JP2008076170A - Substrate inspection device - Google Patents

Substrate inspection device Download PDF

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JP2008076170A
JP2008076170A JP2006254456A JP2006254456A JP2008076170A JP 2008076170 A JP2008076170 A JP 2008076170A JP 2006254456 A JP2006254456 A JP 2006254456A JP 2006254456 A JP2006254456 A JP 2006254456A JP 2008076170 A JP2008076170 A JP 2008076170A
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substrate
compressed air
air
floating
inspection apparatus
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Masaru Matsumoto
勝 松本
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Olympus Corp
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Olympus Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate inspection device capable of inspecting a substrate in a state that the substrate is stably floated by compressed air. <P>SOLUTION: The substrate inspection device is equipped with a microscope head (inspection part) 3 for inspecting the surface of the substrate 2, a first floating part 6 for ejecting compressed air to float the substrate 2, the second floating part 7 adjacent to the side of the microscope head 3 of the first floating part 6 and arranged in the vicinity of the microscope head 3 to float the substrate 2, an suction feed stage (feed part) 8 for feeding the substrate 2 to the first floating part 6 and the second floating part 7 and the air discharge unit (discharge part) 10 arranged in the vicinity of the microscope head 3 to eject compressed air to the substrate 2 from above. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、基板検査装置に関する。   The present invention relates to a substrate inspection apparatus.

顕微鏡等を用いて液晶基板等のフラットパネルの表面の欠陥検査を行う基板検査装置は、近年、液晶基板の大型化に伴い、圧縮空気を吐出して基板を浮上させた状態で搬送、保持させるエアー浮上ステージ方式が広く採用されている。このような方式では、基板が大型化するにつれて基板平坦度の維持や矯正が困難となっていく。   2. Description of the Related Art In recent years, a substrate inspection apparatus for inspecting defects on the surface of a flat panel such as a liquid crystal substrate using a microscope or the like is transported and held in a state where the substrate is floated by discharging compressed air as the liquid crystal substrate becomes larger. The air levitation stage method is widely adopted. In such a system, it becomes difficult to maintain and correct the substrate flatness as the substrate becomes larger.

そこで、基板が検査位置に到達する前に基板の反り具合を予め検出し、その状況に応じて方向が決定されたノズルからエアーを吹き付けることによって、その圧力で基板の反りを矯正させるものが提案されている(例えば、特許文献1参照。)。また、基板を浮上させる浮上ブロックに隣接して、かつ、浮上ブロックよりも低い位置に、吸引ブロックが設けられ、浮上と吸引とを同時に行って基板の反りを矯正するものが提案されている(例えば、特許文献2参照。)。
特開2005−55207号公報 特開2004−331265号公報
Therefore, it is proposed to detect the warpage of the substrate in advance before it reaches the inspection position, and to correct the warpage of the substrate with the pressure by blowing air from the nozzle whose direction is determined according to the situation. (For example, refer to Patent Document 1). In addition, a suction block is provided adjacent to the floating block for levitating the substrate and at a position lower than the floating block, and the substrate is corrected by correcting the warpage of the substrate by performing the floating and the suction simultaneously ( For example, see Patent Document 2.)
JP 2005-55207 A JP 2004-331265 A

しかしながら、上記従来の基板検査装置では、基板の下方からの空気の吐出圧と基板の重力との間で支持させているので、わずかな外乱によって基板を振動させることがある。特に高倍率の顕微鏡観察や、微小線幅測定等の検査時には、基板の振動による不安定性が影響するので、基板を浮上させたままで検査を実施することが困難である。   However, since the conventional substrate inspection apparatus supports the substrate between the discharge pressure of air from below the substrate and the gravity of the substrate, the substrate may be vibrated by a slight disturbance. In particular, at the time of inspection such as high-magnification microscopic observation and measurement of a minute line width, instability due to vibration of the substrate affects, so that it is difficult to perform the inspection while the substrate is left floating.

また、振動による影響を排除するために、空気の吐出を一旦停止して基板を静止させた場合には、静電気により基板と浮上ブロックとが張り付いてしまい、タクトタイムが長くなってしまう。   In addition, in order to eliminate the influence of vibration, when the discharge of air is temporarily stopped and the substrate is stopped, the substrate and the floating block are stuck due to static electricity, and the tact time becomes long.

