JP2003077886A - Wetting treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wetting treatment device with which the using amount of wetting treatment liquid can be saved, which can be miniaturized, can be used for a manufacturing line and can rationally perform wetting treatment without needing a large facility cost and an occupation space in a wetting treatment process. SOLUTION: In the wetting treatment device, a substrate 21 is transferred into a treatment chamber 31a having a treatment area 32 in which a plurality of wetting treatment means supplying treatment liquid for wetting treatment on the substrate to be treated 21 is disposed, and wetting treatment is sequentially performed. Transfer rollers 25 for transferring the substrate 21 in an inclined state are disposed in the treatment chamber 31a. A plurality of wetting treatment means are constituted of a pair of push/pull nozzles 41 and 41 and a pair of push/pull nozzles 42 and 42. The substrate to be treated 21 is transferred between the facing parts of the pairs of push/pull nozzles, and wetting treatment is conducted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention continuously supplies one or more kinds of wet treatments such as cleaning, peeling, development, etching, plating and polishing by supplying a treatment liquid to the surface of an object to be treated. Involved in a wet processing device that performs drying as necessary, particularly in a wet processing step such as wet etching and cleaning (rinsing) in the manufacturing process of semiconductor devices, liquid crystal display panels, etc. It relates to a suitable technique.

[0002]

2. Description of the Related Art In the field of electronic devices such as semiconductor devices and liquid crystal display panels, a process of wet-treating a substrate to be processed such as a semiconductor substrate or a glass substrate, which is an object to be processed, during the manufacturing process, and a wet treatment. The step of drying the substrate is essential. FIG. 1 shows an example of a conventional wet treatment apparatus used in such a wet treatment process and a drying process.
Shown in 1. A conventional wet processing apparatus 100 includes a long processing chamber 101 for performing wet processing on a substrate to be processed and then drying the substrate.
And a unloader 114 for feeding the substrate to be processed into the processing chamber 101 and an unloader 114 for taking out the substrate processed in the processing chamber 101. The substrate to be processed is transferred from the loader 110 through the inside of the processing chamber 101. It can be automatically conveyed to the unloader 114.

In the long processing chamber 101, an etching bath 111 for supplying an etching liquid to the substrate to be processed for wet etching, a cleaning bath (rinsing bath) 112 for cleaning the substrate to be processed after etching, and a substrate to be cleaned after cleaning. A drying tank 113 for drying the processed substrate is sequentially provided. A partition 115 is provided between the adjacent tanks as shown in FIG.
In the cleaning tank (rinsing tank) 112, as shown in FIG. 12, a plurality of nozzles 112a for supplying a cleaning liquid to the substrate 121 to be processed are respectively provided in the vertical direction with respect to the substrate 121 to be processed conveyed into the cleaning tank 112. It is provided. Also,
In the drying tank 113, as shown in FIG.
A plurality of air knives 113a for blowing high-pressure air onto the substrate 1 are provided in the vertical direction with respect to the substrate 121 to be processed that has been transported into the drying tank 113.

In the processing chamber 101, a transfer roller 12 for sending the substrate 121 to be processed, which has been sent into the processing chamber 101 by the loader 110, from the etching tank 111 to the cleaning tank 112 and the drying tank 113 to the unloader 114.
5 is provided. Of the transport rollers 125, those provided in the vicinity of the air knife 113a of the drying tank 113 are the substrates 1 to be processed in the moving direction of the substrate 121 to be processed.
21 is inclined and arranged so that it can be conveyed by inclination at an angle. The transfer rollers 125 provided in the etching tank 111 and the cleaning tank 112, and the transfer rollers 125 provided in the drying tank 113 other than near the air knife 113a.
Are horizontally arranged in the moving direction of the substrate 121 so that the substrate 121 can be transported while being kept horizontal.

Using the conventional wet processing apparatus 100 as shown in FIGS. 11 to 12, the substrate 21 to be processed is sequentially subjected to wet processing and drying in the following manner. First, the substrate 121 to be processed is loaded into the processing chamber 10 by the loader 110.
1 into the etching bath 111. Next, the substrate 121 to be processed fed into the etching bath 111 is wet-etched while being horizontally transported by the transport rollers 125 .... Then, the substrate 1 to be processed after the wet etching
21 is fed into the cleaning tank 112, and the substrate 121 to be processed is horizontally conveyed in the cleaning tank 112 by the transfer rollers 125 .. And is sprayed on both surfaces to wash away the etching liquid adhering to the surface in the etching bath 111. Then, the processed substrate 121 after cleaning is dried in the drying tank 113.
It is sent into the inside and the substrate 121 to be processed is conveyed by the roller 125 ...
The air knife 1 is conveyed while being slanted in the drying tank 113 by
High-pressure air is blown onto both surfaces of the substrate 121 to be processed from 13a ... to dry the cleaning liquid adhering to the surface in the cleaning tank 112, and then it is conveyed to the unloader 114, and then stored in, for example, a cassette or the like.

[0006]

However, in the conventional wet processing apparatus 100, the etching bath 111 is used.
Since the substrate 212 to be processed is conveyed horizontally inside and inside the cleaning tank 112, the wet processing liquid used in the preceding step of the cleaning processing step, specifically, the etching liquid is brought into the cleaning tank 112. As a result, there is a problem in that a large amount of cleaning liquid is required, which makes the cleaning tank 112 longer and the wet processing apparatus becomes larger. If the wet processing device becomes large in this way,
The space occupied by the apparatus in the clean room in which the wet processing apparatus 100 is disposed becomes large, and a large equipment cost is spent only in the cleaning process, which is extremely irrational.

Further, the substrate 121 to be processed is placed in the cleaning tank 112.
Of the cleaning liquid adhering to the surface of the substrate 121 to be processed before being sent to the drying tank 113 becomes thicker, the amount of the drying gas used in the drying process, that is, Therefore, the amount of high-pressure air discharged from the air knife 113a increases. When the amount of the drying gas thus used increases, the mist generated in the processing chamber 101 increases, and the mist may collide with the inner wall of the processing chamber to contaminate the substrate 121 to be processed. Room 101
Had to be large.

In the fields of semiconductor devices, liquid crystal display panels, and the like, in recent years, substrates as objects to be processed have tended to become larger in size. The above-mentioned problem becomes more remarkable because the space occupied by the above becomes larger. Further, as the size of the substrate as the object to be processed increases, the amount of the wet processing liquid used also increases, but when ultrapure water is used as the cleaning liquid, the supply amount of this ultrapure water is limited. However, there is a problem in that the supply amount is not enough for cleaning the substrate, and thus it is not possible to sufficiently cope with the wet processing of a large substrate to be processed. Problems such as the above are avoided not only when performing cleaning after etching but also when performing wet processing continuously, because the wet processing liquid of the previous process mixes with the wet processing liquid of the subsequent process. Therefore, there arises a problem that the wet processing apparatus becomes large in size.

The present invention has been made in view of the above circumstances, and it is possible to reduce the amount of wet processing liquid used, to downsize the apparatus, and to spend a large amount of equipment and occupied space in the wet processing step. It is another object of the present invention to provide a wet processing apparatus that can be reasonably used for wet processing in a manufacturing line or the like. Further, the present invention can reduce not only the amount of the wet treatment liquid used, but also the amount of the drying gas used in the drying step after the wet treatment step, the apparatus can be downsized, and the wet treatment step and the drying step can be performed. An object of the present invention is to provide a wet processing apparatus that can be reasonably used for wet processing and drying in a production line or the like without spending a large amount of equipment and occupied space.

[0010]

In order to solve the above-mentioned problems, the wet processing apparatus according to the first aspect of the present invention supplies a processing liquid for the wet processing of an object to be processed toward the object to be processed. A wet processing apparatus for sequentially carrying out wet processing by transporting an object to be processed into a processing chamber provided with a plurality of wet processing areas provided with wet processing means, wherein the object is inclined in the processing chamber. It is characterized in that an inclined transport mechanism for transporting in a state is provided. According to the wet processing apparatus of the first embodiment having such a configuration, the objects to be processed are arranged obliquely in each wet processing area, and the processing liquid for the wet processing (wet processing) in each wet processing area. The wet treatment liquid can be efficiently brought into contact with the object to be treated when the treatment is performed, and the treatment liquid after the wet treatment is efficiently separated from the object to be treated, so that the wet treatment can be performed efficiently. it can. Further, according to the wet processing apparatus of the first embodiment, it is possible to prevent the processing liquid used in the wet processing area for performing the wet processing in the previous step from entering the wet processing area for performing the wet processing in the subsequent step (used in the previous step). It is possible to prevent the wet processing liquid from entering the post-process), so it is possible to save the amount of the wet processing liquid used in the post-processing wet processing area, shorten the wet processing area, and reduce the size of the wet processing equipment. Is possible.

Further, when the post-process is a cleaning process using ultrapure water, it is possible to prevent the processing solution used in the wet process region for performing the wet process of the previous process from entering the wet process region for performing the cleaning process of the subsequent process. As a result, it is possible to reduce the amount of ultrapure water used in the wet processing area of the cleaning process, and it is possible to improve the supply shortage of ultrapure water even if the substrate to be processed becomes large by 1 to 2 m square. Therefore, it is possible to sufficiently cope with the wet processing of a large object to be processed. As described above, in the wet processing apparatus of the first embodiment, it is possible to save the amount of the wet processing liquid used and to reduce the size of the wet processing apparatus. Therefore, a large amount of equipment and occupied space are required for the wet processing process. In addition, it can be used as a rational device for a production line or the like, and can be a device that can sufficiently cope with wet processing of a large object to be processed.

The wet processing apparatus according to the second aspect of the present invention comprises a plurality of wet processing regions provided with a wet processing means for supplying a processing liquid for the wet processing of the object to be processed toward the object. A wet processing apparatus for carrying out a wet process by sequentially transporting a target object into a processing chamber provided with a drying processing area provided with a drying mechanism for drying a target object subjected to wet processing, and It is characterized in that an inclined transfer mechanism for transferring the object to be processed in an inclined state is provided in the processing chamber. Second of such a configuration
According to the wet processing apparatus of the above-mentioned mode, the objects to be processed are arranged so as to be inclined in each wet processing area, and there is the same effect as the first wet processing apparatus.

