KR100502751B1 - Wet processing apparatus and wet processing method - Google Patents

Abstract

A problem is to prevent damage of an ultrasonic vibrator even when a region in which the processing liquid does not exist in the processing region occurs during the wet processing operation.

In order to solve the said subject, the introduction opening part 21b which supplies the processing liquid 2 for wet processing of the to-be-processed object W toward the to-be-processed surface W1 of the to-be-processed object W, and after wet processing A wet processing nozzle 1 having a discharge opening 22b for discharging the discharge liquid 2 from the target surface W1, for applying ultrasonic vibration to the processing liquid 2 on the target surface W1. An ultrasonic vibrator 48 and a vibrator portion 46 in contact with the ultrasonic vibrator 48 are provided, and the vibrator portion 46 is provided on at least the workpiece W side of the ultrasonic vibrator 48, The relationship between the thickness dimension T of the vibrating portion 46 on the processing object W side and the wavelength? Of the ultrasonic vibration in the vibrating portion 46,

T = (n ± 0.1) λ / 2 (where n is an integer of 2 or more)

Is set to.

Description

WET PROCESSING APPARATUS AND WET PROCESSING METHOD}

The present invention is, for example, a wet processing apparatus for supplying a processing liquid onto a workpiece in a wet processing step of cleaning, peeling, developing, etching, plating, polishing, or the like in a manufacturing process of a semiconductor device, a liquid crystal display panel, or the like. It is about.

In the field of electronic devices such as semiconductor devices and liquid crystal display panels, a process of cleaning a semiconductor substrate or a glass substrate, which is an object to be processed, is essential during the manufacturing process. In the washing step, washing with various washing liquids such as ultrapure water, electrolytic ion water, ozone water, hydrogen water, etc., in which various substances to be removed in the manufacturing process should be removed, is carried out. It is supplied from the nozzle onto the substrate.

By the way, when the conventional cleaning nozzle is used, there exists a problem that the usage-amount of a washing | cleaning liquid increases. For example, as the residual amount of particles on the substrate after washing the substrate of 500 mm angle using a cleaning liquid such as electrolytic ion water and rinsing with such a cleaning liquid and rinsing with rinse washing water. In order to achieve a cleanness level of 0.5 pieces / cm ² , a cleaning liquid and a rinse cleaning liquid of about 25 to 30 liters / minute had to be used.

Therefore, a wet type cleaning nozzle capable of significantly reducing the amount of cleaning liquid used compared to the conventional mold, and is used for wet processing for supplying the processing liquid onto the substrate to be wetted. In the nozzle, an introduction passage having an introduction port for introducing the processing liquid at one end and an outlet passage for discharging the processing liquid after use at one end is formed, and each other end of each of the introduction passage and the discharge passage is formed. A wet processing nozzle is known which has an introduction opening and an opening opening that are opened toward a substrate to be processed.

In addition, a wet processing apparatus using the wet processing nozzle, wherein the wet processing nozzle and the processing target substrate are moved relative to each other according to the processing target surface of the processing target nozzle and the processing target substrate. The wet processing apparatus is provided which has a nozzle or a movement means of a to-be-processed substrate for processing the whole to-be-processed surface of the to-be-processed surface.

That is, according to the wet processing apparatus or the like described above, the processing liquid can be removed on the substrate to be processed without bringing the processing liquid into contact with a portion other than the portion to which the processing liquid is supplied, and a liquid-liquid nozzle can be realized. Further, by providing the wet processing nozzle and the movement means for relatively moving the substrate to be processed according to the surface to be processed, the entire surface to be processed of the substrate can be processed.

In addition, in such a liquid-forming nozzle, a wet processing nozzle as shown in Fig. 16 is known as a configuration to be applied when irradiating ultrasonic waves. The wet processing nozzle includes an introduction pipe 101 having an introduction port 101a for introducing the processing liquid 100 at one end thereof, and a discharge port for discharging the processing liquid 100 after the wet processing at one end to the outside ( A discharge pipe 102 having a 102a is formed, and the other ends of the introduction pipe 101 and the discharge pipe 102 are connected to each other so that a connecting portion 103 facing the substrate 90 is formed, thereby connecting the connecting portion 103. The first opening 101b which the inlet pipe 101 opens, and the 2nd opening 102b which the discharge pipe 102 opens are formed in (). In the space between the connecting portion 103 and the substrate 90 to be processed, a processing region 105 for performing wet processing is formed. In addition, the connecting portion 103 is provided with an ultrasonic vibrator for imparting ultrasonic vibration to the processing liquid 100 in the processing region 105.

The ultrasonic vibrator is composed of a diaphragm 96, a side plate 97 standing up from both ends of the main surface of the diaphragm 96, and an ultrasonic vibrating body 108 formed on the main surface of the diaphragm 96. The thickness of the diaphragm 96 is set to about 3 mm, when set to about 1 MHz of ultrasonic waves.

In addition, a pressure reducing pump (not shown) is connected to the discharge port 102a of the discharge pipe 102.

In addition, the processing liquid 100 is supplied from the inlet 101a of the inlet tube 101 and reaches the first opening 101b, but a pressure reducing pump (not shown) is provided in the outlet 102a of the outlet tube 102. Since it is connected, by controlling the suction pressure of the decompression pump, the pressure of the processing liquid 100 in which the processing liquid 100 supplied to the introduction pipe 101 is in contact with the atmosphere of the first opening 101b ( And the surface tension of the processing liquid 100 and the surface tension of the surface to be processed of the substrate 90) and the atmospheric pressure.

That is, the relationship between the pressure Pw (including the surface tension of the processing liquid and the surface tension of the surface to be processed of the substrate 90) and the atmospheric pressure Pa of the processing liquid 100 in contact with the atmosphere of the first opening 101b is shown. By setting it as PwPa, it is supplied to the board | substrate 90 through the 1st opening part 101b, and the process liquid 100 which contacted the board | substrate 90 does not leak to the exterior of a wet processing nozzle, It is discharged to the discharge pipe 102. For this reason, this wet process nozzle can reduce the usage-amount of process liquid significantly compared with the nozzle of a non-liquid type type.

In addition, in the nozzle of the example shown in the figure, during the cleaning of the substrate 90 to be processed, ultrasonic vibration is vibrated from the vibrating plate 96 by the ultrasonic vibrating body 108 with the processing liquid 100 being supplied to the processing region 105. Is applied to the processing liquid 100 to be co-worked (worked together) to clean the substrate 90 to be processed.

At this time, although the temperature of the diaphragm 96 rises by the ultrasonic wave which propagates, it cools by the process liquid supplied, and the temperature rise of the diaphragm 96 becomes about 1 degreeC.

However, in the type for irradiating the ultrasonic wave among the above-mentioned liquid component wet processing nozzles shown in Fig. 1, when the amount of the processing liquid to be used is reduced, the processing region between the wet processing nozzle and the substrate to be processed 90 is reduced. Bubbles may enter the 105, whereby a portion in which the processing liquid does not exist in this processing region may be generated. In the part where this process liquid is not filled, the irradiated ultrasonic wave is reflected from the to-be-processed substrate 90, and the temperature of the diaphragm 96 rises by this reflected ultrasonic wave. In particular, when the diaphragm 96 is thin about 3 mm, this heat propagates toward the ultrasonic vibrator body 108 and at the same time, the connection portion between the diaphragm 96 and the ultrasonic vibrating body 108 is heated instantaneously. There has been a problem that the ultrasonic vibrator main body 108 is peeled off from the diaphragm 96, or the temperature of the ultrasonic vibrator main body 108 rises, which may cause malfunction or breakage.

In addition, the actual use conditions of such a wet processing apparatus were not fully examined. In particular, various conditions in applying vibration on both surfaces of the substrate to be processed are determined by trial and error in the individual wet processing apparatuses, and there is a possibility that they may be used under conditions that are not necessarily appropriate.

This invention is made | formed in view of the said situation, and is trying to achieve the following objectives.

 (1) To provide a wet processing nozzle capable of preventing breakage of an ultrasonic vibrator even when a region in which the processing liquid does not exist in the processing region occurs during the wet processing operation.

 (2) To provide a wet processing nozzle capable of preventing temperature rise in an ultrasonic vibrator even when a region in which the processing liquid does not exist in the processing region during the wet processing operation.

 (3) To provide a wet processing nozzle capable of improving the operational stability of an ultrasonic vibrator.

 (4) To provide a wet processing apparatus having the wet processing nozzle described above.

In addition, the present invention provides a wet processing apparatus and a wet processing method in which the wet liquid of the above-mentioned liquid component type is made clear by appropriate conditions when applying vibration from both surfaces of the substrate to be processed, thereby enabling efficient wet processing. The task is to provide.

The wet processing nozzle of the present invention includes an introduction opening for supplying a processing liquid for wet processing of a workpiece toward the processing surface of the workpiece, and a discharge liquid of the processing liquid after the wet treatment from the processing surface. A wet processing nozzle having a discharge opening, comprising: an ultrasonic vibrator for imparting ultrasonic vibration to the processing liquid on the surface to be treated, and a vibrating portion in contact with the ultrasonic vibrator, wherein the vibrating portion includes at least the ultrasonic vibrator. The relationship between the thickness dimension T of the said vibration part in the to-be-processed object side, and the wavelength (lambda) of the said ultrasonic vibration in this vibration part,

T = (n ± 0.1) · λ / 2 (where n is an integer of 2 or more)

The problem was solved by being set to.

In the present invention, the relationship between the thickness dimension T of the vibration part on the side of the object to be treated and the wavelength? Of the ultrasonic vibration in the vibration part,

T = (n ± 0.1) λ / 2 (where n is an integer from 3 to 7)

It is preferable to set it as, and it is especially preferable to set it as T = (5 ± 0.1) * λ / 2.

Moreover, in this invention, it is also possible to employ | adopt the means by which the coating part is formed in contact with the said to-be-processed object side of the said vibration part.

Moreover, the said coating part can also be comprised so that the surface on the said to-be-processed object side may have reaction resistance and / or heat resistance with respect to the said process liquid.

In this invention, it is preferable that the relationship between the thickness dimension T 'of the said coating | coated part and the wavelength (lambda)' of the said ultrasonic vibration in this coating | coated part is set to any of the following.

T'≤λ '/ 20

T '= (1 ± 0.1) λ' / 2

In this invention, it is also possible to employ | adopt the means which the said vibration part is provided in both the said to-be-processed object side of the said ultrasonic vibrator, and the opposite side.

Further, the wet processing nozzle of the present invention includes an introduction opening for supplying a processing liquid for wet processing of an object toward the processing surface of the processing object, and a discharge liquid of the processing liquid after the wet processing on the processing surface. A nozzle for wet processing provided with a discharge opening for discharging, an ultrasonic vibrator for imparting ultrasonic vibration to the processing liquid on the surface to be treated, a coating portion formed on the side of the object to be in contact with the ultrasonic vibrator, A vibration part provided on the side opposite to the covering part in contact with the ultrasonic vibrator, and the relationship between the thickness dimension T 'of the covering part and the wavelength?' Of the ultrasonic vibration in the covering part is set to any of the followings. The said subject was solved by being made.

T'≤λ '/ 20

T '= (1 ± 0.1) λ' / 2

In the present invention, the coating portion may be configured such that the surface on the side of the workpiece has responsiveness and / or heat resistance to the treatment liquid.

Moreover, in each said invention, the said vibration part can be provided with the cooling means which cools the said vibration part.

Moreover, the said cooling means may become a structure which distribute | circulates a cooling liquid to the cooling pipe located in the inside and / or outside of the said vibration part.

In this invention, it is preferable that the said cooling liquid becomes the said processing liquid and / or the said discharge liquid.

The wet processing apparatus of the present invention includes a processing liquid introduction means for introducing a processing liquid between the wet processing nozzle, the introduction opening portion, and the surface to be processed, the discharge opening portion, and the object to be processed. In order to suck and discharge the processing liquid between the processing surface and the processing liquid recovery means, the wet processing nozzle and the processing target object are moved relative to the processing surface of the processing object so that the entire processing surface of the processing object is processed. This subject was solved by having the nozzle and to-be-processed object moving means for processing the process.

