JP2014216383A - Substrate transfer system and substrate transfer method - Google Patents

Substrate transfer system and substrate transfer method Download PDF

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Publication number
JP2014216383A
JP2014216383A JP2013090483A JP2013090483A JP2014216383A JP 2014216383 A JP2014216383 A JP 2014216383A JP 2013090483 A JP2013090483 A JP 2013090483A JP 2013090483 A JP2013090483 A JP 2013090483A JP 2014216383 A JP2014216383 A JP 2014216383A
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substrate
substrate mounting
mounting
surface
mounting surface
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JP2013090483A
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JP6089920B2 (en
Inventor
直也 武田
Naoya Takeda
直也 武田
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株式会社島津製作所
Shimadzu Corp
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

PROBLEM TO BE SOLVED: To provide a substrate transfer system and a substrate transfer method capable of suppressing occurrence of scratches on the back surface of the substrate due to rotation thereof on a substrate plate, in the transfer of a substrate by means of a boat-type sample holder.SOLUTION: A substrate transfer system includes a substrate plate having a substrate mounting surface, in which a substrate mounting region for mounting a substrate is defined, and stretching in the vertical direction, and a transfer device for transferring a substrate on the substrate plate by changing the distance of the substrate and the substrate mounting surface, between a position where the back surface comes into contact with the substrate mounting region and a position separated therefrom, while rotating the substrate in a state where the back surface of the substrate faces the substrate mounting surface in parallel with the back surface of the substrate.

Description

  The present invention relates to a substrate transfer system and a substrate transfer method for transferring a substrate to a sample holder.

  In processing steps such as film formation and etching, the substrate is mounted on a sample holder and carried into a process processing apparatus. Sample holders include a cart type in which substrates are mounted horizontally and a boat type in which substrates are mounted vertically. In order to improve the processing efficiency, it is effective to increase the number of substrates that can be processed simultaneously using a boat-type sample holder (see, for example, Patent Document 1). By using a boat type sample holder having a plurality of substrate plates on which substrates are mounted, the footprint of a process processing apparatus that simultaneously processes a large number of substrates can be reduced. The mounting of the substrate on the sample holder and the recovery of the substrate from the sample holder are referred to as “substrate transfer”.

JP 2002-75884 A

  In transferring a substrate with a boat-type sample holder, there is a method of rotating the substrate by a predetermined angle on the substrate plate with the surface normal direction of the main surface of the substrate as a rotation axis. That is, when collecting the substrate, the robot hand is held on the substrate mounted on the substrate plate, and then the robot hand is rotated to tilt the substrate, for example, by 3 degrees. Thereafter, the robot hand is moved to recover the substrate from the substrate plate. Further, when the substrate is mounted, the substrate is brought into contact with the substrate plate in a state where the substrate is inclined by 3 degrees by the robot hand. Then, after rotating the robot hand so as to eliminate the tilt of the substrate, the robot hand releases the substrate and the substrate is mounted on the substrate plate.

  When the substrate is held on the substrate plate, a method of supporting the substrate from below or from the left and right by fixing pins is employed. At this time, a protrusion for supporting the substrate from the main surface side is formed at the tip of the fixing pin so that the substrate does not slide off the substrate plate. For example, when a flat type pin is used as the fixing pin, the substrate is supported from the side surface and the lower surface by the shaft portion of the fixing pin, and the substrate is supported from the main surface side by the head of the fixing pin.

  Therefore, in transferring the substrate with the sample holder, the substrate is placed directly above the substrate plate with the substrate tilted so that the substrate does not contact the protruding portion of the fixing pin, and then the substrate is placed between the protruding portion and the substrate plate. Rotate the substrate to position it. At this time, in order to suppress an increase in time required for transferring the substrate, it is preferable that the angle at which the substrate is rotated is small. The substrate is tilted, for example, by about 3 degrees so that the substrate does not contact the head of the fixing pin and the rotation angle of the substrate is as small as possible.

  When the above-mentioned substrate is transferred, the substrate rotates on the substrate plate, so that the substrate may come into contact with the surface of the substrate plate and scratch on the back surface of the substrate.

  The present invention provides a substrate transfer system and a substrate transfer method capable of suppressing the occurrence of scratches on the back surface of a substrate caused by the rotation of the substrate on the substrate plate in transferring the substrate with a boat type sample holder. Objective.

  According to one aspect of the present invention, (a) a substrate mounting surface on which a substrate mounting area on which a substrate is mounted is defined, a substrate plate extending vertically, and (b) a back surface of the substrate is a substrate mounting surface The substrate is moved on the substrate plate by changing the distance between the substrate and the substrate mounting surface between the position where the back surface is in contact with the substrate mounting area and the position where the substrate is separated from the substrate mounting area while rotating the substrate in a state of facing the substrate. There is provided a substrate transfer system including a transfer device for mounting.

  According to another aspect of the present invention, (b) a step of preparing a substrate plate having a substrate mounting surface in which a substrate mounting area on which a substrate is mounted is defined and extending in a vertical direction; While rotating the substrate with the back surface facing the substrate mounting surface in parallel, the distance between the substrate and the substrate mounting surface is changed between the position where the back surface is in contact with the substrate mounting region and the position where it is separated from the substrate mounting surface. A substrate transfer method for performing at least one of mounting the substrate on the substrate mounting area and collecting the substrate from the substrate mounting area.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate transfer system and board | substrate transfer method which can suppress generation | occurrence | production of the damage | wound of the board | substrate back surface which arises by rotation of the board | substrate on a board | substrate plate in transfer of a board | substrate with a boat type sample holder can be provided. .

