JP3955197B2 - Wet processing nozzle and wet processing apparatus - Google Patents

Description

ここで、<q> は各細孔からの処理液流量のばらつき、ｎは１つの導入管に接続される細孔の本数、ＱＴは１つの導入管から供給される全処理液流量、ｑ_max ｑ_min は各細孔における流量の最大値と最小値とを表している。
ここで、記細孔における流量のばらつきが１０％より大きくなるように設定した場合には、ウエット処理の処理速度が処理幅方向に不均一になることのみならず、流量が少ない部分において開口部内の処理液が不安定になりやすくなるため、それを抑えるために少ない部分の流量に会わせてウエット処理装置トータルの処理液量を増やす必要があり、好ましくない。
【００１７】
本発明において、前記排出開口部は、前記被処理物から前記排出開口部に排出される前記排出液の流量が、前記被処理物に対する処理方向と直交する方向に対して均一化するよう設定されてなることにより、処理幅方向に延在する排出開口部の各部分において排出される排出液量をそれぞれ均等な量に設定することができるため、ウエット処理中の排出液排出における圧力損失を増加することなく、ウエット処理動作中に処理領域から排出される排出液を処理幅方向に均等に排出することができる。このため、被処理物表面における排出液流量を処理幅方向に均一化して、被処理物表面におけるウエット処理の反応速度を均一化し、ウエット処理の処理幅方向における不均一の発生低減を図ることができる。
【００１８】
さらに、前記排出開口部が、前記被処理物に向けて開口する複数の細孔と、前記排出管の接続された排出管接続部に前記排出液を各前記細孔から排出するための排出通路とを有し、前記流量を設定するために、前記複数の細孔における各径寸法が、前記排出管接続部位置から離間する位置に向けてそれぞれ傾斜するよう設定される手段か、前記複数の細孔における各長さ寸法が、前記排出管接続部位置から離間する位置に向けてそれぞれ傾斜するよう設定される手段か、前記排出通路における断面形状が、前記排出管接続部位置から離間する位置に向けてそれぞれ傾斜するよう設定される手段を採用することができ、これらにより、ウエット処理中の排出液排出における圧力損失を増加することなく、ウエット処理動作中に処理領域から排出される排出液を処理幅方向に均等に排出することができる。このため、被処理物表面における排出液流量を処理幅方向に均一化して、被処理物表面におけるウエット処理の反応速度を均一化し、ウエット処理の処理幅方向における不均一の発生低減を図ることができる。
【００１９】
ここで、具体的な構造としては、パッキンと押さえ板とにおいて、１つの前記長穴に１つの排出管が接続されている場合には、複数の細孔における各径寸法が、排出管接続位置に近い位置から離間する方向に大きくなるように傾斜して設定される。そして、１つのの長穴に複数の排出管が接続された場合には、両方の排出管から排出される排出液の量を考慮して、それぞれの細管の径寸法が、処理領域から排出される排出液の流量を、処理幅方向に対して各細管において均一化するよう設定される。
【００２０】
または、具体的な構造としては、パッキンと押さえ板とにおいて、１つの前記長穴に１つの排出管が接続されている場合には、複数の細孔における各長さ寸法が、排出管接続位置に近い位置から離間する方向に大きくなるように傾斜して設定される。そして、１つのの長穴に複数の排出管が接続された場合には、両方の排出管から排出される排出液の量を考慮して、それぞれの細管の長さ寸法が、処理領域から排出される処理液の流量を、処理幅方向に対して各細管において均一化するよう設定される。このため、被処理物表面における排出液流量を処理幅方向に均一化して、被処理物表面におけるウエット処理の反応速度を均一化し、ウエット処理の処理幅方向における不均一の発生低減を図ることができる。
【００２１】
本発明のウエット処理装置は、上記のウエット処理用ノズルと、
前記導入開口部と前記被処理物の被処理面との間に処理液を導入するための処理液導入手段と、
前記排出開口部と前記被処理物の被処理面との間から処理液を吸引して排出するため処理液回収手段と、
被処理物の被処理面に沿って前記ウエット処理用ノズルと前記被処理物とを相対移動させることにより前記被処理物の被処理面全域を処理するためのノズル・被処理物相対移動手段とを有することにより、上記本発明のウエット処理用ノズルの利点を有したまま被処理物の被処理面全域を処理することができ、投入するエネルギー、および処理液の量に対して洗浄効率の高いウエット処理装置を提供できる。
【００２２】
【発明の実施の形態】
以下、本発明に係るウエット処理用ノズルおよびウエット処理装置の第１実施形態を、図面に基づいて説明する。
［第１の実施形態］
図１は、本実施形態におけるウエット処理用ノズルを示す下面図、図２は、図１のII−II線に沿った断面図、図３は、本実施形態におけるウエット処理用ノズルを示す分解斜視図である。
図において、符号１は、本実施形態におけるウエット処理用ノズルである。
【００２３】
本実施形態の洗浄用ノズル１は、図１，図２，図３に示すように、一端に洗浄液（処理液）２を導入するための導入口２１ａを有する導入通路（導入管）２１と一端に洗浄後の洗浄液（ウエット処理後の処理液の排出液）を外部へ排出するための排出口２２ａを有する排出通路（排出管）２２とが設けられ、これら導入通路２１と排出通路２２のそれぞれの他端が連結され、被処理基板（被処理物）Ｗに対向する対向面４６Ａを有する連結部２３を形成するとともに、この連結部２３に導入通路２１が開口している第１の開口部（導入開口部）２１ｂと、排出通路２２が開口している第２の開口部（排出開口部）２２ｂが設けられたものである。このようなノズルは、プッシュ・プル型ノズル（省流量型ノズル）と呼ばれるものである。第１と第２の開口部２１ｂ，２２ｂは、被処理基板Ｗに向けて開口している。連結部２３と被処理基板Ｗの間の空間には、ウエット処理を行う処理領域３５が形成されている。
【００２４】
連結部２３が筐体とされ、該筐体２３における第１の側壁２３ａ外側に前記導入口２１ａの接続された処理液供給用の間隙通路（導入通路）２１が設けられるとともに、前記筐体２３において第１の側壁２３ａと対向する位置の第２の側壁２３ｂ外側に前記排出口２２ａに接続された処理液排出用の間隙通路（排出通路）２２が設けられている。
これら処理液供給用および処理液排出用の間隙通路２１，２２が、それぞれ、前記連結部２３の全幅を覆うように筐体側壁２３ａ，２３ｂ外側に沿わされた薄板状のパッキン３１，３２と、該パッキン３１，３２を筐体２３に水密に固着する押さえ板２１ｃ，２２ｃとからなり、これら筐体２３の側壁２３ａ，２３ｂ、パッキン３１，３２、押さえ板２１ｃ，２２ｃにより導入管接続部および排出管接続部とが構成されている。
【００２５】
連結部２３を構成する材料としては、ＰＴＦＥ（Polytetrafluoroethylene ）、ＰＦＡ（p-fluorophenylalanine ）、ＰＰ（polypropylene ）等の樹脂、高純度ガラス状カーボン、ステンレス鋼、石英、サファイア、アルミナ等のセラミックスなどのうちから選択されて用いられる。
【００２６】
導入管接続部と排出管接続部とは連結部に対して対称形状とされているので、以下、導入管接続部について説明する。
【００２７】
図４は、本実施形態におけるウエット処理用ノズルにおけるパッキンを示す正面図（ａ）、および（ａ）における矢視断面図（ｂ）である。
前記パッキンに３１には、図３，図４に示すように、厚み方向に貫通する２つの長穴３１ａ，３１ａが図においてｘ軸方向とされる処理幅方向に沿ってが並列に形成されている。各長穴３１ａは、処理幅方向に長辺を有する略矩形として延在するよう形成されており、この長穴３１ａには、処理幅方向中央に略二等辺三角形に外側に突出した部分が形成されて、その頂部付近が導入管接続位置２１ａ’とされ、この導入管接続位置２１ａ’において、それぞれ一つの導入口２１ａが接続されるようになっている。
長穴３１ａは、導入管接続位置２１ａ’を通り接液面４６Ａに垂直な直線に対して処理幅方向略線対称とされており、処理領域３５を形成する側の長穴周壁部３１ｂに、前記長穴３１ａ内と前記処理領域３５とを連結する複数の細孔２１ｂ，２１ｂが設けられており、この細孔２１ｂ，２１ｂが導入開口部を構成している。
【００２８】
パッキン３１は、ＰＴＦＥ（Polytetrafluoroethylene ）、ＰＦＡ（p-fluorophenylalanine ）等の樹脂、アルミナ等のセラミックス、ステンレス鋼等からなる。
【００２９】
ここで、複数の細孔２１ｂ，２１ｂにおける各径寸法Ｄｒが、ｘ軸とされる処理幅方向に延在する各導入開口部（細孔）２１ｂ，２１ｂに対応する各位置において供給される処理液２の液量ｑをそれぞれ略均等に設定するために、導入管接続位置２１ａ’に近い位置から処理幅方向に向かって離間する方向に大きくなるように傾斜して設定される。ここで、細孔２１ｂの径寸法Ｄｒは、各細孔２１における流量のばらつきが１０％以下になるように設定されてなる。
各細孔２１ｂにおける流量のばらつき<q> は以下の式（１）で定義される。
【数２】

ここで、<q> は各細孔２１ｂからの処理液流量のばらつき、ｎは１つの導入管２１に接続される細孔２１ｂの本数、ＱＴは１つの導入管２１から供給される全処理液流量、ｑ_max ，ｑ_min はそれぞれ各細孔２１ｂにおける流量の最大値および最小値を表している。
ここで、記細孔２１ｂにおける流量のばらつき<q> が１０％より大きくなるように設定した場合には、ウエット処理の処理速度が処理幅方向に不均一になることのみならず、流量が少ない部分において開口部内の処理液が不安定になりやすくなるため、それを抑えるために少ない部分の流量に会わせてウエット処理装置トータルの処理液量を増やす必要があり、好ましくない。
【００３０】
具体的には、細孔２１ｂの径寸法Ｄｒは、図３，図４に示すｘ軸に沿って、導入管接続位置２１ａ’から処理幅方向（＋ｘ方向）に、線形に、または、２時曲線に沿って大きくなるように傾斜して設定される。また、細孔２１ｂの径寸法Ｄｒは、導入管接続位置２１ａ’から処理幅方向（−ｘ方向）に、線形に、または、２次曲線に沿って大きくなるように傾斜して設定される。ここで、実際には、各細孔２１ｂの径寸法は、処理液２に対する圧力、長穴３１ａの断面積の形状等の条件を総合的に勘案して適切なものが採用されることになる。
図２（Ａ）において、細孔２１ｂはパッキン３１の厚み方向の中央に、図の垂直方向に設けているが、図２（Ｂ）に示すように、接液面４６Ａ側では一端がより筐体２３側に開口していることが好ましい。これにより、処理液出口と筐体２３との間に疏水域がなくなるため、処理液２の滞留部分が安定して形成される。
【００３１】
押さえ板２１ｃは、連結部２３と同等の材質からなり、筐体２３に対してパッキン３１を押圧して、このパッキン３１が水密状態となるように図示しない固定手段により固定されている。この押さえ板２１ｃには、図１〜図３に示すように、断面Ｌ字状となるように、処理領域３５側となる下端部に、連結部２３の接液面４６Ａと面一になるよう接液部２１ｄが設けられる。また、押さえ板２１ｃ上端部側の２カ所に位置する導入管接続位置２１ａ’に、長穴３１ａ，３１ａ内に処理液２を供給する導入管２１が接続されている。
このように、連結部２３の筐体側壁２３ａ外側面と押さえ板２１ｃとパッキン３１の長穴３１ａ周壁部３１ｂ，３１ｃ，３１ｄ，３１ｄとで囲まれて形成された空間により間隙通路（導入通路）２１が形成されている。
【００３２】
前記筐体２３側壁２３ａと対向する位置の第２の側壁２３ｂ外側に前記排出口２２ａに接続された処理液排出用の間隙通路（排出通路）２２においては、それぞれ、パッキン３２、長穴３２ａ、細孔２２ｂ，２２ｂ、周壁部、押さえ板２２ｃ、接液部２２ｄ等が、上述の処理液供給用の間隙通路２１における、パッキン３１、長穴３１ａ、細孔２１ｂ，２１ｂ、周壁部３１ｂ，３１ｃ，３１ｄ，３１ｄ、押さえ板２１ｃ、接液部２１ｄ等に対応して構成されており、細孔２２ｂ，２２ｂの径寸法Ｄｒも同様に、排出管２２の接続される排出口接続位置から離間する処理幅方向に大きくなるよう傾斜して設定され、各細孔２２ｂ，２２ｂにおける排出液の液量を一定化するよう設定されている。
【００３３】
また、排出口２２ａ側には、圧力制御部（図示略）が設けられ、この圧力制御部（処理液回収手段）は、被処理基板Ｗに接触した洗浄液２が洗浄後に排出通路２２に流れるように、第１の開口部２１ｂの大気と接触している洗浄液の圧力（洗浄液の表面張力と被処理基板の被洗浄面の表面張力も含む）と大気圧との均衡がとれるように設けられている。上記圧力制御部は、排出口２２ａ側に設けられた減圧ポンプにより構成されている。したがって、排出通路２２側の圧力制御部に減圧ポンプを用いて、この減圧ポンプで連結部２３の洗浄液を吸引する力を制御して、第１の開口部２１ｂの大気と接触している洗浄液の圧力（洗浄液の表面張力と被処理基板Ｗの被洗浄面の表面張力も含む）と大気圧との均衡をとるようになっている。
つまり、第１の開口部２１ｂの大気と接触している洗浄液の圧力Ｐw （洗浄液の表面張力と基板Ｗの被洗浄面の表面張力も含む）と大気圧Ｐa との関係をＰw ≒ Ｐaとすることにより、第１の開口部２１ｂを通じて被処理基板Ｗに供給され、被処理基板Ｗに接触した洗浄液は、洗浄用ノズルの外部に漏れることなく、排出通路２２に排出される。すなわち、洗浄用ノズルから被処理基板Ｗ上に供給した洗浄液は、被処理基板Ｗ上の洗浄液を供給した部分（第１と第２の開口部２１ｂ,２２ｂ）以外の部分に接触することなく、基板Ｗ上から除去される。
【００３４】
