CN103858220A - Substrate transfer system and substrate transfer method - Google Patents
Substrate transfer system and substrate transfer method Download PDFInfo
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- CN103858220A CN103858220A CN201280049913.1A CN201280049913A CN103858220A CN 103858220 A CN103858220 A CN 103858220A CN 201280049913 A CN201280049913 A CN 201280049913A CN 103858220 A CN103858220 A CN 103858220A
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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Abstract
Provided are a substrate plate (21), which has a vertically extending mounting surface (210) defined by a plurality of rectangular substrate mounting regions (211) which are aligned horizontally and has a left-side fixed pin, a right-side fixed pin, and underside fixed pin respectively disposed on the left side, the right side and the underside of each periphery for the substrate mounting regions (211); and a substrate mounting device (10), which has a substrate hold mechanism (15) for holding a plurality of rectangular substrates (100) with each principal surface thereof being disposed on the same plane level, a substrate transfer mechanism (11) for transferring the principal surface of the plurality of held substrates (100) that is held obliquely in horizontal view relative to the substrate mounting regions (211) to face the mounting surface (210) in the proximity thereof, and a substrate rotation mechanism (13), which simultaneously rotates the plurality of substrates (100) around a single rotary shaft along the mounting surface (210).
Description
Technical field
The present invention relates to a kind of by the substrate transfer of handling object substrate transfer system and the method for transferring substrates to sample holder (sample holder).
Background technology
In the manufacturing step of semiconductor device, plasma (plasma) processing unit is because have the advantage of easily carrying out accurately technique (process) control, so processing such as the film forming of being used to, etching (etching), ashing (ashing).For example, as film formation device, known have plasma activated chemical vapour deposition (chemical vapor deposition, a CVD) film formation device that forms plasma between negative electrode (cathode) electrode of parallel flat and anode (anode) electrode and carry out film forming processing forming.
The substrate processing method using same of plasma processing apparatus is roughly divided into the one chip of piecewise substrate being processed and batch (batch) formula of simultaneously multiple substrates being processed.The substrate size of solar cell is little, is 125mm～156mm left and right, and, must increase the treatment substrate sheet number of time per unit in order to reduce the cost that every plate base spends.Therefore, in the batch that adopt in film formation device for solar cell more.
In batch, for by the conveyances simultaneously of multiple substrates to membrane forming process room, and by substrate transfer to substrate loading device.Substrate loading device comprises substrate is flatly arranged in to cart style (cart type) or the brilliant boat type (boat type) that multiple substrates are vertically arranged etc. on the plate of level, in order to improve treatment effeciency, effectively with brilliant boat type sample holder increase can simultaneously treated substrate quantity.
Therefore, for example proposed multiple substrates to be mounted in to be arranged in state in the normal direction of interarea the method for transferring substrates (for example, with reference to patent documentation 1) of brilliant boat type sample holder.
Prior art document
Patent documentation
Patent documentation 1: Japanese patent laid-open 11-121587 communique
Summary of the invention
The problem that the present invention will solve
Brilliant boat type sample holder has the substrate carrier of the lift-launch face of defining (plate) is arranged in to the formation in the normal direction of lift-launch face.Therefore,, in the case of multiple substrates are transferred load to sample holder with the state being arranged in the normal direction of interarea, all must adjust the spacing between the substrate of the spacing between substrate carrier and the face of lift-launch.
At this moment, for example, sustain damage and substrate is dropped in order not make bump substrate bump against substrate carrier when the mounted board or to carry to substrate carrier, must consider distortion of substrate carrier etc. and make the spacing between substrate carrier there is enough and to spare.Therefore, be difficult to make the spacing between spacing or the substrate between substrate carrier to coordinate that accurately substrate precision is transferred load to sample holder well.
The object of the present invention is to provide a kind of can be by multiple substrates simultaneously and transfer load to accurately substrate transfer system and the method for transferring substrates of brilliant boat type sample holder.
Solve the technological means of problem
According to an embodiment of the present invention, a kind of substrate transfer system is provided, comprise: (one) substrate carrier, have to extend in vertical direction and define in the horizontal direction multiple rectangular substrate of arranging and carry the lift-launch face in region, and carry at each substrate region periphery the left side, the right and configuring respectively below left side steady pin (pin), the right steady pin and steady pin below; And (two) substrate loading device, comprising: substrate holding mechanism, the state that multiple rectangular substrate are configured in to same plane level with interarea separately keeps; Substrate travel mechanism, carry region with respect to substrate when observing from horizontal direction and the posture that tilts make the interarea of the multiple substrates that kept approaching with lift-launch face and relative to; And substrate rotating mechanism, make multiple substrates centered by a rotating shaft and rotate along lift-launch face simultaneously; And described substrate loading device is mounted in multiple substrates lift-launchs region with the left side, the right of substrate and the mode being supported by left side steady pin, the right steady pin and following steady pin respectively below by multiple substrates simultaneously.
