JP2014022598A - Substrate conveyance device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conveyance device with high conveyance efficiency of a substrate.SOLUTION: A substrate conveyance device 1 includes a first hand mechanism 40 and a second hand mechanism 140. The first hand mechanism 40 includes a first lower arm 41, a first upper arm 42, a first hand 43 of which end portion is a first substrate-holding section 43a, a first following mechanism 44 that rotates the first hand 43 according to the rotation of the first upper arm 42. The first substrate-holding section 43a is configured to be movable between a contraction position and an extension position by the rotations of the first lower arm 41, the first upper arm 42, and the first hand 43. The second hand mechanism 140 includes a second lower arm 141, a second upper arm 142, a second hand 143 of which end portion is a second substrate-holding section 143a, a second following mechanism 144 that rotates the second hand 143 according to the rotation of the second upper arm 142. The second substrate-holding section 143a is configured to be movable synchronously with the first substrate-holding section 43a between a contraction position and an extension position by the rotations of the second lower arm 141, the second upper arm 142, and the second hand 143.

Description

  The present invention relates to a substrate transfer apparatus for transferring a substrate such as a silicon wafer or a glass wafer, and more particularly to a substrate transfer apparatus including two hands for transferring a substrate.

  Conventionally, a semiconductor processing facility called a multi-chamber system is known. This multi-chamber system includes a plurality of semiconductor processing chambers and a load lock chamber. The semiconductor processing chamber and the load lock chamber are each connected to one transfer chamber via a gate, and a transfer device is disposed in the transfer chamber. The transfer device takes a wafer from the load lock chamber and the semiconductor processing chamber, transfers the wafer to a predetermined substrate placement position in the next semiconductor processing chamber, and places the wafer on the substrate placement position. The semiconductor wafer transferred to the substrate mounting position is subjected to a predetermined process process, and further transferred to the next substrate mounting position by a transfer device. As a transport apparatus, for example, a transport apparatus having two hands as disclosed in Patent Document 1 is known.

  This conveying apparatus has a turning link and two hand mechanisms. The turning link is turned by a turning drive mechanism. An arm of a hand mechanism is rotatably attached to the turning link. A hand of the hand mechanism is rotatably attached to the arm of the hand mechanism. The arms of the two hand mechanisms are respectively connected to corresponding hand drive mechanisms via arm belts or the like. The hand drive mechanism is configured to move the arm belt to rotate the corresponding arm. The hand of the hand mechanism is connected to the arm of the corresponding hand mechanism through an interlocking mechanism. The interlocking mechanism is configured to rotate the hand in conjunction with the rotation of the arm of the hand mechanism. The hand of the hand mechanism is formed so as to hold the wafer.

  The transport device configured as described above is configured so that the hand mechanism corresponding to the hand drive mechanism is moved by the one hand drive mechanism while the swing link is rotated by the swing drive mechanism. The wafer held by the hand is transported by rotating it so as to face in a direction substantially coinciding with. Thereby, it is possible to avoid the wafer or the arm of the hand mechanism from coming into contact with the gate.

JP 2011-161554 A

  However, the conveying device described in Patent Document 1 is swung by the swivel drive mechanism so that the hand of one hand mechanism faces a direction substantially coinciding with the opening direction of the gate while the one hand mechanism is extended. Since the link is turned, the turning link cannot be turned by the turning drive mechanism so that the hand of the other hand mechanism faces the direction substantially matching the opening direction of the other gate. There was a problem of low efficiency. Such a problem occurs not only in a semiconductor wafer but also in a substrate other than a semiconductor wafer processed by a substrate processing system having a structure similar to that of a multi-chamber system.

  In order to solve the above-described problems, a substrate transport apparatus according to the present invention includes a turning unit that can turn around a turning axis, and a first hand that is provided in the turning unit symmetrically with respect to a symmetry plane that includes the turning axis. A mechanism and a second hand mechanism, and a transport device drive mechanism for driving the first and second hand mechanisms, wherein the first hand mechanism has one end portion parallel to the swivel axis on the swivel portion. A first lower arm attached to be rotatable about a first axis, and one end of the first lower arm attached to the other end of the first lower arm to be rotatable about a second axis parallel to the pivot axis The first upper arm and its distal end are the first substrate holding part, and its base end is pivotable about the third axis parallel to the pivot axis at the other end of the first upper arm And is rotated following the rotation of the first upper arm. And a first follower mechanism for rotating the first hand by following the rotation of the first upper arm, and the first lower arm, the first upper arm, and the first By rotating the hand, the first substrate holder moves the first substrate holder between a contracted position near the pivot axis and a first substrate holder extended position farther from the pivot axis than the contracted position. The second hand mechanism includes a second lower arm, one end of which is attached to the turning portion so as to be rotatable about a fourth axis parallel to the turning axis, and the second lower arm. A second upper arm attached to the other end of the second arm so as to be rotatable about a fifth axis parallel to the swivel axis, and a distal end of the second upper arm is a second substrate holding portion. Has a sixth axis parallel to the pivot axis at the other end of the second upper arm. A second hand that is pivotally attached to the second upper arm and that is rotated by the rotation of the second upper arm, and a second hand that is rotated by the rotation of the second upper arm. A second driven mechanism, and the second substrate holding portion is held close to the pivot axis by the rotation of the second lower arm, the second upper arm, and the second hand, and the second substrate holding. The second substrate holding unit is configured to be able to move in synchronization with the first substrate holding unit between an extended position farther from the pivot axis than the contracted position.

  According to this configuration, since the first hand mechanism and the second hand mechanism can be driven simultaneously to carry the substrate, it is possible to improve the substrate carrying efficiency. Moreover, it can be realized with three axes.

  Further, in the substrate transfer apparatus of the present invention, when divided into two virtual regions so as to have the same central angle when viewed from the direction in which the swivel axis extends, the processing chamber for performing the same processing is positioned in one region. The present invention can be applied to a semiconductor processing facility arranged to do so.

  The first substrate holding unit is configured to operate such that the substrate held by the first substrate holding unit moves in a region on one side of the symmetry plane, and the substrate held by the second substrate holding unit is The second substrate holding part may be configured to operate so as to move in a region on the other side of the symmetry plane.

  According to this configuration, it is possible to prevent the substrates held by the first substrate holding unit and the second substrate holding unit from interfering with each other.

  The transport device drive mechanism includes a first drive unit that rotates the turning unit, a second drive unit that rotates the first lower arm and the second lower arm in opposite directions, and the first upper unit. A third driving unit that interlocks and rotates the arm and the second upper arm in opposite directions may be included.

  According to this configuration, the configuration of the substrate transport apparatus can be simplified, and it is advantageous for manufacturing and the manufacturing cost is low.

  The first driven mechanism rotates the first hand according to the rotation of the first upper arm at a reduction ratio of 1.35 to 1.65, and the second driven mechanism The hand may be rotated by following the rotation of the second upper arm at a reduction ratio of 1.35 to 1.65.