It is a mimetic diagram showing composition of a substrate transfer system concerning a 1st embodiment of the present invention. It is a schematic diagram which shows operation | movement of the board | substrate transfer system which concerns on the 1st Embodiment of this invention (the 1). It is a schematic diagram which shows operation | movement of the board | substrate transfer system which concerns on the 1st Embodiment of this invention (the 2). It is a schematic diagram which shows operation | movement of the board | substrate transfer system which concerns on the 1st Embodiment of this invention (the 3). It is a schematic diagram which shows rotation of the board | substrate by the board | substrate transfer system which concerns on the 1st Embodiment of this invention (the 1). It is a schematic diagram which shows rotation of the board | substrate by the board | substrate transfer system which concerns on the 1st Embodiment of this invention (the 2). It is a schematic diagram which shows the structure of the fixing pin arrange | positioned at the board | substrate plate of the board | substrate transfer system which concerns on the 1st Embodiment of this invention. It is a schematic diagram for demonstrating the example of the board | substrate transfer method by the board | substrate transfer system which concerns on the 1st Embodiment of this invention (the 1). It is a schematic diagram for demonstrating the example of the board | substrate transfer method by the board | substrate transfer system which concerns on the 1st Embodiment of this invention (the 2). It is a schematic diagram for demonstrating the example of the board | substrate transfer method by the board | substrate transfer system which concerns on the 1st Embodiment of this invention (the 3). It is a schematic diagram for demonstrating the example of the board | substrate transfer method by the board | substrate transfer system which concerns on the 1st Embodiment of this invention (the 4). It is a schematic diagram for demonstrating the example of the substrate transfer method by the substrate transfer system which concerns on the 1st Embodiment of this invention (the 5). It is a schematic diagram for demonstrating the board | substrate mounting method by the board | substrate transfer system concerning the 1st Embodiment of this invention, Fig.13 (a) is a front view, FIG.13 (b) is a side view. It is a schematic diagram for demonstrating the board | substrate collection | recovery method by the board | substrate transfer system concerning the 1st Embodiment of this invention, Fig.14 (a) is a front view, FIG.14 (b) is a side view. FIG. 15B is a photograph showing a state in which a film is formed on the substrate plate, and FIG. 15B is an enlarged photograph of the region S in FIG. It is a schematic diagram for demonstrating the board | substrate transfer method of a comparative example. It is a photograph which shows the example of the damage | wound which generate | occur | produces on the back surface of a board | substrate by the board | substrate transfer method of a comparative example, FIG.17 (b) is a photograph which expanded the area | region R of Fig.17 (a). It is a photograph which shows the example of the damage | wound which generate | occur | produces on the back surface of a board | substrate by the board | substrate transfer method concerning the 1st Embodiment of this invention, FIG.18 (b) is a photograph which expanded a part of FIG.18 (a). . It is a schematic diagram which shows the example which transfers a board | substrate with several board | substrate plates by the board | substrate transfer system which concerns on the 1st Embodiment of this invention. It is a schematic diagram which shows the structure of the in-line type manufacturing apparatus which can apply the board | substrate transfer system which concerns on the 1st Embodiment of this invention. It is a schematic diagram which shows the structure of the board | substrate transfer system which concerns on the 2nd Embodiment of this invention. It is a schematic diagram which shows the example which transfers a board | substrate with several board | substrate plates by the board | substrate transfer system which concerns on the 2nd Embodiment of this invention.

  Embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic. Further, the embodiment described below exemplifies an apparatus and a method for embodying the technical idea of the present invention, and the embodiment of the present invention has the following structure and arrangement of components. It is not something specific. The embodiment of the present invention can be variously modified within the scope of the claims.

(First embodiment)
As shown in FIG. 1, the substrate transfer system 1 according to the first embodiment of the present invention has a substrate mounting surface 210 on which a substrate 100 is mounted, and a substrate plate 21 extending in the vertical direction, and a substrate plate And a transfer device 10 for transferring the substrate 100 at 21.

  As shown in FIG. 2, a substrate mounting area 211 on which the rectangular substrate 100 is mounted and a non-mounting area 212 around the substrate mounting area 211 are defined on the substrate mounting surface 210 of the substrate plate 21. On the substrate mounting surface 210 of the substrate plate 21 shown in FIG. 2, four substrate mounting areas 211 are defined by being arranged in the horizontal direction. One substrate 100 is mounted on one substrate mounting region 211. The transfer apparatus 10 can simultaneously mount a plurality of substrates 100 on the substrate mounting surface 210.

  Here, an example in which a plurality of substrate mounting areas 211 are defined on one substrate mounting surface 210 is shown. However, there may be one substrate mounting area 211 defined on one substrate mounting surface 210.

  As shown in FIGS. 1 and 2, a left side fixing pin P1, a right side fixing pin P2, and a lower side fixing pin P3 are respectively arranged on the left side, the right side, and the lower side of the outer periphery of each substrate mounting region 211. Hereinafter, the left side fixing pin P1, the right side fixing pin P2, and the lower side fixing pin P3 are collectively referred to as “fixing pins”.

  The relative positions of the left side fixing pin P1, the right side fixing pin P2, and the lower side fixing pin P3 with respect to each of the substrate mounting areas 211 are common to the plurality of substrate mounting areas 211. For this reason, when a plurality of substrates 100 mounted on the substrate plate 21 are processed, the influence of the fixing pins on each substrate 100 can be made the same. For example, when a film forming process is performed, an area where no film is formed due to the shadow of the fixed pin can be made common to all the substrates 100.

  When transferring the substrate 100 on the substrate plate 21, the transfer apparatus 10 rotates the substrate 100 in a state where the back surface of the substrate 100 faces the substrate mounting surface 210 in parallel, and the back surface is the substrate mounting region 211. The distance between the substrate 100 and the substrate mounting surface 210 is changed between a position in contact with the substrate and a position separated from the substrate. The substrate 100 rotates with the surface normal direction of the substrate mounting surface 210 as the central axis direction.