According to another embodiment of the present invention, a kind of method of transferring substrates is provided, comprise the following steps: (one) prepared substrate support plate, described substrate carrier has to extend in vertical direction and define in the horizontal direction multiple rectangular substrate of arranging carries the lift-launch face in region, and carry at each substrate region periphery the left side, the right and configuring respectively below left side steady pin, the right steady pin and steady pin below; (2) state that multiple rectangular substrate is configured in to same plane level with interarea separately keeps; (3) carry region with respect to substrate when observing from horizontal direction and the posture that tilts make the interarea of the multiple substrates that kept approaching with lift-launch face and relative to; And (four) make multiple substrates centered by a rotating shaft and rotate along lift-launch face simultaneously, thereby with the left side of substrate, the right and by left side steady pin, the right steady pin and steady pin supports below mode, multiple substrates are mounted in to multiple substrates respectively below and carry region simultaneously.
The effect of invention
According to the present invention, can provide a kind of can be by multiple substrates simultaneously and transfer load to accurately substrate transfer system and the method for transferring substrates of brilliant boat type sample holder.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that represents the formation of the substrate transfer system of the first execution mode of the present invention.
Fig. 2 is the schematic diagram (one) that represents the action of the substrate transfer system of the first execution mode of the present invention.
Fig. 3 is the schematic diagram (its two) that represents the action of the substrate transfer system of the first execution mode of the present invention.
Fig. 4 represents to utilize the substrate transfer system of the first execution mode of the present invention to make the schematic diagram (one) of substrate rotation.
Fig. 5 represents to utilize the substrate transfer system of the first execution mode of the present invention to make the schematic diagram (its two) of substrate rotation.
Fig. 6 is the schematic diagram that represents the structure of the steady pin of the substrate carrier of the substrate transfer system that is configured in the first execution mode of the present invention.
Fig. 7 is the schematic diagram (one) that utilizes the example of the method for transferring substrates of the substrate transfer system of the first execution mode of the present invention in order to explanation.
Fig. 8 is the schematic diagram (its two) that utilizes the example of the method for transferring substrates of the substrate transfer system of the first execution mode of the present invention in order to explanation.
Fig. 9 is the schematic diagram (its three) that utilizes the example of the method for transferring substrates of the substrate transfer system of the first execution mode of the present invention in order to explanation.
Figure 10 is the schematic diagram (its four) that utilizes the example of the method for transferring substrates of the substrate transfer system of the first execution mode of the present invention in order to explanation.
Figure 11 is the schematic diagram (its five) that utilizes the example of the method for transferring substrates of the substrate transfer system of the first execution mode of the present invention in order to explanation.
Figure 12 is the schematic diagram (one) that the position of the rotating shaft of the substrate transfer system of the first execution mode of the present invention is described.
Figure 13 is the schematic diagram (its two) that the position of the rotating shaft of the substrate transfer system of the first execution mode of the present invention is described.
Figure 14 is the schematic diagram (its three) that the position of the rotating shaft of the substrate transfer system of the first execution mode of the present invention is described.
Figure 15 is the schematic diagram (its four) that the position of the rotating shaft of the substrate transfer system of the first execution mode of the present invention is described.
Figure 16 is the schematic diagram (its five) that the position of the rotating shaft of the substrate transfer system of the first execution mode of the present invention is described.
Figure 17 is the schematic diagram (its six) that the position of the rotating shaft of the substrate transfer system of the first execution mode of the present invention is described.
Figure 18 is the peaked schematic diagram that the anglec of rotation of the substrate transfer system of the first execution mode of the present invention is described.
Figure 19 is the schematic diagram (one) of setting the method for the position of the rotating shaft of the substrate transfer system of the first execution mode of the present invention in order to explanation.
Figure 20 is the schematic diagram (its two) of setting the method for the position of the rotating shaft of the substrate transfer system of the first execution mode of the present invention in order to explanation.
Figure 21 represents to utilize the substrate transfer system of the first execution mode of the present invention by the extremely schematic diagram of the example of multiple substrate carrier of substrate transfer.
Figure 22 represents to utilize the substrate transfer system of comparative example by the extremely schematic diagram of the example of multiple substrate carrier of substrate transfer.
Figure 23 is the schematic diagram that represents the formation of the continous way manufacturing installation of the substrate transfer system that can apply the first execution mode of the present invention.
Figure 24 is the schematic diagram that represents the formation of the substrate transfer system of the second execution mode of the present invention.
Figure 25 represents to utilize the substrate transfer system of the second execution mode of the present invention by the extremely schematic diagram of the example of multiple substrate carrier of substrate transfer.
Embodiment
With reference to accompanying drawing, embodiments of the present invention are described.In the record of following accompanying drawing, same or similar part is marked to same or similar symbol.But, should notice that accompanying drawing is schematic.And execution mode shown below is to illustrate in order to by device specific technological thought of the present invention or method, embodiments of the present invention not by structure, the configuration etc. of constituent part specifically for following content.Embodiments of the present invention can apply various changes in the scope of claims.
(the first execution mode)
As shown in Figure 1, the substrate transfer system of the first execution mode of the present invention comprises: substrate carrier 21, has lift-launch face 210; And substrate loading device 10, multiple rectangular substrate 100 are mounted in to lift-launch face 210 simultaneously.
The lift-launch face 210 of substrate carrier 21 extends in vertical direction, and defines as shown in Figure 2 multiple rectangular substrate lift-launchs region 211 of arranging in the horizontal direction.Carry region 211 at a substrate and carry a plate base 100.And then, carry at each substrate region 211 periphery the left side, the right and configuring respectively below left side steady pin P1, the right steady pin P2 and steady pin P3 below.Below, left side steady pin P1, the right steady pin P2 and following steady pin P3 are referred to as to " steady pin ".
