JP2001196345A - Substrate guide device and cleaning equipment using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate guide device which can support a substrate by preventing the occurrence of contact contamination, can improve the setting accuracy of the positions and states of nozzles for cleaning, etc., and a substrate and the treating efficiency of cleaning, etc., can be simplified in constitution, and can be reduced in manufacturing cost. SOLUTION: The substrate guide device is provided with a pair of fluid blowing-out nozzles which are arranged in such a way that their supply openings 202a and 202b are faced oppositely to each with a gap in between and a fluid supplying means which supplies a fluid to the nozzles 201a and 201b. The guide device controls the relative distances between the substrate 10 inserted into the gap between the ports 202a and 202b and the nozzles 201a and 201b by blowing out the fluid from the openings 202a and 202b of the nozzles into the gap.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate guide apparatus and a cleaning apparatus using the same, and more particularly to a technique suitable for use in a cleaning process in a manufacturing process of a semiconductor device, a liquid crystal display panel, and the like.

[0002]

2. Description of the Related Art In the field of electronic devices such as semiconductor devices and liquid crystal display panels, a process of cleaning a semiconductor substrate or a glass substrate, which is a substrate to be processed, is essential during the manufacturing process. Such a cleaning process requires a step of removing organic substances attached to the substrate surface. In that case, for example, a wet process in which various cleaning liquids are brought into contact with the substrate for cleaning, and a dry process in which ultraviolet rays (UV) are emitted can be selected.

In the wet treatment, various cleaning liquids such as ultrapure water, electrolytic ionic water, ozone water and hydrogen water are used to remove various substances to be removed during the manufacturing process. The cleaning liquid is supplied onto the substrate from the cleaning nozzle of the cleaning device. However, when a conventional general cleaning nozzle is used, there is a problem that the amount of the cleaning liquid used increases. Therefore, the present applicant has already filed an application for a liquid-saving cleaning nozzle that can greatly reduce the amount of cleaning liquid used compared to the conventional type. One example of this type of cleaning nozzle is shown in FIGS. FIG. 13A is a bottom view of the cleaning nozzle, and FIG.
FIG. 3 is a side sectional view taken along line XIII. As shown in these drawings, the cleaning nozzle 100 has an introduction passage 101 having an introduction port 101a for introducing the cleaning liquid L at one end, and an outlet for discharging the used cleaning liquid L to the outside of the system at one end. 10
2a is provided, and the introduction passage 1 is provided.
01 and the discharge passage 102 at the other end thereof to form an intersection 103, and the intersection W
An opening 104 is provided to open toward the camera. A pressure reducing pump (not shown) is connected to the discharge port 102 a of the discharge passage 102, and by controlling the suction pressure of the pressure reducing pump, the pressure of the cleaning liquid L in contact with the atmosphere of the opening 104 (the cleaning liquid L) is controlled. L (including the surface tension of the surface to be cleaned of the substrate W) and the atmospheric pressure.

[0004] That is, in contact with the atmosphere of the opening 104
Pressure P of the cleaning liquid L_w(Surface tension of cleaning liquid and substrate W
(Including the surface tension of the surface to be cleaned) and the atmospheric pressure P_aThe relationship with P_w
≒ P _aBy doing so, the substrate W
Is supplied to the substrate W and comes into contact with the substrate W.
Discharge to the discharge passage 102 without leaking to the outside of the
Will be issued. Therefore, the cleaning nozzle 100
The cleaning liquid L supplied to the substrate W supplies the cleaning liquid L on the substrate W.
Do not touch any part other than the part (opening 104)
That is, it is removed from the substrate W. Like this
Therefore, the proposed cleaning nozzle is more clean than the conventional nozzle.
The use amount of the purified liquid can be greatly reduced. Also,
These cleaning liquids are supplied to the cleaning nozzle
Ultrasonic vibration by applying ultrasonic vibration with the ultrasonic transducer
Was sometimes performed.

[0005] On the other hand, in the dry process, ultraviolet rays emitted from an ultraviolet light source of a cleaning nozzle are irradiated on a substrate or the like to decompose and remove organic substances and the like, thereby cleaning the substrate surface.

In some cases, it is necessary to dry the substrate before flowing the substrate after the wet processing to the next step. In this case, for example, an arbitrary drying gas, for example, a drying gas connected to a supply source of air is used. A substrate was dried by using a drying apparatus having a nozzle, a so-called air knife, and blowing air toward the substrate from a slit at the tip of the nozzle. In such a drying process of a substrate or the like, in order to reduce the amount of air ejected from the drying nozzle and to reduce the amount of the gas-liquid mixture remaining on the surface of the object (substrate) to be processed, one nozzle is used. There is a configuration in which the gas-liquid mixture is immediately discharged from the gas-liquid mixture discharge unit immediately after the drying gas is injected from the gas supply unit for drying. In addition to the above-described cleaning processing, there are various surface treatments of substrates and the like performed by relatively moving each processing nozzle and the substrate.

[0007]

In the liquid-saving type cleaning nozzle used for the wet processing as described above, it is desired to reduce the distance between the substrate and the cleaning nozzle in order to reduce the amount of the cleaning liquid to be used. There was a request. In addition, there has been a demand for reducing the distance between the substrate and the cleaning nozzle in order to prevent a reduction in cleaning efficiency in ultrasonic cleaning using an ultrasonic vibrator. Also, in the dry treatment by UV irradiation as described above, it is desired to reduce the distance between the UV cleaning nozzle and the substrate in order to prevent a decrease in the illuminance of ultraviolet light on the substrate surface and maintain the efficiency of decomposing and cleaning organic substances and the like. Request existed. Further, there is a demand for reducing the distance between the drying nozzle and the substrate in order to reduce the amount of air ejected from the drying nozzle and to reduce the amount of the gas-liquid mixture remaining on the surface of the workpiece (substrate). Was. Similarly, in the case of surface treatment of various substrates and the like performed by relatively moving each processing nozzle and the substrate, there is a demand for reducing the distance between the nozzles and the substrate in order to improve processing efficiency. Existed.

Here, for example, when processing a substrate having a size of several hundred mm square, there is a possibility that a substrate made of glass or the like may be deformed such as warp or undulation. Further, the deformation of the substrate, such as warpage or undulation, increases the size of the substrate, and
When it is about 000 mm square, it is expected that it will be about 2 mm to 3 mm with respect to the normal direction of the surface of the substrate. Further, after various films are formed on the substrate surface, the amount of warpage generally increases further. For this reason, if the distance between each nozzle and the substrate surface is about 1 mm to 1.5 mm, there is a possibility that the substrate contacts the nozzle, and in order to prevent this, the distance between the nozzle and the substrate surface is set to this 1 mm. ~ 1.5m
It is necessary to set it sufficiently larger than about m. As a result, there has been a problem in that the cleaning efficiency and the like on the substrate surface are reduced, and a sufficient effect may not be obtained. Furthermore, when the distance is set large, there is a problem that a short cleaning time may not be able to obtain a sufficient cleaning effect.

Further, when a process such as cleaning is performed by relatively moving the nozzle and the substrate while contacting and supporting the entire surface of the substrate by a roller conveyor or the like provided continuously, the surface of the substrate in contact with the supporting portion is contaminated. Therefore, it is necessary to reduce the area of the contact portion. In addition, if only a part of the substrate surface, such as an edge, is supported to prevent this contamination, deformation of the entire substrate, such as warpage, undulation, and bending, may increase, and the processing efficiency such as cleaning may decrease. There was a problem that it was not practical. Further, there is always a demand for downsizing of the apparatus and reduction of manufacturing costs and running costs.

The present invention has been made in view of the above circumstances, and aims to achieve the following objects. At the time of processing such as cleaning, correction of deformation such as warpage or undulation of an object to be processed such as a substrate. An object of the present invention is to improve the accuracy of setting the positional state between a nozzle for processing such as cleaning and a substrate. Improve processing efficiency such as cleaning. Minimize contact contamination and support the substrate. To simplify the device configuration and reduce the manufacturing cost.

