JPH09102444A - Substrate treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treatment device which can prevent particle from adhering to a substrate owing to static electricity and remove particle adhering to a substrate owing to static electricity. SOLUTION: In a substrate treatment device which performs treatments such as cleaning treatment, application treatment and development treatment for a substrate 100, an ionizer 60 which generates ion is arranged in an upper part of a substrate carrying-in/out device 50 which becomes a substrate standby part, a substrate carrier device 40 or a treatment part such as a rotary cleaning part 10, a rotary application part 20 and a rotary development part 30 for neutralizing static electricity electrically.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate processing apparatus for performing a predetermined process on a substrate.

[0002]

2. Description of the Related Art In manufacturing a semiconductor device, a substrate such as a semiconductor wafer is subjected to a series of processes such as a coating process of a processing liquid, a developing process and a film forming process. In the course of such a series of processing, the substrate before or after the processing is temporarily stored in the substrate cassette. In addition, in the course of a series of treatments, a cleaning treatment using ultrapure water and a brush is performed to keep the substrate surface clean.

[0003]

However, when the substrate cassette for temporarily storing the substrate is not formed of a conductive material, static electricity is generated in the substrate cassette, and the static electricity causes dust, dust and the like in the surroundings. The particles (fine particles) of may be attracted. As a result, even if the substrate is cleaned by the cleaning process, particles are reattached to the substrate when the substrate is stored in the substrate cassette.

Further, when a film such as an oxide film or a nitride film is formed on the surface of the substrate and then the substrate is stored in a substrate cassette, the film surface itself of the substrate is affected by the static electricity generated in the substrate cassette. The film surface itself may be charged, and the film surface itself of the substrate may be charged during the cleaning process or even just by rotating the substrate. This causes the particles to reattach to the film surface of the substrate.

An object of the present invention is to provide a substrate processing apparatus capable of preventing particles from adhering to a substrate due to static electricity and removing particles adhering to the substrate due to static electricity.

[0006]

Means for Solving the Problems and Effects of the Invention In the substrate processing apparatus according to the first invention, ions for supplying ions to the substrate standby unit are provided above the substrate standby unit for waiting the substrate before or after the processing. A supply means is provided.

In the substrate processing apparatus according to the second aspect of the present invention, an ion supply means for supplying ions to the substrate transfer section is arranged above the substrate transfer section for transferring the substrate. Third
In the substrate processing apparatus according to the invention described above, an ion supply unit that supplies ions to the substrate processing unit is arranged above the substrate processing unit that performs a predetermined process on the substrate.

In the substrate processing apparatus according to the fourth aspect of the present invention, in the configuration of the substrate processing apparatus according to the third aspect of the present invention, the substrate processing section rotates the substrate to perform a predetermined processing on the substrate. It will be.

In the substrate processing apparatus according to the first to fourth aspects of the present invention, static electricity generated in the substrate standby portion, the substrate transfer portion or the substrate processing portion is neutralized and removed by the ions supplied by the ion supply means. It This prevents particles from being attracted by the static electricity and adhering to the substrate. Further, it is possible to prevent particles from adhering to the substrate due to the influence of static electricity on the substrate itself. Further, particles adhering to the substrate are removed due to the influence of static electricity.

Further, when the specific particles have a strong polarity, the ions supplied by the ion supplying means can charge the substrate standby portion, the substrate transfer portion or the substrate processing portion, or the substrate to a polarity opposite to that of the particles. it can. As a result, it is possible to prevent the specific particles from adhering to the substrate, and it is possible to remove the specific particles attached to the substrate.

Particularly, in the substrate processing apparatus according to the first aspect of the present invention, since the ion supplying means is provided above the substrate standby portion, particles are prevented from adhering to the substrate in standby and the substrate The particles attached to the substrate are removed while the substrate is on standby.

Further, in the substrate processing apparatus according to the second aspect of the present invention, since the ion supply means is provided above the substrate transfer section, it is possible to prevent particles from adhering to the substrate during transfer of the substrate. At the same time, particles attached to the substrate are removed when the substrate is transported.

Further, in the substrate processing apparatus according to the third aspect of the present invention, since the ion supplying means is provided above the substrate processing section, it is possible to prevent particles from adhering to the substrate during processing of the substrate. At the same time, particles attached to the substrate are removed during the processing of the substrate.