In addition, left side steady pin P1, the right steady pin P2 and following steady pin P3 are common location with respect to the relative position in each substrate lift-launch region 211 for multiple substrates lift-launchs region 211.Therefore,, in the time that substrate 100 implementing process to being mounted in substrate carrier 21 are processed, can make steady pin is identical on the impact of each substrate 100.For example, in the situation that carrying out film forming processing, can make shade because becoming steady pin not the region of film forming on all substrates 100, be common region.
As shown in Figure 1, substrate loading device 10 comprises substrate travel mechanism 11, substrate rotating mechanism 13 and substrate holding mechanism 15.Utilize substrate loading device 10 with the left side, the right of substrate 100 and by the mode of left side steady pin P1, the right steady pin P2 and steady pin P3 support below, multiple substrates 100 are mounted in to substrate respectively below simultaneously and carry region 211, details will be described below.
The interarea that substrate travel mechanism 11 makes kept multiple substrates 100 approach with lift-launch face 210 and relative to.Substrate travel mechanism 11 shown in Fig. 1 comprises: column sections 111; Pillar rotating part 112, makes vertical direction that column sections 111 extends take column sections 111 be rotated as rotating shaft; And beam portion 113, the radial direction from column sections 111 to described rotation extends.Multiple substrate holding mechanisms 15 are that the direction of extending along beam portion 113 is arranged on beam portion 113.Specifically, the arm 152 of substrate holding mechanism 15 is arranged on beam portion 113, and arm 152 equates with the disposition interval that the substrate on lift-launch face 210 carries region 211 at the disposition interval of beam portion 113.Substrate travel mechanism 11 by the multiple substrates 100 that kept by substrate holding mechanism 15 with the interarea of substrate 100 relative with lift-launch face 210 to mode move on lift-launch face 210.At this moment, as shown in Figure 2, carry the oblique upper in region 211 at substrate, substrate 100 is parallel with lift-launch face 210 and carry region 211 with respect to substrate while observing from horizontal direction and the posture of inclination configures with interarea.Afterwards, as shown in Figure 3, till substrate travel mechanism 11 makes substrate 100 move to the position of regulation downwards along lift-launch face 210 in vertical direction.At this moment, substrate 100 is still with respect to substrate and carries region 211 and the posture of inclination.Specifically, as shown in Figure 4, keep as follows substrate 100, that is, intersect in the mode of angulation θ at rotary middle point C with the following parallel straight line that carries region 211 with substrate with the following parallel straight line of the substrate 100 of inclination attitude.
Steady pin for example can adopt platypelloid type pin 30 as shown in Figure 6.A part for the front end of the shaft portion 32 of pin 30 is embedded in lift-launch face 210.Utilize head 31 and the shaft portion 32 that the gap location of lift-launch face 210 exposes at consequent pin 30, substrate 100 is supported on to lift-launch face 210.The length t of the shaft portion 32 exposing on lift-launch face 210 is set to the thickness of substrate 100 and equates, for example, be 200 μ m left and right.
The minimum value that substrate carries the interval between region 211 is the diameter of the head 31 of pin 30.That is to say, the diameter of the head 31 of pin 30 is less, just can make the interval between substrate lift-launch region 211 less, but in order stably to keep substrate 100, the diameter of the head 31 of pin 30 is preferably 2mm～5mm left and right, for example, be preferably 3.6mm left and right.Interval between substrate lift-launch region 211 is more narrow better, and maximum is for example 10mm left and right.
Below, for by so that interarea becomes the action of Benq's plate loading device 10 situation that substrate 100 that the mode of level is arranged in substrate tray (tray) transfers load to substrate carrier 21.
First, the substrate 100 of substrate loading device 10 adsorption treatment objects.As shown in Figure 7, substrate 100 is so that the state that interarea is arranged towards above-below direction is lain in the lift-launch face 400 of substrate tray 40 to example.In this case, as shown in Figure 7, Figure 8, substrate loading device 10 makes the adsorption section 151 of substrate holding mechanism 15 contact with the interarea of substrate 100.Fig. 7 is the end view of observing from horizontal direction, and Fig. 8 is the vertical view of observing from vertical direction.At this moment, as shown in Figure 9, the arm 152 of substrate holding mechanism 15 extends in the horizontal direction.Fig. 9 is the end view of observing from the front end of beam portion 113.
Afterwards, substrate travel mechanism 11 moves to substrate 100 on the lift-launch face 210 of substrate carrier 21.That is to say, as shown in the Figure 10 observing from vertical direction, utilize pillar rotating part 112 that beam portion 113 is rotated take column sections 111 as rotating shaft, thereby substrate 100 is moved to substrate carrier 21 from substrate tray 40.At this moment, the direction that beam portion 113 extends take beam portion 113 is rotated as rotating shaft, thereby as shown in figure 11, the interarea of substrate 100 becomes parallel with vertical direction.Figure 11 is the end view of observing from the front end of beam portion 113.That is to say, substrate loading device 10 one side moves substrate 100, and one side becomes with the interarea of substrate 100 interarea that the mode parallel with the lift-launch face 210 of substrate carrier 21 make substrate 100 to be become vertical.