[0011]

According to the present invention, there is provided a substrate guide apparatus comprising: a pair of fluid ejection nozzles having outlets opposed to each other and arranged at intervals; and supplying a fluid to each of the pair of fluid ejection nozzles. Fluid supply means,
This problem is solved by blowing out this fluid from the outlet of the fluid outlet nozzle into the gap to control the relative distance between the substrate inserted into the gap and the fluid outlet nozzle. In the substrate guide device of the present invention, it is preferable that the outlet is formed of a porous member. Further, in the substrate guide device of the present invention, the pair of fluid ejection nozzles are arranged at intervals in a vertical direction, and a substrate positioned substantially horizontally is inserted into the gap, and the pair of fluid ejection nozzles is provided. Means for setting a distance between the fluid blowing nozzle located above the substrate and the substrate surface in a range of 1 mm to 10 mm,
The interval between the fluid ejection nozzle located below the substrate and the back surface of the substrate among the pair of fluid ejection nozzles is 0.1.
Means set in the range of mm to 10 mm can also be employed. Further, in the substrate guide device of the present invention, a fluid suction nozzle for sucking and discharging the fluid blown out from the outlet may be provided near the outlet. In the cleaning apparatus of the present invention, the substrate guide device, a relative moving unit that relatively moves the fluid ejection nozzle of the substrate guide device and the substrate inserted into a gap between the pair of fluid ejection nozzles, And a cleaning nozzle for cleaning the substrate, the cleaning nozzle being provided on the downstream side of the fluid ejection nozzle in the direction. Further, in the cleaning apparatus of the present invention, the substrate guide device, a relative moving means for relatively moving the fluid ejection nozzle of the substrate guide device and the substrate inserted into a gap between the pair of fluid ejection nozzles, A cleaning nozzle provided on an upstream side of the fluid blowing nozzle in a substrate moving direction to clean the substrate.

A substrate guide device according to the present invention is characterized in that a fluid, which is a liquid or a gas, is blown out from a pair of fluid blowout nozzles through a blowout opening of the fluid blowout nozzle into the gap, whereby the substrate inserted into the gap and the fluid are blown out. The substrate can be supported in a state where the relative distance to the blow nozzle is controlled. This makes it possible to support the substrate in a state where contact contamination of the substrate is prevented without directly contacting the substrate, and to set the position of the substrate in the normal direction of the substrate surface. The substrate can be easily moved in the direction of the substrate surface in a state where the deformation of the substrate is corrected.

The substrate guide device of the present invention can uniformly eject a fluid from the surface of the air outlet formed by the porous member, thereby generating a uniform pressure on the substrate in the surface direction. In addition, it is possible to set the position of the substrate with respect to the normal direction of the substrate surface to a desired state, and at the same time, it is possible to correct the deformation of the substrate over a predetermined range in the surface direction. It is also possible to adopt an air knife-like configuration in which gas is blown from a slit extending in the substrate width direction.

In the substrate guide device of the present invention,
By controlling the amount of fluid supplied to the fluid ejection nozzle by the fluid supply means, the distance between the fluid ejection nozzle located above the substrate and the substrate surface among the pair of fluid ejection nozzles is 1 mm to 10 mm. The distance between the fluid ejection nozzle located below the substrate and the back surface of the substrate is set in the range of 0.1 mm to 10 mm. This makes it possible to set the vertical position and the vertical shape of the substrate so that the substrate surface direction is substantially the same as the horizontal direction. Here, when the distance between the fluid ejection nozzle located above the substrate and the substrate surface of the pair of fluid ejection nozzles is set to less than 1 mm, the substrate and the upper fluid ejection nozzle come into contact with each other. In addition to this, it is difficult to control the flow of the fluid, and the effect of correcting the deformation of the substrate is reduced. As a result, when the substrate guide device is applied to a cleaning device, the cleaning efficiency is reduced, which is not preferable. Further, when the distance between the upper fluid ejection nozzle and the substrate surface is set to be larger than 10 mm, in order to correct deformation such as warpage and distortion of the substrate and maintain the substrate at a predetermined position and shape. In addition, there is a problem that a large amount of fluid to be ejected toward the substrate is required, and the possibility of contaminating the substrate increases. In addition, when the amount of the fluid to be ejected is insufficient, it is difficult to set the position of the substrate while keeping the pressure of the fluid uniform in the substrate surface direction, which is not preferable. Further, the interval between the fluid ejection nozzle located on the lower side of the substrate and the back surface of the substrate among the pair of fluid ejection nozzles is such that the substrate is held by a holding member such as a roller. It can be maintained with higher controllability than the distance from the substrate surface. This interval is 0.
If the distance is set to less than 1 mm, the controllability of the fluid is low, and the controllability of the distance is reduced, and the possibility that the substrate and the lower fluid ejection nozzle come into contact occurs, which is not preferable. . Further, when the distance between the lower fluid ejection nozzle and the substrate surface is set to be larger than 10 mm, a large amount of fluid is ejected to the substrate to correct the deformation of the substrate and to support the substrate. This requires a pressurizing means or the like as a fluid supply means corresponding to the amount thereof, which causes a problem that the space and cost required for the apparatus increase, and that the pressure of the fluid is reduced on the substrate surface. It is difficult to set the position of the substrate in the vertical direction as a state uniform in the direction, at least a state uniform in the substrate width direction. Moreover, it becomes a factor of generating mist of the fluid, which is not preferable.

Further, in the substrate guide device of the present invention,
By suctioning and discharging the fluid blown out from the outlet from a fluid suction nozzle provided near the outlet, it is possible to more easily control the pressure of the fluid applied to the substrate, and to change the state of the substrate. Gases such as air, ozone, hydrogen, and the like, and fluids containing these, such as liquids, can be recovered. In addition, thereby, it is possible to reduce the running cost, and it is possible to make the substrate guide device of the present invention a common configuration with a processing nozzle for a cleaning process or the like,
Compared with the case where the substrate guide device is provided separately from these processing nozzles, the manufacturing cost and space of the device can be reduced.

Further, in the substrate guide device of the present invention, the interval between the outlets facing each other can be set to be larger on the upstream side than on the downstream side in the moving direction of the substrate. Thus, when the front end of the substrate relatively moving between the opposed outlets of the substrate guide device is located, the warpage of the substrate,
Even if deformation such as distortion occurs, the substrate can continue to relatively move without contacting the substrate guide device. As the substrate relatively moves, the substrate relatively moves to the downstream side of the substrate guide device outlet while gradually correcting the deformation such as warpage and distortion of the substrate, and the substrate is positioned downstream of the substrate guide device outlet. In this case, the substrate can be relatively moved further downstream from the substrate guide device in a state where the deformation of the substrate is most corrected. Thereby, even if the substrate has a large deformation such as warpage or distortion, the deformation can be corrected without contacting the substrate guide device. Further, in the substrate guide device of the present invention, when the fluid blowing nozzle and the fluid suction nozzle are arranged side by side in the direction of relative movement of the substrate, the interval between the nozzles facing each other is changed to the interval between the upstream side and the downstream side. By setting the distance to be large, the same operation and effect as described above can be obtained.

In the cleaning apparatus of the present invention, the substrate is supported by the substrate guide device, the substrate is corrected for deformation such as warpage and distortion, and the relative position of the substrate is set in the normal direction of the substrate surface. By relatively moving the substrate and the cleaning nozzle by the moving means, the substrate can be cleaned by the cleaning nozzle located on the downstream side of the substrate guide device. For this reason, it is possible to reduce the possibility that the cleaning nozzle contacts the substrate, and at the same time, it is possible to control the distance between the cleaning nozzle and the substrate surface. Can be prevented from being reduced depending on the distance of the cleaning process. Further, it is possible to select the type and state of the fluid ejected from the substrate guide device in accordance with the washing process in the washing nozzle, and select the pretreatment for the washing process by the fluid ejected from the substrate guide device to the substrate. It is possible to do it. For example, as the pre-processing in the substrate guide device, depending on the type of cleaning processing in the cleaning nozzle, decomposition of organic substances using ozone water as a fluid, rinsing of liquid or the like attached in the processing on the upstream side, between two or more cleaning liquids It is possible to select prevention of mutual contamination, reduction of the amount of cleaning liquid on the substrate by air blowing, drying by air blowing, and the like. In addition, the effect of correcting the deformation of the substrate can be maximized by selecting a gas as the fluid to be ejected in the substrate guide device.

