JP2015126092A - Cleaning substrate and method for cleaning substrate processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning substrate for improving collecting performance by adsorbing foreign matter such as dust generated in a processing part of a substrate processing device, and also to provide a cleaning method capable of more surely removing the foreign matter such as dust generated in the processing part of the substrate processing device by using the cleaning substrate.SOLUTION: A cleaning substrate 10 includes the charged substrate body 14, and an adhesive layer 12 provided on the surface of the substrate body 14. The foreign matter generated in a processing part of a substrate processing device is adsorbed and collected by transporting the substrate 10 charged before being transported into the processing part of the substrate processing device.

Description

  The present invention relates to a cleaning substrate and a cleaning method for a substrate processing apparatus using the cleaning substrate.

  For example, in the photolithography technology during the manufacturing process of a semiconductor device, a photoresist is applied to a substrate such as a wafer to form a resist film, and then the resist film is exposed according to a predetermined circuit pattern. A series of lithography processes are performed in which a desired circuit pattern is formed on a resist film by developing the pattern.

  In general, such a series of processes includes a coating processing unit that applies a resist solution to a substrate transported by a transport means, and heat-treats the substrate after the resist solution coating processing and the substrate after the exposure processing. It is carried out by a coating / development processing system in which a developer is supplied to a processing unit such as a heat treatment unit or a development processing unit that performs development processing by supplying a developer to the substrate after exposure processing.

  In general, in this type of coating / development processing system, in order to prevent dust such as particles from adhering to the wafer or the like in the transfer unit or processing unit of the wafer or the like, clean air in the local space of the transfer unit or processing unit. The airflow is controlled such as flowing through the downflow.

  However, due to the miniaturization of the dust control particles, electrostatic adsorption onto a wafer or the like is the main cause, and conventional airflow control alone is insufficient. In addition, in a heat processing unit or a vacuum processing unit that requires heat uniformity, there is a problem that the atmosphere in the processing unit cannot be replaced with clean air, and dust adheres to the wafer or the like.

  As a method of suppressing dust generation in the processing unit by methods other than airflow control and reducing the amount of dust adhering to the wafer etc., dust can be collected before the wafer etc. is carried into the processing unit and processed. There is known a method in which a collecting plate in a proper state is carried into a processing unit, and dust generated in the processing unit is attached to the collecting plate and collected (see, for example, Patent Document 1).

JP 2008-277480 A

  In a cleaning method for a substrate processing apparatus as disclosed in Patent Document 1, a charged collection plate is conveyed into a processing unit, and dust is adsorbed by attractive force due to static electricity. However, simply charging the collection plate may cause dust adhering to the collection plate to fall off due to charge neutralization and contaminate the body of the substrate processing apparatus. In addition, when the collection plate is used in a vacuum, there is a risk that dust adsorbed on the collection plate in a vacuum will blow off due to a change in pressure when the collection plate is transported to the atmosphere. there were.

  The present invention has been made in consideration of the above points, and provides a cleaning substrate with improved performance of collecting foreign matters such as dust generated in a processing section of a substrate processing apparatus. For the purpose.

  Another object of the present invention is to provide a cleaning method for a substrate processing apparatus capable of more reliably removing foreign matters such as dust generated in a processing section of the substrate processing apparatus by using such a cleaning substrate. There is.

  The cleaning substrate of the present invention is a cleaning substrate for cleaning a substrate processing apparatus, and includes a charged substrate main body and an adhesive layer provided on the surface of the substrate main body. It collects by adsorb | sucking the foreign material which generate | occur | produces in this processing part.

  According to such a cleaning substrate, not only the static electricity is charged, but also the adhesive layer is made sticky, thereby increasing the force for collecting the adsorbed foreign matter, thereby improving the cleaning efficiency. Can do. It is also efficient for substrate processing equipment in which foreign matter collected due to pressure changes, etc. may drop due to increased force to collect foreign matter, such as dry etching equipment using vacuum. Cleaning can be performed automatically. In addition, since the above-described cleaning substrate is a non-contact adsorption method using static electricity, it is possible to clean a place where a human hand usually does not enter by simply transporting such a cleaning substrate. In addition, since it is not necessary to stop the substrate processing apparatus in order to carry out such cleaning, the operating rate can be improved.

