JP2009031301A - 2次元型検出器を用いた薄膜特性測定装置及びその測定方法 - Google Patents

2次元型検出器を用いた薄膜特性測定装置及びその測定方法 Download PDF

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Publication number
JP2009031301A
JP2009031301A JP2008235547A JP2008235547A JP2009031301A JP 2009031301 A JP2009031301 A JP 2009031301A JP 2008235547 A JP2008235547 A JP 2008235547A JP 2008235547 A JP2008235547 A JP 2008235547A JP 2009031301 A JP2009031301 A JP 2009031301A
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Japan
Prior art keywords
thin film
light
thickness
reflectance
refractive index
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Japanese (ja)
Inventor
Yeong Ryeol Kim
イェオング−リェオル キム,
Ji Jong Park
ジ−ジョング パク,
Jin Yong Kim
ジン−ヨング キム,
Joong Whan Lee
ジョオング−ワン リ,
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KMAC
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KMAC
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
JP2008235547A 2001-09-21 2008-09-12 2次元型検出器を用いた薄膜特性測定装置及びその測定方法 Pending JP2009031301A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20010058535 2001-09-21
KR10-2002-0057581A KR100490325B1 (ko) 2001-09-21 2002-09-23 2차원형 검출기를 이용한 박막 특성 측정 장치 및 그 측정 방법

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JP2003529082A Division JP4242767B2 (ja) 2001-09-21 2002-09-23 2次元型検出器を用いた薄膜特性測定装置及びその測定方法

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JP2009031301A true JP2009031301A (ja) 2009-02-12

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JP (1) JP2009031301A (zh)
KR (1) KR100490325B1 (zh)
CN (1) CN1808056B (zh)

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JP2015169553A (ja) * 2014-03-07 2015-09-28 株式会社リコー 屈折率測定装置
JP2018072051A (ja) * 2016-10-25 2018-05-10 株式会社ブルービジョン 光源装置及び撮像システム
JP2020504308A (ja) * 2017-01-09 2020-02-06 ユニティ・セミコンダクター・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングUnity Semiconductor Gmbh サンプルスタックにおける複数層の厚さを判断するための方法およびアセンブリ
WO2022180829A1 (ja) * 2021-02-26 2022-09-01 日本電信電話株式会社 非接触測定法
CN115101437A (zh) * 2022-08-26 2022-09-23 合肥新晶集成电路有限公司 晶圆的测试方法、测试装置以及晶圆测试系统