洗浄用ノズル１の各開口部２１ｂ,２２ｂおよび接液面４６Ａと、被処理基板Ｗとの間の距離Ｈは、８ｍｍ以下で被処理基板Ｗと接触しない範囲がよく、好ましくは６ｍｍ以下で基板Ｗと接触しない範囲、より好ましくは３ｍｍ以下で基板Ｗと接触しない範囲とするのがよい。８ｍｍを越えると、基板Ｗと洗浄用ノズルとの間に所望の洗浄液を満たすことが困難となり、洗浄が難しくなるからである。
【００３５】
洗浄用ノズル１の接液面となる対向面４６Ａは、ＰＦＡ等のフッ素樹脂や、用いる洗浄液によっては最表面がクロム酸化物のみからなる不動態膜面のステンレス、あるいは酸化アルミニウムとクロム酸化物の混合膜を表面に備えたステンレス、オゾン水に対しては電解研磨表面を備えたチタン等からなる対応面被覆部とすることが、洗浄液への不純物の溶出がないことから好ましい。接液面を石英により構成すれば、フッ酸を除く全ての洗浄液の供給に好ましい。
また、より好ましくは、対向面４６Ａを親水性に、押さえ板２１ｃの接液部２１ｄを疎水性とすることにより、洗浄液２の安定性を高めることができる。
本実施の形態における洗浄用ノズルの構成においては、処理領域３５に供給される洗浄液２が水素水である場合は、水素水洗浄用ノズルとして用いることができ、洗浄液がオゾン水である場合は、オゾン水洗浄用ノズルとして用いることができ、洗浄液が純水である場合は、純水リンス洗浄用ノズルとして用いることができる。
【００３６】
本実施形態のウエット処理用ノズル１では、複数の細孔２１ｂ，２１ｂにおける各径寸法Ｄｒが、処理幅方向のｘ軸に沿って、導入管接続位置２１ａ’から大きくなるように傾斜して設定されることにより、ｘ軸とされる処理幅方向に延在する各導入開口部（細孔）２１ｂ，２１ｂに対応する各位置において供給される処理液２の液量ｑをそれぞれ略均等に設定することができるため、ウエット処理中の処理液供給における圧力損失を増加することなく、ウエット処理動作中に処理領域３５へ供給される処理液２を処理幅方向に略均等に供給することができる。このため、被処理物Ｗ表面における処理液２流量をｘ軸とされる処理幅方向に均一化して、被処理物Ｗ表面の各位置における処理液２接触量、通過量等を均一化してウエット処理の反応速度を均一化し、ウエット処理の処理幅方向における不均一の発生低減を図ることができる。
【００３７】
本実施形態のウエット処理用ノズル１では、複数の細孔２２ｂ，２２ｂにおける各径寸法Ｄｒが、処理幅方向のｘ軸に沿って、排出管接続位置２２ａ’から大きくなるように傾斜して設定されることにより、ｘ軸とされる処理幅方向に延在する各排出開口部（細孔）２２ｂ，２２ｂに対応する各位置から排出される排出液の液量ｑをそれぞれ略均等に設定することができるため、ウエット処理中の処理液排出における圧力損失を増加することなく、ウエット処理動作中に処理領域３５から排出される排出液２を処理幅方向に略均等に排出することができる。このため、被処理物Ｗ表面における排出液流量をｘ軸とされる処理幅方向に均一化して、被処理物Ｗ表面の各位置における処理液２接触量、通過量等を均一化してウエット処理の反応速度を均一化し、ウエット処理の処理幅方向における不均一の発生低減を図ることができる。
【００３８】
本実施形態においては、ウエット処理を洗浄処理としたが、これ以外にも、剥離、現像、エッチング、メッキ、研磨等のウエット処理に適応することができ、それ以外の構成に関しても、本発明の趣旨を変更しない範囲で、どのような変更も可能である。
【００３９】
本実施形態では、ウエット処理用ノズル１を被処理基板Ｗの上面側（一方の被処理面側）に設けた場合について説明したが、図５に示すように被処理基板Ｗの下面側にもウエット処理用ノズル１ａを設けてもよい。このウエット処理用ノズル１ａは、先に述べたウエット処理用ノズル１と同様の構成である。
【００４０】
以下、本発明に係るウエット処理用ノズルおよびウエット処理装置の第２実施形態を、図面に基づいて説明する。
［第２の実施形態］
図６は、本実施形態におけるウエット処理用ノズルを示す断面図、図７は、本実施形態におけるウエット処理用ノズルにおけるパッキンを示す正面図（ａ）、および（ａ）における矢視断面図（ｂ）である。
本実施形態において、図１〜図５に示す第１実施形態と異なるのはパッキン３１，３２に関する点、および、連結部２３の構成に関する点であり、これ以外の対応する構成要素には同一の符号を付してその説明を省略する。
【００４１】
本実施形態のパッキンに３１においては、図７に示すように、複数の細孔２１ｂ，２１ｂにおける各径寸法が等しく設定されるとともに各長さ寸法Ｄ_L が、ｘ軸とされる処理幅方向に延在する各導入開口部（細孔）２１ｂ，２１ｂに対応する各位置において供給される処理液２の液量ｑをそれぞれ略均等に設定するために、導入管接続位置２１ａ’に近い位置から処理幅方向に向かって離間する方向に小さくなるように傾斜して設定される。ここで、細孔２１ｂの長さ寸法Ｄ_L は、各細孔２１における流量のばらつきが１０％以下になるように設定されてなる。
各細孔２１ｂにおける流量のばらつき<q> は前述の式（１）で同様に定義される。
【００４２】
具体的には、細管２１ｂの長さ寸法Ｄ_L は、図７に示すｘ軸に沿って、導入管接続位置２１ａ’から処理幅方向外側（＋ｘ方向および−ｘ方向）に、線形、または、２時曲線に沿って傾斜するように設定される。ここで、実際には、細孔２１ｂの長さ寸法Ｄ_L は、処理液２に対する圧力、長穴３１ａの断面積の形状、処理液２のレイノルズ数等の条件を総合的に勘案して適切なものが採用されることになる。
【００４３】
上記のように、細孔２１ｂ，２１ｂの長さ寸法Ｄ_L を設定した際、長穴３１ａの断面積が処理幅方向に対する変動を低減するために、長穴３１ａの高さ寸法Ｄ_W を一定になるよう設定した。これに対応して、長穴３１ａは、処理幅方向中央に位置する導入管接続位置２１ａ’付近が接液面４６Ａ側から遠くなり、長穴３１ａの両端側において接液面４６Ａ側に湾曲して近づくような略弧状に形成される。
【００４４】
前記筐体２３側壁２３ａと対向する位置の第２の側壁２３ｂ外側に前記排出口２２ａに接続された処理液排出用の間隙通路（排出通路）２２においては、それぞれ、パッキン３２、長穴３２ａ、細孔２２ｂ，２２ｂ、周壁部、押さえ板２２ｃ、接液部２２ｄ等が、上述の処理液供給用の間隙通路２１における、パッキン３１、長穴３１ａ、細孔２１ｂ，２１ｂ、周壁部３１ｂ，３１ｃ，３１ｄ，３１ｄ、押さえ板２１ｃ、接液部２１ｄ等に対応して構成されており、細孔２２ｂ，２２ｂの長さ寸法Ｄ_L も同様に、排出管２２の接続される排出口接続位置から離間する処理幅方向に大きくなるよう傾斜して設定され、各細孔２２ｂ，２２ｂにおける排出液の液量を一定化するよう設定されている。
【００４５】
また、連結部２３には、図６に示すように、被処理基板Ｗが洗浄されている間、処理領域３５内の洗浄液２に超音波振動を付与するための超音波振動子部分４０が設けられている。この超音波振動子部分４０は、振動板（振動部）４６と、振動板４６の主面上に設けられ、振動板４６に超音波振動を付与する超音波振動子４８とが備えられてなるものである。超音波振動子４８は、ＰＺＴ等の電歪素子とされ、発振器から超音波周波電気信号を受けて超音波振動を発生する。この超音波振動子４８は、超音波振動子接着用等の接着剤により振動板４６に接続されている。
【００４６】
超音波振動子４８は、２０ｋＨｚ〜１０ＭＨｚの範囲の周波数の超音波振動を出力可能なものであることがウエット処理を行う場合に実用的な点で好ましく、特に、保持可能な処理液層の厚さの観点から０．２ＭＨｚ以上の周波数が好ましい。
ここでの被処理基板Ｗの洗浄の際、処理領域３５に洗浄液２を供給した状態で上記超音波振動子４８により超音波振動を付与し、洗浄液２と共働して被処理基板Ｗを洗浄できる。
【００４７】
本実施形態のウエット処理用ノズル１では、上記の実施形態と同様の効果を奏することができるとともに、複数の細孔２１ｂ，２１ｂにおける各長さ寸法Ｄ_L が、処理幅方向のｘ軸に沿って、導入管接続位置２１ａ’から小さくなるように傾斜して設定されることにより、ｘ軸とされる処理幅方向に延在する各導入開口部（細孔）２１ｂ，２１ｂに対応する各位置において供給される処理液２の液量ｑをそれぞれ略均等に設定することができるため、ウエット処理中の処理液供給における圧力損失を増加することなく、ウエット処理動作中に処理領域３５へ供給される処理液２を処理幅方向に略均等に供給することができる。このため、被処理物Ｗ表面における処理液２流量をｘ軸とされる処理幅方向に均一化して、被処理物Ｗ表面の各位置における処理液２接触量、通過量等を均一化してウエット処理の反応速度を均一化し、ウエット処理の処理幅方向における不均一の発生低減を図ることができる。
【００４８】
さらに、本実施形態のウエット処理用ノズル１では、複数の細孔２２ｂ，２２ｂにおける各長さ寸法Ｄ_L が、処理幅方向のｘ軸に沿って、排出管接続位置２２ａ’から大きくなるように傾斜して設定されることにより、ｘ軸とされる処理幅方向に延在する各排出開口部（細孔）２２ｂ，２２ｂに対応する各位置から排出される排出液の液量ｑをそれぞれ略均等に設定することができるため、ウエット処理中の処理液排出における圧力損失を増加することなく、ウエット処理動作中に処理領域３５から排出される排出液２を処理幅方向に略均等に排出することができる。このため、被処理物Ｗ表面における排出液流量をｘ軸とされる処理幅方向に均一化して、被処理物Ｗ表面の各位置における処理液２接触量、通過量等を均一化してウエット処理の反応速度を均一化し、ウエット処理の処理幅方向における不均一の発生低減を図ることができる。
【００４９】
また、本実施形態においては、超音波振動子４８が設けられてなることにより、処理液２と超音波振動と協働してウエット処理をおこなうことが可能となり、処理効率を向上することが可能となる。
【００５０】
また、上記の各実施形態においては、導入開口部となる細孔２１ｂを、パッキン３１の周壁部３１ｂに貫通された貫通孔状態としたが、図８に示すように、周壁部３１ｂの押さえ板３１側の表面３１ｆに穿設された溝２１ｂ’とすることもできる。この場合には、溝２１ｂ’の隆路方向断面積を細孔２１ｂの径寸法の代わりに導入管接続位置２２ａ’から処理幅方向（±ｘ方向）に大きくなるように設定することができる。あるいは、溝２１ｂ’をパッキン３１の筐体２３側表面に設けることもできる。
【００５１】
以下、本発明に係るウエット処理装置の第３実施形態を、図面に基づいて説明する。
［第３の実施形態］
本実施形態は、上記のいずれかの実施形態のウエット処理用ノズルを具備した洗浄装置（ウェット処理装置）の一例である。
図９は、本実施形態におけるウエット処理装置５１の概略構成を示す図であって、例えば被処理基板として数百ｍｍ角程度の大型のガラス基板（以下、単に基板という）を枚葉洗浄するための装置である。
図中符号５２は洗浄部、５３はステージ（基板保持手段）、５４、５５、５６、８９は洗浄用ノズル、５７は基板搬送ロボット、５８はローダカセット、５９はアンローダカセット、６０は水素水・オゾン水生成部、６１は洗浄液再生部、Ｗはガラス基板（被処理基板）である。
【００５２】
図に示すように、装置上面中央が洗浄部５２となっており、基板Ｗを保持するステージ５３が設けられている。ステージ５３には、基板Ｗの形状に合致した矩形の段部が設けられ、この段部上に基板Ｗが嵌め込まれて、基板Ｗの表面とステージ５３の表面が面一状態でステージ５３に保持されるようになっている。また、段部の下方には空間部が形成され、空間部にはステージ５３の下方から基板昇降用シャフト（図示略）が突出している。基板昇降用シャフトの下端にはシリンダ等のシャフト駆動源（図示略）が設けられ、基板搬送ロボット５７による基板Ｗの受け渡しの際にシリンダの作動により上記基板昇降用シャフトが上下動し、シャフトの上下動に伴って基板Ｗが上昇または下降するようになっている。
【００５３】
ステージ５３を挟んで対向する位置に一対のラックベース６２が設けられ、これらラックベース６２間に洗浄用ノズル５４，５５，５６，８９が架設されている。洗浄用ノズルは並列配置された４本のノズルからなり、各洗浄用ノズル５４，５５，５６，８９が異なる洗浄方法により洗浄を行うものとなっている。本実施の形態の場合、これら４本のノズルは、基板にオゾンを供給するとともに紫外線ランプ６３から紫外線を照射することによって主に有機物を分解除去する紫外線洗浄用ノズル５４、オゾン水を供給しつつ超音波振動子本体４８により超音波振動を付与して洗浄するオゾン水超音波洗浄用ノズル５５、水素水を供給しつつ超音波振動子本体４８により超音波振動を付与して洗浄する水素水超音波洗浄用ノズル５６、純水を供給してリンス洗浄を行う純水リンス洗浄用ノズル８９、である。
【００５４】
各洗浄用ノズル５４，５５，５６，８９は、プッシュ・プル型ノズル（省液型ノズル）と呼ばれるものである。また、これら４本のノズルのうちオゾン水超音波洗浄用ノズル５５と、水素水超音波洗浄用ノズル５６は、図１〜図８を用いて説明したいずれかの実施形態の洗浄用ノズルと同様の構成のもの、あるいは１本の洗浄用ノズルにつき、図１〜図８を用いて説明したいずれかの実施形態の洗浄用ノズルが複数設けられたもの（図９では、１本の洗浄用ノズルにつき、導入通路２１と排出通路２２との連結部２３およびこの連結部２３に設けられた超音波振動子部分４０（又は超音波振動子４０ａ）および第１、第２の開口部２１ｂ，２２ｂはそれぞれ３組づつ設けられており、第１と第２の開口部２１ｂ，２２ｂはそれぞれ３組合わせて基板Ｗの幅以上の長さに延びている。）である。ただし、ここでは図示の都合上、超音波振動子４８のみを図示し、洗浄液導入部、洗浄液排出部等に区分した図示は省略する。また、洗浄用ノズル５４は、超音波振動子本体４８に代えて紫外線ランプ６３が設けられた以外は上記実施形態の洗浄用ノズルと略同様の構成であり、洗浄用ノズル８９は、超音波振動子本体４８が設けられていない以外は、上記実施形態の洗浄用ノズルと略同様の構成である。ただし、ここでは図示の都合上、洗浄液導入部、洗浄液排出部等に区分した図示は省略する。
