IN2014DN06962A - - Google Patents
Info
- Publication number
- IN2014DN06962A IN2014DN06962A IN6962DEN2014A IN2014DN06962A IN 2014DN06962 A IN2014DN06962 A IN 2014DN06962A IN 6962DEN2014 A IN6962DEN2014 A IN 6962DEN2014A IN 2014DN06962 A IN2014DN06962 A IN 2014DN06962A
- Authority
- IN
- India
- Prior art keywords
- solder
- paste
- becomes possible
- power module
- metallic member
- Prior art date
Links
Classifications
-
- H10W72/30—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
- B23K35/0272—Rods, electrodes, wires with more than one layer of coating or sheathing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3602—Carbonates, basic oxides or hydroxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3607—Silica or silicates
-
- H10W40/22—
-
- H10W40/255—
-
- H10W72/01361—
-
- H10W72/01961—
-
- H10W72/073—
-
- H10W72/07331—
-
- H10W72/07334—
-
- H10W72/07336—
-
- H10W72/321—
-
- H10W72/322—
-
- H10W72/325—
-
- H10W72/351—
-
- H10W72/352—
-
- H10W72/353—
-
- H10W72/59—
-
- H10W72/925—
-
- H10W72/952—
-
- H10W72/953—
-
- H10W90/734—
-
- H10W90/736—
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012029646A JP5915233B2 (ja) | 2012-02-14 | 2012-02-14 | はんだ接合構造、パワーモジュール、ヒートシンク付パワーモジュール用基板及びそれらの製造方法 |
| JP2012029683A JP2013168240A (ja) | 2012-02-14 | 2012-02-14 | はんだ下地層形成用ペースト |
| PCT/JP2013/053488 WO2013122126A1 (ja) | 2012-02-14 | 2013-02-14 | はんだ接合構造、パワーモジュール、ヒートシンク付パワーモジュール用基板及びそれらの製造方法、並びにはんだ下地層形成用ペースト |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2014DN06962A true IN2014DN06962A (enExample) | 2015-04-10 |
Family
ID=48984235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN6962DEN2014 IN2014DN06962A (enExample) | 2012-02-14 | 2013-02-14 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9355986B2 (enExample) |
| EP (1) | EP2816593B1 (enExample) |
| KR (1) | KR102066300B1 (enExample) |
| CN (1) | CN104126226B (enExample) |
| IN (1) | IN2014DN06962A (enExample) |
| WO (1) | WO2013122126A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6061276B2 (ja) | 2014-08-29 | 2017-01-18 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 金属層間のはんだ接合の形成方法 |
| US10696851B2 (en) | 2015-11-24 | 2020-06-30 | Hitachi Chemical Co., Ltd. | Print-on pastes for modifying material properties of metal particle layers |
| SG11201804392WA (en) * | 2015-11-24 | 2018-06-28 | Plant Pv Inc | Fired multilayer stacks for use in integrated circuits and solar cells |
| JP6463505B2 (ja) * | 2015-11-25 | 2019-02-06 | 三菱電機株式会社 | 半導体装置、インバータ装置及び自動車 |
| DE112016006717T5 (de) * | 2016-04-06 | 2019-01-03 | Mitsubishi Electric Corporation | Leistungs-halbleitereinheit |
| CN109075159B (zh) * | 2016-04-21 | 2021-12-17 | 三菱电机株式会社 | 半导体装置及其制造方法 |
| US10727186B2 (en) * | 2016-08-05 | 2020-07-28 | Mitsubishi Electric Corporation | Power semiconductor device |
| CN106270871A (zh) * | 2016-11-01 | 2017-01-04 | 株洲中车时代电气股份有限公司 | 一种半导体器件的焊接方法及焊接系统 |
| JP6717245B2 (ja) * | 2017-03-17 | 2020-07-01 | 三菱マテリアル株式会社 | 接合体の製造方法、絶縁回路基板の製造方法、及び、ヒートシンク付き絶縁回路基板の製造方法 |
| JP6888401B2 (ja) | 2017-04-28 | 2021-06-16 | 日亜化学工業株式会社 | 金属粉焼結ペースト及びその製造方法、ならびに導電性材料の製造方法 |
| JP7043794B2 (ja) * | 2017-11-06 | 2022-03-30 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板およびヒートシンク付パワーモジュール用基板の製造方法 |
| JP7200616B2 (ja) | 2017-12-06 | 2023-01-10 | 三菱マテリアル株式会社 | 絶縁伝熱基板、熱電変換モジュール、及び、絶縁伝熱基板の製造方法 |
