DE3905276C1 - - Google Patents

Info

Publication number
DE3905276C1
DE3905276C1 DE3905276A DE3905276A DE3905276C1 DE 3905276 C1 DE3905276 C1 DE 3905276C1 DE 3905276 A DE3905276 A DE 3905276A DE 3905276 A DE3905276 A DE 3905276A DE 3905276 C1 DE3905276 C1 DE 3905276C1
Authority
DE
Germany
Prior art keywords
glass
weight
oxide
silver
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3905276A
Other languages
German (de)
English (en)
Inventor
Karl Anton Dipl.-Chem. Dr. 6458 Rodenbach De Starz
Matthias Dipl.-Ing. 8752 Kleinostheim De Metzner
Wolfgang 8757 Karlstein De Weber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
DEMETRON GESELLSCHAFT fur ELEKTRONIK-WERKSTOFFE MBH 6450 HANAU DE
Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DEMETRON GESELLSCHAFT fur ELEKTRONIK-WERKSTOFFE MBH 6450 HANAU DE, Degussa GmbH filed Critical DEMETRON GESELLSCHAFT fur ELEKTRONIK-WERKSTOFFE MBH 6450 HANAU DE
Priority to DE3905276A priority Critical patent/DE3905276C1/de
Priority to GB9003491A priority patent/GB2229388B/en
Priority to US07/483,219 priority patent/US4962066A/en
Application granted granted Critical
Publication of DE3905276C1 publication Critical patent/DE3905276C1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Die Bonding (AREA)
DE3905276A 1989-02-21 1989-02-21 Expired - Lifetime DE3905276C1 (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE3905276A DE3905276C1 (enExample) 1989-02-21 1989-02-21
GB9003491A GB2229388B (en) 1989-02-21 1990-02-15 A soldering paste for fixing semiconductors to ceramic supports
US07/483,219 US4962066A (en) 1989-02-21 1990-02-21 Solder paste for fastening semiconductors onto ceramic bases

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3905276A DE3905276C1 (enExample) 1989-02-21 1989-02-21

Publications (1)

Publication Number Publication Date
DE3905276C1 true DE3905276C1 (enExample) 1990-05-03

Family

ID=6374580

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3905276A Expired - Lifetime DE3905276C1 (enExample) 1989-02-21 1989-02-21

Country Status (3)

Country Link
US (1) US4962066A (enExample)
DE (1) DE3905276C1 (enExample)
GB (1) GB2229388B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0355783A3 (en) * 1988-08-22 1991-04-24 W.R. Grace & Co.-Conn. Oxide glasses having low glass transformation temperatures
DE4013256C1 (en) * 1990-04-26 1991-10-24 Degussa Ag, 6000 Frankfurt, De Solder paste for sticking electrical components on substrates - comprises mixt. of silver powder and low melting glass powder
DE4128804A1 (de) * 1991-08-30 1993-03-04 Demetron Bleifreies, niedrigschmelzendes glas
EP2816593A4 (en) * 2012-02-14 2016-07-06 Mitsubishi Materials Corp SOLDERING CONNECTION STRUCTURE, POWER MODULE, SUBSTRATE MOUNTED TO A REFRIGERATED BODY FOR A POWER MODULE, METHOD FOR PRODUCING THIS SUBSTRATE, AND PASTE FOR PRODUCING A SOLDER LAYER