この洗浄装置５１では、上記４本の洗浄ノズルが基板Ｗの上方で基板Ｗとの間隔を一定に保ちながらラックベース６２に沿って順次移動することにより、基板Ｗの被洗浄面全域（被処理面全域）が４種類の洗浄方法により洗浄される構成となっている。
【００５５】
各洗浄用ノズルの移動手段（ノズル・被処理物相対移動手段）としては、各ラックベース６２上のリニアガイドに沿って水平移動可能とされたスライダがそれぞれ設けられ、各スライダの上面に支柱がそれぞれ立設され、これら支柱に各洗浄用ノズル５４，５５，５６，８９の両端部が固定されている。各スライダ上にはモータ等の駆動源が設置されており、各スライダがラックベース６２上を自走する構成となっている。そして、装置の制御部（図示略）から供給される制御信号により各スライダ上のモータがそれぞれ作動することによって、各洗浄用ノズル５４，５５，５６，８９が個別に水平移動する構成となっている。また、上記支柱にはシリンダ（図示略）等の駆動源が設けられ、支柱が上下動することにより各洗浄用ノズル５４，５５，５６，８９の高さ、すなわち各洗浄用ノズル５４，５５，５６，８９と基板Ｗとの間隔がそれぞれ調整可能となっている。
【００５６】
洗浄部５２の側方に、水素水・オゾン水生成部６０と洗浄液再生部６１とが設けられている。水素水・オゾン水生成部６０には、水素水製造装置６４とオゾン水製造装置６５とが組み込まれている。いずれの洗浄液も、純水中に水素ガスやオゾンガスを溶解させることによって生成することができる。そして、水素水製造装置６４で生成された水素水が、水素水供給配管６６の途中に設けられた送液ポンプ６７により水素水超音波洗浄用ノズル５６に供給されるようになっている。同様に、オゾン水製造装置６５で生成されたオゾン水が、オゾン水供給配管６８の途中に設けられた送液ポンプ６９によりオゾン水超音波洗浄用ノズル５５に供給されるようになっている。なお、純水リンス洗浄用ノズル８９には製造ライン内の純水供給用配管（図示略）から純水が供給されるようになっている。
【００５７】
そして、水素水用フィルタ７０を通した後の水素水は、再生水素水供給配管７６の途中に設けられた送液ポンプ７７により水素水超音波洗浄用ノズル５６に供給されるようになっている。同様に、オゾン水用フィルタ７１を通した後のオゾン水は、再生オゾン水供給配管７８の途中に設けられた送液ポンプ７９によりオゾン水超音波洗浄用ノズル５５に供給されるようになっている。また、水素水供給配管６６と再生水素水供給配管７６は水素水超音波洗浄用ノズル５６の手前で接続され、弁８０によって水素水超音波洗浄用ノズル５６に新しい水素水を導入するか、再生水素水を導入するかを切り換え可能となっている。同様に、オゾン水供給配管６８と再生オゾン水供給配管７８はオゾン水超音波洗浄用ノズル５５の手前で接続され、弁８１によってオゾン水超音波洗浄用ノズル５５に新しいオゾン水を導入するか、再生オゾン水を導入するかを切り換え可能となっている。なお、各フィルタ７０，７１を通した後の水素水やオゾン水は、パーティクルが除去されてはいるものの、液中気体含有濃度が低下しているため、配管を通じて再度水素水製造装置６４やオゾン水製造装置６５に戻し、水素ガスやオゾンガスを補充するようにしてもよい。
【００５８】
洗浄部５２の側方に、ローダカセット５８、アンローダカセット５９が着脱可能に設けられている。これら２つのカセット５８、５９は、複数枚の基板Ｗが収容可能な同一の形状のものであり、ローダカセット５８に洗浄前（ウエット処理前）の基板Ｗを収容し、アンローダカセット５９には洗浄済（ウエット処理後）の基板Ｗが収容される。そして、洗浄部５２とローダカセット５８、アンローダカセット５９の中間の位置に基板搬送ロボット５７が設置されている。基板搬送ロボット５７はその上部に伸縮自在なリンク機構を有するアーム８２を有し、アーム８２は回転可能かつ昇降可能となっており、アーム８２の先端部で基板Ｗを支持、搬送するようになっている。
【００５９】
上記構成の洗浄装置５１は、例えば洗浄用ノズル５４，５５，５６，８９と基板Ｗとの間隔、洗浄用ノズルの移動速度、洗浄液の流量等、種々の洗浄条件をオペレータが設定する他は、各部の動作が制御部により制御されており、自動運転する構成になっている。したがって、この洗浄装置５１を使用する際には、洗浄前の基板Ｗをローダカセット５８にセットし、オペレータがスタートスイッチを操作すれば、基板搬送ロボット５７によりローダカセット５８からステージ５３上に基板Ｗが搬送され、ステージ５３上で各洗浄用ノズル５４，５５，５６，８９により紫外線洗浄、オゾン水超音波洗浄、水素水超音波洗浄、リンス洗浄が順次自動的に行われ、洗浄後、基板搬送ロボット５７によりアンローダカセット５９に収容される。
【００６０】
本実施形態の洗浄装置５１においては、本発明の実施形態の洗浄用ノズル５５，５６と、上記のノズル・被処理物相対移動手段とを備えたことにより、上記本実施形態のウエット処理用ノズル（洗浄用ノズル）の利点を有したまま基板Ｗの被洗浄面全域をウエット処理（洗浄）することができる。
【００６１】
また、本実施形態の洗浄装置５１は、４本の洗浄用ノズル５４，５５，５６，８９の各々が、紫外線洗浄、オゾン水超音波洗浄、水素水超音波洗浄、リンス洗浄といった異なる洗浄方法により洗浄処理する構成であるため、本装置１台で種々の洗浄方法を実施することができる。したがって、例えば、水素水超音波洗浄、オゾン水超音波洗浄により微細な粒径のパーティクルを除去し、さらにリンス洗浄で基板表面に付着した洗浄液も洗い流しながら仕上げの洗浄を行う、というように種々の被除去物を充分に洗浄除去することができる。また、本実施の形態の洗浄装置５１の場合、上記の省液型の洗浄用ノズルが備えられているため、洗浄液の使用量を低減することができ、しかも、ノズルの下方に液溜まりが生じないため、高効率、高清浄度の基板洗浄を実施することができる。したがって、半導体デバイス、液晶表示パネル等をはじめとする各種電子機器の製造ラインに好適な洗浄装置を実現することができる。
【００６２】
なお、本発明の技術範囲は上記実施の形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲において種々の変更を加えることが可能である。例えば、洗浄用ノズルの形状や寸法、洗浄用ノズルの導入管や排出管の数や設置位置等の具体的な構成等に関しては、適宜設計変更が可能なことは勿論である。さらに、上記実施の形態においては、本発明のノズルを洗浄用ノズルに適用した例を示したが、洗浄以外のウェット処理、例えばエッチング、レジスト除去等に本発明のノズルを適用することも可能である。
【００６３】
以下本発明のウエット処理用ノズルまたはウエット処理装置にかかる実施例を説明する。
［実施例］
本発明にでは、導入開口部（細孔）２１ｂの径寸法および長さ寸法を設定することにより、導入開口部から前記被処理物に向けて供給される前記処理液の流量が、前記被処理物に対する処理方向と直交する方向（処理幅方向）に対するばらつきを測定した。
【００６４】
ここで、実際に使用したウエット処理用ノズルとしては、第１実施形態のように際おく２１ｂの径寸法Ｄｒを設定したもの、および、第２実施形態のように細孔２１ｂの長さ寸法Ｄ_L を設定したもの、そして、比較のため設定をしないものである。
ここで、処理液２としては、純水を選択した。また、処理液２の流量、および、長穴３１の高さ寸法Ｄ_W 、パッキン３１の厚み寸法、細孔２１ｂのピッチ、細管２１ｂ本数、は、以下のとおりである。
【００６５】
処理液２の総流量：５Ｌ／ｍｉｎ
長穴３１の高さ寸法Ｄ_W ：６ｍｍ
パッキン３１の厚み寸法：３ｍｍ
細孔２１ｂのピッチ（間隔）寸法：１０ｍｍ
細管２１ｂ総本数：５０本
【００６６】
（実施例）
上記のようなウエット処理用ノズル１において、複数の細孔２１ｂ，２１ｂにおける各径寸法Ｄｒを、処理幅方向のｘ軸に沿って、導入管接続位置２１ａ’から大きくなるように傾斜して設定した。
このときの細孔２１ｂの径寸法Ｄｒを線形に変化させるとともに、この径寸法における最大値と最小値とを表１に示すように設定し、これらを実施例１，２とした。
また、細孔２１ｂの径寸法Ｄｒを２次曲線に対応して変化させるとともに、この径寸法Ｄｒにおける最大値と最小値とを表１に示すように設定し、これらを実施例３とした。
【００６７】
また、複数の細孔２１ｂ，２１ｂにおける各長さ寸法Ｄ_L を、処理幅方向のｘ軸に沿って、導入管接続位置２１ａ’から小さくなるように傾斜して設定した。されることにより、
このときの細孔２１ｂの長さ寸法Ｄ_L を２次曲線に対応して変化させるとともに、この長さ寸法Ｄ_L における最大値と最小値とを表１に示すように設定し、これらを実施例４とした。
【００６８】
（比較例）
同様にして、細孔２１ｂの径寸法Ｄｒおよび長さ寸法Ｄ_L が変化しないものを比較例１〜４とした。
【００６９】
これらのノズルにおいて、各細孔２１ｂにおける圧力と、式（１）で示す流量のばらつきとを測定した。
その結果を表１に示す。
【００７０】
【表１】

表１において、各欄に−で結ばれた２つの数字は、その項目における最大値と最小値とを示している。
ここで、１ｋｇｆ／ｍ² は約９．８Ｐａである。
【００７１】
上記の結果によれば、比較例４に示すように、圧力が増加してしまう程度に細孔径寸法Ｄｒを細くした場合には、流量ばらつきは１０パーセント以下になるが、これは、圧力損失が大きすぎて、実用的でない。ここでそれ以外の比較例１〜３では、流量ばらつきが２０パーセント以上になり、ウエット処理の不均一が問題となる可能性の範囲となっている。これに対して、実施例１〜４においては、流量のばらつきを全て１０パーセント以下に押さえることができることが解る。このため、被処理物Ｗ表面における処理液２流量をｘ軸とされる処理幅方向に均一化して、被処理物Ｗ表面の各位置における処理液２接触量、通過量等を均一化してウエット処理の反応速度を均一化し、ウエット処理の処理幅方向における不均一の発生低減を図ることができる。
【００７２】
【発明の効果】
本発明のウエット処理用ノズルまたはウエット処理装置によれば、導入開口部から前記被処理物に向けて供給される前記処理液の流量が、前記被処理物に対する処理方向と直交する方向（処理幅方向）に対して均一化するよう設定されてなることにより、処理幅方向に延在する導入開口部の各部分において供給される処理液量をそれぞれ均等な量に設定することができるため、ウエット処理中の処理液供給における圧力損失を増加することなく、ウエット処理動作中に処理領域へ供給される処理液を処理幅方向に均等に供給することができる。このため、被処理物表面における処理液流量を処理幅方向に均一化して、被処理物表面におけるウエット処理の反応速度を均一化し、ウエット処理の処理幅方向における不均一の発生低減を図ることができるという効果を奏することができる。
【図面の簡単な説明】
【図１】 本発明に係るウエット処理用ノズルの第１実施形態を示す下面図である。
【図２】 図１のII−II線に沿った断面図である。
【図３】 本発明に係るウエット処理用ノズルの第１実施形態を示す分解斜視図である。
【図４】 本発明に係るウエット処理用ノズルの第１実施形態におけるパッキンを示す正面図（ａ）、および（ａ）における矢視断面図（ｂ）である。
【図５】 本発明に係るウエット処理用ノズルの他の実施形態を示す断面図である。
【図６】 本発明に係るウエット処理用ノズルの第２実施形態を示す段面図である。
【図７】 本発明に係るウエット処理用ノズルの第２実施形態におけるパッキンを示す正面図（ａ）、および（ａ）における矢視断面図（ｂ）である。
【図８】 本発明に係るウエット処理用ノズルの他の実施形態におけるパッキンを示す斜視図である。
【図９】 本発明のウエット処理装置における第３実施形態の概略構成を示す平面図である。
【図１０】 従来のウエット処理用ノズルの断面図である。
【符号の説明】
１・・・洗浄用ノズル（ウエット処理用ノズル）
２・・・処理液（排出液）
２１・・・導入通路（導入管）
２１ａ・・・導入口
２１ａ’・・・導入管接続部位置
２１ｂ・・・第１の開口部（導入開口部）細孔
２２・・・排出管（排出管）
２２ａ・・・排出口
２２ａ’・・・排出管接続部位置
２２ｂ・・・第２の開口部（排出開口部）細孔
２３・・・連結部
３１，３２・・・パッキン
３１ａ，３２ａ・・・長穴
３１ｂ，３１ｃ，３１ｄ・・・周壁部
３１ｅ・・・内表面
３１ｆ・・・表面
３５・・・処理領域
４０・・・超音波振動子部分
４６・・・振動板（振動部）
４６Ａ・・・対向面
４８・・・超音波振動子
５１・・・洗浄装置（ウエット処理装置）
５５，５６・・・洗浄用ノズル（ウエット処理用ノズル）
Ｗ・・・被処理基板（被処理物）[0001]
BACKGROUND OF THE INVENTION
The present invention provides a wet processing apparatus for supplying a processing liquid onto an object to be processed in wet processing steps such as cleaning, peeling, developing, etching, plating, and polishing in a manufacturing process of a semiconductor device, a liquid crystal display panel, and the like. The present invention relates to a technique suitable for use.