Then, as shown in Figure 3, substrate travel mechanism 11 is configured in substrate 100 on the lift-launch face 210 of substrate carrier 21.At this moment, as mentioned above, substrate 100 is that the mode that forms the angle θ of regulation is retained as with respect to substrate lift-launch region 211 and tilts.Then,, as illustrated with reference to Fig. 4～Fig. 5, substrate rotating mechanism 13 makes multiple substrates 100 centered by a rotating shaft and rotates along lift-launch face 210 simultaneously.Each limit of thus, each limit of substrate 100 and substrate being carried to region 211 is adjusted into and is parallel to each other and substrate 100 is configured in to substrate carries region 211.
According to above content, make the left side, the right of substrate 100 and supported by steady pin respectively below and multiple substrates 100 are mounted in to multiple substrates simultaneously carry region 211.
Below, the rotary middle point C shown in position, i.e. Fig. 4 and the Fig. 5 of the rotating shaft to make multiple substrates 100 simultaneously rotate at substrate rotating mechanism 13 in the situation that describes.First, study the optimum position of rotary middle point C for a plate base 100.
As illustrated with reference to Fig. 2, Fig. 3, the substrate 100 of the posture tilting with respect to substrate lift-launch region 211 when substrate loading device 10 makes to observe from horizontal direction moves downwards along lift-launch face 210 in vertical direction.Therefore the following vertical direction distance that, left side steady pin P1 and the right steady pin P2 carry region 211 apart from substrate is set to different.In the case of making substrate 100 along being counterclockwise direction rotation when observing above lift-launch face 210, as shown in Fig. 4, Fig. 5 etc., carry being set to and being shorter than the following vertical direction distance to left side steady pin P1 of carrying region 211 from substrate to the vertical direction distance of the right steady pin P2 below of region 211 from substrate.Below, the right steady pin P2 being shorter than to left side steady pin P1 apart from the following vertical direction distance in substrate lift-launch region 211 describes apart from the situation of the following vertical direction distance in substrate lift-launch region 211.
In the example shown in Figure 12, the position of rotary middle point C is set at than the position of the more approaching the right of straight line L3 steady pin P2 of the vertical direction of the position by following steady pin P3, and is set at respectively by the position of left side steady pin P1 and the right steady pin P2 and between two the straight line L1, the straight line L2 that extend in the horizontal direction.In the case of the position shown in Figure 12 is made as rotary middle point C, can make substrate 100 carry region 211 along substrate and rotate and do not contact with arbitrary steady pin.
In the example shown in Figure 13, the position of rotary middle point C is set at the position that more approaches left side steady pin P1 than the straight line L3 of the position by following steady pin P3, and is set between the straight line L1 and straight line L2 of the position of passing through respectively left side steady pin P1 and the right steady pin P2.In the case of the position shown in Figure 13 is made as rotary middle point C, rotate if make substrate 100 carry region 211 along substrate, substrate 100 can contact with following steady pin P3.Therefore, substrate 100 cannot be configured in to substrate and carry region 211.
In the example shown in Figure 14, the position of rotary middle point C is set at than the position of the more approaching the right of straight line L3 steady pin P2 of the position by following steady pin P3, and is set at more closer to the top than the straight line L1 of the position by left side steady pin P1.In the case of the position shown in Figure 14 is made as rotary middle point C, rotate if make substrate 100 carry region 211 along substrate, substrate 100 can contact with left side steady pin P1.Therefore, substrate 100 cannot be configured in to substrate and carry region 211.
In the example shown in Figure 15, the position of rotary middle point C is set at than the position of the more approaching the right of straight line L3 steady pin P2 of the position by following steady pin P3, and is set at than the straight line L2 of the position by the right steady pin P2 more on the lower.In the case of the position shown in Figure 15 is made as rotary middle point C, rotate if make substrate 100 carry region 211 along substrate, substrate 100 can contact with the right steady pin P2.Therefore, substrate 100 cannot be configured in to substrate and carry region 211.
In the example shown in Figure 16, the position of rotary middle point C is set at than the right steady pin P2 substrate more on the right side and carries the outside in region 211, and is set between two straight line L1, the straight line L2 of the position of passing through respectively left side steady pin P1 and the right steady pin P2.In the case of the position shown in Figure 16 is made as rotary middle point C, can make substrate 100 carry region 211 along substrate and rotate and do not contact with arbitrary steady pin.
Therefore, the position of the rotary middle point C that can make substrate 100 rotate along substrate lift-launch region 211 and not contact with arbitrary steady pin is than the straight line L3 of the position by following steady pin P3 more on the right side, and is to pass through respectively between two straight line L1, the straight line L2 of position of left side steady pin P1 and the right steady pin P2.In Figure 17, this region is shown to region A.
In addition, as shown in figure 18, will carry region 211 across substrate and be positioned at straight line that the position of the left side steady pin P1 of the opposition side of rotary middle point C is connected with rotary middle point C and by the position of rotary middle point C and the angle θ that forms of the straight line extending in the horizontal direction
mAXfor making substrate 100 rotate the maximum of the angle not contacting with steady pin.In order to make substrate 100 to be greater than angle θ
mAXangle be rotated, the distance that left side steady pin P1 and substrate carry the substrate 100 on region 211 can become excessive and fixing base 100 stably.Therefore, make the angle that substrate 100 rotates must be less than or equal to angle θ
mAX.
