JP2009004778A5 - - Google Patents
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- Publication number
- JP2009004778A5 JP2009004778A5 JP2008153992A JP2008153992A JP2009004778A5 JP 2009004778 A5 JP2009004778 A5 JP 2009004778A5 JP 2008153992 A JP2008153992 A JP 2008153992A JP 2008153992 A JP2008153992 A JP 2008153992A JP 2009004778 A5 JP2009004778 A5 JP 2009004778A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- directing
- particle beam
- ion
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/766,680 | 2007-06-21 | ||
| US11/766,680 US8303833B2 (en) | 2007-06-21 | 2007-06-21 | High resolution plasma etch |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009004778A JP2009004778A (ja) | 2009-01-08 |
| JP2009004778A5 true JP2009004778A5 (enExample) | 2011-07-21 |
| JP5112181B2 JP5112181B2 (ja) | 2013-01-09 |
Family
ID=39828422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008153992A Active JP5112181B2 (ja) | 2007-06-21 | 2008-06-12 | 高解像度プラズマ・エッチング |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US8303833B2 (enExample) |
| EP (1) | EP2006249A3 (enExample) |
| JP (1) | JP5112181B2 (enExample) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1501115B1 (en) | 2003-07-14 | 2009-07-01 | FEI Company | Dual beam system |
| US20110163068A1 (en) * | 2008-01-09 | 2011-07-07 | Mark Utlaut | Multibeam System |
| US8168961B2 (en) * | 2008-11-26 | 2012-05-01 | Fei Company | Charged particle beam masking for laser ablation micromachining |
| US8778804B2 (en) * | 2009-01-30 | 2014-07-15 | Fei Company | High selectivity, low damage electron-beam delineation etch |
| EP2226830B1 (en) * | 2009-03-06 | 2014-01-08 | FEI Company | Charged particle beam processing |
| EP2233907A1 (en) * | 2009-03-27 | 2010-09-29 | FEI Company | Forming an image while milling a work piece |
| JP5702552B2 (ja) | 2009-05-28 | 2015-04-15 | エフ イー アイ カンパニFei Company | デュアルビームシステムの制御方法 |
| EP2471086B1 (en) | 2009-08-28 | 2013-12-11 | FEI Company | Pattern modification schemes for improved fib patterning |
| US8617668B2 (en) * | 2009-09-23 | 2013-12-31 | Fei Company | Method of using nitrogen based compounds to reduce contamination in beam-induced thin film deposition |
| US8253118B2 (en) * | 2009-10-14 | 2012-08-28 | Fei Company | Charged particle beam system having multiple user-selectable operating modes |
| EP2341525B1 (en) | 2009-12-30 | 2013-10-23 | FEI Company | Plasma source for charged particle beam system |
| US8642974B2 (en) | 2009-12-30 | 2014-02-04 | Fei Company | Encapsulation of electrodes in solid media for use in conjunction with fluid high voltage isolation |
| US8987678B2 (en) | 2009-12-30 | 2015-03-24 | Fei Company | Encapsulation of electrodes in solid media |
| KR101854287B1 (ko) * | 2010-04-07 | 2018-05-03 | 에프이아이 컴파니 | 레이저 및 하전 입자 빔 시스템 결합 |
| EP2492950B1 (en) | 2011-02-25 | 2018-04-11 | FEI Company | Method for rapid switching between a high current mode and a low current mode in a charged particle beam system |
| US9721754B2 (en) | 2011-04-26 | 2017-08-01 | Carl Zeiss Smt Gmbh | Method and apparatus for processing a substrate with a focused particle beam |
| US20130098871A1 (en) | 2011-10-19 | 2013-04-25 | Fei Company | Internal Split Faraday Shield for an Inductively Coupled Plasma Source |
| US9443697B2 (en) * | 2012-01-31 | 2016-09-13 | Fei Company | Low energy ion beam etch |
| WO2014022429A1 (en) * | 2012-07-30 | 2014-02-06 | Fei Company | Environmental sem gas injection system |
| US9655223B2 (en) * | 2012-09-14 | 2017-05-16 | Oregon Physics, Llc | RF system, magnetic filter, and high voltage isolation for an inductively coupled plasma ion source |
| US9741536B2 (en) * | 2012-10-05 | 2017-08-22 | Fei Company | High aspect ratio structure analysis |
| WO2014078800A1 (en) * | 2012-11-16 | 2014-05-22 | Dmitri Litvinov | System and method for selectively removing atoms |
| US10103008B2 (en) | 2016-01-12 | 2018-10-16 | Fei Company | Charged particle beam-induced etching |
| DE102016203094B4 (de) | 2016-02-26 | 2022-02-10 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zum dauerhaften Reparieren von Defekten fehlenden Materials einer photolithographischen Maske |