In the cleaning apparatus of the present invention, the substrate and the cleaning nozzle are relatively moved by the relative moving means,
When cleaning the substrate with the cleaning nozzle located on the upstream side of the substrate guide device, the substrate is supported by the substrate guide device, and the substrate is corrected for deformation such as warpage and distortion, and in the normal direction of the substrate surface. The position can be set.
Therefore, it is possible to reduce the possibility that the cleaning nozzle contacts the substrate, and at the same time, it is possible to control the distance between the cleaning nozzle and the substrate surface.
It is possible to prevent the efficiency of the cleaning process depending on the distance between the cleaning nozzle and the substrate surface from being reduced. Further, it is possible to select the type and state of the fluid ejected from the substrate guide device in accordance with the washing process in the washing nozzle, and to select post-processing for the washing process by the fluid ejected from the substrate guide device to the substrate. It is possible to do it. For example, as post-processing in the substrate guide device, depending on the type of cleaning processing in the cleaning nozzle,
It is possible to select rinsing of liquid or the like adhered in the cleaning process, prevention of mutual contamination between two or more types of cleaning liquids, reduction of the amount of cleaning liquid on the substrate by air blowing, and drying by air blowing. In addition, the effect of correcting the deformation of the substrate can be maximized by selecting a gas as the fluid to be ejected in the substrate guide device.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] A first embodiment of a substrate guide device according to the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a substrate guide device of the present embodiment, and FIG. 2 is a cross-sectional view taken along line II-II of FIG. The substrate guide device of the present embodiment is used, for example, when processing a rectangular glass substrate (object to be processed). In the drawing, reference numeral 10 denotes a substrate, and 201 denotes a substrate guide device.

The substrate guide device 201 according to the present embodiment
As shown in FIGS. 1 and 2, a pair of elongated box-shaped air ejection nozzles (fluid ejection nozzles) 201 a and 201 b are used.
However, the outlets 202a and 202b are opposed to each other, and are arranged in the vertical direction with an interval. The air blowing nozzles 201a and 201b have a function of blowing air (drying gas) toward the surface of the substrate, and have a large number of through holes for blowing air from the outlets 202a and 202b. is there. The upper side of the air blowing nozzle 201a and the air blowing nozzle 2
01b, two fluid supply ports 203 are provided respectively.
a and 203b are provided. Air blowing nozzle 20
1a and 201b, these fluid supply ports 203 are used.
Air (fluid) is supplied from the air supply means (fluid supply means) connected to a and 203b.

The air blowing nozzles 201a and 201b are
As shown in FIGS. 1 and 2, porous materials 205 a and 205 b having a large number of through holes are provided inside box-shaped casings 204 a and 204 b having open outlets 202 a and 202 b.
Is housed and fixed. This porous material 205a, 20
5b is a casing 204 facing the substrate 10 during use.
a, 204b are housed and fixed so as to cover the side surfaces of the outlets 202a, 202b.
In the interior of 204b, air is stably blown out.
In order to uniformly eject the surfaces a and 202b, spaces 206a and 206b serving as a so-called compressor are provided, and fluid supply ports 203a and 203 are provided in the spaces 206a and 206b.
b is communicated. In the figure, spaces 206a, 206
b is only in the vicinity of the fluid supply ports 203a and 203b,
Porous materials 205a and 205b are accommodated in most of the interior of the casings 204a and 204b.
a, 206b may be configured to occupy a large portion inside the casings 204a, 204b. In this case, the space 20 as a regulator may be used.
6a and 206b, the pressure of the air (fluid) can be further uniformed in the plane direction of the outlets 202a and 202b. It is also possible to provide a large number of fluid supply ports 203a, 203b.
The air ejected in the plane direction of 202b can be equalized.

These air blowing nozzles 201a, 201
1b is positioned such that the surfaces of the porous materials 205a and 205b forming the outlets 202a and 202b are parallel to each other. For example, metal, plastic, ceramic, or the like is used for the porous materials 205a and 205b, and the surfaces of the porous materials 205a and 205b facing the substrate 10, that is, the surfaces serving as the outlets 202a and 202b have surface roughness. It is desirable that the swell is small and the swell is small. Fluid supply means is connected to the fluid supply ports 203a and 203b.

The air supply means includes an air blowing nozzle 20.
It has an air supply unit for supplying air to 1a and 201b, and a control unit for controlling the amount of air supplied from the air supply unit. For example, the pressure of gas (air) which is compressed air Is controlled in accordance with the material of the substrate 10, the size of the vertical and horizontal thickness, the weight, and the like. More specifically, the fluid supply unit is configured to generate a pressure of, for example, about 300 kPa. The control unit of the air supply means includes a pair of air blowing nozzles 201a, 201a.
The amount of air (fluid) to be supplied to the substrate 10 is controlled by the air blowing nozzle 201a located above the substrate 10 and the substrate 10
Distance L ₁ between the surface, to not 1mm is set in a range of 10 mm, The distance L ₂ between the substrate 10 backside the air blowing nozzle 201b positioned on the lower side of the substrate 10,
Control is performed so as to be set in the range of 0.1 mm to 10 mm. Thereby, it is possible to set the vertical position and the vertical shape of the substrate 10 with the surface direction of the substrate 10 being substantially horizontal.

Here, the pair of air blowing nozzles 20
1a and 201b, the distance L between the air blowing nozzle 201a located above the substrate 10 and the surface of the substrate 10
_{If 1} is set to less than 1 mm, there is a possibility that the substrate 10 may come into contact with the upper air blowing nozzle 201a, and it is difficult to control the flow of the fluid and the effect of correcting the deformation of the substrate is reduced. However, as a result, when the substrate guide device is applied to a cleaning device, the cleaning efficiency decreases, which is not preferable. Also, the upper air blowing nozzle 201
distance L ₁ between a and the substrate 10 surface, if it is larger than 10mm, the warping of the substrate 10, and correct the deformation such as distortion in order to maintain the substrate 10 at a predetermined position and shape There is a problem that a large amount of air (fluid) ejected toward the substrate 10 is required, so that the possibility of contaminating the substrate 10 increases and the cost increases. Furthermore, when the amount of air to be blown out is insufficient, it is difficult to set the position of the substrate 10 while keeping the pressure of the air uniform in the surface direction of the substrate 10, which is not preferable.

A fluid blowout located below the substrate 10
The distance L between the nozzle 201b and the surface of the substrate 10_Two Is the base
Since the plate is held by a holder such as a roller (not shown),
Control higher than the distance between the upper fluid ejection nozzle and the substrate surface
Sex can be maintained. This interval L _Two Is set to less than 0.1 mm
If defined, fluid controllability is low and
Controllability is reduced, and the substrate 10 and the lower fluid blowing nozzle
The possibility of contact with the tool 201b.
Not preferred. In addition, the lower air blowing nozzle 20
1b and the distance L between the surface of the substrate 10_Two But from 10mm
When set to a large value, the deformation of the substrate 10 is corrected.
Together with the substrate 10 to support the substrate 10
Requires a large amount of air to be blown out.
Pressurizing the compressor etc. as a suitable air supply means
Means for the substrate guide device 201
There is a problem that space and cost increase,
Further, the air pressure is kept uniform in the direction of the substrate 10 surface,
At least in the width direction of the substrate 10 (perpendicular to the arrow K in the figure)
Direction), the shape of the substrate 10 in the vertical direction
It is difficult to set the shape and position. Ma
Further, it becomes a factor of generating mist of the fluid, which is not preferable.

