JP2014022516A5 - - Google Patents
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- Publication number
- JP2014022516A5 JP2014022516A5 JP2012158807A JP2012158807A JP2014022516A5 JP 2014022516 A5 JP2014022516 A5 JP 2014022516A5 JP 2012158807 A JP2012158807 A JP 2012158807A JP 2012158807 A JP2012158807 A JP 2012158807A JP 2014022516 A5 JP2014022516 A5 JP 2014022516A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- electronic component
- sealing resin
- mounting structure
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 37
- 239000011347 resin Substances 0.000 claims 24
- 229920005989 resin Polymers 0.000 claims 24
- 238000007789 sealing Methods 0.000 claims 21
- 239000000758 substrate Substances 0.000 claims 11
- 238000005452 bending Methods 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 5
- 238000010438 heat treatment Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910052571 earthenware Inorganic materials 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012158807A JP6112796B2 (ja) | 2012-07-17 | 2012-07-17 | 半導体装置実装構造体 |
| US13/932,333 US9490191B2 (en) | 2012-07-17 | 2013-07-01 | Mounting structure of semiconductor device and method of manufacturing the same |
| US15/058,671 US9583416B2 (en) | 2012-07-17 | 2016-03-02 | Mounting structure of semiconductor device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012158807A JP6112796B2 (ja) | 2012-07-17 | 2012-07-17 | 半導体装置実装構造体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014022516A JP2014022516A (ja) | 2014-02-03 |
| JP2014022516A5 true JP2014022516A5 (enExample) | 2015-08-27 |
| JP6112796B2 JP6112796B2 (ja) | 2017-04-12 |
Family
ID=49945890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012158807A Expired - Fee Related JP6112796B2 (ja) | 2012-07-17 | 2012-07-17 | 半導体装置実装構造体 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US9490191B2 (enExample) |
| JP (1) | JP6112796B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3038130B1 (fr) * | 2015-06-25 | 2017-08-11 | 3D Plus | Module electronique 3d comportant un empilement de boitiers a billes |
| JP6595232B2 (ja) | 2015-07-02 | 2019-10-23 | ソニー・オリンパスメディカルソリューションズ株式会社 | 内視鏡用撮像装置、内視鏡装置、及び内視鏡用ケーブル |
| US10410963B1 (en) * | 2018-06-07 | 2019-09-10 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Deformed layer for short electric connection between structures of electric device |
| CN114093770A (zh) * | 2021-10-27 | 2022-02-25 | 珠海越亚半导体股份有限公司 | 埋嵌封装结构及其制作方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5229916A (en) * | 1992-03-04 | 1993-07-20 | International Business Machines Corporation | Chip edge interconnect overlay element |
| JPH08335663A (ja) * | 1995-06-08 | 1996-12-17 | Sony Corp | 半導体装置及び半導体装置の製造方法 |
| JPH11111772A (ja) * | 1997-10-07 | 1999-04-23 | Matsushita Electric Ind Co Ltd | キャリア基板の実装位置決め方法、キャリア基板および配線基板 |
| US5963427A (en) * | 1997-12-11 | 1999-10-05 | Sun Microsystems, Inc. | Multi-chip module with flexible circuit board |
| JP3915338B2 (ja) | 1999-09-01 | 2007-05-16 | 松下電器産業株式会社 | リードフレームとそれを用いた樹脂封止型半導体装置の製造方法 |
| JP2001077294A (ja) | 1999-09-02 | 2001-03-23 | Nec Corp | 半導体装置 |
| JP2001203319A (ja) * | 2000-01-18 | 2001-07-27 | Sony Corp | 積層型半導体装置 |
| KR100460062B1 (ko) * | 2002-04-23 | 2004-12-04 | 주식회사 하이닉스반도체 | 멀티 칩 패키지 및 그 제조 방법 |
| JP4600443B2 (ja) * | 2007-07-09 | 2010-12-15 | 日本電気株式会社 | 半導体パッケージ及び積層型半導体パッケージ |
-
2012
- 2012-07-17 JP JP2012158807A patent/JP6112796B2/ja not_active Expired - Fee Related
-
2013
- 2013-07-01 US US13/932,333 patent/US9490191B2/en active Active
-
2016
- 2016-03-02 US US15/058,671 patent/US9583416B2/en active Active
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