CN104379527A - Chemical polishing apparatus - Google Patents
Chemical polishing apparatus Download PDFInfo
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- CN104379527A CN104379527A CN201380021338.9A CN201380021338A CN104379527A CN 104379527 A CN104379527 A CN 104379527A CN 201380021338 A CN201380021338 A CN 201380021338A CN 104379527 A CN104379527 A CN 104379527A
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- glass substrate
- treatment chamber
- spray tube
- milled processed
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- Surface Treatment Of Glass (AREA)
Abstract
Provided is a single-wafer chemical polishing apparatus that is capable of performing chemical polishing with respect to a glass substrate without using a jig. A chemical polishing apparatus (10) is provided with at least a first polishing section (4), a second polishing section (2), and a cleaning section (70). The first polishing section (4) is configured so as to perform chemical polishing using a first treatment liquid with respect to a glass substrate (100) transferred along a transfer path. The second polishing section (2) is configured so as to perform chemical polishing using a second treatment liquid with respect to the glass substrate (100) transferred along the transfer path, said second treatment liquid being different from the first treatment liquid. The cleaning section (70) is disposed in the downstream of the first polishing section (4) and in the upstream of the second polishing section (2) on the transfer path, and the cleaning section (70) is configured to clean the treatment liquid adhered on the glass substrate (100).
Description
Technical field
The present invention relates to a kind of chemical abrasive device, consist of and carry out chemical grinding process to by the multiple glass substrates transported continuously.
Background technology
In order to make glass substrate slimming, usually need to use the chemical grinding liquid containing hydrofluoric acid to carry out chemical grinding process to glass substrate.As this chemical grinding process, batch-type chemical grinding and one chip chemical grinding can be enumerated, pending glass substrate impregnated in the groove being placed with chemical grinding liquid by described batch-type chemical grinding with the specified time, pending glass substrate carrying roller transports and sprays chemical grinding liquid simultaneously by described one chip chemical grinding successively.
In the mode of these chemical grindings, for the grinding of batch mode, it is by impregnated in pending glass substrate in lapping liquid bath with the specified time, thus makes glass substrate thin plateization to desired thickness of slab, and therefore having can the such advantage of a large amount of glass substrate of disposable process.But at least there is following problem in the grinding of batch mode.
First, in the grinding of batch mode, because lapping liquid bath is the structure opened upward, the surrounding that therefore there is lapping liquid bath forms the such problem of dense hydrofluoric acid atmosphere.Particularly, when carrying out foaming process to the lapping liquid of lapping liquid bath, there is gasiform hydrofluoric acid and easily spread such problem towards periphery.The operator operated in such hydrofluoric acid atmosphere, operate if do not wear suitable protection-gear, then likely impair one's health.Therefore, the cost issuing the protection-gear of operator uprises.
In addition, in the grinding of batch mode, in order to eliminate the dense hydrofluoric acid atmosphere of the surrounding of lapping liquid bath, need the exhaust equipments such as strong gas scrubber, thus increase equipment cost.And then, easily there is equipment corrosion due to hydrofluoric acid gas, therefore exist for and implement suitable corrosion protection process and spend the replacement frequency of cost or equipment to become large and problem that is that spend cost such.
Therefore, in recent years, the chemical grinding process of single chip mode is sometimes used.Such as, in the prior art, there is flat panel display glass substrate etching machines, this equipment is configured to: utilize and the fixture of glassivation substrate can carry out longitudinal supporting glass substrate, and while this fixture of conveyance, chemical grinding liquid (for example, referring to patent documentation 1) is sprayed to glass substrate.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2008-266135 publication.
Summary of the invention
Invent problem to be solved
But technology described in patent documentation 1 still has to use the fixture for support glass substrate.Therefore, same with above-mentioned batch-type chemical abrasive device, what also there is preparation fixture costly and easily produces the such problem of fixture vestige on the glass substrate.If produce fixture vestige on the glass substrate, then can make to carry out efficient chamfer design and become extremely difficult, therefore exist and make chamfering efficiency reduce such problem.
The present invention makes in view of above-mentioned problem, and it provides the one chip chemical abrasive device not using fixture also can implement chemical grinding process to glass substrate.
Solve the means of problem
Chemical abrasive device of the present invention is configured to be carried out chemical grinding process to along conveyance path by the multiple glass substrates transported continuously.Typical example as the formation of conveyance path can enumerate the formation arranging multiple carrying roller, replaces this formation also can set up forming of netted travelling belt by employing on Kun.
This chemical abrasive device at least possesses the 1st milled processed portion, the 2nd milled processed portion and washing portion.1st milled processed portion is configured to, and utilizes the 1st treatment solution to carry out chemical grinding process to the glass substrate along the conveyance of conveyance path.2nd milled processed portion is configured to, and utilizes 2nd treatment solution different from the 1st treatment solution to carry out chemical grinding process to the glass substrate along the conveyance of conveyance path.Washing portion is configured to, and be configured at the downstream side in the 1st milled processed portion and the upstream side in the 2nd milled processed portion that transport path, washing is attached to the treatment solution of glass substrate.