As shown in FIGS. 1 and 2, the substrate guide device 201 of the present embodiment has a pair of upper and lower air blowing nozzles 2.
01a and 201b, the air supplied by the air supply means is jetted through a large number of through holes of the porous materials 205a and 205b via the space portions 206a and 206b, respectively (the flow of air is indicated by a solid line in FIG. 2). Indicated by arrows). At this time, the air supply means, the amount of air (fluid) is supplied, to no 1mm spacing L ₁ between the air blowing nozzle 201a and the substrate 10 surface in the range of 10 mm, also the the air blowing nozzle 201b substrate 1
The distance L ₂ between 0 backside, in the range of from 0.1 mm 10 mm, respectively set. The substrate 10 positioned between the air blowing nozzles 201a and 201b is moved by the air pressure controlled in this manner.
The vertical position with respect to a and 201b is defined. At the same time, deformation such as warpage and distortion in the vertical direction of the substrate 10 can be corrected.

[Second Embodiment] A second embodiment of a substrate guide apparatus and a cleaning apparatus using the same according to the present invention will be described below with reference to the drawings. FIG. 3 is a schematic view showing a cleaning apparatus of the present embodiment, FIG. 4 is a bottom view showing a surface cleaning nozzle in the cleaning apparatus of FIG. 3, and FIG.
It is sectional drawing which shows a washing nozzle along the VV line. The cleaning apparatus of the present embodiment is used for cleaning, for example, a rectangular glass substrate (object to be processed), and has the same components as those of the first embodiment shown in FIGS. The description is omitted by attaching the reference numerals.

In the figure, reference numeral 200 denotes a cleaning device. The cleaning device 200 includes a cleaning nozzle 210 and a pair of substrate guides, ie, two pairs of substrate guides on the upstream side and the downstream side of the cleaning nozzle 210 in the moving direction of the substrate 10. Device 201,
201 and a relative moving means (not shown) for moving the substrate 10 relative to the cleaning nozzle 210. The substrate guide devices 201, 201 have substantially the same configuration as the first embodiment shown in FIGS. 1 and 2, respectively, and have air blowing nozzles (fluid blowing nozzles) 201a, 201b.
Are fluid supply means (air supply means) 208,
208.

As shown in FIGS. 4 and 5, the cleaning nozzle 210 according to the present embodiment has a front surface cleaning nozzle 210A for ultrasonically cleaning the front surface of the substrate 10 and a rear surface of the substrate 10 by wet processing. And a back surface cleaning nozzle 210B.
And the back surface cleaning nozzle 210B are arranged vertically.

As shown in FIG. 4 and FIG. 5, the surface cleaning nozzle 210A is
The cleaning liquid introduction unit 213 and the cleaning liquid discharge unit 214 are located at both ends, and the ultrasonic transducer housing unit 215 is located at the center. Two cleaning liquid introduction pipes 216 (introduction passages) are provided on the upper surface of the cleaning liquid introduction part 213 in the longitudinal direction of the nozzle, and two cleaning liquid discharge pipes 217 (discharge passages) are similarly provided on the upper surface of the cleaning liquid discharge part 214. Book is provided. The upper end of each cleaning liquid introduction pipe 216 is opened, and an inlet 216 for introducing the cleaning liquid L (processing liquid) therefrom.
a, and the lower end is the substrate 10 inside the casing 212.
The opening 216b opens toward the (substrate to be processed). Similarly, the upper end of each of the cleaning liquid discharge pipes 217 is opened to serve as a discharge port 217a for discharging the used cleaning liquid W to the outside, and the lower end thereof is a discharge opening that opens toward the substrate 10 inside the casing 212. 217b. The discharge port 217a of the cleaning liquid discharge pipe 217 is connected to a decompression pump (not shown), and by controlling the suction force of the decompression pump, the difference between the pressure of the used cleaning liquid W and the atmospheric pressure is controlled. L is surely discharged.

An ultrasonic vibrator 218 (ultrasonic vibration applying means) for performing ultrasonic cleaning by applying ultrasonic vibration to the cleaning liquid W is accommodated in the ultrasonic vibrator housing section 215. ing. A cable 221 for controlling the ultrasonic vibrator 215 is provided at the center of the ultrasonic vibrator housing 215.

As shown in FIG. 5, a cleaning liquid supply member 222 (processing liquid supply member) made of a porous material is inserted into the introduction opening 216b. As a porous material, specifically, such as fluorine resin, plastic such as polyethylene, metals SUS316 etc., alumina, ceramics such as silicon oxide, plastic which was subjected to hydrophilic treatment to have a hydrophilic group on the surface, TiO ₂ Materials such as metal oxides can be used. In particular, hydrophilic materials such as silicon oxide, alumina, and plastics subjected to hydrophilic treatment are more preferable. Alternatively, at least a portion of the substrate 10 that is in contact with the cleaning liquid W may be formed of a hydrophilic material, or the surface thereof may be subjected to a hydrophilic treatment, without using the entire cleaning liquid supply member 222 with a hydrophilic material. In any case, since the cleaning liquid supply member 222 is formed of a porous material, when the cleaning liquid W is supplied from the cleaning liquid introduction pipe 216 into the introduction opening 216b, the substrate is passed through the many through holes of the cleaning liquid supply member 222. The cleaning liquid W is supplied to the surface 10.

On the other hand, a cleaning liquid discharge member 223 (processing liquid discharge member) made of a porous material is also inserted into the discharge opening 217b. As the porous material used for the cleaning liquid discharge member 223, the same material as that used for the cleaning liquid supply member 222 can be used. Here, the cleaning liquid supply member 222 and the cleaning liquid discharge member 22 are provided in one nozzle.
The porous materials used in 3 may be the same or different types. Since the cleaning liquid discharging member 223 is formed of a porous material, the used cleaning liquid W remaining on the substrate 10 is sucked from the many through holes of the cleaning liquid discharging member 223 and discharged to the outside of the nozzle through the cleaning liquid discharging pipe 217. .

As shown in FIG. 5, the back surface cleaning nozzle 210B is provided so as to be vertically opposed to the front surface cleaning nozzle 210A, and has substantially the same configuration as the front surface cleaning nozzle 210A. And description thereof is omitted. The back cleaning nozzle 210B is different from the front cleaning nozzle 210A in that the ultrasonic vibrator 218 and the cable 221 are not provided.

Next, the sequence of the cleaning nozzle 210 having the above configuration will be described. When the cleaning nozzle 210 is used to realize a liquid-saving nozzle as described in the section of the related art, the cleaning liquid W on the front surface and the back surface of the substrate 10 is applied outside the space between the cleaning nozzle 210 and the substrate 10. The difference between the pressure of the cleaning liquid W and the atmospheric pressure is controlled so as not to flow into
A drain pump (not shown) for sucking and discharging the cleaning liquid through the cleaning liquid discharge pipes 217 of OA and 210B is connected to the cleaning liquid discharge pipe 217 to form a nozzle device. further,
Arbitrary cleaning liquid supply means is connected to the cleaning liquid introduction pipes 216 of both nozzles 210A and 210B. In FIG. 5, the direction of movement of the substrate 10 with respect to the cleaning nozzle 210 moved by the relative moving means is indicated by an arrow K.

First, in a state where the ultrasonic oscillator 218 of the surface cleaning nozzle 210A is not operated, when the front end of the substrate 10 or the front end of the portion to be cleaned of the substrate 10 comes under the cleaning liquid supply member 222, Nozzle 2
The substrate 10 is supplied from the cleaning liquid supply member 222 of 10A and 210B.
The cleaning liquid W is supplied thereon. When the substrate 10 is further moved, the cleaning liquid W flows to a position below the ultrasonic vibrator 218 of the front surface cleaning nozzle 210A. Further substrate 1
0 moves and reaches a position between the cleaning liquid discharge members 223 of both nozzles 210A and 210B, the drain pump is operated, and the cleaning liquid supply members 22 of both nozzles 210A and 210B are operated.
The cleaning liquid W supplied onto the substrate 10 from 2 is discharged from the cleaning liquid discharging member 223. At this stage, the cleaning liquid W
Since the fluid flows constantly on the front surface and the back surface, at the same time, the ultrasonic vibrator 218 of the front surface cleaning nozzle 210A
The ultrasonic cleaning of the substrate 10 is performed by operating. Lastly, the end of the substrate 10 is located at both nozzles 210A,
After passing between the cleaning liquid supply members 222 of 210B, the supply of the cleaning liquid W is stopped, and the ultrasonic oscillator 218 of the surface cleaning nozzle 210A is stopped. And
Finally, the cleaning liquid W remaining on the front and back surfaces of the substrate 10 is discharged from the cleaning liquid discharge members 223 of both nozzles 210A and 210B. In this way, the entire surface of the substrate 10 can be subjected to ultrasonic cleaning and the entire rear surface of the substrate 10 can be subjected to wet cleaning.

