JP2009010143A5 - - Google Patents

Download PDF

Info

Publication number
JP2009010143A5
JP2009010143A5 JP2007169772A JP2007169772A JP2009010143A5 JP 2009010143 A5 JP2009010143 A5 JP 2009010143A5 JP 2007169772 A JP2007169772 A JP 2007169772A JP 2007169772 A JP2007169772 A JP 2007169772A JP 2009010143 A5 JP2009010143 A5 JP 2009010143A5
Authority
JP
Japan
Prior art keywords
metal substrate
potential
resin layer
insulating resin
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007169772A
Other languages
English (en)
Japanese (ja)
Other versions
JP5188110B2 (ja
JP2009010143A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007169772A priority Critical patent/JP5188110B2/ja
Priority claimed from JP2007169772A external-priority patent/JP5188110B2/ja
Priority to US12/667,031 priority patent/US8363419B2/en
Priority to PCT/JP2008/001645 priority patent/WO2009001554A1/ja
Publication of JP2009010143A publication Critical patent/JP2009010143A/ja
Publication of JP2009010143A5 publication Critical patent/JP2009010143A5/ja
Application granted granted Critical
Publication of JP5188110B2 publication Critical patent/JP5188110B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007169772A 2007-06-27 2007-06-27 回路装置 Expired - Fee Related JP5188110B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007169772A JP5188110B2 (ja) 2007-06-27 2007-06-27 回路装置
US12/667,031 US8363419B2 (en) 2007-06-27 2008-06-24 Circuit device
PCT/JP2008/001645 WO2009001554A1 (ja) 2007-06-27 2008-06-24 回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007169772A JP5188110B2 (ja) 2007-06-27 2007-06-27 回路装置

Publications (3)

Publication Number Publication Date
JP2009010143A JP2009010143A (ja) 2009-01-15
JP2009010143A5 true JP2009010143A5 (enExample) 2010-08-05
JP5188110B2 JP5188110B2 (ja) 2013-04-24

Family

ID=40185379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007169772A Expired - Fee Related JP5188110B2 (ja) 2007-06-27 2007-06-27 回路装置

Country Status (3)

Country Link
US (1) US8363419B2 (enExample)
JP (1) JP5188110B2 (enExample)
WO (1) WO2009001554A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8158510B2 (en) * 2009-11-19 2012-04-17 Stats Chippac, Ltd. Semiconductor device and method of forming IPD on molded substrate
JP2013197223A (ja) * 2012-03-19 2013-09-30 Hitachi Automotive Systems Ltd 電子制御装置
CN104112731B (zh) * 2013-07-17 2017-03-22 广东美的制冷设备有限公司 智能功率模块及其制造方法
DE102013219780A1 (de) * 2013-09-30 2015-04-02 Infineon Technologies Ag Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls
KR102284123B1 (ko) * 2014-05-26 2021-07-30 삼성전기주식회사 회로기판, 전자부품 및 회로기판 제조방법
JP6354845B2 (ja) 2014-07-30 2018-07-11 富士電機株式会社 半導体モジュール
EP3185292B1 (en) * 2014-08-22 2021-04-21 Mitsubishi Electric Corporation Power conversion device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04162691A (ja) * 1990-10-25 1992-06-08 Sanyo Electric Co Ltd 混成集積回路
JP2919674B2 (ja) * 1992-07-17 1999-07-12 三洋電機株式会社 混成集積回路
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
JPH11307689A (ja) * 1998-02-17 1999-11-05 Seiko Epson Corp 半導体装置、半導体装置用基板及びこれらの製造方法並びに電子機器
JP2005005445A (ja) * 2003-06-11 2005-01-06 Sanyo Electric Co Ltd 混成集積回路装置
JP4436706B2 (ja) 2004-03-25 2010-03-24 三洋電機株式会社 混成集積回路装置
JP2007157773A (ja) * 2005-11-30 2007-06-21 Sanyo Electric Co Ltd 回路装置

Similar Documents

Publication Publication Date Title
JP2009010143A5 (enExample)
JP2010251721A5 (ja) 半導体装置
TW200739580A (en) Nonvolatile semiconductor memory device
WO2008152845A1 (ja) 乱数発生器
WO2012024544A3 (en) Variable resistance memory element and fabrication methods
JP2013525918A5 (enExample)
ATE453311T1 (de) Leiterplatte mit zusätzlichen funktionalen elementen sowie herstellverfahren und anwendung
JP2011097033A5 (enExample)
JP2012138382A5 (ja) 表示装置、表示モジュール及び電子機器
TW200638419A (en) Electric element, memory device, and semiconductor integrated circuit
JP2007072453A5 (enExample)
WO2008081741A1 (ja) 抵抗変化型素子および抵抗変化型記憶装置
JP2010511368A5 (enExample)
WO2007146769A3 (en) Nano-piezoelectronics
WO2011105913A8 (en) Electrical components and circuits including said components
WO2009040939A1 (ja) 磁気抵抗効果を用いた負性抵抗素子
JP2013146182A5 (ja) 受電装置
WO2008152934A1 (ja) 金属一体導電ゴム部品
JP2017208987A5 (enExample)
JP2011008514A5 (enExample)
JP2010118650A5 (ja) 半導体装置
IN2014CH02031A (enExample)
JP2013232486A5 (enExample)
DE602007013326D1 (de) Elektrische Sicherungsschaltung, Speichervorrichtung und elektronisches Bauteil
MX2010000674A (es) Dispositivo resistivo de capas de pelicula gruesa que emplea una cinta dielectrica.