  According to this configuration, the hand of the other hand mechanism can be rotated by the rotation of the upper arm so as to avoid one of the first and second hand mechanisms.

  The first hand takes a posture away from the plane of symmetry as it goes from the third axis toward the center of the first substrate holding part at the contracted position, and the second hand part from the sixth axis at the contracted position. You may take the attitude | position which leaves | separates from the said symmetry plane as it goes to the center of a 2nd board | substrate holding part.

  According to this configuration, the substrate held by one of the first and second substrate holding units of the substrate transport apparatus taking the initial posture is held by the other substrate holding unit. Can be prevented.

  The first and second substrate holders move from the contracted position to the extended position so that their trajectories draw a straight line that extends radially from the pivot axis or a straight line that is substantially asymptotic to a straight line parallel to the straight line. It may be configured to.

  According to this configuration, the first and second substrate holders can be moved so as to draw a substantially straight line in the vicinity of the extended position, so that the first and second substrate holders are placed in the substrate processing chamber. It can be easily inserted.

  According to the present invention, the transfer efficiency of the substrate transfer apparatus can be improved.

It is a top view which shows the structural example of a semiconductor processing equipment provided with the substrate conveying apparatus which concerns on embodiment of this invention. It is the perspective view which looked at the board | substrate conveyance apparatus of FIG. 1 from diagonally upward. It is an expanded sectional view which expands and shows the cross section when the 1st hand mechanism and its peripheral part of the board | substrate conveyance apparatus of FIG. 1 are cut | disconnected in the perpendicular direction. It is an expanded sectional view which expands and shows the cross section when the 2nd hand mechanism of the board | substrate conveyance apparatus of FIG. 1 and its peripheral part are cut | disconnected in the lead perpendicular | vertical direction. It is a top view which shows typically the gear provided in the turning part of the board | substrate conveyance apparatus of FIG. It is a top view which shows operation | movement of the 1st and 2nd hand mechanism. It is a top view which shows the board | substrate conveyance apparatus of the state which extended the 1st and 2nd hand mechanism from the state of FIG. 1, and made the hand approach the gate. It is a top view which shows the board | substrate conveyance apparatus of the state which extended the 1st and 2nd hand mechanism from the state of FIG. 7, and inserted the hand in the chamber room. FIG. 9 is a plan view showing the substrate transfer apparatus in a state in which the first and second hand mechanisms are further extended from the state of FIG. 8 and the hand is moved to the substrate placement position. It is a top view which shows the board | substrate conveyance apparatus of the state which turned from the state of FIG. 1 and was located so that the 1st and 2nd board | substrate holding part might face another chamber. It is a top view which shows the board | substrate conveyance apparatus of the state which extended the 1st and 2nd hand mechanism from the state of FIG. 10, and made the hand approach the gate. It is a top view which shows the board | substrate conveyance apparatus of the state which extended the 1st and 2nd hand mechanism from the state of FIG. 11, and inserted the hand in the chamber room. It is a top view which shows the board | substrate conveyance apparatus of the state which extended the 1st and 2nd hand mechanism from the state of FIG. 12, and moved the hand to near the board | substrate mounting position. It is a top view which shows the board | substrate conveyance apparatus of the state which extended the 1st and 2nd hand mechanism from the state of FIG. 13, and moved the hand to the substrate mounting position. It is a top view which shows the board | substrate conveyance apparatus of the state which contracted the 1st and 2nd hand mechanism from the state of FIG. 14, and took out the board | substrate from the board | substrate mounting position. FIG. 16 is a plan view showing the substrate transfer apparatus in a state in which the first and second hand mechanisms are contracted from the state of FIG. 15 and the hand is brought close to the gate. It is a top view which shows the board | substrate conveyance apparatus of the state which contracted the 1st and 2nd hand mechanism from the state of FIG. 16, and made the board | substrate pass to a gate. FIG. 18 is a plan view showing the substrate transfer apparatus in a state in which the first and second hand mechanisms are contracted from the state of FIG. 17 to return to the initial posture.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[Semiconductor processing equipment]
FIG. 1 is a plan view showing a configuration example of a semiconductor processing facility 100 including a substrate transfer apparatus 1 according to an embodiment of the present invention. The semiconductor processing facility 100 is an example of a substrate processing system. The substrate processing system is a system in which a plurality of processing chambers for processing a substrate are arranged around the transfer space, and a transfer device for taking in and out the substrate is arranged in each transfer chamber in the transfer space. Good. As shown in FIG. 1, the semiconductor processing facility 100 is a facility for performing various process processes such as a heat treatment, an impurity introduction process, a thin film forming process, a lithography process, a cleaning process, and a planarization process on the substrate P. In the present invention, the substrate P is, for example, a semiconductor wafer, a glass wafer or the like, and examples of the semiconductor wafer include a silicon wafer, a sapphire (single crystal alumina) wafer, and other various wafers. Examples of the glass wafer include a glass substrate for FPD (Flat Panel Display) and a glass substrate for MEMS (Micro Electro Mechanical Systems).

  In addition to the substrate transfer apparatus 1, the semiconductor processing facility 100 includes a plurality of chambers 2, a transfer chamber 3, and a gate 4.

  Each of the plurality of chambers 2 has a room 5. The chamber 5 is a processing chamber (load lock chamber) for loading / unloading the substrate P before processing and the substrate P after processing into / from the semiconductor processing equipment 100, a processing chamber for performing various processing processes on the substrate P, and the like. . In the room 5, a substrate placement position 6 on which the substrate P is placed when performing various process processes or waiting is predetermined. The load lock chamber includes an opening and a gate (not shown) for taking in and out the substrate P from the outside of the semiconductor processing facility 100. The substrate placement positions 6 of the plurality of chambers 2 are arranged radially with respect to a turning axis L1 of the substrate transport apparatus 1 described later. A substrate support portion (not shown) is provided at the substrate placement position 6.

  The outer shape of the transfer chamber 3 is polygonal in plan view, and the number of sides thereof is the same as or more than the number of the chambers 2 included in the semiconductor processing facility 100. The chamber 2 is arranged so as to be adjacent to each side portion. The transfer chamber 3 includes a transfer chamber 7 in which the substrate transfer apparatus 1 is disposed. The transfer chamber 7 is formed in a substantially circular shape (or regular polygonal shape) in plan view. The inner diameter of the transfer chamber 7 is formed to be slightly larger than the turning radius (details will be described later) of the substrate transfer device 1 taking the initial posture, so that the substrate transfer device 1 in the initial posture of turning does not interfere with the inner wall of the transfer chamber 7. It is configured.

  The gate 4 is provided at the boundary between each chamber 5 and the transfer chamber 7 and opens in a direction in which a straight line extending radially from a turning axis L1 of the substrate transfer apparatus 1 described later or a straight line parallel to the straight line extends. And it is comprised so that the transfer chamber 7 may access the room 5 through the gate 4. FIG. The substrate placement position 6 of the chamber 2 is positioned on a straight line extending from the gate 4 in the depth direction of the room 5 in plan view. Accordingly, the substrate can be positioned at the substrate mounting position 6 by inserting the substrate P straight from the gate 4.