さらに、上記特許文献1に記載の基板検査装置では、基板の斜め方向から検査位置に向かってノズルが直接空気を吹き付けているので、このノズルを使用しても基板の振動を十分に排除することが困難である。また、上記特許文献2に記載の基板検査装置では、脈動を起こさない程度まで正圧から負圧への気流の流れを一定に保つのは困難であり、正圧と負圧との圧力バランスを維持することが難しい。   Furthermore, in the substrate inspection apparatus described in Patent Document 1, since the nozzle directly blows air from the oblique direction of the substrate toward the inspection position, vibration of the substrate can be sufficiently eliminated even if this nozzle is used. Is difficult. Further, in the substrate inspection apparatus described in Patent Document 2, it is difficult to keep the flow of air flow from positive pressure to negative pressure to an extent that does not cause pulsation, and the pressure balance between positive pressure and negative pressure is difficult to maintain. Difficult to maintain.

本発明は上記事情に鑑みて成されたものであり、基板を圧縮空気で安定的に浮上させたままの状態で検査を行うことができる基板検査装置を提供することを目的とする。   The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate inspection apparatus capable of performing an inspection while the substrate is stably floated with compressed air.

本発明は、上記課題を解決するため、以下の手段を採用する。
本発明に係る基板検査装置は、基板の表面を検査する検査部と、圧縮空気を噴出して前記基板を浮上させる第一浮上部と、該第一浮上部の前記検査部側に隣接して前記検査部近傍に配されて前記基板を浮上させる第二浮上部と、前記第一浮上部及び前記第二浮上部に対して、前記基板を非接触状態で搬送する搬送部と、前記検査部近傍に配されて、前記基板の上方から該基板に向かって圧縮空気を噴き出す吐出部と、を備えていることを特徴とする。
The present invention employs the following means in order to solve the above problems.
A substrate inspection apparatus according to the present invention includes an inspection unit that inspects a surface of a substrate, a first floating portion that ejects compressed air to float the substrate, and the first floating portion adjacent to the inspection portion side. A second floating part that is arranged in the vicinity of the inspection unit and floats the substrate; a transport unit that transports the substrate in a non-contact state with respect to the first floating part and the second floating part; and the inspection unit And a discharge portion that is disposed in the vicinity and that ejects compressed air from above the substrate toward the substrate.

本発明によれば、第二浮上部と吐出部との間で基板を挟んだ状態で圧縮空気をともに基板に噴き出すことができ、検査部近傍に基板を圧縮空気で浮上させて安定的に保持することができる。従って、基板を浮上させた状態で検査することができ、タクトタイムのロスや、基板の貼り付けを抑えることができる。   According to the present invention, the compressed air can be ejected to the substrate together with the substrate sandwiched between the second floating part and the discharge unit, and the substrate is floated by the compressed air in the vicinity of the inspection unit and stably held. can do. Accordingly, the inspection can be performed in a state where the substrate is floated, and loss of tact time and attachment of the substrate can be suppressed.

本発明に係る第1の実施形態について、図1から図5を参照して説明する。
本実施形態に係る基板検査装置1は、図1及び図2に示すように、基板2の表面を検査する検査部として、例えば、顕微鏡ヘッド3を有する検査ステージ5と、圧縮空気を噴出して基板2を浮上させる第一浮上部6と、顕微鏡ヘッド3の検査領域に配されて、基板2を第一浮上部6よりも精密な浮上高さで浮上させる第二浮上部7と、第一浮上部6及び第二浮上部7に対して、基板2を非接触状態で搬送方向Lに向かって搬送する吸着搬送ステージ(搬送部)8と、顕微鏡ヘッド3に配されて、基板2の上方から基板2に向かって圧縮空気を噴き出すエアー吐出ユニット(吐出部)10とを備えている。
A first embodiment according to the present invention will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the substrate inspection apparatus 1 according to the present embodiment, as an inspection unit for inspecting the surface of the substrate 2, for example, inspects an inspection stage 5 having a microscope head 3 and jets compressed air. A first floating portion 6 that floats the substrate 2, a second floating portion 7 that is disposed in the inspection region of the microscope head 3 and floats the substrate 2 at a higher flying height than the first floating portion 6, An adsorption conveyance stage (conveyance unit) 8 that conveys the substrate 2 toward the conveyance direction L in a non-contact state with respect to the floating portion 6 and the second floating portion 7, and the microscope head 3. And an air discharge unit (discharge unit) 10 that discharges compressed air toward the substrate 2.

検査ステージ5は、基板2の搬送方向Lに対して直交する方向に基板2を横断するように設けられた門型フレーム11を備えている。顕微鏡ヘッド3は、基板2全体を観察するために門型フレーム11の長手方向に移動可能に配されており、基板2に対向して配された対物レンズ12とを備えている。   The inspection stage 5 includes a portal frame 11 provided so as to cross the substrate 2 in a direction orthogonal to the conveyance direction L of the substrate 2. The microscope head 3 is arranged so as to be movable in the longitudinal direction of the portal frame 11 in order to observe the entire substrate 2, and includes an objective lens 12 arranged facing the substrate 2.

