JP2008263049A - 半導体装置、半導体装置の製造方法および液滴吐出装置 - Google Patents
半導体装置、半導体装置の製造方法および液滴吐出装置 Download PDFInfo
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- JP2008263049A JP2008263049A JP2007104522A JP2007104522A JP2008263049A JP 2008263049 A JP2008263049 A JP 2008263049A JP 2007104522 A JP2007104522 A JP 2007104522A JP 2007104522 A JP2007104522 A JP 2007104522A JP 2008263049 A JP2008263049 A JP 2008263049A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 50
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
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- 239000011347 resin Substances 0.000 claims abstract description 100
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- 229920001187 thermosetting polymer Polymers 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 9
- 239000013013 elastic material Substances 0.000 claims description 7
- 229920000800 acrylic rubber Polymers 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 5
- 229920000058 polyacrylate Polymers 0.000 claims description 5
- 239000004945 silicone rubber Substances 0.000 claims description 5
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- 230000000694 effects Effects 0.000 description 5
- 238000005192 partition Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229920001973 fluoroelastomer Polymers 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
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- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
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- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
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- 238000005530 etching Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007104522A JP2008263049A (ja) | 2007-04-12 | 2007-04-12 | 半導体装置、半導体装置の製造方法および液滴吐出装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007104522A JP2008263049A (ja) | 2007-04-12 | 2007-04-12 | 半導体装置、半導体装置の製造方法および液滴吐出装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008263049A true JP2008263049A (ja) | 2008-10-30 |
| JP2008263049A5 JP2008263049A5 (enExample) | 2010-05-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007104522A Withdrawn JP2008263049A (ja) | 2007-04-12 | 2007-04-12 | 半導体装置、半導体装置の製造方法および液滴吐出装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008263049A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102259496A (zh) * | 2010-05-12 | 2011-11-30 | 佳能株式会社 | 液体喷射头及其制备方法 |
| CN105599450A (zh) * | 2014-10-27 | 2016-05-25 | 精工爱普生株式会社 | 液体喷射头以及液体喷射装置 |
-
2007
- 2007-04-12 JP JP2007104522A patent/JP2008263049A/ja not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102259496A (zh) * | 2010-05-12 | 2011-11-30 | 佳能株式会社 | 液体喷射头及其制备方法 |
| CN105599450A (zh) * | 2014-10-27 | 2016-05-25 | 精工爱普生株式会社 | 液体喷射头以及液体喷射装置 |
| CN105599450B (zh) * | 2014-10-27 | 2019-10-29 | 精工爱普生株式会社 | 液体喷射头以及液体喷射装置 |
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