In the cleaning apparatus 200 of the present embodiment,
As described above, the ultrasonic cleaning of the front surface of the substrate 10 and the wet cleaning of the back surface of the substrate 10 are performed by the cleaning nozzle 210. At this time, as described in the first embodiment shown in FIGS. In 201, 201, the air blowing nozzle 201 is controlled by the fluid supply means 208, 208 to control the pressure of the blown air.
The vertical position of the substrate 10 located between a and 201b is defined with respect to the air blowing nozzles 201a and 201b. At the same time, deformation such as warpage and distortion in the vertical direction of the substrate 10 can be corrected. Therefore, in this state, the substrate 1 is moved by the relative moving means.
By moving the cleaning nozzle 210 and the cleaning nozzle 210 relative to each other in the in-plane direction of the substrate 10, the substrate guide device 201 on the upstream side supports the substrate 10, corrects the deformation of the substrate 10, and fixes the surface of the substrate 10. With the normal position set, both nozzles 210A and 210B of the cleaning nozzle 210 are set.
The substrate 10 can be inserted between them. Therefore, it is possible to reduce the possibility that the cleaning nozzle 210 and the substrate 10 come into contact with each other. Further, the substrate 10 is supported by the substrate guide device 201 on the upstream side, and
0, and the surface cleaning nozzle 210A and the substrate 10
The distance from the front surface, the back surface cleaning nozzle 210B and the substrate 1
It is possible to control the distance from the back surface to the zero. Therefore, the efficiency of the cleaning process depending on the distance between the cleaning nozzle 210 and the front surface or the back surface of the substrate 10, that is, the efficiency of the ultrasonic cleaning in the front surface cleaning nozzle 210A and the efficiency of the wet processing cleaning in the back surface cleaning nozzle 210B are reduced. And at the same time, the amount of the cleaning liquid W used in these processes can be reduced.

When ultrasonic cleaning of the front surface of the substrate 10 and wet cleaning of the back surface of the substrate 10 are performed by the cleaning nozzle 210, the substrate 10 is supported by the substrate guide device 201 on the downstream side of the cleaning nozzle 210.
0 in a state where the deformation of the cleaning nozzle 210 is corrected and the position of the normal direction in the surface of the substrate 10 is set.
The position of the substrate 10 can be set between A and 210B. Therefore, the positional accuracy of the substrate 10 can be further improved by using only the substrate guide device 201 on the upstream side of the cleaning nozzle 210, and the positional accuracy between the cleaning nozzle 210 and the front surface or the back surface of the substrate 10 can be improved. The efficiency of the cleaning process depending on the distance can be further improved.

It is possible to select the type and state of the fluid ejected from the substrate guide devices 201, 201 in accordance with the cleaning process in the cleaning nozzle 210.
In the case of the present embodiment, air is selected and the cleaning nozzle 21 is selected.
The substrate guide devices 201 on both the upstream and downstream sides can be incorporated in the cleaning process as air blowing means for drying. The cleaning nozzle 210 may be provided with an ultraviolet light source instead of the ultrasonic vibrator 218 and have a structure capable of transmitting ultraviolet light at the same time, so that a cleaning device capable of performing a process of decomposing and removing organic substances by ultraviolet ozone cleaning may be used. Further, the cleaning nozzle 210 can be used in a rinsing step using pure water for a wet processing step such as cleaning located further upstream. Further, the cleaning nozzles 210 are respectively connected to both the cleaning nozzles 21.
0A and 210B have an upside down structure, an upper and lower structure capable of ultrasonic cleaning or ultraviolet cleaning, an upper and lower structure of only wet processing cleaning, or a surface cleaning nozzle 2
10A or only the back surface cleaning nozzle 210B may be used.

[Third Embodiment] Hereinafter, a third embodiment of the substrate guide device according to the present invention will be described with reference to the drawings. FIG. 6 is a sectional view showing the substrate guide device of the present embodiment. The substrate guide device of the present embodiment is used, for example, when processing a rectangular glass substrate (object to be processed).
The same components as those of the embodiment are denoted by the same reference numerals, and description thereof will be omitted. The present embodiment differs from the first embodiment shown in FIGS. 1 and 2 in that the fluid ejection nozzles are arranged at an angle.

In the substrate guide device 201 of this embodiment,
The air blowing nozzle (fluid blowing nozzle) 201a,
201b are parallel to the plane direction of the substrate 10 respectively.
Are arranged in a state where there is no
02a, 202b, the substrate 10 indicated by the arrow K in the figure
The upstream side is set larger than the downstream side in the moving direction of
You. The interval between the outlets 202a and 202b is the outlet 2
02a and the distance between the surface of the substrate 10 are as shown in FIG.
On the most upstream side of the air blowing nozzle 201a, the interval L _1A
And the most downstream side is the interval L_1BIs set to Ma
The distance between the outlet 202b and the back surface of the substrate 10 is as shown in FIG.
As shown in the figure, at the most upstream side of the air blowing nozzle 201b,
Is the interval L_2AAnd the most downstream side is the interval L_2BSet to
I have. Here, each interval is L_1A> L_1B L_2A> L_2B It is set to be. Of course, such a substrate 1
0 and the outlets 202a, 202b
-Not only the arrangement of the blowing nozzles 201a and 201b,
Air supply means in use state of plate guide device 201
Control of air (fluid) supply by (fluid supply means)
Is realized. Here, the above-mentioned substrate 10 and
The distance between the outlets 202a and 202b is L_1AAnd L_2A
Is 10 mm or less, L_1BIs 1 mm or more, L _2BIs 0.1 mm
It is assumed that these are set as described above.

The substrate guide device 201 having the above structure
Has the same effect as the first embodiment shown in FIGS. 1 and 2 described above, and by adopting such a configuration, the opposed outlets 20 of the substrate guide device 201 are provided.
Even when deformation such as warpage or distortion of the substrate 10 occurs when the front end of the substrate 10 relatively moving between 2a and 202b is located, the interval between the outlets 202a and 202b is increased on the upstream side as described above. Since the setting is performed, the substrate 10 can continue to relatively move in the arrow K direction without contacting the air blowing nozzles 201a and 201b of the substrate guide device 201. Then, as the substrate 10 relatively moves in the direction of arrow K, the deformation of the substrate 10 is gradually corrected by the pressure of the ejected air, and the substrate 10 relatively moves toward the downstream side of the substrate guide device 201.
When the substrate guide device 201 is located at the most downstream side, the substrate 1
The deformation of 0 is the most corrected state. Therefore, with the position corrected in this way, the substrate guide device 2
It is possible to relatively move further downstream from 01. Thereby, even if the deformation of the substrate 10 is large, the air blowing nozzles 201a, 201
1b without contact and without contact contamination.
Zero deformation can be corrected.

[Fourth Embodiment] Hereinafter, a fourth embodiment of the substrate guide apparatus according to the present invention will be described with reference to the drawings. FIG. 7 is a perspective view showing the substrate guide device of the present embodiment, and FIG. 8 is a cross-sectional view along the line VIII-VIII in FIG. The difference between the substrate guide device of the present embodiment and the first embodiment shown in FIGS. 1 and 2 and the third embodiment shown in FIG. 6 is that the substrate guide device has a fluid suction nozzle. The other common components are denoted by the same reference numerals and description thereof is omitted. In the figure, reference numeral 230 is a substrate guide device.