  The substrate transport apparatus 1 is configured to transport the substrate P to the substrate placement position 6 and to unload the substrate P from the substrate placement position 6.

  In the present embodiment, the semiconductor processing facility 100 includes, for example, six chambers 2A to 2F having six rooms 5A to 5F. The chambers 5A and 5B of the adjacent chambers 2A and 2B are processing chambers for performing the first processing, and the rooms 5C and 5D of the adjacent chambers 2C and 2D are processing chambers for performing the second processing. The rooms 5E and 5F of the adjacent chambers 2E and 2F are processing chambers for performing the third processing. As described above, when the processing chamber for performing the same processing in the semiconductor processing facility 100 is divided into two virtual regions so as to have the same central angle when viewed from a direction in which a turning axis L1 described later extends, Are arranged so as to be located together. Further, if the chambers 5A and 5B of the chambers 2A and 2B located in the one region are used as load lock chambers for loading and unloading the substrate P before and after the processing to the semiconductor processing facility 100, for example, on a diagonal line Compared with the case where the load lock chamber is arranged, the substrate transfer apparatus for taking the substrate P in and out of the load lock chamber from the outside can be simply configured.

  The six rooms 5A to 5F have substrate placement positions 6A to 6F, respectively. The transfer chamber 7 is formed in a substantially hexagonal shape in plan view, and is connected to the six rooms 5A to 5F via the gates 4A to 4F.

[Overall configuration of substrate transfer device]
FIG. 2 is a perspective view of the substrate transfer apparatus 1 as viewed obliquely from above. FIG. 3 is an enlarged cross-sectional view showing an enlarged cross section when the first hand mechanism 40 of the substrate transfer apparatus 1 and its peripheral portion are cut in the vertical direction. FIG. 4 is an enlarged cross-sectional view showing an enlarged cross section when the second hand mechanism 140 of the substrate transfer apparatus 1 and its peripheral portion are cut in the vertical direction.

  As shown in FIGS. 2 to 4, the substrate transfer apparatus 1 controls operations of the turning unit 20, the first hand mechanism 40, the second hand mechanism 140, the transfer apparatus driving mechanism 60, and the substrate transfer apparatus 1. It has a controller. Furthermore, the substrate transport apparatus 1 includes a support body that arranges the components of the substrate transport apparatus 1 in a predetermined positional relationship. Here, the predetermined position means a position suitable for carrying out the substrate transport operation of the substrate transport apparatus 1 of the present invention.

[Swivel part]
The swivel unit 20 is composed of, for example, a hollow cylindrical member. The swivel unit 20 is fixed to the upper end of a swivel shaft 64 (described later) so that the center axis thereof coincides with the swivel axis L1 extending in the up-down direction. It has become.

  As shown in FIG. 1, the first hand mechanism 40 and the second hand mechanism 140 are provided in the turning portion 20 symmetrically with respect to the symmetry plane S including the turning axis L1.

[First hand mechanism]
As shown in FIGS. 2 and 3, the first hand mechanism 40 includes a first lower arm 41, a first upper arm 42, a first hand 43, and a first driven mechanism 44.

  The first lower arm 41 is, for example, a hollow plate-like member, and is formed in a substantially strip shape in plan view. As shown in FIG. 3, a first lower arm rotation shaft 45 is formed so as to protrude downward from the bottom surface of the turning portion side end portion 41a of the first lower arm 41 (one end portion of the first lower arm 41). Yes. The first lower arm rotation shaft 45 is attached to the turning portion 20 so as to be rotatable about a first axis L2 extending in parallel with the turning axis L1. The first lower arm rotation shaft 45 is formed in a hollow cylindrical shape, and the internal space thereof communicates with the internal space of the main body of the turning unit 20 and the internal space of the first lower arm 41. A first lower arm rotation driven gear 46 is fixed to the lower end portion of the first lower arm rotation shaft 45. The first lower arm rotation driven gear 46 is provided at the same height as a lower arm rotation main drive gear 67 of a lower arm drive shaft 65 described later, and meshes with the lower arm rotation main drive gear 67. ing. A first upper arm support shaft 47 extending upward is formed on the upper arm side end 41 b (the other end of the first lower arm 41) in the first lower arm 41. The first upper arm support shaft 47 is provided such that its axis coincides with a second axis L3 extending in parallel with the turning axis L1. A first fixed pulley 55 is fixed to the upper end portion of the first upper arm support shaft 47.

  A first upper arm rotation shaft 48 is provided inside the first lower arm rotation shaft 45. The first upper arm rotation shaft 48 is attached to the first lower arm rotation shaft 45 so as to be rotatable about the first axis L2. The first upper arm rotating shaft 48 has a lower end protruding below the lower end of the first lower arm rotating shaft 45, and a first upper arm rotating driven gear 49 is fixed to the protruding portion. . The first upper arm rotating driven gear 49 is provided at the same height as an upper arm / hand driving main driving gear 69 of the upper arm / hand driving shaft 66 described later, and the upper arm / hand driving main driving is provided. It meshes with the gear 69. Further, the upper end of the first upper arm rotating shaft 48 is located in the internal space of the first lower arm 41, and the first upper arm rotating intermediate pulley 50 is fixed to this portion. The first upper arm rotating driven gear 49 and the first upper arm rotating intermediate pulley 50 are provided such that their axes coincide with the first axis L2.

  In the initial posture, the first lower arm 41 is configured to take, for example, the posture shown in FIG. 1 (see also the solid line in FIG. 6). That is, the first lower arm 41 extends radially from the turning unit 20.

  The first upper arm 42 is, for example, a hollow plate-like member, and is formed in a substantially strip shape in plan view. The first upper arm 42 has a cylindrical first upper arm rotating driven pulley 51 fixed to the bottom surface of the lower arm side end portion 42a (one end portion of the first upper arm 42). A first transmission belt 52 is wound around the first upper arm rotating intermediate pulley 50 and the first upper arm rotating driven pulley 51. The first upper arm rotation driven pulley 51 is rotatably attached to the first upper arm support shaft 47 of the first lower arm 41. Thus, the first upper arm 42 attached to the first lower arm 41 is configured to be rotatable about the second axis L3. A first hand support shaft 53 extending upward is formed at a hand side end portion 42 b (the other end portion of the first upper arm 42) in the first upper arm 42. The first hand support shaft 53 is provided such that its axis coincides with a third axis L4 extending in parallel with the turning axis L1.

  In the initial posture, the first upper arm 42 is configured to take, for example, the posture shown in FIG. 1 (see also the solid line in FIG. 6). That is, the first upper arm 42 extends from the upper arm side end 41 b of the first lower arm 41 toward the symmetry plane S.