[0002]
[Prior art]
In the field of electronic devices such as semiconductor devices and liquid crystal display panels, a process of cleaning a semiconductor substrate or glass substrate, which is an object to be processed, during the manufacturing process is essential. In the cleaning process, cleaning is performed using various cleaning liquids such as ultrapure water, electrolytic ion water, ozone water, hydrogen water, etc., in order to remove various substances to be removed during the manufacturing process. It is supplied onto the substrate from the nozzle of the apparatus.
However, when a conventional general cleaning nozzle is used, there is a problem that the amount of cleaning liquid used increases. For example, a 500 mm square substrate is cleaned using a cleaning solution such as electrolytic ion water, and the remaining amount of particles on the substrate after cleaning with the cleaning solution and rinsing with cleaning water is 0.5 particles / cm.² In order to achieve a level of cleanliness, cleaning and rinse cleaning solutions of about 25-30 liters / minute had to be used.
[0003]
In view of this, a liquid-saving cleaning nozzle that can significantly reduce the amount of cleaning liquid used compared to the conventional type is provided. For example, a wet processing nozzle used when a processing liquid is supplied onto a substrate to be processed and wet processing is performed on the substrate to be processed. A discharge passage having a discharge port for discharging the processing liquid after use to the outside is formed, and an introduction opening and a discharge opening that open toward the substrate to be processed are provided at the other ends of the introduction passage and the discharge passage, respectively. There is already known a wet processing nozzle provided with a portion. The pressure and atmospheric pressure of the processing liquid in contact with the substrate to be processed so as not to flow out of the discharge passage after processing the processing liquid in contact with the substrate to be processed through the introduction opening and the nozzle for wet processing And a means for sucking and discharging through the discharge passage.
Further, as a wet processing apparatus using the wet processing nozzle, the wet processing nozzle and the wet processing nozzle and the target substrate are relatively moved along the target surface of the target substrate. There is provided a wet processing apparatus comprising a nozzle for processing the entire surface to be processed of the substrate to be processed or means for moving the substrate to be processed.
[0004]
That is, according to the above-described wet processing apparatus or the like, the processing liquid can be removed from the substrate without bringing the processing liquid into contact with a portion other than the portion to which the processing liquid is supplied, and a liquid-saving nozzle can be realized. it can. Further, by providing a moving means for relatively moving the wet processing nozzle and the substrate to be processed along the surface to be processed of the substrate to be processed, the entire surface to be processed of the substrate to be processed can be processed. is there.
[0005]
Furthermore, in such a liquid-saving nozzle, a wet processing nozzle as shown in FIG. 10 is known as a configuration applied when irradiating ultrasonic waves. The wet processing nozzle includes an introduction pipe 101 having an introduction port 101a for introducing the treatment liquid 100 at one end, and a discharge pipe having a discharge port 102a for discharging the treatment liquid 100 after the wet treatment to the outside at one end. 102, the other ends of the introduction pipe 101 and the discharge pipe 102 are connected to each other, a connection portion 103 that faces the substrate to be processed 90 is formed, and the introduction pipe 101 is open to the connection portion 103. An opening 101b and a second opening 102b in which the discharge pipe 102 is opened are provided. A processing region 105 for performing wet processing is formed in the space between the connecting portion 103 and the substrate to be processed 90.
Further, a decompression pump (not shown) is connected to the discharge port 102 a of the discharge pipe 102.
[0006]
The processing liquid 100 is supplied from the introduction port 101a of the introduction pipe 101 and reaches the first opening 101b, but a decompression pump (not shown) is connected to the discharge port 102a of the discharge pipe 102. By controlling the suction pressure, the pressure of the processing liquid 100 in which the processing liquid 100 supplied to the introduction tube 101 is in contact with the atmosphere of the first opening 101b (the surface tension of the processing liquid 100 and the substrate 90 to be processed). The difference between the surface tension of the surface to be processed and the atmospheric pressure can be controlled.
That is, the relationship between the pressure Pw of the processing liquid 100 in contact with the atmosphere of the first opening 101b (including the surface tension of the processing liquid and the surface tension of the surface to be processed of the substrate 90) and the atmospheric pressure Pa is Pw≈Pa. Thus, the processing liquid 100 supplied to the substrate 90 through the first opening 101b and contacting the substrate 90 is discharged to the discharge pipe 102 without leaking outside the wet processing nozzle. For this reason, this wet processing nozzle can greatly reduce the amount of processing liquid used compared to a non-liquid-saving type nozzle.
Here, each of the first opening portion 101b and the second opening portion 102b has a predetermined processing width and can perform wet processing on the substrate 90 to be processed. It extends in a processing width direction that is parallel to the surface and orthogonal to the processing direction DT in which the substrate 90 to be processed shown in the drawing moves, that is, has a predetermined length in a direction perpendicular to the paper surface. .
Further, in the illustrated example of the nozzle, the substrate to be processed 90 is cleaned while the processing liquid 100 is supplied to the processing region 105 when the substrate to be processed 90 is cleaned.
[0007]
[Problems to be solved by the invention]
However, in the liquid-saving wet processing nozzle as shown in the figure, the amount of processing liquid supplied from the nozzle to the processing region 105 is even in the direction in which the first opening 101b extends, that is, in the processing width direction. There was a problem that it may not be.
In particular, when comparing a position close to the introduction port 101a and a position away from the introduction port 101a, the amount of supply liquid decreases at a position away from the introduction port 101a as compared to a position close to the introduction port 101a, and the difference in supply liquid amount occurs. There was a problem that it might have occurred.
For this reason, the reaction speed becomes non-uniform at each position on the surface of the substrate 90 to be processed, and as a result, the wet process may become non-uniform in the process width direction.
Furthermore, when the opening area of the first opening 101b is reduced in order to correct this non-uniformity in the amount of processing liquid, there is a problem that the pressure loss increases, which is not practical.
[0008]
The present invention has been made in view of the above circumstances, and intends to achieve the following object.
(1) To equalize the supply width of the processing liquid supplied to the processing region during the wet processing operation in the processing width direction.
(2) To prevent an increase in pressure loss in the treatment liquid supply.
(3) Prevent wet processing from becoming uneven in the processing width direction.
(4) To provide a wet processing apparatus having the wet processing nozzle.
[0009]
[Means for Solving the Problems]
  The wet processing nozzle of the present invention supplies a processing liquid for wet processing of a processing object toward the processing target, and discharges a discharged liquid of the processing liquid after the wet processing. A nozzle,
  The nozzle includes an introduction pipe having an introduction port for introducing the treatment liquid at one end, a discharge pipe having a discharge port for discharging the discharge liquid to the outside at one end, and the introduction pipe and the discharge pipe. The other end is connected to each other and includes a connecting portion that faces the object to be processed. The connecting portion includes an introduction opening in which the introduction pipe is open, and a discharge opening in which the discharge pipe is open. Is provided,
  By supplying the processing liquid from the introduction opening toward the object to be processed, the wet filled with the processing liquid in the space between the connecting portion and each surface of the object to be processed facing each other. A processing region for processing is formed, and the discharged liquid from the processing region is led from the discharge opening to the discharge pipe and discharged from the discharge port,
  The connecting portion is provided with a casing and a thin packing along the outside of the side wall of the casing, and a pressing plate for watertightly fixing the packing to the casing.
  In the packing, one or a plurality of long holes are formed along a processing width direction which is a direction orthogonal to a processing direction for the workpiece, and a long hole on the side forming the processing region is formed. The peripheral wall portion is provided with a plurality of pores that connect the inside of the elongated hole and the processing region to form the introduction opening,
  The elongated hole and the fine hole are formed such that the flow rate of the treatment liquid supplied from the introduction opening toward the object to be processed is perpendicular to the process direction with respect to the object to be processed. Set to equalize,
The processing area side of the packing is flush with the processing width direction,
The elongated hole is far from the processing region side in the vicinity of the introduction tube connection position to which the introduction tube is connected, and toward the processing region side toward a position away from the introduction tube connection position in the processing width direction. By being formed to approach,
Each length dimension in the plurality of pores is set to become smaller toward a position away from the introduction pipe connecting portion position.The above problems were solved.
MaIn addition, the flow rate variation in the pores may be set to be 10% or less.
  In the present invention, there is provided a wet processing nozzle for supplying a processing liquid for wet processing of an object to be processed toward the object to be processed and for discharging a discharged liquid of the processing liquid after the wet processing. ,
  The nozzle includes an introduction pipe having an introduction port for introducing the treatment liquid at one end, a discharge pipe having a discharge port for discharging the discharge liquid to the outside at one end, and the introduction pipe and the discharge pipe. The other end is connected to each other and includes a connecting portion that faces the object to be processed. The connecting portion includes an introduction opening in which the introduction pipe is open, and a discharge opening in which the discharge pipe is open. Is provided,
  By supplying the processing liquid from the introduction opening toward the object to be processed, the wet filled with the processing liquid in the space between the connecting portion and each surface of the object to be processed facing each other. A processing region for processing is formed, and the discharged liquid from the processing region is led from the discharge opening to the discharge pipe and discharged from the discharge port,
The connecting portion is provided with a casing and a thin packing along the outside of the side wall of the casing, and a pressing plate for watertightly fixing the packing to the casing.