  In the cleaning substrate of the present invention, the adhesive layer may be made of an adhesive tape.

  In this case, the adhesive tape may be made of a fluororesin or a polyimide resin.

  The cleaning substrate of the present invention is a cleaning substrate for cleaning a substrate processing apparatus, and includes a charged substrate body having irregularities on the surface thereof, and is generated in a processing section of the substrate processing apparatus. It collects by adsorbing a foreign material.

  According to such a cleaning substrate, not only is static electricity charged, but also the surface area is increased by forming irregularities on the surface, thereby increasing the force to collect the adsorbed foreign matter, thereby cleaning the substrate. Efficiency can be improved. It is also efficient for substrate processing equipment in which foreign matter collected due to pressure changes, etc. may drop due to increased force to collect foreign matter, such as dry etching equipment using vacuum. Cleaning can be performed automatically. In addition, since the above-described cleaning substrate is a non-contact adsorption method using static electricity, it is possible to clean a place where a human hand usually does not enter by simply transporting such a cleaning substrate. In addition, since it is not necessary to stop the substrate processing apparatus in order to carry out such cleaning, the operating rate can be improved.

  A cleaning method for a substrate processing apparatus according to the present invention is a cleaning method for a substrate processing apparatus including a processing unit for processing a substrate, and includes a substrate body and a cleaning layer provided on a surface of the substrate body. A step of charging the cleaning substrate, and a step of bringing the charged cleaning substrate into the processing section and collecting and collecting foreign matter generated in the processing section before the substrate processing. And.

  According to such a cleaning method for a substrate processing apparatus, foreign substances such as dust generated in the processing section of the substrate processing apparatus can be more reliably removed by using the cleaning substrate.

  In the cleaning method for a substrate processing apparatus of the present invention, the step of charging the cleaning substrate having the substrate main body and the adhesive layer provided on the surface of the substrate main body may be performed in the body of the substrate processing apparatus. Good.

  In the cleaning method for a substrate processing apparatus of the present invention, the cleaning substrate in which foreign matter is collected is transported to a cleaning unit provided in the body of the substrate processing apparatus, and is collected on the cleaning substrate in the cleaning unit. There may be further provided a step of removing the extraneous matter by washing.

  The cleaning method for a substrate processing apparatus of the present invention is a cleaning method for a substrate processing apparatus provided with a processing section for processing a substrate, and the step of charging a cleaning substrate having a substrate body provided with irregularities on the surface thereof And before the substrate is processed, the charged cleaning substrate is carried into the processing section, and foreign matter generated in the processing section is attached to the cleaning substrate and collected. It is characterized by.

  According to such a cleaning method for a substrate processing apparatus, foreign substances such as dust generated in the processing section of the substrate processing apparatus can be more reliably removed by using the cleaning substrate.

  In the cleaning method for a substrate processing apparatus of the present invention, the cleaning substrate in which foreign matter is collected is transported to a cleaning unit provided in the body of the substrate processing apparatus, and is collected on the cleaning substrate in the cleaning unit. There may be further provided a step of removing the extraneous matter by washing.

  According to the cleaning substrate of the present invention, it is possible to improve the performance of collecting by adsorbing foreign matter such as dust generated in the processing section of the substrate processing apparatus.

  In addition, according to the cleaning method of the substrate processing apparatus, foreign substances such as dust generated in the processing section of the substrate processing apparatus can be more reliably removed by using such a cleaning substrate.