In this formation, along conveyance path by the glass substrate transported continuously, successively by the 1st milled processed portion, washing portion and the 2nd milled processed portion.Glass substrate, along conveyance flow channels, so there is no necessary by maintenances such as glass substrate fixtures.Along conveyance path by the glass substrate transported continuously, carry out chemical grinding process at the 1st milled processed portion the 1st treatment solution, then, after the washing of washing portion, carry out chemical grinding process at the 2nd milled processed portion the 2nd treatment solution.Therefore, two kinds of milled processed can be carried out continuously.As the example of different two kinds of milled processed, can list: use the treatment solution regulated in the mode that hydrofluoric acid concentration is mutually different, grinding rate is to process fast and grinding rate is two kinds of process at a slow speed, and use the process of adding the suppression glass pit of the treatment solution of a small amount of hydrofluoric acid in principal constituent sulfuric acid and use with hydrofluoric acid be principal constituent treatment solution make two kinds of the process of glass slimming etc., but be not defined in these.
In above-mentioned formation, preferably, the 1st milled processed portion has the multiple treatment chambers being configured to the 1st treatment solution to spray to glass substrate, and the 2nd milled processed portion has the multiple treatment chambers being configured to the 2nd treatment solution to spray to glass substrate.By adopting such formation, preventing a treatment chamber to maximize, being therefore not easy carrying out in the middle of milled processed, in each component forming office treatment, undesirable condition occurring.
In addition, in above-mentioned formation, preferably, at least have pretreatment portion further at the upstream side in the 1st milled processed portion, described pretreatment portion is configured to the surface wettability making the glass substrate before being imported into the 1st milled processed portion.By adopting this formation, before carrying out milled processed to the surface of glass substrate, the surface of glass substrate is moistening thus form liquid membrane by the liquid of water etc., therefore prevents the drying nest of glass baseplate surface from carrying out milled processed.Therefore, prevent from, because carrying out chemical grinding at drying nest, the generation of the undesirable conditions such as gonorrhoea occurs.
Invention effect
If utilize the invention described above, then do not use fixture can implement chemical grinding process to glass substrate yet.
Accompanying drawing explanation
Fig. 1 is the outside drawing of the one chip chemical abrasive device represented described in embodiments of the present invention.
Fig. 2 is the schematic configuration diagram representing one chip chemical abrasive device.
Fig. 3 is the schematic configuration diagram representing one chip chemical abrasive device.
Fig. 4 is the schematic configuration diagram representing the 3rd treatment chamber.
Fig. 5 is the schematic configuration diagram representing treatment solution feed mechanism.
Fig. 6 is the schematic configuration diagram representing crank mechanism.
Fig. 7 is described figure to the process in pretreatment chamber.
Fig. 8 represents the bearing state figure utilizing carrying roller to support glass.
Embodiment
Fig. 1 is the outside drawing of the one chip chemical abrasive device 10 described in an example representing embodiments of the present invention.As shown in the drawing, the conveyance path that chemical abrasive device 10 possesses the multiple carrying roller 50 of arrangement and forms, is provided with the 1st milled processed portion 4, washing room 70, the 2nd milled processed portion 2 and washing room 24 along this conveyance path successively from upstream.In this embodiment, preliminary treatment is carried out in the 1st milled processed portion 4, described preliminary treatment uses the lapping liquid of the high viscosity that the sulfuric acid containing appropriate concentration hydrogen fluoric acid is principal constituent to suppress for the purpose of pit, and using in the 2nd milled processed portion 2 with hydrofluoric acid is that the lapping liquid of principal constituent carries out slimming process.
The leading portion in the 1st milled processed portion 4 is provided with loading unit 62 and pretreatment chamber 64.1st milled processed portion 2 possesses the 1st treatment chamber 66, the 2nd treatment chamber 68 and the 1st relay 72.In addition, the back segment in the 1st milled processed portion 4 is provided with washing room 70.
Loading unit 62 is configured to the manual operation that can receive by being undertaken by operator or the automatic operation that undertaken by robot etc. and the pending glass substrate 100 moved into.In this embodiment, the slim glass substrate of glass substrate 100 to be dull and stereotyped thickness be about 0.5mm ~ 2.0mm, but be not defined to this as the glass substrate 100 of handling object.Pretreatment chamber 64, is configured to receive the glass substrate 100 transported from loading unit 62.1st treatment chamber 66 is configured to spray chemical grinding liquid to the top and bottom of glass substrate 100, suppress or removing glass substrate 100 surface pit while by glass substrate 100 slimming.2nd treatment chamber 68 is configured to the chemical grinding liquid with the 1st treatment chamber 66 same composition spray to the top and bottom of glass substrate 100 thus suppress or remove the pit on glass substrate 100 surface further.1st relay 72 is configured to connection the 1st treatment chamber 66 and the 1st treatment chamber 68.
Washing room 70 is configured to wash via the glass substrate 100 after the 2nd treatment chamber 68.Washing room 70 forms the washing portion in the present invention.In this embodiment, adopt washing room 70 as washing portion, but also can adopt the formation of the washings cleaning glass substrate 100 beyond as washing portion water.In washing room 70, eliminate the glass substrate 100 for the treatment of solution, conveyance is to the downstream of conveyance path further.
Back segment in the 1st milled processed portion 4 and the 2nd milled processed portion 2 leading portion are provided with loading unit 12 and pretreatment chamber 14.2nd milled processed portion 2 possesses the 3rd treatment chamber 16, the 4th treatment chamber 18, the 5th treatment chamber 20, the 6th treatment chamber 22, the 2nd relay 28, the 3rd relay 30 and the 4th relay 32.In addition, the back segment in the 2nd milled processed portion 2 is provided with washing room 24 and takes out of portion 26.There is the 2nd treatment solution resettlement section 42, the 2nd treatment solution supply unit 44 and water supply portion 46.