  The reason why the substrate 100 is rotated is to bring the substrate 100 close to or away from the substrate mounting surface 210 so that the substrate 100 does not contact the fixing pin. At this time, the distance between the substrate 100 and the substrate mounting surface 210 is changed while the substrate 100 is rotated, rather than the operation of changing the distance between the substrate 100 and the substrate mounting surface 210 and the rotation operation of the substrate 100 being performed separately. As a result, the time required to transfer the substrate 100 can be shortened.

  As shown in FIG. 1, the transfer apparatus 10 includes a substrate moving mechanism 11, a substrate rotating mechanism 13, and a substrate holding mechanism 15. A plurality of substrates 100 are simultaneously mounted on the substrate mounting area 211 so that the left side, the right side, and the lower side of the substrate 100 are supported by the left side fixing pin P1, the right side fixing pin P2, and the lower side fixing pin P3 by the transfer device 10, respectively. The In addition, the plurality of substrates 100 are simultaneously recovered from the substrate mounting area 211 by the transfer device 10. Below, operation | movement of the transfer apparatus 10 is demonstrated.

  The substrate holding mechanism 15 includes an adsorption portion 151 and an arm portion 152, and one substrate holding mechanism 15 is prepared for each substrate 100. The substrate 100 is adsorbed by the adsorbing portion 151 brought into contact with the main surface of the substrate 100, and the substrate holding mechanism 15 holds the plurality of substrates 100 in a state where the respective main surfaces are arranged on the same plane level. The suction unit 151 holds the substrate 100 by, for example, vacuum suction.

  The substrate moving mechanism 11 moves the substrate 100 closer to or away from the substrate mounting area 211. The substrate moving mechanism 11 shown in FIG. 1 includes a support column 111, a support rotation unit 112 that rotates the support column 111 about the vertical direction in which the support column 111 extends, and a support column 111 in the radial direction of the rotation. The extending beam portion 113 and the parallel moving portion 114 that moves the substrate holding mechanism 15 in the horizontal direction with the back surface of the substrate 100 facing the substrate mounting surface 210 in parallel. The substrate moving mechanism 11 is fixed by a fixing unit 17.

  A plurality of substrate holding mechanisms 15 are attached to the beam portion 113 along the direction in which the beam portion 113 extends. Specifically, the arm portion 152 of the substrate holding mechanism 15 is attached to the beam portion 113, and the arrangement pitch of the arm portion 152 in the beam portion 113 is equal to the arrangement pitch of the substrate mounting area 211 on the substrate mounting surface 210.

  The substrate moving mechanism 11 moves the plurality of substrates 100 held by the substrate holding mechanism 15 onto the substrate mounting surface 210 so that the main surface of the substrate 100 faces the substrate mounting surface 210. At this time, as shown in FIG. 2, the main surface is parallel to the substrate mounting surface 210 and obliquely above the substrate mounting region 211 and with respect to the substrate mounting region 211 when viewed from the surface normal direction of the substrate mounting surface 210. The substrate 100 is disposed in an oblique posture. Thereafter, the beam portion 113 moves downward along the column portion 111. As a result, as shown in FIG. 3, the substrate 100 is moved downward along the substrate mounting surface 210 in a vertical direction to a predetermined position. At this time, the substrate 100 remains inclined with respect to the substrate mounting region 211.

  As shown in FIG. 1, the translation unit 114 has one end connected to the support column rotation unit 112 and the other end connected to the fixed unit 17. And as shown in FIG. 4, it rotates centering | focusing on the connection point with the fixing | fixed part 17, and making a perpendicular direction into a rotating shaft direction. At this time, in order to move the substrate holding mechanism 15 in the horizontal direction with the back surface of the substrate 100 facing the substrate mounting surface 120 in parallel, the support column 15 is canceled so as to cancel the rotation around the connection point with the fixing portion 17. A connection point between the rotating unit 112 and the parallel moving unit 114 rotates.

  As shown in FIGS. 2 and 3, the substrate 100 is disposed in an oblique posture with respect to the substrate mounting region 211 when viewed from the surface normal direction of the substrate mounting surface 210. Specifically, as shown in FIG. 5, a straight line parallel to the lower side of the substrate 100 in an oblique posture intersects with a straight line parallel to the lower side of the substrate mounting area 211 at an angle θ at the rotation center point C. Thus, the substrate 100 is held.

  The substrate rotating mechanism 13 rotates the substrate 100 in a state where the back surface is parallel to the substrate mounting surface 210. Specifically, as shown in FIG. 5, the plurality of substrates 100 held obliquely with respect to the substrate mounting area 211 are parallel to the surface normal direction of the substrate mounting surface 210 and the rotation center point C is set. The passing straight line is simultaneously rotated by an angle θ using the passing straight line as a rotation axis. As a result, as shown in FIG. 6, the plurality of substrates 100 are simultaneously mounted on the substrate mounting region 211. That is, by simultaneously rotating the plurality of substrates 100 around one rotation axis, the plurality of substrates 100 move simultaneously along a direction perpendicular to the surface normal direction of the substrate mounting surface 210. Thereby, a plurality of substrates 100 can be transferred simultaneously.

  Further, in parallel with the operation of rotating the substrate 100 by the substrate rotating mechanism 13, as shown in FIG. 4, the parallel moving unit 114 holds the substrate with the back surface of the substrate 100 facing the substrate mounting surface 210 in parallel. The mechanism 15 is moved in the horizontal direction. Thus, the distance between the substrate 100 and the substrate mounting surface 210 can be changed while rotating the substrate 100 in a state where the back surface of the substrate 100 faces the substrate mounting surface 210 in parallel. Details of this operation will be described later.