吸着搬送ステージ8は、第一浮上部6及び第二浮上部7が載置された定盤13上に、第一浮上部6及び第二浮上部7により構成された基板搬送路の外側に沿って敷設されたリニアガイド8Aと、リニアガイド8A上を走行するスライダ8Bと、スライダ8Bに所定の間隔にて複数設けられた昇降ベース8Cと、各昇降ベース8Cに昇降可能に設けられた吸着ベース15Aと、各吸着ベース15A上に所定の間隔で複数設けられ、基板2の下面を吸引して基板2を吸着させる吸着パッド15Bと、吸着ベース15A上に昇降可能に設けられた3個の基準ピン16及び1個の後述する押圧ピン17とを備えている。定盤13には、基板2を基準ピン16に押し付け、基準位置に位置決めする押圧ピン17が設けられている。   The suction conveyance stage 8 is arranged on the surface plate 13 on which the first floating portion 6 and the second floating portion 7 are placed, along the outside of the substrate conveyance path constituted by the first floating portion 6 and the second floating portion 7. Linear guides 8A laid on each other, sliders 8B traveling on the linear guides 8A, a plurality of lifting bases 8C provided at predetermined intervals on the sliders 8B, and suction bases provided on the respective lifting bases 8C so as to be movable up and down. 15A, a plurality of suction pads 15B provided at predetermined intervals on each suction base 15A, sucking the lower surface of the substrate 2 to suck the substrate 2, and three references provided on the suction base 15A so as to be movable up and down A pin 16 and one pressing pin 17 to be described later are provided. The surface plate 13 is provided with a pressing pin 17 that presses the substrate 2 against the reference pin 16 and positions the substrate 2 at the reference position.

第一浮上部6は、顕微鏡ステージ5の検査領域に配置された第二浮上部7を挟んで基板2の搬入、搬出側のそれぞれに配されている。この第一浮上部6には、細長い矩形の搬送面にエアー噴出孔Nが多数形成されたエアー浮上ブロック18が、所定の間隔18aに離間した状態で複数配されている。各エアー浮上ブロック18内の図示しないバッファ空間には、図示しない空気供給源が接続され、バッファ空間を介して各エアー噴出孔Nより圧縮空気が噴き出される。   The first floating part 6 is arranged on each of the carry-in and carry-out sides of the substrate 2 with the second floating part 7 arranged in the inspection area of the microscope stage 5 interposed therebetween. A plurality of air levitation blocks 18 each having a plurality of air ejection holes N formed on a long and narrow rectangular conveying surface are disposed in the first floating portion 6 in a state of being separated by a predetermined interval 18a. An unillustrated air supply source is connected to a buffer space (not shown) in each air floating block 18, and compressed air is ejected from each air ejection hole N through the buffer space.

第二浮上部7は、基板搬送方向Lの上流側及び下流側のそれぞれに配置された第一浮上部6の間に配されて、搬送面にエアー噴出孔Nが第一浮上部6よりも密に、かつ、多数形成された精密エアー浮上ブロック20A,20Bを備えている。精密エアー浮上ブロック20A,20Bは、透過照明用の隙間20aを挟んで、搬送方向Lに直交する方向に隙間なく複数配されている。隙間20aは、顕微鏡ヘッド3の光軸の移動ライン上に設けられ、対物レンズ12と対向する基板2の裏面側に設けられた不図示の透過照明光源からの照明光が遮られない間隔に形成されている。   The second floating portion 7 is disposed between the first floating portions 6 arranged on the upstream side and the downstream side in the substrate transfer direction L, and the air ejection holes N are formed on the transfer surface from the first floating portion 6. It is provided with precise and high precision air levitation blocks 20A, 20B that are densely formed. A plurality of precision air levitation blocks 20A and 20B are arranged without a gap in a direction orthogonal to the conveyance direction L with a gap 20a for transmitted illumination interposed therebetween. The gap 20a is provided on the movement line of the optical axis of the microscope head 3, and is formed at an interval at which illumination light from a transmission illumination light source (not shown) provided on the back side of the substrate 2 facing the objective lens 12 is not blocked. Has been.