| US10549386B2 (en) * | 2016-02-29 | 2020-02-04 | Xerox Corporation | Method for ablating openings in unsupported layers |
| EP3285278A1 (en) * | 2016-08-16 | 2018-02-21 | FEI Company | Magnet used with a plasma cleaner |
| US10684407B2 (en) * | 2017-10-30 | 2020-06-16 | Facebook Technologies, Llc | Reactivity enhancement in ion beam etcher |
| JP7285251B2 (ja) * | 2017-10-30 | 2023-06-01 | メタ プラットフォームズ テクノロジーズ, リミテッド ライアビリティ カンパニー | 高屈折率材料のh2補助傾斜エッチング |
| US10845596B2 (en) | 2018-01-23 | 2020-11-24 | Facebook Technologies, Llc | Slanted surface relief grating for rainbow reduction in waveguide display |
| US10914954B2 (en) | 2018-08-03 | 2021-02-09 | Facebook Technologies, Llc | Rainbow reduction for waveguide displays |
| US10761330B2 (en) | 2018-01-23 | 2020-09-01 | Facebook Technologies, Llc | Rainbow reduction in waveguide displays |
| US10649119B2 (en) | 2018-07-16 | 2020-05-12 | Facebook Technologies, Llc | Duty cycle, depth, and surface energy control in nano fabrication |
| US11137536B2 (en) | 2018-07-26 | 2021-10-05 | Facebook Technologies, Llc | Bragg-like gratings on high refractive index material |
| US11150394B2 (en) | 2019-01-31 | 2021-10-19 | Facebook Technologies, Llc | Duty cycle range increase for waveguide combiners |
| US11550083B2 (en) | 2019-06-26 | 2023-01-10 | Meta Platforms Technologies, Llc | Techniques for manufacturing slanted structures |
| CN110921613B (zh) * | 2019-11-21 | 2023-06-27 | 武汉大学 | 电磁场控制等离子体的激光掩膜刻蚀方法以及系统 |
| US11226446B2 (en) | 2020-05-06 | 2022-01-18 | Facebook Technologies, Llc | Hydrogen/nitrogen doping and chemically assisted etching of high refractive index gratings |
| CN112591707B (zh) * | 2020-12-15 | 2024-05-31 | 南方科技大学 | 一种纳米锥形阵列结构及其制备方法 |
| WO2024223248A1 (en) * | 2023-04-27 | 2024-10-31 | Carl Zeiss Smt Gmbh | Remote-plasma electron-induced mask repair |
| US20250210361A1 (en) * | 2023-12-22 | 2025-06-26 | Applied Materials, Inc. | Electron-Stimulated Etching of Silicon |
| EP4567872A3 (en) * | 2025-04-09 | 2025-11-12 | ASML Netherlands B.V. | Material removal apparatus and methods of removing material from an object support |
Family Cites Families (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59104287A (ja) | 1982-12-07 | 1984-06-16 | Sumitomo Electric Ind Ltd | レ−ザ加工法 |
| JPS59132132A (ja) | 1983-01-17 | 1984-07-30 | Mitsubishi Electric Corp | 微細パタ−ンの形成方法 |
| JPS59168652A (ja) | 1983-03-16 | 1984-09-22 | Hitachi Ltd | 素子修正方法及びその装置 |
| US4859908A (en) | 1986-09-24 | 1989-08-22 | Matsushita Electric Industrial Co., Ltd. | Plasma processing apparatus for large area ion irradiation |
| US4737637A (en) | 1986-10-15 | 1988-04-12 | Hughes Aircraft Company | Mass separator for ionized cluster beam |
| US4740267A (en) | 1987-02-20 | 1988-04-26 | Hughes Aircraft Company | Energy intensive surface reactions using a cluster beam |
| US4856457A (en) | 1987-02-20 | 1989-08-15 | Hughes Aircraft Company | Cluster source for nonvolatile species, having independent temperature control |
| US4833319A (en) | 1987-02-27 | 1989-05-23 | Hughes Aircraft Company | Carrier gas cluster source for thermally conditioned clusters |
| US5221422A (en) | 1988-06-06 | 1993-06-22 | Digital Equipment Corporation | Lithographic technique using laser scanning for fabrication of electronic components and the like |
| JPH0262039A (ja) | 1988-08-29 | 1990-03-01 | Hitachi Ltd | 多層素子の微細加工方法およびその装置 |
| US4874459A (en) | 1988-10-17 | 1989-10-17 | The Regents Of The University Of California | Low damage-producing, anisotropic, chemically enhanced etching method and apparatus |
| DE4018954A1 (de) | 1989-06-15 | 1991-01-03 | Mitsubishi Electric Corp | Trockenaetzgeraet |
| JPH04272640A (ja) | 1991-02-26 | 1992-09-29 | Shimadzu Corp | 集束イオンビームエッチング装置 |
| US5188705A (en) | 1991-04-15 | 1993-02-23 | Fei Company | Method of semiconductor device manufacture |
| JP2694625B2 (ja) | 1991-07-05 | 1997-12-24 | 光技術研究開発株式会社 | 化合物半導体基体のエッチング方法および製造方法 |