In the substrate guide device 230 of this embodiment, as shown in FIGS.
a, the downstream side of the fluid suction nozzle 2
01c and 201d are provided. These fluid suction nozzles 201c and 201d are obtained by connecting the fluid ejection nozzles 201a and 201b of the first embodiment to another one downstream thereof, and their respective structures are the same as those of the first embodiment.
Is almost the same as the fluid blowing nozzles 201a and 201b of the embodiment. Here, the fluid blowing nozzle 201a and the fluid suction nozzle 201c are fixed to each other in the nozzle 230A on the upper side of the substrate 10, and the fluid blowing nozzle 201b and the fluid suction nozzle 201d are fixed to each other in the nozzle 230B on the lower side of the substrate 10. Have been.
In the present embodiment, the fluid blowing nozzles 201a, 201
The fluid supply means connected to 1b supplies a liquid as a fluid, in particular, pure water.

As shown in FIGS. 7 and 8, the fluid suction nozzles 201c and 201d are provided inside box-shaped casings 204c and 204d having suction ports 202c and 202d opened.
Porous materials 205c and 205d having a large number of through holes are accommodated and fixed. This porous material 205c, 205d
Are casings 204c facing the substrate 10 during use.
The housing 204d is accommodated and fixed so as to cover the surfaces on the suction ports 202c and 202d side. Porous material 205c, 205d
Inside the casings 204c and 204d,
Fluid outlet 203 via space portions 206c and 206d
c and 203d are communicated.

These fluid suction nozzles 201c, 201
d is a porous material 2 forming the suction ports 202c and 202d.
The porous materials 205a, 205d whose surfaces are parallel to each other and which form the outlets 202a, 202b.
5b is positioned so as to be parallel to the surface. For example, metal, plastic, ceramic, or the like is used for the porous materials 205c and 205d.
The surfaces of the substrates c and 205d facing the substrate 10, that is, the surfaces serving as the suction ports 202c and 202d have small surface roughness.
It is desirable that the swell be small. This fluid outlet 203
Fluid discharge means is connected to c and 203d.

The fluid discharging means is a fluid blowing nozzle 201
a, 201b, the fluid (pure water) that has come into contact with the front and back surfaces of the substrate 10 is discharged to the fluid suction nozzles 201c,
The liquid is sucked and discharged through 201d (the flow of a fluid such as a cleaning liquid is shown by a solid arrow in FIG. 8). Here, it has a control unit for controlling the suction and discharge amount, and a part for storing the suctioned and discharged fluid.

In the substrate guide device 230 of this embodiment, since the fluid blown out from the fluid blowout nozzles 201a and 201b is a liquid, the position of the substrate 10 with respect to both nozzles 230A and 230B is set as in the above-described embodiments. Can be performed to correct the deformation of the substrate 10, and the fluid suction nozzles 201c and 201d are provided, and the fluid discharge nozzles 201a and 201d are provided by the fluid discharge means.
By suctioning and discharging the fluid blown out from 1b, the pressure of the fluid applied to the substrate 10 can be more easily controlled. At the same time, as the fluid, the liquid is ejected from the fluid ejection nozzles 201a and 201b, and is sucked and discharged through the fluid suction nozzles 201c and 201d, so that the cleaning nozzle 210 in the second embodiment shown in FIGS. In the state where the difference between the pressure of the fluid and the atmospheric pressure is controlled so as not to flow out of the space between the substrate guide device 230 and the substrate 10, the front and rear surfaces of the substrate 10 are cleaned (here, rinsing with pure water). Processing) can be performed. Here, as in the above-described second embodiment, the amount of fluid that is in contact with the front and back surfaces of the substrate 10 is controlled so that the fluid (pure water) spreads all over the substrate 10 and a liquid pool occurs. And no substrate 1
Discharge is ensured to the extent that it does not drop from near zero.

The substrate guide device 230 of the present embodiment
By selecting ozone water, hydrogen water, oxygen water, nitrogen water, pure water, etc. as the fluid to be supplied to, organic matter decomposition treatment with ozone water, particle reattachment prevention with hydrogen water,
It is also possible to perform a treatment such as a rinse with pure water.

[Fifth Embodiment] Hereinafter, a fifth embodiment of the substrate guide apparatus and the cleaning apparatus using the same according to the present invention will be described with reference to the drawings. FIG. 9 is a schematic diagram illustrating a cleaning device according to the present embodiment. The cleaning apparatus of the present embodiment is used for cleaning, for example, a rectangular glass substrate (object to be processed), and has the same components as those of the first to fourth embodiments shown in FIGS. 1 to 8. Are denoted by the same reference numerals and description thereof is omitted.

In the present embodiment, in the cleaning apparatus 200 of the second embodiment shown in FIGS. 3 to 5, the substrate guide device provided upstream of the cleaning nozzle 210 is substantially the same as the third embodiment shown in FIG. It is assumed to have an equivalent configuration,
The substrate guide device provided on the downstream side of the cleaning nozzle 210 is that of the fourth embodiment shown in FIGS.

Here, in the substrate guide device 230 provided on the downstream side of the cleaning nozzle 210, a fluid supply means 231 for supplying a liquid (pure water) to the fluid blowing nozzles 201a and 201b is connected, and the fluid suction nozzle 201c is provided. , 2
01d is connected to a fluid discharging means 232 for sucking and discharging the liquid.

According to such a cleaning apparatus 200, the same effects as those of the first to fourth embodiments shown in FIGS. 1 to 8 can be obtained, and at the upstream side of the cleaning nozzle 210, the substrate guide apparatus 201 is provided. By selecting a gas as the fluid to be ejected in the above, the highest effect on the deformation correction of the substrate 10 can be obtained. At the same time, on the downstream side of the cleaning nozzle 210, a rinsing process for removing the cleaning liquid W used in the cleaning nozzle 210 can be performed by the substrate guide device 230. As a result, the manufacturing cost can be reduced as compared with the case where the substrate guide device and the rinsing device are provided as separate components as the cleaning device 200, and the rinsing is performed by the fluid for correcting the deformation of the substrate 10. Therefore, there is an effect that the running cost can be reduced.

[Sixth Embodiment] Hereinafter, a sixth embodiment of the present invention will be described.
Will be described with reference to FIGS. 10 and 11. FIG. FIG. 10 is a perspective view showing the substrate guide device of the present embodiment, and FIG. 11 is a cross-sectional view along the line XI-XI in FIG. The substrate guide device of the present embodiment is used, for example, when processing a rectangular glass substrate (object to be processed).
In addition to correcting the deformation of the substrate 10, the drying nozzle 25 can simultaneously dry both the front surface and the rear surface of the substrate 10.

The drying nozzle 25 of the present embodiment is similar to that of FIG.
As shown in FIGS. 0 and 11, like the substrate guide devices of the first to fifth embodiments shown in FIGS.
It has a vertically symmetric configuration. Therefore, in FIG. 10 and FIG. 11, the same reference numerals are given to the components common to the upper side and the lower side by adding a suffix “* a” to the upper nozzle and “* b” to the lower nozzle. .

As shown in FIGS. 10 and 11, the drying nozzle (substrate guide device) 25 of the present embodiment has a long and thin box-shaped drying gas supply unit (fluid blowing nozzle) 2a,
2b and gas-liquid mixture discharge section (fluid suction nozzle) 3a, 3b
Are juxtaposed in the direction along the surface of the substrate 10.
The drying gas supply units 2a and 2b have a function of blowing air (drying gas) toward the substrate surface.
The gas-liquid mixture discharge sections 3a and 3b are arranged at a predetermined distance from the surface of the substrate 10 so as to have a function of making the liquid thickness of the liquid on the surface and the back surface of the substrate 10 constant before drying. It has a large number of through holes for discharging the gas-liquid mixture from the substrate surface. Air supply ports 4a, 4b are provided at one end surface in the longitudinal direction of the drying gas supply sections 2a, 2b, and the gas-liquid mixture discharge sections 3a, 4b are provided.
Two gas-liquid mixture outlets 5a and 5b are provided on the upper surface of 3b. When the drying nozzle 25 is used, for example, an arbitrary air supply source (fluid supply means) in a production line is connected to the air supply ports 4a and 4b, and the gas-liquid mixture discharge ports 5a and 5b have drainage and exhaust functions. Arbitrary suction means (fluid discharge means) such as a pump provided is connected.