精密エアー浮上ブロック20A,20Bには、基板2に対向して空気供給源から供給される圧縮空気を上方に噴き出す複数のエアー噴出孔Nが均一かつ密に分布して設けられている。エアー浮上ブロック18及び精密エアー浮上ブロック20A,20Bは、それぞれの基板搬送面が同一平面上に配されるように高さが調整されている。   The precision air levitation blocks 20A and 20B are provided with a plurality of air ejection holes N that face the substrate 2 and eject compressed air supplied from an air supply source upwardly and uniformly. The height of the air levitation block 18 and the precision air levitation blocks 20A and 20B are adjusted so that the substrate transfer surfaces are arranged on the same plane.

エアー吐出ユニット10は、図3から図5に示すように、対物レンズ12と干渉しないようにその周囲に配されている。エアー吐出ユニット10は、矩形の噴出面21bを有するエアー吐出ブロック21を備えている。エアー吐出ブロック21は、エアー浮上ブロック18及び精密エアー浮上ブロック20A,20Bよりも小さく形成されている。これは、顕微鏡ヘッド3の周辺の少なくとも顕微鏡ヘッド3の観察視野領域よりも若干広い領域周縁部において、基板2の上方からエアーを吹き付けて、精密エアー浮上ブロック20A,20Bに対して基板2の浮上高さを高精度に規制できればよいからである。   As shown in FIGS. 3 to 5, the air discharge unit 10 is disposed around the objective lens 12 so as not to interfere with the objective lens 12. The air discharge unit 10 includes an air discharge block 21 having a rectangular ejection surface 21b. The air discharge block 21 is formed smaller than the air levitation block 18 and the precision air levitation blocks 20A and 20B. This is because air is blown from above the substrate 2 at least in the periphery of the microscope head 3 at least in the peripheral area of the observation field of the microscope head 3, and the substrate 2 floats over the precision air floating blocks 20A and 20B. This is because it is sufficient if the height can be regulated with high accuracy.

エアー吐出ブロック21は、搬送方向Lに直交する方向を長手方向として、かつ、顕微鏡ヘッド3の対物レンズ12を間に挟むようにして所定の間隔の隙間21aを形成して互いに離間した状態で配されている。噴出面21bには、基板2に対向して空気供給源から供給される圧縮空気を下方に噴き出す複数のエアー噴出孔21Aが均一かつ高密度に分布して設けられている。   The air discharge blocks 21 are arranged in a state of being spaced apart from each other by forming a gap 21a having a predetermined interval so that the longitudinal direction is a direction perpendicular to the conveyance direction L and the objective lens 12 of the microscope head 3 is sandwiched therebetween. Yes. The ejection surface 21b is provided with a plurality of air ejection holes 21A that are opposed to the substrate 2 and that eject compressed air supplied from an air supply source downwardly in a uniform and high density manner.

精密エアー浮上ブロック20A,20B及びエアー吐出ブロック21の噴出面21bは互いに平行に配されており、そのために圧縮空気が基板2の表面に対して直交する方向に噴出される。この際、第二浮上部7からの圧縮空気の吐出圧と、エアー吐出ユニット10からの圧縮空気の吐出圧とが、図示しない制御部によって個別に調整されるようになっている。   The precision air levitation blocks 20A and 20B and the ejection surfaces 21b of the air discharge block 21 are arranged in parallel to each other, so that compressed air is ejected in a direction perpendicular to the surface of the substrate 2. At this time, the discharge pressure of the compressed air from the second floating portion 7 and the discharge pressure of the compressed air from the air discharge unit 10 are individually adjusted by a control unit (not shown).

次に、本実施形態に係る基板検査装置1の作用について説明する。
まず、図示しない搬送ロボット等によって、基板2を第一浮上部6のエアー浮上ブロック18上に投入し、基準ピン16と押圧ピン17とによって基板2を浮上させた状態で基準位置に位置決めした後、この基板2の一端を吸着パッド15Bにより吸着保持させる。
Next, the operation of the substrate inspection apparatus 1 according to this embodiment will be described.
First, after the substrate 2 is put on the air floating block 18 of the first floating portion 6 by a transfer robot (not shown) and the substrate 2 is lifted by the reference pin 16 and the pressing pin 17, the substrate 2 is positioned at the reference position. Then, one end of the substrate 2 is sucked and held by the suction pad 15B.

この間、第一浮上部6からは、常に一定圧力の圧縮空気が上方に向かって噴出された状態となっている。そのため、基板2は、精密エアー浮上ブロック20A,20Bから一定の高さに浮上している。なお、基板2に当たった空気は、エアー浮上ブロック18間の隙間18aから外部へ排出される。   During this time, the compressed air having a constant pressure is always ejected upward from the first floating part 6. Therefore, the substrate 2 is levitated to a certain height from the precision air levitating blocks 20A and 20B. In addition, the air which hits the board | substrate 2 is discharged | emitted outside from the clearance gap 18a between the air floating blocks 18. FIG.

