JPH11307494A - Substrate processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the number of parts coming into slidable contact from a shutter mechanism opening or closing an opening of a process chamber and decrease the number of parts of the shutter mechanism. SOLUTION: This substrate processing device comprises a water cleaning process chamber 4 having an opening 4b and a shutter mechanism 70. The opening 4b of the water cleaning process chamber 4 is an opening for carrying a substrate. The shutter mechanism 70 has a round axis member 71 and a lid member 72. The round axis member 71 is disposed near the opening 4b to rotate. The lid member 72 has a greater area than the opening 4b. This shutter mechanism 70 opens or closes the opening 4b by integrally rotating the round axis member 71 and the lid member 72.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for processing various substrates, and in particular, to an FPD (Flat PDP) such as a substrate for a liquid crystal display.
A substrate processing apparatus for processing a substrate for an anel display, a substrate for a photomask, a printed substrate, and a semiconductor substrate in a processing chamber, comprising a shutter mechanism for opening and closing an opening of a processing chamber provided for transporting the substrate. About things.

[0002]

2. Description of the Related Art In general, a substrate processing apparatus has a plurality of processing chambers for supplying a processing liquid to a substrate to perform processing and drying the substrate. Then, the substrate is transported to these processing chambers and a series of processing is performed in order. In the processing chamber, for example, a chemical solution processing chamber for supplying a chemical solution to the substrate and performing a chemical solution process, a water washing process chamber for washing the substrate to which the chemical solution after the chemical solution is attached, and drying the substrate to which the droplets after the water washing process are attached. There is a drying processing chamber to be used. Each of these chambers is provided with an opening such as a substrate entrance and an exit for the substrate, and a shutter mechanism for opening and closing these openings is often provided. By providing the shutter mechanism in the opening, the atmosphere in each processing chamber is suppressed from flowing to the adjacent processing chamber.

FIG. 9 shows a conventional rack and pinion type shutter mechanism 10 formed in an opening of a substrate processing apparatus 100.
5 is shown. The substrate processing apparatus 100 has a pre-processing chamber 101 and an etching processing chamber 102. Here, after the substrate W is transferred from the pre-processing chamber 101 by the plurality of transport rollers 103 and is carried into the etching processing chamber 102, a predetermined chemical solution is sprayed here, so-called etching is performed, and the substrate W is subjected to a washing process or the like. Is carried out to the chamber.

[0004] A boundary wall 104 is provided between the pre-processing chamber 101 and the etching processing chamber 102, and a horizontally long opening 104 a for allowing the substrate W to pass therethrough is formed in the boundary wall 104. The substrate W sent from the pre-processing chamber 101 to the etching processing chamber 102 by the transport roller 103 passes through the opening 104a. Such an opening is also provided on the boundary wall between the etching processing chamber 102 and the next chamber, but in the following description, the opening 104a will be described as a representative.

In the etching processing chamber 102, a chemical having a strong acidity is used as a chemical liquid to be sprayed on the substrate W. When such a chemical liquid enters the pre-processing chamber 101, it adversely affects the pre-processing chamber 101. Therefore, a shutter mechanism 105 is provided at the opening 104a of the boundary wall 104 so that the chemical solution does not enter. By operating the shutter mechanism 105, the opening 104 a is opened when the substrate W is fed into the etching processing chamber 102, and the opening 104 a is opened while the chemical solution is being injected in the etching processing chamber 102. Is closed.

The shutter mechanism 105 includes an opening 104
a guide plate 106 provided at a lower portion of the opening a with a gap from the boundary wall 104, a hinged door 107 disposed at a gap between the guide plate 106 and the boundary wall 104, and a pair of left and right racks provided at a lower surface of the hinged door 107 108, and horizontal axis 10
A pair of left and right pinions 110 fixed around 9 and meshing with each rack 108 are provided. The horizontal axis 109 is rotationally driven by a driving unit (not shown).
By rotating the horizontal shaft 109 clockwise (the direction of the rotation arrow in FIG. 9), the pinion 110 rotates in the same direction, and the rack 108 meshing with the pinion 110 moves upward. As a result, the hinged door 107 is raised, and the opening 104a is opened.
Is closed. When the horizontal shaft 109 is rotated in the opposite direction, the hinged door 107 is lowered, and the opening 104a is opened.