The drying gas supply units 2a and 2b are arranged as shown in FIG.
As shown in FIG. 11, inside the box-shaped casings 6a and 6b, air supply tubes 9a and 9b (gas introduction paths) each composed of a double pipe of inner pipes 7a and 7b and outer pipes 8a and 8b are accommodated. ing. The inner and outer surfaces of the inner tubes 7a, 7b and the outer tubes 8a, 8b constituting the air supply tubes 9a, 9b are both polished so that no dust is generated from these tubes. Thereby, dust or the like is not included in the air jetted onto the substrate 10 and the substrate 1
0 is not contaminated. As an example, stainless steel (SUS316L) is used for the inner pipes 7a and 7b and the outer pipes 8a and 8b that constitute the air supply tubes 9a and 9b, and the surface is GEP-W treated (by Shinko Pantech Co., Ltd.). It has been subjected. The air supply tubes 9a and 9b are fixed to the casings 6a and 6b at upper and lower fixing portions 11a, 11a, 11b and 11b, respectively, by means such as welding.

An opening 22a, a part of the inner pipe 7a, 7b
A resistance member 12a, 12b for uniformly supplying air is incorporated in the openings 22a, 22b, and is fixed to the inner tubes 7a, 7b by fixing means such as screws 13a, 13b. Resistance members 12a, 12 for uniformly supplying air
b is air for uniformly discharging the air introduced into the inner tubes 7a, 7b from one end of the air supply tubes 9a, 9b to the space between the inner tubes 7a, 7b and the outer tubes 8a, 8b. Is made of a material that can transmit, and has a certain degree of resistance during air transmission. That is, since there is a certain degree of resistance when air passes through the inside of the air uniform supply resistance members 12a and 12b, the air supply tube 9
Even if air is supplied into the inner tubes 7a and 7b from only one end of the inner tubes 7a and 7b, the air is uniformly diffused into the inner tubes 7a and 7b, and then passes through the air uniform supply resistance members 12a and 12b to form the inner tube. The air flows out into the space between the outer tubes 7a and 7b and the outer tubes 8a and 8b, and the air is uniformly injected from any position in the longitudinal direction of the drying gas supply units 2a and 2b. The resistance members 12a and 12b for uniformly supplying air are formed of a material such as a porous ceramic, for example, but a known filter material may be used.

The resistance members 12a for uniformly supplying air are provided.
Inner tubes 7a, 7b substantially opposite to the mounting position of 12b
The air flow direction control portions 14a and 14b projecting in a substantially triangular shape are fixed to the outer surface of the outer tube by welding or the like, and the positions on the outer tubes 8a and 8b corresponding to the mounting positions of the air flow direction control portions 14a and 14b. In the openings 23a and 23b, nozzles 15a and 15b for ejecting air are provided at the ends of the openings 23a and 23b.
It is fixed by welding or the like toward the sides a and 3b. It is desirable that the inclination of the nozzle portions 15a and 15b be set so that the angle formed by the normal to the surface of the substrate 10 is about 5 ° to 30 °. As shown in FIGS. 10 and 11, air ejection slits 16a and 16b extending in the longitudinal direction are formed on the lower surfaces of the casings 6a and 6b, and the tips of the nozzle portions 15a and 15b are provided in the air ejection slits 16a and 16b. Are located, and the gaps between the tips of the nozzle portions 15a, 15b and the air ejection slits 16a, 16b of the casings 6a, 6b are sealed by sealing portions 17a, 17b. With this configuration, the air supplied into the inner pipes 7a and 7b flows through the air uniform supply resistance members 12a and 12b into the space between the inner pipes 7a and 7b and the outer pipes 8a and 8b. The air flows in the space in the circumferential direction, and depends on the shape of the air flow direction control units 14a and 14b.
The nozzles 15a, 15b are jetted toward the substrate 10 from the tips of the nozzles 15a, 15b, that is, the air jet slits 16a, 16b on the lower surfaces of the drying gas supply units 2a, 2b (FIG. 1).
The flow of air is indicated by a broken arrow in FIG. 1).

As shown in FIG. 11, the gas-liquid mixture discharge sections 3a and 3b accommodate and fix porous materials 19a and 19b having a large number of through holes inside box-shaped casings 18a and 18b. . For example, metal, plastic, ceramic, or the like is used for the porous materials 19a and 19b, and it is preferable that at least a portion facing the substrate 10 has hydrophilicity. In this case, the contact between the gas-liquid mixture on the surface of the substrate 10 and the porous materials 19a and 19b is improved, and the gas-liquid mixture can be efficiently discharged. It is desirable that the surfaces of the porous materials 19a and 19b facing the substrate 10 have small surface roughness and small undulation. When the drying nozzle 25 is used, suction means such as a pump is connected to the gas-liquid mixture outlets 5a and 5b provided on the upper surface of the casing 18a and the lower surface of the casing 18b, and the gas-liquid mixture on the front surface and the rear surface of the substrate 10 is connected. Is discharged from the gas-liquid mixture outlets 5a, 5b through a number of through holes of the porous materials 19a, 19b (the flow of the gas-liquid mixture is indicated by solid arrows in FIG. 11). Further, the drying gas supply units 2a and 2b and the gas-liquid mixture discharge units 3a and 3b are respectively provided with casings 6a and 18a and casings 6b and 6b.
18b are fixed by screws 20a and 20b.

The drying nozzle 25 having the above structure is capable of processing the substrate 10 after wet processing such as washing, for example, and includes the drying gas supply units 2 a and 2 b and the gas-liquid mixture discharge unit 3.
a and 3b are adjacently juxtaposed in the direction along the front and back surfaces of the substrate 10, and when used, the front and back surfaces of the substrate 10 have the gas-liquid mixture discharge sections 3a and 3b and the drying gas supply sections 2a and 2a.
2b (substrate 1 indicated by arrow K in FIG. 11).
The substrate 10 can be dried by moving the drying nozzle 25 and the substrate 10 relative to each other in the direction of movement (0). First, when the gas-liquid mixture discharge units 3a and 3b disposed above and below the wetted substrate 10 and separated by a distance set as described later pass through the wetted substrate 10, the surface of the wetted substrate 10 rises on the front and back surfaces of the substrate 10. The liquid 21 adhering to the liquid is pushed away, and the liquid thickness becomes constant and thin. Next, air is ejected from the air ejection slits 16a and 16b of the drying gas supply units 2a and 2b toward the front surface and the back surface of the substrate 10 to which the liquid 21 having a constant liquid thickness adheres, so that the liquid 21 is vaporized. The portion of the substrate 10 that is blown toward the liquid mixture discharge sections 3a and 3b and sprayed with air is dried. Then, the gas-liquid mixture in which the liquid and the air blown to the vicinity of the gas-liquid mixture discharge portions 3a, 3b are mixed with the substrate through many through holes of the porous materials 19a, 19b of the gas-liquid mixture discharge portions 3a, 3b. 10 Suction and discharge from front and back. In this manner, the entire area of the front surface and the back surface of the substrate 10 can be dried.

At the same time, in the drying nozzle (substrate guide device) 25 of this embodiment, the amount of the fluid (air) supplied to the drying gas supply units 2a and 2b and the air The substrate 10 is controlled by controlling the amount of the gas-liquid mixture to be suctioned and removed from the liquid mixture discharge sections 3a and 3b.
Controlling the pressure exerted on, as shown in FIG. 11, the interval L ₁ between the drying gas supply unit 2a and the gas-liquid mixture discharge section 3a and the substrate 10 surface, to no 1mm is set in a range of 10 mm, also, dried spacing distance L ₂ between the use gas supply unit 2b and the gas-liquid mixture discharge section 3b and the substrate 10 backside, 0.1 m
It is set in the range of m to 10 mm. The substrate 10 positioned between the upper and lower drying nozzles 25 defines the vertical position with respect to the drying nozzles 25 by the air pressure controlled as described above. At the same time, deformation such as warpage and distortion in the vertical direction of the substrate 10 can be corrected.