The wet processing nozzle of the present invention includes an introduction opening for supplying a processing liquid for wet processing of a workpiece toward the processing surface of the workpiece, and a discharge liquid of the processing liquid after the wet treatment from the processing surface. A wet processing nozzle having a discharge opening, comprising: an ultrasonic vibrator for imparting ultrasonic vibration to the processing liquid on the surface to be treated, and a vibrating portion in contact with the ultrasonic vibrator, wherein the vibrating portion includes at least the ultrasonic vibrator. The relationship between the thickness dimension T of the said vibration part in the to-be-processed object side, and the wavelength (lambda) of the said ultrasonic vibration in this vibration part,

T = (1 ± 0.1) λ / 2 (where n is an integer of 2 or more)

In the treatment area between the vibrating portion and the surface to be processed, even when there is a bubble-free area where there is no processing liquid, the thickness of the diaphragm is set to be large, By reducing the heat propagated to the ultrasonic vibrator, the temperature of the ultrasonic vibrator can be prevented from rising, and the ultrasonic vibrator can be prevented from being damaged.

Here, the thickness dimension of the vibrator means the direction in which sound waves propagate from the ultrasonic vibrator to the workpiece, in other words, the direction from the ultrasonic vibrator to the target surface to be processed, that is, when the workpiece is a substrate such as a semiconductor or a liquid crystal. Means the thickness dimension in the normal direction.

In addition, "the thickness dimension of the vibrating part on the to-be-processed object side" means the thickness dimension of only the to-be-processed object side, and even if the vibrating part is provided also on the opposite side to the to-be-processed object side of an ultrasonic vibrator, do not include.

In addition, the "wavelength of ultrasonic vibration of a vibration part" is a value determined by the frequency of the ultrasonic vibration, the material of the vibration part, and the like. For example, if the frequency of the ultrasonic vibration is set to 1 MHz and the vibration part is made of stainless steel (SUS316L), The half wavelength (λ / 2) is about 3 mm at 20 ° C, which is the standard temperature under standard operating conditions.

According to this invention, thickness dimension T is set thicker than before. For example, when the vibrating portion is stainless steel (SUS316L), the conventional standard thickness dimension T is about 3 mm, but when the frequency of the ultrasonic vibration is 1 MHz, it is set to at least twice the half wavelength, for example, 6 mm. As a result, the amount of heat propagated by the ultrasonic vibrator can be reduced.

In addition, since the thickness dimension T is set within a predetermined range centered on the integral multiple of the half wavelength (λ / 2), the transmittance of the ultrasonic vibration from the ultrasonic vibrator to the processing liquid can be increased.

In addition, the area | region in which there is no process liquid means that the process liquid does not exist enough in said thickness dimension direction in a process region, and most of the ultrasonic waves reflect on the surface of a to-be-processed substrate.

In the present invention, the thickness dimension T is set in the vicinity of three to seven times, in particular five times, the half wavelength of the ultrasonic vibration in the vibrating portion to efficiently propagate ultrasonic vibration in the vibrating portion. At the same time, the thickness dimension T is set to be large to further reduce the heat propagated from the vibrator to the ultrasonic vibrator, further preventing the temperature of the ultrasonic vibrator from rising, thereby further preventing the ultrasonic vibrator from being damaged. Can be.

When the thickness dimension T is set in a range exceeding 7 times the half wavelength of the ultrasonic vibration in the vibrating portion, the resonance point easily varies due to temperature fluctuations, etc., so that ultrasonic vibration is applied from the ultrasonic vibrator. It is not preferable because the vibration is attenuated and the vibration does not occur. In addition, when the thickness dimension T is set in a range smaller than three times the half wavelength of the ultrasonic vibration in the vibrating portion, bubbles are rolled up in the processing region between the vibrating portion and the surface to be processed. In the case where a region without the treatment liquid exists, the sum of the reduction of the heat propagated from the vibrator to the ultrasonic vibrator is small, which is not preferable because the temperature of the ultrasonic vibrator rises.

By setting the thickness dimension T to five times the half wavelength, it is possible to appropriately drive the ultrasonic vibrator and to reduce the possibility of damage in the ultrasonic vibrator in the case where a portion without wet processing liquid is formed in the treatment region. .

In addition, in the present invention, since the treatment liquid is not directly in contact with the vibrating portion by being formed in contact with the to-be-processed object side of the vibrating portion, the surface of the vibrating portion is not wetted. The degradation of the vibrating portion by the treatment liquid and the ultrasonic vibration can be reduced, and the life of the vibrating portion can be lengthened, and the components of the vibrating portion can be prevented from being mixed in the treatment liquid to contaminate the surface of the workpiece.

The coating part is configured such that the surface on the side of the object to be treated has reaction resistance and / or heat resistance to the treatment liquid, so that the reactive treatment liquid or the reactive treatment liquid at high temperature do not directly contact the vibrating part. Since the surface of the coating part is not wet-treated, the vibration part is further reduced from being deteriorated by the processing liquid and ultrasonic vibration, so that the life of the vibration part can be longer, and the components of the vibration part and the treatment surface coating part are reactive. However, it can be prevented from being mixed in the high temperature treatment liquid to contaminate the surface of the workpiece.

Here, as wet processing, treatments such as washing, peeling, developing, wet etching, plating and polishing can be applied. In this case, ultrapure water, electrolytic ion water, ozone water, hydrogen water, and the like are used as the treatment liquid to be supplied to the vibrating portion, and in the case of the peeling treatment, inorganic alkalis such as lean NaOH and lean KOH, and amines are used. In the case of developing treatment, inorganic alkalis such as lean NaOH and lean KOH, dimethyl trimonite ammonium dilute solution, and the like are used, and in the case of wet etching, fluoric acid etching solution and the like are used. In the case of Cu, Ag, Au plating solutions, and the like are used, and in the case of polishing, SiO ₂ slurry, Al ₂ O ₃ slurry, diamond slurry and the like are used.

Correspondingly, the coating part is made of fluorine resin such as quartz or PFA, but depending on the processing liquid used, the vibration part is made of stainless steel (SUS316L, etc.) of the passivation film surface whose outermost surface as the coating part is made only of chromium oxide. Can be done.

The vibrating portion may be made of stainless steel having a mixed film of aluminum oxide and chromium oxide as a coating portion on the surface thereof, or may be titanium or the like having an electrolytic polishing surface as the coating portion when the treated water is ozone water. In addition, as the coating part, it is possible to apply fluorine resins such as high purity alumina, sapphire, tetrafluoroethylene, PEEK (polyether ether ketone) and high purity glassy carbon.

In the present invention, the thickness dimension T 'of the covering portion is set to a constant range centered at 1/10 or less or 1 times the half wavelength (λ' / 2) of the ultrasonic vibration in the covering portion. In addition, it is possible to stabilize the wet treatment by minimizing the loss of vibration energy irradiated to the workpiece from the ultrasonic vibrator. Here, when the thickness dimension of the coating part is set to be equal to or less than 1/10 of the half wavelength of the ultrasonic vibration in the coating part, it is possible to propagate the ultrasonic vibration sufficiently efficiently to the processing liquid through the coating part. On the other hand, when the thickness dimension of the coating part is set in the range of less than one-half of the half-wave and larger than one-half of the half-wave, the loss of vibration energy irradiated to the workpiece from the ultrasonic vibrator is reduced. It is not desirable to increase.

In addition, the numerical value of 1/10 or less of the half wavelength of the ultrasonic vibration in the coating part is defined to allow the most efficient state to be selected depending on the temperature state of the vibration part and the coating part or the frequency of the ultrasonic vibration applied. It is to have a constant, and is not limited to the value of 1/10 of the half wavelength, and 1 time strictly.

Specifically, when the wavelength in the vibrating portion of the ultrasonic vibration generated from the ultrasonic vibrator is λ, the numerical range of 1/10 or less of the half wavelength is preferably λ / 120 to λ / 20 or less, more preferably. Preferably, it is below the range of (lambda) / 120-(lambda) / 60. In addition, it is preferable that the numerical value of 1 time of a half wavelength is specifically, the range of (lambda) /2±0.5 mm, More preferably, it is the range of (lambda) /2±0.05 mm or (lambda) /2±0.01 mm. It is possible to fall within the range. By setting the thickness of the coating as described above, the ultrasonic vibration from the ultrasonic vibrator can be effectively propagated. Therefore, if the wet treatment is performed using the wet processing nozzle equipped with the ultrasonic vibrator having such excellent characteristics, ultrasonic vibration (Ultrasonic energy) is sufficiently provided to the treatment liquid, and the wet treatment can be efficiently performed.

In this invention, it is also possible to employ | adopt the means which the said vibration part is provided in both the said to-be-processed object side of the said ultrasonic vibrator, and the opposite side.

In this case, since the vibration part is provided not only on the to-be-processed object side but on the opposite side, it is possible to form the whole-vibration part thickly, without thickening along the thickness dimension T of the vibration part on the to-be-processed object side. As a result, it is possible to more reliably prevent the ultrasonic vibrator from becoming hot by dispersing heat generated in the entire vibrator without lowering the transmittance of the ultrasonic vibrator from the ultrasonic vibrator to the processing liquid.

The vibrating portion on the object side and the vibrating portion on the opposite side of the workpiece can be formed integrally or separately.

Further, the wet processing nozzle of the present invention includes an introduction opening for supplying a processing liquid for wet processing of an object toward the processing surface of the processing object, and a discharge liquid of the processing liquid after the wet processing on the processing surface. A wet processing nozzle having a discharge opening for discharging, comprising: an ultrasonic vibrator for imparting ultrasonic vibration to the processing liquid on the surface to be treated, a coating portion formed on the side of the object to be in contact with the ultrasonic vibrator, and The vibration part provided in contact with an ultrasonic vibrator on the opposite side to the said covering part is provided, The relationship between the thickness dimension T 'of the said covering part, and the wavelength (lambda)' of the said ultrasonic vibration of this covering part is set to any of the followings. This problem was solved.

T'≤λ '/ 20

T '= (1 ± 0.1) λ' / 2

In this case, since the vibrating portion is provided on the side opposite to the object to be treated, the generated heat is dispersed in the vibrator without lowering the transmittance from the ultrasonic vibrator to the processing liquid of the ultrasonic vibration, thereby preventing the ultrasonic vibrator from becoming hot. There is a number.

In addition, the thickness dimension T 'of the coating part is set to a constant range centered on 1/10 or less or 1 time of the half wavelength (λ' / 2) in the ultrasonic vibration, so that the object to be processed is subjected to the ultrasonic vibrator. The loss of vibration energy to be irradiated can be minimized to stabilize the wet treatment. Here, when the thickness dimension of the coating part is set to be equal to or less than 1/10 of the half wavelength of the ultrasonic vibration in the coating part, it is possible to propagate the ultrasonic vibration sufficiently efficiently to the processing liquid through the coating part. On the other hand, when the thickness dimension of the coating part is set in the range of less than one-half of the half-wave and larger than one-half of the half-wave, the loss of vibration energy irradiated to the workpiece from the ultrasonic vibrator is reduced. It is not desirable to increase.

In addition, the vibrating portion is provided with cooling means for cooling the vibrating portion, so that even when used for a long time in a state where bubbles enter the processing region and a portion without a processing liquid is formed, the vibrating portion is cooled by the cooling means and vibrated. Since the negative temperature rise can be reduced and the temperature control of the vibrator can be controlled, the connection between the ultrasonic vibrator and the vibrator and the temperature of the ultrasonic vibrator can be prevented and the possibility of damage in the ultrasonic vibrator can be reduced. In addition, stable driving of ultrasonic irradiation in wet processing can be enabled.

In addition, the cooling means is configured to distribute the cooling liquid to the cooling tubes located inside and / or outside the vibrating portion, so that even if a portion without the processing liquid occurs in the processing region, the vibrating portion is formed by the cooling liquid. Since cooling becomes possible, the temperature rise of a vibration part can be prevented, the connection part of an ultrasonic vibrator and a vibration part, and the temperature rise of an ultrasonic vibrator can be prevented and the possibility of the damage in an ultrasonic vibrator can be reduced. .