Further, in the wet processing apparatus of the second embodiment, the object to be processed is arranged not only in each wet processing area but also in the dry processing area, and the wet processing of the previous step is performed. It is possible to prevent the treatment liquid used in the wet treatment area from entering the drying treatment area where the post-drying step is performed (it is possible to prevent the wet treatment liquid used in the previous step from entering the post-drying step). The liquid film of the wet processing liquid adhering to the surface of the object to be processed before being sent to the area can be thinned, and the amount of the drying gas used in the drying processing area can be reduced. Since a small amount of mist is used, the amount of mist generated in the processing chamber is small, and therefore, it is not necessary to enlarge the processing chamber in order to prevent contamination of the object to be processed due to this mist. In addition, the exhaust air volume for preventing the contamination of the object to be processed due to the mist can be significantly reduced.
As described above, in the wet treatment apparatus of the second embodiment, not only the amount of the wet treatment liquid used but also the amount of the drying gas used in the drying step after the wet treatment step can be reduced,
The device can be downsized, the exhaust air volume can be reduced, the wet processing and the drying can be reasonably performed by the wet processing and the drying process without spending a lot of equipment and occupied space in the manufacturing line, etc. The apparatus can sufficiently cope with wet processing and drying of a large object.

The wet processing apparatus according to the third aspect is a processing chamber provided with a processing region provided with a plurality of wet processing means for supplying a processing liquid for the wet processing of an object to be processed toward the object. In the wet processing apparatus for sequentially carrying out the wet processing by carrying the object to be processed, an inclined transfer mechanism for carrying the object to be processed in an inclined state is provided in the processing chamber, and among the plurality of wet processing means. At least one is formed with an inlet passage having an inlet for introducing the wet treatment liquid at one end and an exhaust passage for discharging the wet treatment liquid after the wet treatment to the outside of the wet treatment system at one end, The introduction passage and the discharge passage are composed of a pair of nozzle constituents each having an opening at the other end that opens toward the object to be processed. Is disposed to face the side with each other a gap provided, the between the opposing portions to be treated is characterized by being conveyed and performs wet process.

According to the wet processing apparatus of the third aspect having such a structure, in particular, since the wet processing means is composed of the pair of nozzle constituent members having the above structure, the wet processing liquid is processed from the introduction passage. After supplying the treatment liquid to the surface of the object, the treatment liquid containing the removed substance (those removed from the substance to be treated) is discharged from the discharge passage without contacting the surface of the substance to be treated other than the portion to which the treatment liquid is supplied with the wet treatment liquid. Since it can be discharged to the outside, the wet treatment can be performed efficiently (sufficient cleanliness can be obtained when the wet treatment liquid is a cleaning liquid). Further, the wet processing is performed by controlling the suction force from the discharge port (the end opposite to the end where the opening is provided) at the other end of the discharge passage with respect to the pressure of the wet processing liquid in the opening. Since the liquid can be discharged without leaking to the outside of the nozzle, sufficient wet treatment can be performed with a small amount of treatment liquid (sufficient cleanliness can be obtained when the wet treatment liquid is a cleaning liquid). As described above, in the wet processing apparatus according to the third aspect, the objects to be processed are arranged so as to be inclined in the processing region, and the wet processing means is composed of the nozzle structure having the above-described structure. Since the amount of processing liquid used can be further reduced and the wet processing apparatus can be downsized, it does not require a large amount of equipment cost or occupied space for the wet processing process, and it can be used as a rational device for production lines. In addition, it is possible to provide an apparatus that can sufficiently cope with the wet processing of a large object to be processed.

The wet processing apparatus according to the fourth aspect of the present invention comprises a plurality of wet processing means for supplying a processing liquid for the wet processing of an object to be processed toward the object, and the object subjected to the wet processing. A wet processing apparatus for sequentially carrying out wet processing and drying processing by carrying an object to be processed into a processing chamber provided with a processing region provided with a drying mechanism for drying the object to be processed in the processing chamber. An inclined transport mechanism for transporting in an inclined state is provided, and at least one of the plurality of wet treatment means has an introduction passage having an introduction port for introducing a wet treatment liquid at one end and a wet post-wet treatment at one end. A discharge passage for discharging the treatment liquid to the outside of the wet treatment system is formed, and an opening for opening the introduction passage and the discharge passage at the other end toward the object to be treated is formed. A pair of nozzle constructions formed by a pair of nozzles, and the nozzle constructions are arranged so that the sides provided with the openings are opposed to each other with a gap therebetween, and the object to be processed is conveyed between the opposed portions to perform a wet treatment. It is characterized by being performed.

As described above, in the wet processing apparatus of the fourth embodiment, the object to be processed is arranged so as to be inclined in the processing region where the wet processing and the drying processing are performed.
Since the wet treatment means is composed of the pair of nozzle constituents having the above-mentioned configuration, the amount of the wet treatment liquid used can be further reduced, and the amount of the drying gas used in the drying step after the wet treatment step can be reduced. It is possible to reduce the size of the equipment, and without using a large amount of equipment and occupied space in the wet treatment process and the drying process, the wet treatment and the drying can be rationally used in the production line, and the large-scale coating can be used. It is possible to provide an apparatus capable of sufficiently handling wet processing and drying of a processed material.

The wet processing apparatus according to the fifth aspect is the wet processing apparatus according to the third or fourth aspect, wherein the distance between the facing opposing portions of the pair of nozzle assemblies is a, and the opening of the nozzle assembly is Where the width in the direction along which the object to be processed is conveyed is b and the inclination angle of the object to be processed that is conveyed between the facing portions of these nozzle structures is θ, 0 <θ
By satisfying the condition of <arctan (a / b), the wet treatment liquid can be stably supplied to and drained from each nozzle constituent, and moreover, the object to be treated is not brought into contact with these nozzle constituents, This is preferable in that the object to be processed can be carried between the facing portions of the pair of nozzle constituents to perform the wet processing.

In the wet processing apparatus of the present invention having any one of the above-mentioned constitutions, the inclined transfer mechanism is an apparatus for performing the inclined transfer at an angle at which the processing object moves in the moving direction of the processing object moving in the processing chamber. It is characterized by being.

In the wet processing apparatus of any one of the above-described configurations of the present invention, the drying mechanism is movable so that when the object is dried, the amount of movement (conveyance) of the object is transferred. Even if the speed is low, the surface of the object to be processed can be efficiently dried by moving the drying mechanism. In such a case, the fixed drying mechanism can be used while the transportation speed of the object to be processed is high. Compared with the case where the surface of the object to be processed is dried, the dry processing area can be shortened and the wet processing apparatus can be downsized. Further, in the wet processing devices of the third to fourth embodiments, the wet processing means may be movable.

Further, in the wet processing apparatus of the present invention having any one of the above-mentioned constitutions, holding means for holding an object to be processed is provided in the processing chamber, and the holding means is provided near the end of the object to be processed. It is preferable that a porous member is provided in the position where it is in contact or non-contact with the end of the object to be treated. Moreover, it is desirable that the porous member be hydrophilic. When the holding means as described above is provided in the processing chamber, the wet treatment liquid adhered to the surface of the object to be treated after the wet treatment when the aqueous treatment liquid (solvent is water) is used as the wet treatment liquid. Since the liquid droplet of is absorbed by the above porous member by the capillary phenomenon, the liquid film of the wet treatment liquid adhering to the surface of the object to be treated can be thinned, and in particular,
When the processing chamber is provided with a dry processing region,
Since the droplets of the wet treatment liquid adhering to the surface of the object to be treated are absorbed by the above porous member by the capillary phenomenon,
The liquid film of the wet processing liquid adhering to the surface of the object to be processed can be thinned, the amount of drying gas used in the drying processing area can be reduced, and in this way, the amount of drying gas used is small. Since there is no mist generated in the processing chamber,
Therefore, it is not necessary to upsize the processing chamber in order to prevent the contamination of the object to be processed due to this mist.

Further, in the wet processing apparatus according to any one of the third to fifth aspects, the pair of nozzle constituents,
Nozzle structure / processing object relative for processing the entire area of the processing surface of the processing object by relatively moving the pair of nozzle components and the processing object along the processing surface of the processing object By having a moving means, it is possible to perform wet processing on the entire surface to be processed of the object to be processed while maintaining the advantages of the nozzle structure, and a pair of nozzle structures to the object to be processed. Since it can be moved relative to each other, the conveyance distance of the object to be processed can be short, the wet processing area can be shortened, and specifically, the wet processing area can be slightly larger than the object to be processed. It is possible to further reduce the size of the wet processing apparatus. Further, in any of the first to fifth wet processing apparatuses, the conveyance mechanism is configured such that a central portion of a processing object in a width direction (a direction orthogonal to a transportation direction of the processing target object) is higher. It is preferable to have a function of conveying while curving. According to the wet processing apparatus having such a configuration, when the object to be processed is transported in the processing region to perform the wet processing or the drying process, the object to be processed is in the length direction (direction in which the object to be processed is transported). The wet treatment and the dry treatment are performed while being inclined, and the wet treatment and the dry treatment are performed while curving so that the central portion in the width direction becomes high. Therefore, the wet treatment and the dry treatment are performed only when the substrate 21 is inclined. Compared with the case of performing the drying treatment, the drainage of the treatment liquid after the wet treatment can be further improved, and the drying efficiency can be further improved.
In this case, it is more preferable that the shape of the drying mechanism (for example, the air knife) is also curved according to the curved shape of the object to be treated. In the second or fourth wet processing apparatus, it is preferable that the drying mechanism is arranged so as not to interfere with the transport mechanism,
Specifically, the drying mechanism arranged on the lower side of the object to be processed may be arranged between the conveying mechanisms, and further, the drying mechanism may be divided into plural pieces and arranged between the conveying rollers.
According to the wet processing apparatus having such a configuration, since the drying mechanism is arranged so as not to interfere with the transport mechanism, it is possible to prevent high-pressure air blown from the drying mechanism from being blocked by the transport mechanism. The treatment liquid after the wet treatment attached to the object to be treated can be efficiently dried by high pressure air. Further, examples of the object to be subjected to the wet treatment or the drying treatment by the wet treatment apparatus of the present invention include plastic substrates, glass substrates, substrates such as semiconductor substrates, etc. In the case of an apparatus that performs a wet treatment or a drying treatment while curving the center of the object to be processed in the width direction to be high, the object has a Young's modulus of 58 to 75 GPa.
It is preferable to use one within the range of 0.04 mm to 0.7 m when the object to be processed is a glass substrate.
It is preferably a glass substrate of m.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In the embodiment described below, the wet processing apparatus of the present invention is used as an object to be processed for several hundred mm.
Wet suitable for use in a step of performing a wet etching treatment on a substrate to be treated such as a large glass substrate having a square shape, preferably 1 to 2 square meters, a cleaning treatment (rinsing treatment), and then a drying treatment. A case of applying to a processing device will be described. [First Embodiment] FIG. 1 is a view showing the schematic arrangement of a wet processing apparatus according to the first embodiment of the present invention. Figure 2
FIG. 2 is a cross-sectional view showing a wet processing area, a cleaning processing area, and a drying processing area of the wet processing apparatus of FIG. 1. The wet processing apparatus 1 according to the first embodiment is a long processing chamber 1a in which a substrate to be processed (object to be processed) is subjected to wet processing and then dried.
And a loader 1 for feeding the substrate to be processed into the processing chamber 1a
0, the unloader 14 for taking out the substrate to be processed processed in the processing chamber 1a is roughly configured, and the substrate to be processed can be automatically transferred from the loader 10 to the unloader 14 through the processing chamber 1a. There is.