However, in the shutter mechanism 105 as shown in FIG. 9, every time the door 107 is opened or closed, the door 107 moves up and down in a gap between the guide plate 106 and the boundary wall 104 in a sliding state. Therefore, the crystal of the chemical solution adhered to the surface of the boundary wall 104 or the inner wall surface of the guide plate 106 is separated, and the separated crystal is dusted by the sliding movement of the door 107, and adheres to the surface of the substrate W. As a result, there is a problem that the defect rate of the substrate W deteriorates. Further, since the hinged door 107 is wide in width, a moment acts on the hinged door 107 during the ascending and descending process, for example, when the left and right movement resistances are different due to clogging of a crystal or the like of a chemical solution, thereby causing the hinged door 107 to move to the boundary wall. There is also a problem that a so-called “torsion” occurs, which is inclined on the surface 104, and it is difficult to ascend and descend.

In order to solve these problems, the present applicant has proposed a link type shutter mechanism in Japanese Patent Application Laid-Open No. Hei 9-82775. FIG. 10 shows an example of a link-type shutter mechanism. Shutter mechanism 120
Are a pair of left and right brackets 121, a link mechanism 122 supported by these brackets 121, a closing plate 123 coupled to the link mechanism 122, and a link mechanism 12
2 is provided. Bracket 121
Has one end fixed to the boundary wall 104. Closing plate 12
3, a closing portion 123a and a substrate passage port 123b
Are formed. A notch 12 at the lower center of the closing plate 123 to avoid interference with the bracket 121
3c is formed. The link mechanism 122 has a first arm 131 and a second arm 132 provided in parallel outside the pair of left and right brackets 121, respectively, and the first arm 131 is rotatably supported by the bracket 121 and is rotatably fixed together. And a pair of brackets 134 fixed to the lower portion of the closing plate 123. One end of the first arm 131 and the second arm 132 is rotatably supported by the bracket 121, and the other end is rotatably supported by the bracket 134. Here, by rotating the shaft 133 clockwise (in the direction of the rotation arrow in FIG. 10) by the driving means, the closing plate 123 performs a circular motion while maintaining the parallel state with respect to the boundary wall 104, and The closing portion 123a closing the opening of the substrate 104 moves obliquely upward (moves to a position shown by a two-dot chain line in FIG.
23b moves to the height of the opening in the boundary wall 104.

[0009]

The shutter mechanism 1
In the case of the mechanism 20, since there are few sliding contact portions, the problem of deterioration of the defect rate of the substrate W due to dust generation and the like of the shutter mechanism 105 and the problem of “torsion” are almost eliminated. However, in the case of such a link-type shutter mechanism, the number of components increases as is clear from FIG.

SUMMARY OF THE INVENTION It is an object of the present invention to reduce the number of parts in sliding contact with a shutter mechanism for opening and closing an opening of a processing chamber of a substrate processing apparatus, and to reduce the number of parts of the shutter mechanism.

[0011]

According to a first aspect of the present invention, a substrate processing apparatus includes a first processing chamber having an opening and a first shutter mechanism. The opening of the first processing chamber is an opening for loading a substrate or unloading a substrate. The first shutter mechanism has a shaft and a lid. The shaft is located near the opening,
Rotate. The lid has an area larger than the opening. The first shutter mechanism opens and closes the opening by integrally rotating the shaft and the lid around the rotation axis of the shaft.

In the present substrate processing apparatus, when a substrate is carried into or out of the first processing chamber, an opening is opened by the first shutter mechanism to perform processing on the substrate in the first processing chamber. Sometimes the opening is closed by the first shutter mechanism. Here, since the first shutter mechanism opens and closes the opening by integrally rotating the shaft portion and the lid portion, the sliding contact portion is small, and problems such as dust generation are suppressed. Further, since the shaft and the cover are integrally rotated with a simple structure and a simple mechanism, the number of parts is reduced, and the manufacturing cost can be reduced.