  As the fixing pin, for example, a flat type pin 30 as shown in FIG. 7 can be adopted. The tip of the shaft portion 32 of the pin 30 is embedded in the substrate mounting surface 210. The substrate 100 is supported on the substrate mounting surface 210 by a part of the shaft portion 32 exposed in the gap between the head portion 31 of the pin 30 and the substrate mounting surface 210 generated thereby. The length t of the shaft portion 32 exposed on the substrate mounting surface 210 is set to be equal to the thickness of the substrate 100, and is about 200 μm, for example.

  The distance between the substrate mounting areas 211 is the minimum value of the diameter of the head 31 of the pin 30. That is, the smaller the diameter of the head portion 31 of the pin 30, the smaller the interval between the substrate mounting regions 211 can be. However, in order to stably hold the substrate 100, the diameter of the head portion 31 of the pin 30 is about 2 to 5 mm. For example, it is preferably about 3.6 mm. The interval between the substrate mounting areas 211 is preferably as narrow as possible, and the maximum value is, for example, about 10 mm.

  The operation of the transfer device 10 will be described below in the case where the substrates 100 arranged in the substrate tray with the main surface horizontal are mounted on the substrate plate 21.

  First, the transfer apparatus 10 sucks the substrate 100 to be processed. For example, as shown in FIG. 8, the substrate 100 is placed flat on the substrate arrangement surface 400 of the substrate tray 40 in a state where the main surface is arranged in the vertical direction. In this case, as shown in FIGS. 8 and 9, the transfer apparatus 10 brings the suction portion 151 of the substrate holding mechanism 15 into contact with the main surface of the substrate 100. FIG. 8 is a side view seen from the horizontal direction, and FIG. 9 is a plan view seen from the vertical direction. At this time, as shown in FIG. 10, the arm portion 152 of the substrate holding mechanism 15 extends in the horizontal direction. FIG. 10 is a side view seen from the tip of the beam portion 113.

  Thereafter, the substrate moving mechanism 11 moves the substrate 100 onto the substrate mounting surface 210 of the substrate plate 21. That is, as shown in FIG. 11 as viewed from the vertical direction, the beam rotating section 112 rotates the beam section 113 around the column section 111 as a rotation axis, and the substrate 100 is moved from the substrate tray 40 to the substrate plate 21. At this time, the beam portion 113 rotates with the extending direction of the beam portion 113 as a rotation axis, and the main surface of the substrate 100 becomes parallel to the vertical direction as shown in FIG. FIG. 12 is a side view seen from the tip of the beam portion 113. That is, the transfer apparatus 10 moves the substrate 100 while making the main surface of the substrate 100 vertical so that the main surface of the substrate 100 is parallel to the substrate mounting surface 210 of the substrate plate 21.

  Then, the substrate moving mechanism 11 places the substrate 100 on the substrate mounting surface 210 of the substrate plate 21, as shown in FIG. At this time, as already described, the substrate 100 is held obliquely with respect to the substrate mounting region 211 so as to form a predetermined angle θ. In addition, a certain distance is maintained between the back surface of the substrate 100 and the substrate mounting surface 210.

  Next, as described with reference to FIGS. 5 to 6, the substrate rotation mechanism 13 simultaneously rotates the plurality of substrates 100 along the substrate mounting surface 210 around one rotation axis. At this time, the substrate rotating mechanism 13 rotates the substrate 100 as indicated by an arrow in FIG. 13A, and at the same time, the distance between the substrate 100 and the substrate mounting surface 210 is changed by the parallel moving unit 114, as shown in FIG. As indicated by the arrow in b), the substrate 100 is brought close to the substrate plate 21. That is, the transfer apparatus 10 moves the substrate 100 to a position where the back surface is separated from the substrate mounting region 211 and faces the substrate mounting region 211, and then rotates the substrate 100 until the back surface contacts the substrate mounting region 211. , The substrate 100 is mounted on the substrate mounting region 211.

  As described above, each side of the substrate 100 and each side of the substrate mounting area 211 are adjusted in parallel, and the substrate 100 is arranged in the substrate mounting area 211. That is, the left side, the right side, and the lower side of the substrate 100 are respectively supported by the fixing pins, and the plurality of substrates 100 are simultaneously mounted on the plurality of substrate mounting regions 211. After the substrate holding mechanism 15 releases the substrate 100, the substrate moving mechanism 11 is retracted from the substrate plate 21.

  The transfer apparatus 10 may rotate the substrate 100 to a position where the substrate mounting region 211 and the substrate 100 completely overlap, or may rotate the substrate 100 until just before they completely overlap. For example, when the angle θ is 3 degrees, the substrate rotation mechanism 13 rotates the substrate 100 by 3 degrees. Alternatively, the substrate holding mechanism 15 releases the substrate 100 after the substrate rotating mechanism 13 makes the back surface of the substrate 100 contact the substrate mounting area 211 while rotating the substrate 100 by 2.5 degrees. Thereafter, the substrate 100 is placed in the substrate mounting area 211 in a state where it completely overlaps the substrate mounting area 211 while rotating further by its own weight. Then, after separating the substrate 100, the substrate rotating mechanism 13 further rotates the beam portion 113 by 0.5 degrees to retract the substrate moving mechanism 11.

  As described with reference to FIG. 2 and FIG. 3, the transfer apparatus 10 moves the substrate 100 in a posture inclined with respect to the substrate mounting area 211 when viewed from the horizontal direction along the substrate mounting surface 210 in the vertical direction. Move down. For this reason, the vertical distance from the lower side of the board mounting area 211 of the left side fixing pin P1 and the right side fixing pin P2 is set to be different from each other. When the substrate 100 is rotated in the counterclockwise direction when viewed from above the substrate mounting surface 210, as shown in FIGS. 5 and 6, the vertical distance from the lower side of the substrate mounting area 211 to the left side fixing pin P1. Also, the vertical distance from the lower side of the board mounting area 211 to the right side fixing pin P2 is set short.