An etching treatment region (wet treatment region) 1 for supplying an etching liquid (wet treatment liquid) to a substrate to be processed and performing wet etching in the long processing chamber 1a.
1. A cleaning processing area (wet processing area) 12 for cleaning the processed substrate after etching and a drying processing area 13 for drying the processed substrate after cleaning are sequentially provided from the loader 10 side to the unloader 14 side. As shown in FIG. 2, partition walls 15 are vertically provided between the adjacent processing regions in the processing chamber 1a. Etching area 11
As shown in FIG. 2, a shower nozzle (wet processing means) 11 for supplying an etching liquid to the substrate to be processed 11 is provided therein.
A plurality of a are provided in the vertical direction with respect to the substrate to be processed 21 transported into the etching processing region 11. In addition, reference symbol S in the drawing indicates a conveyance direction (movement direction) of the substrate to be processed 21.

A shower nozzle (wet processing means) 12a for supplying a cleaning liquid to the substrate to be processed 21 is provided in the cleaning processing area 1 as shown in FIG.
A plurality of substrates 21 are provided in the vertical direction with respect to the substrate to be processed 21 that has been transported into the substrate 2. In addition, the dry processing area 1
An air knife (drying mechanism) 1 that blows high-pressure air (drying gas) onto the substrate 21 to be processed is shown in FIG.
The substrate 21 to be processed 3a is transported into the dry processing region 13.
In contrast, a plurality of them are provided in the vertical direction.

In the processing chamber 1a, the substrate 21 to be processed, which is sent into the processing chamber 1a by the loader 10, is transferred from the etching processing region 11 to the cleaning processing region 12 and the drying processing region 1.
Transport roller 2 for feeding to unloader 14 via 3
5 is provided. These transport rollers 25 ... Are located in the processing chamber 1a, that is, the etching processing area 11,
All of the cleaning processing region 12 and the drying processing region 13 are arranged so as to be inclined so that the substrate to be processed 21 can be conveyed by inclination. More specifically, the transfer rollers 25 ... The transfer target substrate 21 sent into the processing chamber 1a is in the moving direction (transfer direction).
It is arranged so that it can be conveyed at an angle so as to rise. More preferably, the transport roller 25 ... Is the processing chamber 1.
When the substrate 21 to be processed fed into the inside of the a is tilted at angles θ, 0.
It is desirable to arrange them so that they can be conveyed in an inclined state at an angle of 5 to 30 degrees, preferably about 1 to 15 degrees.

The wet etching process, the cleaning process, and the drying process are sequentially performed on the substrate to be processed 21 by using the wet processing apparatus 1 as shown in FIGS. 1 and 2 as follows. First, the substrate to be processed 21 is sent into the etching processing region 11 of the processing chamber 1a by the loader 10. Then, the processed substrate 21 sent into the etching processing region 11
While conveying the substrate 21 at an angle so as to rise in the moving direction (conveying direction) by the conveying rollers 25 ... Spray and wet etch. The substrate 21 to be processed here is in the moving direction (conveying direction)
S is the direction of movement from the loader 10 side to the unloader 14 side, in other words, the direction of movement from the left side to the right side of the paper surface of FIG.

Then, the substrate 21 to be processed after the wet etching is sent into the cleaning processing region 12. Then, the substrate to be processed 21 sent into the cleaning processing region 12 is conveyed by the transfer roller 25.
The substrate 21 to be processed is moved in the moving direction (conveying direction).
While being conveyed at an angle so as to rise, cleaning liquids such as ultrapure water, ozone water, and hydrogen water are sprayed onto both surfaces of the substrate 21 to be processed from the upper and lower shower nozzles 12a ... Rinse away the attached etching liquid.

Then, the cleaned substrate 21 is sent into the dry processing region 13. The upper and lower air knives 13a, ...
・ By blowing high pressure air from both sides of the substrate 21 to be processed,
After the cleaning liquid adhering to the surface in the cleaning region 12 is dried, it is transported to the unloader 14 and then stored in, for example, a cassette or the like.

According to the wet processing apparatus 1 of the first embodiment, the etching process is provided with the transfer rollers 25 ... As an inclined transfer mechanism for transferring the substrate 21 to be processed in an inclined state into the processing chamber 1a. In the region 11 and the cleaning process region 12, the substrate 21 to be processed is processed in a state of being arranged obliquely, and when the wet etching process or the cleaning process is performed in the etching process region 11 and the cleaning process region 12, an etching solution or The cleaning liquid is applied to the substrate 21 to be processed.
Since the processing liquid after the wet processing is efficiently separated from the substrate 21 to be processed in each processing region, the etching processing and the cleaning processing can be efficiently performed.

Further, according to the wet processing apparatus 1 of the first embodiment, the etching solution used in the etching processing area 11 for performing the wet processing of the previous step enters the cleaning processing area 12 for performing the wet processing of the subsequent step. Since this can be prevented (the etching liquid used in the previous process can be prevented from entering the subsequent process), the amount of the cleaning liquid used in the cleaning process region 12 in the subsequent process can be saved and the cleaning process region 12 can be shortened. The size of the wet processing device can be reduced. Further, when the step of performing the wet treatment in the subsequent step is a cleaning step using ultrapure water, the etching solution used in the etching processing region 11 for performing the wet processing in the previous step is the cleaning processing region 12 for performing the cleaning step in the subsequent step. Since it is possible to prevent entry into the cleaning process area 12, it is possible to reduce the amount of ultrapure water used in the cleaning process region 12 in the cleaning process, and the substrate 21 to be processed is 1-2.
Even if the size of m-square becomes large, the shortage of supply of ultrapure water can be improved, and therefore, wet processing such as wet etching or cleaning of a large substrate to be processed can be sufficiently dealt with.

Further, in the wet processing apparatus 1, the substrate 21 to be processed is processed not only in the etching processing region 11 and the cleaning processing region 12 but also in the drying processing region 13 in a state in which the substrate 21 is obliquely arranged. It is possible to prevent the cleaning liquid used in the cleaning processing region 12 for performing the wet processing of the above from entering the drying processing region 13 for performing the drying process in the subsequent process (the cleaning liquid used in the previous process can be prevented from entering the drying process in the subsequent process). Therefore, the liquid film of the cleaning liquid adhering to the surface of the substrate to be processed 21 before being sent to the dry processing region 13 can be made thin, and the amount of pressurized air used in the dry processing region 13 can be reduced. The pressure air consumption of the wet processing apparatus of this embodiment is 1/10 times or less of the pressure air consumption of the conventional wet processing apparatus shown in FIGS. 11 to 12. Rukoto can. Further, in this wet processing apparatus 1, since the amount of pressurized air used is small as described above, less mist is generated in the processing chamber 1a,
Therefore, it is not necessary to upsize the processing chamber 1a in order to prevent contamination of the substrate 21 to be processed due to this mist. Further, the exhaust air volume for preventing the contamination of the substrate to be processed due to the mist can be set to 1/10 times or less of the exhaust air volume of the conventional wet processing apparatus.

Therefore, in the wet processing apparatus 1 of the first embodiment, not only the amount of the wet processing liquid such as the etching liquid or the cleaning liquid used, but also the drying process after the wet processing such as the wet etching process or the cleaning process is used. The amount of drying gas used can be reduced, the device can be downsized, and the wet processing and drying process can be reasonably performed without using a large amount of equipment and occupation space, and can be used for a wet process in a manufacturing line. It is possible to provide an apparatus which can be dried and can sufficiently cope with wet processing and drying of a large substrate to be processed.

[0034] In the wet treatment apparatus 1 of the first embodiment has described the case the air knife 13a as drying mechanism is of fixed type, an arrow S ₂ direction (to be processed as shown in FIG. 3 An air knife 23a capable of moving (the moving direction of the substrate 21 and the opposite direction) may be provided. If the air knife 23a is movable in this way, when the substrate 21 to be processed is dried in the drying processing area 13, even if the movement amount (conveyance speed) of the substrate 21 to be processed is small, the air knife 23a is moved to S ₂ The surface of the substrate to be processed 21 can be efficiently dried by traversing in the same direction. In this case, the air knife 1 fixed while the transport speed of the substrate to be processed 21 is high.
Compared with the case where the surface of the substrate 21 to be processed is dried by 3a, the dry processing region 13 can be shortened, and the wet processing apparatus can be downsized.

[Second Embodiment] FIG. 4 is a view showing the schematic arrangement of a wet processing apparatus according to the second embodiment of the present invention. FIG. 5 is a sectional view showing a processing region of the wet processing apparatus of FIG. FIG. 6 is a cross-sectional view showing a configuration of a pair of push-pull type nozzles provided in the processing region of FIG. FIG. 7 is a view of the push-pull type nozzle of FIG. 5 viewed from the substrate 21 side. The wet processing apparatus 31 of the second embodiment includes a long processing chamber 31a for drying a substrate to be processed (object to be processed) and then drying the substrate, and the processing chamber 3a.
Loader 10 for feeding the substrate to be processed into processing chamber 1a, processing chamber 31
Unloader 14 for taking out the substrate to be processed processed in a.
The substrate to be processed is loaded by the loader 10
Can be automatically conveyed to the unloader 14 via the processing chamber 1a.

A processing region 32 in which an etching liquid (wet processing liquid) is supplied to the substrate to be processed to perform wet etching in the long processing chamber 31a, and then cleaning, cleaning and drying are performed.
Is provided. That is, in the apparatus according to the second embodiment, an etching treatment region (wet treatment region) for supplying an etching liquid (wet treatment liquid) to the substrate to be treated to perform wet etching and a cleaning treatment for cleaning the substrate after etching. The three processing regions, that is, the region (wet processing region) and the dry processing region for drying the substrate to be processed after cleaning can be shared by one processing region 32. In the processing region 32, as shown in FIG. 5, a pair of push-pull type nozzles (nozzle structure) as a wet processing means for supplying an etching liquid to the substrate 21 to be processed.
41, 41 are provided. In addition, reference symbol S in the drawing indicates a conveyance direction (movement direction) of the substrate to be processed.