According to a second aspect of the present invention, there is provided a substrate processing apparatus.
In the device described in (1), the lid is a plate-shaped member having a first closing plane and a fixing part. The first closing surface has a larger area than the opening, and is a surface that closes the opening. The fixing part is a part fixed to the shaft part. Here, the first shutter mechanism has an assembly having a structure in which a lid, which is a plate-shaped member, is fixed to the shaft, and the opening and closing of the opening is performed by integrally rotating the assembly around a rotation axis of the shaft. Is going. Also,
Since the lid has a plane (first closing plane) for closing the opening, the opening can be reliably closed.

A third aspect of the present invention provides a substrate processing apparatus.
Or in the device according to 2, wherein the first shutter mechanism comprises:
The shaft and the lid are rotated approximately 90 °. By rotating the shaft and the lid approximately 90 ° in this manner, the first shutter mechanism removes the lid from the path for loading or unloading the substrate, and shifts the state from the closed state to the opened state. . Further, the first shutter mechanism closes the opening with the lid by rotating the shaft and the lid by approximately 90 °, and shifts the state from the opened state to the closed state.

According to a fourth aspect of the present invention, a substrate processing apparatus includes a second processing chamber having an opening, and a second shutter mechanism. The opening of the second processing chamber is an opening for carrying in a substrate or an opening for carrying out a substrate. The second shutter mechanism has a rod-shaped member, and opens and closes the opening by rotating the rod-shaped member. The rod-shaped member has a second closing surface for closing the opening and a passage opening larger than the cross-sectional area of the substrate.

In the present substrate processing apparatus, when a substrate is carried into or out of the second processing chamber, an opening is opened by the second shutter mechanism to perform processing on the substrate in the second processing chamber. At times, the opening is closed by the second shutter mechanism. Here, since the second shutter mechanism opens and closes the opening by rotating the rod-shaped member having the second closing surface and the passage port formed therein, the sliding contact portion is small, and problems such as dust generation are suppressed. In addition, since it has a simple structure and a simple mechanism for rotating the rod-shaped member, the number of parts is reduced and the manufacturing cost can be suppressed.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus according to the fourth aspect.
, The rod-shaped member has a cylindrical shape. Then, a part of the circumferential surface of the rod-shaped member having the cylindrical shape becomes the second closed surface. In addition, the passage port is provided at a central portion of the rod-shaped member. In the present substrate processing apparatus, when the second closing surface is at the position closing the opening, the opening is closed, and when the passage opening is at a position corresponding to the opening, the opening is open. Here, since the rod-shaped member has a cylindrical shape, even when the rod-shaped member is close to the opening and the wall of the second processing chamber near the opening, interference between the rod-shaped member and the wall of the second processing chamber due to the rotation of the rod-shaped member is obtained. Can be avoided.

According to a sixth aspect of the present invention, there is provided a substrate processing apparatus according to the fourth aspect.
Or the device according to 5, wherein the second shutter mechanism is
The rod is rotated approximately 90 °. By rotating the rod-like member approximately 90 ° in this manner, the second shutter mechanism removes the second closing surface from the path for loading or unloading the substrate, makes the passage opening correspond to the opening, and opens the opening from the closed state. Move to open state. In addition, the second shutter mechanism closes the opening with the second closing surface by rotating the rod-like member approximately 90 °, and shifts from the state where the opening is opened to the state where the opening is closed.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] FIG. 1 shows a substrate processing apparatus 1 according to one embodiment of the present invention. The substrate processing apparatus 1 is an apparatus that performs an etching process on a thin film formed on a glass substrate W for a liquid crystal display, and mainly includes an inlet conveyor chamber 2, an etching chamber 3, a rinsing chamber 4, and a drying / unloading chamber. Chamber 5
And transport rollers 6 provided in each of the chambers 2 to 5. The substrate W is transported by the transport rollers 6 from the entrance conveyor chamber 2 to the drying / unloading chamber 5 (the direction along the dashed line in FIGS. 1 to 3 and the direction of the arrow D in FIGS. 1 to 3). ).