この状態で、吸着搬送ステージ8が検査ステージ5の方向に向かって移動して、基板2を第二浮上部7まで移動する。このとき、第二浮上部7からは、常に一定圧力の圧縮空気が上方に向かって噴出されている。一方、エアー吐出ユニット10からは、常に一定圧力の圧縮空気が下方に向かって噴出された状態となっている。即ち、エアー吐出ブロック21が配された領域に基板2が搬送されたときには、基板2が下方と上方とから空気で押圧される。   In this state, the suction conveyance stage 8 moves toward the inspection stage 5 to move the substrate 2 to the second floating portion 7. At this time, a constant pressure of compressed air is always ejected upward from the second floating portion 7. On the other hand, a constant pressure of compressed air is always ejected downward from the air discharge unit 10. That is, when the substrate 2 is transported to the area where the air discharge block 21 is disposed, the substrate 2 is pressed with air from below and above.

このとき、精密エアー浮上ブロック20A,20B及びエアー吐出ブロック21の噴出面21bから噴き出される空気圧が略同一の場合には、精密エアー浮上ブロック20A,20B及びエアー吐出ブロック21の噴出面21bの中間位置にて圧力がつりあう。そのため、基板2は該中間位置にて振動が抑えられた状態で保持される。ここで、基板2に上方又は下方への反りがある場合には、反った方向の噴出面からの空気圧をもう一つの噴出面からの空気圧より上げる。このときの差圧によって反りの部分が押されて、基板2の平坦度が矯正される。   At this time, when the air pressures ejected from the ejection surfaces 21b of the precision air levitation blocks 20A and 20B and the air discharge block 21 are substantially the same, they are intermediate between the precision air levitation blocks 20A and 20B and the ejection surface 21b of the air ejection block 21. Pressure is balanced at the position. Therefore, the substrate 2 is held in a state where vibration is suppressed at the intermediate position. Here, when the substrate 2 is warped upward or downward, the air pressure from the ejection surface in the warped direction is increased from the air pressure from the other ejection surface. The warped portion is pushed by the differential pressure at this time, and the flatness of the substrate 2 is corrected.

基板2が対物レンズ12の直下に配されたことを確認した後、顕微鏡ヘッド3内の図示しない落射照明系により対物レンズ12を介して基板2表面を観察する。この間、基板2は、吸着搬送ステージ8により搬送方向Lへの移動が継続されるので、基板2の全面が門型フレーム11を通過していく。こうして検査が終了した基板2は、吸着搬送ステージ8から取り外される。   After confirming that the substrate 2 is arranged immediately below the objective lens 12, the surface of the substrate 2 is observed through the objective lens 12 by an epi-illumination system (not shown) in the microscope head 3. During this time, since the substrate 2 continues to move in the transport direction L by the suction transport stage 8, the entire surface of the substrate 2 passes through the portal frame 11. The substrate 2 thus inspected is removed from the suction transfer stage 8.

なお、予め登録させた座標データに基づいて自動的に吸着搬送ステージを移動して、画像処理を用いてTFTを構成する微小な線幅を自動的に測定してもよい。   Alternatively, the suction conveyance stage may be automatically moved based on the coordinate data registered in advance, and the minute line width constituting the TFT may be automatically measured using image processing.

この基板検査装置1によれば、第二浮上部7とエアー吐出ユニット10との間で基板2を挟んだ状態で、圧縮空気をともに基板2に噴き出すことができ、顕微鏡ヘッド3の観察視野内に相当する基板2を安定的に保持することができる。   According to this substrate inspection apparatus 1, both compressed air can be ejected onto the substrate 2 while the substrate 2 is sandwiched between the second floating portion 7 and the air discharge unit 10, and within the observation field of view of the microscope head 3. The substrate 2 corresponding to can be stably held.

このとき、精密エアー浮上ブロック20A,20B及びエアー吐出ブロック21の噴出面21bとから圧縮空気を噴き出させるので、基板2に面圧を与えることができ、点状や線状に押圧する場合に比べて基板2をより均一に押圧して安定的に保持することができる。
また、圧縮空気を基板2の上下方向から同時に吹きつけるので、基板2が平面方向に移動しないように安定して保持させることができる。この際、噴出孔Nが均一に多数分布して配されているので、基板2に対して均一に圧縮空気を噴出させることができる。
At this time, since the compressed air is ejected from the precision air floating blocks 20A and 20B and the ejection surface 21b of the air discharge block 21, the surface pressure can be applied to the substrate 2 and it is pressed in a dotted or linear manner. In comparison, the substrate 2 can be pressed more uniformly and stably held.
Moreover, since compressed air is blown simultaneously from the up-down direction of the board | substrate 2, it can hold | maintain stably so that the board | substrate 2 may not move to a plane direction. At this time, since a large number of the ejection holes N are uniformly distributed, the compressed air can be ejected uniformly to the substrate 2.