FIG. 6 is a sectional view showing the schematic construction of a pair of push-pull type nozzles 41, 41 provided in the processing chamber 31a, and FIG.
It is the figure seen from the to-be-processed substrate 21 side. Each push-pull type nozzle 41 has an inlet passage 51a having an inlet 51a for introducing the etching liquid 50 as a wet processing liquid at one end, and an etching liquid after etching at one end (for the wet processing liquid after the wet processing). Discharged liquid) in the processing chamber 31
a, a discharge passage 52 having a discharge port 52a for discharging to the outside (outside of the wet processing system), and these introduction passages 51
The other end of each of the discharge passage 52 and the discharge passage 52 is connected to each other, and a connecting portion 53 facing the substrate to be processed 21 is provided. Is provided, and two openings 52b that open toward the target substrate 21 are provided at the other end of the discharge passage 52, which is called a flow-saving nozzle.
A region 55 for performing wet etching processing (wet processing) is formed in a space between the connecting portion 53 and the substrate to be processed 21.

A pressure controller (not shown) is provided on the discharge passage 52 side. This pressure control unit has a discharge port 5
It is composed of a decompression pump provided on the 2a side,
The first opening 51 is formed so that the etching liquid 50 contacting the substrate 21 to be processed flows into the discharge passage 52 after etching.
This is to balance the pressure of the etching solution in contact with the atmosphere of b (including the surface tension of the etching solution and the surface tension of the surface to be processed of the substrate to be processed) with the atmospheric pressure.

Therefore, a decompression pump is used for the pressure control unit on the side of the discharge passage 52, and the decompression pump controls the force of sucking the etching liquid 50 in the connecting unit 53 to bring it into contact with the atmosphere in the first opening 51b. The pressure of the etching liquid 50 (including the surface tension of the etching liquid and the surface tension of the surface to be processed of the substrate to be processed 21) and the atmospheric pressure are balanced. That is, the pressure P _{w of the} etching liquid (including the surface tension of the etching liquid and the surface tension of the surface to be processed of the substrate 21) of the etching liquid in contact with the atmosphere of the first opening 51 b and the atmospheric pressure P _a
By setting the relation with P _w ≈P _a , the etching liquid supplied to the substrate to be processed 21 through the first opening 51b and contacting the substrate to be processed 21 leaks to the outside of the push-pull type nozzle. Instead, it is discharged to the discharge passage 52. That is, the etching liquid supplied from the nozzle 41 onto the substrate to be processed 21 is the portion on the substrate to be processed 21 supplied with the etching liquid (first and second openings 51b and 52b).
It is removed from the surface of the substrate 21 without contacting other parts.

The push-pull type nozzles 41, 41 having such a structure are provided so that the connecting portions 53, 53 face each other with a gap. That is, in the push-pull type nozzles 41, 41, the first openings 51b, 51b also face each other with a gap, and the second openings 52b, 52b also face each other with a gap. Such a pair of pushes
Between the facing portions of the pull-type nozzles 41, 41 (the first opening 51
The substrate 21 to be processed is transferred to a transfer roller (transfer mechanism) 25 to be described later between b and 51b, between the connecting portions 53 and 53, and between the second openings 52b and 52b, and the processed substrate 21 and A region 55 between the push-pull type nozzles 41, 41,
An etching process (wet process) can be performed at 55.

The liquid contact surface of each push-pull type nozzle 41 is made of a fluororesin such as PFA, stainless steel having a passivation film surface whose outermost surface is made of only chromium oxide, or aluminum oxide and chromium, depending on the wet treatment liquid used. It is preferable to use stainless steel having a mixed oxide film on its surface and titanium having an electropolishing surface for ozone water because impurities are not eluted into the wet treatment liquid.
If the liquid contact surface is made of quartz, it is preferable to supply all the cleaning liquids except hydrofluoric acid.

Inlet 5 of each push-pull type nozzle 41
A wet treatment liquid generation unit (not shown) and a wet treatment liquid regeneration unit (not shown) are connected to 1a. In addition, a wet treatment liquid regenerator (not shown) is connected to the outlet 52a of each push-pull type nozzle 41. The wet treatment liquid regenerating unit is provided with a filter (not shown) for removing particles and foreign matters contained in the wet treatment liquid after use, and the wet treatment after passing through this filter is It is supplied again to the nozzle 41. Further, a valve mechanism (not shown) is provided at the introduction port 51a, and it is possible to switch between introducing a new wet treatment liquid and a regenerated wet treatment liquid by this valve mechanism.

A pair of push-pull type nozzles 41, 41
Between the facing portions (between the first openings 51b and 51b or between the connecting portions 53 and 53 or between the second openings 52b and 52b) on the side having the opening of the push-pull type nozzle,
Width in the direction along the conveyance direction of the object to be processed (first opening 5
The width from 1b to the second opening portion 52b) is b, and the facing portions of the push-pull type nozzles 41, 41 (between the first opening portions 51b, 51b, connecting portions 53, 53, and the second portion). The substrate 21 to be processed which is transported to the opening 52b, 52b).
Where θ is the inclination angle of 0 <θ <arctan (a / b)
By satisfying the following condition, the etching liquid 50 can be stably supplied / drained to / from each nozzle, and moreover, the substrate 21 to be processed is pushed / pulled by these push / pull type nozzles 41, 4.
This is preferable in that the substrate 21 to be processed can be carried between the facing portions of the pair of push-pull type nozzles 41, 41 without contacting the substrate 1 to perform wet etching processing.

When the inclination angle θ of the substrate 21 to be processed is 0 or less, the substrate 21 is placed between the facing portions of the nozzles 41, 41.
Is transported horizontally or the substrate 21 is transported at an angle that descends in the transport direction (moving direction) S (transported with a negative inclination), and the etching liquid used in the previous step is the cleaning step in the subsequent step. It is easy to get in, and the desired effect cannot be obtained. The inclination angle θ of the substrate 21 to be processed is arctan
When it is (a / b) or more, it is difficult to stably supply / drain the etching liquid 50 to / from each nozzle 41, and the substrate 21 to be processed has the connecting portion 53 of the push-pull type nozzles 41, 41 and the first portion. Or, there is a case where the second openings 51b and 52b are contacted.

In the processing area 32 of the processing chamber 31,
As shown in FIG. 5, a pair of push-pull type nozzles (wet processing means) 42, 42 for supplying a cleaning liquid (wet processing liquid) to the target substrate 21 are provided. The pair of push-pull type nozzles 42, 42 is a pair of push-pull type nozzles 41, 4 for wet etching processing.
It is provided on the post-process side of 1 (downstream side in the moving direction S of the substrate to be processed 21). The pair of push-pull type nozzles 42, 42 has the same structure as the pair of push-pull type nozzles 41, 41 shown in FIG. 6, but the introduction of each push-pull type nozzle (wet processing means) 42. Passage 5
The wet treatment liquid introduced into the No. 1 and discharged from the discharge passage 52 through the region 55 is the cleaning liquid 70. Between the pair of such push-pull type nozzles 42, 42 facing each other (between the first openings 51b, 51b, between the connecting portions 53, 53, between the second openings 52b, 52b) Board 21
Are transported to a transport roller (transport mechanism) 25 to be described later, and a cleaning process (wet process) can be performed in regions 55 and 55 between the substrate 21 to be processed and the push-pull type nozzles 42 and 42. .

A pair of push-pull type nozzles 42, 42
Between opposing facing portions (between the first opening portions 51b and 51b or between the connecting portions 53 and 53 or the second opening portions 52b and 52).
(b)), the distance is a, the side having the opening portion of the push-pull type nozzle, and the width in the direction along the conveyance direction of the object to be processed (first
From the opening 51b to the second opening 52b) of the push-pull type nozzles 42, 42 facing each other (between the first openings 51b, 51b, the connecting portion 53,
0 <θ <ar, where θ is the inclination angle of the substrate to be processed 21 transported to the second opening 52b, 52b).
By satisfying the condition of ctan (a / b), the cleaning liquid 70 can be stably supplied to and discharged from each nozzle,
Moreover, the substrate 21 to be processed is carried between the facing portions of the pair of push-pull type nozzles 42 and 42 without contacting the substrate 21 to be processed with the push-pull type nozzles 42 and 42 to perform a cleaning process. It is preferable because it can be obtained.

When the inclination angle θ of the substrate 21 to be processed is 0 or less, the substrate 21 is interposed between the facing portions of the nozzles 42, 42.
Will be transported horizontally or the substrate 21 will be transported at an angle that descends in the transport direction (moving direction) S (transported with a negative inclination), and the cleaning liquid used in the previous step will be used in the subsequent drying step. It is easy to get in, and the desired effect cannot be obtained. The inclination angle θ of the substrate 21 to be processed is arctan (a /
If b) or more, it is difficult to stably supply / drain the cleaning liquid 70 to / from each nozzle 42, and the substrate 21 to be processed is connected to the connecting portion 53 of the push-pull type nozzles 42, 42 and the first and second nozzles. The openings 51b and 52b may come into contact with each other.

Particularly, in the push-pull type nozzle 42 used here, as shown in FIG. 6, while the substrate 21 to be processed is subjected to the wet treatment (particularly the cleaning treatment), the connecting portion 23 is
It is preferable to provide an ultrasonic transducer 60 for applying ultrasonic vibration to the wet processing liquid (particularly the cleaning liquid) in the area 55. This ultrasonic transducer 60 is provided on a vibrating plate (vibrating portion) 66, a side plate (side wall portion) 67 rising from the peripheral edge of the main surface of the vibrating plate 66, and on the main surface of the vibrating plate 66 inside the side plate 67. The vibration plate 66 is provided with an ultrasonic vibrator main body 68 for applying ultrasonic vibration. The side plate 67 is formed integrally with the diaphragm 66.
As a material forming the vibrating plate 66 and the side plate 67,
It is selected and used from ceramics such as stainless steel, quartz, sapphire, and alumina. The ultrasonic transducer body 68 is connected to a power source (not shown).

The ultrasonic vibrator main body 48 is capable of outputting ultrasonic vibrations having a frequency in the range of about 20 kHz to about 10 MHz. , Ultrasonic cleaning is possible, and in particular, a frequency of 0.2 MHz or higher is preferable from the viewpoint of the thickness of the wet treatment liquid layer (cleaning liquid layer) that can be held, but with ultrasonic waves having a frequency of about 20 kHz. Wet treatment (particularly cleaning) is also possible. The ultrasonic transducer 60 includes upper and lower push-pull type nozzles 42, 42.
It does not have to be provided on both
It may be provided only on the pull-type nozzle 42.

Further, as shown in FIG. 5, an air knife (drying mechanism) 43 for blowing high-pressure air (drying gas) onto the substrate to be processed 21 in the processing region 32 is the substrate to be processed 2 after cleaning.
1 are provided in the vertical direction. These air knives 43, 43 are located on the post-process side (the processed substrate 21
(Downstream side in the moving direction S).