  The transfer apparatus 10 moves the substrate 100 in an inclined posture so as to pass between the left side fixing pin P1 and the right side fixing pin P2 set as described above.

  As the angle θ for rotating the substrate 100 increases, the amount of sliding between the substrate 100 and the substrate mounting region 211 increases. For this reason, the angle θ for rotating the substrate 100 is preferably small. For example, the angle at which the substrate 100 is rotated is set within 3 degrees.

  Next, the operation of the transfer apparatus 10 will be described in the case where the substrate 100 mounted on the substrate plate 21 is collected.

  First, as shown in FIG. 1, the transfer apparatus 10 brings the suction portion 151 of the substrate holding mechanism 15 into contact with the main surface of the substrate 100. Then, the substrate 100 is adsorbed by the adsorption unit 151, and the substrate holding mechanism 15 holds the substrate 100.

  Next, the substrate rotation mechanism 13 rotates the substrate 100 in parallel with the substrate mounting surface 210 around one rotation axis. Accordingly, the substrate 100 is held obliquely with respect to the substrate mounting region 211 so as to form a predetermined angle (see FIG. 3). The angle at which the substrate 100 is rotated is, for example, about 3 degrees. The substrate rotation mechanism 13 starts rotating the substrate 100 from a state where the back surface of the substrate 100 is in contact with the substrate mounting area 211. At this time, as shown by the arrow in FIG. 14A, the substrate rotating mechanism 13 rotates the substrate 100, and at the same time, the distance between the substrate 100 and the substrate mounting surface 210 is changed by the parallel moving unit 114, and FIG. ), The substrate 100 and the substrate plate 21 are separated from each other as indicated by arrows.

  That is, the transfer apparatus 10 separates the substrate 100 from the substrate mounting surface 210 while rotating the substrate 100 from a position where the back surface contacts the substrate mounting area 211 to a position facing the substrate mounting surface 210. Therefore, when the rotation of the substrate 100 by the substrate rotation mechanism 13 is finished, the back surface of the substrate 100 and the substrate mounting surface 210 are separated by a certain distance.

  Then, the substrate moving mechanism 11 moves the substrate 100 vertically along the substrate mounting surface 210 to a predetermined position while maintaining a certain distance between the back surface of the substrate 100 and the substrate mounting surface 210. . At this time, the substrate 100 remains inclined with respect to the substrate mounting region 211. As a result, the substrate 100 is held by the transfer device 10 as shown in FIG.

  Thereafter, the substrate 100 is transferred to the substrate tray 40 by an operation opposite to the operation at the time of mounting in which the substrate 100 is moved from the substrate tray 40 onto the substrate plate 21. That is, the substrate moving mechanism 11 moves the substrate 100 held by the substrate holding mechanism 15 onto the substrate arrangement surface 400 of the substrate tray 40. At this time, the beam portion 113 rotates with the extending direction of the beam portion 113 as a rotation axis, and the main surface of the substrate 100 is made parallel to the substrate arrangement surface 400 while moving the substrate 100. Then, the substrate moving mechanism 11 arranges the substrate 100 on the substrate arrangement surface 400 of the substrate tray 40 (see FIGS. 8 and 9). As described above, the substrate 100 is moved from the substrate mounting surface 210 and the substrate 100 is recovered from the substrate mounting region 211.

  By the way, when the film forming process is performed on the substrate 100 mounted on the substrate plate 21, a film is also formed in the region around the substrate 100 of the substrate plate 21, that is, in the non-mounting region 212. For this reason, as the film forming process is repeated, a thick film is formed in the non-mounting area 212 of the substrate mounting area 211 of the substrate plate 21 as shown in FIGS. 15A and 15B.

  Therefore, when the substrate 100 is rotated with the back surface of the substrate 100 in contact with the substrate mounting surface 210 as in the comparative example shown in FIG. 16, the back surface of the substrate 100 and the film formed in the non-mounting region 212 rub against each other. . As a result, scratches along the rotation direction occur on the back surface of the substrate 100 as shown in black in FIGS. 17 (a) and 17 (b).

  In contrast, in the substrate transfer system 1 according to the first embodiment, the distance between the substrate 100 and the substrate mounting surface 210 is changed while the substrate 100 is rotated. For this reason, when the substrate 100 rotates, the back surface of the substrate 100 and the film on the non-mounting region 212 are suppressed from rubbing. Therefore, as shown in FIGS. 18A and 18B, the occurrence of scratches on the back surface of the substrate 100 is suppressed. For example, only a few linear scratches are generated above the marker M for indicating the position of the scratch.

  The distance between the substrate 100 and the substrate mounting surface 210 immediately before the rotation of the substrate 100 at the time of mounting the substrate (hereinafter referred to as “the distance at the time of mounting”), and the substrate 100 and the substrate immediately after the rotation of the substrate 100 at the time of substrate recovery The optimum value of the distance from the mounting surface 210 (hereinafter referred to as “distance at the time of collection”) varies depending on the cleaning cycle of the substrate plate 21 and the film formation time. That is, the distance at the time of mounting and the distance at the time of recovery are set so as not to contact the film formed in the non-mounting area 212 immediately before the cleaning of the substrate plate 21. For example, when the substrate plate 21 is cleaned when the film deposition amount in the non-mounting area 212 is 0.2 mm, the distance between the loading and the collecting distance is made larger than 0.2 mm. For example, the distance at the time of mounting is set to about 0.3 mm, and the distance at the time of collection is set to about 0.4 mm. These numbers were obtained by our experiments.