さらに、第二浮上部7からの吐出圧とエアー吐出ユニット10からの吐出圧とを略同一にした場合には、両者の中間位置にて力がつりあうので、基板2を安定してその位置に保持させることができる。また、基板2に反り等がある場合には、吐出圧を異ならせることによって、基板2の平坦度を矯正させることができる。   Further, when the discharge pressure from the second floating portion 7 and the discharge pressure from the air discharge unit 10 are substantially the same, the force balances at the intermediate position between the two, so that the substrate 2 is stably placed at that position. Can be retained. When the substrate 2 is warped, the flatness of the substrate 2 can be corrected by changing the discharge pressure.

次に、第2の実施形態について図6を参照しながら説明する。
なお、上述した第1の実施形態と同様の構成要素には同一符号を付すとともに説明を省略する。
第2の実施形態と第1の実施形態との異なる点は、本実施形態に係る基板検査装置25のエアー吐出ユニット26のエアー吐出ブロック27が、図示しない基板の搬送方向Lを長手方向として、かつ、搬送方向Lに直交する方向に対して対物レンズ12を間に挟むように所定の間隔の隙間27aを形成して互いに離間した状態で配されているとした点である。
Next, a second embodiment will be described with reference to FIG.
In addition, the same code | symbol is attached | subjected to the component similar to 1st Embodiment mentioned above, and description is abbreviate | omitted.
The difference between the second embodiment and the first embodiment is that the air discharge block 27 of the air discharge unit 26 of the substrate inspection apparatus 25 according to this embodiment has a substrate transport direction L (not shown) as a longitudinal direction. In addition, a gap 27a having a predetermined interval is formed so as to sandwich the objective lens 12 with respect to a direction orthogonal to the transport direction L, and the gaps 27a are spaced apart from each other.

この基板検査装置25によれば、基板が対物レンズ12の直下を通過する際にも、エアー吐出ユニット26と第二浮上部7との間に基板が挟まれて保持された状態なので、対物レンズ12の直下において、第1の実施形態よりもより安定して基板を保持させることができる。   According to the substrate inspection apparatus 25, since the substrate is sandwiched and held between the air discharge unit 26 and the second floating portion 7 even when the substrate passes directly below the objective lens 12, the objective lens Just under 12, the substrate can be held more stably than in the first embodiment.

なお、本発明の技術範囲は上記実施の形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲において種々の変更を加えることが可能である。
例えば、上記実施形態では、エアー吐出ブロック21,27は、対物レンズ12の一方向からのみ取り囲むように配されたものとしているが、図7及び図8に示すように、四角状に、若しくは、輪帯状に形成されて、対物レンズ12を取り囲むようにエアー吐出ブロック28,30が配されたエアー吐出ユニット31,32でもよい。この場合、上記二つの実施形態よりも、より安定して基板を保持させることができる。
The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, in the above embodiment, the air discharge blocks 21 and 27 are arranged so as to surround only from one direction of the objective lens 12, but as shown in FIGS. The air discharge units 31 and 32 may be formed in a ring shape and provided with air discharge blocks 28 and 30 so as to surround the objective lens 12. In this case, the substrate can be held more stably than in the above two embodiments.

また、検査部を顕微鏡ヘッド3としているが、これに限らず、微小欠陥検査装置(パターン検査装置)の検査ヘッドとして、微小欠陥を検査するものであってもよい。また、基板検査装置が、微小範囲にレーザを照射して加工又は修復するレーザリペアユニットを備えていても構わない。   Moreover, although the inspection unit is the microscope head 3, the present invention is not limited to this, and a micro defect may be inspected as an inspection head of a micro defect inspection apparatus (pattern inspection apparatus). Further, the substrate inspection apparatus may include a laser repair unit that performs processing or repair by irradiating a minute range with a laser.