According to the described discussion of the situation that a plate base 100 is rotated, set as follows and make the position of the rotating shaft in situation that multiple substrates 100 rotate simultaneously, the i.e. position of rotary middle point C.That is to say, as shown in figure 19, rotary middle point C is positioned at the outer most edge of following vertical direction distance speech with regard to carry region 211 apart from the substrate the right steady pin P2 side shorter than left side steady pin P1, the substrate that is configured in the rightmost side carries the outside (right side) in region 211, and passing through respectively between the straight line L1 and straight line L2 of position of left side steady pin P1 and the right steady pin P2.
In addition be substrate 100 and the beeline of steady pin apart from steady pin farthest of rotating shaft, the substrate 100 and the distance of left side steady pin P1 that are configured in the leftmost side when rotated.The position of the right steady pin P2 that is positioned at the substrate lift-launch region 211 that is configured in the rightmost side at rotary middle point C, the distance maximum that the left side steady pin P1 in substrate 100 and substrate lift-launch region 211 is separated by when rotated.
The track of the outermost point of the substrate 100 when the curve r shown in Figure 19 is rotation.But, because cannot make the size of steady pin infinitely small, so the right steady pin P2 of pivot can contact with substrate 100.Therefore, as shown in arrow in Figure 19, must make rotary middle point C to than be configured in the rightmost side substrate carry region 211 the right steady pin P2 position more in the outer part (right side) skew.
In addition, the substrate 100 while rotation in order to reduce and the slippage of lift-launch face 210, be preferably and as shown in arrow in Figure 20, make rotary middle point C be offset upward.But although can reduce rotation amount by rotary middle point C is offset upward, as the track of the outermost point of the substrate 100 being represented by curve r in Figure 20, the distance that when rotation, substrate 100 and left side steady pin P1 are separated by diminishes.Thus, there is the relation of accepting or rejecting (trade off) in the distance between slippage and substrate 100 and the steady pin of substrate 100 and lift-launch face 210, and therefore the position of the vertical direction of rotary middle point C can at random be set between straight line L1 and straight line L2.
Above, show the example that substrate 100 rotates in the counterclockwise direction on lift-launch face 210.In the situation that being rotated in a clockwise direction, substrate 100 also can carry out identical discussion.That is to say, carry being set to and being shorter than the following vertical direction distance to the right steady pin P2 of carrying region 211 from substrate to the vertical direction distance of left side steady pin P1 below of region 211 from substrate.And, by rotary middle point C be set in the outer most edge of left side steady pin P1 side, the substrate that is configured in the leftmost side carries the outside (left side) in region 211, and be set in respectively between the straight line L1 and straight line L2 of the position by left side steady pin P1 and the right steady pin P2.
Therefore, the position of the rotating shaft that can make multiple substrates 100 rotate along substrate lift-launch region 211 and not contact with arbitrary steady pin is that the vertical direction in left side steady pin P1 and the right steady pin P2 is carried the outside in region 211 apart from the substrate of the outer most edge of shorter side, and is respectively by the region between two straight line L1, the straight line L2 of the position of left side steady pin P1 and the right steady pin P2 extension in the horizontal direction.
And making the maximum of the angle that multiple substrates 100 rotate is angle θ
mAXfor carrying region 211 straight line that position is farthest connected with the position of rotating shaft apart from the position of rotating shaft and by the position of rotating shaft and the angle that forms of the straight line extending in the horizontal direction across substrate in the position of left side steady pin P1 and the right steady pin P2.
In addition, the angle θ that substrate 100 is rotated is larger, and substrate 100 is larger with the slippage of lift-launch face 210.Therefore, be preferably the angle θ that substrate 100 is rotated less.For example, be in three degree by the angle initialization that substrate 100 is rotated.But angle θ is less, the distance between substrate 100 and steady pin when rotation is less.The mode set angle θ that therefore, can not contact with steady pin with substrate 100.The minimum value of the distance between for example, substrate 100 and steady pin while, being preferably to rotate becomes mode set angle θ more than about 1mm.
In brilliant boat type sample holder, as shown in figure 21, be spaced from each other and configuring abreast multiple substrate carrier 21 along the face normal direction of lift-launch face 210.According to the substrate equipped system shown in Fig. 1, carry multiple substrates 100 in each substrate carrier 21 simultaneously.
With respect to this, the substrate method for loading of the comparative example shown in Figure 22 is, in the mode that the while is carried a plate base 100 in each substrate carrier 21, substrate 100 is mounted in to multiple substrate carrier 21 simultaneously.Substrate method for loading shown in Figure 22 is difficult to improve the precision in substrate carrier 21, substrate 100 being positioned.Reason is, except carrying out in each substrate carrier 21 along the location of the direction of lift-launch face 210, also must consider the disposition interval between substrate carrier 21 and carry out along the location of the direction of the normal direction of lift-launch face 210.Because also will consider that substrate carrier 21 produces the possibility of distortion etc. and decides positioning precision, so need certain enough and to spare.Therefore, the substrate method for loading of the comparative example shown in Figure 22 must increase the permissible range of the stop position of substrate 100.So, the also necessary size that increases steady pin.Result can produce interval between the substrate 100 on lift-launch face 210 and become large, or by problems such as the enlarged areas of the caused non-one-tenth diaphragm area of steady pin.
On the other hand, according to the substrate equipped system of the Fig. 1 shown in Figure 21, because carry out mounted board 100 take a substrate carrier 21 as unit, can improve the position alignment precision of substrate 100.Therefore, the permissible range of the stop position of substrate 100 can be reduced, and the size of steady pin can be reduced.