  The first hand 43 is, for example, a plate-like member, and a first hand rotating shaft 57 is provided at the base end portion. The first hand rotation shaft 57 is formed in a cylindrical shape, and is fitted on the first hand support shaft 53 so as to be rotatable around the third axis L4 and positioned outside the first hand support shaft 53. It is attached. A first hand pulley 54 is fitted and fixed to the outer periphery of the first hand rotating shaft 57. A second transmission belt 56 is wound around the first hand pulley 54 and the first fixed pulley 55. As shown in FIG. 2, the first hand 43 includes a first substrate holding portion 43 a formed in a bifurcated shape and configured to be able to place and hold the substrate P at the tip portion. The first substrate holding part 43a is located on the same horizontal plane as a second substrate holding part 143a described later. In the following, the direction in which the first substrate holding part 43a and the second substrate holding part 143a to be described later are facing is referred to as the front, and the opposite direction is referred to as the rear. In this way, the first hand 43 attached to the first upper arm 42 is configured to be rotatable about the third axis L4.

  In the initial posture, the first hand 43 extends away from the symmetry plane S toward the center of the first substrate holding part 43a from the third axis L4. Accordingly, it is possible to prevent the substrate P held by the first substrate holding unit 43a from interfering with the substrate P located on the same horizontal plane held by the second substrate holding unit 143a described later. The position of the first substrate holder 43a of the first hand 43 in this initial posture constitutes the contracted position. The first substrate holding unit 43a is configured to be movable between a contracted position and an extended position farther from the turning axis L1 than the contracted position by the operation of the first hand mechanism 40 described in detail later. This extension position is set corresponding to each substrate placement position 6 of the semiconductor processing facility 100.

  The first driven mechanism 44 is a mechanism that rotates the first hand 43 following the rotation of the first upper arm 42. In the present embodiment, the first driven mechanism 44 includes, for example, a first hand pulley 54, a first fixed pulley 55, a first hand pulley 54, and a first fixed pulley 55 wound around the second pulley 54. And a transmission belt 56. The first fixed pulley 55 is fixed to the first upper arm support shaft 47 so that the axis thereof coincides with the second axis L3. Accordingly, when the first hand support shaft 53 revolves around the second axis L <b> 3 by the rotation of the first upper arm 42, the first hand rotation shaft 57 that is rotatably attached to the first hand support shaft 53. Rotates about the third axis L4 in the direction opposite to the rotation direction of the first upper arm 42, and the first hand 43 rotates about the third axis L4 in the direction opposite to the rotation direction of the first upper arm 42. It is supposed to be. Accordingly, when the first upper arm 42 is rotated so that the hand side end portion 42b of the first upper arm 42 in the initial posture moves forward, the first upper arm 42 and the first hand are moved accordingly. The first hand 43 is rotated so that an angle formed by the shaft 43 with respect to the third axis L4 is increased (that is, extended). On the other hand, when the first upper arm 42 is rotated so that the hand side end portion 42b of the first upper arm 42 moves rearward, the first upper arm 42 and the first hand 43 are moved along the third axis. The 1st hand 43 rotates so that the angle made in L4 may become small (namely, it may shrink).

  The first hand 43 is configured to rotate following the rotation of the first upper arm 42 so as to avoid the second hand mechanism 140. In the present embodiment, this operation is realized by adjusting the gear ratio between the first hand pulley 54 and the first fixed pulley 55, that is, the reduction ratio of the first hand 43 with respect to the first upper arm 42. Yes. The reduction ratio is set in the range of 1.35 to 1.65. When the reduction ratio is set within such a range, the first hand 43 avoids the second hand mechanism 140 so as to avoid the first hand mechanism 140. The upper arm 42 rotates following the rotation. In addition, by cooperating with the rotation of the first lower arm 41, the movement locus of the first substrate holding portion 43a is substantially asymptotically approximated to a straight line extending radially from the turning axis L1 or a straight line parallel to the straight line. The first substrate holder 43a can be moved to draw a prescribed curve (details will be described later). In the present embodiment, this reduction ratio is set to 1.57.

[Second hand mechanism]
As shown in FIGS. 2 and 4, the second hand mechanism 140 includes a second lower arm 141, a second upper arm 142, a second hand 143, and a second driven mechanism 144.

  The second lower arm 141 is, for example, a hollow plate-like member, and is formed in a substantially strip shape in plan view. As shown in FIG. 4, the second lower arm pivot shaft 145 is formed so as to protrude downward from the bottom surface of the turning portion side end portion 141 a of the second lower arm 141 (one end portion of the second lower arm 141). Yes. And the 2nd lower arm rotation axis | shaft 145 is attached to the turning part 20 so that rotation is possible centering on the 4th axis line L5 extended in parallel with the turning axis line L1. The second lower arm rotation shaft 145 is formed in a hollow cylindrical shape, and the internal space thereof communicates with the internal space of the main body of the turning unit 20 and the internal space of the second lower arm 141. A second lower arm rotation driven gear 146 is fixed to the lower end portion of the second lower arm rotation shaft 145. The second lower arm rotation driven gear 146 is provided at a higher position than the lower arm rotation main drive gear 67 of the lower arm drive shaft 65 described later. 1 is connected via a reversing gear 68. Accordingly, the rotation of the lower arm turning main driving gear 67 is transmitted to the second lower arm turning driven gear 146 via the first reversing gear 68. A second upper arm support shaft 147 extending upward is formed on the upper arm side end portion 141b (the other end portion of the second lower arm 141) in the second lower arm 141. The second upper arm support shaft 147 is provided such that its axis coincides with the fifth axis L6 extending in parallel with the turning axis L1. A second fixed pulley 155 is fixed to the upper end portion of the second upper arm support shaft 147.

  A second upper arm rotation shaft 148 is provided inside the second lower arm rotation shaft 145. The second upper arm rotation shaft 148 is attached to the second lower arm rotation shaft 145 so as to be rotatable about the fourth axis L5. The lower upper arm pivoting shaft 148 has a lower end protruding below the lower end of the second lower arm pivoting shaft 145, and the second upper arm rotating driven gear 149 is fixed to the protruding portion. . The second upper arm rotating driven gear 149 is provided at a higher position than the upper arm / hand driving main driving gear 69 of the upper arm / hand driving shaft 66 described later, and is used for upper arm / hand driving. The main drive gear 69 is connected via a second reversing gear 70. As a result, the rotation of the upper arm / hand driving main driving gear 69 is transmitted to the second upper arm rotating driven gear 149 via the second reversing gear 70. The second upper arm rotating shaft 148 has an upper end located in the internal space of the second lower arm 141, and the second upper arm rotating intermediate pulley 150 is fixed to this portion. The second upper arm rotation driven gear 149 and the second upper arm rotation intermediate pulley 150 are provided such that their axes coincide with the fourth axis L5.

  In the initial posture, the second lower arm 141 is configured to take, for example, the posture shown in FIG. 1 (see also the solid line in FIG. 6). That is, the second lower arm 141 extends radially from the turning unit 20.