| CN108346952B (zh) * | 2018-01-25 | 2020-11-24 | 番禺得意精密电子工业有限公司 | 电连接器固持装置 |
| JP7046643B2 (ja) * | 2018-02-23 | 2022-04-04 | 株式会社ノリタケカンパニーリミテド | 放熱性基板 |
| US11476127B2 (en) * | 2018-03-23 | 2022-10-18 | Mitsubishi Materials Corporation | Manufacturing method of electronic-component-mounted module |
| US10470314B1 (en) * | 2018-08-06 | 2019-11-05 | Lockheed Martin Corporation | Methods of soldering and applications thereof |
| CN109396586B (zh) * | 2018-12-13 | 2020-09-01 | 华北水利水电大学 | 一种环氧树脂器件与pcb印刷电路板基材的钎焊方法 |
| JP7215273B2 (ja) * | 2019-03-22 | 2023-01-31 | 三菱マテリアル株式会社 | 接合構造体 |
| CN115004391A (zh) * | 2020-01-31 | 2022-09-02 | 国立研究开发法人产业技术综合研究所 | 热电转换组件 |
| CN112192085A (zh) * | 2020-10-14 | 2021-01-08 | 哈尔滨工业大学(深圳) | 一种复合焊料预成型片及其制备方法、及封装方法 |
| CN113809032B (zh) * | 2021-08-09 | 2025-04-08 | 华为技术有限公司 | 一种功率模块、电源电路及芯片 |
| CN114700649B (zh) * | 2022-03-29 | 2023-01-13 | 郑州大学 | 一种铜铝钎焊连接钎缝导电性强且强度高的锌铝钎料 |
| KR20240003596A (ko) * | 2022-07-01 | 2024-01-09 | 현대자동차주식회사 | 파워 모듈 |
| TWI832349B (zh) * | 2022-07-21 | 2024-02-11 | 大陸商深圳興奇宏科技有限公司 | 散熱裝置製造方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02230607A (ja) * | 1988-11-04 | 1990-09-13 | Asahi Glass Co Ltd | 導体ペースト組成物及びセラミックス基板 |
| DE3905276C1 (enExample) * | 1989-02-21 | 1990-05-03 | Demetron Gesellschaft Fuer Elektronik-Werkstoffe Mbh, 6450 Hanau, De | |
| JP2795467B2 (ja) * | 1989-06-19 | 1998-09-10 | 第一工業製薬株式会社 | 接着性良好な金属ペースト |
| JPH0437009A (ja) * | 1990-05-31 | 1992-02-07 | Kyocera Corp | 積層型コンデンサの端子電極形成用導電性ペースト |
| US5333668A (en) * | 1991-12-09 | 1994-08-02 | Reynolds Metals Company | Process for creation of metallurgically bonded inserts cast-in-place in a cast aluminum article |
| JP3685901B2 (ja) * | 1997-03-19 | 2005-08-24 | 本田技研工業株式会社 | Al基複合体の製造方法 |
| US6443211B1 (en) * | 1999-08-31 | 2002-09-03 | Cummins Inc. | Mettallurgical bonding of inserts having multi-layered coatings within metal castings |
| US6484790B1 (en) * | 1999-08-31 | 2002-11-26 | Cummins Inc. | Metallurgical bonding of coated inserts within metal castings |
| JP4587617B2 (ja) * | 2001-08-28 | 2010-11-24 | 京セラ株式会社 | セラミック配線基板 |
| JP3982284B2 (ja) * | 2002-03-06 | 2007-09-26 | 住友電気工業株式会社 | サブマウントおよび半導体装置 |
| JP3509809B2 (ja) * | 2002-04-30 | 2004-03-22 | 住友電気工業株式会社 | サブマウントおよび半導体装置 |
| JP3882712B2 (ja) * | 2002-08-09 | 2007-02-21 | 住友電気工業株式会社 | サブマウントおよび半導体装置 |
| CN101076446A (zh) * | 2003-08-06 | 2007-11-21 | 密执安州立大学 | 复合金属基体铸件和焊料组合物与方法 |
| US8163424B2 (en) | 2004-02-18 | 2012-04-24 | Panasonic Corporation | Secondary battery |
| JP2005303218A (ja) * | 2004-04-16 | 2005-10-27 | Renesas Technology Corp | 半導体装置およびその製造方法 |
| JP4826066B2 (ja) * | 2004-04-27 | 2011-11-30 | 住友金属鉱山株式会社 | 非晶質の透明導電性薄膜およびその製造方法、並びに、該非晶質の透明導電性薄膜を得るためのスパッタリングターゲットおよびその製造方法 |
| JP4305430B2 (ja) * | 2005-08-24 | 2009-07-29 | ソニー株式会社 | 部品実装方法および部品実装体 |
| JP4904915B2 (ja) | 2006-05-18 | 2012-03-28 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法、パワーモジュール用基板およびパワーモジュール |
| JP2008227336A (ja) | 2007-03-15 | 2008-09-25 | Hitachi Metals Ltd | 半導体モジュール、これに用いられる回路基板 |
| US7868465B2 (en) * | 2007-06-04 | 2011-01-11 | Infineon Technologies Ag | Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier |
| US7704416B2 (en) * | 2007-06-29 | 2010-04-27 | E.I. Du Pont De Nemours And Company | Conductor paste for ceramic substrate and electric circuit |