Substrate transfer system shown in Fig. 1 can be used in example continous way (inline) manufacturing installation 300 as shown in figure 23.Figure 23 comprises that substrate is taken into the continous way manufacturing installation of chamber 301, process chamber 302, substrate taking-up chamber 303.In process chamber 302, carry out such as film forming processing, etch processes, sputter (spatter) processing etc.
In continous way manufacturing installation 300, utilize the substrate transfer system shown in Fig. 1 that the sample holder 20 that is carrying substrate 100 is taken into substrate and is taken into chamber 301.Then, sample holder 20 is taken into chamber 301 conveyances to process chamber 302 from substrate, the processing stipulating in process chamber 302.For example, form film on substrate 100 in process chamber 302 after, sample holder 20 is taken out chamber 303 from process chamber 302 by conveyance to substrate.Afterwards, take out chamber 303 from substrate and take out sample holder 20.
For example, at the continous way manufacturing installation 300 shown in Figure 23, for plasma activated chemical vapour deposition (CVD) film formation device, sample holder 20 is used as anode electrode.After unstrpped gas being directed in process chamber 302, make unstrpped gas become plasmoid to supplying with alternating electromotive force between sample holder 20 and cathode electrode.By substrate 100 is exposed in formed plasma, and form the desired film take the contained raw material of unstrpped gas as principal component on the surface of exposing of substrate 100.By suitable selection unstrpped gas, can on substrate 100, form the desired films such as Si semiconductor film, silicon nitride film, silicon oxide film, silicon oxynitride film, carbon film.For example, in the situation that substrate 100 is solar cell, can use ammonia (NH
3) and silane gas (SiH
4) mist on substrate 100, form silicon nitride (SiN) film as anti-reflective film or dielectric film.
In film forming processing of solar cell anti-reflective film etc., become in the temperature of substrate 100 that makes handling object under the state of the design temperature of predetermining and form film on substrate 100.Therefore,, when carrying out film forming while processing in continous way manufacturing installation 300, be taken in chamber 301 substrate 100 is preheated at substrate moving into process chamber 302.That is to say, substrate is taken into chamber 301 and doubles as and preheat chamber.Then, the substrate 100 that reaches design temperature is moved into process chamber 302 and carried out film forming processing.
As described above, the substrate transfer system of first embodiment of the invention, by making multiple substrates 100 utilize a common rotating shaft to be rotated on the lift-launch face 210 in substrate carrier 21, substrate 100 can be mounted in to substrate carrier 21 simultaneously.Therefore, can provide can be by multiple substrates 100 simultaneously and transfer load to accurately substrate transfer system and the method for transferring substrates of brilliant boat type sample holder.
(the second execution mode)
Figure 24 and Figure 25 represent the formation of the substrate transfer system of the second execution mode of the present invention.Figure 24 is the vertical view of observing from top.In the substrate transfer system of the second execution mode, be with the difference of the first execution mode, the substrate holding mechanism 15 of substrate loading device 10 is not only configured in the direction with the main surface parallel of substrate 100, is also configured in the normal direction of the interarea of substrate 100.That is to say, arranging substrate holding mechanism 15 illustrated in multiple the first execution modes along the normal direction of the interarea of kept substrate 100.Therefore, multiple substrates 100 from above kept respectively by substrate holding mechanism 15 in a matrix form while observing.Form about other, identical with the first execution mode.
In addition, certain arranged substrate holding mechanism 15 is not limited to three row.In the substrate transfer system shown in Figure 24, be only configured in the situation with the direction of the main surface parallel of substrate 100 with substrate holding mechanism 15 compared with, the sheet number of the substrate 100 that can simultaneously keep is more.
Along the distance between the arm 152 of the normal direction of the interarea of substrate 100 can and substrate carrier 21 between distance fixing accordingly, or can be also variable.For example, for can change interval in the time that substrate tray 40 obtains substrate 100, be variable and utilize actuator (actuator) to make the distance between arm 152.
In the substrate transfer system of the second execution mode, as shown in figure 25, arranging multiple substrate carrier 21 in the face normal direction of lift-launch face 210.In addition, example of arranging three plate base support plates 21 shown in Figure 25, but the sheet number of the substrate carrier 21 of arranging is not limited to three.Substrate holding mechanism 15 connects by armite 15A.
By using the substrate transfer system of the second execution mode, multiple substrates 100 can be mounted in to multiple substrate carrier 21 simultaneously.Therefore, can increase the sheet number of the substrate 100 that simultaneously transfers load to brilliant boat type sample holder.Thus, can shorten the time at sample holder mounted board 100.Similarly, can take out multiple substrates 100 from multiple substrate carrier 21 simultaneously.Other guide is identical in fact with the first execution mode, and omits the record repeating.
In addition, as shown in figure 24, in the time that substrate 100 is mounted in to each of multiple substrate carrier 21 simultaneously, importantly carry face 210 and be stably positioned at the position of regulation.Therefore, preferred use is fixed on the position of the distance between substrate carrier 21 or sample holder 20 apparatus for correcting of the position of regulation etc. accurately.
(other execution modes)
As mentioned above, the present invention is recorded by execution mode, but should not be construed as discussion and accompanying drawing restriction the present invention of a part that forms described announcement.Those skilled in the art should known various replacement execution modes, embodiment and application technology according to described announcement.