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KR100657154B1 (ko) * 2005-10-11 2006-12-13 동부일렉트로닉스 주식회사 보호층의 경화율 측정 방법
KR100936282B1 (ko) * 2007-07-13 2010-01-18 충북대학교 산학협력단 판유리의 굴절률 측정방법
KR100947031B1 (ko) 2008-04-03 2010-03-11 한국과학기술원 3파장 광원을 이용한 위상물체의 굴절률과 두께 측정장치및 그 방법
KR100990641B1 (ko) 2008-06-04 2010-10-29 삼성엘이디 주식회사 Led 검사 장치 및 그 방법
KR101010189B1 (ko) * 2008-06-30 2011-01-21 에스엔유 프리시젼 주식회사 두께 또는 표면형상 측정방법
KR101107507B1 (ko) * 2009-03-23 2012-01-31 에스엔유 프리시젼 주식회사 반사도분포곡선의 모델링방법 및 이를 이용하는 두께 측정방법, 두께 측정 반사계
KR101063753B1 (ko) * 2009-11-11 2011-09-14 한양대학교 산학협력단 텍스처가 형성된 시편에 증착된 박막의 특성 측정방법 및 이를 이용한 분광반사측정기
KR101088911B1 (ko) 2010-07-23 2011-12-07 삼성엘이디 주식회사 발광 디바이스 제조 장치 및 발광 디바이스 제조 방법
KR101289826B1 (ko) * 2011-06-15 2013-07-26 삼성전자주식회사 Led 검사 장치 및 그 방법
KR101388239B1 (ko) * 2012-11-19 2014-04-23 와이즈플래닛(주) 카메라와 가변파장 레이저를 이용한 다층막 두께 측정 검사장치
CN103673903A (zh) * 2013-12-23 2014-03-26 清华大学 薄膜厚度测量装置
KR101699604B1 (ko) * 2015-01-16 2017-01-25 한양대학교 산학협력단 도포 균일성 검사 장치
KR101650319B1 (ko) * 2015-03-06 2016-08-24 에스엔유 프리시젼 주식회사 컬러 카메라를 이용한 두께 측정방법 및 두께 측정장치
KR101655096B1 (ko) 2015-04-23 2016-09-08 에스엔유 프리시젼 주식회사 박막의 두께 측정방법
KR102169436B1 (ko) * 2016-03-07 2020-10-26 에이에스엠엘 네델란즈 비.브이. 조명 시스템 및 계측 시스템
DE102017007140A1 (de) * 2016-10-18 2018-04-19 Reifenhäuser GmbH & Co. KG Maschinenfabrik Verfahren zum indirekten Ableiten einer systematischen Abhängigkeit zwischen einer Einstellgröße und einer optischen Eigenschaft einer Folienbahn, Verfahren zum Anpassen der Qualität einer Folienbahn, Verfahren zum Herstellen einer Folienbahn sowie Vorrichtung zum Herstellen einer Folienbahn
JP2020106277A (ja) * 2018-12-26 2020-07-09 株式会社ディスコ 厚み計測装置、及び厚み計測装置を備えた加工装置
CN109764817A (zh) * 2019-01-14 2019-05-17 南京信息工程大学 非接触式透镜中心厚测量系统及方法
CN110044277B (zh) * 2019-04-04 2020-11-24 深圳市华星光电技术有限公司 框胶检测装置和框胶检测方法
JP7241663B2 (ja) * 2019-11-01 2023-03-17 東京エレクトロン株式会社 情報処理装置、情報処理方法、情報処理プログラム及び半導体製造装置
KR102273485B1 (ko) * 2019-12-05 2021-07-06 주식회사 신코 멀티형 형광측정기
CN112697080A (zh) * 2020-12-16 2021-04-23 长江存储科技有限责任公司 薄膜层厚度的测量方法
CN112798614A (zh) * 2020-12-25 2021-05-14 长江存储科技有限责任公司 一种半导体机台及检测方法
KR102570084B1 (ko) * 2021-06-28 2023-08-24 서울대학교산학협력단 3차원 반사도 곡면을 이용한 두께 측정 방법
CN113916775B (zh) * 2021-08-26 2024-05-03 中国工程物理研究院激光聚变研究中心 一种高辨识度漫反射靶
KR102609881B1 (ko) 2021-10-05 2023-12-05 한국광기술원 1차원 광센서를 이용한 2차원 형광 데이터 측정 장치
KR20230085350A (ko) 2021-12-07 2023-06-14 한국광기술원 1차원 광센서를 이용한 다중 웰 pcr 형광 측정 장치

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JPH0666524A (ja) * 1992-06-29 1994-03-08 Hughes Aircraft Co 変形した形状及び部分的に変化した傾斜を有する薄膜層上の薄膜層の厚みを計測学的に処理するための装置及びその方法
JPH09119812A (ja) * 1995-06-06 1997-05-06 Holtronic Technol Ltd 多層皮膜構造を特徴づけ、その皮膜に直面する2つの面の間の距離を測定する方法及び装置
JPH1114312A (ja) * 1997-06-24 1999-01-22 Toshiba Corp 成膜装置及びエッチング装置
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015169553A (ja) * 2014-03-07 2015-09-28 株式会社リコー 屈折率測定装置
JP2018072051A (ja) * 2016-10-25 2018-05-10 株式会社ブルービジョン 光源装置及び撮像システム
JP2020504308A (ja) * 2017-01-09 2020-02-06 ユニティ・セミコンダクター・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングUnity Semiconductor Gmbh サンプルスタックにおける複数層の厚さを判断するための方法およびアセンブリ
WO2022180829A1 (ja) * 2021-02-26 2022-09-01 日本電信電話株式会社 非接触測定法
CN115101437A (zh) * 2022-08-26 2022-09-23 合肥新晶集成电路有限公司 晶圆的测试方法、测试装置以及晶圆测试系统
CN115101437B (zh) * 2022-08-26 2024-02-06 合肥新晶集成电路有限公司 晶圆的测试方法、测试装置以及晶圆测试系统

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CN1808056A (zh) 2006-07-26
KR20030025891A (ko) 2003-03-29
KR100490325B1 (ko) 2005-05-17
CN1808056B (zh) 2011-09-14

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