WO2000032835A8 - Electro-chemical deposition system - Google Patents

Electro-chemical deposition system

Info

Publication number
WO2000032835A8
WO2000032835A8 PCT/US1999/028159 US9928159W WO0032835A8 WO 2000032835 A8 WO2000032835 A8 WO 2000032835A8 US 9928159 W US9928159 W US 9928159W WO 0032835 A8 WO0032835 A8 WO 0032835A8
Authority
WO
WIPO (PCT)
Prior art keywords
electro
mainframe
chemical deposition
deposition system
disposed
Prior art date
Application number
PCT/US1999/028159
Other languages
French (fr)
Other versions
WO2000032835A2 (en
Inventor
Yezdi Dordi
Donald J Olgado
Ratson Morad
Peter Hey
Mark Denome
Michael Sugarman
Mark Di Lloyd
Joe Stevens
Dan Marohl
Ho Seon Shin
Eugene Ravinovich
Robin Cheung
Ashok K Sinha
Avi Tepman
Dan Carl
George Birkmaier
Ben Shen
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/263,649 external-priority patent/US6254760B1/en
Priority claimed from US09/289,074 external-priority patent/US6258220B1/en
Priority claimed from US09/350,210 external-priority patent/US6267853B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to JP2000585464A priority Critical patent/JP4766579B2/en
Publication of WO2000032835A2 publication Critical patent/WO2000032835A2/en
Publication of WO2000032835A8 publication Critical patent/WO2000032835A8/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes an edge bead removal/spin-rinse-dry (EBR/SRD) station disposed on the mainframe adjacent the loading station, a rapid thermal anneal chamber attached to the loading station, a seed layer repair station disposed on the mainframe, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.
PCT/US1999/028159 1998-11-30 1999-11-29 Electro-chemical deposition system WO2000032835A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000585464A JP4766579B2 (en) 1998-11-30 1999-11-29 Electrochemical deposition equipment

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US11020998P 1998-11-30 1998-11-30
US60/110,209 1998-11-30
US09/263,649 1999-03-05
US09/263,649 US6254760B1 (en) 1999-03-05 1999-03-05 Electro-chemical deposition system and method
US09/289,074 US6258220B1 (en) 1998-11-30 1999-04-08 Electro-chemical deposition system
US09/289,074 1999-04-08
US09/350,210 1999-07-09
US09/350,210 US6267853B1 (en) 1999-07-09 1999-07-09 Electro-chemical deposition system

Publications (2)

Publication Number Publication Date
WO2000032835A2 WO2000032835A2 (en) 2000-06-08
WO2000032835A8 true WO2000032835A8 (en) 2000-08-17

Family

ID=27493736

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/028159 WO2000032835A2 (en) 1998-11-30 1999-11-29 Electro-chemical deposition system

Country Status (3)

Country Link
JP (2) JP4766579B2 (en)
TW (1) TW513751B (en)
WO (1) WO2000032835A2 (en)

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US6258220B1 (en) 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system
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US6309520B1 (en) 1998-12-07 2001-10-30 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
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US6454927B1 (en) * 2000-06-26 2002-09-24 Applied Materials, Inc. Apparatus and method for electro chemical deposition
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WO2002031227A2 (en) * 2000-10-12 2002-04-18 Applied Materials, Inc. Deposition uniformity control for electroplating apparatus, and associated method
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US7189647B2 (en) 2001-04-05 2007-03-13 Novellus Systems, Inc. Sequential station tool for wet processing of semiconductor wafers
WO2003007274A1 (en) * 2001-07-12 2003-01-23 James Hambleton Electro-chemical teaching unit
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KR100518788B1 (en) * 2003-03-11 2005-10-05 삼성전자주식회사 Spin coating apparatus for coating photoresist
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KR101590661B1 (en) * 2010-09-13 2016-02-01 도쿄엘렉트론가부시키가이샤 Liquid processing apparatus, liquid processing method and storage medium
JP5321574B2 (en) * 2010-12-17 2013-10-23 ルネサスエレクトロニクス株式会社 Method of operating semiconductor manufacturing apparatus and method of manufacturing semiconductor device
CN105044370B (en) * 2014-11-04 2017-03-08 长沙绿智电子科技有限公司 A kind of unattended heavy metal-polluted water monitoring apparatus
KR102342006B1 (en) * 2016-03-04 2021-12-22 가부시키가이샤 에바라 세이사꾸쇼 Plating apparatus and plating method
JP6833557B2 (en) * 2016-03-04 2021-02-24 株式会社荏原製作所 Plating equipment and plating method
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EP3647467B1 (en) * 2017-06-30 2022-04-06 Showa Denko K.K. Anode mounting member of fluorine electrolytic cell, fluorine electrolytic cell, and method for producing fluorine gas
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Also Published As

Publication number Publication date
JP2003528214A (en) 2003-09-24
JP4766579B2 (en) 2011-09-07
TW513751B (en) 2002-12-11
JP2009293134A (en) 2009-12-17
WO2000032835A2 (en) 2000-06-08

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