Here, the cooling tube located inside the vibrating unit means, for example, a cooling tube serving as a cooling hole formed integrally with the vibrating unit or a structure in which a coolant can be distributed inside the cooling tube covering the groove formed on the surface of the vibrating unit with a lid. In addition, the outer side of a vibration part means the structure which can distribute a cooling liquid in the cooling tube connected along the surface of a vibration part, or the cooling tube which consists of a cooling body which has the groove part covered by the surface of a vibration part.

In the present invention, the cooling liquid is used as the treatment liquid and / or the discharge liquid, so that the cooling liquid is discharged by the treatment liquid supply discharge means without forming the cooling liquid supply discharge means for cooling. Since supply and discharge can be cooled and the vibration part can be cooled, manufacturing cost can be reduced. In addition, when the processing liquid is used as the cooling liquid, it becomes possible to use heat during cooling of the vibrating unit for temperature control of the processing liquid. In addition, when the discharge liquid is used as the cooling liquid, it is possible to supply the processing liquid without cooling the vibrating portion without depending on the temperature state of the vibrating portion.

In the ultrasonic vibrator, it is preferable that the frequency of the ultrasonic vibration is in the range of 20 kHz to 10 MHz. With such a configuration, ultrasonic cleaning is practical in the case where the wet treatment is provided in the nozzle for wet treatment.

The wet processing apparatus of the present invention includes a processing liquid introduction means for introducing a processing liquid between the wet processing nozzle, the introduction opening portion, and the surface to be processed, the discharge opening portion, and the object to be processed. Treatment liquid recovery means for sucking and discharging the treatment liquid between the treatment surface and the wetted nozzle and the object to be moved relative to the treatment surface of the object to be treated with the entire surface to be treated. By having a nozzle to-be-processed relative movement means for processing the process, it is possible to process the whole to-be-processed surface of a to-be-processed object with the advantage of the wet process nozzle of the said invention, and also to perform ultrasonic wet processing for a long time It can be performed stably and can provide the wet processing apparatus with high washing efficiency with respect to input power.

The present invention is a wet processing apparatus for maintaining a processing liquid in a gap between a pair of opposing nozzles, and treating the object to be processed in the gap, wherein the pair of nozzles each give vibration to the processing liquid. And a vibration imparting means, wherein vibrations imparted to the processing liquid from the vibration imparting means of the respective nozzles are imparted in a symmetrical relationship to both surfaces of the object to be treated.

According to the present invention, the vibration imparted to the processing liquid from the vibration imparting means is imparted in a symmetrical relationship to both surfaces of the workpiece. In other words, both sides of the vibration pressure are always maintained in the same state.

If there is a difference in the vibration pressure on both sides, a pressing force is applied to the object to be treated from the high pressure side to the low pressure side, and convex to the low pressure side. Since the direction of the force is reversed at the same time as the period of vibration, the workpiece itself vibrates. As a result of the deformation of the workpiece, the vibration pressure is attenuated on the high pressure side, and the vibration pressure is increased on the low pressure side, so that both sides of the net are small in amplitude that contributes to the generation of cavitation. In addition, energy as much as vibrating the object is absorbed from the vibration energy of the processing liquid.

According to the present invention, since the vibration pressure on both sides is always the same, the above phenomenon does not occur, and the vibration pressure applied to both surfaces of the object to be treated effectively affects the cavitation generation. Therefore, the high speed flow obtained by cavitation can enhance the wet treatment effect such as washing.

In the present invention, the pair of nozzles each includes a liquid contact plate formed on a surface facing the object to be processed, a processing liquid introduction portion for introducing a processing liquid between the object and the liquid contact plate, and the blood It is preferable to have a process liquid discharge part which discharges a process liquid between a process material and the said contact liquid plate, and the vibration given to the said process liquid from the said vibration giving means is given to the said process liquid through the said contact liquid plate. . In this case, since the treatment liquid is stably held on both surfaces of the workpiece and can always be replaced with a new treatment liquid, the workpiece can be effectively treated.

According to the present invention, the magnitude, frequency and phase of the vibration imparted to the processing liquid from the vibration imparting means of the respective nozzles, and the distance between the liquid contact plate of the respective nozzles and the object to be processed are respectively. It is preferred to be approximately equal to each other. Thereby, it becomes easy to give a vibration in the symmetrical relationship to both surfaces of the to-be-processed object from the said vibration imparting means of each said nozzle.

In this invention, it is preferable that the space | interval of the liquid plate and the liquid plate of each said nozzle is 8.0 mm or less, and the space | interval of a liquid plate and a to-be-processed object is 0.1 mm or more.

In this case, the distance between the liquid contact plate and the object to be treated is set to 0.1 mm or more in order to avoid contact between the liquid contact plate of the nozzle and the object to be processed at the time of conveyance. In addition, the distance between the liquid contact plate and the liquid contact plate is set to 8 mm or less because when it is larger than 8 mm, holding of the processing liquid becomes difficult and the process cannot be performed.

Moreover, the more preferable space | interval of a liquid contact plate and a liquid contact plate is 7 mm or less.

Moreover, in this invention, it is preferable to equip the liquid contact plate of each said nozzle and the said to-be-processed object with relative movement, keeping the space | interval mutually constant, and to provide the means for moving a nozzle or a to-be-processed object.

Thereby, the whole surface of a to-be-processed object can be wet-processed without making a contact liquid plate large.

In addition, the present invention is a wet processing method for maintaining a processing liquid in a gap between a pair of opposing nozzles and treating the processing object while applying vibration to the processing liquid in the gap, wherein both surfaces of the processing object are treated. Provided is a wet processing method characterized by imparting vibration in a symmetrical relationship.

According to the present invention, the vibration imparted to the processing liquid from the vibration imparting means is imparted in a symmetrical relationship to both surfaces of the workpiece. In other words, the vibration pressure of both surfaces is always maintained the same.

If there is a difference in the vibration pressures on both sides, the workpiece is subjected to a pressing force from the high pressure side to the low pressure side, and convex to the low pressure side. Since the direction of the force is reversed at the same time as the period of vibration, the object to be processed vibrates. The vibration pressure is attenuated on the high pressure side by the deformation of the processing target, and the vibration pressure is increased on the low pressure side, and the net amplitude which contributes to the generation of cavitation on both sides becomes small. In addition, energy as much as vibrating the object is absorbed from the vibration energy of the processing liquid.

According to the present invention, since the vibration pressure on both sides is always the same, the above phenomenon does not occur, and the vibration pressure applied to both surfaces of the object to be treated effectively affects the cavitation generation. Therefore, by the high speed flow obtained by cavitation, the wet processing effect, such as washing | cleaning, can be heightened.

In the present invention, the pair of nozzles each includes a liquid contact plate formed on a surface facing the object to be processed, a processing liquid introduction portion for introducing a processing liquid between the object and the liquid contact plate, and the It is preferable to have a process liquid discharge part which discharges a process liquid between a to-be-processed object and the said contact liquid plate, and a vibration imparting means, and a vibration is given to the said process liquid from the said vibration imparting means through the said contact liquid plate. .

In this case, it is stable on both surfaces of the object to be treated, and the processing liquid can be maintained and the new processing liquid can always be replaced, so that the object can be treated effectively.

According to the present invention, the distance between each of the liquid contact plates and the object to be treated is approximately equal to each other, and the magnitude, frequency, and phase of the vibration are respectively different with respect to the processing liquid through the respective liquid contact plates. It is preferable to give approximately the same vibration to each other.

Thereby, it becomes easy to give a vibration in the symmetrical relationship to both surfaces of the to-be-processed object from the said vibration imparting means of each said nozzle.

In this invention, it is preferable that the space | interval of the liquid plate and the liquid plate of each said nozzle is 8.0 mm or less, and the space | interval of a liquid plate and a to-be-processed object is 0.1 mm or more.

In this case, the distance between the liquid contact plate and the object to be treated is set to 0.1 mm or more in order to avoid contact between the liquid contact plate of the nozzle and the object to be processed at the time of conveyance. In addition, the interval between the liquid contact plate and the liquid contact plate is set to 8 mm or less because when it is larger than 8 mm, holding of the processing liquid becomes difficult and the processing cannot be performed.

Moreover, the more preferable space | interval of a liquid contact plate and a liquid contact plate is 7 mm or less.

Moreover, in this invention, it is preferable to make each said liquid contact plate and the said to-be-processed object relatively move, keeping the space | interval mutually constant.

Thereby, the whole surface of a to-be-processed object can be wet-processed without making a contact liquid plate large.

Embodiment of the invention

EMBODIMENT OF THE INVENTION Hereinafter, 1st Embodiment of the wet processing nozzle and wet processing apparatus which concern on this invention is described based on drawing.

[First embodiment]

FIG. 1 is a bottom view of the wet processing nozzle in the present embodiment, and FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1. In the figure, reference numeral 1 denotes a nozzle for wet processing in the present embodiment.

1 and 2, the cleaning nozzle 1 of this embodiment has an introduction passage (introduction pipe 21) having an inlet port 21a for introducing a cleaning liquid (treatment liquid: 2) at one end thereof; At one end, discharge passages (discharge pipes 22) having discharge ports 22a for discharging the washing liquid (the discharge liquid of the treated liquid after the wet treatment) to the outside are formed, and these introduction passages 21 and the discharge passages 22 are formed. The other end of each is connected to form a connecting portion 23 having an opposing surface 46a facing the substrate to be processed (object to be processed W), and at the same time, an introduction passage 21 is provided to the connecting portion 23. The opening 1st opening (induction opening part 21b) and the opening 2nd opening (outlet opening part 22b) are formed. Such a nozzle is called a push-pull nozzle (a sex flow nozzle). The first and second openings 21b and 22b are opened toward the substrate W to be processed. In the space between the connecting portion 23 and the substrate W to be processed, a processing region 35 for performing wet processing is formed.

In addition, the connecting portion 23 is provided with an ultrasonic vibrator portion 46 for imparting ultrasonic vibration to the cleaning liquid 2 in the processing region 35 while the substrate W is cleaned. The ultrasonic vibrator portion 46 is provided on a diaphragm (vibration portion 46) and an ultrasonic vibrator 48 provided on the main surface of the diaphragm 46 to impart ultrasonic vibration to the diaphragm 46. The ultrasonic vibrator 48 is an electro-distortion element such as PZT, and receives an ultrasonic wave electric signal from an oscillator to generate ultrasonic vibration. The ultrasonic vibrator 48 is connected to the diaphragm 46 by an adhesive such as an ultrasonic vibrator for which epoxy resin is a main component.

As a material which comprises the diaphragm 46, it is selected from ceramics, such as high-purity glassy carbon, stainless steel, quartz, sapphire, and aluminum, or aluminum, its alloy, titanium, magnesium, etc., and is used. In the case of the wet treatment nozzle used for a normal cleaning treatment, stainless steel is sufficient as the material of the diaphragm 46. However, when the cleaning liquid is a relatively strong acid or hydrofluoric acid, it is composed of ceramics such as sapphire or aluminum. Since it is excellent in the tolerance with respect to a wet process liquid and can prevent deterioration, it is preferable in carrying out a wet process.

In addition, the ultrasonic vibrator 48 is preferable from the viewpoint of practical use in the case of wet processing that is capable of outputting ultrasonic vibrations in a frequency in the range of 20 kHz to 10 MHz, and in particular, 0.2 MHz in view of the thickness of the maintainable treatment liquid layer. The above frequency is more preferable.

In addition, the length of the wavelength λ in the diaphragm 46 of the ultrasonic vibration generated from the ultrasonic vibrator 48 is in the range of about 0.6 mm to about 300 mm when the diaphragm 46 is made of stainless steel (SUS316L). .

The diaphragm 46, when the thickness dimension T shown in FIG. 1 makes the wavelength in the said diaphragm 46 of the ultrasonic vibration generate | occur | produced from the ultrasonic vibrator 48 into (lambda),

T = (n ± 0.1) λ / 2 (where n is an integer of 2 or more)

Is set to. As a value of n, 3-7, especially 5 are preferable.