In the processing chamber 31a, there are provided transfer rollers 25 for transferring the substrate 21 to be processed, which has been sent into the processing chamber 31a by the loader 10, to the unloader 14 through the processing region 32 in the processing chamber 31. Has been. These transport rollers 25 ... Are inside the processing chamber 31a, that is,
In the processing region 32, the substrates 21 to be processed are arranged to be inclined so that the substrates 21 can be conveyed by inclination. For details, see the transport roller 25 ...
Are arranged so that the substrate to be processed 21 sent into the processing chamber 31a can be transported at an angle so as to rise in the moving direction (transporting direction). More preferably, the transport roller 25
... is the substrate to be processed 21 sent into the processing chamber 31a.
Is desirably arranged so that it can be conveyed in an inclined state under the condition of 0 <θ <arctan (a / b).

The wet etching process, the cleaning process, and the drying process are sequentially performed on the substrate to be processed 21 by using the wet processing apparatus 31 as shown in FIGS. 4 to 7 as follows. First, the substrate 21 to be processed is sent into the processing region 31 of the processing chamber 31a by the loader 10. Then, the substrate to be processed 21 sent into the processing area 32 is conveyed by the transfer rollers 25 ...
The first opening of each of the pair of push-pull type nozzles 41, 41 while being inclined and conveyed under the condition of 0 <θ <arctan (a / b) between the facing portions of the pair of push-pull type nozzles 41, 41. The etching liquid 50 is supplied from the portion 51b to the region 55, and is brought into contact with the substrate to be processed 21 for etching, and then the etching liquid 50 after being brought into contact with the substrate to be processed 21
It is discharged to the discharge passage 52 from the opening 52b. Here, the moving direction (conveying direction) S of the substrate to be processed 21 is the loader 1
The direction from the 0 side to the unloader 14 side, in other words, the direction from the left side to the right side of the paper surface of FIG.
In the wet etching process here, the substrate 21 to be processed is
However, when the substrate to be processed 21 passes between the facing portions of the pair of push-pull type nozzles 41, 41, the portions passing between the facing portions are sequentially etched instead of being etched at once.

Next, the substrate 21 to be processed after the wet etching is further conveyed by the transport rollers 25 ...
The cleaning liquid 70 such as ultrapure water, ozone water, hydrogen water or the like is supplied to the region 55 from the first opening portions 51b of the pair of push-pull type nozzles 42, 42 while being conveyed under an inclination of (a / b). Then, the cleaning liquid 70 after contacting the substrate 21 to be processed is washed with the second opening 52 after contacting the substrate 21 to be processed.
By discharging from b to the discharge passage 52, the etching liquid adhering to the surface in the etching process and the dirt such as particles adhering to the surface of the substrate 21 to be processed are cleaned. The moving direction (conveying direction) S of the substrate to be processed 21 here
Is the direction of movement from the loader 10 side to the unloader 14 side, in other words, the direction of movement from the left side to the right side of the paper surface of FIG. In the cleaning process here, the substrate to be processed 21 is processed.
However, when the substrate to be processed 21 passes between the facing portions of the pair of push-pull type nozzles 42, 42, the portion passing between the facing portions is sequentially washed, instead of cleaning both surfaces at once. At the time of cleaning the substrate 21 to be processed here, with the cleaning liquid 70 supplied to the region 55, the ultrasonic transducer body 6
It is preferable that ultrasonic vibration is applied by means of 8, and the substrate 21 to be processed is ultrasonically cleaned in cooperation with the cleaning liquid 70.

Then, the cleaning target substrate 21 is conveyed by the transfer rollers 25 ... While being inclined and conveyed at an angle such that the target substrate 21 rises in the moving direction (conveying direction) S, the upper and lower air knives 43, 43. High-pressure air is blown from both of these air knives 43, 43 to the both surfaces of the substrate to be processed 21 while being conveyed, and the cleaning liquid adhering to the surface in the cleaning step is dried and then conveyed to the unloader 14, and thereafter, for example, a cassette To house. In the drying step here, the both surfaces of the substrate to be processed 21 are not dried at once, but the substrate to be processed 2 is processed.
When 1 passes between the air knives 43, 43, the portions to which the high pressure air from the air knives 43, 43 is applied are sequentially dried.

According to the wet processing apparatus 31 of the second embodiment, the transfer roller 25 as an inclined transfer mechanism for transferring the substrate 21 to be processed into the processing chamber 31a in an inclined state.
The processing target substrate 21 is processed in a state in which the processing target substrate 21 is obliquely arranged in the processing region 32 in which is provided. Since the treatment liquid after the wet treatment is efficiently separated from the substrate 21 to be treated, the etching treatment and the cleaning treatment can be performed efficiently.

Further, according to the wet processing apparatus 31 of the second embodiment, it is possible to prevent the etching solution used in the wet etching process of the previous process from mixing with the cleaning liquid used in the cleaning process of the subsequent process (used in the previous process. Since it is possible to prevent the etching solution from entering the subsequent process), it is possible to reduce the amount of cleaning liquid used in the cleaning process in the subsequent process, shorten the cleaning process, and downsize the wet processing device. . Further, when the step of performing the wet process of the subsequent step is a cleaning step using ultrapure water, it is possible to prevent the etching solution used in the etching process of performing the wet processing of the previous step from entering the cleaning step of the subsequent step, It is possible to reduce the amount of ultrapure water used in the cleaning step, and it is possible to improve the supply shortage of ultrapure water even if the substrate 21 to be processed is large in size of 1 to 2 m square, and thus wet the large substrate to be processed It can sufficiently support wet processing such as etching processing and cleaning processing.

Further, in the wet processing apparatus 31, the substrate 21 to be processed is also processed in the obliquely arranged state even in the drying step, and the cleaning liquid used in the wet processing in the previous step enters the drying step in the subsequent step. Since it can be prevented, the liquid film of the cleaning liquid adhering to the surface of the substrate 21 to be processed before being sent to the drying process can be thinned, and the amount of the pressurized air used in the drying process can be reduced. Since the amount of pressurized air used is small, the amount of mist generated in the processing chamber 31a is also small. Therefore, in order to prevent contamination of the substrate 21 to be processed due to this mist, the processing chamber 31a is prevented.
There is no need to upsize a.

Further, in the wet processing apparatus 31, the wet processing means is a pair of push / push units having the above-mentioned structure.
Each of the introduction passages 5 is composed of the pull type nozzles 41, 41 and the pair of push-pull type nozzles 42, 42.
When a wet processing liquid such as an etching liquid or a cleaning liquid is supplied from 1 to the surface of the substrate to be processed, it is possible to remove the removed product from each discharge passage 52 without contacting the surface of the substrate to be processed other than the part to which the processing liquid is supplied. Since the processing solution containing (removed from the substrate to be processed) can be discharged to the outside, wet processing such as wet etching processing and cleaning processing can be efficiently performed (sufficient cleanliness is obtained when the wet processing solution is a cleaning solution). can get). In addition, from the discharge port (the end opposite to the end where the opening is provided) at the other end of the discharge passage with respect to the pressure of the wet processing liquid at the opening (region 55) of each push-pull type nozzle. The wet processing liquid can be discharged without leaking to the outside of the nozzle by controlling the suction force of, so that sufficient wet processing with a small amount of processing liquid (sufficient cleanliness when the wet processing liquid is a cleaning liquid) Can be obtained).

Further, in this wet processing apparatus 31, since the wet processing means employs the pair of push-pull type nozzles having the above-mentioned constitution, when the wet processing liquid is supplied to the surface of the substrate to be processed, the processing liquid is supplied. The wet processing liquid can be discharged without coming into contact with the surface of the substrate to be processed other than the supplied portion, and since the substrate to be processed 21 in the processing chamber 31a is conveyed in an inclined state, Since it is possible to prevent the cleaning liquid used in the wet processing from entering the subsequent drying step, it is possible to dry the wet processing step such as wet etching and cleaning in one processing area without dividing the processing chamber into multiple processing areas. The steps can be sequentially performed, the size of the processing chamber can be set to a size in which the substrate to be processed can be accommodated, and the size can be reduced.

Therefore, in the wet processing apparatus 31 of the second embodiment, the substrate 21 to be processed is arranged in a slanted manner in the processing region 32, and the wet processing means is a pair of push-pull type having the above-mentioned configuration. Since it is composed of nozzles, the amount of wet processing liquid such as etching liquid and cleaning liquid can be further reduced, and the amount of drying gas used in the drying process after the wet processing process can be reduced. Since the device can be downsized, it can be used reasonably for wet processing and drying in a production line without spending a large amount of equipment and occupied space in the wet processing and drying steps. It is possible to provide an apparatus capable of sufficiently handling wet processing and drying of a processed substrate.

In the wet processing apparatus 31 of the second embodiment, the case where the nozzles used in the wet etching step and the cleaning step are both a pair of push-pull type nozzles having the above-mentioned configuration has been described. It is also within the scope of the present invention to use a pair of push-pull type nozzles in one of the cleaning step and the cleaning step and use a normal shower nozzle in the other step.

[0062] In the wet treatment apparatus 1 of the second embodiment has described the case the air knife 13a as drying mechanism is of fixed type, an arrow S ₂ direction (to be processed as shown in FIG. 8 An air knife 83 that is movable in the moving direction of the substrate 21 or the opposite direction may be provided.
If the air knife 83 is movable in this way,
When the substrate 21 to be processed is dried in the processing region 32, even if the movement amount (conveyance speed) of the substrate 21 to be processed is small, the air knife 83 is traversed in the S ₂ direction to efficiently dry the surface of the substrate 21 to be processed. In this case, compared to the case where the surface of the substrate to be processed 21 is dried by the fixed air knife 13a while the conveyance speed of the substrate to be processed 21 is high, the drying step is performed. It can be shortened and the wet processing apparatus can be downsized.

In the wet processing apparatus of the second embodiment, the case where the pair of push-pull type nozzles as the wet processing means is the fixed type has been described, but the pair of push-pull type nozzles move. Possible nozzle moving means (nozzle structure / object relative moving means)
May be provided. As a specific example of the nozzle moving means, as shown in FIG. 9, a pair of rack bases 92, 92 facing each other with a predetermined interval are provided, and a pair of push-pull type nozzles are provided between the rack bases 92, 92. 41, 41 are installed. Each rack base 92 is provided with a slider 94 that is movable along a linear guide 93 formed on the rack base 92, and a column 95 is erected on the upper surface of each slider 94. Both ends of each push-pull type nozzle 41 are fixed. A drive source such as a motor 96 is installed on each slider 94, and each slider 94 is configured to be self-propelled on the rack base 92. A pair of push-pull type nozzles 42, 42 (not shown) are provided between the rack bases 92, 92.
The pull-type nozzles 41, 41 are installed in the same manner. The pair of push-pull type nozzles 41, 41 and the pair of push-pull type nozzles 42, 42 move along the rack bases 92, 92 while keeping a constant distance from the substrate 21, thereby covering the substrate 21. The entire processing surface is wet-processed.