Loading unit 12 is configured to receive the glass substrate 100 of discharging from washing room 70.Pretreatment chamber 14 is configured to the glass substrate 100 receiving loading unit 12 conveyance.3rd treatment chamber 16 is configured to spray chemical grinding liquid to the top and bottom of glass substrate 100 thus make glass substrate 100 slimming.4th treatment chamber 18, the 5th treatment chamber 20 and the 6th treatment chamber 22 are configured to respectively, sprayed by the chemical grinding liquid with the 3rd treatment chamber 16 same composition thus make glass substrate 100 slimming further to glass substrate 100 top and bottom.2nd relay 28, the 3rd relay 30 are configured to be connected multiple treatment chamber with the 4th relay 32 respectively.
Washing room 24 is configured to washing via the glass substrate 100 after the 6th treatment chamber 22.Take out of the glass substrate 100 that portion 26 is configured to can take out through chemical grinding process and washing process.Arrive the glass substrate 100 to the portion of taking out of 26, by the manual operation undertaken by operator or the automatic operation undertaken by robot etc., chemically milling apparatus 10 takes out and reclaims.Then, when glass substrate 100 needs further slimming, it is imported in chemical abrasive device 10 again, and when not needing further slimming, is transferred in the subsequent handlings such as film formation process.
As shown in Figure 2, chemical abrasive device 10 possesses the 1st treatment solution resettlement section 84, the 1st treatment solution supply unit 82, water supply portion 74, the 2nd treatment solution resettlement section 42, the 2nd treatment solution supply unit 44 and water supply portion 46.1st treatment solution resettlement section 84 is connected with the 1st treatment chamber 66 and the 2nd treatment chamber 68 via recovery line 840.1st treatment solution supply unit 82, via feed flow pipeline 820, is connected with the 1st treatment chamber 66, the 2nd treatment chamber 68 and the 1st relay 72.Water supply portion 74 via water supply line 740, with pretreatment chamber 64 with wash room 70 and be connected.It should be noted that, in Fig. 1, eliminate the relevant indicators of the water supply line 460 of the recovery line 420 of chemical abrasive device 10, feed flow pipeline 440 and washing water.
2nd treatment solution resettlement section 42, via recovery line 420, is connected with the 3rd treatment chamber 16, the 4th treatment chamber 18, the 5th treatment chamber 20 and the 6th treatment chamber 22.2nd treatment solution supply unit 44, via feed flow pipeline 440, is connected with the 3rd treatment chamber 16, the 4th treatment chamber 18, the 5th treatment chamber 20, the 6th treatment chamber 22, the 2nd relay 28, the 3rd relay 30 and the 4th relay 32.Water supply portion 46 is via water supply line 460 and pretreatment chamber 14 and wash room 24 and be connected.
In above-mentioned chemical abrasive device 10, except the introducing port to pretreatment chamber 64,14, from the washing export mouth of room 70,24 and the working space of a part for aftermentioned crank mechanism 36, close to the overall resistance to air loss of chemical abrasive device 10 and watertightness.The introducing port arranged in chemical abrasive device and export mouth, present slightly higher than the thickness of slab of glass substrate 100, slightly wider than the width of glass substrate 100 shape of slit.In addition, as above-mentioned, ground, through each portion is configured with multiple carrying roller 50 on same level.Each carrying roller 50 transports to diagram the right while the bottom surface of support glass substrate 100.
At this, conveyance speed is preferably set to 100 ~ 800mm/ minute, more preferably should be set as 300 ~ 550mm/ minute.Further, in the present embodiment, the treatment time in the 1st treatment chamber 66, the 2nd treatment chamber 68, the 3rd treatment chamber 16, the 4th treatment chamber 18, the 5th treatment chamber 20 and the 6th treatment chamber 22 is set as total about 20 ~ 60 minutes, but is not limited thereto.In addition, if exceed above-mentioned scope and conveyance speed is excessively slow, then not only production efficiency is poor, and chemical grinding liquid is easily stranded on glass substrate 100, thus likely hinder uniform chemical grinding, the crackle etc. producing glass substrate 100 may be brought out in worst case.On the other hand, in same apparatus scale, if improve conveyance speed, then the liquid composition realizing this target is difficult to optimizing, and result is difficult to realize uniform chemical grinding.
Be not particularly limited by the glass substrate 100 of slimming process in chemical abrasive device 10, chemical abrasive device 10 is configured to as under type, that is: even if for 1/4th large-size glass substrates such as cutting (1080 × 1030mm) and G6 size (1500 × 1800mm) etc. of G8 size, also can evenly grind its upper and lower surface.In addition, chemical abrasive device 10 is configured to when not using fixture, bracket, directly utilizes carrying roller 50 to transport glass substrate 100.
As mentioned above, the 1st treatment chamber 66, the 2nd treatment chamber 68 and the 1st relay 72, via feed flow pipeline 820, receive from the 1st treatment solution supply unit 82 and the supply of the 1st treatment solution (chemical grinding liquid) through temperature treatment.In present embodiment, the 1st treatment solution is about 40 ~ 42 DEG C by temperature treatment.In addition, the composition of the 1st treatment solution uses sulfuric acid 35 ~ 95 % by weight, hydrofluoric acid 1 ~ 10 about % by weight, forms remaining as the liquid of water, but is not limited to this liquid composition.
