurality of concave recesses 3a, 3b... For accommodating and mounting therein. In each of the recesses 3a, 3b. A foil I is provided. The indium foil I
Can be positioned and fixed inside the recesses 3a, 3b,... By being point-bonded with a conductive adhesive as a DC bipolar sputtering device. A target T is provided inside the sputtering chamber 1a.
Is provided facing the tray 3. The target T is also preferably provided with a cooling water circulation system 4 for cooling. The target T and the tray 3 are several hundreds
The circuit is connected to apply a DC high voltage of V or more. In addition, a gas introduction system 6 for introducing a sputtering gas and a vacuum exhaust system 7 for maintaining a constant gas pressure are connected to the sputtering chamber 1a. Inside the preparation chamber 1b, there is provided a substrate carrier means 8 for automatically feeding or unloading the substrate B into or from the recesses 3a and 3b of the tray 3. The carrier means 8 has a mounting table 8a capable of stocking a plurality of substrates before and after the sputtering process. When the gate valve 1c is opened, the carrier means 8 holds the substrate with a chuck (not shown) on the distal end side so as to be in contact with the tray 3. The robot is configured as an automatic robot including a carrier arm 8b that expands and contracts or bends and extends between them. The carrier arm 8b holds the substrate B with a chuck so that the depressions 3a, 3b
Are provided in the plate surface of the tray 3 so as to extend from the peripheral edge to the edges of the recesses 3a, 3b. It is equipped so that it can be inserted inside. In the sputtering apparatus, a solid indium foil I for ensuring surface contact with a substrate is placed on a tray 3.
The indium foil I can be prevented from scattering or adhering to the substrate by supplying the substrate under any conditions. Therefore, the substrate B is supplied for the substrate supply.
Can be applied to the recesses 3a, 3b,... Of the tray 3 automatically, and efficient sputtering can be performed. Further, the substrate carrier means 8 is provided in the charging chamber 1b of the vacuum chamber 1 and operates inside the chamber 1 by automatically sending or removing the substrate B to or from the tray 3 of the sputtering chamber 1a. From
If a plurality of substrates are stocked in the charging chamber 1b,
All can be continuously processed in the vacuum of the chamber 1, and the number of times and the time for opening the vacuum chamber 1 can be reduced, so that dust is prevented from entering the inside of the vacuum chamber 1. Although the above-described embodiment has been described with reference to a direct current bipolar sputtering apparatus, the carrier means 8 for a substrate can also be applied to a high frequency sputtering apparatus. As described above, according to the sputtering apparatus of the present invention, the recess for accommodating the substrate is provided on the plate surface.
As a means for securing a contact area with the substrate, a tray provided with an indium foil inside the recessed portion is provided, so that the cooling effect of the substrate can be enhanced, and a carrier means for automatically feeding or removing the substrate into or out of the recessed portion of the tray. Is provided in the preparation chamber of the vacuum chamber, dust is prevented from entering the inside of the vacuum chamber, and efficient sputtering can be performed.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram schematically showing an entire sputtering apparatus equipped with a substrate supply apparatus for a tray according to the present invention. FIG. 2 is an explanatory view showing a tray of the apparatus in a partial side cross section. [Description of Signs] B Substrate I Indium foil 1 Vacuum chamber 1a Sputter chamber 1b Loading chamber 1c Gate valve 3 Tray 3a, 3b Tray recess 8 Carrier means 8a Substrate mounting table 8b Substrate carrier arm 9 Tray concave groove

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) C23C 14/00-14/58

Claims (1)

(57) [Claims 1] The inside is divided into a preparation chamber and a sputter chamber, and a vacuum chamber provided with a gate valve for opening and closing the sputter chamber between both chambers is used as a base, and a plurality of sheets are provided. A mounting table for stocking the substrate and a carrier means for automatically taking the substrate in and out of the chamber between the charging chamber and the sputtering chamber are disposed in the chamber of the charging chamber. In the sputtering apparatus in which the cooling tray is disposed in the chamber of the sputtering chamber, the carrier means includes a carrier arm having a chuck for holding the substrate at the tip end side, and the plate surface of the cooling tray is A concave groove capable of accommodating the substrate is provided, and a concave groove which can be inserted under the substrate accommodating one side of the chuck inside the concave portion is formed from the edge of the tray to the edge of the concave portion. A sputtering apparatus provided continuously, and further provided with an indium foil for securing a contact area of the substrate inside the recess.