  In the packing, one or a plurality of long holes are formed along a processing width direction which is a direction orthogonal to a processing direction for the workpiece, and a long hole on the side forming the processing region is formed. The peripheral wall portion is provided with a plurality of pores that connect the inside of the elongated hole and the processing region to form the discharge opening,
  The elongated holes and the pores are set so that the flow rate of the discharged liquid discharged from the object to be processed to the discharge opening is made uniform in a direction orthogonal to the processing direction for the object to be processed.The processing region side of the packing is flush with the processing width direction,
In the vicinity of the discharge pipe connection position to which the discharge pipe is connected, the elongated hole is far from the processing area side, and toward the position away from the discharge pipe connection position in the processing width direction. By being formed to approach,
Each length dimension in the plurality of pores is set to become smaller toward a position away from the discharge pipe connecting portion position, and the processing region side of the packing is flush with the processing width direction,
In the vicinity of the discharge pipe connection position to which the discharge pipe is connected, the elongated hole is far from the processing area side, and toward the position away from the discharge pipe connection position in the processing width direction. By being formed to approach,
Each length dimension in the plurality of pores is set to become smaller toward a position away from the discharge pipe connecting portion position.The above problems were solved.
  MoreBeforeIt is possible to adopt means in which the cross-sectional shape in the discharge passage is set so as to be inclined toward a position away from the discharge pipe connecting portion position.
  In the wet processing apparatus of the present invention, the wet processing nozzle,
  A treatment liquid introduction means for introducing a treatment liquid between the introduction opening and a surface to be treated of the object to be treated;
  A processing liquid recovery means for sucking and discharging the processing liquid from between the discharge opening and the surface to be processed;
  A nozzle / processing object relative moving means for processing the entire processing surface of the processing object by moving the wet processing nozzle and the processing object relative to each other along the processing surface of the processing object; Can have.
[0010]
The introduction opening of the wet processing nozzle of the present invention has a direction in which the flow rate of the processing liquid supplied from the introduction opening toward the object to be processed is perpendicular to the processing direction with respect to the object to be processed (processing width). Since the amount of processing liquid supplied to each portion of the introduction opening extending in the processing width direction can be set to an equal amount by setting it to be uniform with respect to (direction), The processing liquid supplied to the processing region during the wet processing operation can be evenly supplied in the processing width direction without increasing the pressure loss in the processing liquid supply during processing. Therefore, it is possible to equalize the processing liquid flow rate on the surface of the object to be processed in the processing width direction, to equalize the reaction speed of the wet processing on the surface of the object to be processed, and to reduce the occurrence of non-uniformity in the processing width direction of the wet processing. it can.
[0011]
Here, as a structure of the nozzle for wet processing, more specifically,
The connecting portion is a housing, and a processing liquid supply gap passage (introduction passage) serving as the introduction port is provided outside the first side wall of the housing, and faces the first side wall in the housing. A gap passage (discharge passage) for discharging the processing liquid serving as the discharge port is provided outside the second side wall at the position of
The gap passages for supplying the processing liquid and discharging the processing liquid respectively cover the entire width of the connecting portion, and a thin plate-like packing that extends along the outer side of the casing side wall, and the packing is fixed to the casing in a watertight manner. It consists of a pressure plate, and these casing, packing, and pressure plate constitute an introduction pipe connection part and a discharge pipe connection part,
In the packing, one or a plurality of long holes are formed along the processing width direction, and the long hole peripheral wall portion on the side forming the processing region includes the inside of the long hole and the processing region. Are provided with a plurality of pores connecting the
The holding plate is connected to the introduction pipe for supplying a processing liquid into the elongated hole and / or a discharge pipe for discharging the discharged liquid to the outside.
The gap passage is formed by a space formed by surrounding the outer side wall of the housing of the connecting portion, the pressing plate, and the peripheral wall of the packing elongated hole,
The introduction opening and the discharge opening may be configured by the plurality of pores that open toward the treatment object.
[0012]
In the present invention, the introduction opening is configured to supply the processing liquid to each of the pores from a plurality of pores that open toward the object to be processed and the introduction pipe connection portion to which the introduction pipe is connected. In order to set the flow rate,
By setting each diameter dimension in the plurality of pores to be inclined toward a position away from the introduction pipe connecting portion position, without increasing the pressure loss in the treatment liquid supply during the wet treatment, At each pore position, the fluid resistance and / or flow rate of the processing liquid supplied toward the processing object is set to be uniform in the processing width direction orthogonal to the processing direction of the processing object. In addition, it is possible to set the flow rate of each pore by setting the pore diameter at the position of each pore in the treatment width direction. Therefore, it is possible to equalize the processing liquid flow rate on the surface of the object to be processed in the processing width direction, to equalize the reaction speed of the wet processing on the surface of the object to be processed, and to reduce the occurrence of non-uniformity in the processing width direction of the wet processing. it can.
[0013]
Here, as a specific structure, when one introduction pipe is connected to one of the elongated holes in the packing and the holding plate, each diameter dimension in the plurality of pores is determined as the introduction pipe connection position. It is set to be inclined so as to increase in a direction away from a position close to. When a plurality of introduction pipes are connected to one elongated hole, the diameter of each thin pipe is directed toward the object to be processed in consideration of the amount of treatment liquid supplied from both introduction pipes. The flow rate of the processing liquid supplied in this way is set to be uniform in each narrow tube in the processing width direction.
[0014]
The introduction opening of the present invention has a plurality of pores that open toward the object to be processed, and an introduction for supplying the treatment liquid to each of the pores from the introduction tube connection portion to which the introduction tube is connected. And for setting the flow rate,
Each length dimension in the plurality of pores is set so as to be inclined toward a position away from the introduction pipe connecting portion position without increasing the pressure loss in the processing liquid supply during the wet processing. In each pore position, the fluid resistance and / or flow rate of the processing liquid supplied toward the processing object is made uniform with respect to the processing width direction orthogonal to the processing direction of the processing object. In addition to being able to set, by setting the length dimension at the position of each pore in the processing width direction, it is possible to set the flow rate in each individual pore. Therefore, it is possible to equalize the processing liquid flow rate on the surface of the object to be processed in the processing width direction, to equalize the reaction speed of the wet processing on the surface of the object to be processed, and to reduce the occurrence of non-uniformity in the processing width direction of the wet processing. it can.
[0015]
Here, as a specific structure, when one introduction pipe is connected to one of the elongated holes in the packing and the holding plate, each length dimension in the plurality of pores is determined as the introduction pipe connection. The inclination is set so as to increase in a direction away from a position close to the position. When a plurality of introduction pipes are connected to one long hole, the length of each thin pipe is set to the object to be processed in consideration of the amount of treatment liquid supplied from both introduction pipes. The flow rate of the processing liquid supplied in the direction is set to be uniform in each narrow tube with respect to the processing width direction.
[0016]
Further, by setting the flow rate variation in the pores to be 10% or less, the treatment liquid supplied to the treatment region is made uniform in the treatment width direction, and the wet treatment of the workpiece is performed. It becomes possible to make uniform in the processing width direction. Therefore, it is possible to equalize the processing liquid flow rate on the surface of the object to be processed in the processing width direction, to equalize the reaction speed of the wet processing on the surface of the object to be processed, and to reduce the occurrence of non-uniformity in the processing width direction of the wet processing. it can.
Here, the flow rate variation <q> in each pore is defined by the following equation (1).
[Expression 1]

Here, <q> is a variation in the flow rate of the treatment liquid from each pore, n is the number of pores connected to one introduction pipe, QT is the total treatment liquid flow rate supplied from one introduction pipe, q_max q_min Represents the maximum value and the minimum value of the flow rate in each pore.
Here, when the variation in the flow rate in the pores is set to be larger than 10%, not only the processing speed of the wet processing becomes uneven in the processing width direction but also in the opening portion in the portion where the flow rate is small. Therefore, it is necessary to increase the total amount of the processing liquid in the wet processing apparatus in accordance with the flow rate of a small portion in order to suppress this, which is not preferable.
[0017]
In the present invention, the discharge opening is set so that the flow rate of the discharged liquid discharged from the object to be processed to the discharge opening is uniform with respect to a direction orthogonal to a processing direction for the object to be processed. As a result, the amount of discharged liquid discharged from each part of the discharge opening extending in the processing width direction can be set to an equal amount, thereby increasing the pressure loss in discharging the discharged liquid during wet processing. Therefore, the liquid discharged from the processing area during the wet processing operation can be discharged uniformly in the processing width direction. For this reason, the flow rate of the discharged liquid on the surface of the object to be processed is made uniform in the processing width direction, the reaction speed of the wet process on the surface of the object to be processed is made uniform, and the occurrence of non-uniformity in the direction of the processing width of the wet process can be reduced. it can.
[0018]
Further, the discharge opening is a plurality of pores that open toward the object to be processed, and a discharge passage for discharging the discharged liquid from each of the pores to a discharge pipe connecting portion to which the discharge pipe is connected. And each of the plurality of pores has a diameter dimension set to be inclined toward a position away from the discharge pipe connection portion, or the plurality of pores. Means in which each length dimension in the pore is set so as to be inclined toward a position away from the discharge pipe connection position, or a position where the cross-sectional shape in the discharge passage is away from the discharge pipe connection position Means that are each set to be inclined towards each other, so that they are discharged from the treatment area during the wet treatment operation without increasing the pressure loss in the discharge of the drainage liquid during the wet treatment. It can be uniformly discharged to the processing width direction effluents to be. For this reason, the flow rate of the discharged liquid on the surface of the object to be processed is made uniform in the processing width direction, the reaction speed of the wet process on the surface of the object to be processed is made uniform, and the occurrence of non-uniformity in the direction of the processing width of the wet process can be reduced. it can.
[0019]
Here, as a specific structure, when one discharge pipe is connected to one of the elongated holes in the packing and the holding plate, the diameter of each of the plurality of pores is the discharge pipe connection position. It is set to be inclined so as to increase in a direction away from a position close to. When a plurality of discharge pipes are connected to one elongated hole, the diameter of each narrow pipe is discharged from the processing area in consideration of the amount of the discharged liquid discharged from both discharge pipes. The flow rate of the discharged liquid is set to be uniform in each narrow tube with respect to the processing width direction.
[0020]
Alternatively, as a specific structure, when one discharge pipe is connected to one of the elongated holes in the packing and the holding plate, each length dimension in the plurality of pores is the discharge pipe connection position. It is set to be inclined so as to increase in a direction away from a position close to. When a plurality of discharge pipes are connected to one long hole, the length of each narrow pipe is discharged from the processing area in consideration of the amount of liquid discharged from both discharge pipes. The flow rate of the processed liquid is set to be uniform in each narrow tube with respect to the processing width direction. For this reason, the flow rate of the discharged liquid on the surface of the object to be processed is made uniform in the processing width direction, the reaction speed of the wet process on the surface of the object to be processed is made uniform, and the occurrence of non-uniformity in the direction of the processing width of the wet process can be reduced. it can.
[0021]
The wet processing apparatus of the present invention, the above-mentioned wet processing nozzle,
A treatment liquid introduction means for introducing a treatment liquid between the introduction opening and a surface to be treated of the object to be treated;
A processing liquid recovery means for sucking and discharging the processing liquid from between the discharge opening and the surface to be processed;
A nozzle / processing object relative moving means for processing the entire processing surface of the processing object by moving the wet processing nozzle and the processing object relative to each other along the processing surface of the processing object; Therefore, the entire surface to be processed of the object to be processed can be processed while having the advantages of the above-described wet processing nozzle of the present invention, and the cleaning efficiency is high with respect to the input energy and the amount of the processing liquid. A wet processing apparatus can be provided.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a first embodiment of a wet processing nozzle and a wet processing apparatus according to the present invention will be described with reference to the drawings.
[First Embodiment]
FIG. 1 is a bottom view showing a wet processing nozzle in the present embodiment, FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1, and FIG. 3 is an exploded perspective view showing the wet processing nozzle in the present embodiment. FIG.
In the figure, reference numeral 1 denotes a wet processing nozzle in the present embodiment.
[0023]
As shown in FIGS. 1, 2, and 3, the cleaning nozzle 1 of the present embodiment has an introduction passage (introduction pipe) 21 having an introduction port 21a for introducing a cleaning liquid (treatment liquid) 2 at one end and one end. Are provided with a discharge passage (discharge pipe) 22 having a discharge port 22a for discharging the cleaning liquid after cleaning (the discharged liquid of the processing liquid after the wet processing) to the outside, and each of the introduction passage 21 and the discharge passage 22 is provided. Are connected to each other to form a connecting portion 23 having a facing surface 46A that faces a substrate (object to be processed) W, and a first opening in which the introduction passage 21 is open. (Introduction opening) 21b and a second opening (discharge opening) 22b in which the discharge passage 22 is open are provided. Such a nozzle is called a push-pull type nozzle (flow saving type nozzle). The first and second openings 21b and 22b are opened toward the substrate W to be processed. In the space between the connecting portion 23 and the substrate to be processed W, a processing region 35 for performing wet processing is formed.
[0024]
The connecting portion 23 is a housing, and a processing liquid supply gap passage (introduction passage) 21 connected to the introduction port 21 a is provided outside the first side wall 23 a of the housing 23. In FIG. 4, a processing liquid discharge gap passage (discharge passage) 22 connected to the discharge port 22a is provided outside the second side wall 23b at a position facing the first side wall 23a.
The thin plate-like packings 31 and 32 are provided along the outer sides of the housing side walls 23a and 23b so that these processing liquid supply and processing liquid discharge gap passages 21 and 22 cover the entire width of the connecting portion 23, respectively. The packings 31 and 32 are made up of pressing plates 21c and 22c that are water-tightly fixed to the casing 23. The side walls 23a and 23b of the casing 23, the packings 31 and 32, and the pressing plates 21c and 22c are used to connect and discharge the introduction pipe. And a pipe connecting portion.