In addition, 3rd treatment chamber 16, the 4th treatment chamber 18, the 5th treatment chamber 20, the 6th treatment chamber 22, the 2nd relay 28, the 3rd relay 30 and the 4th relay 32, via feed flow pipeline 440, receive from the 2nd treatment solution supply unit 44, by the supply of the 2nd treatment solution (chemical grinding liquid) of temperature treatment.In this embodiment, the 2nd treatment solution is about 40 ~ 42 DEG C by temperature treatment.In addition, the composition of the 2nd treatment solution uses hydrofluoric acid 1 ~ 20 % by weight, salt acid 0 ~ 10 % by weight, forms remaining as the liquid of water, but is not defined in this liquid composition.
Pretreatment chamber 64 and washing room 70, receive the supply of the washing water from water supply portion 46 via water supply line 740.Furthermore, pretreatment chamber 14 and washing room 24, receive the supply of the washing water from water supply portion 46 via water supply line 460.In addition, from the washing draining that pretreatment chamber 64,14 and washing room 70,24 discharge, discharge to sewage treatment equipment.
On the other hand, as mentioned above, the bottom of the 1st treatment chamber 66 and the 2nd treatment chamber 68, is communicated to the 1st treatment solution resettlement section 84 via recovery line 840, is reclaimed by the 1st treatment solution.In addition, the bottom of the 3rd treatment chamber 16, the 4th treatment chamber 18, the 5th treatment chamber 20 and the 6th treatment chamber 22, is communicated to the 2nd treatment solution resettlement section 42 via recovery line 420, is reclaimed by the 2nd treatment solution.
The bottom of the 1st relay 72, have the bottom tilted to each adjacent treatment chamber, the 1st treatment solution therefore in the 1st relay 72 can successfully import adjacent treatment chamber.The bottom of the 2nd relay 28, the 3rd relay 30 and the 4th relay 32, has the bottom tilted to each adjacent treatment chamber, and the 2nd treatment solution therefore in the 2nd relay 28, the 3rd relay 30 and the 4th relay 32 also successfully imports adjacent treatment chamber.In addition, the milled processed water be recovered is after the precipitation and other process of resultant of reaction, if the state that can recycle, then be sent to the 1st treatment solution supply unit 82 or the 2nd treatment solution supply unit 44, on the other hand, when state can not be recycled, be transferred in liquid waste disposal operation as the dense waste liquid of height.
In addition, as shown in Figure 3, pretreatment chamber 64, the 1st treatment chamber 66, the 2nd treatment chamber 68, washing room 70, pretreatment chamber 14, the 3rd treatment chamber 16, the 4th treatment chamber 18, the 5th treatment chamber 20, the 6th treatment chamber 22 and washing room 24, via vent line 340, be communicated to exhaust portion 34, the internal gas of each room is attracted to exhaust portion 34.At this, vent line 340 is stable plays function, and therefore the opening portion of chemical abrasive device 10 maintains negative pressure state, thus process gas is difficult to be spilt by these opening portions.
Formation below with regard to chambers is described, but the formation in the 1st side, milled processed portion 4 is identical in fact with the formation of the 2nd side, milled processed portion 2, therefore only the 2nd side, milled processed portion 2 is formed below and be described, omit the explanation that the 1st side, milled processed portion 4 is formed.As shown in Figure 4 and Figure 5, in the 3rd treatment chamber 16, the 4th treatment chamber 18, the 5th treatment chamber 20, the 6th treatment chamber 22 and washing room 24, at one group of (10) spray tube 444 (444U that the conveyance direction of glass substrate 100 extends, 444L), the upper-lower position of carrying roller 50 is configured at respectively.Each spray tube 444 is the hollow resin pipes be made up of ethylene chloride or Teflon (registered trademark), and on a spray tube, multiple injection nozzle 446 forms row.In addition, spray chemical grinding liquid from the upside spray tube 444U of upside configuration to above glass substrate 100, from the downside spray tube 444L configured in downside, chemical grinding liquid is sprayed to the bottom surface of glass substrate 100.On the other hand, from washing room 24, the upside spray tube 242U of configuration is to jet cleaning water above glass substrate, from the bottom surface jet cleaning water of downside spray tube 242L to glass substrate 100.Furthermore, in 2nd relay 28, the 3rd relay 30 and the 4th relay 32, be respectively equipped with spray tube 282 (282U, 282L), spray tube 302 (302U, 302L) and spray tube 322 (322U, 322L), the chemical grinding liquid with the 3rd ~ 6th treatment chamber 18,20,22,24 same composition is sprayed above glass substrate 100 and bottom surface.
In the present embodiment, the spray tube (242U, 242L) of the spray tube 282 (282U, 282L) configured in the 2nd relay 28, the 3rd relay 30 and the 4th relay 32, spray tube 302 (302U, 302L) and spray tube 322 (322U, 322L) and configuration in washing room 24 keeps stationary state.On the other hand, in the 3rd treatment chamber 16, the 4th treatment chamber 18, the 5th treatment chamber 20, the 6th treatment chamber 22, each spray tube 444 of configuration is configured to by crank mechanism 36 and swings.
As shown in Fig. 5 (A) and Fig. 5 (B), in the present embodiment, in the 3rd treatment chamber 16, the 4th treatment chamber 18, the 5th treatment chamber 20 and the 6th treatment chamber 22, be configured with 10 spray tubes 444 (444U, 444L) separately in the upper side and lower side of glass substrate 100.Fig. 5 (A) is the orthographic plan of spray tube 444 (444U, 444L), in each spray tube 444 (444U, 444L), forms such as 8 injection nozzles 446.