  The second upper arm 142 is, for example, a hollow plate-like member, and is formed in a substantially strip shape in plan view. The second upper arm 142 has a cylindrical second upper arm rotating driven pulley 151 fixed to the bottom surface of the lower arm side end portion 142a (one end portion of the second upper arm 142). A third transmission belt 152 is wound around the second upper arm rotating intermediate pulley 150 and the second upper arm rotating driven pulley 151. The second upper arm rotation driven pulley 151 is rotatably attached to the second upper arm support shaft 147 of the second lower arm 141. Thus, the second upper arm 142 attached to the second lower arm 141 is configured to be rotatable about the fifth axis L6. A second hand support shaft 153 extending upward is formed at the hand side end 142b (the other end of the second upper arm 142) in the second upper arm 142. The second hand support shaft 153 is provided such that its axis coincides with a sixth axis L7 extending in parallel with the turning axis L1.

  In the initial posture, the second upper arm 142 is configured to take, for example, the posture shown in FIG. 1 (see also the solid line in FIG. 6). That is, the second upper arm 142 extends from the upper arm side end portion 141 b of the second lower arm 141 toward the symmetry plane S.

  The second hand 143 is, for example, a plate-like member, and a second hand rotating shaft 157 is provided at the base end portion. The second hand rotating shaft 157 is formed in a cylindrical shape, and is fitted to the second hand support shaft 153 so as to be rotatable around the sixth axis L7 and positioned outside the second hand support shaft 153. It is attached. A second hand pulley 154 is fitted and fixed to the outer periphery of the second hand rotating shaft 157. A fourth transmission belt 156 is wound around the second hand pulley 154 and the second fixed pulley 155. As shown in FIG. 2, the second hand 143 is formed in a bifurcated shape, and includes a second substrate holding portion 143 a configured to place and hold the substrate P at the distal end portion. As described above, the second substrate holding part 143a is located on the same horizontal plane as the first substrate holding part 43a. In this way, the second hand 143 attached to the second upper arm 142 is configured to be rotatable about the sixth axis L7.

  In the initial posture, the second hand 143 extends away from the symmetry plane S toward the center of the second substrate holding part 143a from the sixth axis L7. Accordingly, it is possible to prevent the substrate P held by the second substrate holding unit 143a from interfering with the substrate P located on the same horizontal plane held by the first substrate holding unit 43a. The position of the second substrate holder 143a of the second hand 143 in this initial posture constitutes the contracted position. The first substrate holding portion 43a and the second substrate holding portion 143a are held by the first substrate holding portion 43a and the second substrate holding portion 143a when they are held by the substrate P and positioned at the contracted position. In addition, the substrates P positioned on the same horizontal plane are positioned so as not to overlap or interfere with each other. The second substrate holding unit 143a is configured to be movable between a contracted position and an extended position farther from the turning axis than the contracted position by the operation of the second hand mechanism 140 described in detail later. This extension position is set corresponding to each substrate placement position 6 of the semiconductor processing facility 100.

  The second driven mechanism 144 is a mechanism that rotates the second hand 143 by following the rotation of the second upper arm 142. In the present embodiment, the second driven mechanism 144 is, for example, a second hand pulley 154, a second fixed pulley 155, a second hand pulley 154 and a second fixed pulley 155 wound around the fourth pulley. And a transmission belt 156. The first fixed pulley 55 is fixed to the second upper arm support shaft 147 so that the axis line coincides with the fifth axis line L6. Accordingly, when the second hand support shaft 153 revolves around the fifth axis L6 by the rotation of the second upper arm 142, the second hand rotation shaft 157 that is rotatably attached to the second hand support shaft 153. Rotates around the sixth axis L7 in the direction opposite to the rotation direction of the second upper arm 142, and the second hand 143 rotates around the sixth axis L7 in the direction opposite to the rotation direction of the second upper arm 142. It is supposed to be. Therefore, when the second upper arm 142 is rotated so that the hand side end 142b of the second upper arm 142 in the initial posture moves forward, the second upper arm 142 and the second hand are driven by the rotation. The second hand 143 rotates so that the angle formed between the second axis 143 and the sixth axis L7 is increased (that is, extended). On the other hand, when the second upper arm 142 is rotated so that the hand side end portion 142b of the second upper arm 142 moves rearward, the second upper arm 142 and the second hand 143 follow the sixth axis. The second hand 143 rotates so that the angle formed at L7 becomes smaller (ie, contracts).

  The second hand 143 is configured to rotate following the rotation of the second upper arm 142 so as to avoid the first hand mechanism 40. In the present embodiment, this operation is realized by adjusting the gear ratio between the second hand pulley 154 and the second fixed pulley 155, that is, the reduction ratio of the second hand 143 with respect to the second upper arm 142. Yes. The reduction ratio is set in a range of 1.35 to 1.65. When the reduction ratio is set within such a range, the second hand 143 avoids the first hand mechanism 40 and the second hand 143 is avoided. It rotates following the rotation of the upper arm 142. In addition, by cooperating with the rotation operation of the second lower arm 141, the movement locus of the second substrate holding portion 143a is substantially asymptotically approximated to a straight line extending radially from the turning axis L1 or a straight line parallel to the straight line. The first substrate holder 43a can be moved to draw a prescribed curve (details will be described later). In the present embodiment, this reduction ratio is set to 1.57, which is the same as that of the first hand mechanism 40.

[Conveyor drive mechanism]
FIG. 5 is a plan view schematically showing the gear provided in the turning unit 20.

  As shown in FIG. 4, the transport device driving mechanism 60 includes first to third driving units 61 to 63 that are supported by a support (not shown).

  The 1st drive part 61 is provided with the turning shaft 64 and the actuator (not shown) which rotationally drives this.

  As shown in FIG. 3, the turning shaft 64 is provided so as to be rotatable about the turning axis L1. The turning shaft 64 is formed in a hollow cylindrical shape. As described above, the upper end of the turning shaft 64 is fixed to the turning portion 20 and rotates together with the turning portion 20. Thus, by the operation of the first drive unit 61, the turning unit 20 and the first hand mechanism 40 and the second hand mechanism 140 supported by the turning unit 20 turn.

  The second drive unit 62 includes a lower arm drive shaft 65 and an actuator (not shown) that rotationally drives the lower arm drive shaft 65.

  As shown in FIGS. 3 and 4, the lower arm drive shaft 65 is inserted into the turning shaft 64 and is provided to be rotatable about the turning axis L <b> 1. The lower arm drive shaft 65 is formed in a round bar shape. The upper end of the lower arm drive shaft 65 protrudes upward from a turning shaft 64 and an upper arm / hand drive shaft 66 described later. A lower arm rotation main drive gear 67 is provided at the upper end of the lower arm drive shaft 65. As described above, the lower arm turning main driving gear 67 is engaged with the first lower arm turning driven gear 46 as shown in FIG. Further, the lower arm turning main driving gear 67 meshes with the second lower arm turning driven gear 146 via the first reversing gear 68.

  Thus, since the second lower arm rotation driven gear 146 is engaged with the lower arm rotation main driving gear 67 via the first reversing gear 68, the rotation of the lower arm drive shaft 65 causes the 1 The lower arm rotation driven gear 46 is rotated in the opposite direction. Then, by the operation of the second drive unit 62, the first lower arm 41 and the second lower arm 141 are rotated in synchronization with each other about the first axis L2 and the fourth axis L5.