Here, the thickness dimension T is preferably set within a range having a width with respect to each numerical value, such as λ ± 0.3 mm, 3λ / 2 ± 0.3 mm, 5λ / 2 ± 0.3 mm, and 7λ / 2 ± 0.3 mm. This considers conditions such as temperature change. By setting the thickness dimension T in this way, the ultrasonic vibration from the ultrasonic vibrator 48 can be effectively propagated, and the wet treatment is performed using the cleaning nozzle 1 provided with the ultrasonic vibrator portion 46. Ultrasonic vibration (ultrasound energy) is sufficiently provided to the cleaning liquid 2, and the wet treatment can be efficiently performed.

In addition, a pressure control unit (not shown) is provided on the discharge passage 22 side, and this pressure control unit (treatment liquid recovery means) has a discharge passage 22 after the cleaning liquid 2 in contact with the substrate W is cleaned. And the pressure of the cleaning liquid (including the surface tension of the cleaning liquid and the surface tension of the surface to be cleaned) and the atmospheric pressure of the cleaning liquid in contact with the atmosphere of the first opening 21b. The pressure control part is constituted by a pressure reducing pump formed on the discharge port 22a side. Therefore, by using the pressure reduction pump at the pressure control part on the discharge passage 22 side, the pressure to suck the cleaning liquid of the connecting portion 23 is controlled by the pressure reducing pump, so that the cleaning liquid is in contact with the atmosphere of the first opening 21b. The pressure (including the surface tension of the cleaning liquid and the surface tension of the surface to be cleaned of the substrate W) and the atmospheric pressure are balanced.

In short, the relationship between the pressure Pw (including the surface tension of the cleaning liquid and the surface tension of the surface to be cleaned of the substrate W) and the atmospheric pressure Pa of the cleaning liquid in contact with the atmosphere of the first opening 21b is set to Pw ≠ Pa. The cleaning liquid supplied to the processing target substrate W through the first opening 21b is discharged to the discharge passage 22 without leaking to the outside of the cleaning nozzle. That is, the cleaning liquid supplied from the cleaning nozzle onto the substrate W is in contact with portions other than the portions (first and second openings 21b, 22b) supplied with the cleaning liquid on the substrate W. Without, is removed on the substrate (W).

At the time of cleaning the substrate W to be treated here, ultrasonic vibration is applied by the ultrasonic vibrator 48 while the cleaning liquid 2 is supplied to the processing region 35, and moved together with the cleaning liquid 2 to be treated. The substrate W can be cleaned. In addition, in the ultrasonic vibrator portion 46 provided in the cleaning nozzle 1 of the present embodiment, when ultrasonic vibration is emitted from the ultrasonic vibrator 48, the ultrasonic vibration propagates to the diaphragm 46, but Since the thickness dimension T is set as described above, the propagated ultrasonic vibration is processed from the opposing surface 46A (the surface opposite to the surface on which the ultrasonic vibrator 48 is formed) opposite the main surface of the diaphragm 46. It is efficiently radiated to the cleaning liquid (2) of.

The distance H between each opening part 21b, 22b of the washing | cleaning nozzle 1, and the to-be-processed board | substrate W is 8 mm or less, and the range which does not contact the to-be-processed board | substrate W is good, Preferably it is It is good to set it as the range which does not contact the board | substrate W by 6 mm or less, More preferably, it does not contact the board | substrate W by 3 mm or less. It is because when it exceeds 8 mm, it will become difficult to fill a desired washing | cleaning liquid between the board | substrate W and the washing | cleaning nozzle, and cleaning will become difficult.

The opposing surface 46A serving as the liquid contact surface of the cleaning nozzle 1 is formed of a fluorocarbon resin such as PFA, or a stainless steel of the passivation film surface whose outermost surface is only chromium oxide, or aluminum oxide and chromium oxide. For the stainless steel and the ozone water provided with the mixed film on the surface, it is preferable to use a corresponding surface coating part made of titanium having an electropolishing surface and the like, since there is no elution of impurities in the cleaning liquid. If the liquid contact surface is made of quartz, it is suitable for supplying all the cleaning liquids except hydrofluoric acid.

In the configuration of the cleaning nozzle in the present embodiment, when the cleaning liquid 2 supplied to the processing region 35 is hydrogen water, it can be used as a hydrogen water ultrasonic cleaning nozzle, and when the cleaning liquid is ozone water It can be used as a nozzle for ozone ultrasonic cleaning, and when the cleaning liquid is pure water, it can be used as a nozzle for pure rinse ultrasonic cleaning.

In the cleaning nozzle 1 of this embodiment, the thickness dimension of the vibration part (vibration plate) 46 is set to an integer multiple greater than twice the half wavelength λ / 2 of the ultrasonic vibration in the vibration part 46. As a result, in the processing region 35 between the opposing surface 46A of the vibrating portion 46 and the processing target surface W1 of the processing target object W, bubbles are rolled up to form the processing liquid 2 Even in the absence of a region, the thickness T of the diaphragm 46 is set larger than conventionally, and heat is generated in the diaphragm 46 by ultrasonic waves reflected from the substrate W in the bubble region. In this case, the heat propagated from the vibrator portion 46 to the ultrasonic vibrator 48 can be reduced, thereby preventing the temperature of the ultrasonic vibrator 48 from rising and preventing the ultrasonic vibrator 48 from being damaged. At the same time, the connection between the diaphragm 46 and the ultrasonic vibrator 48 is broken, resulting in malfunction. It can be prevented from causing.

For example, when the frequency in the ultrasonic vibration is set to 1 MHz and the vibrating portion 46 is made of stainless steel (SUS316'L), the half wavelength λ / 2 is about 3 mm, and the vibrating portion 46 Can be set to a thickness 6 mm thicker than the conventional 3 mm, thereby increasing the ratio of the amount of heat transmitted from the diaphragm 46 to parts other than the ultrasonic vibrator 46, It is possible to reduce the amount of heat propagated to the ultrasonic vibrator 46, to prevent the temperature of the ultrasonic vibrator 48 from rising, and to prevent the ultrasonic vibrator 48 from being damaged.

Moreover, it is preferable that the thickness dimension T of the vibration part 46 is set to 3 to 7 times the range of half wavelength (lambda) / 2 of the ultrasonic vibration in the vibration part 46, More preferably, The thickness dimension T of the vibrator portion 46 is set to 5 times the half wavelength λ / 2 of the ultrasonic vibration in the vibrator portion 48, so that the ultrasonic wave vibrates efficiently in the vibrator portion 46. At the same time, the thickness dimension T of the vibrator portion 46 is set to be larger than that in the prior art, and the heat transmitted from the vibrator portion 46 to the ultrasonic vibrator 48 is further reduced, and the temperature of the ultrasonic vibrator 48 is increased. It is possible to further prevent the rising, thereby further preventing the ultrasonic vibrator 48 from being broken.

Here, when the thickness dimension T of the vibration part 46 is set to the range of 7 times or more of the half wavelength (lambda) / 2 of the ultrasonic vibration in the vibration part 46, a resonance point becomes easy by temperature fluctuation etc. The oscillator of the ultrasonic wave electric signal for causing ultrasonic vibration from the ultrasonic vibrator 48 is not adjusted well, and the diaphragm 46 becomes difficult to vibrate. In addition, when the thickness dimension T of the diaphragm 46 is set to the range of 3 times or less of the half wavelength of the ultrasonic vibration in the vibration part 46, the opposing surface 46A of the vibration part 46 and a to-be-processed object In the processing area 35 between the processing surface W1 of (W), when the bubble is rolled up and there is an area where the processing liquid 2 is not present, the ultrasonic vibrator 48 from the vibration part 46 is present. It is not preferable because the degree of reducing the heat propagating to Nm is small and the temperature of the ultrasonic vibrator 48 rises. Further, the thickness dimension of the vibrator portion 46 is set to 5 times the half wavelength λ / 2 of the ultrasonic vibration in the vibrator portion 46, thereby stably driving the ultrasonic vibrator 48, and Even if the wet processing liquid 2 disappears from the processing region 35, the possibility of damage in the ultrasonic vibrator 48 can be optimally reduced.

Here, the relationship between the thickness dimension T of the vibration part 46 and the resonance frequency of the vibration part 46 is demonstrated. Fig. 3 is a graph showing impedance characteristics in the case of having a 9/2 / 2-thick diaphragm having a coating having a thickness of? / 2, and Fig. 4 having a 5/2 / 2-thick diaphragm having a coating having a thickness of? / 2. It is a graph showing the impedance characteristics in the case.

As shown in Fig. 3 and Fig. 4, the frequency impedance characteristic of the ultrasonic vibration is the point where the maximum value represents the resonance point of the diaphragm. As shown in Fig. 3, the impedance characteristic of the diaphragm having a thickness of 9λ / 2 is As the frequency interval between the resonance points becomes smaller and the frequency of the ultrasonic vibration increases, the interval width between the frequencies between the resonance points becomes smaller. For this reason, when vibration conditions, such as a temperature state, change, it is difficult to vibrate a diaphragm efficiently.

In contrast, in the present embodiment, as shown in FIG. 4, the impedance characteristic of the diaphragm 46 having a thickness of 5λ / 2 is wider than that shown in FIG. 3. Even when vibration conditions, such as temperature conditions, change, the diaphragm 46 can be vibrated efficiently, and the operation | movement of a wet processing nozzle can be stabilized.

As described above, in the present embodiment, the thickness dimension T of the vibration unit 46 is set in a range of 3 times to 7 times the half wavelength λ / 2 of the ultrasonic vibration in the vibration unit 46. This makes it possible to efficiently propagate the ultrasonic vibrations in the vibrator portion 46, and set the thickness dimension T of the vibrator portion 46 to be larger than that of the conventional one, and from the vibrator portion 46, the ultrasonic vibrator 48 ), The heat propagated to ()) can be reduced, the temperature of the ultrasonic vibrator 48 can be prevented from rising, and the possibility of breakage of the ultrasonic vibrator 48 can be reduced. In addition, the thickness dimension T of the vibration part 46 is set to 5 times the half wavelength λ / 2 of the ultrasonic vibration in the vibration part 48, so that the ultrasonic vibration in the vibration part 46 is more efficient. It is possible to propagate well, and at the same time, the thickness dimension T of the vibrator portion 46 is set to be larger than that of the conventional one, and the heat transmitted from the vibrator portion 46 to the ultrasonic vibrator 48 is further reduced, and the ultrasonic vibrator 48 ) Can further prevent the ultrasonic wave oscillator 48 from being damaged by further raising the temperature of the ultrasonic wave oscillator 48, and stably drive the ultrasonic wave vibrator 48 from the processing region 35. ), It is possible to optimize the reduction of the possibility of damage in the ultrasonic vibrator 48.

In addition, in the above embodiment, attention has been focused on only the thickness dimension T of the vibrator portion 46. However, other modifications can be made without departing from the spirit of the present invention.

In the present embodiment, the case where the cleaning nozzle 1 is formed on the upper surface side (one surface to be processed) of the substrate W is explained. However, as shown in FIG. 5, the lower surface of the substrate W to be processed is illustrated. The cleaning nozzle 1a may also be formed on the side. This washing nozzle 1a is not provided with the ultrasonic vibrator 48 in the connection part 23, but the structure of the washing nozzle 1a is the same as that of the washing nozzle 1 mentioned above.

EMBODIMENT OF THE INVENTION Hereinafter, 2nd Embodiment of the wet processing nozzle and wet processing apparatus which concern on this invention is described based on drawing.

2nd Embodiment

6 is a cross-sectional view showing the nozzle for wet processing in the present embodiment.

In this embodiment, what differs from the 1st embodiment shown in FIGS. 1-5 is the point of the structure of the covering part 49, The same code | symbol is attached | subjected to the other corresponding component, and the description is abbreviate | omitted.

On the opposing surface 46A serving as the liquid contact surface of the vibrating portion 46, as shown in FIG. 6, a coating portion having reactivity and / or heat resistance with respect to the processing liquid 2 so as to cover the opposing surface 46A ( 49) is formed.