[0025]
Examples of the material constituting the connecting portion 23 include resins such as PTFE (Polytetrafluoroethylene), PFA (p-fluorophenylalanine), PP (polypropylene), ceramics such as high-purity glassy carbon, stainless steel, quartz, sapphire, and alumina. It is selected and used.
[0026]
Since the introduction pipe connection part and the discharge pipe connection part are symmetrical with respect to the coupling part, the introduction pipe connection part will be described below.
[0027]
FIG. 4 is a front view (a) showing the packing in the wet processing nozzle in the present embodiment, and a cross-sectional view (b) as viewed in the direction of arrow (a).
As shown in FIGS. 3 and 4, two long holes 31 a and 31 a penetrating in the thickness direction are formed in the packing 31 in parallel along the processing width direction which is the x-axis direction in the drawing. Yes. Each elongated hole 31a is formed so as to extend as a substantially rectangular shape having a long side in the processing width direction, and a portion that protrudes outward in a substantially isosceles triangle is formed in the center of the processing width direction. Then, the vicinity of the top portion is set as an introduction pipe connection position 21a ′, and one introduction port 21a is connected at the introduction pipe connection position 21a ′.
The long hole 31a is substantially line symmetric in the processing width direction with respect to a straight line that passes through the introduction pipe connection position 21a ′ and is perpendicular to the liquid contact surface 46A, and the long hole peripheral wall portion 31b on the side forming the processing region 35 has A plurality of pores 21b and 21b that connect the inside of the elongated hole 31a and the processing region 35 are provided, and these pores 21b and 21b constitute introduction openings.
[0028]
The packing 31 is made of a resin such as PTFE (Polytetrafluoroethylene) or PFA (p-fluorophenylalanine), ceramics such as alumina, stainless steel, or the like.
[0029]
Here, each diameter dimension Dr in the plurality of pores 21b and 21b is supplied at each position corresponding to each introduction opening (pore) 21b and 21b extending in the processing width direction which is the x axis. In order to set the liquid amounts q of the liquids 2 approximately equally, the liquid amounts q are set so as to increase in a direction away from the position close to the introduction pipe connection position 21a ′ toward the processing width direction. Here, the diameter dimension Dr of the pore 21b is set so that the variation in the flow rate in each pore 21 is 10% or less.
The flow rate variation <q> in each pore 21b is defined by the following equation (1).
[Expression 2]

Here, <q> is a variation in the flow rate of the processing solution from each pore 21b, n is the number of pores 21b connected to one introduction tube 21, and QT is the total number of treatment solutions supplied from one introduction tube 21. Flow rate, q_max , Q_min Represents the maximum value and the minimum value of the flow rate in each pore 21b.
Here, when the flow rate variation <q> in the fine pores 21b is set to be larger than 10%, not only the processing speed of the wet processing becomes uneven in the processing width direction but also the flow rate is small. Since the processing liquid in the opening tends to become unstable in the part, it is necessary to increase the total processing liquid amount in the wet processing apparatus in accordance with the flow rate of the small part in order to suppress this, which is not preferable.
[0030]
Specifically, the diameter dimension Dr of the pore 21b is linearly or 2 o'clock in the processing width direction (+ x direction) from the introduction pipe connecting position 21a ′ along the x axis shown in FIGS. It is set to be inclined so as to increase along the curve. In addition, the diameter dimension Dr of the pore 21b is set so as to increase linearly or along a quadratic curve in the processing width direction (−x direction) from the introduction pipe connection position 21a ′. Here, in practice, an appropriate diameter is adopted for each of the pores 21b in consideration of conditions such as the pressure on the processing liquid 2 and the shape of the cross-sectional area of the long hole 31a. .
In FIG. 2A, the pore 21b is provided in the center of the packing 31 in the thickness direction and in the vertical direction in the figure. However, as shown in FIG. It is preferable to open to the body 23 side. As a result, there is no flooded area between the treatment liquid outlet and the casing 23, so that a staying portion of the treatment liquid 2 is stably formed.
[0031]
The pressing plate 21c is made of the same material as that of the connecting portion 23, and is fixed by a fixing means (not shown) so as to press the packing 31 against the housing 23 so that the packing 31 is in a watertight state. As shown in FIGS. 1 to 3, the pressing plate 21 c is flush with the liquid contact surface 46 </ b> A of the connecting portion 23 at the lower end portion on the processing region 35 side so as to have an L-shaped cross section. A liquid contact portion 21d is provided. In addition, the introduction pipes 21 for supplying the processing liquid 2 into the long holes 31a and 31a are connected to the introduction pipe connection positions 21a 'located at two positions on the upper end side of the holding plate 21c.
Thus, the gap passage (introduction passage) is formed by the space surrounded by the outer side surface of the casing side wall 23a of the connecting portion 23, the pressing plate 21c, and the peripheral hole portions 31b, 31c, 31d, 31d of the packing 31. 21 is formed.
[0032]
In the gap passage (discharge passage) 22 for discharging the processing liquid connected to the discharge port 22a outside the second side wall 23b at a position facing the housing 23 side wall 23a, a packing 32, a long hole 32a, The pores 22b and 22b, the peripheral wall portion, the pressing plate 22c, the liquid contact portion 22d and the like are the packing 31, the long hole 31a, the pores 21b and 21b, and the peripheral wall portions 31b and 31c in the gap passage 21 for supplying the processing liquid described above. , 31d, 31d, presser plate 21c, liquid contact portion 21d, etc., and the diameter dimension Dr of the pores 22b, 22b is similarly spaced from the discharge port connection position to which the discharge pipe 22 is connected. It is set to be inclined so as to increase in the processing width direction, and is set so as to make the amount of discharged liquid in each of the pores 22b, 22b constant.
[0033]
Further, a pressure control unit (not shown) is provided on the discharge port 22a side, and this pressure control unit (processing liquid recovery means) allows the cleaning liquid 2 in contact with the substrate to be processed W to flow into the discharge passage 22 after cleaning. In addition, the pressure of the cleaning liquid in contact with the atmosphere of the first opening 21b (including the surface tension of the cleaning liquid and the surface tension of the surface to be cleaned of the substrate to be processed) and the atmospheric pressure are provided. Yes. The said pressure control part is comprised by the pressure reduction pump provided in the discharge port 22a side. Therefore, a pressure reduction pump is used for the pressure control part on the discharge passage 22 side, and the force for sucking the cleaning liquid in the connecting part 23 with this pressure reduction pump is controlled, so that the cleaning liquid in contact with the atmosphere of the first opening 21b is controlled. The pressure (including the surface tension of the cleaning liquid and the surface tension of the surface to be cleaned of the substrate to be processed W) is balanced with the atmospheric pressure.
That is, the relation between the pressure Pw of the cleaning liquid in contact with the atmosphere of the first opening 21b (including the surface tension of the cleaning liquid and the surface tension of the surface to be cleaned of the substrate W) and the atmospheric pressure Pa is Pw≈Pa. Thus, the cleaning liquid supplied to the substrate to be processed W through the first opening 21b and contacting the substrate to be processed W is discharged to the discharge passage 22 without leaking outside the cleaning nozzle. That is, the cleaning liquid supplied from the cleaning nozzle onto the substrate to be processed W does not come into contact with portions other than the portions (the first and second openings 21b and 22b) supplied with the cleaning liquid on the substrate W to be processed. It is removed from the substrate W.
[0034]
The distance H between each of the openings 21b and 22b and the liquid contact surface 46A of the cleaning nozzle 1 and the substrate to be processed W should be 8 mm or less and not in contact with the substrate to be processed W, preferably 6 mm or less. A range that does not come into contact with W, more preferably a range that is 3 mm or less and does not come into contact with the substrate W, is preferable. If it exceeds 8 mm, it becomes difficult to fill a desired cleaning liquid between the substrate W and the cleaning nozzle, and cleaning becomes difficult.
[0035]
The facing surface 46A, which is the wetted surface of the cleaning nozzle 1, is made of a fluororesin such as PFA, or depending on the cleaning liquid used, the outermost surface is made of a passive film made of only chromium oxide, or aluminum oxide and chromium oxide. For stainless steel having a mixed film on the surface and ozone water, it is preferable to use a corresponding surface covering portion made of titanium having an electropolished surface because impurities do not elute into the cleaning liquid. If the wetted surface is made of quartz, it is preferable for supplying all cleaning liquids except hydrofluoric acid.
More preferably, the stability of the cleaning liquid 2 can be improved by making the facing surface 46A hydrophilic and the liquid contact part 21d of the pressing plate 21c hydrophobic.
In the configuration of the cleaning nozzle in the present embodiment, when the cleaning liquid 2 supplied to the processing region 35 is hydrogen water, it can be used as a hydrogen water cleaning nozzle, and when the cleaning liquid is ozone water, It can be used as an ozone water cleaning nozzle. When the cleaning liquid is pure water, it can be used as a pure water rinse cleaning nozzle.
[0036]
In the wet processing nozzle 1 of the present embodiment, each diameter dimension Dr in the plurality of pores 21b, 21b is set to be inclined from the introduction pipe connection position 21a ′ along the x axis in the processing width direction. As a result, the liquid amounts q of the processing liquid 2 supplied at the positions corresponding to the introduction openings (pores) 21b and 21b extending in the processing width direction as the x-axis are set substantially equally. Therefore, the processing liquid 2 supplied to the processing region 35 during the wet processing operation can be supplied substantially evenly in the processing width direction without increasing the pressure loss in the processing liquid supply during the wet processing. . For this reason, the flow rate of the processing liquid 2 on the surface of the workpiece W is made uniform in the processing width direction, which is the x axis, and the amount of contact and passage of the processing liquid 2 at each position on the surface of the workpiece W is made uniform. It is possible to make the reaction rate of the treatment uniform and reduce the occurrence of non-uniformity in the treatment width direction of the wet treatment.
[0037]
In the wet processing nozzle 1 of the present embodiment, each diameter dimension Dr in the plurality of pores 22b, 22b is set to be inclined along the x axis in the processing width direction so as to be larger from the discharge pipe connection position 22a ′. As a result, the liquid amounts q of the discharged liquid discharged from the respective positions corresponding to the respective discharge openings (pores) 22b, 22b extending in the processing width direction as the x axis are set substantially equally. Therefore, the discharged liquid 2 discharged from the processing region 35 during the wet processing operation can be discharged substantially uniformly in the processing width direction without increasing the pressure loss in the processing liquid discharge during the wet processing. For this reason, the flow rate of the discharged liquid on the surface of the workpiece W is made uniform in the treatment width direction, which is the x axis, and the amount of contact of the treatment liquid 2 at each position on the surface of the workpiece W, the passing amount, etc. are made uniform. The reaction rate can be made uniform, and the occurrence of non-uniformity in the treatment width direction of the wet treatment can be reduced.
[0038]
In this embodiment, the wet process is a cleaning process, but in addition to this, it can be applied to a wet process such as peeling, developing, etching, plating, polishing, etc. Any change is possible without departing from the spirit of the invention.
[0039]
In the present embodiment, the case where the wet processing nozzle 1 is provided on the upper surface side (one processing surface side) of the substrate W to be processed has been described. However, as shown in FIG. A wet processing nozzle 1a may be provided. The wet processing nozzle 1a has the same configuration as the wet processing nozzle 1 described above.
[0040]
Hereinafter, a second embodiment of a wet processing nozzle and a wet processing apparatus according to the present invention will be described with reference to the drawings.
[Second Embodiment]
6 is a cross-sectional view showing the wet processing nozzle in the present embodiment, FIG. 7 is a front view showing the packing in the wet processing nozzle in the present embodiment, and FIG. ).
In this embodiment, what is different from the first embodiment shown in FIGS. 1 to 5 is a point related to the packings 31 and 32 and a point related to the configuration of the connecting portion 23, and the other corresponding components are the same. Reference numerals are assigned and explanations thereof are omitted.
[0041]
In the packing 31 of the present embodiment, as shown in FIG. 7, the diameters of the plurality of pores 21b and 21b are set to be equal and the lengths D are set._L However, in order to set the liquid amounts q of the processing liquid 2 supplied at the positions corresponding to the introduction openings (pores) 21b and 21b extending in the processing width direction as the x-axis substantially evenly. The inclination is set so as to decrease in the direction away from the position close to the introduction pipe connection position 21a ′ toward the processing width direction. Here, the length dimension D of the pore 21b_L Is set so that the variation in the flow rate in each pore 21 is 10% or less.
The flow rate variation <q> in each pore 21b is similarly defined by the above-described equation (1).
[0042]
Specifically, the length dimension D of the thin tube 21b_L Is set to be inclined linearly or along a 2 o'clock curve from the introduction pipe connecting position 21a ′ to the outside in the processing width direction (+ x direction and −x direction) along the x axis shown in FIG. . Here, actually, the length dimension D of the pore 21b._L In consideration of conditions such as the pressure on the processing liquid 2, the shape of the cross-sectional area of the long hole 31a, the Reynolds number of the processing liquid 2, etc., an appropriate one is adopted.
