JP2012004322A5 - - Google Patents

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Publication number
JP2012004322A5
JP2012004322A5 JP2010137650A JP2010137650A JP2012004322A5 JP 2012004322 A5 JP2012004322 A5 JP 2012004322A5 JP 2010137650 A JP2010137650 A JP 2010137650A JP 2010137650 A JP2010137650 A JP 2010137650A JP 2012004322 A5 JP2012004322 A5 JP 2012004322A5
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JP
Japan
Prior art keywords
unit
substrates
substrate bonding
bonding apparatus
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010137650A
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English (en)
Japanese (ja)
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JP2012004322A (ja
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Publication date
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Priority to JP2010137650A priority Critical patent/JP2012004322A/ja
Priority claimed from JP2010137650A external-priority patent/JP2012004322A/ja
Publication of JP2012004322A publication Critical patent/JP2012004322A/ja
Publication of JP2012004322A5 publication Critical patent/JP2012004322A5/ja
Pending legal-status Critical Current

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JP2010137650A 2010-06-16 2010-06-16 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置 Pending JP2012004322A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010137650A JP2012004322A (ja) 2010-06-16 2010-06-16 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010137650A JP2012004322A (ja) 2010-06-16 2010-06-16 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014144275A Division JP2014241416A (ja) 2014-07-14 2014-07-14 基板貼り合せ装置および積層半導体装置製造方法

Publications (2)

Publication Number Publication Date
JP2012004322A JP2012004322A (ja) 2012-01-05
JP2012004322A5 true JP2012004322A5 (enExample) 2013-09-19

Family

ID=45535988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010137650A Pending JP2012004322A (ja) 2010-06-16 2010-06-16 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置

Country Status (1)

Country Link
JP (1) JP2012004322A (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000182915A (ja) * 1998-12-16 2000-06-30 Ricoh Co Ltd 半導体装置およびその製造方法
JP2006332563A (ja) * 2005-05-30 2006-12-07 Nikon Corp ウェハ搬送装置、ウェハ積層体搬送装置及び積層型半導体装置製造方法
JP5272348B2 (ja) * 2007-08-14 2013-08-28 株式会社ニコン ウェハ接合装置
JP5412731B2 (ja) * 2008-02-19 2014-02-12 株式会社ニコン 加熱加圧システム及び冷却装置
JP5577585B2 (ja) * 2008-11-12 2014-08-27 株式会社ニコン 基板保持部材、接合装置および接合方法

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