JP2005231247A5 - - Google Patents

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Publication number
JP2005231247A5
JP2005231247A5 JP2004044727A JP2004044727A JP2005231247A5 JP 2005231247 A5 JP2005231247 A5 JP 2005231247A5 JP 2004044727 A JP2004044727 A JP 2004044727A JP 2004044727 A JP2004044727 A JP 2004044727A JP 2005231247 A5 JP2005231247 A5 JP 2005231247A5
Authority
JP
Japan
Prior art keywords
mold
workpiece
processing
recess
pressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004044727A
Other languages
English (en)
Japanese (ja)
Other versions
JP4455093B2 (ja
JP2005231247A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004044727A priority Critical patent/JP4455093B2/ja
Priority claimed from JP2004044727A external-priority patent/JP4455093B2/ja
Priority to US11/058,195 priority patent/US7347683B2/en
Publication of JP2005231247A publication Critical patent/JP2005231247A/ja
Priority to US12/024,354 priority patent/US7678319B2/en
Priority to US12/024,338 priority patent/US7674104B2/en
Publication of JP2005231247A5 publication Critical patent/JP2005231247A5/ja
Application granted granted Critical
Publication of JP4455093B2 publication Critical patent/JP4455093B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004044727A 2004-02-20 2004-02-20 モールド、モールドを用いた加工装置及びモールドを用いた加工方法 Expired - Fee Related JP4455093B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004044727A JP4455093B2 (ja) 2004-02-20 2004-02-20 モールド、モールドを用いた加工装置及びモールドを用いた加工方法
US11/058,195 US7347683B2 (en) 2004-02-20 2005-02-16 Mold and molding apparatus using the same
US12/024,354 US7678319B2 (en) 2004-02-20 2008-02-01 Mold and molding apparatus using the same
US12/024,338 US7674104B2 (en) 2004-02-20 2008-02-01 Mold and molding apparatus using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004044727A JP4455093B2 (ja) 2004-02-20 2004-02-20 モールド、モールドを用いた加工装置及びモールドを用いた加工方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009132094A Division JP4810592B2 (ja) 2009-06-01 2009-06-01 モールド、モールドを用いた加工装置及びモールドを用いた加工方法

Publications (3)

Publication Number Publication Date
JP2005231247A JP2005231247A (ja) 2005-09-02
JP2005231247A5 true JP2005231247A5 (enExample) 2009-02-26
JP4455093B2 JP4455093B2 (ja) 2010-04-21

Family

ID=34986617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004044727A Expired - Fee Related JP4455093B2 (ja) 2004-02-20 2004-02-20 モールド、モールドを用いた加工装置及びモールドを用いた加工方法

Country Status (2)

Country Link
US (3) US7347683B2 (enExample)
JP (1) JP4455093B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080160129A1 (en) * 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
JP4455092B2 (ja) 2004-02-20 2010-04-21 キヤノン株式会社 加工装置及び加工方法
US7557051B2 (en) * 2004-03-17 2009-07-07 The Board Of Trustees Of The Leland Stanford Junior University 3-D interconnected multi-layer microstructure of thermoplastic materials
JP2006346974A (ja) * 2005-06-15 2006-12-28 Konica Minolta Holdings Inc 成形方法及び成形装置
JP4987012B2 (ja) * 2005-12-08 2012-07-25 モレキュラー・インプリンツ・インコーポレーテッド 基板の両面パターニングする方法及びシステム
JP2007180315A (ja) * 2005-12-28 2007-07-12 Toshiba Mach Co Ltd 転写装置
JP4814682B2 (ja) * 2006-04-18 2011-11-16 株式会社日立ハイテクノロジーズ 微細構造パターンの転写方法及び転写装置
US20070284779A1 (en) * 2006-06-13 2007-12-13 Wei Wu Imprint lithography apparatus and methods
JP5173311B2 (ja) * 2007-08-09 2013-04-03 キヤノン株式会社 インプリント方法、インプリント装置および半導体製造方法
US20100015270A1 (en) * 2008-07-15 2010-01-21 Molecular Imprints, Inc. Inner cavity system for nano-imprint lithography
FR2950043B1 (fr) * 2009-09-17 2011-10-14 Commissariat Energie Atomique Moule pour la lithographie par nanoimpression thermique, son procede de preparation, et procede de nanoimpression thermique le mettant en ?uvre.
JP5395756B2 (ja) * 2010-07-07 2014-01-22 株式会社東芝 インプリント用テンプレートの製造方法及びパターン形成方法
FR2964338B1 (fr) 2010-09-07 2012-10-05 Commissariat Energie Atomique Moule pour la lithographie par nano-impression thermique, son procede de preparation, et procede de nano-impression thermique le mettant en ?uvre.
DE102011054789A1 (de) * 2011-10-25 2013-04-25 Universität Kassel Nano-Formgebungsstruktur
TWI672212B (zh) * 2016-08-25 2019-09-21 國立成功大學 奈米壓印組合體及其壓印方法
CN107030951B (zh) * 2017-06-15 2023-04-11 吉林大学 一种泥浆泵仿生活塞铸造成型方法和成型装置
WO2019156695A1 (en) * 2018-02-09 2019-08-15 Didrew Technology (Bvi) Limited Method of manufacturing fan out package with carrier-less molded cavity
CN112092145A (zh) * 2020-09-25 2020-12-18 石月(天津)云科技有限公司 一种绿色板材及其制备系统与方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5253663A (en) * 1975-10-29 1977-04-30 Hitachi Ltd Resin sealing mold
US5259752A (en) * 1990-10-05 1993-11-09 Stephen Scolamiero Insulation board for molding machine
KR100237564B1 (ko) * 1991-12-20 2000-01-15 김영환 반도체 패키지 성형용 금형
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US6809802B1 (en) 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
JP3638513B2 (ja) 2000-09-25 2005-04-13 株式会社東芝 転写装置及び転写方法
US6712598B2 (en) * 2000-11-20 2004-03-30 Superior Concrete Fence Of Texas, Inc. Mold battery with improved member separation
US7144539B2 (en) * 2002-04-04 2006-12-05 Obducat Ab Imprint method and device
WO2004086471A1 (en) * 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
US7150622B2 (en) * 2003-07-09 2006-12-19 Molecular Imprints, Inc. Systems for magnification and distortion correction for imprint lithography processes
JP4455092B2 (ja) * 2004-02-20 2010-04-21 キヤノン株式会社 加工装置及び加工方法

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