JP2009016544A5 - - Google Patents

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Publication number
JP2009016544A5
JP2009016544A5 JP2007176209A JP2007176209A JP2009016544A5 JP 2009016544 A5 JP2009016544 A5 JP 2009016544A5 JP 2007176209 A JP2007176209 A JP 2007176209A JP 2007176209 A JP2007176209 A JP 2007176209A JP 2009016544 A5 JP2009016544 A5 JP 2009016544A5
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JP
Japan
Prior art keywords
semiconductor element
elastomer
heating
sheet member
mounting apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007176209A
Other languages
English (en)
Japanese (ja)
Other versions
JP5122192B2 (ja
JP2009016544A (ja
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Publication date
Application filed filed Critical
Priority to JP2007176209A priority Critical patent/JP5122192B2/ja
Priority claimed from JP2007176209A external-priority patent/JP5122192B2/ja
Publication of JP2009016544A publication Critical patent/JP2009016544A/ja
Publication of JP2009016544A5 publication Critical patent/JP2009016544A5/ja
Application granted granted Critical
Publication of JP5122192B2 publication Critical patent/JP5122192B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007176209A 2007-07-04 2007-07-04 半導体素子実装装置 Expired - Fee Related JP5122192B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007176209A JP5122192B2 (ja) 2007-07-04 2007-07-04 半導体素子実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007176209A JP5122192B2 (ja) 2007-07-04 2007-07-04 半導体素子実装装置

Publications (3)

Publication Number Publication Date
JP2009016544A JP2009016544A (ja) 2009-01-22
JP2009016544A5 true JP2009016544A5 (enExample) 2010-08-05
JP5122192B2 JP5122192B2 (ja) 2013-01-16

Family

ID=40357101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007176209A Expired - Fee Related JP5122192B2 (ja) 2007-07-04 2007-07-04 半導体素子実装装置

Country Status (1)

Country Link
JP (1) JP5122192B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5208205B2 (ja) * 2008-04-18 2013-06-12 パナソニック株式会社 フリップチップ実装方法とフリップチップ実装装置およびそれに使用されるツール保護シート
JP6043058B2 (ja) * 2011-11-07 2016-12-14 デクセリアルズ株式会社 接続装置、接続構造体の製造方法、チップスタック部品の製造方法及び電子部品の実装方法
KR101345037B1 (ko) * 2012-08-23 2013-12-26 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 제조 장치 및 그 방법
KR20170076652A (ko) * 2014-08-25 2017-07-04 토레이 엔지니어링 컴퍼니, 리미티드 실장용 헤드 및 그것을 사용한 실장 장치
JP7117805B2 (ja) * 2020-07-16 2022-08-15 株式会社新川 実装装置
JP7569247B2 (ja) * 2021-03-12 2024-10-17 キオクシア株式会社 半導体製造装置
US11676937B2 (en) * 2021-05-04 2023-06-13 Asmpt Singapore Pte. Ltd. Flexible sinter tool for bonding semiconductor devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4684502B2 (ja) * 2001-09-27 2011-05-18 日東電工株式会社 導電接続方法及びそれに用いる離型シート
JP2003258413A (ja) * 2002-03-06 2003-09-12 Nikkiso Co Ltd 回路素子の実装装置および実装方法
JP3921459B2 (ja) * 2003-07-11 2007-05-30 ソニーケミカル＆インフォメーションデバイス株式会社 電気部品の実装方法及び実装装置
JP4841431B2 (ja) * 2005-02-02 2011-12-21 ソニーケミカル＆インフォメーションデバイス株式会社 電気部品の実装装置
JP4619209B2 (ja) * 2005-06-28 2011-01-26 パナソニック株式会社 半導体素子実装方法および半導体素子実装装置

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