This coating part 49 changes in the structure according to the wet process adapted.

Here, as wet processing, treatments such as washing, peeling, developing, wet etching, plating and polishing can be applied. At this time, as the treatment liquid 2 supplied to the vibrator portion 46, in the case of the washing treatment, ultrapure water, electrolytic ion water, ozone water, hydrogen water, and the like are used, and in particular, cathode water (in electrolytic ion water, the cathode electrode side). And hydrogen water, ammonia hydrogenated water, and the like can be used stably, and in the case of the peeling treatment, an inorganic alkali such as lean NaOH and lean KOH, an amine peeling liquid, or the like is used. Inorganic alkalis such as lean NaOH, lean KOH, and dimethyl trimethylammonium dilute solution, and the like, in the case of wet etching, a fluoric acid etching solution is used, and in the case of plating treatment, a plating solution for Cu, Ag, and Au Etc. are used, and in the case of polishing, SiO ₂ slurry, Al ₂ O ₃ slurry, diamond slurry and the like are used.

Correspondingly, the coating portion 49 may be made of fluorine resin such as quartz, high purity alumina, sapphire, PFA, ethylene tetrafluoride, PEEK (polyether ether ketone) high purity glassy carbon, or the like. In addition, depending on the processing liquid 2 to be used, the vibration part 46 consists of stainless steel (SUS316L etc.) of the passivation film surface which the outermost surface as the coating part 49 consists only of chromium oxide, and the vibration part 46 (A) Titanium or the like having a mixed film of aluminum oxide and chromium oxide formed of stainless steel provided on the surface as the coating portion 49, or titanium having an electrolytic polishing surface as the coating portion 49 when the treated water 2 is made of ozone water. It is possible to consist of.

The thickness dimension T 'of the coating part 49 of this embodiment is (lambda)' / 20 or less with respect to the wavelength (lambda) 'of the ultrasonic vibration in the coating part 49, as shown in FIG. By setting it to λ '/ 2, it is possible to minimize the loss of vibration energy irradiated from the ultrasonic vibrator 48 to the workpiece W and to stabilize the wet process.

Specifically, when the frequency in the ultrasonic vibration is set to 1 MHz and the covering portion 49 is made of stainless steel (SUS316L), the half wavelength λ '/ 2 can be set to about 3 mm. As a result, the ratio of the amount of heat propagated from the diaphragm 46 to the portion other than the ultrasonic vibrator 46 can be increased to reduce the amount of heat propagated to the ultrasonic vibrator 46, so that the temperature of the ultrasonic vibrator 48 is increased. Can be prevented, and the ultrasonic vibrator 48 can be prevented from being broken.

When the thickness dimension T 'of the covering part 49 is set in the range of (lambda)' / 20 times or less with respect to the wavelength (lambda) 'of the ultrasonic vibration in the covering part 49, the opposing surface of the vibrating part 46 ( It is preferable because the reaction with the processing liquid 2 does not occur in 46A) and the ultrasonic vibration can be sufficiently propagated to the processing liquid 2. Further, the thickness dimension T 'of the covering portion 49 is greater than λ' / 20 and less than λ '/ 2 and greater than λ' / 2 to the wavelength λ 'of the ultrasonic vibration in the covering portion 49. When set in the range, the loss of the vibration energy irradiated from the ultrasonic vibrator 48 to the workpiece W increases, which is not preferable.

Here, the numerical values of lambda '/ 20 or less and lambda' / 2 times with respect to the thickness dimension T 'of the coating part 49 are the temperature state of the vibration part 46 and the coating part 49, and the ultrasonic vibration provided. It has a positive width so that the most efficient state can be selected according to the frequency of, and is not strictly limited to a value of λ '/ 20 or λ' / 2 times.

Specifically, when the wavelength in the covering portion 49 of the ultrasonic vibration generated from the ultrasonic vibrator 48 is λ ', the numerical range of λ' / 20 or less is λ '/ 120 to λ' / 20. It is preferable that it is below the range, More preferably, it becomes below the range of (lambda) '/ 120-(lambda)' / 60. In addition, it is preferable that the numerical value of (lambda) '/ 2 becomes specifically, the range of (lambda)' / 2 ± 0.5 mm, More preferably, it is the range of (lambda) '/ 2 ± 0.05mm or λ' / 2. It is possible to be in the range of ± 0.01 mm. By setting the thickness of the coating part 49 in this way, the ultrasonic vibration from the ultrasonic vibrator 48 can be effectively propagated, so that the ultrasonic treatment part with the ultrasonic vibrator portion 46 having such excellent characteristics is provided for wet processing. When the wet treatment is performed using the nozzle 1, ultrasonic vibration (ultrasound energy) is sufficiently applied to the treatment liquid, and the wet treatment can be efficiently performed.

In the wet processing nozzle 1 of the present embodiment, the same effect as in the above embodiment can be obtained, and a coating portion 49 is formed, and the coating portion 49 is a treatment liquid 2 By having the reaction resistance and / or heat resistance with respect to), the treatment liquid 2 does not directly contact the opposing surface 46A of the vibrating portion 46, and the surface of the treated surface coating portion 49 is wet-treated. Since the vibration part 46 is further reduced from being degraded by the processing liquid 2 and the ultrasonic vibration, the life of the vibration part 46 can be further extended, and the vibration part 46 and the surface of the processing surface are avoided. It is possible to prevent the components of the abdomen 49 from mixing in the processing liquid 2 to contaminate the processing target surface W1 of the processing target object W. At the same time, in the processing region 35 between the opposing surface 46A of the vibrating portion 46 and the processing surface W1 of the processing target object W, bubbles are rolled up so that the processing liquid 2 is absent. In the case where the region exists and the vibrating portion 46 generates heat, even if the vibrating portion 46 in contact with the processing liquid 2 rises in temperature, thermal conductivity is effectively generated in the vibrating portion 46, Since the heat can be discharged to the processing liquid 2 through the abdomen 49, the vibration part 46 can be prevented from being damaged.

In addition, as the nozzle 1 for wet processing of this embodiment, the ultrasonic wave oscillator 48 is made by making the thickness T 'of the coating part 49 into (lambda)' / 20 or less or (1 +/- 0.1) * '' / 2. ), Since the ultrasonic vibration from the vibrator 46 can be effectively propagated, when the wet treatment is performed using the wet processing nozzle 1 provided with the ultrasonic vibrator portion 46 having such excellent characteristics, Vibration (ultrasound energy) is sufficiently imparted to the treatment liquid, and the wet treatment can be efficiently performed. In addition, since not only the vibrating portion 46 but also the covering portion 49 is formed, the thickness dimension T of the vibrating portion 46 is set to be thick by the thickness dimension T ', so that the vibrating portion 46 Even in the processing region 35 between the opposing surface 46A and the processing target surface W1 of the processing target object W, bubbles are rolled up so that even if there is an area without the processing liquid 2, the foaming Even when heat is generated in the diaphragm 46 by the ultrasonic waves reflected from the substrate W in the region of the processing area, the heat propagated from the vibrator portion 46 to the ultrasonic vibrator 48 is reduced, so that the ultrasonic vibrator 48 Can be prevented from being raised, and the ultrasonic vibrator 48 can be prevented from being damaged, and at the same time, the connection portion between the diaphragm 46 and the ultrasonic vibrator 48 can be prevented from being broken and causing malfunction. have.

Also in this embodiment, as in the first embodiment shown in FIG. 5, it is possible to form the cleaning nozzle 1a on the lower surface side of the substrate W to be processed.

EMBODIMENT OF THE INVENTION Hereinafter, 3rd embodiment of the wet processing nozzle and wet processing apparatus which concern on this invention is described based on drawing.

 [Third Embodiment]

7 is a cross-sectional view showing the nozzle for wet processing in the present embodiment.

In this embodiment, what differs from the 1st embodiment shown in FIGS. 1-5 is a point regarding the structure of the cooling tube 50, The same code | symbol is attached | subjected to the other corresponding component, and the description is abbreviate | omitted.

As shown in FIG. 7, the vibrator portion 46 has cooling means for cooling the vibrator portion 46 on both sides of the introduction passage 21 side and the discharge passage 22 side of the connecting portion 23. , Cooling tubes (cooling bodies: 50, 50) are formed, respectively.

The cooling tubes 50 and 50 are made of a material substantially equivalent to the vibrating portion 46 or the introduction passage 21, the discharge passage 22, and the like, and parallel to the opposing surface 46A on the side of the vibrating portion 46. In other words, it extends in a direction substantially perpendicular to the surface of Fig. 7, and is set to a length dimension substantially the same as the length dimension of the vibrator portion 46 in this direction. The cooling pipe 50 is a cooling body 50, 50 having a semi-cylindrical semi-cylindrical cross-sectional shape in a direction perpendicular to the flow path direction, and the opening of the cooling body 50, 50 is a vibrating portion ( 46) are hermetically connected so as to be covered by the side surface. Both ends of the cooling pipe 50 are connected to the discharge port 22a and a pressure reducing pump (not shown) via the cooling pipe 50a, respectively, and the discharge pipe 22, the cooling pipe 50, and the pressure reducing pump are treated. Treatment liquid recovery means for sucking and discharging the discharge liquid (treatment liquid 2) from the area 35 is configured.

In the wet processing nozzle 1 of the present embodiment, the cleaning liquid 2 supplied from the processing liquid introduction means to the processing region 35 on the substrate W through the introduction opening portion 21b is discharged ( 22b) is discharged by the decompression pump from the discharge port 22a, passing through the inside of the cooling pipes 50 and 50 located on both sides of the vibrating part 46 in 22b). That is, the discharge liquid (processing liquid 2) as a cooling liquid flows to the cooling pipe 50 in which a cooling means is located in the outer side of the vibration part 46. As shown in FIG.

As a result, in the wet processing nozzle 1 of the present embodiment, the same effect as in the above embodiment can be obtained, and the vibrating portion 46 can be cooled by the cooling liquid 2. The temperature rise of the vibrator portion 46 can be prevented, so that the vibrator portion 46 can be cooled by the coolant 2 even when a portion without the treatment liquid 2 occurs in the treatment region 35. Therefore, the temperature rise of the vibrator portion 46 can be prevented more reliably, and the connection portion between the ultrasonic vibrator 48 and the vibrator portion 46 and the temperature rise of the ultrasonic vibrator 48 are prevented and the ultrasonic vibrator portion is prevented. The possibility of damage in (46) can be reduced.

In addition, by using the discharge liquid 2 as the cooling liquid, there is no need to provide a cooling liquid supply discharge means in particular for cooling the vibrating portion 46, and by supplying and discharging the cooling liquid by the treatment liquid introduction discharge means, the cooling tube 50 And 50), the vibrator 46 can be cooled by circulating therein, so that the manufacturing cost and the working capital of the wet processing nozzle 1 can be reduced. In addition, since the discharge liquid 2 is used as the cooling liquid, the processing liquid 2 can be supplied without cooling the vibrating portion 46 without depending on the temperature state of the vibrating portion 46.

In addition, in this embodiment, the side surface of the vibrating part 46 to which the cooling body 50 is connected is made into substantially flat surface, but as shown in FIG. 8, the cooling corresponding to the cooling body 50 in the vibrating part 46 side surface is shown. The groove 50A is formed, the cooling groove 50A is covered with the cooling tube 50 to increase the cross-sectional area as a cooling passage through which the cooling liquid 2 flows, thereby increasing the flow rate of the cooling liquid and It is also possible to increase the area which the cooling liquid 2 contacts with the eastern part 46, and to improve cooling efficiency.

In the present embodiment, the inner surface of the cooling tubes 50 and 50, the side surface of the vibrating portion 46, and the inner surface of the cooling groove 50A are in contact with the processing liquid 2 as the cooling liquid. In this regard, it is also possible to perform the same surface coating, surface modification, and the like as the opposing surface coating portion 49 in the second embodiment shown in FIG. In addition, as shown in FIG. 9, the cooling inner tube of the same quality as the coating | coated part 49 in 2nd Embodiment shown in FIG. 6 as a cooling tube 50B inside the cooling body 50 and 50A of cooling grooves ( It is also possible to form 50B). In these cases, the degradation of the treatment liquid 2 can be further reduced, and the life of the vibrator 46 can be longer.

