JP4455093B2 - モールド、モールドを用いた加工装置及びモールドを用いた加工方法 - Google Patents

モールド、モールドを用いた加工装置及びモールドを用いた加工方法 Download PDF

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Publication number
JP4455093B2
JP4455093B2 JP2004044727A JP2004044727A JP4455093B2 JP 4455093 B2 JP4455093 B2 JP 4455093B2 JP 2004044727 A JP2004044727 A JP 2004044727A JP 2004044727 A JP2004044727 A JP 2004044727A JP 4455093 B2 JP4455093 B2 JP 4455093B2
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JP
Japan
Prior art keywords
mold
processing
workpiece
support portion
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004044727A
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English (en)
Japanese (ja)
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JP2005231247A (ja
JP2005231247A5 (enExample
Inventor
淳一 関
透 田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2004044727A priority Critical patent/JP4455093B2/ja
Priority to US11/058,195 priority patent/US7347683B2/en
Publication of JP2005231247A publication Critical patent/JP2005231247A/ja
Priority to US12/024,354 priority patent/US7678319B2/en
Priority to US12/024,338 priority patent/US7674104B2/en
Publication of JP2005231247A5 publication Critical patent/JP2005231247A5/ja
Application granted granted Critical
Publication of JP4455093B2 publication Critical patent/JP4455093B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • B29C2043/3615—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
    • B29C2043/3634—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices having specific surface shape, e.g. grooves, projections, corrugations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/03—Processes for manufacturing substrate-free structures
    • B81C2201/034—Moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Micromachines (AREA)
JP2004044727A 2004-02-20 2004-02-20 モールド、モールドを用いた加工装置及びモールドを用いた加工方法 Expired - Fee Related JP4455093B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004044727A JP4455093B2 (ja) 2004-02-20 2004-02-20 モールド、モールドを用いた加工装置及びモールドを用いた加工方法
US11/058,195 US7347683B2 (en) 2004-02-20 2005-02-16 Mold and molding apparatus using the same
US12/024,354 US7678319B2 (en) 2004-02-20 2008-02-01 Mold and molding apparatus using the same
US12/024,338 US7674104B2 (en) 2004-02-20 2008-02-01 Mold and molding apparatus using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004044727A JP4455093B2 (ja) 2004-02-20 2004-02-20 モールド、モールドを用いた加工装置及びモールドを用いた加工方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009132094A Division JP4810592B2 (ja) 2009-06-01 2009-06-01 モールド、モールドを用いた加工装置及びモールドを用いた加工方法

Publications (3)

Publication Number Publication Date
JP2005231247A JP2005231247A (ja) 2005-09-02
JP2005231247A5 JP2005231247A5 (enExample) 2009-02-26
JP4455093B2 true JP4455093B2 (ja) 2010-04-21

Family

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Family Applications (1)

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JP2004044727A Expired - Fee Related JP4455093B2 (ja) 2004-02-20 2004-02-20 モールド、モールドを用いた加工装置及びモールドを用いた加工方法

Country Status (2)

Country Link
US (3) US7347683B2 (enExample)
JP (1) JP4455093B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080160129A1 (en) * 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
JP4455092B2 (ja) 2004-02-20 2010-04-21 キヤノン株式会社 加工装置及び加工方法
US7557051B2 (en) * 2004-03-17 2009-07-07 The Board Of Trustees Of The Leland Stanford Junior University 3-D interconnected multi-layer microstructure of thermoplastic materials
JP2006346974A (ja) * 2005-06-15 2006-12-28 Konica Minolta Holdings Inc 成形方法及び成形装置
JP4987012B2 (ja) * 2005-12-08 2012-07-25 モレキュラー・インプリンツ・インコーポレーテッド 基板の両面パターニングする方法及びシステム
JP2007180315A (ja) * 2005-12-28 2007-07-12 Toshiba Mach Co Ltd 転写装置
JP4814682B2 (ja) * 2006-04-18 2011-11-16 株式会社日立ハイテクノロジーズ 微細構造パターンの転写方法及び転写装置
US20070284779A1 (en) * 2006-06-13 2007-12-13 Wei Wu Imprint lithography apparatus and methods
JP5173311B2 (ja) * 2007-08-09 2013-04-03 キヤノン株式会社 インプリント方法、インプリント装置および半導体製造方法
US20100015270A1 (en) * 2008-07-15 2010-01-21 Molecular Imprints, Inc. Inner cavity system for nano-imprint lithography
FR2950043B1 (fr) * 2009-09-17 2011-10-14 Commissariat Energie Atomique Moule pour la lithographie par nanoimpression thermique, son procede de preparation, et procede de nanoimpression thermique le mettant en ?uvre.
JP5395756B2 (ja) * 2010-07-07 2014-01-22 株式会社東芝 インプリント用テンプレートの製造方法及びパターン形成方法
FR2964338B1 (fr) 2010-09-07 2012-10-05 Commissariat Energie Atomique Moule pour la lithographie par nano-impression thermique, son procede de preparation, et procede de nano-impression thermique le mettant en ?uvre.
DE102011054789A1 (de) * 2011-10-25 2013-04-25 Universität Kassel Nano-Formgebungsstruktur
TWI672212B (zh) * 2016-08-25 2019-09-21 國立成功大學 奈米壓印組合體及其壓印方法
CN107030951B (zh) * 2017-06-15 2023-04-11 吉林大学 一种泥浆泵仿生活塞铸造成型方法和成型装置
WO2019156695A1 (en) * 2018-02-09 2019-08-15 Didrew Technology (Bvi) Limited Method of manufacturing fan out package with carrier-less molded cavity
CN112092145A (zh) * 2020-09-25 2020-12-18 石月(天津)云科技有限公司 一种绿色板材及其制备系统与方法

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JPS5253663A (en) * 1975-10-29 1977-04-30 Hitachi Ltd Resin sealing mold
US5259752A (en) * 1990-10-05 1993-11-09 Stephen Scolamiero Insulation board for molding machine
KR100237564B1 (ko) * 1991-12-20 2000-01-15 김영환 반도체 패키지 성형용 금형
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US6809802B1 (en) 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
JP3638513B2 (ja) 2000-09-25 2005-04-13 株式会社東芝 転写装置及び転写方法
US6712598B2 (en) * 2000-11-20 2004-03-30 Superior Concrete Fence Of Texas, Inc. Mold battery with improved member separation
US7144539B2 (en) * 2002-04-04 2006-12-05 Obducat Ab Imprint method and device
WO2004086471A1 (en) * 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
US7150622B2 (en) * 2003-07-09 2006-12-19 Molecular Imprints, Inc. Systems for magnification and distortion correction for imprint lithography processes
JP4455092B2 (ja) * 2004-02-20 2010-04-21 キヤノン株式会社 加工装置及び加工方法

Also Published As

Publication number Publication date
US7347683B2 (en) 2008-03-25
US7674104B2 (en) 2010-03-09
US20080128945A1 (en) 2008-06-05
JP2005231247A (ja) 2005-09-02
US20050208171A1 (en) 2005-09-22
US20080131550A1 (en) 2008-06-05
US7678319B2 (en) 2010-03-16

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