[0043]
As described above, the length dimension D of the pores 21b, 21b_L In order to reduce the cross-sectional area of the long hole 31a in the processing width direction, the height dimension D of the long hole 31a is set._W Was set to be constant. Correspondingly, in the long hole 31a, the vicinity of the introduction pipe connection position 21a 'located at the center in the processing width direction is far from the liquid contact surface 46A side, and is curved toward the liquid contact surface 46A side at both ends of the long hole 31a. It is formed in a substantially arc shape that approaches.
[0044]
In the gap passage (discharge passage) 22 for discharging the processing liquid connected to the discharge port 22a outside the second side wall 23b at a position facing the housing 23 side wall 23a, a packing 32, a long hole 32a, The pores 22b and 22b, the peripheral wall portion, the pressing plate 22c, the liquid contact portion 22d and the like are the packing 31, the long hole 31a, the pores 21b and 21b, and the peripheral wall portions 31b and 31c in the gap passage 21 for supplying the processing liquid described above. , 31d, 31d, presser plate 21c, liquid contact portion 21d, etc., and the length dimension D of the pores 22b, 22b_L Is also set to be inclined so as to increase in the processing width direction away from the discharge port connection position to which the discharge pipe 22 is connected, and to set the discharge liquid amount in each of the pores 22b and 22b to be constant. ing.
[0045]
Further, as shown in FIG. 6, the connecting portion 23 is provided with an ultrasonic transducer portion 40 for applying ultrasonic vibration to the cleaning liquid 2 in the processing region 35 while the substrate W to be processed is being cleaned. It has been. The ultrasonic vibrator portion 40 includes a vibration plate (vibration portion) 46 and an ultrasonic vibrator 48 that is provided on the main surface of the vibration plate 46 and applies ultrasonic vibration to the vibration plate 46. Is. The ultrasonic transducer 48 is an electrostrictive element such as PZT, and generates an ultrasonic vibration upon receiving an ultrasonic frequency electric signal from an oscillator. The ultrasonic transducer 48 is connected to the diaphragm 46 by an adhesive for bonding the ultrasonic transducer.
[0046]
It is preferable in terms of practicality when performing wet processing that the ultrasonic vibrator 48 is capable of outputting ultrasonic vibrations having a frequency in the range of 20 kHz to 10 MHz, and in particular, the thickness of the treatment liquid layer that can be retained. From this viewpoint, a frequency of 0.2 MHz or more is preferable.
At the time of cleaning the substrate to be processed W here, ultrasonic vibration is applied by the ultrasonic vibrator 48 while the cleaning liquid 2 is supplied to the processing region 35, and the substrate W to be processed is cleaned in cooperation with the cleaning liquid 2. it can.
[0047]
In the wet processing nozzle 1 of the present embodiment, the same effects as those of the above-described embodiment can be obtained, and each length dimension D of the plurality of pores 21b and 21b can be obtained._L Are set so as to be smaller from the introduction pipe connection position 21a ′ along the x-axis in the process width direction, so that each introduction opening (thinner) extending in the process width direction as the x-axis is set. Hole) Since the liquid amount q of the processing liquid 2 supplied at each position corresponding to 21b, 21b can be set substantially evenly, the wet without increasing the pressure loss in the processing liquid supply during the wet processing. The processing liquid 2 supplied to the processing region 35 during the processing operation can be supplied substantially evenly in the processing width direction. For this reason, the flow rate of the processing liquid 2 on the surface of the workpiece W is made uniform in the processing width direction, which is the x axis, and the amount of contact and passage of the processing liquid 2 at each position on the surface of the workpiece W is made uniform. It is possible to make the reaction rate of the treatment uniform and reduce the occurrence of non-uniformity in the treatment width direction of the wet treatment.
[0048]
Furthermore, in the wet processing nozzle 1 of the present embodiment, each length dimension D in the plurality of pores 22b, 22b._L Are set to be inclined along the x-axis in the processing width direction so as to be larger from the discharge pipe connection position 22a ′, whereby each discharge opening (thinner) extending in the processing width direction as the x-axis is set. Hole) Since the liquid amount q of the discharged liquid discharged from each position corresponding to 22b and 22b can be set substantially evenly, the wet process without increasing the pressure loss in the discharged process liquid during the wet process. The discharged liquid 2 discharged from the processing region 35 during operation can be discharged substantially uniformly in the processing width direction. For this reason, the flow rate of the discharged liquid on the surface of the workpiece W is made uniform in the treatment width direction, which is the x axis, and the amount of contact of the treatment liquid 2 at each position on the surface of the workpiece W, the passing amount, etc. are made uniform. The reaction rate can be made uniform, and the occurrence of non-uniformity in the treatment width direction of the wet treatment can be reduced.
[0049]
In the present embodiment, since the ultrasonic transducer 48 is provided, the wet processing can be performed in cooperation with the processing liquid 2 and the ultrasonic vibration, and the processing efficiency can be improved. It becomes.
[0050]
Further, in each of the above-described embodiments, the pore 21b serving as the introduction opening is in a through-hole state penetrating through the peripheral wall 31b of the packing 31, but as shown in FIG. 8, the holding plate of the peripheral wall 31b It can also be a groove 21b 'drilled in the surface 31f on the 31 side. In this case, the cross-sectional area in the ridge direction of the groove 21b 'can be set so as to increase from the introduction pipe connecting position 22a' in the processing width direction (± x direction) instead of the diameter dimension of the pore 21b. Alternatively, the groove 21 b ′ can be provided on the surface of the packing 31 on the housing 23 side.
[0051]
Hereinafter, a third embodiment of a wet processing apparatus according to the present invention will be described with reference to the drawings.
[Third Embodiment]
The present embodiment is an example of a cleaning apparatus (wet processing apparatus) including the wet processing nozzle of any one of the above embodiments.
FIG. 9 is a diagram showing a schematic configuration of the wet processing apparatus 51 in the present embodiment. For example, a large glass substrate (hereinafter simply referred to as a substrate) of about several hundred mm square is used as a substrate to be processed for single wafer cleaning. It is a device.
In the figure, 52 is a cleaning section, 53 is a stage (substrate holding means), 54, 55, 56 and 89 are cleaning nozzles, 57 is a substrate transfer robot, 58 is a loader cassette, 59 is an unloader cassette, 60 is hydrogen water An ozone water generation unit, 61 is a cleaning liquid regeneration unit, and W is a glass substrate (substrate to be processed).
[0052]
As shown in the drawing, the center of the upper surface of the apparatus is a cleaning unit 52, and a stage 53 for holding the substrate W is provided. The stage 53 is provided with a rectangular step portion that matches the shape of the substrate W, and the substrate W is fitted on the step portion, and the surface of the substrate W and the surface of the stage 53 are held on the stage 53 in a flush state. It has come to be. A space is formed below the step, and a substrate lifting shaft (not shown) protrudes from below the stage 53 in the space. A shaft driving source (not shown) such as a cylinder is provided at the lower end of the substrate elevating shaft, and the substrate elevating shaft moves up and down by the operation of the cylinder when the substrate transfer robot 57 delivers the substrate W. The substrate W is raised or lowered along with the vertical movement.
[0053]
A pair of rack bases 62 are provided at positions facing each other across the stage 53, and cleaning nozzles 54, 55, 56, and 89 are installed between the rack bases 62. The cleaning nozzle is composed of four nozzles arranged in parallel, and each of the cleaning nozzles 54, 55, 56, 89 performs cleaning by different cleaning methods. In the case of the present embodiment, these four nozzles supply ozone to the substrate and irradiate ultraviolet rays from the ultraviolet lamp 63 to supply the ozone cleaning nozzle 54 for mainly decomposing and removing organic substances. Ozone water ultrasonic cleaning nozzle 55 for cleaning by applying ultrasonic vibration by the ultrasonic vibrator main body 48, hydrogen water super for cleaning by supplying ultrasonic vibration by the ultrasonic vibrator main body 48 while supplying hydrogen water A sonic cleaning nozzle 56 and a pure water rinsing cleaning nozzle 89 for supplying pure water to perform rinsing cleaning.
[0054]
Each of the cleaning nozzles 54, 55, 56, 89 is called a push-pull type nozzle (liquid-saving nozzle). Of these four nozzles, the ozone water ultrasonic cleaning nozzle 55 and the hydrogen water ultrasonic cleaning nozzle 56 are the same as the cleaning nozzle of any of the embodiments described with reference to FIGS. Or one cleaning nozzle provided with a plurality of cleaning nozzles according to any one of the embodiments described with reference to FIGS. 1 to 8 (in FIG. 9, one cleaning nozzle The connecting portion 23 between the introduction passage 21 and the discharge passage 22, the ultrasonic transducer portion 40 (or the ultrasonic transducer 40 a) provided in the connecting portion 23, and the first and second openings 21 b and 22 b are as follows. Three sets of each are provided, and the first and second openings 21b and 22b each extend in a length equal to or greater than the width of the substrate W. However, for the sake of illustration, only the ultrasonic transducer 48 is shown here, and illustrations divided into a cleaning liquid introduction section, a cleaning liquid discharge section, and the like are omitted. The cleaning nozzle 54 has substantially the same configuration as the cleaning nozzle of the above embodiment except that an ultraviolet lamp 63 is provided instead of the ultrasonic transducer body 48, and the cleaning nozzle 89 has ultrasonic vibration. The configuration is substantially the same as the cleaning nozzle of the above embodiment except that the child main body 48 is not provided. However, for convenience of illustration, the illustration divided into the cleaning liquid introduction part, the cleaning liquid discharge part, etc. is omitted here.
In the cleaning apparatus 51, the four cleaning nozzles sequentially move along the rack base 62 while maintaining a constant distance from the substrate W above the substrate W, so that the entire surface of the substrate W to be cleaned (processed) The entire surface) is cleaned by four types of cleaning methods.
[0055]
Each cleaning nozzle moving means (nozzle / workpiece relative moving means) is provided with a slider that can be moved horizontally along a linear guide on each rack base 62, and a column is provided on the upper surface of each slider. Each of the cleaning nozzles 54, 55, 56, and 89 is fixed to these columns. A drive source such as a motor is installed on each slider, and each slider is configured to run on the rack base 62. Each of the cleaning nozzles 54, 55, 56, and 89 is individually moved horizontally by operating the motor on each slider in accordance with a control signal supplied from a control unit (not shown) of the apparatus. Yes. Further, the support column is provided with a drive source such as a cylinder (not shown), and when the support column moves up and down, the height of each cleaning nozzle 54, 55, 56, 89, that is, each cleaning nozzle 54, 55, The distance between 56 and 89 and the substrate W can be adjusted.
[0056]
A hydrogen water / ozone water generation unit 60 and a cleaning liquid regeneration unit 61 are provided on the side of the cleaning unit 52. A hydrogen water production device 64 and an ozone water production device 65 are incorporated in the hydrogen water / ozone water generation unit 60. Any cleaning liquid can be produced by dissolving hydrogen gas or ozone gas in pure water. Then, the hydrogen water generated by the hydrogen water production apparatus 64 is supplied to the hydrogen water ultrasonic cleaning nozzle 56 by a liquid feed pump 67 provided in the middle of the hydrogen water supply pipe 66. Similarly, the ozone water generated by the ozone water production apparatus 65 is supplied to the ozone water ultrasonic cleaning nozzle 55 by a liquid feed pump 69 provided in the middle of the ozone water supply pipe 68. The pure water rinse cleaning nozzle 89 is supplied with pure water from a pure water supply pipe (not shown) in the production line.
[0057]
The hydrogen water after passing through the hydrogen water filter 70 is supplied to the hydrogen water ultrasonic cleaning nozzle 56 by a liquid feed pump 77 provided in the middle of the regenerated hydrogen water supply pipe 76. . Similarly, the ozone water that has passed through the ozone water filter 71 is supplied to the ozone water ultrasonic cleaning nozzle 55 by a liquid feed pump 79 provided in the middle of the regenerated ozone water supply pipe 78. Yes. The hydrogen water supply pipe 66 and the regenerated hydrogen water supply pipe 76 are connected in front of the hydrogen water ultrasonic cleaning nozzle 56, and new hydrogen water is introduced into the hydrogen water ultrasonic cleaning nozzle 56 by the valve 80 or regenerated. It is possible to switch between introducing hydrogen water. Similarly, the ozone water supply pipe 68 and the regenerated ozone water supply pipe 78 are connected in front of the ozone water ultrasonic cleaning nozzle 55, and new ozone water is introduced into the ozone water ultrasonic cleaning nozzle 55 by the valve 81. It is possible to switch between introducing regenerated ozone water. It should be noted that the hydrogen water and ozone water after passing through the filters 70 and 71 have particles removed, but the concentration of gas in the liquid is low, so the hydrogen water production device 64 and ozone water again through the pipe. You may make it return to the water manufacturing apparatus 65 and replenish hydrogen gas and ozone gas.
[0058]
A loader cassette 58 and an unloader cassette 59 are detachably provided on the side of the cleaning unit 52. These two cassettes 58 and 59 have the same shape that can accommodate a plurality of substrates W, the substrate W before cleaning (before wet processing) is stored in the loader cassette 58, and the unloader cassette 59 is cleaned. A finished substrate W (after wet processing) is accommodated. A substrate transfer robot 57 is installed at an intermediate position between the cleaning unit 52, the loader cassette 58, and the unloader cassette 59. The substrate transport robot 57 has an arm 82 having a telescopic link mechanism on the upper portion thereof, and the arm 82 is rotatable and can be moved up and down, and supports and transports the substrate W at the tip of the arm 82. ing.