When such a nozzle moving means (nozzle structure / object relative moving means) is provided, the substrate 21 to be processed can be processed while maintaining the advantages of the pair of push-pull type nozzles having the above-mentioned structure. The entire processing surface can be wet-processed, and the pair of push-pull type nozzles can be moved relative to the substrate 21 to be processed. The area can be shortened, specifically, the wet processing area can be made slightly larger than the object to be processed, and the wet processing apparatus can be further downsized.

In the wet processing apparatuses of the first and second embodiments, holding means for holding the substrate 21 to be processed is provided in the processing chamber (particularly in the dry processing area 13 in the first embodiment). Good. In FIG. 10, holding means 97 for sandwiching the substrate to be processed 21 from both sides is provided. A holder support plate 98 is provided at each corner of the holding means 97. A drive source (not shown) such as a cylinder is provided on each of the holder support plates 98, and the support plate 98 is attached to the substrate 21 after the wet process by operating the drive source to rotate the support plate 98 back and forth or left and right. The wet processing liquid can be dried. Also, the holding means 9
In FIG. 7, a porous member 97a made of alumina or the like is provided at a portion located in the vicinity of the end of the substrate to be processed 21 in contact with or not in contact with the end of the substrate to be processed 21 (non-contact in the drawing). preferable. The porous member 97a is the processed plate 21.
If the porous member 97a
The distance between the substrate 21 and the substrate 21 is preferably about 1 mm or less.

When the holding means 97 provided with such a porous member 97a is provided in the processing chamber, the droplets of the wet processing liquid adhering to the surface of the substrate 21 to be processed after the wet processing are capillaries. Since it is absorbed by the porous member 97a due to the phenomenon, the liquid film of the wet processing liquid adhering to the surface of the substrate to be processed 21 can be made thin, and in particular, the drying chamber 13 is provided in the processing chamber. in case of,
Since the droplets of the wet processing liquid adhering to the surface of the substrate to be processed 21 are absorbed by the porous member 97a by the capillary phenomenon, the liquid film of the wet processing liquid adhering to the surface of the substrate to be processed 21. Since the amount of drying gas used in the drying processing region 13 can be reduced and the amount of drying gas used can be small, mist generated in the processing chamber is small, and therefore It is not necessary to enlarge the processing chamber to prevent the contamination of the object to be processed due to the mist.

Although the case where the holding member 97 is provided with the porous member 97a made of alumina or the like in the portion located in the vicinity of the end portion of the substrate to be processed 21 has been described here, the holding member 97 has a large number of holes. It may be included, or may be formed from a porous material such as alumina. Further, when a large number of holes are formed in the holding means 97, a suction mechanism may be provided in the holding means 97 to suck the droplets of the wet processing liquid.

[Third Embodiment] Next, the third embodiment of the present invention will be described.
13 to FIG. 1 regarding the wet processing apparatus of the embodiment of FIG.
This will be described using 5. The wet processing apparatus 201 of the third embodiment is different from the first embodiment shown in FIGS. 1 to 3 in that an air knife (drying) provided in a dry processing region 13 provided in a long processing chamber 1a is used. The structure is different from the size of some of the transport rollers. Figure 13
FIG. 14 is a cross-sectional view showing a dry processing region 13 provided in the processing chamber 1a of the wet processing apparatus of the third embodiment, and FIG.
13 is a sectional view taken along line XIV-XIV in FIG. 13, and FIG.
Lower air knife 2 provided in the drying treatment area 13 of the
13a is a plan view of the substrate 13a as viewed from the substrate 21 side. FIG. In the drying processing area 13 of the present embodiment, as shown in FIGS. 13 and 14, an air knife (drying mechanism) 21 that blows high-pressure air (drying gas) 215 onto the substrate 21 to be processed.
The substrate 21 to be processed 3a is transported into the dry processing region 13.
With respect to the vertical direction.

Each air knife (drying mechanism) 213a is provided in the box-shaped air knife body 213b, the air supply pipe 213c for supplying the high pressure air 215 into the air knife body 213b, and the substrate 21 side of the air knife body 213b. The nozzle opening 213d is formed. The air knife body 213b is formed in a V-shape in plan view as shown in FIG. 15, and has a top portion (V-bottom portion) 21.
3f is formed so as to be located at the center in the left-right direction and on the drying process start side (upper side in the substrate moving direction). Further, the nozzle opening 213d is also formed in a V shape in plan view as shown in FIG. 15, and a top portion (V-shaped bottom portion) 213e is a central portion in the left-right direction (a central portion in a direction orthogonal to the moving direction S of the substrate to be processed 21). In other words, it is formed so as to be located at the central portion in the width direction of the substrate to be processed 21) and on the drying process start side (upper side in the substrate moving direction). Then, each of the air knives 213a is connected to the high pressure air 21 from the air supply pipe 213c into the air knife main body 213b.
5 is supplied to the high pressure air 215 from the nozzle opening 213d.
Are ejected toward the surface of the substrate to be processed 21 (the upper nozzle opening 213d is the upper surface of the substrate to be processed 21 and the lower nozzle opening 213d is the lower surface of the substrate to be processed 21). .

Further, in this embodiment, the drying processing area 13
The lower air knife 2 of the transfer rollers 25 provided inside
The transport roller 25 provided below 13a (the air knife 213a provided below the substrate 21 to be processed) secures a space for the air knife between the substrate 21 to be processed and the rotating shaft, so that it is provided at another position. The outer diameter of the transport roller 25 is larger than that of the transport roller 25. The transfer roller 25 having a large outer diameter (the transfer roller 26 having a large diameter) is arranged in the left-right direction of FIG. A plurality (four in the drawing) are provided. It should be noted that the large-diameter transport roller 2 provided below the lower air knife 213a.
A plurality of transport rollers 25 other than 6 are also provided in the left-right direction in FIG. Large diameter transport roller 26 and this transport roller 26
The rotation speed of the rotation shaft 25c is adjusted so that the movement process of the outer diameter portion is the same as that of the other transport rollers 25 (so that the movement distance of the target substrate 21 is the same). Further, it is desirable that the transfer rollers 25 and 26 are arranged so that the substrate to be processed 21 fed into the processing chamber 1a can be transferred in a state of being inclined at an inclination angle θ. The inclination angle θ is 0.5 to 30 degrees, preferably 1 to 15 degrees.

The lower air knife 213a is arranged between the transfer rollers so as not to interfere with the transfer rollers as shown in FIG. Specifically, as shown in FIG. 15, the left side portion 213g of the main body 213b of the lower air knife 213a is arranged between the first and second conveyance rollers 26 from the left side, and the right side portion 213h is one from the right side. Eyes and 2
The top portion 213f is arranged between the second transfer rollers 26, and is provided on the extension line of the center between the two transfer rollers 26 at the center on the dry processing start side (the upper side of the substrate moving direction). Moreover, the top portion 213f is provided with the two central transport rollers 26.
It is arranged on the lower side in the substrate moving direction with respect to the two central transfer rollers 25 provided on the drying processing start side (the upper side in the substrate moving direction). Also, this lower air knife 21
As shown in FIGS. 13 and 14, the main body 213b of 3a is provided between the rotation shaft 25c of the transport roller 26 and the substrate 21 to be processed. The upper and lower air knives 213a are provided for the substrate 21 when the substrate 21 to be processed is conveyed between them.
The distance between the upper air knife 213a and the upper air knife 213a is about 1 to 10 mm.
The distance from 3a is also set to be about 1 to 10.

Wet processing apparatus 2 of the third embodiment
The step of sequentially performing the wet etching process, the cleaning process, and the drying process on the substrate to be processed 21 using 01 is performed in the same manner as the process using the wet processing apparatus 1 of the first embodiment described above except the drying process. be able to. In order to perform the dry processing by using the wet processing apparatus 201, the cleaned processing target substrate 21 sent into the drying processing region 13 is lifted in the moving direction (conveying direction) by the transfer roller 25. Each nozzle opening 213d of the upper and lower air knives 213a and 213a while being conveyed at an angle such that
The high-pressure air 215 is blown onto both surfaces of the substrate to be processed 21 to dry the cleaning liquid adhering to the surface in the cleaning processing region 12. Then, the substrate to be processed 21 after drying is loaded into the unloader 1
4 and then accommodated in, for example, a cassette or the like.

High pressure air 2 is supplied from each of the nozzle openings 213d described above.
When 15 is blown out, as described above, each nozzle port 2
Since 13d is formed in a V shape in a plan view, the air flow 216 of the high-pressure air 215 blown out from each nozzle opening 213d flows obliquely. Therefore, as shown in FIG. Accordingly, on the plate end surface 21b, an air flow 217 is generated from the central portion corresponding to the top portion 213e of the nozzle opening 213d to both outer sides. As a result, the water droplets (cleaning liquid) that are about to remain on the plate end surface 21b are moved by the air flow 217 so as to be pulled toward both end portions in the width direction of the plate end surface 21b of the substrate 21 to be processed, and the water droplets collect at each end portion. By doing so, after it becomes a large polka dot, it separates from each end one after another and is splashed outward. As a result, it is possible to reliably remove the water droplets that are about to remain on the plate end surface 21b. Further, since each nozzle opening 213d has a V-shape, the front-rear length of each air knife (the length along the length direction of the substrate 21 to be processed, in other words, the direction along the moving direction of the substrate 21 to be processed). Even if the length is shortened, the inclination angle α of the nozzle opening 213d with respect to the substrate 21 to be processed can be made sufficiently large, so that when the processing substrate 21 has the same width, the inclination angle α of the nozzle opening 213d can be increased. It is possible to improve the breakage of water droplets on the end surface 21d of the substrate to be processed 21 and to increase the transport speed of the substrate to be processed 21,
The drying efficiency can be improved.

Wet processing apparatus 201 of the third embodiment
According to this, in particular, the shape of the air knife 213a provided on the lower side of the substrate to be processed 21 is V-shaped, and the air knife 213a is arranged so as not to interfere with the transfer rollers 25 and 26, and the nozzle opening Since 213d is not blocked by the transport rollers 25, 26 and the rotary shaft 25c, the cleaning liquid adhering to the substrate to be processed 21 can be efficiently dried by the high pressure air 215 blown out from the nozzle opening 213d.