| DE4200235C1 (enExample) | 1992-01-08 | 1993-05-06 | Hoffmeister, Helmut, Dr., 4400 Muenster, De | |
| JPH05315212A (ja) * | 1992-05-12 | 1993-11-26 | Jeol Ltd | 集束イオンビーム装置 |
| US5350480A (en) | 1993-07-23 | 1994-09-27 | Aspect International, Inc. | Surface cleaning and conditioning using hot neutral gas beam array |
| US5482802A (en) | 1993-11-24 | 1996-01-09 | At&T Corp. | Material removal with focused particle beams |
| WO1996000803A1 (en) | 1994-06-28 | 1996-01-11 | Fei Company | Charged particle deposition of electrically insulating films |
| JP3464320B2 (ja) | 1995-08-02 | 2003-11-10 | 株式会社荏原製作所 | 高速原子線を用いた加工方法及び加工装置 |
| US5573595A (en) | 1995-09-29 | 1996-11-12 | Lam Research Corporation | Methods and apparatus for generating plasma |
| US6017221A (en) | 1995-12-04 | 2000-01-25 | Flamm; Daniel L. | Process depending on plasma discharges sustained by inductive coupling |
| US5686796A (en) | 1995-12-20 | 1997-11-11 | International Business Machines Corporation | Ion implantation helicon plasma source with magnetic dipoles |
| JP2788436B2 (ja) | 1996-01-16 | 1998-08-20 | 技術研究組合新情報処理開発機構 | イオンビームエッチング装置 |
| TW403959B (en) | 1996-11-27 | 2000-09-01 | Hitachi Ltd | Plasma treatment device |
| US6042738A (en) | 1997-04-16 | 2000-03-28 | Micrion Corporation | Pattern film repair using a focused particle beam system |
| GB9714142D0 (en) | 1997-07-05 | 1997-09-10 | Surface Tech Sys Ltd | An arrangement for the feeding of RF power to one or more antennae |
| JPH11154479A (ja) | 1997-11-20 | 1999-06-08 | Hitachi Ltd | 2次電子画像検出方法及びその装置並びに集束荷電粒子ビームによる処理方法及びその装置 |
| EP0989595A3 (en) | 1998-09-18 | 2001-09-19 | Ims-Ionen Mikrofabrikations Systeme Gmbh | Device for processing a surface of a substrate |
| US6268608B1 (en) | 1998-10-09 | 2001-07-31 | Fei Company | Method and apparatus for selective in-situ etching of inter dielectric layers |
| US20010025826A1 (en) | 2000-02-28 | 2001-10-04 | Pierson Thomas E. | Dense-plasma etching of InP-based materials using chlorine and nitrogen |
| JP4364420B2 (ja) * | 2000-10-31 | 2009-11-18 | エスアイアイ・ナノテクノロジー株式会社 | 垂直エッジのサブミクロン貫通孔を形成する方法 |
| US6977386B2 (en) | 2001-01-19 | 2005-12-20 | Fei Company | Angular aperture shaped beam system and method |
| US6838380B2 (en) | 2001-01-26 | 2005-01-04 | Fei Company | Fabrication of high resistivity structures using focused ion beams |
| KR100444189B1 (ko) | 2001-03-19 | 2004-08-18 | 주성엔지니어링(주) | 유도결합 플라즈마 소스의 임피던스 정합 회로 |
| US6730237B2 (en) * | 2001-06-22 | 2004-05-04 | International Business Machines Corporation | Focused ion beam process for removal of copper |
| WO2003012551A1 (en) | 2001-07-27 | 2003-02-13 | Fei Company | Electron beam processing |
| US6768120B2 (en) | 2001-08-31 | 2004-07-27 | The Regents Of The University Of California | Focused electron and ion beam systems |
| JP2005174591A (ja) | 2003-12-08 | 2005-06-30 | Horon:Kk | 荷電粒子線装置および荷電粒子線像生成方法 |
| US7241361B2 (en) * | 2004-02-20 | 2007-07-10 | Fei Company | Magnetically enhanced, inductively coupled plasma source for a focused ion beam system |
| JP2006005110A (ja) | 2004-06-17 | 2006-01-05 | National Institute For Materials Science | 微細構造の作製方法及び作製装置 |
| EP1630849B1 (en) * | 2004-08-27 | 2011-11-02 | Fei Company | Localized plasma processing |
| JP5033314B2 (ja) | 2004-09-29 | 2012-09-26 | 株式会社日立ハイテクノロジーズ | イオンビーム加工装置及び加工方法 |
| US7670956B2 (en) | 2005-04-08 | 2010-03-02 | Fei Company | Beam-induced etching |
| JP5020483B2 (ja) | 2005-07-08 | 2012-09-05 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
| WO2008094297A2 (en) | 2006-07-14 | 2008-08-07 | Fei Company | A multi-source plasma focused ion beam system |
| US8835880B2 (en) * | 2006-10-31 | 2014-09-16 | Fei Company | Charged particle-beam processing using a cluster source |
-
2007
- 2007-06-21 US US11/766,680 patent/US8303833B2/en active Active
-
2008
- 2008-06-12 JP JP2008153992A patent/JP5112181B2/ja active Active
- 2008-06-20 EP EP08158646A patent/EP2006249A3/en not_active Ceased
-
2012
- 2012-11-05 US US13/669,195 patent/US20130192758A1/en not_active Abandoned
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