In addition, the cooling tube 50 is not provided on a portion other than the side of the vibrator 46, for example, on the main surface to which the ultrasonic vibrator 48 is connected, or a groove is formed on the surface of the vibrator 46. Cooling holes for flowing coolant may be formed in the vibrator portion 46. When the cooling holes are formed in this manner, the contact area between the cooling liquid and the vibrating portion 46 is further increased, and the cooling effect can be further obtained.

EMBODIMENT OF THE INVENTION Hereinafter, 4th embodiment of the wet process nozzle which concerns on this invention is described based on drawing.

Fourth embodiment

10 is a cross-sectional view showing the wet processing nozzle in the present embodiment.

The present embodiment is fundamentally different from the first embodiment from the third embodiment in that the vibrator portion 46 is disposed on the side opposite to the substrate W of the ultrasonic vibrator 48. Also in FIG. 10, the same code | symbol is attached | subjected to the component which is common in FIGS. 1-9, and the detailed description is abbreviate | omitted.

In the present embodiment, the coating portion 49 is formed on the substrate W side of the ultrasonic vibrator 48, and the coating portion 49 connects the introduction passage 21 and the discharge passage 22. The connection part 23 is made. Since the coating part 49 is in contact with the processing liquid 2, as described in the second embodiment, the coating part 49 is formed using a material excellent in the reaction resistance and the heat resistance in response to the processing liquid 2.

The relationship between the thickness dimension T 'of the coating part 49 and the wavelength (lambda)' of the ultrasonic vibration in a coating part is set by the relationship of any of the following.

T'≤λ '/ 20

T '= (1 ± 0.1) λ' / 2

The reason why thickness dimension T 'should be set as above is demonstrated using FIG. 11 is a graph showing the relationship between the thickness dimension T 'of the coating portion 49 and the transmittance of ultrasonic vibration.

In Fig. 11, the solid line is a theoretical value without considering the absorption of vibration by the covering portion 49, and the maximum value is 1.0 (100%) for every half of the wavelength λ 'of ultrasonic vibration in the covering portion, that is, half wavelength. Take In practice, however, the maximum value for each half-wave is gradually attenuated as indicated by the broken line as indicated by the experimental value of the x mark. As can be understood from the graph of FIG. 11, the transmittance decreases as the thickness dimension T 'of the covering portion 49 moves away from zero, and becomes minimum at 1/4 of the wavelength?'. Therefore, the most preferable value as the thickness dimension T 'of the coating part 49 is a value close to zero without limitation, but if it is λ' / 20 or less practically, there is no problem. The next preferable value as the thickness dimension T 'of the coating portion 49 is λ' / 2 which becomes the initial maximum value, but there is no problem if it is practically in the range of (1 ± 0.1) · λ '/ 2.

The wavelength? 'Of the ultrasonic vibration is almost determined by the frequency of the ultrasonic vibration and the material of the covering part, but varies slightly depending on the temperature. Therefore, wavelength (lambda) 'in said formula is judged on the standard temperature conditions in a standard use state.

In the present embodiment, the vibrator portion 46 is formed on the side opposite to the substrate W side of the ultrasonic vibrator 48. The thickness dimension T "of this vibrating portion 46 is a sufficiently large value in order to disperse heat near the ultrasonic vibrator. In this case, the vibrating portion 46 is the ultrasonic vibrator 48 and the processing liquid 2. ), It is not necessary to consider the transmittance of ultrasonic vibration. Therefore, the thickness dimension T ″ does not consider the wavelength λ of the ultrasonic vibration in the vibrator portion 46 and is continuous. It can be selected in any range.

In addition, although the material of the vibrating part 46 may be the same material as the coating part 49, it is preferable to use another material. Since the vibrating part 46 does not need to consider reaction resistance, abrasion resistance, etc. with respect to the process liquid 2, it can form it with a cheap material. In addition, the vibrator portion 46 preferably has a large heat capacity and is excellent in thermal conductivity and easy to conduct heat to the outside.

Also in this embodiment, cooling means is provided in this vibration part 46. Since the specific structure is the same as that of FIG. 9 of 3rd Embodiment, description is abbreviate | omitted.

According to the present embodiment, since the vibrator portion 46 is disposed on the side opposite to the substrate W side of the ultrasonic vibrator 48, it is sufficient without considering the attenuation of the ultrasonic vibration transmitted to the processing liquid 2. It can be formed thickly and without regard to processing precision. Therefore, in combination with the cooling means formed in the vibrator portion 46, damage due to the heating of the ultrasonic vibrator 48 can be efficiently avoided. In addition, since the coating portion 49 is disposed on the substrate W side of the ultrasonic vibrator 48, the ultrasonic vibrator 48 is not damaged by the treatment liquid 2. Moreover, since the thickness dimension T 'of this coating | coated part 49 becomes a predetermined value, ultrasonic vibration is attenuated by the coating | coated part 49, and it can prevent that the transmittance | permeability falls. Therefore, efficient wet processing can be performed without damaging the ultrasonic vibrator 48.

EMBODIMENT OF THE INVENTION Hereinafter, 5th Embodiment of the wet processing apparatus which concerns on this invention is described according to drawing.

5th embodiment

This embodiment is an example of the washing | cleaning apparatus (wet processing apparatus) provided with the nozzle for wet processing of any of the above-mentioned embodiments.

Fig. 12 is a diagram showing a schematic configuration of the wet processing apparatus 51 according to the present embodiment. For example, as a substrate to be processed, a large glass substrate (hereinafter, simply referred to as a substrate) of about several hundred mm in size is embedded. (B) An apparatus for cleaning. In the drawing, reference numeral 52 denotes a cleaning unit, 53 denotes a stage (substrate holding means), 54, 55, 56, and 89 are cleaning nozzles, 57 is a substrate conveying robot, 58 is a loader cassette, 59 is an unloader cassette, 60 Is a hydrogen water and ozone water generating unit, 61 is a cleaning liquid regeneration unit, and W is a glass substrate (substrate to be processed).

As shown in the figure, the center of the apparatus upper surface is the washing | cleaning part 52, and the stage 53 which hold | maintains the board | substrate W is formed. The stage 53 is formed with a rectangular end portion that matches the shape of the substrate W, and the substrate W is fitted on the end portion thereof, so that the surface of the substrate W and the stage 53 are formed. The surface is held by the stage 53 in a plane-matched state. Further, a space portion is formed below the end portion, and a substrate lifting shaft (not shown) protrudes from the space portion below the stage 53. A shaft driving source (not shown) such as a cylinder is provided at the lower end of the substrate lifting shaft, and the substrate lifting shaft moves up and down by operating the cylinder when the substrate W is sent and received by the substrate transport robot 57. Thus, the substrate W is raised or lowered in accordance with the vertical movement of the shaft.

A pair of lock base 62 is provided in the position which opposes the stage 53 in between, and the cleaning nozzles 54, 55, 56, 89 are hypothesized between these lock base 62. As shown in FIG. The cleaning nozzle consists of four nozzles arranged in parallel, and each cleaning nozzle 54, 55, 56, 89 wash | cleans by a different cleaning method. In the case of this embodiment, these four nozzles are ultrasonic vibrating bodies while supplying ozone to a substrate and supplying ultraviolet cleaning nozzle 54 which mainly decomposes and removes an organic substance by irradiating an ultraviolet-ray from the ultraviolet lamp 63, and ozone water. Nozzle for ozone ultrasonic cleaning to impart and clean ultrasonic vibrations by (48) (55), Nozzle for hydrophobic ultrasonic cleaning to impart and clean ultrasonic waves by ultrasonic vibrating body (48) while supplying hydrogen water And a pure rinse cleaning nozzle 89 for supplying pure water to rinse and rinse.

Each washing nozzle 54, 55, 56, 89 is called a push pull nozzle (liquid nozzle). Among these four nozzles, the ozone ultrasonic cleaning nozzle 55 and the hydrogen ultrasonic cleaning nozzle 56 have the same configuration as the cleaning nozzle of any of the embodiments described with reference to FIGS. 1 to 9. Or a plurality of cleaning nozzles of any of the embodiments described with reference to FIGS. 1 to 9 with respect to one cleaning nozzle (in FIG. 12, an introduction passage 21 is provided for one cleaning nozzle. ) And the connecting portion 23 between the discharge passage 22 and the ultrasonic vibrator portion 46 (or the ultrasonic vibrator 40a) formed in the connecting portion 23 and the first and second openings 21b and 22b, respectively, (Iii), and the first and second openings 21b and 22b are each combined three to extend the length of the substrate W or more. Only the ultrasonic vibrator 48 is shown here for the sake of illustration, and the illustration divided into the cleaning liquid introduction portion, the cleaning liquid discharge portion, and the like is omitted. The cleaning nozzle passage 22 has a configuration substantially the same as the cleaning nozzle of the above embodiment except that the ultraviolet lamp 63 is formed in place of the ultrasonic vibrating body 48. Except that the ultrasonic vibrating body 48 is not provided, it is substantially the same structure as the washing nozzle of the said embodiment. However, the illustration divided into the washing | cleaning liquid introduction part, the washing | cleaning liquid discharge part, etc. is abbreviate | omitted here for the convenience of illustration.

In the cleaning device 51, the four cleaning nozzles are sequentially moved along the lock base 62 while keeping the distance between the four substrates W and the substrate W constant. The entire surface to be cleaned (wide surface to be treated) is cleaned by four types of cleaning methods.

As the moving means (nozzle-to-be-processed relative moving means) of each cleaning nozzle, sliders which can be moved horizontally are formed in accordance with the linear guides on the lock bases 62, respectively. Both ends of each of the cleaning nozzles 54, 55, 56, and 89 are fixed to these posts. On each slider, a drive source, such as a motor, is provided, and each slider has the structure which makes the lock base 62 frequently. Then, the motors on the respective sliders are operated by the control signals supplied from the control unit (not shown) of the apparatus, so that the cleaning nozzles 54, 55, 56, 89 are horizontally moved individually. In addition, a driving source such as a cylinder (not shown) is formed in the support, and the support moves up and down, so that the height of each cleaning nozzle 54, 55, 56, 89, that is, each cleaning nozzle 54, 55, 56, 89 and the space | interval of the board | substrate W are each adjustable.

The hydrogen water and ozone water production | generation part 60 and the washing | cleaning liquid regeneration part 61 are provided in the washing | cleaning part 52 side. The hydrogen water production apparatus 64 and the ozone water production apparatus 65 are combined with the hydrogen water and ozone water production | generation part 60. As shown in FIG. Any cleaning liquid can be produced by dissolving hydrogen gas or ozone gas in pure water. The hydrogen water generated by the hydrogen water production device 64 is supplied to the hydrogen water ultrasonic cleaning nozzle 56 by a liquid feeding pump 67 provided in the middle of the hydrogen water supply pipe 66. . Similarly, the ozone water generated by the ozone water production apparatus 65 is supplied to the ozone water ultrasonic cleaning nozzle 55 by the liquid feeding pump 69 provided in the middle of the ozone water supply pipe 68. In addition, pure water is supplied to the pure rinse cleaning nozzle 89 from the pure water supply piping (not shown) in a manufacturing line.

The hydrogen water after passing through the hydrogen water filter 70 is supplied to the hydrogen water ultrasonic cleaning nozzle 56 by the liquid feeding pump 77 formed in the middle of the regenerated hydrogen water supply pipe 76. Similarly, ozone water after passing through the ozone receiving filter 71 is supplied to the ozone water ultrasonic cleaning nozzle 55 by the liquid feeding pump 79 formed in the middle of the regeneration ozone water supply pipe 78. Further, the hydrogen water supply pipe 66 and the renewable hydrogen water supply pipe 76 are connected in front of the hydrogen ultrasonic cleaning nozzle 56, and a new water is supplied to the hydrogen ultrasonic cleaning nozzle 56 by the valve 80. It is possible to switch between introducing a decimal number and introducing a renewable hydrogen number. Similarly, the ozone water supply pipe 68 and the regenerated ozone water supply pipe 78 are connected in front of the ozone water ultrasonic cleaning nozzle 55, and introduce a new ozone water to the ozone water ultrasonic cleaning nozzle 55 by the valve 81. It is possible to switch between introducing or regeneration ozone water. In the hydrogen water and ozone water after passing through the filters 70 and 71, although the particles are removed, the concentration of gas in the liquid is lowered. Therefore, the hydrogen water production device 64 and the ozone water production are again produced through the piping. It may be returned to the apparatus 65 to replenish hydrogen gas or ozone gas.