With regard to each spray tube 444 (444U, 444L), its front (diagram downside) is closed, and is provided with hydraulic control portion in its butt side.Hydraulic control portion is made up of the opening-closing valve 442 (442U, 442L) with spray tube 444 (444U, 444L) equal amts (10), by adjusting the aperture of each opening-closing valve 442 (442U, 442L), the hydraulic pressure of the chemical grinding liquid being supplied in each spray tube 444 (444U, 444L) can be set arbitrarily.Such as, can hydraulic pressure difference be set to the hydraulic pressure of upside spray tube 444U and downside spray tube 444L or hydraulic pressure difference can be set at central injection pipe 444 (444U, 444L) and the hydraulic pressure of end spray tube 444 (444U, 444L).In addition, the hydraulic pressure being supplied in the chemical grinding liquid of each spray tube 444 (444U, 444L) can be confirmed by the tolerance instrument 38 being configured at the upper surface of chemical abrasive device 10.
In the present embodiment, compared with the spray tube 444 (444U, 444L) of peripheral position, the hydraulic pressure of the spray tube 444 (444U, 444L) of middle position is set slightly large, compared with the contact pressure of the peripheral position to glass substrate 100, emitted dose, be set slightly high to the contact pressure of the middle position of glass substrate 100, emitted dose.Therefore, the chemical grinding liquid sprayed in the middle position of glass substrate 100 successfully can move to the peripheral position of glass substrate, thus makes chemical grinding liquid be difficult to be stranded in the upper surface of glass substrate 100.Consequently, make the chemical grinding liquid of equivalent substantially act on whole of whole glass substrate 100, thus easily make whole glass substrate 100 be ground equably.In addition, even if change in the direction of the width not making the hydraulic pressure of spray tube 444 (444U, 444L), when chemical grinding liquid also can not be stranded in the upper surface of glass substrate 100, there is no need specially to make the hydraulic pressure of spray tube 444 (444U, 444L) change in the direction of the width, as long as the hydraulic pressure of whole spray tubes 444 (444U, 444L) is set to evenly.
In addition, each spray tube 444 (444U, 444L) be configured to its two ends by bearing etc. be supported to rotatable thus utilize crank mechanism 36 can swing (oscillation) about ± 30 ° (with reference to Fig. 5 (B)).It should be noted that, Fig. 5 (B) represents pendulum angle, does not represent the spray regime of chemical grinding liquid.That is, because chemical grinding liquid sprays with the horn-like injection nozzle 446 from spray tube 444, therefore its spray regime is wider than pendulum angle.
As shown in Fig. 6 (A) and Fig. 6 (B), crank mechanism 36 has CD-ROM drive motor 362 and transport sector portion 364, described transport sector portion 364 is configured to the revolving force of CD-ROM drive motor 362 is converted to the power that spray tube 444 (444U, 444L) is swung, and transmits to spray tube 444 (444U, 444L).The revolving force of CD-ROM drive motor 362 via transfer arm transfers to swing arm 366 as the power making swing arm 366 swing.The support 368 that swing arm 366 is arranged on the inner wall part of chemical abrasive device 10 is supported to rotatable state.
On the other hand, the partition wall of the through treatment chamber in end of each spray tube 444 (444U, 444L), be provided with torque transfer arm 372,376 in the part in the outside being positioned at treatment chamber, this torque transfer arm 372,376 is for transmitting the torque needed for spray tube 444 (444U, 444L) swing.Torque transfer arm 372,376 is supported in keeping arm 370,374 with rotating state respectively.Keeping arm 370,374 is with rotatably and slidably state and swing arm 366 link.
If the revolving force by CD-ROM drive motor 362 makes swing arm 366 swing, then keeping arm 370,374 and swing arm 366 swing linkedly as shown by the arrow like that.From the power of keeping arm 370 via torque transfer arm 372 as torque transfer supreme side spray tube 444U.In addition, the masterpiece from keeping arm 374 is that torque transfers to downside spray tube 444L by torque transfer arm 376.Consequently, as shown in Fig. 6 (A) and Fig. 6 (B), upside spray tube 444U and downside spray tube 444L is to orthogonal with the conveyance direction of glass substrate 100 and opposite directions rotate about ± 30 °.In addition, the rotating speed of CD-ROM drive motor 362 specifies the number of oscillations of spray tube 444 (444U, 444L), but in the present embodiment, the speed setting of CD-ROM drive motor is about 10 ~ 30rpm.
Due in the spray tube 444U of upside, injection nozzle 446U is formed below it, in the spray tube 444L of downside, be formed with injection nozzle 446L above it, therefore chemical grinding liquid sprays to the top and bottom of glass substrate (with reference to Fig. 5 (B)) by each injection nozzle while rotation about ± 30 °.
In addition, in the present embodiment, specially arrange implementing the 3rd treatment chamber 16 of same chemical grinding, the 4th treatment chamber 18, the 5th treatment chamber 20 and the 6th treatment chamber 22 separated from one another with same liquid composition.Its reason is, because by suppressing the length of spray tube 444 (444U, 444L), preventing the flexure of spray tube 444 (444U, 444L), and making spray tube 444 (444U, 444L) successfully swing.In addition, because the impact that the thermal expansion by spray tube 444 (444U, 444L) causes is suppressed less.By taking this formation, can maintain evenly by spray tube 444 (444U, 444L) and the distance of glass substrate 100, easily the hydraulic pressure of the chemical grinding liquid in glass substrate 100 is sprayed in adjustment.In addition, by making spray tube 444 (444U, 444L) successfully swing, chemical grinding liquid can be made successfully to wander from the upper surface of glass substrate 100, therefore chemical grinding liquid is difficult to the upper surface being stranded in glass substrate 100.It should be noted that, the length of spray tube 444 (444U, 444L) is also relevant with caliber (liquor charging amount), but is generally below 2.5m, preferably suppresses for below 2m.