  In the substrate transfer system 1, a boat type sample holder having a plurality of substrate plates 21 can be employed. In this boat type sample holder, as shown in FIG. 19, a plurality of substrate plates 21 are arranged apart from and parallel to each other along the surface normal direction of the substrate mounting surface 210. In the substrate transfer system 1 shown in FIG. 1, a plurality of substrates 100 can be simultaneously mounted for each substrate plate 21.

  As described above, in the substrate transfer system 1 according to the first embodiment of the present invention, the distance between the substrate 100 and the substrate mounting surface 210 at the same time as the substrate 100 is rotated during substrate mounting and substrate recovery. To change. Therefore, even when the substrate 100 is rotated on the substrate mounting surface 210 in a state where a film is formed in the non-mounting region 212, generation of scratches on the back surface of the substrate caused by contact with the film formed on the substrate plate 21 is suppressed. it can. In particular, when both surfaces of the substrate 100 are used for solar cells, if the surface of the substrate 100 is flawed, the conversion efficiency decreases. Therefore, the substrate transfer system 1 is suitably used for manufacturing solar cells.

  The substrate transfer system 1 can be used, for example, in an in-line manufacturing apparatus 300 shown in FIG. FIG. 20 shows an in-line manufacturing apparatus including a substrate take-in chamber 301, a processing chamber 302, and a substrate take-out chamber 303. A film formation process or the like is performed in the processing chamber 302.

  The sample holder 20 shown in FIG. 20 is a boat type in which a plurality of substrate plates 21 are arranged in parallel along the surface normal direction of the substrate mounting surface 210 with their bottoms fixed by a fixing plate 22. Although FIG. 20 shows an example in which there are five substrate plates 21, the number of substrate plates 21 is not limited to five. The boat-type sample holder 20 can increase the number of substrates 100 that can be processed in one film forming process, and as a result, the overall processing time can be shortened.

  In the in-line manufacturing apparatus 300, the sample holder 20 on which the substrate 100 is mounted by the substrate transfer system 1 shown in FIG. Then, the sample holder 20 is transferred from the substrate taking-in chamber 301 to the processing chamber 302, and a predetermined process is performed in the processing chamber 302. For example, after a thin film is formed on the substrate 100 in the processing chamber 302, the sample holder 20 is transferred from the processing chamber 302 to the substrate extraction chamber 303. Thereafter, the sample holder 20 is taken out from the substrate take-out chamber 303. Then, the substrate 100 is collected from the sample holder 20 by the substrate transfer system 1.

  The sample holder 20 is transported between the chambers of the in-line manufacturing apparatus 300 by a transport device (not shown). For example, an openable / closable gate (not shown) is disposed between the substrate take-in chamber 301 and the process chamber 302 and between the process chamber 302 and the substrate take-out chamber 303, and the sample holder 20 moves through these gates. Note that the in-line manufacturing apparatus may have a structure including the substrate taking-in chamber 301 and the processing chamber 302 without the substrate taking-out chamber 303.

For example, when the in-line manufacturing apparatus 300 shown in FIG. 20 is a plasma chemical vapor deposition (CVD) film forming apparatus, the sample holder 20 is used as an anode electrode. After introducing the source gas into the processing chamber 302, AC power is supplied between the sample holder 20 and the cathode electrode to bring the source gas into a plasma state. By exposing the substrate 100 to the formed plasma, a desired thin film mainly composed of the raw material contained in the raw material gas is formed on the exposed surface of the substrate 100. By appropriately selecting the source gas, a desired thin film such as a silicon semiconductor thin film, a silicon nitride thin film, a silicon oxide thin film, a silicon oxynitride thin film, or a carbon thin film can be formed on the substrate 100. For example, when the substrate 100 is a solar battery cell, a silicon nitride (SiN) film as an antireflection film or an insulating film is formed on the substrate 100 using a mixed gas of ammonia (NH 3 ) gas and silane (SiH 4 ) gas. Can be formed.

  In film formation processing of the solar cell antireflection film, a film is formed on the substrate 100 in a state where the temperature of the substrate 100 to be processed is set to a predetermined set temperature. For this reason, when the in-line manufacturing apparatus 300 performs the film forming process, the substrate 100 is preheated in the substrate taking-in chamber 301 before being carried into the processing chamber 302. That is, the substrate taking-in chamber 301 also serves as a preheating chamber. Then, the substrate 100 that has reached the set temperature is carried into the processing chamber 302 and a film forming process is performed.

(Second Embodiment)
21 and 22 show the configuration of the substrate transfer system 1 according to the second embodiment of the present invention. FIG. 21 is a plan view seen from above. In the substrate transfer system 1 according to the second embodiment, the substrate holding mechanism 15 of the transfer apparatus 10 is arranged not only in the direction parallel to the main surface of the substrate 100 but also in the normal direction of the main surface of the substrate 100. This is a difference from the first embodiment. That is, a plurality of substrate holding mechanisms 15 described in the first embodiment are arranged along the normal direction of the main surface of the held substrate 100. Accordingly, the plurality of substrates 100 are respectively held by the substrate holding mechanism 15 in a matrix when viewed from above. About another structure, it is the same as that of 1st Embodiment.

  Of course, the substrate holding mechanisms 15 arranged are not limited to three rows. In the substrate transfer system shown in FIG. 21, the number of substrates 100 held at the same time is larger than when the substrate holding mechanism 15 is arranged only in the direction parallel to the main surface of the substrate 100.

  The distance between the arm portions 152 along the normal direction of the main surface of the substrate 100 may be fixed or variable according to the distance between the substrate plates 21. For example, in order to make the interval variable when acquiring the substrate 100 from the substrate tray 40, the distance between the arm portions 152 is made variable by an actuator.