  The third drive unit 63 includes an upper arm / hand drive shaft 66 and an actuator (not shown) that rotationally drives the upper arm / hand drive shaft 66.

  The upper arm / hand drive shaft 66 is inserted into the turning shaft 64, and is provided so as to be rotatable about the turning axis L1. The upper arm / hand drive shaft 66 is formed in a hollow cylindrical shape, and the lower arm drive shaft 65 is inserted therethrough. That is, the lower arm drive shaft 65 and the upper arm / hand drive shaft 66 are provided in a nested manner inside the turning shaft 64. The upper end of the upper arm / hand drive shaft 66 protrudes upward from the turning shaft 64, but is positioned below the upper end of the lower arm drive shaft 65. An upper arm / hand drive main drive gear 69 is provided at the upper end of the upper arm / hand drive shaft 66. As described above, the upper arm / hand driving main driving gear 69 meshes with the first upper arm rotating driven gear 49 as shown in FIG. Further, the upper arm / hand driving main driving gear 69 meshes with the second upper arm rotating driven gear 149 via the second reversing gear 70.

  Thus, the second upper arm rotation driven gear 149 meshes with the upper arm / hand driving main driving gear 69 via the second reversing gear 70, so that the upper arm / hand driving shaft 66 rotates. By the movement, the first upper arm rotating driven gear 49 is rotated in the opposite direction.

  Then, the first upper arm rotation shaft 48 and the second upper arm rotation shaft 148 are rotated by the rotation of the first upper arm rotation driven gear 49 and the second upper arm rotation driven gear 149. Further, the first upper arm rotating intermediate pulley 50 and the second upper arm rotating intermediate pulley 150 are rotated by the rotation of the first upper arm rotating shaft 48 and the second upper arm rotating shaft 148. Further, by the rotation of the first upper arm rotating intermediate pulley 50 and the second upper arm rotating intermediate pulley 150, the first upper arm rotating driven pulley 51 and the first upper arm rotating driven pulley 51 through the first transmission belt 52 and the third transmission belt 152, respectively. The second upper arm rotating driven pulley 151 rotates. As a result, the first upper arm 42 and the second upper arm 142 rotate. That is, by the operation of the third drive unit 63, the first upper arm 42 and the second upper arm 142 are rotated synchronously about the second axis L3 and the fifth axis L6.

  Further, the first upper arm 42 and the second upper arm 142 rotate about the second axis L3 and the fifth axis L6, so that the first driven mechanism 44 and the second driven mechanism 144 are moved to the first hand 43 and the second The two hands 143 rotate in synchronization. As a result, the substrate transport apparatus 1 can simultaneously carry the two substrates P to the respective substrate placement positions by the first hand mechanism 40 and the second hand mechanism 140, and the two substrates P can be loaded. At the same time, it can be unloaded from each substrate placement position (details will be described later).

  As described above, the substrate transfer apparatus 1 is driven by the three drive units of the first drive unit 61, the second drive unit 62, and the third drive unit 63, so that the configuration of the substrate transfer apparatus 1 can be simplified. In addition, it is advantageous for manufacturing and the manufacturing cost is low.

[Elevating mechanism]
In the present embodiment, the substrate transfer apparatus 1 includes a lifting mechanism (not shown). The elevating mechanism includes, for example, a well-known ball screw mechanism and an actuator for driving the same, and, for example, elevates and lowers the turning unit 20, the first hand mechanism 40, and the second hand mechanism 140 together. Thus, the first substrate holding part 43a and the second substrate holding part 143a can be raised and lowered between the raised position and the lowered position. The height position of the lowered position is set lower than the height position of the substrate support portion provided at the substrate placement position 6. Further, the height position of the raised position is set above the height position of the substrate support portion provided at the substrate placement position 6. Therefore, by raising the first substrate holding portion 43a and the second substrate holding portion 143a from the lowered position to the raised position at the substrate placement position 6, the substrate P placed on the substrate support portion is lifted to raise the first substrate. The holding portion 43a and the second substrate holding portion 143a can be held. Further, the first substrate holding portion 43a and the second substrate holding portion 143a are held by the first substrate holding portion 43a and the second substrate holding portion 143a by lowering the first substrate holding portion 43a and the second substrate holding portion 143a from the raised position to the lowered position at the substrate placement position 6. The substrate P that is present can be placed on the substrate support portion at the substrate placement position 6.

[Control unit]
The controller provided in the substrate transport apparatus 1 includes, for example, a control unit having a computing unit such as a CPU and a storage unit having a memory such as a ROM and a RAM. The control unit may be configured by a single controller that performs centralized control, or may be configured by a plurality of controllers that perform distributed control in cooperation with each other. The control unit controls the operations of the actuators of the first to third driving units 61 to 63 and the actuator of the lifting mechanism, and thereby controls the operation of the substrate transfer apparatus 1. A predetermined control program is stored in the storage unit, and the control unit reads and executes these control programs, whereby the operation of the substrate transfer apparatus 1 is controlled.

[Operation example of first and second hand mechanisms]
Next, an operation example of the substrate transfer apparatus 1 will be described.

  FIG. 6 is a plan view showing operations of the first hand mechanism 40 and the second hand mechanism 140.

(Extension operation)
First, an extending operation for moving the first substrate holding unit 43a and the second substrate holding unit 143a from the contracted position to the extended position will be described below.

  First, the control unit is defined in advance such that the movement trajectories of the first substrate holding unit 43a and the second substrate holding unit 143a substantially asymptotically approach straight lines La and Lb extending radially from the turning axis L1 or a straight line parallel to the straight line. The actuators of the second drive unit 62 and the third drive unit 63 are driven so as to draw a curved curve (hereinafter simply referred to as a prescribed asymptotic curve). The straight line in which the movement locus extends radially from the turning axis L 1 or a straight line parallel to the straight line is a line passing through the substrate placement position 6 of the chamber 2. Therefore, the prescribed asymptotic curve is prescribed in advance according to each substrate placement position.

  In the present embodiment, the operation setting data for operating the second drive unit 62 and the third drive unit 63 so that the movement locus of the first substrate holding unit 43a and the second substrate holding unit 143a draws a specified asymptotic curve is Are stored in the storage unit in advance. And the control part controls the actuator of the 2nd drive part 62 and the 3rd drive part 63 based on this operation | movement setting data.

  Accordingly, the first substrate holding portion 43a and the second substrate holding portion 143a located at the contracted position are located at the corresponding extended positions.

  And since the control part drives the 2nd drive part 62 and the 3rd drive part 63 so that the movement locus | trajectory of the 1st board | substrate holding | maintenance part 43a and the 2nd board | substrate holding | maintenance part 143a draws a regulation asymptotic curve, it is extended position In the vicinity of, the first substrate holding part 43a and the second substrate holding part 143a move so as to draw a substantially straight line. Thereby, as will be described in detail later, it is possible to prevent the substrate P held by the first substrate holding portion 43a and the second substrate holding portion 143a from interfering with the gate 4 during transport.