In order to carry out high-speed chemical grinding to glass substrate 100, need the liquor charging amount of the chemical grinding liquid increasing warm-up mode, but by the length of spray tube 444 (444U, 444L) being suppressed for suitable length, thus do not need CD-ROM drive motor 362 is so maximized, and multiple spray tube 444 (444U, 444L) just can be made successfully to swing by simple mechanism.
Next, Fig. 7 (A) ~ Fig. 7 (C) formation to pretreatment chamber 14 is adopted to be described.In pretreatment chamber 14, the situation being closely configured with the crank mechanism 36 that spray tube 444 (444U, 444L) is swung with the 3rd treatment chamber 16 is described above.Except above-mentioned formation, in pretreatment chamber 14, at the introducing port place of the glass substrate 100 to the 3rd treatment chamber 16, be configured with and receive the opposed roll 146 of glass substrate 100 and the washing nozzle 142,144 to the top and bottom injection water of glass substrate 100.Whole region on the direction (width) orthogonal with the conveyance direction of glass substrate 100, is equipped with multiple washing nozzle 142,144 with the interval specified.At this, be set with contact pressure, thus make glass substrate 100 mildly be kept by opposed roll 146 and carrying roller 50 and import to the 3rd treatment chamber 16.
In addition, wash nozzle 142,144 to be set as towards the introducing port injection water to the 3rd treatment chamber 16 of glass substrate 100.Therefore, the glass substrate 100 being directed into the 3rd treatment chamber 16 is fully wetting states, prevents from carrying out uneven initial stage etching.Namely; because the 3rd treatment chamber 16 is hydrofluoric acid gas atmosphere; therefore; if the surface of glass substrate 100 is drying regimes; then existing may because of hydrofluoric acid gas by the danger of corroding unevenly; but in the present embodiment, because the surface of glass substrate 100 is by water conservation, uniform etching therefore, can be started in the 3rd treatment chamber 16.
In the present embodiment, as shown in Fig. 7 (A) ~ Fig. 7 (C), washing nozzle 142 be configured to immediately below injection water, and wash nozzle 144 and be configured to upward and the upstream side injection water obliquely of conveyance path towards glass substrate 100.The result that washing nozzle 144 is configured to injection water is obliquely upward, when glass substrate 100 is close to washing nozzle 142,144, as shown in Fig. 7 (A) and Fig. 7 (B), can from washing nozzle 144 to the upper surface of glass substrate 100 for feedwater.Thereby, it is possible to form rapidly the moisture film corroded from hydrofluoric acid gas for the protection of it at the upper surface of glass substrate 100.In addition, if glass substrate 100 is close to washing nozzle 144, then the water owing to spraying from washing nozzle 144 can be sprayed onto the bottom surface of glass substrate 100, therefore, it is possible to utilize the bottom surface of the suitable cleaning glass substrate 100 of washing nozzle 144, and makes it suitably soak.
As mentioned above, by washing nozzle 142,144 is arranged at pretreatment chamber 14, the glass substrate 100 of drying regime can be prevented to be exposed to hydrofluoric acid gas and to be etched unevenly.In addition, preventing glass substrate 100 to be sandwiched between opposed roll 146 and carrying roller 50 with drying regime, therefore when passing through between opposed roll 146 and carrying roller 50, can prevent from producing scar over the glass substrate 100 or making glass substrate 100 stained.
Next, the 2nd relay 28, the 3rd relay 30 and the 4th relay 32 are described.In the 2nd relay, the 3rd relay 30 and the 4th relay 32, be configured with the spray tube 282 of stationary state, spray tube 302 and spray tube 322 at the upper-lower position of conveyance path respectively.Further, chemical grinding liquid is sprayed from spray tube 282, spray tube 302 and spray tube 322 to the top and bottom of glass substrate 100.In the present embodiment, spray tube 444, spray tube 282, spray tube 302 and spray tube 322 form lapping liquid jet apparatus of the present invention separately.
At this, although can consider the 2nd relay 28, the 3rd relay 30 and the 4th relay 32 as the free space in glass grinding process, but in the present embodiment, specially also the chemical grinding liquid of same composition is sprayed to glass substrate 100 in these the 2nd relay 28, the 3rd relay 30 and the 4th relay 32.Therefore, when by the 2nd relay 28, the 3rd relay 30 and the 4th relay 32, chemical grinding liquid can not be made to be stranded on glass substrate 100, otherwise, when by the 2nd relay 28, the 3rd relay 30 and the 4th relay 32, glass substrate 100 can not be made slightly dry, thus the glass grinding of high-quality can be realized.It should be noted that, although the spray tube 282 of the 2nd relay 28, the 3rd relay 30 and the 4th relay 32, spray tube 302 and spray tube 322 are stationary states, the swing type of free-standing also can be adopted to form.
