JP2008263049A5 - - Google Patents
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- Publication number
- JP2008263049A5 JP2008263049A5 JP2007104522A JP2007104522A JP2008263049A5 JP 2008263049 A5 JP2008263049 A5 JP 2008263049A5 JP 2007104522 A JP2007104522 A JP 2007104522A JP 2007104522 A JP2007104522 A JP 2007104522A JP 2008263049 A5 JP2008263049 A5 JP 2008263049A5
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- groove
- elastic member
- thermosetting resin
- flexible substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000463 material Substances 0.000 claims 10
- 239000011347 resin Substances 0.000 claims 10
- 229920005989 resin Polymers 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 9
- 229920001187 thermosetting polymer Polymers 0.000 claims 9
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 229920000800 acrylic rubber Polymers 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229920000058 polyacrylate Polymers 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007104522A JP2008263049A (ja) | 2007-04-12 | 2007-04-12 | 半導体装置、半導体装置の製造方法および液滴吐出装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007104522A JP2008263049A (ja) | 2007-04-12 | 2007-04-12 | 半導体装置、半導体装置の製造方法および液滴吐出装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008263049A JP2008263049A (ja) | 2008-10-30 |
| JP2008263049A5 true JP2008263049A5 (enExample) | 2010-05-27 |
Family
ID=39985308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007104522A Withdrawn JP2008263049A (ja) | 2007-04-12 | 2007-04-12 | 半導体装置、半導体装置の製造方法および液滴吐出装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008263049A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5631054B2 (ja) * | 2010-05-12 | 2014-11-26 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
| JP2016083861A (ja) * | 2014-10-27 | 2016-05-19 | セイコーエプソン株式会社 | 液体噴射ヘッドおよび液体噴射装置 |
-
2007
- 2007-04-12 JP JP2007104522A patent/JP2008263049A/ja not_active Withdrawn
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