[Fourth Embodiment] Next, the fourth embodiment of the present invention will be described.
16 to FIG. 1 regarding the wet processing apparatus of the embodiment of FIG.
This will be described using 8. The wet processing apparatus 301 of the fourth embodiment is different from that of the third embodiment shown in FIGS. 13 to 15 in that the lower air knife of the air knives (drying mechanism) provided in the dry processing area 13 is configured. Is different, and the outer diameter of the transport roller 25 is the same. FIG. 16 is a cross-sectional view showing a dry processing region 13 provided in the processing chamber 1a of the wet processing apparatus of the fourth embodiment, and FIG. 17 is a cross-sectional view taken along line XVII-XVII of FIG. FIG. 17 is a plan view of the lower air knife 313a provided in the dry processing region 13 of FIG. 16 when viewed from the substrate 21 side. In the dry processing area 13 of the present embodiment, as shown in FIGS. 16 and 17, the dry processing area 13 is provided.
An air knife (drying mechanism) 213a is provided on the upper side and an air knife (drying mechanism) 313a is provided on the lower side with respect to the substrate 21 to be processed. Since the upper air knife 213a has the same configuration as that of the third embodiment, its explanation is omitted.

Lower air knife (drying mechanism) 313a
However, what is different from the air knife 213a of the third embodiment is that it is divided into a plurality of parts. Specifically, the air knife main body 313b is the air knife main bodies 313b1 and 31.
It is divided into 3b2 and 313b3. The air knife body 313b1 has a box shape, and its plane shape is formed in a V shape as shown in FIG.
A bottom portion) 313f is formed so as to be located at the center portion in the left-right direction and on the drying process start side (upper side in the substrate moving direction). In this air knife body 313b1,
An air supply pipe 313c1 for supplying high-pressure air 215 is provided in the main body 313b1, and the main body 313b is also provided.
A nozzle port 313d1 is formed on the No. 1 substrate 21 side. Further, the nozzle opening 313d1 is also formed in a V-shape in plan view as shown in FIG. 18, and has a top portion (V-shaped bottom portion) 31.
3e is the central portion in the left-right direction (the movement direction S of the substrate 21 to be processed).
A central portion in a direction orthogonal to the substrate 2, in other words, the substrate 2 to be processed.
It is formed so as to be located at the center portion in the width direction 1) and on the drying processing start side (the upper side in the substrate moving direction).

The air knife main body 313b2 has a box shape, and its planar shape is a parallelogram shape as shown in FIG. This air knife body 313b2
Is provided with an air supply pipe 313c2 for supplying high-pressure air 215 into the main body 313b2.
A nozzle port 313d2 is formed on the substrate 13 side of 13b2. The nozzle opening 313d2 is also formed in a parallelogrammatic shape in plan view as shown in FIG. The air knife main body 313b3 has a box shape, and its planar shape is a parallelogram shape as shown in FIG. The air knife body 313b3 has a body 31
Air supply pipe 313 for supplying high-pressure air 215 into 3b3
c3 is provided, and a nozzle port 313d3 is formed on the processed substrate 21 side of the main body 313b3. The nozzle opening 313d3 is also formed in a parallelogrammatic shape in plan view as shown in FIG. And the air knife 31
3a is an air supply pipe 313c1, 313c2, 313c.
3 to the corresponding air knife bodies 313b1 and 313b
The high-pressure air 215 is supplied into 2, 313b3, and the high-pressure air 215 is ejected from the nozzle openings 313d1, 313d2, 313d3 toward the lower surface of the substrate 21 to be processed.

Further, in this embodiment, the drying processing area 13
The outer diameters of the transport rollers 25 provided inside are the same. Further, it is desirable that the transfer rollers 25 are arranged so that the substrate to be processed 21 fed into the processing chamber 1a can be transferred in a state of being inclined at an inclination angle θ. The inclination angle θ is 0.5 to 30 degrees, preferably 1 to 15 degrees.

The air knife body 313b is shown in FIG.
As shown in FIG. 8, they are arranged between the transport rollers 25 so as not to interfere with the transport rollers. More specifically, as shown in FIG. 18, the air knife main body 313b1 includes a rotary shaft 2 serving as a reference.
5c (rotating shaft 25c provided in the vicinity of the air knife main body 213a shown in FIG. 17) is provided on the drying process start side (the upper side in the substrate moving direction). This body 313b
The top portion 313f of No. 1 is provided on the drying processing start side on the central extension line between the two central transport rollers 25 provided on the reference rotating shaft 25c.
3f is arranged on the lower side in the substrate moving direction with respect to the two central transfer rollers 25 provided on the rotating shaft 25c arranged on the drying processing start side of the above-described rotating shaft 25c. Further, the end portion of the left side portion 313g1 of the main body 313b1 is formed so as to be arranged on the lower side of the substrate moving direction than the top portion 313f side, and the end portion of the right side portion 313h1 is formed in the substrate moving direction rather than the top portion 313f side. It is formed so as to be arranged on the lower side.

The air knife main body 313b2 is arranged on the lower side in the substrate moving direction with respect to the first and second transfer rollers 25 from the right side of the transfer rollers 25 provided on the reference rotating shaft 25c. The end of the right side portion 313h2 of the main body 313b2 is arranged on the lower side in the substrate moving direction than the end of the left side portion 313g2. The air knife body 313b3 has a rotary shaft 25c serving as the above reference.
It is arranged on the lower side in the substrate moving direction with respect to the first and second transfer rollers 25 from the left side of the transfer rollers 25 provided in. Also, the left side portion 313g3 of the main body 313b3
Is arranged on the lower side in the substrate moving direction than the end of the right side portion 313h3.

Wet treatment apparatus 3 of the fourth embodiment
The step of sequentially performing the wet etching process, the cleaning process, and the drying process on the substrate to be processed 21 using 01 is performed in the same manner as the process using the wet processing apparatus 1 of the first embodiment described above except the drying process. be able to. In order to perform the drying process using the wet processing apparatus 301, the substrate to be processed 21 after cleaning, which has been sent into the drying process region 13, is lifted in the moving direction (conveying direction) by the transfer roller 25. The nozzle opening 213d of the upper air knife 213a and the nozzle openings 313d1, 313d2, 3 of the lower air knife 313a are conveyed while being inclined and conveyed at such an angle.
High-pressure air 215 is blown onto both surfaces of the substrate to be processed 21 from 13d3 to dry the cleaning liquid adhering to the surface in the cleaning processing region 12. Then, the dried substrate 21 is transported to the unloader 14 and then stored in, for example, a cassette or the like.

The nozzle openings 313d1, 313d2,
When the high-pressure air 215 is blown out from the nozzle opening 313d3, the nozzle opening shape combining these nozzle openings 313d1, 313d2, 313d3 is formed in a substantially V shape, so that the air flow 2 of the high-pressure air 215 blown out from each nozzle opening is increased.
Since 16 flows with an inclination, as shown in FIG.
In accordance with the movement of the substrate 21 to be processed, at the plate end face 21b, an air flow 217 is generated from the central part corresponding to the top part 313e of the nozzle opening 313d1 to both outsides, whereby water drops (cleaning liquid) that are left on the plate end face 21b. Are moved by the air flow 217 so as to be pulled toward both ends of the plate end surface 21b of the substrate 21 to be processed in the width direction, and water droplets collect at each end to form a large water drop,
One after the other, they fly away from each end and fly outward. As a result, it is possible to reliably remove the water droplets that are about to remain on the plate end surface 21b.
Further, since the combined shape of the nozzle openings 313d1, 313d2, and 313d3 is a substantially V-shape, the air knife 313
Even if the front-rear length of a is shortened, the inclination angle α of each nozzle opening with respect to the substrate 21 to be processed can be made sufficiently large, and when the processing substrate 21 has the same width, the inclination angle α of each nozzle opening is The end surface 21 of the substrate 21 to be processed can be made large.
It is possible to improve the breakability of the water droplets of d, and the substrate to be processed 21
The transport speed of can be increased and the drying efficiency can be improved.

Wet processing apparatus 301 of the fourth embodiment
According to this, in particular, the divided air knife main body is arranged so as not to interfere with the transport roller 25, and the nozzle openings are not blocked by the transport roller 25 or the rotary shaft 25c, so that it adheres to the substrate 21 to be processed. The cleaning liquid thus prepared can be efficiently dried by the high pressure air 215 blown out from the nozzle port.

In the wet processing apparatus 301 of the fourth embodiment, the case where the outer diameters of the transport rollers 25 provided in the drying processing area 13 are the same has been described, but each rotation shown in FIG. Two transports arranged at the central portion in the left-right direction (the central portion in the direction orthogonal to the moving direction S of the substrate to be processed 21, in other words, the central portion along the width direction of the substrate to be processed 21) on the axis 25c. The outer diameter of the roller 25 is set to be larger than the outer diameter of the transport rollers 25 at both ends, and the end of the substrate 21 in the width direction is above the transport rollers 25 at both ends of each rotating shaft 25. A configuration may be used in which an upper conveyance roller is provided for sandwiching it. Figure 1
9 is a cross-sectional view showing the inside of the drying processing chamber 13 configured as described above, reference numeral 27 (25) is a large-diameter transfer roller, reference numeral 28 is an upper transfer roller, and reference numeral 28c is an upper transfer roller 28. It is a rotating shaft.

With this structure, when the processed substrate 21 after cleaning is fed into the dry processing region 13, both end portions in the width direction of the processed substrate 21 are sandwiched by the upper and lower transfer rollers 25 and 28, respectively. As a result, the central portion in the width direction of the substrate to be processed 21 is pushed up above the substrate 21 by the large-diameter transport roller 27, so that the substrate to be processed 21 is curved in the width direction, that is, the width of the substrate to be processed 21. The central part in the direction is located above both ends. When the substrate 21 to be processed is curved so that the central portion in the width direction becomes high, when the high-pressure air 215 is blown from the air knife 213a on the upper side, water droplets (cleaning liquid) attached to the substrate 21 are removed from the substrate 21. Since the liquid flows from the central portion to the end portion without stagnation, the liquid drainage and drying effects can be further improved as compared with the case where the substrate 21 to be processed is not curved. In this case, it is more preferable that the shape of the air knife body is also curved according to the curved shape of the substrate 21 to be processed. When drying is performed while curving the substrate 21 so that the central portion in the width direction becomes higher as described above, the distance between the substrate 21 and the air knife may be wider than that in the third embodiment.

In the above example, the central portion in the left and right direction (the substrate 2
The outer diameter of the transport rollers 25 arranged in the central portion in the direction orthogonal to the moving direction S of 1 (in other words, the central portion in the direction along the width direction of the substrate to be processed 21) is the outer diameter of the transport rollers 25 at both ends. A larger diameter is provided, and upper side transfer rollers for sandwiching the end portion in the width direction of the substrate to be processed 21 with the transfer rollers 25 are provided above the transfer rollers 25 at both ends, thereby performing a drying process. The substrate to be processed 21 sent into the area 13
The case where the drying process can be performed while curving so that the central portion in the width direction becomes high has been described.
In the etching processing area and the cleaning processing area of the wet processing apparatus of the fourth embodiment as well, the central portion in the left-right direction of the transport rollers 25 arranged in these processing areas (which is orthogonal to the moving direction S of the substrate 21 to be processed). Direction central portion, in other words, the central portion in the direction along the width direction of the substrate 21 to be processed)
The outer diameter of the transport roller 25 arranged at
The outer diameter may be larger than the outer diameter, and upper side transfer rollers for sandwiching the end portion in the width direction of the substrate to be processed 21 between the transfer rollers 25 at both ends may be provided.