Glass substrate 100 passes through the 3rd treatment chamber 16, the 4th treatment chamber 18, the 5th treatment chamber 20, the 6th treatment chamber 22, the 2nd relay 28, the 3rd relay 30 and the 4th relay 32 successively, and successively by chemical grinding.Then, to the glass substrate 100 of chemical grinding terminating multiple stage, utilize the air knife 244 being configured at the outlet of the 6th treatment chamber 22 carry out upper surface except after liquid process, utilize the washing water received from the one group of spray tube 242 be configured at washing room 24 to wash.Although washing spray tube 242 is stationary states, the formation making it swing also can be adopted.
In a word, in the final stage of carrying out washing treatment, be configured with upper and lower a pair air knife 246, utilize the air sprayed by this to make the top and bottom of glass substrate 100 dry rapidly.Then, the glass substrate 100 of discharging from the export mouth 300 of washing room 24 is taken out by the operator waited in the portion of taking out of 26, thus completes a series of processing treatment.So, by configuring air knife 244 in addition at the leading portion of upper and lower a pair air knife 246, can rapidly the upper surface of chemical grinding liquid from glass substrate 100 be removed, therefore, it is possible to effectively prevent the upper surface of glass substrate 100 from being etched unevenly.
As mentioned above, the chemical abrasive device 10 related to according to the present embodiment, chemical grinding is carried out in the space closed, the toxic gases such as the hydrofluoric acid gas utilizing the air-releasing mechanisms such as gas scrubber almost all to produce in retrieving arrangements, therefore hydrofluoric acid gas spreads to chemical abrasive device 10 surrounding hardly.Consequently, compared with the situation of batch-type chemical grinding process, the operating environment around chemical abrasive device 10 is significantly improved.Therefore, eliminate the worry that the health of operator is worsened and eliminate the necessity of Expenses Cost on protection-gear simultaneously.
In addition, because the equipment of the surrounding that can prevent chemical abrasive device 10 is corroded by hydrofluoric acid gas, therefore, it is possible to the maintenance cost of suppression equipment.That is, there is the advantage that can be used for as operator provide good operating environment such with the maintenance cost of cheapness.
And then, compared with the milled processed of batch mode, when using chemical abrasive device 10 of single chip mode, there is the such advantage of quality that can improve operation efficiency, product.And, owing to improving thickness of slab precision by chemical abrasive device 10, therefore measurable stable to yield rate during cutting.In addition, for cut surface planar strength, also can grow compared with the milled processed of batch mode.Further, because the hydrofluoric acid do not caused by foaming loses, therefore, it is possible to expect the effect of reduction about 15% hydrofluoric acid cost.And then, continuously and automatically carry out different types of milled processed, can thus improve the processing efficiency to glass substrate 100 to glass substrate 100.
At this, adopt Fig. 8 (A) and Fig. 8 (B) that the state of the glass substrate 100 transported by carrying roller 50 is described.In the past, stained in order to avoid glass substrate 100, the past did not recommend to adopt the formation making the direct side face of contact carrying roller 50 of glass substrate 100.But, in the present embodiment, even if glass substrate 100 is directly positioned on the side face of carrying roller 50 by well-designed one-tenth, glass substrate 100 also can not be made stained.
First, in the present embodiment, the a large amount of chemical grinding liquid sprayed from multiple spray tube 444 (444U, 444L), spray tube 282 (282U, 282L), spray tube 302 (302U, 302L) and spray tube 322 (322U, 322L) is sprayed onto the side face of carrying roller 50 all the time, thus makes the side face of carrying roller 50 keep moisture state and form the thin layer of chemical grinding liquid simultaneously at the side face of carrying roller 50.Now, multiple spray tube 444 (444U, 444L), spray tube 282 (282U, 282L), spray tube 302 (302U, 302L) and spray tube 322 (322U, 322L) are with the injection at least making the mode of the side face of whole carrying rollers 50 in chemical grinding process space (the 3rd treatment chamber 16, the 4th treatment chamber 18, the 5th treatment chamber 20, the 6th treatment chamber 22, the 2nd relay 28, the 3rd relay 30 and the 4th relay 32) formation moisture state carry out chemical grinding liquid.
By adopting the formation recorded in present embodiment, lapping liquid from multiple spray tube 444 (444U, 444L), spray tube 282 (282U, 282L), spray tube 302 (302U, 302L) and spray tube 322 (322U, 322L) is sprayed at the side face of the carrying roller 50 in chemical grinding process space, and therefore the side face of carrying roller 50 remains moisture state by lapping liquid.In addition, because the side face of carrying roller 50 is washed by the lapping liquid sprayed, therefore the foreign matter such as sludge is difficult to the side face being attached to carrying roller 50, makes the side face of carrying roller 50 remain clean state.
By above-mentioned formation, greatly can reduce the frictional coefficient between the side face of carrying roller 50 and the interarea of glass substrate 100, thus glass substrate 100 is difficult to because of the contact of the side face with carrying roller 50 stained.In addition, owing to also there is chemical grinding liquid between the interarea and the side face of carrying roller 50 of glass substrate 100, therefore also suitably being ground by chemical grinding liquid with the part of the circumferential contact of carrying roller 50 of glass substrate 100.Consequently, transport even if glass substrate 100 is directly placed on carrying roller 50, be also difficult to such problem occurs, that is: produce the quality badness of the uneven or glass substrate 100 of chemical grinding process.Thus, even if do not use fixture, also suitably chemical grinding process can be implemented successively to glass substrate.
