WO2008126312A1 - 熱式インプリント装置および熱式インプリント方法 - Google Patents

熱式インプリント装置および熱式インプリント方法 Download PDF

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Publication number
WO2008126312A1
WO2008126312A1 PCT/JP2007/057266 JP2007057266W WO2008126312A1 WO 2008126312 A1 WO2008126312 A1 WO 2008126312A1 JP 2007057266 W JP2007057266 W JP 2007057266W WO 2008126312 A1 WO2008126312 A1 WO 2008126312A1
Authority
WO
WIPO (PCT)
Prior art keywords
heating
mold
thermal imprinting
transfer
substratum
Prior art date
Application number
PCT/JP2007/057266
Other languages
English (en)
French (fr)
Inventor
Tetsuya Imai
Kazunobu Hashimoto
Original Assignee
Pioneer Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Corporation filed Critical Pioneer Corporation
Priority to US12/594,126 priority Critical patent/US20100072665A1/en
Priority to PCT/JP2007/057266 priority patent/WO2008126312A1/ja
Priority to JP2009508854A priority patent/JPWO2008126312A1/ja
Publication of WO2008126312A1 publication Critical patent/WO2008126312A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/74—Record carriers characterised by the form, e.g. sheet shaped to wrap around a drum
    • G11B5/743—Patterned record carriers, wherein the magnetic recording layer is patterned into magnetic isolated data islands, e.g. discrete tracks
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/855—Coating only part of a support with a magnetic layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/74—Record carriers characterised by the form, e.g. sheet shaped to wrap around a drum
    • G11B5/82—Disk carriers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/86—Re-recording, i.e. transcribing information from one magnetisable record carrier on to one or more similar or dissimilar record carriers
    • G11B5/865—Re-recording, i.e. transcribing information from one magnetisable record carrier on to one or more similar or dissimilar record carriers by contact "printing"

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Health & Medical Sciences (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

　転写層に形成すべき凹凸パターンが表面に形成されたモールドと、モールドを転写層に密着させて加圧する加圧機構と、モールドおよび転写基板を挟む位置に配置され、モールドおよび転写基板を加熱する一対の加熱機構と、を含み、加熱機構のうちの少なくとも一方は、中央加熱領域と中央加熱領域を囲む少なくとも１つの外周加熱領域とからなる複数の加熱領域を有し、加熱領域毎に異なる加熱能力を有する。
PCT/JP2007/057266 2007-03-30 2007-03-30 熱式インプリント装置および熱式インプリント方法 WO2008126312A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/594,126 US20100072665A1 (en) 2007-03-30 2007-03-30 Thermal imprinting device and thermal imprinting method
PCT/JP2007/057266 WO2008126312A1 (ja) 2007-03-30 2007-03-30 熱式インプリント装置および熱式インプリント方法
JP2009508854A JPWO2008126312A1 (ja) 2007-03-30 2007-03-30 熱式インプリント装置および熱式インプリント方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/057266 WO2008126312A1 (ja) 2007-03-30 2007-03-30 熱式インプリント装置および熱式インプリント方法

Publications (1)

Publication Number Publication Date
WO2008126312A1 true WO2008126312A1 (ja) 2008-10-23

Family

ID=39863488

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/057266 WO2008126312A1 (ja) 2007-03-30 2007-03-30 熱式インプリント装置および熱式インプリント方法

Country Status (3)