On the cleaning part 52 side, the loader cassette 58 and the unloader cassette 59 are detachably provided. These two cassettes 58 and 59 are of the same shape in which a plurality of substrates W can be accommodated. The two cassettes 58 and 59 accommodate the substrate W before cleaning (before wet processing) in the loader cassette 58, and unloader. The cassette 59 accommodates the substrate W on which cleaning has been completed (after wet processing). And the board | substrate conveyance robot 57 is provided in the intermediate position of the washing | cleaning part 52, the loader cassette 58, and the unloader cassette 59. As shown in FIG. The substrate transport robot 57 has an arm 82 having a link mechanism freely stretchable thereon, the arm 82 is rotatable and liftable, and the substrate W at the tip of the arm 82. It supports and conveys.

In the cleaning apparatus 51 having the above-described configuration, for example, the operator sets various cleaning conditions such as the interval between the cleaning nozzles 54, 55, 56, 89 and the substrate W, the moving speed of the cleaning nozzle, the flow rate of the cleaning liquid, and the like. In addition, the operation of each part is controlled by a control part, and it is the structure which operates automatically. Therefore, when using this washing | cleaning apparatus 51, when the board | substrate W before washing | cleaning is set to the loader cassette 58, and an operator operates a start switch, the board | substrate conveyance robot 57 will carry out the loader cassette 58. The substrate W is conveyed on the stage 53, and the ultraviolet ray cleaning, the ozone water bath washing, the hydrogen water bath washing, and the rinse cleaning are sequentially turned on the stage 53 by the cleaning nozzles 54, 55, 56, and 89. It is performed automatically, and after washing | cleaning, it is accommodated in the unloader cassette 59 by the board | substrate conveyance robot 57. As shown in FIG.

In the cleaning device 51 of this embodiment, the cleaning nozzles 55 and 56 of the embodiment of the present invention and the nozzle-to-be-processed relative moving means described above provide the wet of the present embodiment. The whole cleaning surface of the board | substrate W can be wet-processed (washing), with the advantage of a processing nozzle (cleaning nozzle).

In addition, each of the four cleaning nozzles 54, 55, 56, 89 has four cleaning nozzles 51 of the present embodiment in different cleaning methods such as ultraviolet cleaning, ozone ultrasonic cleaning, hydrogen water ultrasonic cleaning, and rinse cleaning. In this configuration, various cleaning methods can be performed by one apparatus. Thus, for example, particles of fine particle size are removed by, for example, hydrogen sonication and ozone sonication, and further, the rinse wash also washes off the cleaning liquid attached to the surface of the substrate to sufficiently clean and remove various objects to be removed. can do. In addition, in the cleaning apparatus 51 of this embodiment, since the above-mentioned liquid-liquid cleaning nozzle is provided, the usage-amount of a cleaning liquid can be reduced, and also since liquid accumulation does not generate | occur | produce below the nozzle, Highly efficient substrate cleaning can be performed. Therefore, a cleaning apparatus suitable for a manufacturing line of various electronic devices can be realized, including semiconductor devices, liquid crystal display panels, and the like.

In addition, the technical scope of this invention is not limited to the said embodiment, A various deformation | transformation can be added in the range which does not deviate from the meaning of this invention. For example, it is a matter of course that a suitable design change can be made regarding the shape and dimensions of the cleaning nozzle, the specific configuration such as the number of the introduction pipe and the discharge pipe of the cleaning nozzle, the installation position, and the like. In addition, in the said embodiment, although the example which applied the nozzle of this invention to the cleaning nozzle was shown, the nozzle of this invention can be applied to wet processing other than cleaning, for example, etching, resist removal, etc.

EMBODIMENT OF THE INVENTION Hereinafter, 6th Embodiment of this invention is described with reference to drawings.

6th embodiment

FIG. 13: is a perspective structure diagram which shows typically the whole structure of the washing | cleaning apparatus (wet processing apparatus) which is embodiment of this invention, and FIG. 14 is a figure which shows the cross-sectional structure along the BB 'line | wire shown in FIG. . FIG. 15 is a plan view of the cleaning nozzles 111 and 111 shown in FIGS. 13 and 14 seen from the substrate W side. As shown in FIG. 13 and FIG. 14, the cleaning apparatus of this embodiment is a moving means (not shown) which moves the to-be-processed substrate W which is a to-be-processed object with respect to the cleaning nozzles 111 and 111 to a movement direction A (not shown). It consists of outline.

The cleaning nozzles 111 and 111 shown in FIGS. 13 to 15 each include a plate-shaped substrate (liquid plate 112) and a partition member disposed on the substrate 112 by surrounding the outer periphery of the substrate 112. 121, a support plate 117 disposed on the partition member 121, and vibration imparting means 123 formed on a surface on the side opposite to the substrate W of the substrate 112.

The board | substrate 112 is comprised from metal substrates, such as stainless steel, glass substrates, such as quartz, etc. according to the kind of washing process performed to the to-be-processed substrate W. FIG. As shown in FIG. 14 and FIG. 15, this board | substrate 112 is a member which forms the surface which contact | connects a process liquid in the washing | cleaning nozzle 111 in contact with a process liquid, and the edge of the long side of the both sides is shown. Thus, a plurality of processing liquid introduction ports 126 and processing liquid collection ports 127 are formed. More specifically, rectangular grooves 112A and 112B are formed in plan view along the ends of the long sides on both sides of the substrate W of the substrate 112 and opposite grooves 112A. A plurality of processing liquid introduction holes 126 are formed through the bottom surface of the substrate W and penetrate into the processing substrate W from the bottom of the groove portion 112B. ) Is formed. In the cleaning nozzle 111 of the present embodiment, the processing liquid (the cleaning liquid 120 for cleaning) is supplied to the substrate W to be processed through the processing liquid introduction port 126, and the processing liquid recovery port 127 is provided. The cleaning liquid 120 is recovered from the substrate W to be processed. The area between the processing liquid introduction port 126 and the processing liquid collection port 127 between the substrate 112 and the substrate W to be processed is the processing area in the cleaning apparatus of the present embodiment ( 115), the surface of the substrate W to be in contact with the processing region 115 is assisted in cleaning (wet processing).

Further, the distance between the substrate 112 of each cleaning nozzle 111 (the distance between the liquid contact plate and the liquid contact plate of the nozzle) x is in a range of 0.1 to 8 mm, and each cleaning nozzle ( The distance between the substrate 112 of the 111 and the substrate W to be processed is the same.

The processing liquid introduction port 126 and the processing liquid collection port 127 are formed to have predetermined intervals and hole diameters, respectively, and the cleaning liquid in the width direction (the longitudinal direction of the substrate 112) of the substrate W to be processed. The 120 is supplied uniformly and is recoverable. In FIG. 15, as an example, 15 processing liquid introduction ports 126 (processing liquid recovery ports 127) having the same hole diameter are arranged at equal intervals along the longitudinal direction of the groove portions 112A and 112B. Although not limited to these hole diameters, spacings, and shapes, the processing liquid 120 in the arrangement direction (the substrate 112 longitudinal direction) of the processing liquid introduction port 126 and the processing liquid recovery port 127 is provided. If the flow rate can be made uniform, it can be made into arbitrary shapes and arrangement intervals.

At least the surface of the substrate 112 on the side of the substrate W to be processed is preferably hydrophilic, and the processing liquid introduction port 126 and the processing liquid ash formed through the substrate 112 are formed. It is preferable that the inner surface side of the water port 127 also becomes hydrophilic. By making the surface of the board | substrate 112 which comprises the process area 115 hydrophilic, the flow of the process liquid 120 in the process area 115 can be made smooth, and the controllability can be improved. In addition, by making the inner surface sides of the processing liquid introduction port 126 and the processing liquid collection port 127 hydrophilic, the introduction and recovery of the processing liquid 120 can be made smooth, and the flow of the processing liquid 120 is more stable. It can be done.

The partition member 11 formed on the board | substrate 112 has a substantially liquid edge shape in plan view, as shown to FIG. 14, 15, and a part of the periphery edge part protrudes to the outer peripheral side of the board | substrate 112, The surface on the substrate W side of the peripheral portion thereof coincides with the surface on the substrate W side of the substrate 112.

In other words, the substrate 112 is fitted to the stepped portion formed along the inner circumference of the liquid-crystal partition member 121 along the inner circumference of the substrate W side. The partition member 121 penetrates through the thickness direction of the partition member 121 along both long sides, and the hollow parts 121A and 121B are formed, respectively, and these hollow parts 121A and 121B are And the hollow portion 121A and the groove portion 112A are formed in substantially the same planar shape as the groove portions 112A and 112B, respectively, at positions corresponding to the rectangular groove portions 112A and 112B in plan view formed on the substrate 112. The hollow portion 121B and the groove portion 112B communicate with each other. And the part containing the hollow part 121A and the process liquid introduction port 126 becomes the process liquid introduction part 113, and the part containing the hollow part 121B and the process liquid collection port 127 is the process liquid collection part. (114). In these hollow portions 121A and 121B, the processing liquid 120 can be stored, and in the processing liquid introduction part 113, the supply of the processing liquid 120 to the processing liquid introduction port 126 can be made more uniform. In addition, in the treatment liquid recovery part 114, the recovery of the treatment liquid 120 from the substrate W to be processed can be made more uniform.

It is preferable that the partition member 121 is made of, for example, a hydrophobic material such as ethylene tetrafluoride. By using the partition member 121 as a hydrophobic material, the treatment liquid is enclosed in the region (processing region 5) inside the partition member 121 that faces the outer peripheral side of the substrate 112 and faces the substrate W. Since the 120 is easily confined, the controllability of the flow of the processing liquid 120 in the processing region 115 can be improved, and the processing liquid 120 can be easily flowed more stably. In addition, since the amount of the processing liquid 120 flowing out of the processing region 115 can be suppressed, the amount of the processing liquid 120 can be reduced, and the batty blown into the processing liquid 120 can be reduced. Reattachment of the cleats can also be suppressed.

On the upper side of FIG. 14 of the partition member 121, the support plate 117 is formed, and in the longitudinal center part of this support plate 117, the process liquid introduction pipe 117A and the process liquid collection pipe 117B provide a partition member ( 121 extending in the direction opposite to the side (above shown), the inside of these process liquid introduction pipe 117A and the inside of the process liquid collection pipe 117B penetrate the support plate 117, In communication with the other side. And the support plate 117 side of the process liquid introduction pipe 117A is arrange | positioned above the hollow part 121A, and the inside of the process liquid introduction pipe 117A and the hollow part 121A communicate, and the process liquid collection pipe 117B. ), The support plate 117 side is disposed above the hollow portion 121B so that the inside of the processing liquid collection pipe 117B and the hollow portion 121B are in communication with each other.

As described above, in the cleaning nozzle 111 of the present embodiment, the processing liquid introduction pipe 117A is processed through the path from the processing liquid introduction pipe 117A to the processing liquid introduction port 126 via the hollow portion 121A and the groove portion 112A. The liquid 120 is introduced into the substrate W to be processed, and is processed through the path from the processing liquid collection port 127 to the processing liquid collection pipe 117B via the groove 112B and the hollow portion 121B. The liquid 120 is recovered from the substrate W and discharged to the outside at the same time.

The junction surface of the partition member 121 and the board | substrate 112, and the partition member 121 and the support plate 117 shown in FIG. 14 leaks the process liquid 120 which flows in the hollow part 121A, 121B. In order to prevent this, it is sealed by a sealing material (not shown) or the like. The sealing of the bonding surface is not particularly limited in its material and structure as long as the treatment liquid 120 can be prevented from leaking out through these bonding surfaces. For example, O-rings may be provided at these bonding surfaces. Or you may seal by apply | coating an adhesive agent etc. to a joining surface.