The transport rollers 6 are arranged so that their longitudinal directions are orthogonal to the transport direction D of the substrate W, and transport the substrate W while holding it in a horizontal state. In this way, a transport path P (a chain line in FIGS. 1 to 3) through which the substrate W passes is formed above the transport roller 6. 2 and 3 show a shutter mechanism 70 provided in the inlet conveyor chamber 2 and the washing processing chamber 4. 2 and 3 are enlarged views of a portion II surrounded by a two-dot chain line in FIG.

When a substrate W having a thin film formed on its surface is carried to the substrate processing apparatus 1, the substrate W is first carried into the entrance conveyor chamber 2. Thereafter, the substrate W is moved to the etching chamber 3 by the transport roller 6.
In the etching chamber 3, a chemical solution for etching is sprayed on the substrate W, and a thin film on the substrate surface is etched by a predetermined thickness. The substrate W thus etched is
Next, the substrate is sent to the washing processing chamber 4 and the chemical solution attached to the substrate W is washed away. Then, the substrate W that has been subjected to the water washing process is carried out after the drying process by air blowing is performed in the drying / unloading chamber 5.

The entrance conveyor chamber 2 is provided with a shutter mechanism (first shutter mechanism) 70 for opening and closing an opening 2b provided on the side wall 2a on the side of the etching chamber 3 for securing a transfer path P for the substrate W. (See FIGS. 2 and 3). The shutter mechanism 70 will be described later. As shown in FIG. 1, the etching chamber 3 is mainly used when the substrate W is swung along the transport path P by the transport roller 6 using the upper spray 31 and the lower spray 32 for injecting a chemical solution onto the substrate W. Position sensors 33 and 34 for performing the etching and an optical reflection type EPS (end point sensor) 35 for detecting the end point of the etching are arranged. In the etching processing chamber 3, the end of the etching is automatically detected by the EPS 35. In the meantime, the substrate W reciprocates between the position sensors 33 and 34, and the substrate W oscillates. Chemical liquids are injected from 31, 32.

The washing chamber 4 mainly includes an upper cleaning spray 41, a lower cleaning spray 42, position sensors 43 and 44, and a shutter mechanism 70. The upper and lower cleaning sprays 41, 42
Is sprayed with pure water, which is a treatment liquid for washing. The position sensors 43 and 44 are optical fiber sensors that detect the position of the substrate W in the washing processing chamber 4 along the substrate transport direction D. The shutter mechanism 70 has the same structure as that provided in the entrance conveyor chamber 2, and includes a side wall 4 on the etching processing chamber 3 side.
The opening 4b for securing the transfer path P of the substrate W provided at the position a is opened and closed (see FIGS. 2 and 3). The shutter mechanism 70 will be described later. When the substrate W having been subjected to the etching process with the chemical solution in the etching process chamber 3 and having the chemical solution attached thereto is sent to the rinsing process chamber 4 by the transport roller 6, the substrate W is moved by the position sensors 43 and 44 for a predetermined time. Is repeated, and at this time, pure water is jetted from the upper and lower cleaning sprays 41 and 42 onto the substrate W.
The pure water comes into contact with and collides with the substrate W, and the chemical solution attached to the substrate W is washed away from the substrate W. Pure water contaminated by washing the substrate W and mixing with the chemical solution is discharged from the lower portion of the washing processing chamber 4.

The drying / unloading chamber 5 is provided with upper and lower air knives 51 and 52 for injecting dry air onto the substrate W. In the drying / unloading chamber 5, the pure water remaining on the substrate W after the rinsing processing in the rinsing processing chamber 4 is blown off by the dry air jetted from the air knives 51 and 52 to dry the substrate W. Next, the shutter mechanism 70 provided in the inlet conveyor chamber 2 and the washing processing chamber 4 will be described.

