WO2010054622A3 - Optoelektronisches halbleiterbauelement - Google Patents

Optoelektronisches halbleiterbauelement Download PDF

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Publication number
WO2010054622A3
WO2010054622A3 PCT/DE2009/001548 DE2009001548W WO2010054622A3 WO 2010054622 A3 WO2010054622 A3 WO 2010054622A3 DE 2009001548 W DE2009001548 W DE 2009001548W WO 2010054622 A3 WO2010054622 A3 WO 2010054622A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor component
optoelectronic semiconductor
conversion element
connection support
semiconductor chips
Prior art date
Application number
PCT/DE2009/001548
Other languages
English (en)
French (fr)
Other versions
WO2010054622A2 (de
Inventor
Ralph Wirth
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Priority to CN200980145491.6A priority Critical patent/CN102217065B/zh
Priority to EP09798867A priority patent/EP2316130A2/de
Priority to JP2011535869A priority patent/JP5544369B2/ja
Priority to US13/128,706 priority patent/US8558259B2/en
Publication of WO2010054622A2 publication Critical patent/WO2010054622A2/de
Publication of WO2010054622A3 publication Critical patent/WO2010054622A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Abstract

Es wird ein optoelektronisches Bauelement (1) angegeben, mit - einem Anschlussträger (2), auf dem zumindest zwei strahlungsemittierende Halbleiterchips (3) angeordnet sind, - einem Konversionselement (4), das am Anschlussträger (2) befestigt ist, wobei - das Konversionselement (4) die Halbleiterchips (3) derart überspannt, dass die Halbleiterchips (3) vom Konversionselement (4) und dem Anschlussträger (2) umgeben sind, und - zumindest zwei der strahlungsemittierenden Halbleiterchips (3) sich hinsichtlich der Wellenlängen der von ihnen im Betrieb emittierten elektromagnetischen Strahlung voneinander unterscheiden.
PCT/DE2009/001548 2008-11-13 2009-11-02 Optoelektronisches bauelement WO2010054622A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200980145491.6A CN102217065B (zh) 2008-11-13 2009-11-02 光电子半导体器件
EP09798867A EP2316130A2 (de) 2008-11-13 2009-11-02 Optoelektronisches bauelement
JP2011535869A JP5544369B2 (ja) 2008-11-13 2009-11-02 オプトエレクトロニクス部品
US13/128,706 US8558259B2 (en) 2008-11-13 2009-11-02 Optoelectronic component having a dome-like conversion element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008057140A DE102008057140A1 (de) 2008-11-13 2008-11-13 Optoelektronisches Bauelement
DE102008057140.7 2008-11-13

Publications (2)

Publication Number Publication Date
WO2010054622A2 WO2010054622A2 (de) 2010-05-20
WO2010054622A3 true WO2010054622A3 (de) 2010-07-08

Family

ID=42103012

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2009/001548 WO2010054622A2 (de) 2008-11-13 2009-11-02 Optoelektronisches bauelement

Country Status (7)

Country Link
US (1) US8558259B2 (de)
EP (1) EP2316130A2 (de)
JP (1) JP5544369B2 (de)
KR (1) KR20110084307A (de)
CN (1) CN102217065B (de)
DE (1) DE102008057140A1 (de)
WO (1) WO2010054622A2 (de)

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US8319247B2 (en) 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
US8486761B2 (en) * 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
DE102010038396B4 (de) 2010-07-26 2021-08-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Leuchtvorrichung damit
JP5612991B2 (ja) 2010-09-30 2014-10-22 シャープ株式会社 発光装置及びこれを備えた照明装置
KR20130128444A (ko) 2010-12-29 2013-11-26 쓰리엠 이노베이티브 프로퍼티즈 컴파니 광대력 출력 및 제어가능한 색을 갖는 원격 형광체 ｌｅｄ 디바이스
WO2012100132A1 (en) * 2011-01-21 2012-07-26 Osram Sylvania Inc. Luminescent converter and led light source containing same
DE102011003989A1 (de) * 2011-02-11 2012-08-16 Osram Ag Leuchtvorrichtung
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DE102012102859A1 (de) 2012-04-02 2013-11-14 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement umfassend eine Konverterträgerschicht, und Verfahren zur Herstellung eines optoelektronischen Bauelements umfassend eine Konverterträgerschicht
DE102012205469A1 (de) * 2012-04-03 2013-10-10 Osram Gmbh Leuchtvorrichtung und verfahren zum betreiben einer leuchtvorrichtung
DE102013211525A1 (de) * 2013-06-19 2014-12-24 Osram Gmbh LED-Modul mit LED-Chips
JP2014187392A (ja) * 2014-06-23 2014-10-02 Sharp Corp 発光装置及びこれを備えた照明装置
JP2016009761A (ja) * 2014-06-24 2016-01-18 株式会社小糸製作所 発光モジュール
JP2016051845A (ja) * 2014-09-01 2016-04-11 株式会社ジャパンディスプレイ 表示装置
KR20170073224A (ko) * 2015-12-18 2017-06-28 주식회사 트레이스 3차원 돔형 터치 패턴을 이용한 터치 스크린
JP6986698B2 (ja) * 2017-06-28 2021-12-22 パナソニックＩｐマネジメント株式会社 発光装置及びそれを備える光学分析システム
DE102018124751B4 (de) * 2018-10-08 2023-11-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils

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Also Published As

Publication number Publication date
EP2316130A2 (de) 2011-05-04
DE102008057140A1 (de) 2010-05-20
JP2012508970A (ja) 2012-04-12
US20110272713A1 (en) 2011-11-10
KR20110084307A (ko) 2011-07-21
US8558259B2 (en) 2013-10-15
JP5544369B2 (ja) 2014-07-09
CN102217065A (zh) 2011-10-12
WO2010054622A2 (de) 2010-05-20
CN102217065B (zh) 2014-07-02

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