[Seventh Embodiment] Hereinafter, a seventh embodiment of a substrate guide device and a cleaning apparatus using the same according to the present invention will be described with reference to the drawings. FIG. 12 is a schematic diagram showing the cleaning device of the present embodiment. The cleaning apparatus of the present embodiment is used for cleaning, for example, a rectangular glass substrate (object to be processed), and is shown in FIGS.
The same components as those of the first to sixth embodiments shown in FIG.

In the present embodiment, in the cleaning apparatus 200 of the fifth embodiment shown in FIG. 9, the substrate guide device provided on the upstream side of the cleaning nozzle 210 is substantially the same as the fourth embodiment shown in FIGS. Substrate guide device 2 having the same configuration
The substrate guide device 30 is provided downstream of the cleaning nozzle 210 and has substantially the same configuration as the substrate guide device 25 of the sixth embodiment shown in FIGS.

Here, in the substrate guide device 230, fluid supply means 231 for supplying a liquid (here, ozone water) is connected to the fluid blowing nozzles 201a and 201b, and fluid supply nozzles 201c and 201d are connected to the fluid suction nozzles 201c and 201d.
A fluid discharging means 232 for sucking and discharging the liquid is connected.
In the substrate guide device (drying nozzle) 25, fluid supply means (air supply source) 233 for supplying a fluid (air; drying gas) to the drying gas supply units (fluid blowing nozzles) 2a and 2b is connected. The fluid (gas-liquid mixture) is discharged from the gas-liquid mixture discharge sections (fluid suction nozzles) 3a, 3b.
A fluid discharge means (suction means) 234 for sucking and removing the fluid is connected.

According to such a cleaning apparatus, the aforementioned FIG.
In addition to the effects equivalent to those of the first to sixth embodiments shown in FIGS. 11 to 11, the liquid is selected as the fluid to be ejected in the substrate guide device 230 on the upstream side of the cleaning nozzle 210 to correct the deformation of the substrate 10. At the same time, by selecting ozone water as this fluid,
Prior to the cleaning process of the cleaning nozzle 210 with the cleaning liquid W,
Organic substance decomposition treatment can be performed on the front and back surfaces of the substrate 10. In addition, a drying process for removing the cleaning liquid W in the cleaning nozzle 210 can be performed by a drying nozzle (substrate guide device) 25 that blows out drying air. Thereby, as the cleaning device 200,
As compared with the case where the substrate guide device, the organic substance decomposition processing nozzle, and the drying nozzle are provided as separate components, the space required for the device can be reduced, the manufacturing cost can be reduced, and
Since the organic matter decomposing process and the drying process can be performed by the zero deformation correcting fluid, there is an effect that the running cost can be reduced.

[0067]

According to the substrate guide device of the present invention and the cleaning device using the same, the substrate can be supported by preventing the contact contamination by blowing the fluid to correct the deformation of the substrate and set the position. In addition, it is possible to improve the accuracy of setting the positional state between the processing nozzle for cleaning and the like and the substrate, improve the efficiency of processing for cleaning and the like, simplify the apparatus configuration, and reduce the manufacturing cost.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of a substrate guide device according to the present invention.

FIG. 2 is a cross-sectional view showing the substrate guide device along the line II-II in FIG.

FIG. 3 is a schematic diagram showing a cleaning device in a second embodiment of a substrate guide device and a cleaning device using the same according to the present invention.

FIG. 4 is a bottom view showing a front surface cleaning nozzle in the cleaning device of FIG. 3;

FIG. 5 is a sectional view showing the cleaning nozzle along the line VV in FIG. 4;

FIG. 6 is a sectional view showing a third embodiment of the substrate guide device according to the present invention.

FIG. 7 is a perspective view showing a fourth embodiment of the substrate guide device according to the present invention.

8 is a cross-sectional view showing the substrate guide device along the line VIII-VIII in FIG.

FIG. 9 is a schematic view showing a cleaning device in a fifth embodiment of a substrate guide device and a cleaning device using the same according to the present invention.

FIG. 10 is a perspective view showing a sixth embodiment of the substrate guide device according to the present invention.

FIG. 11 is a sectional view showing the cleaning nozzle along the line XI-XI in FIG. 10;

FIG. 12 is a schematic view showing a cleaning device in a seventh embodiment of a substrate guide device and a cleaning device using the same according to the present invention.

13A and 13B are diagrams illustrating an example of a conventional liquid-saving nozzle, in which FIG. 13A is a bottom view of a cleaning nozzle, and FIG.
13B is a side sectional view taken along line XIII-XIII in FIG.

[Explanation of symbols]

W: Cleaning liquid 2a, 2b: Drying gas supply unit (fluid blowing nozzle) 3a, 3b: Gas-liquid mixture discharge unit (fluid suction nozzle) 4a, 4b: Air supply port 5a, 5b: Gas-liquid mixture discharge port 6a, 6b ... Casing 7a, 7b ... Inner tube 8a, 8b ... Outer tube 9a, 9b ... Air supply tube 10 ... Substrate 11a, 11b ... Fixed part 12a, 12b ... Air uniform supply resistance member 13a, 13b, 20a, 20b ... Screw 14a, 14b ... air flow direction control unit 15a, 15b ... nozzle unit 16a, 16b ... air ejection slit 17a, 17b ... sealing unit 18a, 18b, 204a, 204b, 204c, 20
4d Casing 19a, 19b, 205a, 205b, 205c, 20
5d: Porous material 21: Liquid 22a, 22b, 23a, 23b: Opening 25: Drying nozzle (substrate guide device) 200: Cleaning device 201, 230: Substrate guide device 201a, 201b: Air blowing nozzle (fluid blowing nozzle) 201c, 201d ... fluid suction nozzles 202a, 202b ... outlets 202c, 202d ... suction ports 203a, 203b ... fluid supply ports 203c, 203d ... fluid discharge ports 206a, 206b, 206c, 206d ... space 208 ... air supply means ( Fluid supply means) 210: cleaning nozzle 230A: upper nozzle 230B: lower nozzle 231, 233: fluid supply means 232, 234: fluid discharge means

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kenichi Mimori 3-31 Meido, Izumi-ku, Sendai-shi, Miyagi F-term in Frontech Co., Ltd. 3B116 AA02 AB14 AB42 BB24 BB32 BB72 BB85 CC03 CD42 CD43 3B201 AA02 AB14 AB42 BB24 BB32 BB72 BB85 BB92 CC12 CD42 CD43

Claims (7)

[Claims] 1. A pair of fluid outlet nozzles having outlets opposed to each other and arranged at an interval, and fluid supply means for supplying a fluid to each of the pair of fluid outlet nozzles. A substrate guide device, wherein a relative distance between a substrate inserted into the gap and the fluid ejection nozzle is controlled by blowing the fluid from the outlet of the fluid ejection nozzle into the gap. 2. The substrate guide device according to claim 1, wherein the outlet is formed of a porous member. 3. The pair of fluid ejection nozzles are arranged at intervals in the vertical direction, and a substrate positioned in a substantially horizontal state is inserted into the gap. The distance between the fluid ejection nozzle located on the upper side and the substrate surface is 1 mm
2. The substrate guide device according to claim 1, wherein the substrate guide device is set in a range of 10 to 10 mm. 4. The pair of fluid ejection nozzles are arranged at intervals in the vertical direction, and a substrate positioned in a substantially horizontal state is inserted into the gap. The distance between the lower fluid ejection nozzle and the back surface of the substrate is 0.1
2. The substrate guide device according to claim 1, wherein the substrate guide device is set in a range of mm to 10 mm. 5. The substrate guide device according to claim 1, wherein a fluid suction nozzle for sucking and discharging the fluid blown out from the outlet is provided near the outlet. 6. A substrate guide device according to claim 1, relative movement means for relatively moving a fluid blowout nozzle of said substrate guide device and said substrate inserted into a gap between said pair of fluid blowout nozzles, and said substrate. A cleaning nozzle provided downstream of the fluid blowing nozzle in a moving direction for cleaning the substrate. 7. The substrate guide device according to claim 1, relative movement means for relatively moving a fluid blowing nozzle of the substrate guide device and the substrate inserted into a gap between the pair of fluid blowing nozzles, A cleaning nozzle provided upstream of the fluid blowing nozzle in a moving direction to clean the substrate.