By configuring the etching processing region and the cleaning processing region as described above, when the substrate to be processed 21 is carried in these processing regions and wet processing is performed, the substrate to be processed 21 is moved in the longitudinal direction thereof. Since the wet treatment is performed in a state where the substrate 21 is tilted, and the wet treatment is performed while curving so that the central portion in the width direction becomes high, the wet treatment is performed as compared with the case where the substrate 21 to be processed is only inclined. It is possible to further improve the drainage of the subsequent processing liquid.

Further, in the first to fourth embodiments,
A wet processing step of performing wet etching and cleaning,
Although the case where the present invention is applied to an apparatus for sequentially performing a drying step has been described, an apparatus for continuously performing one or more kinds of wet treatments such as cleaning, peeling, development, wet etching, plating, and polishing. Moreover, it can be applied to an apparatus for performing drying after the wet treatment or an apparatus for performing a drying step between the wet treatment steps, if necessary. In addition, in the first to fourth embodiments,
The case where the object to be processed is a large substrate such as a glass substrate having a size of several hundred mm square, preferably 1 to 2 m square, has been described, but it may have a circular shape such as a semiconductor wafer.

[0089]

As described above, in the wet processing apparatus of the present invention in which the objects to be processed are arranged obliquely in each wet processing area, the use amount of the wet processing liquid can be reduced. Since the wet processing apparatus can be downsized, it does not require a large amount of equipment and space for the wet processing process, and can be used as a rational apparatus in a production line, etc. The apparatus can sufficiently cope with the wet processing of the object to be processed. Further, in the wet processing apparatus of the present invention, not only in each wet processing area, but also in the dry processing area, the object to be processed is arranged obliquely,
Not only the amount of wet treatment liquid used, but also the amount of drying gas used in the drying process after the wet treatment process can be reduced, the device can be downsized, and a large amount of equipment expense is required for the wet treatment process and the drying process. The apparatus can be reasonably used in a production line or the like to rationally perform wet processing and drying without occupying an occupied space, and can sufficiently cope with wet processing and drying of a large object to be processed.

Further, in the wet processing apparatus of the present invention, the object to be processed is arranged obliquely in the processing region where the wet processing is performed, and the wet processing means is composed of the pair of nozzle constituent members having the above-mentioned structure. In this case, the amount of the wet processing liquid used can be further reduced, and the wet processing apparatus can be downsized, so that the wet processing process does not consume a large amount of equipment or occupied space, and the manufacturing line etc. It can be used as a rational device, and can be a device that can sufficiently cope with wet processing of a large object to be processed. Further, in the wet processing apparatus of the present invention, the object to be processed is arranged so as to be oblique in the processing region where the wet processing and the drying processing are performed, and the wet processing means is composed of the pair of nozzle constituent members having the above-described structure. In this case, the amount of the wet treatment liquid used can be further reduced, and the amount of the drying gas used in the drying process after the wet treatment process can be reduced, so that the apparatus can be downsized and the wet treatment process can be performed. A device that can be used reasonably for wet processing and drying in a production line, etc. without spending a large amount of equipment and occupied space for the drying process, and can sufficiently cope with wet processing and drying of a large object. can do.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing a wet processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a wet treatment area, a cleaning treatment area, and a drying treatment area of the wet treatment apparatus of FIG.

FIG. 3 is a diagram showing another example of the air knife provided in the dry processing region of the wet processing apparatus of the first embodiment.

FIG. 4 is a schematic configuration diagram showing a wet processing apparatus according to a second embodiment of the present invention.

5 is a sectional view showing a processing region of the wet processing apparatus shown in FIG.

6 is an enlarged cross-sectional view showing a configuration of a pair of push-pull type nozzles provided in the processing region of FIG.

FIG. 7 is a view of the push-pull type nozzle of FIGS. 5 to 6 as viewed from the substrate side.

FIG. 8 is a diagram showing another example of the air knife provided in the dry processing region of the wet processing apparatus according to the second embodiment.

FIG. 9 is a plan view showing a nozzle moving unit (nozzle constituting member / processed object relative moving unit) provided in the wet processing apparatus of the second embodiment.

FIG. 10 is a plan view showing a holding means provided with a porous member provided in the processing chamber of the embodiment.

FIG. 11 is a schematic configuration diagram showing an example of a conventional wet processing apparatus.

12 is a view showing a cleaning tank, a drying tank, and an unloader of the wet processing apparatus of FIG.

FIG. 13 is a cross-sectional view showing a drying processing region provided in a processing chamber of the wet processing apparatus according to the third embodiment.

14 is a sectional view taken along line XIV-XIV in FIG.

FIG. 15 is a plan view of the lower air knife provided in the dry processing area of FIG. 13 when viewed from the substrate side.

FIG. 16 is a cross-sectional view showing a drying processing region provided in a processing chamber of the wet processing apparatus according to the fourth embodiment.

17 is a sectional view taken along line XVII-XVII of FIG.

FIG. 18 is a plan view of the lower air knife provided in the dry processing area of FIG. 16 when viewed from the substrate side.

FIG. 19 is a cross-sectional view showing another example of the transfer rollers provided in the drying processing chamber of the present embodiment.

[Explanation of symbols]

1, 31, 201, 301 ... Wet processing device, 1
a, 31a ... Processing chamber, 11 ... Etching processing area (wet processing area), 11a, 12a ... Shower nozzle (wet processing means) 12 ... Cleaning processing area (wet processing area), 13. ..Drying processing areas, 13a, 23a,
43, 83, 213a, 313a ... Air knife (drying mechanism), 21 ... Processing substrate (processing object), 25, 2
6, 27 ... Transport rollers (transport mechanism), 32 ... Processing area,
41, 42 ... Push-pull type nozzle (wet processing means), 50 ... Etching solution (wet processing solution), 5
1a ... Inlet port, 51b ... First opening part, 51 ... Inlet passage, 52a ... Outlet port, 52b ... Second opening part, 52
... Discharge passage, 70 ... Cleaning liquid (wet processing liquid) 92 ...
-Rack base, 93 ... Linear guide, 94 ... Slider, 95 ... Support, 96 ... Motor, 97 ... Holding means,
97a ... Porous member, 98 ... Holder support plate, θ ... Inclination angle, S ... Transport direction (moving direction), a ... Distance, b ...
·width.

Claims (9)

[Claims] 1. An object to be processed is transported into a processing chamber provided with a plurality of wet processing areas provided with a wet processing means for supplying a processing liquid for the wet processing of the object to be processed toward the object to be processed. A wet processing apparatus that sequentially performs wet processing by means of an inclined transfer mechanism that transfers the workpiece in an inclined state in the processing chamber. 2. A plurality of wet treatment areas provided with a wet treatment means for supplying a treatment liquid for the wet treatment of the object to be treated toward the object to be treated, and a drying process for drying the object treated to be wet. A wet processing apparatus for carrying out a wet processing by sequentially transporting an object to be processed into a processing chamber provided with a drying processing area provided with a mechanism,
A wet processing apparatus, wherein an inclined transfer mechanism for transferring the object to be processed in an inclined state is provided in the processing chamber. 3. An object to be processed is conveyed into a processing chamber provided with a processing region provided with a plurality of wet processing means for supplying a processing liquid for the wet processing of the object to be processed toward the object to be processed. A wet processing apparatus for sequentially performing wet processing, wherein an inclined transfer mechanism for transferring the object to be processed in an inclined state is provided in the processing chamber, and at least one of the plurality of wet processing means has one end. An introduction passage having an introduction port for introducing the wet treatment liquid and a discharge passage for discharging the wet treatment liquid after the wet treatment to the outside of the wet treatment system are formed at one end, the introduction passage and the discharge passage. At the other end of each of which is composed of a pair of nozzle constituents provided with an opening opening toward the object to be processed,
These nozzle structures are arranged such that the sides provided with the openings are opposed to each other with a gap therebetween, and the object to be processed is conveyed between the opposed parts to perform a wet process. apparatus. 4. A treatment provided with a plurality of wet treatment means for supplying a treatment liquid for wet treatment of an object to be treated toward the object to be treated, and a drying mechanism for drying the wet treated object. A wet processing apparatus for sequentially carrying out a wet process and a drying process by carrying an object to be processed into a processing chamber provided with an area, wherein an inclined transfer mechanism for carrying the object to be processed in an inclined state is provided in the processing chamber. At least one of the plurality of wet treatment means discharges the wet treatment liquid after the wet treatment to an introduction passage having an introduction port for introducing the wet treatment liquid at one end and to the outside of the wet treatment system at one end. And a discharge passage for forming the discharge passage, and the other end of each of the introduction passage and the discharge passage is provided with an opening that opens toward the object to be processed. The nozzle structure is arranged such that the sides provided with the openings are opposed to each other with a gap therebetween, and the object to be processed is conveyed between the opposed parts to perform a wet process. Processing equipment. 5. The distance between the facing portions of the pair of nozzle constituents is a, the width of the nozzle constituent on the side having the opening is b in the direction along the conveyance direction of the workpiece, and these nozzle constituents are The wet processing apparatus according to claim 3 or 4, wherein a condition of 0 <θ <arctan (a / b) is satisfied, where θ is an inclination angle of the object to be processed that is conveyed between the facing portions. . 6. The wet processing apparatus according to any one of claims 1 to 5, wherein the tilted transfer mechanism is at an angle at which the object to be processed rises in a moving direction of the object to be processed moving in the processing chamber. A wet processing apparatus characterized in that it is conveyed in an inclined manner. 7. The wet processing apparatus according to claim 1, wherein the drying mechanism is movable. 8. The wet processing apparatus according to any one of claims 1 to 7, further comprising: holding means for holding an object to be processed in the processing chamber, wherein the holding means has an end portion of the object to be processed. A wet treatment apparatus, wherein a porous member is provided in a portion located in the vicinity of the contact member in contact with or not in contact with an end portion of the object to be processed. 9. The wet processing apparatus according to claim 3, wherein the pair of nozzle constituents and the pair of nozzle constituents and the object to be processed are arranged along a surface to be processed of the object to be processed. A nozzle structure for processing the entire surface of the object to be processed by relatively moving the object to be processed.
A wet processing apparatus comprising: a relative movement means for an object to be processed.