It is a top view of the substrate for cleaning by an embodiment of the invention. It is a sectional side view by the AA arrow of the substrate for cleaning shown in FIG. It is a figure which shows the state when charging the board | substrate for cleaning shown in FIG. 1 etc. with a charging device. It is a top view of other composition of a substrate for cleaning by an embodiment of the invention. It is a sectional side view by the BB arrow of the substrate for cleaning shown in FIG. 1 is a perspective view showing a configuration of a substrate processing apparatus in which cleaning is performed by a cleaning substrate according to an embodiment of the present invention. It is a schematic block diagram which shows the outline of the internal structure of the substrate processing apparatus shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings. 1 to 7 are diagrams showing a cleaning substrate and a substrate processing apparatus in which cleaning is performed by the cleaning substrate according to the present embodiment. Among these, FIG. 1 is a top view of the cleaning substrate according to the present embodiment, and FIG. 2 is a side sectional view of the cleaning substrate shown in FIG. FIG. 3 is a diagram showing a state when the cleaning substrate shown in FIG. 1 and the like is charged by a charging device. 4 is a top view of another configuration of the cleaning substrate according to the present embodiment, and FIG. 5 is a side sectional view of the cleaning substrate shown in FIG. FIG. 6 is a perspective view showing a configuration of the substrate processing apparatus in which cleaning is performed by the cleaning substrate according to the present embodiment, and FIG. 7 is a schematic diagram showing an outline of the internal configuration of the substrate processing apparatus shown in FIG. It is a block diagram.

  The cleaning substrate 10 shown in FIGS. 1 to 3 is for cleaning the substrate processing apparatus, and collects the foreign substances generated in the processing section of the substrate processing apparatus by adsorbing them. Such a cleaning substrate 10 includes a charged substrate body 14 and an adhesive layer 12 provided on the surface of the substrate body 14. Here, the material of the surface of the substrate body 14 is formed of, for example, a plastic such as a fluororesin or an insulating material such as quartz. The adhesive layer 12 is formed by applying an adhesive to the substrate body 14. As another example, the adhesive layer 12 may be an adhesive tape. At this time, the adhesive tape may be, for example, a double-sided tape. Further, when the cleaning substrate 10 according to the present embodiment is used in a vacuum, the adhesive is vaporized when the adhesive layer 12 is formed by applying the adhesive to the substrate body 14, and the substrate processing apparatus is caused by outgas. The inside of the aircraft may be contaminated. On the other hand, when an adhesive tape made of a fluororesin or a polyimide resin is used as the adhesive layer 12, generation of outgas can be suppressed even when the cleaning substrate 10 according to the present embodiment is used in a vacuum. it can.

  When the substrate processing apparatus is cleaned by the cleaning substrate 10 as shown in FIG. 1, before the cleaning substrate 10 is transferred into the processing section of the substrate processing apparatus, as shown in FIG. The charging device 20 charges the substrate body 14 of the cleaning substrate 10. Such a charging device 20 may be provided in the body of the substrate processing apparatus, or may be provided outside the body of the substrate processing apparatus. With such a charging device 20, the substrate body 14 can be charged with enough static electricity to attract foreign matters such as dust. Here, when the substrate processing apparatus to be cleaned by the cleaning substrate 10 is, for example, a dry etching apparatus using plasma, dust in the processing unit is negatively charged, so that the substrate body 14 of the cleaning substrate 10 is It needs to be charged positively.

  The cleaning substrate for cleaning the substrate processing apparatus is not limited to the one disclosed in FIGS. Another structure of the cleaning substrate according to this embodiment will be described with reference to FIGS.

  The cleaning substrate 30 shown in FIGS. 4 and 5 is obtained by charging a substrate body 31 having irregularities on its surface. Specifically, as shown in FIGS. 4 and 5, line-shaped convex portions 32 and concave portions 34 are alternately formed on the surface of the substrate body 31, and the substrate main body is formed by these convex portions 32 and concave portions 34. The surface area of 31 has increased. In the cleaning substrate 30 shown in FIGS. 4 and 5, the surface area of the substrate body 31 is increased, so that the performance of adsorbing foreign matters such as dust is improved. In the case where the substrate processing apparatus is cleaned with the cleaning substrate 30 as shown in FIGS. 4 and 5, the charging substrate shown in FIG. 3 is also transferred before the cleaning substrate 30 is transferred into the processing section of the substrate processing apparatus. The substrate body 31 of the cleaning substrate 30 is charged by a charging device such as a corona discharge method having the same configuration as the device 20. Further, the material of the surface of the substrate body 31 of the cleaning substrate 30 is formed of, for example, a plastic such as a fluororesin or an insulating material such as quartz.