(Shrinking operation)
Next, a contraction operation for moving the first substrate holding part 43a and the second substrate holding part 143a from the extension position to the contraction position will be described below.

  First, the control unit drives the actuators of the second drive unit 62 and the third drive unit 63 so as to draw a specified asymptotic curve during the extension operation. In the present embodiment, data for operating the second drive unit 62 and the third drive unit 63 is expanded so that the movement trajectories of the first substrate holding unit 43a and the second substrate holding unit 143a draw a specified asymptotic curve. Similar to the time of operation, it is previously stored in the storage unit. Then, the control unit controls the actuators of the second drive unit 62 and the third drive unit 63 based on this data.

  Accordingly, the first substrate holding portion 43a and the second substrate holding portion 143a located at the extended position are located at the corresponding contracted positions.

  Then, the control unit draws the second drive unit 62 and the third drive unit so that the movement trajectories of the first substrate holding unit 43a and the second substrate holding unit 143a draw the same defined asymptotic curve as the defined asymptotic curve during the extension operation. Since the actuator 63 is driven, in the vicinity of the extended position, the first substrate holding portion 43a and the second substrate holding portion 143a move so as to draw a substantially straight line. Thereby, as will be described in detail later, it is possible to prevent the substrate P held by the first substrate holding portion 43a and the second substrate holding portion 143a from interfering with the gate 4 during transport.

  In both the extending operation and the contracting operation, the control unit positions the first hand mechanism 40 in which the substrate P held by the first substrate holding unit 43a and the second substrate holding unit 143a has the symmetry plane S, respectively. The actuators of the second drive unit 62 and the third drive unit 63 are driven so as to move in the side region and the region where the second hand mechanism 140 is located. Thereby, it is possible to prevent the substrates held by the first substrate holding part 43a and the second substrate holding part 143a from interfering with each other.

  Note that, in the above, the control unit, based on the data stored in the storage unit in advance, the second driving unit 62 so that the movement trajectories of the first substrate holding unit 43a and the second substrate holding unit 143a draw a specified asymptotic curve. The actuator of the third drive unit 63 is driven, but instead of this, one of the second drive unit 62 and the third drive unit 63 is driven and driven, and the other drive unit is driven. The driving unit may be driven so that the movement trajectories of the first substrate holding unit 43a and the second substrate holding unit 143a draw a specified asymptotic curve.

[Operation example of semiconductor processing equipment]
Next, an operation example of the semiconductor processing facility 100 will be described.

  First, the case where the substrate P is carried into the substrate mounting positions 6A and 6B in the chambers 2A and 2B will be described with reference to FIGS. 1 and 7 to 9.

  First, the control unit positions the first substrate holding unit 43a and the second substrate holding unit 143a holding the substrate P by the lifting mechanism at the raised position.

  Next, the control unit turns the turning shaft 64 to turn the turning unit 20 of the substrate transport apparatus 1 in the initial posture, and the first substrate holding unit 43a of the first hand mechanism 40 and the second hand mechanism 140 of the first hand mechanism 140 are turned. The two-substrate holding part 143a is positioned so as to face the loading destination chambers 2A and 2B (see FIG. 1).

  Next, the control unit rotates the lower arm driving shaft 65 and the upper arm / hand driving shaft 66 to move the first substrate holding portion 43a and the second substrate holding portion 143a located at the contracted position to the substrate placement position 6A. , B are extended toward the extension position. At this time, the control unit moves the lower arm drive shaft 65 and the upper arm / so that the movement trajectories of the first substrate holding unit 43a and the second substrate holding unit 143a draw a specified asymptotic curve corresponding to the substrate placement positions 6A and 6B. Since the rotation of the hand drive shaft 66 is controlled to move the first substrate holding portion 43a and the second substrate holding portion 143a from the contracted position toward the extended position, the first substrate holding portion 43a and the second substrate are moved. When the substrate P held by the holding unit 143a approaches the gates 4A and 4B (see FIG. 7), the first substrate holding unit 43a and the second substrate holding unit 143a are arranged so that the substrate P does not hit the gates 4A and 4B. Are inserted in a substantially straight state near the centers of the gates 4A and 4B, respectively.

  After the insertion, the control unit extends the first hand mechanism 40 while adjusting the rotational speeds of the lower arm driving shaft 65 and the upper arm / hand driving shaft 66, and the first substrate holding unit 43a and the second substrate. The substrate P held by the holding unit 143a is moved in a substantially straight line toward the substrate placement positions 6A and 6B, respectively (see FIG. 8).

  Thereafter, when the substrate P held by the first substrate holding unit 43a and the second substrate holding unit 143a reaches the extended position corresponding to the substrate placement positions 6A and 6B (see FIG. 9), the control unit drives the lower arm. The rotation of the shaft 65 and the upper arm / hand drive shaft 66 is stopped.

  Next, the control unit lowers the first substrate holding unit 43a and the second substrate holding unit 143a from the raised position to the lowered position by the lifting mechanism, and each substrate P is moved to the substrate support portion at the substrate placement position 6A, 6B, respectively. Place. Accordingly, the two substrates P held by the first substrate holding part 43a and the second substrate holding part 143a are simultaneously carried into the substrate placement positions 6A and 6B, respectively. After placement, the control unit rotates the lower arm drive shaft 65 and the upper arm / hand drive shaft 66 to contract the first hand mechanism 40 and the second hand mechanism 140, and follows the trajectory that has been moved. The first hand 43 is retracted and returned to the initial posture.

  Next, the case where the substrate P placed at the substrate placement positions 6C and 6D in the chambers 2C and 2D is carried out will be described with reference to FIGS.

  First, the control unit positions the first substrate holding unit 43a and the second substrate holding unit 143a at the lowered position by the lifting mechanism.

  Next, the control unit turns the turning shaft 64 to turn the turning unit 20 of the substrate transport apparatus 1 in the initial posture, and the first substrate holding unit 43a of the first hand mechanism 40 and the second hand mechanism 140 of the first hand mechanism 140 are turned. The two-substrate holding part 143a is positioned so as to face the destination chambers 2C and 2D (see FIG. 10).

  Next, the control unit rotates the lower arm drive shaft 65 and the upper arm / hand drive shaft 66 to move the first substrate holding portion 43a and the second substrate holding portion 143a located at the contracted position to the substrate placement position 6C. , 6D (see FIGS. 11 to 13). At this time, the controller controls the lower arm drive shaft 65 and the upper arm / so that the movement trajectories of the first substrate holding portion 43a and the second substrate holding portion 143a draw a specified asymptotic curve corresponding to the substrate placement positions 6C and 6D. The rotation of the hand drive shaft 66 is controlled to move the first substrate holding portion 43a and the second substrate holding portion 143a from the contracted position toward the extended positions corresponding to the substrate placement positions 6C and 6D, respectively.

  When the first substrate holding portion 43a and the second substrate holding portion 143a reach the extended positions corresponding to the substrate placement positions 6C and 6D (see FIG. 14), the control unit moves the lower arm driving shaft 65 and the upper arm / The rotation of the hand drive shaft 66 is stopped.