  In the substrate transfer system 1 according to the second embodiment, a plurality of substrate plates 21 are arranged in the surface normal direction of the substrate mounting surface 210 as shown in FIG. Although FIG. 22 shows an example in which three substrate plates 21 are arranged, the number of arranged substrate plates 21 is not limited to three. The substrate holding mechanism 15 is connected by a connecting arm 15A.

  The transfer apparatus 10 holds a plurality of substrate rows each having a plurality of substrates 100 each having a main surface arranged at the same plane level in a state of being arranged along the surface normal direction of the main surface of the substrate 100. Then, the plurality of substrates 100 are simultaneously mounted on the plurality of substrate plates 21 arranged along the surface normal direction of the substrate mounting surface 210 in the same manner as the method described in the first embodiment. As a result, the plurality of substrates 100 are arranged in a matrix as viewed from above.

  By using the substrate transfer system 1 according to the second embodiment, a plurality of substrates 100 can be simultaneously mounted on a plurality of substrate plates 21. Therefore, it is possible to increase the number of substrates 100 to be simultaneously mounted on the boat type sample holder. Similarly, a plurality of substrates 100 can be recovered simultaneously from a plurality of substrate plates 21. Thereby, the time required for the transfer operation of the substrate 100 with the sample holder can be shortened. Then, by changing the distance between the substrate 100 and the substrate mounting surface 210 while rotating the substrate 100 when mounting the substrate and when collecting the substrate, scratches on the back surface of the substrate caused by contact with the film formed on the substrate plate 21 are prevented. Generation can be suppressed. Others are substantially the same as those in the first embodiment, and redundant description is omitted.

  As shown in FIG. 22, in order to simultaneously mount the substrate 100 on each of the plurality of substrate plates 21, it is important that the substrate mounting surface 210 is stably positioned at a predetermined location. For this reason, it is preferable to use a correction device or the like that fixes the distance between the substrate plates 21 or the position of the sample holder 20 to a predetermined position with high accuracy.

(Other embodiments)
As mentioned above, although this invention was described by embodiment, it should not be understood that the description and drawing which form a part of this indication limit this invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  For example, an example is shown in which four substrate mounting areas 211 are defined on the substrate mounting surface 210 of the substrate plate 21, but the number of substrate mounting areas 211 defined on one substrate mounting surface 210 is limited to four. Absent. Moreover, although the example which rotates the some board | substrate 100 on the board | substrate mounting surface 210 counterclockwise was shown, you may rotate it clockwise.

  As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

DESCRIPTION OF SYMBOLS 1 ... Substrate transfer system 10 ... Transfer apparatus 11 ... Substrate movement mechanism 13 ... Substrate rotation mechanism 15 ... Substrate holding mechanism 17 ... Fixed part 20 ... Sample holder 21 ... Substrate plate 30 ... Pin 40 ... Substrate tray 100 ... Substrate 111 ... Supporting part 112: Supporting part rotating part 113 ... Beam part 114 ... Parallel moving part 120 ... Substrate mounting surface 151 ... Adsorption part 152 ... Arm part 210 ... Substrate mounting surface 211 ... Substrate mounting area 212 ... Non-mounting area 300 ... In-line manufacturing apparatus 301 ... Substrate take-in chamber 302 ... Processing chamber 303 ... Substrate take-out chamber 400 ... Substrate placement surface

Claims (16)