Particularly, in the substrate processing apparatus according to the fourth aspect of the present invention, since the ion supply means is provided above the rotary substrate processing section, static electricity is generated when the rotating substrate cuts off air, and the substrate is thus processed. The particles are prevented from adhering to the substrate, and the particles adhering to the substrate are removed during the rotation processing of the substrate.

[0015]

1 is a schematic perspective view of a substrate processing apparatus according to an embodiment of the present invention. The substrate processing apparatus of FIG. 1 is an apparatus for performing a series of processing such as cleaning processing, coating processing, development processing, adhesion strengthening processing, heating processing, cooling processing on the substrate 100, and the first substrate processing is performed on the front side. An area 100, a second substrate processing area 200 on the rear side, and a first
The transfer area 300 is provided between the substrate processing area 100 and the second substrate processing area 200.

In the first substrate processing area 100, a rotary cleaning unit (spin scrubber) 10 for cleaning the substrate,
Rotating coating unit (spin coater) for coating the processing liquid
20 and a rotary developing unit (spin developer) 30 that performs development processing are arranged. Further, in the second substrate processing area 200, the adhesion strengthening part AH for performing the adhesion strengthening process,
A substrate heating unit (hot plate) HP that performs heat treatment and a substrate cooling unit (cooling plate) C that performs cooling treatment
P is arranged. A substrate transfer device 40 is movably provided in the transfer area 300.

Further, on the side of this substrate processing apparatus,
A substrate loading / unloading device (indexer) 50 that stores the substrate 100 and that loads and unloads the substrate 100 is arranged. The substrate loading / unloading device 50 includes a plurality of substrate cassettes 51 for housing the substrates 100 and a transfer robot 54 for loading / unloading the substrates 100. The transfer robot 54 takes out the substrate 100 from the substrate cassette 51 and sends it to the substrate transfer device 40, and conversely receives the substrate 100 that has been subjected to a series of processing from the substrate transfer device 40 and returns it to the substrate cassette 51.

Further, an ionizer 60 for generating positive or negative ions is provided above the substrate loading / unloading device 50 by supporting members 61 and 62. In this embodiment, the substrate loading / unloading device 50 uses the substrate 100 before or after processing.
Corresponds to a board waiting unit for waiting. The substrate transfer device 40 corresponds to the substrate transfer unit, and the rotary cleaning unit 10, the rotary coating unit 20, and the rotary developing unit 30 correspond to the substrate processing unit. Further, the ionizer 60 corresponds to the ion supply means.

FIG. 2 is a schematic plan view of the substrate processing apparatus of FIG. The ionizer 60 is not shown in FIG. 2 shows a state in which the substrate cassette 51 is not placed on the substrate loading / unloading device 50.

As shown in FIG. 2, the rotary cleaning section 10 has a rotary substrate holding device 11 and a brush 12. The rotary cleaning unit 10 rotates a substrate at a high speed by a rotating substrate holding device 11 and cleans the substrate surface with a brush 12 while spraying ultrapure water onto the rotating substrate surface. This rotary cleaning unit 1
At 0, since the substrate, the ultrapure water and the brush 12 are insulators, static electricity is easily generated. As a result, 0.
Particles of 1 μm or less are reattached to the cleaned substrate.

The rotary coating section 20 has a rotary substrate holding device 21 and a processing liquid nozzle arm 22. The rotary coating unit 20 rotates the substrate at a predetermined number of rotations by a rotating substrate holding device 21, drops a processing liquid such as a resist on the surface of the rotating substrate by a processing liquid nozzle arm 22 and spreads it on the surface of the substrate. Furthermore, the rotary developing unit 30
It has a rotating substrate holder 31 and a developer nozzle arm 32. The rotary developing unit 30 includes a rotary substrate holding device 3
The substrate is rotated by 1, and the developing solution nozzle arm 32 supplies the developing solution to the surface of the rotating substrate. In these rotary coating section 20 and rotary developing section 30, static electricity is easily generated when the substrate rotating at high speed cuts off air. As a result, particles adhere to the processed substrate.

The substrate transfer device 40 has an arm 41 for supporting the substrate and a moving body 42 for moving the arm 41. The arm 41 includes a first substrate processing area 100 and a second substrate processing area 2 by an arm driving mechanism (not shown).
It is possible to move back and forth to the side of 00, to pass an unprocessed substrate to each processing unit, and to receive a processed substrate in each processing unit.

