JPH1197514A - Structure of wafer support board for wafer surface treating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To vacuum-chuck the back side of a wafer in recesses at the surface and backside of a support plate through a vacuum pincette, without increasing the thickness of this plate by offsetting the recess at the surface of the plate from that at the backside thereof. SOLUTION: Recesses 13, 14 are cut into wafer-mounting regions of the surface and backside 11a, 11b of a support plate 11 such that the recesses 13, 14 communicate with one side face 11c of the plate 11 and mutually offset in the plate length direction, resulting in that the depth of only one of the recesses 13, 14 is added to the thickness T of the plate 11 and hence the recesses 13, 14 may be deep at the front and back surfaces 11a, 11b, without increasing the thickness T.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment apparatus for performing various surface treatments such as formation of an oxide film or a protective film on the surface of a wafer used in the manufacture of semiconductor components. It is about structure.

[0002]

2. Description of the Related Art As is well known in the art, the above-mentioned surface treatment apparatus for wafers is provided with a plurality of flat support plates arranged in parallel in a sealed container.
A wafer is attached to both sides of each support plate so as to be in close contact with each other, and in this state, various surface treatments are performed on the surface of the wafer.

In this case, conventionally, FIG. 3 and FIG.
As shown in FIG. 3, recessed grooves 3 and 4 are formed in portions of front and back surfaces 1a and 1b of the support plate 1 where the wafer 2 is mounted so that the recessed grooves 3 and 4 communicate with one side surface 1c of the support plate 1. By engraving, the wafer 2 having been subjected to the surface treatment on the front and back surfaces 1a and 1b of the support plate 1 is removed.
The support plate 1 is set with tweezers inserted into the concave grooves 3 and 4.
To remove it from.

[0004]

However, in the conventional support plate 1, the concave grooves 3 and 4 on the front and back surfaces 1a and 1b of the support plate 1 are provided at the same position so as to overlap each other. Therefore, the thickness T of the support plate 1 is set to a value obtained by adding an appropriate dimension S to twice the depth H of the double recessed grooves 3 and 4 so that the depth H of the two recessed grooves 3 and 4 is set. (T
= 2H + S).

[0005] That is, when the plate thickness T of the support plate 1 is increased, the concave grooves 3, 4 on the front and back surfaces 1 a, 1 b are increased.
The depth H can be increased, but the number of support plates that can be provided in the sealed container in the surface treatment apparatus is reduced by the increase in the plate thickness. Will be invited. Further, when the thickness T of the support plate 1 is reduced, the number of support plates that can be provided in the sealed container in the surface treatment apparatus increases, and the processing capability of the surface treatment can be increased. The depth H of the concave grooves 3 and 4 on the front and back surfaces 1a and 1b of the support plate 1 is reduced, and the depths H of the concave grooves 3 and 4 are set in the concave grooves 3 and 4, for example, as disclosed in Japanese Utility Model Laid-Open Publication No.
The conventional vacuum type tweezers described in JP-A-330388 and the like cannot be inserted, that is, the wafer cannot be vacuum-adsorbed on the back side by the vacuum type tweezers. In order to remove the surface-finished wafer 2 from the front and back surfaces 1a and 1b of the support plate 1, hand-operated tweezers having extremely thin tips are inserted, and the wafer 2 is sandwiched between the front and back surfaces by the manual tweezers. However, there is a problem that the surface of the wafer is likely to be scratched or dust such as metal powder is attached.

An object of the present invention is to provide a support plate structure that solves this problem.

[0007]

In order to achieve this technical object, the present invention provides a method for forming a concave groove in a portion of a surface treatment apparatus for a wafer, which is provided in a sealed container and which is provided on both front and back sides of the wafer for mounting a wafer. In the engraved support plate,
The concave groove on the front surface and the concave groove on the back surface of the support plate are shifted so that the two concave grooves do not overlap each other. ".

[0008]

As described above, the concave groove on the front surface of the support plate and the concave groove on the back surface are shifted so that the two concave grooves do not overlap each other, so that the thickness of the support plate is reduced. Since only the depth of one concave groove is added, without increasing the thickness of the support plate,
The depth of the concave groove on both the front and back surfaces can be made approximately twice as deep as the conventional one.

Therefore, according to the present invention, when removing a wafer which has been subjected to surface treatment on both the front and back surfaces of the support plate from the support plate, the concave grooves on both the front and back surfaces of the support plate can be provided without increasing the thickness of the support plate. The conventional well-known vacuum tweezers described above can be inserted therein, and the back side of the wafer can be vacuum-sucked with the vacuum tweezers, so that the surface of the wafer can be scratched without lowering the processing capacity. In addition, there is an effect that the possibility of adhering dust such as metal powder can be reliably reduced.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In this figure,
Reference numeral 11 denotes a support plate provided in a sealed container in the wafer surface treatment apparatus.
The wafer 12 is mounted on the back surface 1a and the back surface 11b such that the wafer 12 comes into close contact with an appropriate space along the longitudinal direction of the support plate 11.

Reference numeral 15 denotes a positioning pin for mounting the wafer 12, and each wafer 12
It is mounted so as to be in close contact with the support plate 11 by appropriate means (not shown). The recesses 13, 14 are formed in portions of the support plate 11 where the wafer 12 is to be mounted on the front surface 11 a and the back surface 11 b, respectively.
When the groove 14 is engraved so as to communicate with one side surface 11c of the support plate 11, the concave groove 13 on the front surface 11a of the support plate 11 and the concave groove 14 on the back surface 11b of the support plate 11 are formed. The support plates 11 are shifted from each other in the longitudinal direction so as not to overlap with each other.

As described above, the recessed grooves 13 on the front surface 11a of the support plate 11 and the recessed grooves 14 on the back surface 11b of the support plate 11 are moved so that the two recessed grooves 13, 14 do not overlap each other. 11, the depth H of one of the two concave grooves 13 and 14 is only added to the plate thickness T of the support plate 11. The groove 1 in the front and back surfaces 11a, 11b without increasing the plate thickness T in FIG.
The depth H of 3, 14 can be increased.

That is, in general, a plate having a thickness T of 3.2 mm is used as the support plate. Therefore, when the concave grooves on both front and back surfaces are provided so as to overlap the same place as in the conventional case, Since the depth of the concave groove on both front and back surfaces was 0.7 mm at the maximum, vacuum tweezers could not be inserted into this concave groove. On the other hand, the concave grooves 13 on the front and back surfaces 11a and 11b,
When the two grooves 14 are shifted from each other so as not to overlap with each other, the depth of the two grooves 13 and 14 can be doubled to 1.5 mm, which is the conventional depth.
Vacuum tweezers can be inserted into each of the wafers 3 and 14, and the back side of the wafer 12 can be vacuum-sucked by the vacuum tweezers.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a support according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a perspective view showing a conventional support plate.

FIG. 4 is a sectional view taken along line IV-IV of FIG. 3;

[Explanation of symbols]

 REFERENCE SIGNS LIST 11 support plate 11a front surface of support plate 11b back surface of support plate 11c one side surface of support plate 12 wafer 13, 14 concave groove

Claims (1)

[Claims] 1. A support plate provided in a sealed container in a wafer surface treatment apparatus, wherein a concave groove is engraved in a portion for mounting a wafer on both front and back surfaces, wherein a concave groove on a surface of the support plate is provided. And a concave groove on the back surface of the wafer supporting plate in the wafer surface treating apparatus, wherein the concave grooves are not overlapped with each other.