For example, the lift-launch face 210 that has been illustrated in substrate carrier 21 defines the example in four substrates lift-launch regions 211, is not limited to four but the substrate defining at a lift-launch face 210 carries the quantity in region 211.And, though the example that multiple substrates 100 are rotated in the counterclockwise direction on lift-launch face 210 is shown, also can make multiple substrates 100 be rotated in a clockwise direction.
As mentioned above, the present invention comprises here the various execution modes do not recorded etc. certainly.Therefore, technical scope of the present invention is only determined by the specific item of invention of appropriate claims according to described explanation.
[industrial utilizability]
Substrate transfer system of the present invention can be used in the purposes that multiple substrates is mounted in simultaneously to sample holder.
Claims (15)
1. a substrate transfer system, is characterized in that, comprising:
Substrate carrier, have to extend in vertical direction and define in the horizontal direction multiple rectangular substrate of arranging and carry the lift-launch face in region, and described in each substrate carry region periphery the left side, the right and configuring respectively below left side steady pin, the right steady pin and steady pin below; And
Substrate loading device, comprising: substrate holding mechanism, and the state that multiple rectangular substrate are configured in to same plane level with interarea separately keeps; Substrate travel mechanism, carry region with respect to described substrate when observing from described horizontal direction and the posture that tilts make the described interarea of the multiple described substrates that kept approaching with described lift-launch face and relative to; And substrate rotating mechanism, make multiple described substrates centered by a rotating shaft and rotate along described lift-launch face simultaneously; And described substrate loading device is mounted in multiple described substrates lift-launchs region with the left side, the right of described substrate and the mode being supported by described left side steady pin, described the right steady pin and described following steady pin respectively below by multiple described substrates simultaneously.
2. substrate transfer system according to claim 1, it is characterized in that: the following vertical direction distance that described left side steady pin and described the right steady pin carry region apart from described substrate is different, the described vertical direction that described rotating shaft is arranged in described left side steady pin and described the right steady pin is carried the outside in region apart from the described substrate of the outer most edge of shorter side, and between the position by described left side steady pin and described the right steady pin respectively two straight lines extending in described horizontal direction.
3. substrate transfer system according to claim 2, it is characterized in that: make the angle of multiple described substrate rotations be less than or equal to following two angles that straight line forms,, will in the position of described left side steady pin and described the right steady pin, carry regions and the straight line that position is farthest connected with the position of described rotating shaft apart from the position of described rotating shaft and the straight line extending by the position of described rotating shaft and in described horizontal direction across multiple described substrates.
4. substrate transfer system according to claim 3, is characterized in that: making the angle of multiple described substrate rotations is in three degree.
5. substrate transfer system according to claim 1, is characterized in that: described left side steady pin, described the right steady pin and described following steady pin carry region relative position with respect to described substrate is common location for multiple described substrates lift-launchs region.
6. substrate transfer system according to claim 1, it is characterized in that: described left side steady pin, described the right steady pin and described following steady pin are to comprise the pin structure that head and area of section are less than the shaft portion of described head, a part for the front extreme direction of described shaft portion is embedded in described lift-launch face, supports described substrate by the described shaft portion between described head and described lift-launch face.
7. substrate transfer system according to claim 1, is characterized in that: comprise multiple described substrate carrier.
8. substrate transfer system according to claim 1, is characterized in that: described substrate loading device comprises the multiple described substrate holding mechanism of arranging along the normal method of the interarea of kept described substrate,
Described substrate loading device is mounted in multiple described substrates the multiple described substrate carrier of arranging along the face normal direction of described lift-launch face simultaneously.
9. a method of transferring substrates, is characterized in that, comprises the following steps:
Prepared substrate support plate, described substrate carrier has to extend in vertical direction and define in the horizontal direction multiple rectangular substrate of arranging carries the lift-launch face in region, and described in each substrate carry region periphery the left side, the right and configuring respectively below left side steady pin, the right steady pin and steady pin below;
The state that multiple rectangular substrate are configured in to same plane level with interarea separately keeps;
The posture of carrying region with respect to described substrate when observing from described horizontal direction and tilt make the described interarea of the multiple described substrates that kept approaching with described lift-launch face and relative to; And
Make multiple described substrates centered by a rotating shaft and rotate along described lift-launch face simultaneously, thereby with the left side, the right of described substrate and the mode being supported by described left side steady pin, described the right steady pin and described following steady pin respectively below, multiple described substrates being mounted in to multiple described substrates lift-launchs region simultaneously.
10. method of transferring substrates according to claim 9, it is characterized in that: the following vertical direction distance that described left side steady pin and described the right steady pin carry region apart from described substrate is different, the position of described rotating shaft is set at described vertical direction in described left side steady pin and described the right steady pin and carries the outside in region apart from the described substrate of the outer most edge of shorter side, and be set at respectively the position by described left side steady pin and described the right steady pin and two straight lines extending in described horizontal direction between.
11. method of transferring substrates according to claim 10, it is characterized in that: make the angle of multiple described substrate rotations be less than or equal to following two angles that straight line forms,, will in the position of described left side steady pin and described the right steady pin, carry regions and the straight line that position is farthest connected with the position of described rotating shaft apart from the position of described rotating shaft and the straight line extending by the position of described rotating shaft and in described horizontal direction across multiple described substrates.