  Next, the control unit raises the first substrate holding unit 43a and the second substrate holding unit 143a from the lowered position to the raised position by the lifting mechanism, and lifts the substrate P placed on the substrate supporting unit to the first substrate. The holding unit 43a and the second substrate holding unit 143a hold it. Then, the control unit rotates the lower arm drive shaft 65 and the upper arm / hand drive shaft 66 to contract the first hand mechanism 40 and the second hand mechanism 140, and follows the trajectory that has been moved, thereby moving the first hand 43. Is moved back to the initial posture (see FIGS. 15 to 18). As a result, the two substrates P placed at the substrate placement positions 6C and 6D are respectively held by the first substrate holding part 43a and the second substrate holding part 143a and simultaneously carried out.

  As described above, the substrate transfer apparatus 1 of the present invention drives the first hand mechanism 40 and the second hand mechanism 140 simultaneously, and carries the substrate P into and out of the substrate placement position 6 of the chamber 2. Therefore, the substrate transfer efficiency of the substrate transfer apparatus 1 can be improved.

  In addition, when the substrate transfer apparatus 1 according to the present invention is divided into two virtual regions so as to have the same central angle when viewed from the direction in which the turning axis L1 extends, the processing chamber for performing the same processing is in one region. The present invention can be applied to the semiconductor processing equipment 100 arranged so as to be located together.

  The present invention can be applied to a transfer device in a facility for processing a substrate.

DESCRIPTION OF SYMBOLS 1 Substrate transfer apparatus 2 Chamber 3 Transfer chamber 4 Gate 5 Room 6 Substrate mounting position 7 Transfer chamber 10 Elevating mechanism 20 Turning part 40 First hand mechanism 41 First lower arm 41a (End of first lower arm) Turn part side end 41b Upper arm side end portion (of the first lower arm) 42 First upper arm 42a Lower arm side end portion (of the first upper arm) 42b Hand side end portion (of the first upper arm) 43 First hand 43a First Substrate holder 44 First driven mechanism 45 First lower arm rotation shaft 46 First lower arm rotation driven gear 47 First upper arm support shaft 48 First upper arm rotation shaft 49 First upper arm rotation driven gear 50 First upper arm rotating intermediate pulley 51 First upper arm rotating driven pulley 52 First transmission belt 53 First hand support shaft 54 First hand pulley 55 First fixed pulley 56 Second transmission belt 57 First hand rotating shaft 60 Conveying device driving mechanism 61 First driving unit 62 Second driving unit 63 Third driving unit 64 Rotating shaft 65 Lower arm driving shaft 66 Upper arm / hand driving shaft 67 Lower arm rotation Main driving gear 68 First reversing gear 69 Upper arm / hand driving main driving gear 70 Second reversing gear 100 Semiconductor processing equipment 140 Second hand mechanism 141 Second lower arm 141a (second lower arm) swivel side end 141b (second lower arm) upper arm side end 142 second upper arm 142a (second upper arm) lower arm side end 142b (second upper arm) hand side end 143 second hand 143a first 2 substrate holding portion 144 second driven mechanism 145 second lower arm rotating shaft 146 second lower arm rotating driven gear 147 second upper arm support shaft 148 second upper arm 145 Second upper arm rotation driven gear 150 Second upper arm rotation intermediate pulley 151 Second upper arm rotation driven pulley 152 Third transmission belt 153 Second hand support shaft 154 Second hand pulley 155 First 2 fixed pulley 156 4th transmission belt 157 2nd shaft for hand rotation

Claims (6)

A revolving part that can rotate around a revolving axis,
A first hand mechanism and a second hand mechanism provided in the swivel unit symmetrically with respect to a symmetry plane including the swivel axis;
A transport device drive mechanism for driving the first and second hand mechanisms,
The first hand mechanism has a first lower arm attached to the turning portion so that one end of the turning portion is rotatable about a first axis parallel to the turning axis, and the other end of the first lower arm. A first upper arm whose one end is pivotably mounted about a second axis parallel to the pivot axis, a distal end thereof is a first substrate holding portion, and a base end thereof is the first upper A first hand attached to the other end of the arm so as to be rotatable about a third axis parallel to the turning axis, and rotated by the rotation of the first upper arm; and the first hand And a first driven mechanism that rotates the first upper arm in accordance with the rotation of the first upper arm, and the first lower arm, the first upper arm, and the first hand rotate to rotate the first One substrate holding part is closer to the pivot axis and the first substrate holding part is closer to the contracted position. Is movable in said first substrate holder between the far extended position from the pivot axis,
The second hand mechanism has a second lower arm attached to the turning portion so that one end of the turning portion is rotatable about a fourth axis parallel to the turning axis, and the other end of the second lower arm. A second upper arm whose one end is pivotably mounted about a fifth axis parallel to the pivot axis, a distal end thereof is a second substrate holding portion, and a base end thereof is the second upper A second hand attached to the other end of the arm so as to be rotatable about a sixth axis parallel to the pivot axis, and rotated by the rotation of the second upper arm; and the second hand And a second driven mechanism for rotating the second upper arm in accordance with the rotation of the second upper arm, and the second lower arm, the second upper arm, and the second hand by the rotation of the second upper arm. The two substrate holders are close to the swivel axis and the second substrate holder is at the contracted position. Wherein said second substrate holder between a far extended position from the pivot axis in synchronization with the first substrate holding portion is configured to be movable, the substrate transfer apparatus. The first substrate holder is configured to operate such that the substrate held by the first substrate holder moves in a region on one side of the symmetry plane;
The substrate transfer apparatus according to claim 1, wherein the second substrate holding unit is configured to operate such that the substrate held by the second substrate holding unit moves in a region on the other side of the symmetry plane.   The transport device drive mechanism includes a first drive unit that rotates the turning unit, a second drive unit that rotates the first lower arm and the second lower arm in opposite directions, and the first upper unit. The substrate transfer apparatus according to claim 1, further comprising a third drive unit that interlocks and rotates the arm and the second upper arm in opposite directions. The first driven mechanism rotates the first hand following the rotation of the first upper arm at a reduction ratio of 1.35 to 1.65,
4. The second driven mechanism according to claim 1, wherein the second driven mechanism rotates the second hand by following the rotation of the second upper arm at a reduction ratio of 1.35 to 1.65. 5. Substrate transfer device. In the contracted position, the first hand takes a posture away from the symmetry plane as it goes from the third axis toward the center of the first substrate holding part,
5. The substrate transfer apparatus according to claim 1, wherein the second hand unit is configured to move away from the symmetry plane toward the center of the second substrate holding unit from the sixth axis at the contracted position.   The first and second substrate holders move from the contracted position to the extended position so that their trajectories draw a straight line that extends radially from the pivot axis or a straight line that is substantially asymptotic to a straight line parallel to the straight line. The substrate transfer apparatus according to claim 1, wherein the substrate transfer apparatus is configured to do so.

Images