JP2012004322A - 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置 - Google Patents

基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置 Download PDF

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JP2012004322A
JP2012004322A JP2010137650A JP2010137650A JP2012004322A JP 2012004322 A JP2012004322 A JP 2012004322A JP 2010137650 A JP2010137650 A JP 2010137650A JP 2010137650 A JP2010137650 A JP 2010137650A JP 2012004322 A JP2012004322 A JP 2012004322A
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substrates
substrate
pressure
pressing plate
bonding apparatus
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JP2010137650A
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Japanese (ja)
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JP2012004322A5 (enExample
Inventor
Isao Sugaya
功 菅谷
Keiichi Tanaka
慶一 田中
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Nikon Corp
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Nikon Corp
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JP2010137650A 2010-06-16 2010-06-16 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置 Pending JP2012004322A (ja)

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JP2010137650A JP2012004322A (ja) 2010-06-16 2010-06-16 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置

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JP2010137650A JP2012004322A (ja) 2010-06-16 2010-06-16 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置

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JP2014144275A Division JP2014241416A (ja) 2014-07-14 2014-07-14 基板貼り合せ装置および積層半導体装置製造方法

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JP2012004322A true JP2012004322A (ja) 2012-01-05
JP2012004322A5 JP2012004322A5 (enExample) 2013-09-19

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JP2010137650A Pending JP2012004322A (ja) 2010-06-16 2010-06-16 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000182915A (ja) * 1998-12-16 2000-06-30 Ricoh Co Ltd 半導体装置およびその製造方法
JP2006332563A (ja) * 2005-05-30 2006-12-07 Nikon Corp ウェハ搬送装置、ウェハ積層体搬送装置及び積層型半導体装置製造方法
JP2009049066A (ja) * 2007-08-14 2009-03-05 Nikon Corp ウェハ接合装置
JP2009200075A (ja) * 2008-02-19 2009-09-03 Nikon Corp 加熱加圧システム
JP2010118483A (ja) * 2008-11-12 2010-05-27 Nikon Corp 基板保持部材および接合装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000182915A (ja) * 1998-12-16 2000-06-30 Ricoh Co Ltd 半導体装置およびその製造方法
JP2006332563A (ja) * 2005-05-30 2006-12-07 Nikon Corp ウェハ搬送装置、ウェハ積層体搬送装置及び積層型半導体装置製造方法
JP2009049066A (ja) * 2007-08-14 2009-03-05 Nikon Corp ウェハ接合装置
JP2009200075A (ja) * 2008-02-19 2009-09-03 Nikon Corp 加熱加圧システム
JP2010118483A (ja) * 2008-11-12 2010-05-27 Nikon Corp 基板保持部材および接合装置

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