As shown in FIGS. 2 and 3, the shutter mechanism 70 is disposed near the opening 4b (2b), and includes a round shaft member (shaft portion) 71 and a plate-like lid member (lid portion). 7
And a shutter composed of a round shaft member 7
And a driving means (not shown) for rotating the rotation center about one rotation center axis. The round shaft member 71 is provided so that its longitudinal direction is orthogonal to the transport direction D of the substrate W, and is rotatably supported by the chamber. Fixed members 73 are fixed to the round shaft member 71 at two places (see FIG. 4). The fixing member 73 is substantially a rectangular parallelepiped, and has a cylindrical hole penetrating the center. The fixing member 73 is fixed to the round shaft member 71 with the round shaft member 71 penetrating the cylindrical hole.

As shown in FIG. 2 to FIG.
It is a plate-shaped member on which a plane (first closing plane) 72a having a width dimension and a height dimension larger than the opening 4b (2b) is formed. The lid member 72 has a fixing portion 72b extending from a portion where the plane surface 72a is formed.
By being bolted to 3, it is non-rotatably fixed to the round shaft member 71.

The shutter composed of the round shaft member 71 and the lid member 72 is rotated by 90 ° by the driving means, and the state shown in FIGS. 2 and 3 is repeated. 4 and 5 are perspective views showing the state of the shutter of FIGS. 2 and 3. FIG. The state shown in FIGS.
b (2b) is closed. At this time, the plane 7
2a covers the opening 4b (2b) to prevent the atmosphere of the etching processing chamber 3 from entering the washing processing chamber 4 (entrance conveyor chamber 2). The etching processing chamber 3 and the rinsing processing chamber 4 (the inlet conveyor chamber 2) are connected via a chamber connecting member 9 mounted inside the substrate transfer opening of both chambers.

The state shown in FIG. 3 and FIG.
b (2b) is open. At this time, the plane 7
2a is removed from the opening 4b (2b) and also from the transfer path P of the substrate W, thereby enabling the transfer of the substrate W between the etching processing chamber 3 and the rinsing processing chamber 4 (entrance conveyor chamber 2). In the present substrate processing apparatus 1, the substrate W is carried out from the entrance conveyor chamber 2 and carried into the etching processing chamber 3, and the substrate W is carried out from the etching processing chamber 3 and carried into the washing processing chamber 4. At times, the openings 2b and 4b are opened by the respective shutter mechanisms 70, and control is performed so that the shutters of both shutter mechanisms 70 close the openings 2b and 4b when performing the chemical treatment on the substrate W in the etching processing chamber 3. With such control, when the substrate W is being subjected to the chemical treatment in the etching chamber 3, the atmosphere containing the chemical in the etching chamber 3 may enter the inlet conveyor chamber 2 and the washing chamber 4. Is prevented.

Here, by rotating a shutter composed of the round shaft member 71 and the lid member 72, the opening 4b (2
Since the opening and closing of b) is performed, there is almost no sliding contact portion, and the substrate W is not adversely affected by dust generation or the like. Also,
Since the shutter has a simple structure including the round shaft member 71 and the lid member 72 and is opened and closed by a simple mechanism for rotating the shutter, the number of parts is reduced and the manufacturing cost is reduced.

Further, since the flat surface 72a for closing the opening is formed in the lid member 72, the sealing state of the opening 4b (2b) is high, so that the intrusion of the atmosphere from the etching chamber 3 can be reliably prevented. ing. Here, the shutter composed of the round shaft member 71 and the lid member 72 is 9
The opening 4b (2b) is opened and closed by rotating by 0 °, but if the lid member 72 is displaced from the transport path P of the substrate W, 9
There is no problem even if the rotation angle is less than 0 °.

[Second Embodiment] Instead of the shutter mechanism 70 of the above embodiment, a shutter mechanism (second shutter mechanism) using a rod-shaped shutter member 81 shown in FIGS. 6 to 8 may be employed. This shutter mechanism includes a rod-shaped shutter member 81 shown in FIG. 8 and driving means (not shown) for rotating the rod-shaped shutter member 81.