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0959553A (ja) * 1995-08-30 1997-03-04 Dainippon Printing Co Ltd 透明導電性インキ
DE19842276A1 (de) * 1998-09-16 2000-03-30 Bosch Gmbh Robert Paste zum Verschweißen von Keramiken mit Metallen und Verfahren zur Herstellung einer Schweißverbindung
US7005106B2 (en) * 2001-08-30 2006-02-28 Sumida Corporation Lead-free solder alloy and electronic components using it
DE10240412A1 (de) * 2002-09-02 2004-03-25 Brazetec Gmbh Flussmittelzubereitung und Verfahren zum lotfreien Verbinden von Aluminium oder Aluminiumlegierungen
EP1807370A1 (en) * 2004-09-24 2007-07-18 E.I. Dupont De Nemours And Company Sealing compositions
CA2768803A1 (en) * 2009-07-27 2011-02-03 Basf Se Thermoelectric modules with improved contact connection
US9984787B2 (en) * 2009-11-11 2018-05-29 Samsung Electronics Co., Ltd. Conductive paste and solar cell
KR101741683B1 (ko) 2010-08-05 2017-05-31 삼성전자주식회사 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지
US8668847B2 (en) 2010-08-13 2014-03-11 Samsung Electronics Co., Ltd. Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste
US8987586B2 (en) 2010-08-13 2015-03-24 Samsung Electronics Co., Ltd. Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste
US8974703B2 (en) 2010-10-27 2015-03-10 Samsung Electronics Co., Ltd. Conductive paste and electronic device and solar cell including an electrode formed using the same
US9105370B2 (en) 2011-01-12 2015-08-11 Samsung Electronics Co., Ltd. Conductive paste, and electronic device and solar cell including an electrode formed using the same
US8940195B2 (en) 2011-01-13 2015-01-27 Samsung Electronics Co., Ltd. Conductive paste, and electronic device and solar cell including an electrode formed using the same
EP2763141B1 (en) * 2013-02-01 2016-02-03 Heraeus Precious Metals North America Conshohocken LLC Low fire silver paste
JP6750404B2 (ja) * 2015-09-18 2020-09-02 三菱マテリアル株式会社 熱電変換モジュール及び熱電変換装置並びに熱電変換モジュールの製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3154503A (en) * 1961-01-12 1964-10-27 Int Resistance Co Resistance material and resistor made therefrom
GB2052474A (en) * 1979-05-16 1981-01-28 Hitachi Ltd Liquid Crystal Display Element
US4401767A (en) * 1981-08-03 1983-08-30 Johnson Matthey Inc. Silver-filled glass
US4636254A (en) * 1985-07-23 1987-01-13 Quantum Materials, Inc. Silver-glass paste for attachment of silicon die to ceramic substrate
US4699888A (en) * 1985-09-16 1987-10-13 Technology Glass Corporation Die/attach composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3876433A (en) * 1973-12-28 1975-04-08 Du Pont Bismuth-containing silver conductor compositions
US4186023A (en) * 1978-05-01 1980-01-29 Technology Glass Corporation Sealing glass composition
US4251595A (en) * 1979-09-10 1981-02-17 Technology Glass Corporation Low temperature sealing glasses
US4369063A (en) * 1981-11-12 1983-01-18 Ciba-Geigy Corporation Silver containing conductive coatings
US4743302A (en) * 1986-06-06 1988-05-10 Vlsi Packaging Materials, Inc. Low melting glass composition
US4761224A (en) * 1986-03-10 1988-08-02 Quantum Materials Inc. Silver-glass paste with poly-modal flake size distribution and quick dry vehicle
US4881974A (en) * 1987-11-05 1989-11-21 Johnson Matthey, Inc. Silver-glass paste
US4904415A (en) * 1988-08-22 1990-02-27 W. R. Grace & Co.-Conn. Oxide glasses having low glass transformation temperatures

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3154503A (en) * 1961-01-12 1964-10-27 Int Resistance Co Resistance material and resistor made therefrom
GB2052474A (en) * 1979-05-16 1981-01-28 Hitachi Ltd Liquid Crystal Display Element
US4401767A (en) * 1981-08-03 1983-08-30 Johnson Matthey Inc. Silver-filled glass
US4636254A (en) * 1985-07-23 1987-01-13 Quantum Materials, Inc. Silver-glass paste for attachment of silicon die to ceramic substrate
US4699888A (en) * 1985-09-16 1987-10-13 Technology Glass Corporation Die/attach composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0355783A3 (en) * 1988-08-22 1991-04-24 W.R. Grace & Co.-Conn. Oxide glasses having low glass transformation temperatures
DE4013256C1 (en) * 1990-04-26 1991-10-24 Degussa Ag, 6000 Frankfurt, De Solder paste for sticking electrical components on substrates - comprises mixt. of silver powder and low melting glass powder
DE4128804A1 (de) * 1991-08-30 1993-03-04 Demetron Bleifreies, niedrigschmelzendes glas
EP2816593A4 (en) * 2012-02-14 2016-07-06 Mitsubishi Materials Corp SOLDERING CONNECTION STRUCTURE, POWER MODULE, SUBSTRATE MOUNTED TO A REFRIGERATED BODY FOR A POWER MODULE, METHOD FOR PRODUCING THIS SUBSTRATE, AND PASTE FOR PRODUCING A SOLDER LAYER