本発明の第1の実施形態に係る基板検査装置の概略を示す平面図である。It is a top view which shows the outline of the board | substrate inspection apparatus which concerns on the 1st Embodiment of this invention. 本発明の第1の実施形態に係る基板検査装置の概略を示す正面図である。It is a front view showing the outline of the substrate inspection device concerning a 1st embodiment of the present invention. 本発明の第1の実施形態に係る基板検査装置を示す要部正面図である。It is a principal part front view which shows the board | substrate inspection apparatus which concerns on the 1st Embodiment of this invention. 本発明の第1の実施形態に係る基板検査装置の作用を示す説明図である。It is explanatory drawing which shows the effect | action of the board | substrate inspection apparatus which concerns on the 1st Embodiment of this invention. 本発明の第1の実施形態に係る基板検査装置を示す要部平面図である。It is a principal part top view which shows the board | substrate inspection apparatus which concerns on the 1st Embodiment of this invention. 本発明の第2の実施形態に係る基板検査装置を示す要部平面図である。It is a principal part top view which shows the board | substrate inspection apparatus which concerns on the 2nd Embodiment of this invention. 本発明の第1の実施形態に係る基板検査装置の変形例を示す要部平面図である。It is a principal part top view which shows the modification of the board | substrate inspection apparatus which concerns on the 1st Embodiment of this invention. 本発明の第1の実施形態に係る基板検査装置の変形例を示す要部平面図である。It is a principal part top view which shows the modification of the board | substrate inspection apparatus which concerns on the 1st Embodiment of this invention.

符号の説明Explanation of symbols

1,25 基板検査装置
2 基板
3 顕微鏡ヘッド(検査部)
6 第一浮上部
7 第二浮上部
8 吸着搬送ステージ(搬送部)
10,26,31,32 エアー吐出ブロック(吐出部)
21b 上側噴出面
N 噴出孔
1,25 Substrate inspection device 2 Substrate 3 Microscope head (inspection unit)
6 1st floating part 7 2nd floating part 8 Adsorption conveyance stage (conveyance part)
10, 26, 31, 32 Air discharge block (discharge section)
21b Upper ejection surface N Ejection hole

Claims (5)

基板の表面を検査する検査部と、
圧縮空気を噴出して前記基板を浮上させる第一浮上部と、
該第一浮上部の前記検査部側に隣接して前記検査部近傍に配されて前記基板を浮上させる第二浮上部と、
前記第一浮上部及び前記第二浮上部に対して、前記基板を非接触状態で搬送する搬送部と、
前記検査部近傍に配されて、前記基板の上方から該基板に向かって圧縮空気を噴出する吐出部と、
を備えていることを特徴とする基板検査装置。
An inspection unit for inspecting the surface of the substrate;
A first levitating unit that ejects compressed air to float the substrate;
A second levitating part which is arranged in the vicinity of the inspection part adjacent to the inspection part side of the first floating part and floats the substrate;
A transport unit that transports the substrate in a non-contact state with respect to the first floating part and the second floating part,
A discharge unit disposed in the vicinity of the inspection unit and configured to eject compressed air from above the substrate toward the substrate;
A board inspection apparatus comprising:
前記圧縮空気を上方に噴き出す下側噴出面が、前記基板に対向するように前記第二浮上部に設けられ、かつ、前記圧縮空気を下方に噴き出す上側噴出面が、前記基板に対向するように前記吐出部に設けられていることを特徴とする請求項1に記載の基板検査装置。   A lower ejection surface for ejecting the compressed air upward is provided on the second floating portion so as to face the substrate, and an upper ejection surface for ejecting the compressed air downward is opposed to the substrate. The substrate inspection apparatus according to claim 1, wherein the substrate inspection apparatus is provided in the discharge unit. 前記下側噴出面及び前記上側噴出面が、平行に配され、
前記圧縮空気が、前記基板の表面に対して直交する方向に噴出されることを特徴とする請求項2に記載の基板検査装置。
The lower ejection surface and the upper ejection surface are arranged in parallel,
The substrate inspection apparatus according to claim 2, wherein the compressed air is ejected in a direction orthogonal to the surface of the substrate.
前記第二浮上部からの前記圧縮空気の吐出圧と、前記吐出部からの前記圧縮空気の吐出圧とが、個別に調整されることを特徴とする請求項1に記載の基板検査装置。   The board inspection apparatus according to claim 1, wherein a discharge pressure of the compressed air from the second floating part and a discharge pressure of the compressed air from the discharge unit are individually adjusted. 前記第二浮上部及び前記吐出部に、前記圧縮空気が噴き出される複数の噴出口がそれぞれ設けられ、
これら噴出口が、均一に分布して配されていることを特徴とする請求項1に記載の基板検査装置。
A plurality of jet outlets from which the compressed air is jetted are provided in the second floating part and the discharge part,
The board inspection apparatus according to claim 1, wherein the jet ports are uniformly distributed.
JP2006254456A 2006-09-20 2006-09-20 Substrate inspection device Pending JP2008076170A (en)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010159164A (en) * 2008-12-12 2010-07-22 Tokyo Electron Ltd Vacuum processing device, vacuum processing system and processing method
JP2011178529A (en) * 2010-03-02 2011-09-15 Ihi Corp Float transportation device
JP2012096920A (en) * 2010-11-05 2012-05-24 Hitachi High-Technologies Corp Glass substrate defect inspection device and glass substrate defect inspection method and glass substrate defect inspection system
CN102565092A (en) * 2010-09-27 2012-07-11 株式会社日立高新技术 Glass substrate defect inspection device and glass substrate defect inspection method
KR101185532B1 (en) 2009-12-30 2012-09-25 엘아이지에이디피 주식회사 Apparatus for transferring substrate and method using thereof
JP2015208780A (en) * 2014-04-23 2015-11-24 邦男 荒井 Laser processing method and apparatus
WO2016136495A1 (en) * 2015-02-27 2016-09-01 株式会社日本製鋼所 Gas floated workpiece support device and non-contact workpiece support method
JP2017089894A (en) * 2016-12-07 2017-05-25 株式会社日本製鋼所 Gas flotation workpiece support device
CN108840104A (en) * 2018-05-03 2018-11-20 拓卡奔马机电科技有限公司 Improve the method and air flotation conveying device of air bearing conveying cut-parts stability