The substrate loading / unloading device 50 has a plurality of cassette stages 52, and each of the cassette stages 52 has a structure shown in FIG.
The substrate cassette 51 shown in FIG. A cassette detection arm 53 that detects the presence or absence of the substrate cassette 51 is attached around each cassette stage 52.

FIG. 3 is a plan view showing the substrate cassette 51 placed on one cassette stage of the substrate loading / unloading device 50. As shown in FIG. 3, the substrate cassette 51 is held by a guide member 55 made of an insulating material.

In the substrate loading / unloading device 50, the surface of the cassette stage 52 (FIG. 2) is an insulator because it is anodized. Moreover, since the guide member 55 is made of an insulating material, the substrate cassette 51 is in an electrically floating state. Therefore,
Static electricity is easily generated in the substrate cassette 51. in this case,
It is possible to remove the static electricity by providing the guide member 55 and the like with a grounding function, but the static electricity is not sufficiently removed in other portions except the grounded portion, and the effect of removing the static electricity is small as a whole.

In this embodiment, the ions generated by the ionizer 60 are supplied to the substrate loading / unloading device 50.
In particular, when the substrate processing apparatus is arranged in a down-flow type clean room, the ions generated from the ionizer 60 are efficiently supplied to the substrate loading / unloading apparatus 50 by the air flow from the upper side to the lower side.

As a result, the static electricity of the entire substrate cassette 51 is electrically neutralized by the ions and removed. Even when the film surface formed on the substrate 100 in the substrate cassette 51 is charged, the static electricity on the film surface is electrically neutralized by the ions supplied from the ionizer 60. As a result, particles are prevented from adhering to the surface of the substrate 100 due to static electricity, and the rotary cleaning unit 1
Particles attached to the substrate 100 are removed at 0, the rotary coating unit 20, the rotary developing unit 30, and the substrate transfer device 40.

When a specific particle has a strong polarity, the ionizer 60 can temporarily charge the entire substrate cassette 51 to the polarity that the particle repels. Thereby, it is possible to prevent specific particles from adhering to the substrate 100,
Moreover, the specific particles attached to the substrate 100 can be removed. Similarly, by imparting polarity to the film formed on the surface of the substrate 100, it is possible to prevent specific particles from adhering to the film surface, and remove specific particles adhering to the film surface. be able to.

In the above embodiment, the ionizer 60 is provided above the substrate loading / unloading device 50.
May be disposed above the substrate transfer device 40. In this case, static electricity generated when the substrate 100 is transported is electrically neutralized, particles are prevented from adhering to the substrate 100 due to static electricity, and particles adhering to the substrate 100 are removed.

Further, an ionizer 60 may be provided above the rotary cleaning section 10. This electrically neutralizes static electricity generated during cleaning of the substrate 100, prevents redeposition of particles on the substrate 100 due to static electricity, and completely removes particles attached to the substrate 100. As a result, the surface of the substrate 100 can be cleaned.

Further, an ionizer 60 may be provided above the rotary coating section 20 or rotary developing section 30. This electrically neutralizes static electricity generated by the high-speed rotation of the substrate 100, prevents particles from adhering to the substrate 100 due to static electricity, and removes particles adhering to the substrate 100.

The ionizer 60 may be provided above the other processing units such as the rotary edge exposure device.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic plan view of the substrate processing apparatus of FIG.

FIG. 3 is a plan view showing a substrate cassette mounted on one cassette stage of the substrate loading / unloading device in the substrate processing apparatus of FIG.

[Explanation of symbols]

 10 rotary cleaning unit 20 rotary coating unit 30 rotary developing unit 40 substrate transfer device 50 substrate loading / unloading device 51 substrate cassette 54 transfer robot 60 ionizer

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H05F 3/04 H01L 21/30 503G

Claims (4)

[Claims] 1. A substrate processing apparatus, comprising: an ion supply unit for supplying ions to the substrate standby unit, which is disposed above a substrate standby unit for waiting a substrate before or after processing. 2. A substrate processing apparatus, characterized in that an ion supply means for supplying ions to said substrate transfer section is arranged above a substrate transfer section for transferring a substrate. 3. A substrate processing apparatus, characterized in that an ion supply means for supplying ions to said substrate processing section is arranged above a substrate processing section for performing a predetermined processing on a substrate. 4. The substrate processing apparatus according to claim 3, wherein the substrate processing unit includes a rotary substrate processing unit that rotates the substrate to perform a predetermined process on the substrate.