  The cleaning substrate 10 shown in FIGS. 1 to 3 and the cleaning substrate 30 shown in FIGS. 4 and 5 are not only charged with static electricity, but also are made sticky by the adhesive layer 12 or have irregularities on the surface. By increasing the surface area by forming, the force to collect the adsorbed foreign matter is increased, thereby improving the cleaning efficiency. It is also efficient for substrate processing equipment in which foreign matter collected due to pressure changes, etc. may drop due to increased force to collect foreign matter, such as dry etching equipment using vacuum. Cleaning can be performed automatically. Further, the cleaning substrate 10 shown in FIGS. 1 to 3 and the cleaning substrate 30 shown in FIGS. 4 and 5 are non-contact adsorption systems using static electricity, and therefore, such cleaning substrates 10 and 30 are used. It is possible to clean areas that would normally be inaccessible simply by transporting, and it is not necessary to stop the substrate processing equipment to perform such area cleaning, improving the operating rate. it can.

  Further, when an adhesive tape is used as the adhesive layer 12 in the cleaning substrate 10 shown in FIGS. 1 to 3, foreign substances such as dust adhere to the cleaning substrate 10 by cleaning the substrate processing apparatus. However, the cleaning substrate 10 can be reused simply by replacing the adhesive tape. Further, when foreign matter such as dust adheres to the cleaning substrate 30 shown in FIGS. 4 and 5 by cleaning the substrate processing apparatus, the cleaning substrate 30 is cleaned to clean the surface. The substrate 30 can be reused.

  Next, the configuration of the substrate processing apparatus in which cleaning is performed by the cleaning substrates 10 and 30 according to the present embodiment will be described with reference to FIGS. The substrate processing apparatus as shown in FIGS. 6 and 7 includes a coating / developing apparatus 100 and an exposure apparatus 110 arranged so as to be adjacent to each other, and the coating / developing apparatus 100 is a semiconductor wafer (a substrate to be processed). A carrier block 101 that is a loading / unloading unit for loading / unloading, for example, 25 carriers 121 that are hermetically contained, and a processing block 102 that performs a resist solution coating process and a developing process on the wafer. And an interface block 103 which is an interface unit. Further, the coating / developing apparatus 100 is provided with transfer arms 104, 106, and 108 as transfer means for transferring wafers between the blocks 101, 102, and 103 and with various units in the processing block 102. ing.

  The carrier block 101 includes a mounting table 122 on which a plurality of (for example, four) carriers 121 can be mounted, an opening / closing unit 123 provided on a wall surface in front of the mounting table 122, and an opening / closing unit 123. And a transfer arm 104 for taking out the wafer from the carrier 121.

  A processing block 102 is connected to the heel side of the carrier block 101. The processing block 102 is provided with a plurality of processing units 130 including a coating processing unit for applying a resist solution to the wafer and a developing processing unit for developing the wafer. The processing block 102 is provided with a plurality of shelf units 140 on which wafers are placed. The processing block 102 is provided with a cleaning unit 150 for cleaning the wafer, and the cleaning unit 150 is provided with a charging device 160 for charging the cleaning substrates 10 and 30. The processing block 102 includes transfer stages 125 and 126 for transferring wafers to and from the carrier block 101 and the interface block 103, and various units between the carrier block 101 and the interface block 103 and in the processing block 102. Are provided with transfer arms 106 for transferring the wafers between them.

  The interface block 103 is provided with a transfer arm 108 for transferring a wafer between the processing block 102 and the exposure apparatus 110. In the exposure apparatus 110, a wafer coated with a resist solution is exposed by a coating unit provided in the processing block 102. The wafer subjected to the exposure process is subjected to development processing by a development processing unit provided in the processing block 102.

