WO2011009677A3 - Optoelektronisches bauteil und verfahren zur herstellung eines optischen elements für ein optoelektronisches bauteil - Google Patents

Optoelektronisches bauteil und verfahren zur herstellung eines optischen elements für ein optoelektronisches bauteil Download PDF

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Publication number
WO2011009677A3
WO2011009677A3 PCT/EP2010/058084 EP2010058084W WO2011009677A3 WO 2011009677 A3 WO2011009677 A3 WO 2011009677A3 EP 2010058084 W EP2010058084 W EP 2010058084W WO 2011009677 A3 WO2011009677 A3 WO 2011009677A3
Authority
WO
WIPO (PCT)
Prior art keywords
optical element
optoelectronic component
carrier
base body
producing
Prior art date
Application number
PCT/EP2010/058084
Other languages
English (en)
French (fr)
Other versions
WO2011009677A2 (de
Inventor
Harald JÄGER
Herbert Brunner
Stephan Preuss
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2011009677A2 publication Critical patent/WO2011009677A2/de
Publication of WO2011009677A3 publication Critical patent/WO2011009677A3/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/40—Moulds for making articles of definite length, i.e. discrete articles with means for cutting the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14827—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using a transfer foil detachable from the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

In mindestens einer Ausführungsform des optoelektronischen Bauteils (1) umfasst dieses einen Träger (3) und mindestens einen optoelektronischen Halbleiterchip (2), der an dem Träger (3) angebracht ist. Ferner beinhaltet das optoelektronische Bauteil (1) wenigstens ein optisches Element (45), das ebenfalls an dem Träger (3) angebracht ist. Das optische Element (45) weist hierbei einen Grundkörper (5) mit einem strahlungsdurchlässigen Formmaterial auf. Das Formmaterial ist ein Silikon, ein Epoxid oder ein Silikon- Epoxid-Hybridmaterial. Weiterhin ist der Grundkörper (5) formgepresst, formgespritzt oder formgegossen. Außerdem umfasst das optische Element (45) eine Folie (4), die eine dem Halbleiterchip (2) abgewandte Begrenzungsfläche (7) des optischen Elements (45) bildet. Die Folie (4) ist verbindungsmittelfrei und unmittelbar mit dem Grundkörper (5) verbunden.
PCT/EP2010/058084 2009-07-23 2010-06-09 Optoelektronisches bauteil und verfahren zur herstellung eines optischen elements für ein optoelektronisches bauteil WO2011009677A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200910034370 DE102009034370A1 (de) 2009-07-23 2009-07-23 Optoelektronisches Bauteil und Verfahren zur Herstellung eines optischen Elements für ein optoelektronisches Bauteil
DE102009034370.9 2009-07-23

Publications (2)

Publication Number Publication Date
WO2011009677A2 WO2011009677A2 (de) 2011-01-27
WO2011009677A3 true WO2011009677A3 (de) 2013-06-13

Family

ID=42635283

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/058084 WO2011009677A2 (de) 2009-07-23 2010-06-09 Optoelektronisches bauteil und verfahren zur herstellung eines optischen elements für ein optoelektronisches bauteil

Country Status (2)

Country Link
DE (1) DE102009034370A1 (de)
WO (1) WO2011009677A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010034923A1 (de) * 2010-08-20 2012-02-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Schichtverbunds aus einer Lumineszenzkonversionsschicht und einer Streuschicht
DE102010047454A1 (de) * 2010-10-04 2012-04-05 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Silikonfolie, Silikonfolie und optoelektronisches Halbleiterbauteil mit einer Silikonfolie
DE102011081083A1 (de) * 2011-08-17 2013-02-21 Osram Ag Presswerkzeug und verfahren zum pressen eines silikonelements
DE102011082157A1 (de) * 2011-09-06 2013-03-07 Osram Opto Semiconductors Gmbh Presswerkzeug und Verfahrenzum Herstellen eines Silikonelements
DE102014117764A1 (de) * 2014-12-03 2016-06-09 Osram Opto Semiconductors Gmbh Strahlungsemittierendes optoelektronisches Halbleiterbauteil und Verfahren zu dessen Herstellung
EP3340319B1 (de) * 2015-08-18 2019-07-31 Jiangsu Cherrity Optronics Co., Ltd Anlagensystem mit verwendung eines fotokonverters aus thermoplastischem harz zur bond-verpackung einer led durch walzen
DE102015114661A1 (de) * 2015-09-02 2017-03-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
DE102015116595A1 (de) 2015-09-30 2017-03-30 Osram Opto Semiconductors Gmbh Bauelement mit einem Licht emittierenden Halbleiterchip
DE102016116468A1 (de) 2016-09-02 2018-03-08 Osram Opto Semiconductors Gmbh Optoelektronische anordnung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040064990A1 (en) * 2002-09-12 2004-04-08 Murata Manufacturing Co., Ltd. Film molded casing
WO2006103582A1 (en) * 2005-03-29 2006-10-05 Koninklijke Philips Electronics N.V. Wide emitting lens for led useful for backlighting
US20070269586A1 (en) * 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
WO2009148543A2 (en) * 2008-05-29 2009-12-10 Cree, Inc. Light source with near field mixing
WO2010047798A1 (en) * 2008-10-24 2010-04-29 Cree Led Lighting Solutions, Inc. Array layout for color mixing

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3780357A (en) * 1973-02-16 1973-12-18 Hewlett Packard Co Electroluminescent semiconductor display apparatus and method of fabricating the same
KR101332771B1 (ko) 2004-02-20 2013-11-25 오스람 옵토 세미컨덕터스 게엠베하 광전 소자, 다수의 광전 소자를 구비한 장치 및 광전 소자를 제조하기 위한 방법
EP1735149A2 (de) * 2004-04-16 2006-12-27 Lucea AG Lichtemittierendes paneel und optisch wirksame folie
DE102007004304A1 (de) 2007-01-29 2008-07-31 Osram Opto Semiconductors Gmbh Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips
DE102007017855A1 (de) * 2007-04-16 2008-10-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040064990A1 (en) * 2002-09-12 2004-04-08 Murata Manufacturing Co., Ltd. Film molded casing
WO2006103582A1 (en) * 2005-03-29 2006-10-05 Koninklijke Philips Electronics N.V. Wide emitting lens for led useful for backlighting
US20070269586A1 (en) * 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
WO2009148543A2 (en) * 2008-05-29 2009-12-10 Cree, Inc. Light source with near field mixing
WO2010047798A1 (en) * 2008-10-24 2010-04-29 Cree Led Lighting Solutions, Inc. Array layout for color mixing

Also Published As

Publication number Publication date
WO2011009677A2 (de) 2011-01-27
DE102009034370A1 (de) 2011-01-27

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