  1. A substrate plate having a substrate mounting surface in which a substrate mounting area on which the substrate is mounted is defined and extending in a vertical direction;
    While rotating the substrate with the back surface of the substrate facing the substrate mounting surface in parallel, the substrate and the substrate mounting surface between the position where the back surface is in contact with the substrate mounting region and the spaced position And a transfer device that transfers the substrate on the substrate plate by changing the distance of the substrate.
  2.   After the transfer device has moved the substrate to a position where the back surface is spaced apart and opposed to the substrate mounting region, the substrate mounting surface is rotated while rotating the substrate until the back surface contacts the substrate mounting region. 2. The substrate transfer system according to claim 1, wherein the substrate is mounted on the substrate mounting region in a manner close to the substrate.
  3.   The transfer device is separated from the substrate mounting surface while rotating the substrate from a position where the back surface is in contact with the substrate mounting area to a position facing the substrate mounting surface. The substrate transfer system according to claim 1, wherein the substrate is recovered from the substrate mounting area by being moved from a substrate mounting surface.
  4. The transfer device is
    A substrate holding mechanism for holding the substrate;
    A substrate moving mechanism for moving the substrate holding mechanism in a horizontal direction with the back surface of the substrate facing the substrate mounting surface in parallel;
    The substrate transfer system according to claim 1, further comprising: a substrate rotation mechanism that rotates the substrate in a state where the back surface is parallel to the substrate mounting surface.
  5. A plurality of the substrate mounting areas are defined on the substrate mounting surface,
    2. The transfer apparatus according to claim 1, wherein the plurality of substrates are simultaneously transferred in the plurality of substrate mounting regions by simultaneously rotating the plurality of substrates around one rotation axis. 5. The substrate transfer system according to any one of 1 to 4.
  6. A left side fixing pin, a right side fixing pin and a lower side fixing pin are arranged on the left side, the right side and the lower side of the outer periphery of the substrate mounting area, respectively.
    The transfer device is configured such that the back surface is parallel to the substrate mounting surface and the substrate is tilted with respect to the substrate mounting region when viewed from the surface normal direction of the substrate mounting surface. The substrate transfer system according to any one of claims 1 to 5, wherein the substrate is moved so as to pass between a left side fixing pin and the right side fixing pin.
  7.   The substrate transfer system according to claim 1, wherein an angle at which the substrate is rotated is within 3 degrees.
  8.   The substrate transfer system according to claim 1, wherein two main surfaces of the plate facing each other are the substrate mounting surfaces.
  9.   The substrate transfer system according to claim 1, comprising a plurality of the substrate plates.
  10. Preparing a substrate plate having a substrate mounting surface in which a substrate mounting area on which the substrate is mounted is defined and extending in a vertical direction;
    While rotating the substrate with the back surface of the substrate facing the substrate mounting surface in parallel, the substrate and the substrate mounting surface between the position where the back surface is in contact with the substrate mounting region and the spaced position And transferring the substrate on the substrate plate, and mounting at least one of mounting the substrate on the substrate mounting region and collecting the substrate from the substrate mounting region. A substrate transfer method characterized in that the method is performed.
  11. Mounting the substrate on the substrate mounting region comprises:
    Moving the substrate to a position where the back surface is spaced apart and opposed to the substrate mounting region;
    The substrate transfer method according to claim 10, further comprising the step of causing the substrate to approach the substrate mounting surface while rotating the substrate until the back surface contacts the substrate mounting region.
  12. Recovering the substrate from the substrate mounting area;
    Separating the substrate from the substrate mounting surface while rotating the substrate from a position where the back surface contacts the substrate mounting region to a position facing the substrate mounting surface.
    The substrate transfer method according to claim 10, further comprising: moving the substrate from the substrate mounting surface.
  13. Defining a plurality of substrate mounting areas on the substrate mounting surface;
    The plurality of substrates are simultaneously transferred in the plurality of substrate mounting regions by simultaneously rotating the plurality of substrates around one rotation axis. 2. The substrate transfer method according to item 1.
  14. The left side fixing pin, the right side fixing pin, and the lower side fixing pin are arranged on the left side, the right side, and the lower side of the outer periphery of the board mounting area,
    The substrate is fixed to the left-side fixing pin and the right-side fixing in such a manner that the back surface faces the substrate-mounting surface in parallel and the substrate is inclined with respect to the substrate-mounting region when viewed from the surface normal direction of the substrate-mounting surface. It moves so that it may pass between pins. The board | substrate transfer method of any one of Claims 10 thru | or 13 characterized by the above-mentioned.
  15.   The substrate transfer method according to claim 10, wherein an angle at which the substrate is rotated is within 3 degrees.
  16.   The substrate transfer method according to claim 10, wherein two main surfaces of the plate facing each other are the substrate mounting surfaces.
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JPH0598449A (en) * 1991-10-02 1993-04-20 Ibiden Co Ltd Wafer holding pin used for susceptor of plasma cvd device
JPH05218181A (en) * 1992-01-31 1993-08-27 Canon Inc Positioning mechanism of semiconductor substrate
JPH07307374A (en) * 1994-05-10 1995-11-21 Dainippon Screen Mfg Co Ltd Substrate holding chuck, substrate holding unit and substrate treating device
JPH09283476A (en) * 1996-04-08 1997-10-31 Dainippon Screen Mfg Co Ltd Substrate treatment device
JPH10194450A (en) * 1997-01-06 1998-07-28 Nikon Corp Substrate carrying method and substrate carrying device
JPH10256340A (en) * 1997-03-17 1998-09-25 Dainippon Screen Mfg Co Ltd Substrate carrying device, substrate treatment device and substrate treatment method
JPH1197514A (en) * 1997-09-24 1999-04-09 Rohm Co Ltd Structure of wafer support board for wafer surface treating apparatus
JP2001185502A (en) * 1999-12-22 2001-07-06 Mitsubishi Electric Corp Impurity diffusion method in semiconductor element manufacturing process, impurity diffusing device for use therein and semiconductor element manufactured therefrom
JP2005272113A (en) * 2004-03-25 2005-10-06 Sharp Corp Substrate carrying device and substrate carrying method
JP2011173732A (en) * 2011-04-25 2011-09-08 Ihi Corp Substrate mounting method and substrate take-out method

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6419726A (en) * 1987-07-15 1989-01-23 Hitachi Ltd Wet treater
JPH0250419A (en) * 1988-08-12 1990-02-20 Hitachi Ltd Plasma cvd film-forming device
JPH0598449A (en) * 1991-10-02 1993-04-20 Ibiden Co Ltd Wafer holding pin used for susceptor of plasma cvd device
JPH05218181A (en) * 1992-01-31 1993-08-27 Canon Inc Positioning mechanism of semiconductor substrate
JPH07307374A (en) * 1994-05-10 1995-11-21 Dainippon Screen Mfg Co Ltd Substrate holding chuck, substrate holding unit and substrate treating device
JPH09283476A (en) * 1996-04-08 1997-10-31 Dainippon Screen Mfg Co Ltd Substrate treatment device
JPH10194450A (en) * 1997-01-06 1998-07-28 Nikon Corp Substrate carrying method and substrate carrying device
JPH10256340A (en) * 1997-03-17 1998-09-25 Dainippon Screen Mfg Co Ltd Substrate carrying device, substrate treatment device and substrate treatment method
JPH1197514A (en) * 1997-09-24 1999-04-09 Rohm Co Ltd Structure of wafer support board for wafer surface treating apparatus
JP2001185502A (en) * 1999-12-22 2001-07-06 Mitsubishi Electric Corp Impurity diffusion method in semiconductor element manufacturing process, impurity diffusing device for use therein and semiconductor element manufactured therefrom
JP2005272113A (en) * 2004-03-25 2005-10-06 Sharp Corp Substrate carrying device and substrate carrying method
JP2011173732A (en) * 2011-04-25 2011-09-08 Ihi Corp Substrate mounting method and substrate take-out method

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