  When cleaning a substrate processing apparatus having such a structure, before the substrate processing is performed by the substrate processing apparatus, the cleaning substrate 10 as shown in FIGS. 1 to 3 or FIGS. The cleaning substrate 30 as shown is charged by a charging device 160 provided in the body of the substrate processing apparatus, and then the cleaning substrates 10 and 30 are transported into the processing unit 130 to thereby remove dust in the processing unit 130. A foreign substance such as a liquid is attached to the cleaning substrates 10 and 30 and collected. Thereby, foreign matters such as dust in the processing unit 130 are removed. Further, the cleaning substrates 10 and 30 that collect foreign matters such as dust are transported to the cleaning unit 150 and cleaned by the cleaning unit 150. As a result, foreign substances such as dust adhering to the surfaces of the cleaning substrates 10 and 30 are washed away, so that the cleaning substrates 10 and 30 can be reused.

  Note that the cleaning substrate and the substrate processing apparatus that performs cleaning with the cleaning substrate according to the present embodiment are not limited to the above-described modes, and various types are within the scope of the invention described in the claims. Changes can be made.

  For example, the cleaning substrate is not limited to a square shape as shown in FIGS. For example, a circular substrate may be used as the cleaning substrate.

  Further, the substrate processing apparatus that performs cleaning with the cleaning substrate is not limited to the one shown in FIGS. As a substrate processing apparatus that performs cleaning with the cleaning substrate, a device other than the photolithography apparatus as shown in FIGS. 6 and 7 may be used.

DESCRIPTION OF SYMBOLS 10 Cleaning substrate 12 Adhesive layer 14 Substrate main body 20 Charging device 30 Cleaning substrate 31 Substrate main body 32 Convex part 34 Concave part 100 Coating / developing apparatus 101 Carrier block 102 Processing block 103 Interface block 104, 106, 108 Transport arm 110 Exposure apparatus 121 Carrier 122 Mounting table 123 Opening / closing section 125, 126 Delivery stage 130 Processing unit 140 Shelf unit 150 Cleaning unit 160 Charging device

Claims (9)

A cleaning substrate for cleaning a substrate processing apparatus,
A charged substrate body;
An adhesive layer provided on the surface of the substrate body;
With
A cleaning substrate that collects by adsorbing foreign matter generated in a processing section of a substrate processing apparatus.   The cleaning substrate according to claim 1, wherein the adhesive layer is made of an adhesive tape.   The cleaning substrate according to claim 2, wherein the adhesive tape is made of a fluororesin or a polyimide resin. A cleaning substrate for cleaning a substrate processing apparatus,
It has a charged substrate body with irregularities on its surface,
A cleaning substrate that collects by adsorbing foreign matter generated in a processing section of a substrate processing apparatus. A cleaning method for a substrate processing apparatus including a processing unit for processing a substrate,
Charging a cleaning substrate having a substrate body and an adhesive layer provided on a surface of the substrate body;
Before the processing of the substrate, the charged cleaning substrate is carried into the processing unit, and the foreign matter generated in the processing unit is attached to the cleaning substrate and collected;
A method for cleaning a substrate processing apparatus, comprising:   6. The method for cleaning a substrate processing apparatus according to claim 5, wherein the step of charging a cleaning substrate having a substrate main body and an adhesive layer provided on the surface of the substrate main body is performed in the body of the substrate processing apparatus.   A step of transporting the cleaning substrate collecting foreign matter to a cleaning unit provided in the body of the substrate processing apparatus, and further removing the foreign matter collected on the cleaning substrate by cleaning in the cleaning unit; A cleaning method for a substrate processing apparatus according to claim 5 or 6. A cleaning method for a substrate processing apparatus including a processing unit for processing a substrate,
Charging a cleaning substrate having a substrate body provided with irregularities on its surface;
Before the processing of the substrate, the charged cleaning substrate is carried into the processing unit, and the foreign matter generated in the processing unit is attached to the cleaning substrate and collected;
A method for cleaning a substrate processing apparatus, comprising:   A step of transporting the cleaning substrate collecting foreign matter to a cleaning unit provided in the body of the substrate processing apparatus, and further removing the foreign matter collected on the cleaning substrate by cleaning in the cleaning unit; The method for cleaning a substrate processing apparatus according to claim 8.

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