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0529238A (en) * 1991-07-24 1993-02-05 Sharp Corp Dopant thermal diffusion device
JP2002151570A (en) * 2000-11-15 2002-05-24 Fuji Photo Film Co Ltd Substrate transfer system and method thereof using the same
JP2004123254A (en) * 2002-09-30 2004-04-22 Nippon Sekkei Kogyo:Kk Method of carrying large sheet material and its device
JP2004279335A (en) * 2003-03-18 2004-10-07 Olympus Corp Substrate inspection device
JP2004331265A (en) * 2003-05-01 2004-11-25 Olympus Corp Floating unit and substrate inspection device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0529238A (en) * 1991-07-24 1993-02-05 Sharp Corp Dopant thermal diffusion device
JP2002151570A (en) * 2000-11-15 2002-05-24 Fuji Photo Film Co Ltd Substrate transfer system and method thereof using the same
JP2004123254A (en) * 2002-09-30 2004-04-22 Nippon Sekkei Kogyo:Kk Method of carrying large sheet material and its device
JP2004279335A (en) * 2003-03-18 2004-10-07 Olympus Corp Substrate inspection device
JP2004331265A (en) * 2003-05-01 2004-11-25 Olympus Corp Floating unit and substrate inspection device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010159164A (en) * 2008-12-12 2010-07-22 Tokyo Electron Ltd Vacuum processing device, vacuum processing system and processing method
KR101185532B1 (en) 2009-12-30 2012-09-25 엘아이지에이디피 주식회사 Apparatus for transferring substrate and method using thereof
JP2011178529A (en) * 2010-03-02 2011-09-15 Ihi Corp Float transportation device
CN102565092A (en) * 2010-09-27 2012-07-11 株式会社日立高新技术 Glass substrate defect inspection device and glass substrate defect inspection method
JP2012096920A (en) * 2010-11-05 2012-05-24 Hitachi High-Technologies Corp Glass substrate defect inspection device and glass substrate defect inspection method and glass substrate defect inspection system
JP2015208780A (en) * 2014-04-23 2015-11-24 邦男 荒井 Laser processing method and apparatus
WO2016136495A1 (en) * 2015-02-27 2016-09-01 株式会社日本製鋼所 Gas floated workpiece support device and non-contact workpiece support method
JP2016161007A (en) * 2015-02-27 2016-09-05 株式会社日本製鋼所 Gas flotation workpiece support device and non-contact workpiece support method
CN107407329A (en) * 2015-02-27 2017-11-28 株式会社日本制钢所 Gas floating work-supporting means and non-contact work mounting s method
US10147625B2 (en) 2015-02-27 2018-12-04 The Japan Steel Works, Ltd. Gas floated workpiece supporting apparatus and noncontact workpiece support method
US10418262B2 (en) 2015-02-27 2019-09-17 The Japan Steel Works, Ltd. Gas floated workpiece supporting apparatus and noncontact workpiece support method
TWI710054B (en) * 2015-02-27 2020-11-11 日商日本製鋼所股份有限公司 Supporting device for gas floating on workpiece
JP2017089894A (en) * 2016-12-07 2017-05-25 株式会社日本製鋼所 Gas flotation workpiece support device
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CN108840104B (en) * 2018-05-03 2020-10-16 拓卡奔马机电科技有限公司 Method for improving stability of air-flotation conveying cut pieces and air-flotation conveying device

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