The rod-shaped shutter member 81 is shown in FIGS.
As shown in (2), it is arranged near the opening 4b (2b) of the washing processing chamber 4 (entrance conveyor chamber 2). The rod-shaped shutter member 81 includes a large-diameter portion 81e having a diameter larger than the height of the opening 4b (2b), and a small-diameter portion 81d extending outward from both ends of the large-diameter portion 81e. It is rotatably supported by the washing processing chamber 4 (the entrance conveyor chamber 2). Large diameter part 81
An opening (passing opening) 81b is formed at the center of the center portion e, and a solid portion 81c in which both ends of the large-diameter portion 81e are solid.
It has become. The area of the opening 81b is larger than the cross-sectional area of the substrate W, and the substrate W can pass through the opening 81b. Large-diameter portion 81 other than opening 81b connecting both solid portions 81c
The surface of the central portion of e is a surface 8 having an elongated arc shape.
1a, and this surface 81a is a surface that closes the opening 4b (2b) (see FIG. 6).

The driving means is means for rotating a portion of the small-diameter portion 81d of the rod-shaped shutter member 81 that protrudes out of the chamber by 90 ° in a constant rotation direction by 90 °. By rotating the small-diameter portion 81d, the rod-shaped shutter is rotated. The entire member 81 is rotated. This rod-shaped shutter member 81
As shown in FIGS. 6 and 7, the outer peripheral surface of the large-diameter portion 81 e is arranged at a position where the outer peripheral surface of the large-diameter portion 81 e has a slight gap for avoiding interference with the chamber connecting member 9.

In this shutter mechanism, the surface 81a is removed from the opening 4b (2b) and the transport path P of the substrate W by rotating the rod-shaped shutter member 81 by 90 °, and the opening 81b of the rod-shaped shutter member 81 is moved to the opening 4b of the chamber.
Corresponding to b (2b), the state where the opening 4b (2b) shown in FIG. 6 is closed is shifted to the state where the opening 4b (2b) shown in FIG. 7 is opened. Further, by further rotating the rod-shaped shutter member 81 by 90 ° in the same direction, the opening 4b (2b) is closed by the surface 81a, and the opening 4b (2b) shown in FIG.
From the open state to the state in which the opening 4b (2b) shown in FIG. 6 is closed.

In the present embodiment, when the substrate W is carried out from the entrance conveyor chamber 2 and is carried into the etching processing chamber 3, and when the substrate W is carried out from the etching processing chamber 3, the substrate W is transferred into the washing processing chamber 4. When carrying in, the opening 2b (4b) is opened by each shutter mechanism, and when performing the chemical treatment on the substrate W in the etching chamber 3, the opening 2b and the opening 4b are closed by the rod-shaped shutter members 81 of both shutter mechanisms. I do. With such control, when the substrate W is being subjected to the chemical treatment in the etching chamber 3, the atmosphere containing the chemical in the etching chamber 3 may enter the inlet conveyor chamber 2 and the washing chamber 4. Is prevented.

Here, since the shutter mechanism opens and closes the opening by rotating the rod-shaped shutter member 81, there is almost no sliding contact portion, and problems such as dust generation are suppressed. In addition, since the simple structure and the simple mechanism that only rotates the rod-shaped shutter member 81 are used, the number of components is reduced, and the manufacturing cost can be reduced. Further, since it is only necessary to rotate the rod-shaped shutter member 81 in one direction and there is no need to rotate the rod-shaped shutter member 81 forward and backward, the mechanism for rotating the rod-shaped shutter member 81 by the driving means also has a simple structure.

Since the large-diameter portion 81e of the rod-shaped shutter member 81 has a cylindrical shape as shown in FIGS. 6 to 8, the rod-shaped shutter member 81 has the opening 4b (2
b) Chamber connecting member 9 and opening 4 mounted on
Even when approaching the side wall 4a (2a) of the chamber near b (2b), interference between the rod-shaped shutter member 81 and the chamber connecting member 9 and the side wall 4a (2a) of the chamber due to the rotation of the rod-shaped shutter member 81 can be avoided.