[0059]
The cleaning device 51 having the above-described configuration is configured in such a manner that the operator sets various cleaning conditions such as the distance between the cleaning nozzles 54, 55, 56, and 89 and the substrate W, the moving speed of the cleaning nozzle, the flow rate of the cleaning liquid, etc. The operation of each part is controlled by the control part and is configured to automatically operate. Therefore, when the cleaning apparatus 51 is used, the substrate W before cleaning is set in the loader cassette 58, and if the operator operates the start switch, the substrate transfer robot 57 moves the substrate W from the loader cassette 58 onto the stage 53. UV cleaning, ozone water ultrasonic cleaning, hydrogen water ultrasonic cleaning, and rinse cleaning are automatically performed in sequence on the stage 53 by the cleaning nozzles 54, 55, 56, and 89 on the stage 53. After cleaning, the substrate is transported. The robot 57 accommodates the unloader cassette 59.
[0060]
The cleaning apparatus 51 of the present embodiment includes the cleaning nozzles 55 and 56 of the embodiment of the present invention and the nozzle / workpiece relative movement means described above, so that the wet processing nozzle of the present embodiment. The entire surface to be cleaned of the substrate W can be wet-treated (cleaned) with the advantage of (cleaning nozzle).
[0061]
In the cleaning apparatus 51 of the present embodiment, each of the four cleaning nozzles 54, 55, 56, and 89 is subjected to different cleaning methods such as ultraviolet cleaning, ozone water ultrasonic cleaning, hydrogen water ultrasonic cleaning, and rinse cleaning. Since the cleaning process is performed, various cleaning methods can be performed with one apparatus. Therefore, for example, particles with fine particle diameter are removed by ultrasonic cleaning with hydrogen water and ultrasonic cleaning with ozone water, and further cleaning is performed while rinsing cleaning is also performed to wash away the cleaning liquid adhering to the substrate surface. The object to be removed can be sufficiently washed away. Further, in the case of the cleaning device 51 of the present embodiment, since the above-described liquid-saving type cleaning nozzle is provided, the amount of cleaning liquid used can be reduced, and a liquid pool is generated below the nozzle. Therefore, substrate cleaning with high efficiency and high cleanliness can be performed. Therefore, it is possible to realize a cleaning device suitable for a production line of various electronic devices such as semiconductor devices and liquid crystal display panels.
[0062]
The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, it is a matter of course that the design can be appropriately changed with respect to the specific configuration such as the shape and size of the cleaning nozzle, the number of introduction pipes and discharge pipes of the cleaning nozzle, and the installation positions. Furthermore, in the above embodiment, the example in which the nozzle of the present invention is applied to the cleaning nozzle has been shown. However, the nozzle of the present invention can also be applied to wet processing other than cleaning, such as etching and resist removal. is there.
[0063]
Embodiments of the wet processing nozzle or the wet processing apparatus according to the present invention will be described below.
[Example]
In the present invention, by setting the diameter dimension and the length dimension of the introduction opening (pore) 21b, the flow rate of the processing liquid supplied from the introduction opening toward the object to be treated is set to the treatment object. Variation in the direction (process width direction) orthogonal to the process direction for the object was measured.
[0064]
Here, as the wet processing nozzles actually used, those having the diameter 21b of the diameter 21b as in the first embodiment, and the length D of the pores 21b as in the second embodiment._L And those that are not set for comparison.
Here, pure water was selected as the treatment liquid 2. In addition, the flow rate of the processing liquid 2 and the height dimension D of the long hole 31_W The thickness dimension of the packing 31, the pitch of the pores 21b, and the number of thin tubes 21b are as follows.
[0065]
Total flow rate of treatment liquid 2: 5 L / min
Height dimension D of long hole 31_W : 6mm
Packing 31 thickness dimension: 3 mm
Pitch (interval) dimension of the pores 21b: 10 mm
Total number of thin tubes 21b: 50
[0066]
(Example)
In the wet processing nozzle 1 as described above, the diameters Dr in the plurality of pores 21b and 21b are set so as to be inclined from the introduction pipe connection position 21a ′ along the x axis in the processing width direction. did.
The diameter Dr of the pore 21b at this time was changed linearly, and the maximum value and the minimum value in the diameter dimension were set as shown in Table 1, and these were designated as Examples 1 and 2.
Moreover, while changing the diameter dimension Dr of the pore 21b corresponding to a quadratic curve, the maximum value and the minimum value in this diameter dimension Dr were set as shown in Table 1, and these were set as Example 3.
[0067]
Further, each length dimension D in the plurality of pores 21b, 21b._L Is set to be inclined along the x-axis in the processing width direction so as to be smaller from the introduction pipe connection position 21a '. By doing
The length dimension D of the pore 21b at this time_L Is changed corresponding to the quadratic curve, and the length dimension D is changed._L The maximum and minimum values in were set as shown in Table 1, and these were taken as Example 4.
[0068]
(Comparative example)
Similarly, the diameter dimension Dr and the length dimension D of the pore 21b._L Those in which no change occurred were designated as Comparative Examples 1 to 4.
[0069]
In these nozzles, the pressure in each of the pores 21b and the variation in flow rate represented by the equation (1) were measured.
The results are shown in Table 1.
[0070]
[Table 1]

In Table 1, two numbers connected with-in each column indicate the maximum value and the minimum value in the item.
Here, 1 kgf / m² Is about 9.8 Pa.
[0071]
According to the above result, as shown in Comparative Example 4, when the pore diameter Dr is thinned to such an extent that the pressure increases, the flow rate variation is 10% or less. Too big and impractical. Here, in Comparative Examples 1 to 3 other than that, the flow rate variation is 20% or more, and there is a possibility that the non-uniformity of the wet processing becomes a problem. On the other hand, in Examples 1-4, it turns out that the dispersion | variation in flow volume can all be suppressed to 10 percent or less. For this reason, the flow rate of the processing liquid 2 on the surface of the workpiece W is made uniform in the processing width direction, which is the x axis, and the amount of contact and passage of the processing liquid 2 at each position on the surface of the workpiece W is made uniform. It is possible to make the reaction rate of the treatment uniform and reduce the occurrence of non-uniformity in the treatment width direction of the wet treatment.
[0072]
【The invention's effect】
According to the wet processing nozzle or the wet processing apparatus of the present invention, the flow rate of the processing liquid supplied from the introduction opening toward the processing object is perpendicular to the processing direction with respect to the processing object (processing width). Since the amount of processing liquid supplied to each portion of the introduction opening extending in the processing width direction can be set to an equal amount by setting it to be uniform with respect to (direction), The processing liquid supplied to the processing region during the wet processing operation can be evenly supplied in the processing width direction without increasing the pressure loss in the processing liquid supply during processing. Therefore, it is possible to equalize the processing liquid flow rate on the surface of the object to be processed in the processing width direction, to uniformize the reaction speed of the wet processing on the surface of the object to be processed, and to reduce the occurrence of non-uniformity in the processing width direction of the wet processing. The effect that it is possible can be produced.
[Brief description of the drawings]
FIG. 1 is a bottom view showing a first embodiment of a wet processing nozzle according to the present invention.
2 is a cross-sectional view taken along line II-II in FIG.
FIG. 3 is an exploded perspective view showing a first embodiment of a wet processing nozzle according to the present invention.
FIG. 4 is a front view (a) showing a packing in the first embodiment of the wet processing nozzle according to the present invention, and a cross-sectional view (b) as viewed in the direction of the arrows in (a).
FIG. 5 is a cross-sectional view showing another embodiment of a wet processing nozzle according to the present invention.
FIG. 6 is a step view showing a second embodiment of a wet processing nozzle according to the present invention.
FIG. 7 is a front view (a) showing a packing in a second embodiment of a wet processing nozzle according to the present invention, and a sectional view (b) as viewed in the direction of an arrow in (a).
FIG. 8 is a perspective view showing a packing in another embodiment of a wet processing nozzle according to the present invention.
FIG. 9 is a plan view showing a schematic configuration of a third embodiment of the wet processing apparatus of the present invention.
FIG. 10 is a cross-sectional view of a conventional wet processing nozzle.
[Explanation of symbols]
1 ... Cleaning nozzle (wet processing nozzle)
2. Treatment liquid (exhaust liquid)
21 ... Introduction passage (introduction pipe)
21a ... Inlet
21a '... Inlet pipe connection part position
21b ... 1st opening part (introduction opening part) pore
22 ... discharge pipe (discharge pipe)
22a ... outlet
22a ′: Discharge pipe connection part position
22b ... second opening (discharge opening) pore
23 ... Connecting part
31, 32 ... packing
31a, 32a ... slot
31b, 31c, 31d ... peripheral wall
31e ... inner surface
31f ... surface
35 ... Processing area
40: Ultrasonic transducer part
46 ... Diaphragm (vibrating part)
46A ... Opposite surface
48 ... Ultrasonic transducer
51 ... Cleaning device (wet processing device)
55, 56 ... Cleaning nozzle (wet processing nozzle)
W: Substrate to be processed (processed object)

Claims (4)

A wet processing nozzle for supplying a processing liquid for wet processing of the processing target toward the processing target and discharging a discharged liquid of the processing liquid after the wet processing;
The nozzle includes an introduction pipe having an introduction port for introducing the treatment liquid at one end, a discharge pipe having a discharge port for discharging the discharge liquid to the outside at one end, and the introduction pipe and the discharge pipe. The other end is connected to each other and includes a connecting portion that faces the object to be processed. The connecting portion includes an introduction opening in which the introduction pipe is open, and a discharge opening in which the discharge pipe is open. Is provided,
By supplying the processing liquid from the introduction opening toward the object to be processed, the wet filled with the processing liquid in the space between the connecting portion and each surface of the object to be processed facing each other. A processing region for processing is formed, and the discharged liquid from the processing region is led from the discharge opening to the discharge pipe and discharged from the discharge port,
The connecting portion is provided with a casing and a thin packing along the outside of the side wall of the casing, and a pressing plate for watertightly fixing the packing to the casing.
In the packing, one or a plurality of long holes are formed along a processing width direction which is a direction orthogonal to a processing direction for the workpiece, and a long hole on the side forming the processing region is formed. The peripheral wall portion is provided with a plurality of pores that connect the inside of the elongated hole and the processing region to form the introduction opening,
The elongated holes and the pores are set so that the flow rate of the processing liquid supplied from the introduction opening toward the object to be processed is uniform in a direction orthogonal to the processing direction for the object to be processed. Do Te Ri,
The processing area side of the packing is flush with the processing width direction,
The elongated hole is far from the processing region side in the vicinity of the introduction tube connection position to which the introduction tube is connected, and toward the processing region side toward a position away from the introduction tube connection position in the processing width direction. By being formed to approach,
Wherein each length in the plurality of pores, the wet process nozzle, wherein Rukoto been configured to respectively smaller toward a position spaced from the inlet pipe connecting portion position. Wet treatment nozzle according to claim 1, wherein the variation of flow rate in the pores is set to be 10% or less. A wet processing nozzle for supplying a processing liquid for wet processing of the processing target toward the processing target and discharging a discharged liquid of the processing liquid after the wet processing;
The nozzle includes an introduction pipe having an introduction port for introducing the treatment liquid at one end, a discharge pipe having a discharge port for discharging the discharge liquid to the outside at one end, and the introduction pipe and the discharge pipe. The other end is connected to each other and includes a connecting portion that faces the object to be processed. The connecting portion includes an introduction opening in which the introduction pipe is open, and a discharge opening in which the discharge pipe is open. Is provided,
By supplying the processing liquid from the introduction opening toward the object to be processed, the wet filled with the processing liquid in the space between the connecting portion and each surface of the object to be processed facing each other. A processing region for processing is formed, and the discharged liquid from the processing region is led from the discharge opening to the discharge pipe and discharged from the discharge port,
The connecting portion is provided with a casing and a thin packing along the outside of the side wall of the casing, and a pressing plate for watertightly fixing the packing to the casing.
In the packing, one or a plurality of long holes are formed along a processing width direction which is a direction orthogonal to a processing direction for the workpiece, and a long hole on the side forming the processing region is formed. The peripheral wall portion is provided with a plurality of pores that connect the inside of the elongated hole and the processing region to form the discharge opening,
The elongated hole and the pore are set so that the flow rate of the discharged liquid discharged from the object to be processed to the discharge opening is uniform in a direction orthogonal to the processing direction for the object to be processed. The
The processing area side of the packing is flush with the processing width direction,
In the vicinity of the discharge pipe connection position to which the discharge pipe is connected, the elongated hole is far from the processing area side, and toward the position away from the discharge pipe connection position in the processing width direction. By being formed to approach,
Wherein each length in the plurality of pores, the wet process nozzle, wherein Rukoto been configured to respectively smaller toward a position spaced from the discharge pipe connecting portion position. A nozzle for wet processing according to any one of claims 1 to 3 ,
A treatment liquid introduction means for introducing a treatment liquid between the introduction opening and a surface to be treated of the object to be treated;
A processing liquid recovery means for sucking and discharging the processing liquid from between the discharge opening and the surface to be processed;
A nozzle / processing object relative moving means for processing the entire processing surface of the processing object by moving the wet processing nozzle and the processing object relative to each other along the processing surface of the processing object; A wet processing apparatus.

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