| US20100132404A1 (en) * | 2008-12-03 | 2010-06-03 | Progressive Cooling Solutions, Inc. | Bonds and method for forming bonds for a two-phase cooling apparatus |
| JP5304508B2 (ja) * | 2009-05-15 | 2013-10-02 | 三菱マテリアル株式会社 | 導電性組成物 |
| JP5212298B2 (ja) | 2009-05-15 | 2013-06-19 | 三菱マテリアル株式会社 | パワーモジュール用基板、冷却器付パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法 |
| CN103080633A (zh) * | 2010-08-26 | 2013-05-01 | 日本电气硝子株式会社 | 波长变换元件、光源和液晶用背光单元 |
-
2013
- 2013-02-14 US US14/378,226 patent/US9355986B2/en not_active Expired - Fee Related
- 2013-02-14 CN CN201380008901.9A patent/CN104126226B/zh not_active Expired - Fee Related
- 2013-02-14 KR KR1020147022600A patent/KR102066300B1/ko not_active Expired - Fee Related
- 2013-02-14 IN IN6962DEN2014 patent/IN2014DN06962A/en unknown
- 2013-02-14 WO PCT/JP2013/053488 patent/WO2013122126A1/ja not_active Ceased
- 2013-02-14 EP EP13748657.7A patent/EP2816593B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2816593B1 (en) | 2020-01-15 |
| CN104126226B (zh) | 2018-05-04 |
| CN104126226A (zh) | 2014-10-29 |
| US9355986B2 (en) | 2016-05-31 |
| US20150035137A1 (en) | 2015-02-05 |
| WO2013122126A1 (ja) | 2013-08-22 |
| KR20140127250A (ko) | 2014-11-03 |
| EP2816593A4 (en) | 2016-07-06 |
| EP2816593A1 (en) | 2014-12-24 |
| KR102066300B1 (ko) | 2020-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IN2014DN06962A (enExample) | ||
| MY175032A (en) | Photovoltaic cell and laminate metallization | |
| TW201613037A (en) | Substrate for power modules, substrate with heat sink for power modules and power module with heat sink | |
| EP2294250A4 (en) | ANTIKORROSIVE HYBRID SOL GEL FILM ON METAL SUBSTRATES AND METHOD OF MANUFACTURING THEREOF | |
| IN2014DN08029A (enExample) | ||
| IN2014DN08073A (enExample) | ||
| IN2015DN03283A (enExample) | ||
| WO2011119007A3 (ko) | 방열 테이프 및 그 제조 방법 | |
| WO2012015982A3 (en) | Electronics substrate with enhanced direct bonded metal | |
| WO2012174367A3 (en) | Device with inverted large scale light extraction structures | |
| JP2014175425A5 (enExample) | ||
| PH12011000403A1 (en) | Semiconductor device package and method of manufacturing thereof | |
| PL2718479T3 (pl) | Sposób wytwarzania pasków z aluminium lub stopów aluminium, z lakierem termoutwardzalnym na pierwszej powierzchni i lakierem piecowym na bazie epoksydowej na drugiej powierzchni, uprzednio pokrytymi bezchromową powłoką modyfikującą | |
| IN2014DN08075A (enExample) | ||
| IN2014DN08074A (enExample) | ||
| GB2526464A (en) | Methods of forming buried microelectricomechanical structures coupled with device substrates and structures formed thereby | |
| PH12016501804B1 (en) | Bonds for solar cell metallization | |
| MX377984B (es) | Adhesión de fluoropolímero a metal. | |
| EP2824706A3 (en) | Adhesive bonded solar cell assembly | |
| EP2608407A3 (en) | Circuit substrate for duplexers | |
| EP4435152A3 (en) | Structures and methods for low temperature bonding | |
| MX2017001398A (es) | Elemento de conexion electrica, proceso para fabricar un elemento de conexion electrica y uso de un elemento de conexion electrica. | |
| JP2015037174A5 (enExample) | ||
| MY183221A (en) | Anisotropic conductive film, connection method, and joined body | |
| WO2012099466A3 (en) | Method for manufacturing an electronic device by electrodeposition from an ionic liquid |