Here, as shown in FIGS. 6 and 7, a corner portion of the chamber connecting member 9 is appropriately chamfered so as to further suppress the intrusion of the atmosphere into the etching processing chamber 3. Although the substrate processing apparatus of the above embodiment processes a glass substrate for a liquid crystal display, the present invention may be applied to a substrate processing apparatus for processing a silicon wafer for a semiconductor substrate. Also,
The present invention may be applied to a substrate processing apparatus that accommodates and processes a plurality of substrates in each chamber.

[0039]

According to the present invention, the first shutter mechanism opens and closes the opening by integrally rotating the shaft and the lid, or the second shutter mechanism has a second closing surface and a passage opening. Since the opening and closing of the opening is performed by rotating the rod-shaped member, the sliding contact portion is small, and problems such as dust generation are suppressed.

In addition, because of the simple structure and simple mechanism for rotating the shaft and the lid integrally, or the simple structure and simple mechanism for rotating the rod-shaped member, the number of parts is reduced and the manufacturing cost is reduced. Can be suppressed.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view near a shutter mechanism.

FIG. 3 is a cross-sectional view near a shutter mechanism.

FIG. 4 is a perspective view near a shutter mechanism.

FIG. 5 is a perspective view near a shutter mechanism.

FIG. 6 is a cross-sectional view near a shutter mechanism according to a second embodiment.

FIG. 7 is a sectional view near a shutter mechanism according to a second embodiment.

FIG. 8 is a perspective view of a rod-shaped shutter member according to a second embodiment.

FIG. 9 is a perspective view of a conventional shutter mechanism.

FIG. 10 is a perspective view of a conventional shutter mechanism.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Inlet conveyor chamber 2b opening 3 Etching processing chamber 4 Rinse processing chamber 4b opening 5 Drying unloading chamber 9 Chamber connecting member 70 Shutter mechanism (first shutter mechanism) 71 Round shaft member (shaft portion) 72 Lid member (Lid) Part) 72a Plane (first closed plane) 72b Fixed part 81 Bar-shaped shutter member (bar-shaped member) 81a Surface (second closed surface) 81b Opening (passing opening)

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI C23F 1/08 C23F 1/08 H01L 21/306 H01L 21/68 A 21/68 H05K 3/06 A H05K 3/06 B05C 13 / 02 // B05C 13/02 H01L 21/306 J

Claims (6)

[Claims] A first processing chamber having an opening for carrying a substrate in or out of the substrate; a rotating shaft disposed near the opening; and a larger area than the opening. A substrate processing apparatus, comprising: a lid; and a first shutter mechanism that opens and closes the opening by integrally rotating the shaft and the lid about a rotation axis of the shaft. 2. The cover according to claim 1, wherein the lid is a plate-shaped member having an area larger than the opening and having a first closing plane that covers the opening and a fixing part fixed to the shaft. A substrate processing apparatus according to claim 1. 3. The first shutter mechanism according to claim 2, wherein said lid is removed from a path for loading or unloading a substrate by rotating said shaft and said lid by approximately 90 °, and said opening is closed from said closed state. 3. The apparatus according to claim 1, wherein the state is changed to an opened state, or the state is changed from a state in which the opening is closed by closing the opening with the lid to a state in which the opening is closed.
A substrate processing apparatus according to claim 1. 4. A second processing chamber having an opening for loading or unloading a substrate, a second closing surface for closing the opening, and a passage opening larger than a cross-sectional area of the substrate. And a second shutter mechanism that opens and closes the opening by rotating the rod-shaped member. 5. The rod-shaped member has a columnar shape, the second closing surface is a part of a circumferential surface of the rod-shaped member, and the passage port is provided at a central portion of the rod-shaped member. The substrate processing apparatus according to claim 4. 6. The second shutter mechanism rotates the rod-like member by approximately 90 ° to remove the second closing surface from a path for loading or unloading a substrate so that the passage port corresponds to the opening, and The method according to claim 4, wherein the state is changed from a closed state to a state in which the opening is opened, or the state is changed from a state in which the opening is closed by closing the opening with the second closing surface to a state in which the opening is closed. Substrate processing equipment.