Also Published As

Publication number Publication date
US4962066A (en) 1990-10-09
GB2229388B (en) 1993-01-27
GB2229388A (en) 1990-09-26
GB9003491D0 (en) 1990-04-11

Similar Documents

Publication Publication Date Title
DE3905276C1 (enExample)
EP0215462B1 (de) Paste zum Verbinden von Halbleitern mit keramischen Unterlagen
DE68917753T2 (de) Wärmeleitender, gesinterte Aluminiumnitridkörper und sein Herstellungsverfahren.
DE69327747T2 (de) Dielektrische Zusammensetzung, Mehrschichtleitersubstrat und keramischer Mehrschichtkondensator
DE2517743C3 (de) Passivierender Schutzüberzug für Siliziumhalbleiterbauelemente
DE69002078T2 (de) Metalloxidgläser mit einem niedrigen Erweichungspunkt, geeignet zur Verwendung in der Elektronik.
US8043536B2 (en) Silver-palladium alloy containing conductor paste for ceramic substrate and electric circuit
DE69103807T2 (de) Verfahren zum Anlöten metallisierter Komponenten an keramische Substrate.
DE3873938T2 (de) Laminiertes substrat fuer integrierte schaltungen.
DE2823904A1 (de) Dichtungsglas
DE3934971C1 (enExample)
DE2234461A1 (de) Metallisierungsmasse und verfahren zum metallisieren einer vertiefung in halbleiterpackungen sowie das dabei erhaltene produkt
DE1771503B2 (de) Thermisch kristallisierbares glas und glaskeramik auf der basis sio tief 2-pbo-bao-al tief 2 o tief 3tio tief 2 und ihre verwendung
DE69904889T2 (de) Elektrisch leitende Paste und Glassubstrat mit aufgetragenem elektrischen Schaltkreis
DE2714196B2 (de) Beschichtetes Aluminiumoxidsubstrat und Pulvergemisch zur Beschichtung solcher Substrate
DE1539769A1 (de) Elektrischer Kondensator
DE3509955C2 (enExample)
DE1812733B2 (de) Glaswerkstoff zum Überziehen . Abdichten oder Verbinden von Gegenstanden mit einem linearen Wärmeausdehnungskoeffizienten von weniger als 50 χ 10 hoch 7 / Grad C
US3684536A (en) Bismuthate glass-ceramic precursor compositions
DE3343570C2 (de) Dichtungsglasmasse
DE68910045T2 (de) Oxid-Gläser mit niedrigen Glas-Transformationstemperaturen.
DE4128804A1 (de) Bleifreies, niedrigschmelzendes glas
CH652737A5 (de) Metallische, silberhaltige paste mit glas und ihre verwendung zum befestigen elektronischer bauteile.
DE4013256C1 (en) Solder paste for sticking electrical components on substrates - comprises mixt. of silver powder and low melting glass powder
DE2548736C3 (de) Composit-Passivierungsglas auf der Basis PbO-B2 Okskö-ab O3) m't einem thermischen Ausdehnungskoeffizienten (200-300 Grad C) zwischen 40 und 60 mal 10"7 / Grad C für Silicium-Halbleiterbauelemente mit Aufschmelztemperaturen von höchstens 600 Grad C

Legal Events

Date Code Title Description
8100 Publication of the examined application without publication of unexamined application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DEGUSSA AG, 60311 FRANKFURT, DE

8327 Change in the person/name/address of the patent owner

Owner name: DEGUSSA-HUELS AG, 60311 FRANKFURT, DE

8339 Ceased/non-payment of the annual fee