In the cleaning nozzles 111 and 111 of the present embodiment, vibration is applied to the processing liquid 120 in the space S surrounded by the substrate 112, the support plate 117, and the partition member 121, respectively. The vibration imparting means 123 is accommodated, and one surface side thereof is joined to the inner surface side of the substrate 112. In addition, a cable 128 for driving and controlling the vibration imparting means 123 is connected to the vibration imparting means 123, which passes through the support plate 117 from an end side of the support plate 117. This leads to the outside of the washing nozzle 111, and is connected to a drive control unit (not shown). As the vibration imparting means 123, an ultrasonic vibrator for generating ultrasonic waves having a vibration frequency of about 0.2 to 1.5 MHz, a bolted langevin type vibrator for generating relatively low frequency ultrasonic waves having a vibration frequency of about 28 to 200 kHz, etc. It can be used, and what is necessary is just to select the thing of a suitable frequency timely according to the kind of the to-be-cleaned board | substrate W and a washing purpose.

In the present embodiment, the magnitude, frequency and phase of the vibrations imparted by the vibration imparting means 123 of the cleaning nozzles 111 and 111 are substantially the same. In addition, the distance between each board | substrate (liquid-plating plate 112) and the to-be-processed board | substrate W of the washing | cleaning nozzles 111 and 111 is mutually substantially the same, respectively. As a result, symmetrical vibration is imparted to the substrate W to be processed.

Specifically, it is possible to symmetrically by connecting oscillators of the same standard to the same oscillator, and oscillating by facing each other.

Moreover, in the washing nozzles 111 and 111 of this embodiment, the pressure control part which is not shown in figure in the process liquid collection pipe 117B of the support plate 117 is formed, respectively. This pressure control part is supplied from the processing liquid introduction port 116 and the processing liquid introduction port 126 so that the processing liquid 120 contacted with the substrate W to be recovered is recovered to the processing liquid recovery port 127 after the cleaning process. The balance between the pressure (including the surface tension of the processing liquid and the surface tension of the surface of the substrate to be processed) and the atmospheric pressure of the processing liquid 120 in contact with the atmosphere on the () side is achieved. More specifically, this pressure control part can be comprised by the pressure reduction pump connected to the process liquid collection pipe 117B, and this pressure control part uses the force which draws in the process liquid 120 in the process liquid collection pipe 117B by this pressure reduction pump. By controlling, it balances with the said atmospheric pressure. In this way, the processing liquid 120 introduced into the processing region 115 is recovered to the processing liquid recovery port 127 without leaking out of the processing region 115. In other words, the processing liquid 120 introduced into the processing target substrate W is recovered by the processing liquid recovery unit 114 without being brought into contact with an area other than the surface of the processing substrate W in the processing region 115. It is.

In the washing apparatus of the present embodiment having the above structure, the substrate 112 is disposed on the surface on which the cleaning nozzle 111 faces the substrate W to be processed, and passes through the substrate 112 to introduce the processing liquid introduction port. Since the 126 and the processing liquid recovery port 127 are formed, the surface of the substrate 112 that comes into contact with the processing region 115 that extends from the processing liquid introduction port 126 to the processing liquid recovery port 127 is in one surface of the substrate 112. have. Namely, an end portion of the processing liquid introduction port 126 on the substrate W side, the surface of the substrate 112 on the substrate W side, and the processing substrate W of the processing liquid collection port 127. The edge part of the side is formed in one surface. With this structure, when bubbles are entrained in the treatment liquid 120 and mixed into the treatment region 115, the bubbles are not allowed to stay and the treatment liquid 120 is caused by the retention of bubbles. There is no blocking of flow. Therefore, according to the cleaning nozzle 111 and the washing | cleaning apparatus of this embodiment, the flow of the processing liquid 120 in the process area 115 can be stably maintained, and the to-be-processed board | substrate W may be made non-uniform, It is possible to wash uniformly.

In addition, in the cleaning nozzle 111 having the above-described configuration, the vibration imparting means 123 gives a vibration in a state in which the processing liquid 120 is supplied to the processing region 5. By vibrating (working together), the substrate W can be cleaned, and the cleaning efficiency can be further improved.

And since this vibration is given to the symmetrical relationship to both surfaces of a to-be-processed object, an amplitude can be made large. As a result, cavitation tends to occur, and the wet processing effect such as washing can be enhanced by the high speed flow obtained by cavitation.

Further, the distance between the substrate 112 of each cleaning nozzle 111 (the distance between the liquid contact plate and the liquid contact plate) x is 8.0 mm or less, and the distance between the substrate 112 and the substrate W to be processed. Since it is 0.1 mm or more, efficient wet processing can be performed. In addition, it is possible to avoid contact between the nozzles and the substrate W to be processed at the time of conveyance.

Further, by arranging the cleaning nozzles 111 on both sides of the substrate W, both surfaces of the substrate W can be cleaned at once, and in addition, the cleaning process can be efficiently performed. By simultaneously cleaning the substrate, contamination of the substrate W after cleaning can be minimized.

In addition, the partition wall member 121 of the cleaning nozzle 111 disposed on the lower surface side of the substrate W has a substrate W that is smaller than the surface on the substrate W side of the substrate 112. You may form so that it may slightly protrude to the side. With such a configuration, even in the cleaning nozzles on the lower side where it is difficult to hold the processing liquid 120 into the processing region 115, compared to the cleaning nozzles disposed above the substrate W to be processed, the processing region can be easily processed. The processing liquid 120 can be confined in the 115, and the stability of the flow of the processing liquid 120 can be further improved.

According to the wet processing nozzle or the wet processing apparatus of the present invention, the thickness of the vibrating portion can be set large to disperse the heat generated by the ultrasonic vibration, and the temperature rise of the ultrasonic vibrator can be prevented. Therefore, the ultrasonic vibrator can be prevented from being overheated and damaged even when a bubble is rolled up on the surface to be processed and there is a region without the processing liquid. In addition, according to the wet processing nozzle or wet processing apparatus of the present invention, since the thickness of the vibration portion and / or the covering portion interposed between the ultrasonic vibrator and the processing liquid is set to a specific value, the transmittance of the ultrasonic vibration is reduced in vain. There is nothing to let you do. Therefore, the ultrasonic vibrator can be made into the wet processing nozzle or the wet processing apparatus which can be wet more efficiently with less fear of damage.

In the present invention, in the wet liquid treatment apparatus of the liquid-liquid type, the vibration condition when applying vibration to both surfaces of the substrate to be processed is appropriately selected. Therefore, according to the present invention, an effective and efficient wet treatment can be realized on both surfaces of the workpiece.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows 1st Embodiment of the wet process nozzle which concerns on this invention.

FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.

3 is a graph for explaining impedance characteristics in a diaphragm having a thickness of 9λ / 2.

4 is a graph for explaining impedance characteristics in a diaphragm having a thickness of 5λ / 2.

It is sectional drawing which shows other embodiment of the wet process nozzle which concerns on this invention.

It is sectional drawing which shows 2nd Embodiment of the wet process nozzle which concerns on this invention.

It is sectional drawing which shows 3rd Embodiment of the wet process nozzle which concerns on this invention.

8 is a cross-sectional view showing another embodiment of the wet processing apparatus according to the present invention.

9 is a cross-sectional view showing another embodiment of the wet processing apparatus according to the present invention.

It is sectional drawing which shows schematic structure of 4th Embodiment of the wet processing apparatus which concerns on this invention.

11 is a graph showing the relationship between the thickness dimension of the coating and the transmittance of ultrasonic vibration.

It is a top view which shows schematic structure of 5th Embodiment in the wet processing apparatus of this invention.

It is a perspective view which shows the whole structure of the washing | cleaning apparatus of 6th Embodiment of this invention.

FIG. 14 is a cross-sectional view taken along the line BB ′ shown in FIG. 13.

FIG. 15 is a plan view of the cleaning nozzle 1 shown in FIG. 14 seen from the substrate to be cleaned side.

16 is a cross-sectional view of a conventional wet processing nozzle.

* Description of the symbols for the main parts of the drawings *

Cleaning nozzle (wet processing nozzle)

2 ... treatment liquid (emission liquid, cooling liquid) 21 ... introduction passage (process liquid introduction pipe)

21a ... introduction port 21b ... first opening (introduction opening)

22 ... Drain pipe (Drain pipe) 22a

22b .. 2nd opening part (discharge opening part) 23 ... connection part

35 ... processing area 40 ...

46 ... diaphragm (vibration part) 46A

48 ... ultrasonic vibrators 49 ...

50 · Cooling pipe (cooling body) 50A · Cooling groove (groove)

51 · Washing equipment (wet processing equipment)

55, 56 cleaning nozzle (wet processing nozzle)

117 Support plate 121 Bulkhead member

W ··· Turned substrate (Treatment) W1 ...

T, T ', T' 'Thickness Dimensions

Claims (10)

A wet processing apparatus for holding a processing liquid in a gap between a pair of opposing nozzles, and treating a workpiece in the gap, The pair of nozzles each have vibration imparting means for imparting vibrations approximately equal in frequency and phase to the processing liquid, Vibration imparted to the treatment liquid from the vibration imparting means of the respective nozzles is imparted in a symmetrical relationship to both surfaces of the workpiece, vibration pressures of both surfaces of the workpiece are always the same, and one surface of the workpiece Wet processing apparatus, characterized in that the force is maintained so as not to act on the other surface side from the side. The liquid treatment plate according to claim 1, wherein the pair of nozzles each include a liquid contact plate formed on a surface facing the object to be treated, a treatment liquid introduction portion for introducing a treatment liquid between the object and the liquid contact plate; It has a process liquid discharge part which discharges a process liquid between the said to-be-processed object and the said contact liquid plate, The vibration given to the said process liquid from the said vibration giving means is given to the said process liquid through the said contact liquid plate. Wet processing apparatus. 3. The method according to claim 2, wherein the magnitude, frequency and phase of vibration imparted to the treatment liquid from the vibration imparting means of each nozzle and the distance between the liquid contact plate of each nozzle and the workpiece , Each of which is about the same as each other. The wet processing apparatus according to claim 2, wherein an interval between the liquid contact plate and the liquid contact plate of each nozzle is 8.0 mm or less, and a distance between the liquid contact plate and the object to be processed is 0.1 mm or more. The wet processing apparatus according to claim 2, further comprising a nozzle or a moving means for moving the liquid contact plate of each nozzle and the object to be relatively moved while maintaining a constant distance from each other. A wet treatment method of holding a processing liquid in a gap between a pair of opposing nozzles, and treating the processing object while giving the processing liquid substantially equal phase and frequency to the processing liquid in the gap, wherein both surfaces of the processing object are treated. Vibration is imparted in a symmetrical relationship, so that the vibration pressures of both surfaces of the workpiece are always the same, and the wet processing method is maintained so that no force is applied from one surface side to the other surface side of the workpiece. The liquid treatment plate according to claim 6, wherein the pair of nozzles each include a liquid contact plate formed on a surface facing the object to be processed, and a processing liquid introduction portion for introducing a processing liquid between the object and the liquid contact plate; And a treatment liquid discharge part for discharging the treatment liquid between the object and the wetted liquid plate, and a vibration imparting means, And a vibration is applied to the treatment liquid from the vibration imparting means through the contact liquid plate. 8. The method according to claim 7, wherein the distance between the respective liquid contact plates and the object to be treated is substantially equal to each other, and the magnitude, frequency, and phase of the vibrations are different with respect to the treatment liquid through the respective liquid contact plates. , Each of which imparts approximately the same vibration to each other. 8. The wet processing method according to claim 7, wherein the gap between the liquid contact plate and the liquid contact plate of each nozzle is 8.0 mm or less, and the distance between the liquid contact plate and the object to be processed is 0.1 mm or more. 8. The wet processing method according to claim 7, wherein each of the liquid contact plates and the object to be processed are relatively moved while maintaining a constant distance from each other.