12. method of transferring substrates according to claim 11, is characterized in that: making the angle of multiple described substrate rotations is in three degree.
13. method of transferring substrates according to claim 9, is characterized in that: described left side steady pin, described the right steady pin and described following steady pin carry region relative position with respect to described substrate is common location for multiple described substrates lift-launchs region.
14. method of transferring substrates according to claim 9, it is characterized in that: described left side steady pin, described the right steady pin and described following steady pin are to comprise the pin structure that head and area of section are less than the shaft portion of described head, a part for the front extreme direction of described shaft portion is embedded in described lift-launch face, supports described substrate by the described shaft portion between described head and described lift-launch face.
15. method of transferring substrates according to claim 9, it is characterized in that: the substrate that comprises described interarea separately and be configured in multiple described substrates of described same plane level is listed as to the state of arranging multiple row with the face normal direction along described interarea and keeps, and multiple described substrates are mounted in to the multiple described substrate carrier of arranging along the face normal direction of described lift-launch face simultaneously.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012012648 | 2012-01-25 | ||
| JP2012-012648 | 2012-01-25 | ||
| PCT/JP2012/063185 WO2013111358A1 (en) | 2012-01-25 | 2012-05-23 | Substrate transfer system and substrate transfer method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103858220A true CN103858220A (en) | 2014-06-11 |
| CN103858220B CN103858220B (en) | 2016-05-04 |
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ID=48873112
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280049913.1A Expired - Fee Related CN103858220B (en) | 2012-01-25 | 2012-05-23 | Substrate transfer system and method for transferring substrates |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5704261B2 (en) |
| KR (1) | KR101555623B1 (en) |
| CN (1) | CN103858220B (en) |
| WO (1) | WO2013111358A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801370B (en) * | 2016-09-02 | 2020-08-04 | 松下知识产权经营株式会社 | Component transfer mechanism and component mounting device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015033442A1 (en) * | 2013-09-06 | 2015-03-12 | 株式会社島津製作所 | Substrate transfer system and substrate transfer method |
| JP6194733B2 (en) * | 2013-10-04 | 2017-09-13 | 株式会社島津製作所 | Substrate transfer system |
| WO2015075817A1 (en) * | 2013-11-22 | 2015-05-28 | 株式会社島津製作所 | Substrate processing system |
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| JPH05218181A (en) * | 1992-01-31 | 1993-08-27 | Canon Inc | Positioning mechanism of semiconductor substrate |
| JPH09283476A (en) * | 1996-04-08 | 1997-10-31 | Dainippon Screen Mfg Co Ltd | Substrate treatment device |
| JP2001185502A (en) * | 1999-12-22 | 2001-07-06 | Mitsubishi Electric Corp | Impurity diffusion method in semiconductor element manufacturing process, impurity diffusing device for use therein and semiconductor element manufactured therefrom |
| CN1721302A (en) * | 2004-07-15 | 2006-01-18 | 奇美电子股份有限公司 | Substrate conveying apparatus for sequence type substrate box |
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| JPH0250419A (en) * | 1988-08-12 | 1990-02-20 | Hitachi Ltd | Plasma cvd film-forming device |
| JPH0598449A (en) * | 1991-10-02 | 1993-04-20 | Ibiden Co Ltd | Wafer holding pin used for susceptor of plasma cvd device |
| JPH07307374A (en) * | 1994-05-10 | 1995-11-21 | Dainippon Screen Mfg Co Ltd | Substrate holding chuck, substrate holding unit and substrate treating device |
| JPH1197514A (en) * | 1997-09-24 | 1999-04-09 | Rohm Co Ltd | Structure of wafer support board for wafer surface treating apparatus |
| JP2004231999A (en) | 2003-01-28 | 2004-08-19 | Kyocera Corp | Continuous diode parallel flat plate type plasma-enhanced cvd system |
-
2012
- 2012-05-23 KR KR1020147006247A patent/KR101555623B1/en not_active IP Right Cessation
- 2012-05-23 WO PCT/JP2012/063185 patent/WO2013111358A1/en active Application Filing
- 2012-05-23 CN CN201280049913.1A patent/CN103858220B/en not_active Expired - Fee Related
- 2012-05-23 JP JP2013555097A patent/JP5704261B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05218181A (en) * | 1992-01-31 | 1993-08-27 | Canon Inc | Positioning mechanism of semiconductor substrate |
| JPH09283476A (en) * | 1996-04-08 | 1997-10-31 | Dainippon Screen Mfg Co Ltd | Substrate treatment device |
| JP2001185502A (en) * | 1999-12-22 | 2001-07-06 | Mitsubishi Electric Corp | Impurity diffusion method in semiconductor element manufacturing process, impurity diffusing device for use therein and semiconductor element manufactured therefrom |
| CN1721302A (en) * | 2004-07-15 | 2006-01-18 | 奇美电子股份有限公司 | Substrate conveying apparatus for sequence type substrate box |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107801370B (en) * | 2016-09-02 | 2020-08-04 | 松下知识产权经营株式会社 | Component transfer mechanism and component mounting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2013111358A1 (en) | 2015-05-11 |
| WO2013111358A1 (en) | 2013-08-01 |
| KR20140047158A (en) | 2014-04-21 |
| KR101555623B1 (en) | 2015-10-06 |
| JP5704261B2 (en) | 2015-04-22 |
| CN103858220B (en) | 2016-05-04 |
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