Country Link
US (1) US20100072665A1 (ja)
JP (1) JPWO2008126312A1 (ja)
WO (1) WO2008126312A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009202443A (ja) * 2008-02-28 2009-09-10 Toppan Printing Co Ltd 複製装置および複製方法
US20120025426A1 (en) * 2010-07-30 2012-02-02 Seagate Technology Llc Method and system for thermal imprint lithography
WO2018147037A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法
JP2023066660A (ja) * 2021-10-29 2023-05-16 ヤマト科学株式会社 恒温装置および温度分布改善方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2005007A (en) * 2009-08-28 2011-03-01 Asml Netherlands Bv Imprint lithography method and apparatus.
FR2950043B1 (fr) * 2009-09-17 2011-10-14 Commissariat Energie Atomique Moule pour la lithographie par nanoimpression thermique, son procede de preparation, et procede de nanoimpression thermique le mettant en ?uvre.
JP5731648B2 (ja) * 2010-08-13 2015-06-10 エーエスエムエル ネザーランズ ビー．ブイ． インプリントリソグラフィ方法
FR2964338B1 (fr) * 2010-09-07 2012-10-05 Commissariat Energie Atomique Moule pour la lithographie par nano-impression thermique, son procede de preparation, et procede de nano-impression thermique le mettant en ?uvre.
JP5901942B2 (ja) * 2011-11-09 2016-04-13 国立研究開発法人科学技術振興機構 機能性デバイスの製造方法及び機能性デバイスの製造装置
US9962863B2 (en) * 2013-01-03 2018-05-08 Elwha Llc Nanoimprint lithography
US9302424B2 (en) * 2013-01-03 2016-04-05 Elwha, Llc Nanoimprint lithography
US9561603B2 (en) * 2013-01-03 2017-02-07 Elwha, Llc Nanoimprint lithography
DE102015108327A1 (de) * 2015-05-27 2016-12-01 Technische Universität Darmstadt Vorrichtung und Verfahren zum Erzeugen einer Abformung einer Oberflächeneigenschaft
WO2017061046A1 (ja) * 2015-10-09 2017-04-13 株式会社Ihi 繊維強化複合部材の成形装置
ES2855115T3 (es) * 2015-10-19 2021-09-23 Ag Matriq Dispositivo para marcar piezas de trabajo y su uso
US11225001B2 (en) 2018-04-25 2022-01-18 Matriq Ag Mold and device for marking work pieces
KR102127736B1 (ko) * 2018-10-30 2020-07-01 재단법인 한국탄소융합기술원 항공기 열가소성 보강판넬 제조장치 및 방법
CN114919107B (zh) * 2022-05-17 2024-02-27 深圳技术大学 硅模具的高温模压成型装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS552094A (en) * 1978-06-06 1980-01-09 Messerschmitt Boelkow Blohm Press split pattern for producing record
JPH10626A (ja) * 1996-06-14 1998-01-06 Hitachi Ltd プラスチック成形方法及びその装置
JP2001018228A (ja) * 1999-07-06 2001-01-23 Jsr Corp 成形用金型
JP2007050663A (ja) * 2005-08-19 2007-03-01 Osaka Prefecture Univ ナノインプリント方法及びその装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4245811A (en) * 1978-06-06 1981-01-20 Messerschmitt-Bolkow-Blohm Gesellschaft Mit Beschrankter Haftung Press mould half, more especially for producing records
JP2995936B2 (ja) * 1991-08-06 1999-12-27 凸版印刷株式会社 エンボス複製ヘッドおよび複製方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS552094A (en) * 1978-06-06 1980-01-09 Messerschmitt Boelkow Blohm Press split pattern for producing record
JPH10626A (ja) * 1996-06-14 1998-01-06 Hitachi Ltd プラスチック成形方法及びその装置
JP2001018228A (ja) * 1999-07-06 2001-01-23 Jsr Corp 成形用金型
JP2007050663A (ja) * 2005-08-19 2007-03-01 Osaka Prefecture Univ ナノインプリント方法及びその装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009202443A (ja) * 2008-02-28 2009-09-10 Toppan Printing Co Ltd 複製装置および複製方法
US20120025426A1 (en) * 2010-07-30 2012-02-02 Seagate Technology Llc Method and system for thermal imprint lithography
WO2018147037A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法
WO2018147147A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、樹脂載置装置、部品実装方法および樹脂成形方法
JP2020194956A (ja) * 2017-02-09 2020-12-03 ボンドテック株式会社 樹脂成形装置、樹脂載置装置および樹脂成形方法
JP2022105514A (ja) * 2017-02-09 2022-07-14 ボンドテック株式会社 樹脂成形装置および樹脂成形方法
JP7106151B2 (ja) 2017-02-09 2022-07-26 ボンドテック株式会社 樹脂成形装置、樹脂載置装置および樹脂成形方法
US11587804B2 (en) 2017-02-09 2023-02-21 Bondtech Co., Ltd. Component mounting system
JP7309231B2 (ja) 2017-02-09 2023-07-18 ボンドテック株式会社 樹脂成形装置および樹脂成形方法
JP2023066660A (ja) * 2021-10-29 2023-05-16 ヤマト科学株式会社 恒温装置および温度分布改善方法

Also Published As

Publication number Publication date
JPWO2008126312A1 (ja) 2010-07-22
US20100072665A1 (en) 2010-03-25

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