And then, as shown in Fig. 8 (B), about multiple spray tube 444 (444U, 444L), spray tube 282 (282U, 282L), spray tube 302 (302U, 302L) and spray tube 322 (322U, 322L) lapping liquid jet apparatus, preferably be arranged to: with the multiple spray tube 444U formed from the mode of upside jet grinding liquid, spray tube 282U, the jet power of spray tube 302U and spray tube 322U is compared, with the multiple spray tube 444L formed from the mode of downside jet grinding liquid, spray tube 282L, the jet power of spray tube 302L and spray tube 322L is stronger.Its reason is, by such formation, makes the raising force upwards lifting glass substrate 100 be applied to glass substrate 100.As shown in Fig. 8 (B), by making raising force act on glass substrate 100, reduce the friction between the interarea of glass substrate 100 and the side face of carrying roller 50 further.
Like this, owing to being configured to make the frictional force between the interarea of the side face of carrying roller 50 and glass substrate 100 reduce and not making foreign matter be attached to the side face of carrying roller 50 simultaneously, therefore, even if directly glass substrate 100 is positioned on carrying roller 50, be also difficult to make glass substrate 100 stained.Therefore, easily the arrangement of glass substrate 100 along carrying roller 50 is flatly transported.
In above-mentioned embodiment, carry out suppressing the process of pit and the example of slimming process to be described to glass substrate 100, in chemical abrasive device 10, can carry out cutting off the process on the process of the glass substrate 100 being attached with anti-etching dose of patterning, the surface of cleaning glass substrate 100 in addition.
The explanation in all respects of above-mentioned embodiment is illustration, should not think have restricted.Scope of the present invention is not by above-mentioned embodiment, but is represented by claims.And then scope of the present invention comprises and the meaning of patent claim equalization and the whole changes within the scope of this.
Nomenclature
2-the 2nd milled processed portion
4-the 1st milled processed portion
10-chemical abrasive device
12,62-loading unit
14,64-pretreatment chamber
16-the 3rd treatment chamber
18-the 4th treatment chamber
20-the 5th treatment chamber
22-the 6th treatment chamber
24,70-washes room
26-takes out of portion
28-the 2nd relay
30-the 3rd relay
32-the 4th relay
50-carrying roller
66-the 1st treatment chamber
68-the 2nd treatment chamber
72-the 1st relay
Claims (3)
1. a chemical abrasive device, consists of and is carried out chemical grinding process to along conveyance path by the multiple glass substrates transported continuously, it is characterized in that at least possessing:
1st milled processed portion, described 1st milled processed portion is configured to be used the 1st treatment solution to carry out chemical grinding process to along described conveyance path by the glass substrate transported,
2nd milled processed portion, described 2nd milled processed portion is configured to be used 2nd treatment solution different from described 1st treatment solution to carry out chemical grinding process to along described conveyance path by the glass substrate transported,
Washing portion, described washing portion is configured to the downstream side in the described 1st milled processed portion being configured in described conveyance path and the upstream side in described 2nd milled processed portion, and washing is attached to the treatment solution of described glass substrate.
2. chemical abrasive device according to claim 1, is characterized in that,
Described 1st milled processed portion has the multiple treatment chambers being configured to described 1st treatment solution to spray to described glass substrate; Further,
Described 2nd milled processed portion has the multiple treatment chambers being configured to described 2nd treatment solution to spray to described glass substrate.
3. the chemical abrasive device according to right 1 or 2, is characterized in that,
At least possess pretreatment portion further at the upstream side in described 1st milled processed portion, described pretreatment portion is configured to the surface wettability making the glass substrate before importing to described 1st milled processed portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012134708A JP5518133B2 (en) | 2012-06-14 | 2012-06-14 | Chemical polishing equipment |
| JP2012-134708 | 2012-06-14 | ||
| PCT/JP2013/064836 WO2013187232A1 (en) | 2012-06-14 | 2013-05-29 | Chemical polishing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104379527A true CN104379527A (en) | 2015-02-25 |
Family
ID=49758062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380021338.9A Pending CN104379527A (en) | 2012-06-14 | 2013-05-29 | Chemical polishing apparatus |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5518133B2 (en) |
| KR (1) | KR102021959B1 (en) |
| CN (1) | CN104379527A (en) |
| TW (1) | TWI607977B (en) |
| WO (1) | WO2013187232A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108602714A (en) * | 2016-01-29 | 2018-09-28 | 康宁股份有限公司 | Make the method that glass is thinning |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6013557B1 (en) * | 2015-06-02 | 2016-10-25 | 株式会社Ｎｓｃ | Spray etching equipment |
| JP6536830B2 (en) * | 2016-08-30 | 2019-07-03 | 株式会社Ｎｓｃ | Spray etching system |
| JP6497414B2 (en) * | 2017-06-22 | 2019-04-10 | 株式会社Ｎｓｃ | Glass surface treatment equipment |
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| JP4975169B1 (en) * | 2011-02-10 | 2012-07-11 | 株式会社Ｎｓｃ | Method and apparatus for manufacturing glass substrate |
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- 2013-05-29 WO PCT/JP2013/064836 patent/WO2013187232A1/en active Application Filing
- 2013-05-29 CN CN201380021338.9A patent/CN104379527A/en active Pending
- 2013-05-29 KR KR1020147030929A patent/KR102021959B1/en active IP Right Grant
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2013187232A1 (en) | 2013-12-19 |
| JP2013256427A (en) | 2013-12-26 |
| TW201410630A (en) | 2014-03-16 |
| KR20150030641A (en) | 2015-03-20 |
| JP5518133B2 (en) | 2014-06-11 |
| TWI607977B (en) | 2017-12-11 |
| KR102021959B1 (en) | 2019-09-17 |
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